CN113741577A - Temperature control device, system and electronic equipment - Google Patents
Temperature control device, system and electronic equipment Download PDFInfo
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- CN113741577A CN113741577A CN202010469137.7A CN202010469137A CN113741577A CN 113741577 A CN113741577 A CN 113741577A CN 202010469137 A CN202010469137 A CN 202010469137A CN 113741577 A CN113741577 A CN 113741577A
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
- G05D23/20—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature
Abstract
The embodiment of the invention provides a temperature control device, a system and electronic equipment, wherein the device comprises: the temperature sensor is arranged near or in a target device needing temperature control and used for acquiring the temperature of the target device; the control circuit is electrically connected with the temperature sensor and used for outputting a temperature control signal according to the temperature and a preset target temperature; the heating assembly is electrically connected with the control circuit and used for generating heat according to the temperature control signal; and the heat conduction assembly is arranged between the heating assembly and the target device and used for conducting heat generated by the heating assembly to the target device so as to realize temperature control of the target device.
Description
Technical Field
The invention relates to the technical field of automatic control, in particular to a temperature control device, a temperature control system and electronic equipment.
Background
In practical applications, the performance of many electronic devices is affected by the temperature of the operating environment, such as an Inertial Measurement Unit (IMU).
The IMU is a device for measuring the three-axis attitude angle (or angular rate) and acceleration of an object, and is widely applied to aviation, navigation, aerospace, vehicles, robots, mobile phones and other devices.
The accuracy of the IMU measurement result is easily affected by the ambient temperature, so that the ambient temperature of the IMU needs to be kept at a stable temperature by a certain technical means to ensure the accuracy of the IMU measurement result and reduce the influence of temperature change on the IMU measurement result.
Disclosure of Invention
Embodiments of the present invention provide a temperature control device, a temperature control system, and an electronic device, which can ensure that the ambient temperature of an electronic device is stabilized at a certain set temperature, so as to ensure the performance of the electronic device.
In a first aspect, an embodiment of the present invention provides a temperature control apparatus, where the method includes:
the temperature sensor is used for acquiring the temperature of a target device needing temperature control;
the control circuit is electrically connected with the temperature sensor and used for outputting a temperature control signal according to the temperature and a preset target temperature;
the heating assembly is electrically connected with the control circuit and used for generating heat according to the temperature control signal;
and the heat conduction assembly is arranged between the heating assembly and the target device and is used for conducting the heat generated by the heating assembly to the target device.
In a second aspect, an embodiment of the present invention provides a temperature control system, where the apparatus includes:
a control circuit and temperature control devices respectively corresponding to a plurality of target devices to be temperature-controlled;
wherein, the temperature control device corresponding to any target device comprises: the temperature sensor, the heating assembly and the heat conducting assembly;
the temperature sensor is electrically connected with the control circuit and used for collecting the temperature of any target device and transmitting the temperature to the control circuit;
the control circuit is used for outputting a temperature control signal corresponding to any one target device according to the received temperature corresponding to each of the plurality of target devices and a preset target temperature;
the heating assembly is electrically connected to the control circuit and used for generating heat according to a temperature control signal corresponding to any target device;
the heat conducting assembly is arranged between the heating assembly and any target device and used for conducting heat generated by the heating assembly to any target device.
In a third aspect, an embodiment of the present invention provides an electronic device, including:
the circuit board is fixed in the shell;
the circuit board is provided with a control circuit, a plurality of target devices needing temperature control and temperature control devices corresponding to the target devices respectively;
wherein, the temperature control device corresponding to any target device comprises: the temperature sensor, the heating assembly and the heat conducting assembly;
the temperature sensor is electrically connected with the control circuit and used for collecting the temperature of any target device and transmitting the temperature to the control circuit;
the control circuit is used for outputting a temperature control signal corresponding to any one target device according to the received temperature corresponding to each of the plurality of target devices and a preset target temperature;
the heating assembly is electrically connected to the control circuit and used for generating heat according to a temperature control signal corresponding to any target device;
the heat conducting assembly is arranged between the heating assembly and any target device and used for conducting heat generated by the heating assembly to any target device.
In the embodiment of the present invention, when temperature control is required for a certain target device (such as an IMU), a temperature control device corresponding to the target device may be provided to ensure that the temperature around the target device is maintained at a set temperature by the temperature control device. Specifically, the temperature control device comprises a temperature sensor, a control circuit, a heating component and a heat conduction component connected between the heating component and a target device. The temperature sensor collects the temperature of the target device (the temperature refers to the temperature of the surface of the target device or the temperature around the surface of the target device), the collected temperature is transmitted to the control circuit, the control circuit outputs a temperature control signal to the heating assembly according to the temperature and the preset target temperature, so that the heating assembly generates corresponding heat, and the heat is transmitted to the target device through the heat conducting assembly, and therefore the purpose of ensuring that the temperature of the target device is stabilized at the target temperature is achieved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on the drawings without creative efforts.
Fig. 1 is a schematic composition diagram of a temperature control device according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of another temperature control apparatus according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of another temperature control apparatus according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of a temperature control system according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of an electronic device according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The terminology used in the embodiments of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in the examples of the present invention and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well.
The words "if", as used herein, may be interpreted as "at … …" or "at … …" or "in response to a determination" or "in response to a detection", depending on the context. Similarly, the phrases "if determined" or "if detected (a stated condition or event)" may be interpreted as "when determined" or "in response to a determination" or "when detected (a stated condition or event)" or "in response to a detection (a stated condition or event)", depending on the context.
Fig. 1 is a schematic composition diagram of a temperature control apparatus provided in an embodiment of the present invention, where the temperature control apparatus corresponds to a target device and can be used to control a temperature of the target device. The target device may be, for example, an IMU or other device that is sensitive to temperature. The target device can also be a container arranged in the robot and used for bearing articles, and at the moment, the purpose of controlling the temperature of the container is mainly to stably keep the heat dissipation temperature of the container at a certain set temperature so as to realize the fresh keeping of the articles.
In order to realize the temperature control of the target device, as shown in fig. 1, the temperature control apparatus includes:
The temperature sensor 101 is configured to acquire a temperature of the target device 100 that needs to be temperature-controlled. The temperature sensor 101 may be provided near or inside the target device 100.
In practical applications, the temperature sensor 101 may be attached to the surface of the target device 100 for collecting the temperature of the surface of the target device 100. Of course, the temperature sensor 101 may be disposed at other positions near the target device 100 according to the target device 100.
In the embodiment of the present invention, the temperature of the target device 100 may be understood as the temperature around the target device 100, i.e., the temperature of the environment around the target device 100.
And the control circuit 102 is electrically connected to the temperature sensor 101 and is configured to output a temperature control signal according to the temperature collected by the temperature sensor 101 and a preset target temperature.
Specifically, the control circuit 102 may be implemented as a circuit having a control function, for example, a circuit including a control chip. At this time, the temperature sensor 101 may be connected to the control chip through a data bus. The control chip may be a micro controller Unit (MCU for short).
The control chip may store a target temperature corresponding to the target device in advance, and the target temperature is a temperature around the target device 100 which is desired to be stably maintained at the target temperature.
In practical applications, an electronic device provided with the target device may be provided with an interactive interface, and a user may set a target temperature through the interactive interface. The setting of the target temperature may be different according to the target device. For example, for some target devices, it is desirable to operate at a stable temperature value or temperature range under any condition, and the user can directly set the temperature value or temperature range as the target temperature. For another example, for some target devices, it is desirable to operate in different temperature environments for different time periods, and in this case, the user may set a temperature curve reflecting the correspondence between time and temperature value, so as to determine the target temperature for different time periods based on the temperature curve.
For convenience of description, the temperature collected by the temperature sensor 101 is referred to as an actual temperature, and after the temperature sensor 101 transmits the actual temperature to the control chip, the control chip may determine a corresponding temperature control signal according to a temperature difference between the actual temperature and the target temperature, and output the temperature control signal to the heating assembly 103. For example, different corresponding relations between the temperature difference and the voltage value are preset, so that it can be determined what magnitude of the voltage signal should be output as the temperature control signal according to the temperature difference between the actual temperature and the target temperature. In practical applications, the temperature control signal may be a PWM wave signal or a voltage signal having a certain voltage value.
And the heating component 103 is electrically connected to the control circuit 102 and is used for generating heat according to the temperature control signal. Wherein, the temperature control signal can make the heating assembly 103 raise or lower the temperature to generate the corresponding heat. For example, if the actual temperature collected by the temperature sensor 101 is higher than the target temperature, the generated temperature control signal functions to cool down so as to lower the temperature of the target device to the target temperature; conversely, if the actual temperature sensed by the temperature sensor 101 is lower than the target temperature, the temperature control signal generated functions to increase the temperature of the target device to the target temperature.
Specifically, the heating assembly 103 may include a heating element, such as a heating resistor or a semiconductor cooling plate, which generates heat under the action of the temperature control signal.
As mentioned above, in the process of controlling the temperature of the target device, the target device may need to be heated up or cooled down, and based on this, the heating assembly 103 herein may include any components capable of achieving heating and cooling, and is not limited to the above examples.
And a heat conducting member 104 disposed between the heating member 103 and the target device 100, for conducting heat generated by the heating member 103 to the target device 100.
The heat conductive member 104 is a member having a heat conductive function. A heat conductive member 104 may be filled between the heating member 103 and the target device 100, and the heat conductive member 104 may be implemented as several materials having a heat conductive function. However, it is worth mentioning that when the selected heat conductive material has a conductive function, the arrangement result of the heat conductive material needs to satisfy the following condition: an electrical insulation structure is formed between the heating assembly 103 and the target device 100 to prevent the temperature control signal from being transmitted to the target device 100 through the heating assembly 103 and the heat conducting assembly 104, and the normal operation of the target device 100 is disturbed.
The main components of the temperature control device corresponding to the target device are generally described above, and a specific implementation manner of the temperature control device is provided below with reference to the embodiment shown in fig. 2. It should be noted that, in practical applications, the target device 100 may be a component disposed in some electronic equipment, and the target device 100 may specifically be a component soldered on a circuit board, in this case, in the embodiment of the present invention, the temperature control device corresponding to the target device 100 is also disposed on the circuit board.
Fig. 2 is a schematic diagram illustrating a composition of another temperature control apparatus according to an embodiment of the present invention, and in fig. 2, it is assumed that the target device 100 includes a plurality of pins, such as four pins, J1, J2, J3, and J4, illustrated in fig. 2.
Based on this, as shown in fig. 2, the temperature control apparatus corresponding to the target device 100 includes:
a temperature sensor 101, a control circuit 102, a heating element 103, a heat conducting element 104, and a drive circuit 105.
Of course, in practice, other components such as a power supply may be included, which are not shown in fig. 2.
As described above, the temperature sensor 101 may be attached to the surface of the target device 100 to collect the actual temperature of the target device 100 and transmit the collected actual temperature to the control circuit 102, and specifically, may be an MCU in the control circuit 102. The MCU determines a temperature control signal based on a temperature difference between the actual temperature and the target temperature. In general, since the signal intensity corresponding to the temperature control signal output from the MCU is often low and does not necessarily satisfy the requirement for driving the heating element 103, the driving circuit 105 electrically connected to the control circuit 102 and the heating element 103 is provided. The driving circuit 105 receives the temperature control signal output by the control circuit 102, performs power amplification on the temperature control signal to obtain a heating driving signal, and then outputs the heating driving signal to the heating element 103. In practice, the heating driving signal may be a voltage signal with a voltage value meeting a set requirement.
In this embodiment, the heating assembly 103 may include a plurality of heating elements, and the heat conducting assembly 104 may include a plurality of first heat conductors and a plurality of second heat conductors, corresponding to the target device 100 including a plurality of pins. Wherein the plurality of first thermal conductors are connected to the plurality of pins, the plurality of second thermal conductors are connected to the plurality of heating elements, and the plurality of first thermal conductors and the plurality of second thermal conductors form an electrically insulating structure between the target devices 100 and 103 heating components.
In order to facilitate understanding of the above structure, in fig. 2, the plurality of heating elements may be four heating resistors having the same resistance, i.e., R1, R2, R3, and R4. The plurality of first thermal conductors may be four thermal conductors D1, D2, D3, D4 illustrated in fig. 2, and the plurality of second thermal conductors may be four thermal conductors D5, D6, D7, D8 illustrated in fig. 2.
In practical applications, as mentioned above, the temperature control device may be disposed on a circuit board including the target device 100, and based on this, the plurality of first heat conductors and the plurality of second heat conductors may be copper foils, which is not limited to this. In addition, from the shape point of view, alternatively, as shown in fig. 2, the plurality of first heat conductors and the plurality of second heat conductors described above may be implemented as a structure in the shape of an elongated bar.
In order to make the plurality of first thermal conductors and the plurality of second thermal conductors illustrated in fig. 2 form an electrically insulating structure between the target devices 100 and 103, the plurality of first thermal conductors and the plurality of second thermal conductors are optionally arranged in a crossed and spaced manner, so that a "comb-like" structure may be formed. As shown in fig. 2, in order to form the electrical insulation structure, D1, D2, D3 and D4 are not connected to the heating element 103 at the opposite end, such as resistors R1, R2, R3 and R4, and accordingly, D5, D6, D7 and D8 are not connected to the target device 100 at the opposite end, and further, gaps are provided between D1, D2, D3, D4, D5, D6, D7 and D8 to ensure electrical insulation.
In practical applications, the gap of the "comb tooth" structure can be as small as possible while ensuring electrical insulation. The comb tooth structure is a heat conduction structure with high heat conductivity and low heat capacity.
The electrically insulating structure formed between the first and second heat conductors may be embodied as the above-mentioned "comb-tooth" pattern, but is not limited thereto, and may be implemented as other types of patterns. Indeed, other types of patterns capable of forming a longer contact edge length between the target device 100 and the heating element 103 are possible in order to improve thermal conductivity. Taking the "comb tooth" pattern as an example, the "longer contact side length" means that the lengths and widths of D1 to D8 can be set to be long enough and wide enough according to the needs, so that a heat-conducting surface with a larger area can be formed, and higher heat conductivity can be obtained.
It will be appreciated that in the case where a plurality of heating elements are included in the heating assembly 103, the heating drive signal output by the drive circuit 105 needs to be transmitted to the plurality of heating elements. On the basis of this, in order to facilitate the application of the heating driving signal to the plurality of heating elements on the one hand and also to facilitate the provision of the plurality of second heat conductors on the other hand, optionally, a first connection piece N1 and a second connection piece N2 may also be included in the heating assembly 103. Accordingly, first ends of the plurality of heating elements (heating resistors R1, R2, R3, R4) are connected to the first connection piece N1, second ends of the plurality of heating elements are connected to the second connection piece N2, the second connection piece N2 is grounded, and the plurality of second heat conductors (D5, D6, D7, D8) are connected to the second connection piece N2. In this case, the number of the plurality of second heat conductors does not necessarily equal the number of the plurality of heating elements.
Specifically, in practical applications, the first ends of the resistors R1, R2, R3 and R4 may be soldered to the first connecting piece N1, the second ends of the heating resistors R1, R2, R3 and R4 may be soldered to the second connecting piece N2, and one ends of the second heat conductors D5, D6, D7 and D8 may be soldered to the second connecting piece N2.
Accordingly, the heating driving signal outputted from the driving circuit 105 is transmitted to the first connection piece N1, so that the heating driving signal can be simultaneously applied to the plurality of heating resistors. Since the second connecting pad N2 is grounded, the heating driving signal will form a voltage difference on each heating resistor, and the voltage difference will make each heating resistor generate heat, which is conducted to the target device 100 through the "comb" structure.
In addition, as shown in fig. 2, in order to further improve the thermal conductivity, a thermally conductive material P may be further coated on an electrically insulating structure such as the above-described "comb tooth" structure. The thermally conductive material P may be a material having a relatively high thermal conductivity, such as silicon gel, thermal gel, epoxy, phase change material, polyimide, graphite, aluminum tape, silicone coated fabric, and the like.
Only having multiple pins on a side of target device 100 is illustrated in fig. 2, and in practice, target device 100 may have several pins thereon, and these several pins may be distributed on different sides of the target device. For example, the target device 100 is a rectangular integrated chip that may have multiple pins on all four sides of the chip. In this regard, the pins included on the target device 100 may be grouped, such as grouping a plurality of pins located on the same side of the target device into a group of pins, each group including one or more pins. In practice, all or part of the pins disposed on the same side may be included in the group of pins corresponding to the same side.
When the target device 100 includes a plurality of sets of pins, the heating element 103 and the heat conducting element 104 illustrated in fig. 2 may be disposed for each set of pins, and the heating driving signal output by the driving circuit 105 may be transmitted to the heating element 103 corresponding to each set of pins, so that the heat conductivity may be further improved by the action of the plurality of sets of heating elements 103 and the heat conducting element 104.
Taking the target device 100 as an IMU as an example, the following describes, with reference to fig. 3, an exemplary configuration of a temperature control device corresponding to the IMU in a case where the IMU has multiple sets of pins.
The IMU has several pins, different pins having different roles, such as possibly including a pin for connecting to a power supply, a pin for grounding, and other input and output pins for receiving or outputting signals, etc. In this embodiment, it is assumed that the IMU has 16 pins illustrated in fig. 3, and 16 numbers 1 to 16 are respectively used for representation.
In order to realize the temperature control of the IMU with the above structural features, in practical applications, the pins of the IMU may be grouped, and each group of pins includes one or more pins. In fig. 3, it is assumed that the four sides of the IMU, i.e. the upper side, the lower side, the left side and the right side, are respectively provided with 4 pins, and based on the structural feature, the pins on the same side can be divided into one group, so that the 16 pins of the IMU are divided into four groups: four pins which are marked as 1, 2, 3 and 4 and are arranged on the left side of the IMU are divided into a group; four pins which are provided with the numbers of 5, 6, 7 and 8 and arranged at the lower side of the IMU are divided into a group; four pins marked with 9, 10, 11 and 12 arranged on the right side of the IMU are divided into a group; the four pins, numbered 13, 14, 15, 16, provided on the upper side of the IMU are divided into a group.
For each of the four sets of pins, a heating assembly 103 and a heat conducting assembly 104 similar to those illustrated in fig. 2 are correspondingly disposed. Thus, the four sets of "comb" structures illustrated in FIG. 3 can ultimately be formed: corresponding to four sets of heating elements and four sets of heat conducting elements. In fig. 3, 16 heating resistors corresponding to the 16 pins are represented as R1, R2, and R16, respectively. The 16 heating resistors have the same resistance.
The heating driving signals output by the driving circuit 105 are simultaneously transmitted to the four sets of heating elements, so that the four sets of heating elements generate heat and conduct the heat to the IMU through the corresponding heat conducting elements.
The above embodiments describe the situation where only one target device needs to be temperature controlled, and in practical applications, in some scenarios, a plurality of identical target devices may need to work together, and at this time, the plurality of target devices need to be temperature controlled.
For example, an IMU array (i.e., an array of a plurality of IMUs) may be provided in an electronic device to enable accurate detection of the pose of the electronic device based on the plurality of IMUs. In this case, a circuit board may be provided in the electronic apparatus, and a plurality of IMUs may be provided on the circuit board at intervals, and in order to improve the accuracy of the posture detection result of the IMU array, it is necessary to allow the plurality of IMUs to be stably at a specific target temperature. In addition, in practical application, the circuit board can use a dielectric material with low thermal conductivity to avoid thermal interference between IMUs, such as a fiberglass material.
In view of the above exemplary situation, the embodiments of the present invention provide a temperature control system for performing temperature control on a plurality of target devices operating simultaneously.
In summary, the temperature control system comprises: a control circuit and a temperature control device corresponding to each of a plurality of target devices to be temperature-controlled.
As previously described, the control circuit may be a circuit including a control chip.
Taking any one target device a of a plurality of target devices as an example, the temperature control device corresponding to the target device a comprises: temperature sensor, heating element and heat conduction subassembly.
The temperature sensor is electrically connected to the control circuit and used for collecting the temperature of the target device A and transmitting the collected temperature to the control circuit. The control circuit outputs a temperature control signal corresponding to the target device A according to the received temperature corresponding to each of the plurality of target devices and a preset target temperature. And the heating component is electrically connected with the control circuit and used for generating heat according to the temperature control signal corresponding to the target device A. And the heat conduction assembly is arranged between the heating assembly and the target device A and is used for conducting heat generated by the heating assembly to the target device A.
In addition, optionally, the temperature control system may further include: and the driving circuit is electrically connected with the control circuit and the heating assemblies corresponding to the target devices and is used for carrying out power amplification on the temperature control signals corresponding to the target devices to obtain heating driving signals corresponding to the target devices so as to enable the heating assemblies corresponding to the target devices to generate heat according to the received heating driving signals. The driving circuit may be a circuit including a driving chip.
For ease of understanding, the components of the above-described temperature control system are exemplarily described below with reference to fig. 4.
In fig. 4, it is assumed that the same two target devices are disposed on one circuit board: target device a and target device B. The temperature control systems corresponding to these two target devices may include: a temperature control device 401A corresponding to the target device a, a temperature control device 401B corresponding to the target device B, and a control circuit 402 and a drive circuit 403.
For the temperature control device 401A, the temperature control device 401A includes a temperature sensor Sa, a heating assembly Ha, and a heat conducting assembly Pa.
The temperature sensor Sa may be attached to a surface of the target device a to collect a temperature of the target device a, and the temperature sensor Sa transmits a collected temperature value Wa to the control circuit 402, assuming that the temperature is denoted as Wa.
For the temperature control device 401B, the temperature control device 401B includes a temperature sensor Sb, a heating member Hb, and a heat conducting member Pb.
The temperature sensor Sb may be attached to the surface of the target device B to collect the temperature of the target device B, and assuming that the temperature is denoted as Wb, the temperature sensor Sb transmits the collected temperature value Wb to the control circuit 402.
After receiving the temperature value Wa and the temperature value Wb, the control circuit 402 may determine the temperature control signals corresponding to the target device a and the target device B according to the two temperature values. Specifically, the control circuit 402 determines a temperature control signal corresponding to the target device a according to the temperature value Wa and the temperature value Wb, and determines a temperature control signal corresponding to the target device B according to the temperature value Wa and the temperature value Wb.
That is, for any one of the target devices, the temperature control signal corresponding to the target device is affected by the temperature corresponding to the target device, and is not related to the temperature of the target device.
For the target device a, the temperature control signal output by the control circuit 402 and corresponding to the target device a is subjected to power amplification processing by the driving circuit 403 to obtain a heating driving signal corresponding to the target device a, the heating driving signal is transmitted to the heating assembly Ha, the heating assembly Ha generates heat under the action of the heating driving signal, and the heat is conducted to the target device a through the heat conducting assembly Pa.
Similarly, the temperature control signal corresponding to the target device B output by the control circuit 402 is subjected to power amplification processing by the driving circuit 403 to obtain a heating driving signal corresponding to the target device B, the heating driving signal is transmitted to the heating assembly Hb, and the heating assembly Hb generates heat under the action of the heating driving signal, and the heat is conducted to the target device B through the heat conducting assembly Pb.
For the case where there are multiple target devices, optionally, the control circuit 402 may determine the temperature control signal corresponding to any target device according to the following formula:
wherein, KP、KIAnd KDIs a preset parameter matrix, and assuming that the number of the target devices is N, the dimensions of the several parameter matrices are: n x N, N being greater than 1.
Wherein E represents a temperature difference vector, taking any target device i as an example, and assuming that the temperature value corresponding to the target device i is XiTarget temperature is XtargetThen the temperature difference E corresponding to the target device ii＝Xtarget-XiThe temperature difference vector E is formed by the temperature differences corresponding to the N target devices.
∫EdtWhich represents the operation of integration on E,
representing a differential operation on E.
In practical applications, the above formula functions simply to say that, for the target device i, if the temperatures of other target devices around the target device i are higher, the target device i may be conducted with lower heat to achieve the temperature of the target device i reaching the target temperature, and conversely, if the temperatures of other target devices around the target device i are lower, the target device i may be conducted with higher heat to achieve the temperature of the target device i reaching the target temperature.
In this embodiment, the composition and the function of the heating assembly Ha and the heating assembly Hb may be described in the foregoing other embodiments with respect to the heating assembly 103, and the composition and the function of the heat conducting assembly Pa and the heat conducting assembly Pb may be described in the foregoing other embodiments with respect to the heat conducting assembly 104, which is not described herein again.
In summary, in the embodiment, the corresponding temperature control device is independently provided for each target device, so that on one hand, thermal resistance interference between different target devices can be avoided, and on the other hand, based on the structure of the heating assembly and the heat conducting assembly, the thermal conductivity can be higher. In addition, the temperature of one target device is controlled by combining the temperatures of other target devices around the target device, so that the accurate temperature control of a plurality of target devices can be realized.
The temperature control device described above may be deployed in some electronic device, such as an unmanned aerial vehicle, a mobile phone, a robot, a vehicle-mounted terminal device, and so on.
Fig. 5 is a schematic structural diagram of an electronic device according to an embodiment of the present invention, and as shown in fig. 5, the electronic device includes:
a housing 501 and a circuit board 502 fixed within the housing 501.
The circuit board 502 is provided with a control circuit 503, a plurality of target devices 504 which need to be temperature-controlled, and a plurality of temperature control devices 505 corresponding to the target devices 504.
As described above, the temperature control device 505 corresponding to each target device 504 may include: a temperature sensor, a heating assembly and a heat conducting assembly, not shown in fig. 5.
In practical applications, the electronic device may further include a connection interface for connecting other devices.
The temperature control device of one or more embodiments of the present invention will be described in detail below. Those skilled in the art will appreciate that these temperature control devices can each be configured using commercially available hardware components through the steps taught in the present scheme.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (19)
1. A temperature control apparatus, comprising:
the temperature sensor is used for acquiring the temperature of a target device needing temperature control;
the control circuit is electrically connected with the temperature sensor and used for outputting a temperature control signal according to the temperature and a preset target temperature;
the heating assembly is electrically connected with the control circuit and used for generating heat according to the temperature control signal;
and the heat conduction assembly is arranged between the heating assembly and the target device and is used for conducting the heat generated by the heating assembly to the target device.
2. The apparatus of claim 1, wherein the target device comprises an inertial measurement unit.
3. The apparatus of claim 1, wherein the target device comprises a plurality of pins, the thermally conductive assembly comprises a plurality of first thermally conductive bodies and a plurality of second thermally conductive bodies, the heating assembly comprises a plurality of heating elements;
wherein the plurality of first heat conductors are correspondingly connected with the plurality of pins, and the plurality of second heat conductors are correspondingly connected with the plurality of heating elements;
the plurality of first thermal conductors and the plurality of second thermal conductors form an electrically insulating structure between the target device and the heating assembly.
4. The apparatus of claim 3, wherein the plurality of first thermally conductive bodies are disposed in a spaced-apart relationship across the plurality of second thermally conductive bodies.
5. The apparatus of claim 3, further comprising: a thermally conductive material overlying the electrically insulating structure.
6. The device of claim 3, wherein the heating assembly comprises a first connecting tab and a second connecting tab;
first ends of the plurality of heating elements are connected to the first connection piece, and second ends of the plurality of heating elements are connected to the second connection piece;
the temperature control signal is input to the first connecting sheet, and the second connecting sheet is grounded;
the plurality of second heat conductors are connected to the second connection piece.
7. The device of claim 3, wherein the heating element comprises a heating resistor or a semiconductor cooling fin.
8. The apparatus of claim 3, wherein the target device comprises a plurality of sets of pins, each set comprising a plurality of pins;
the device comprises the heating component and the heat conducting component corresponding to each group of pins.
9. The apparatus of claim 1, further comprising:
and the driving circuit is electrically connected with the control circuit and the heating assembly and is used for receiving the temperature control signal, carrying out power amplification treatment on the temperature control signal to obtain a heating driving signal and outputting the heating driving signal to the heating assembly.
10. A temperature control system, comprising:
a control circuit and temperature control devices respectively corresponding to a plurality of target devices to be temperature-controlled;
wherein, the temperature control device corresponding to any target device comprises: the temperature sensor, the heating assembly and the heat conducting assembly;
the temperature sensor is electrically connected with the control circuit and used for collecting the temperature of any target device and transmitting the temperature to the control circuit;
the control circuit is used for outputting a temperature control signal corresponding to any one target device according to the received temperature corresponding to each of the plurality of target devices and a preset target temperature;
the heating assembly is electrically connected to the control circuit and used for generating heat according to a temperature control signal corresponding to any target device;
the heat conducting assembly is arranged between the heating assembly and any target device and used for conducting heat generated by the heating assembly to any target device.
11. The apparatus of claim 10, wherein the plurality of target devices comprises a plurality of inertial measurement units.
12. The apparatus of claim 10, wherein the system further comprises: and the driving circuit is electrically connected to the control circuit and the heating assemblies corresponding to the target devices, and is used for performing power amplification on the temperature control signals corresponding to the target devices to obtain heating driving signals corresponding to the target devices, so that the heating assemblies corresponding to the target devices generate heat according to the received heating driving signals.
13. The apparatus of claim 10, wherein the any target device comprises a plurality of pins, the thermally conductive assembly comprises a plurality of first thermally conductive bodies and a plurality of second thermally conductive bodies, and the heating assembly comprises a plurality of heating elements;
wherein the plurality of first heat conductors are correspondingly connected with the plurality of pins, and the plurality of second heat conductors are correspondingly connected with the plurality of heating elements;
the plurality of first thermal conductors and the plurality of second thermal conductors form an electrically insulating structure between the any target device and the heating assembly.
14. The apparatus of claim 13, wherein the plurality of first thermal conductors are interleaved with the plurality of second thermal conductors.
15. The apparatus of claim 13, further comprising: a thermally conductive material overlying the electrically insulating structure.
16. The device of claim 13, wherein the heating assembly comprises a first connecting tab and a second connecting tab;
first ends of the plurality of heating elements are connected to the first connection piece, and second ends of the plurality of heating elements are connected to the second connection piece;
the temperature control signal is input to the first connecting sheet, and the second connecting sheet is grounded;
the plurality of second heat conductors are connected to the second connection piece.
17. The device of claim 13, wherein the heating element comprises a heating resistor or a semiconductor cooling fin.
18. The apparatus of claim 13, wherein any of the target devices comprises a plurality of sets of pins, each set comprising a plurality of pins;
the temperature control device comprises the heating component and the heat conduction component corresponding to each group of pins.
19. An electronic device, comprising:
the circuit board is fixed in the shell;
the circuit board is provided with a control circuit, a plurality of target devices needing temperature control and temperature control devices corresponding to the target devices respectively;
wherein, the temperature control device corresponding to any target device comprises: the temperature sensor, the heating assembly and the heat conducting assembly;
the temperature sensor is electrically connected with the control circuit and used for collecting the temperature of any target device and transmitting the temperature to the control circuit;
the control circuit is used for outputting a temperature control signal corresponding to any one target device according to the received temperature corresponding to each of the plurality of target devices and a preset target temperature;
the heating assembly is electrically connected to the control circuit and used for generating heat according to a temperature control signal corresponding to any target device;
the heat conducting assembly is arranged between the heating assembly and any target device and used for conducting heat generated by the heating assembly to any target device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010469137.7A CN113741577A (en) | 2020-05-28 | 2020-05-28 | Temperature control device, system and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010469137.7A CN113741577A (en) | 2020-05-28 | 2020-05-28 | Temperature control device, system and electronic equipment |
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| CN113741577A true CN113741577A (en) | 2021-12-03 |
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| CN202010469137.7A Pending CN113741577A (en) | 2020-05-28 | 2020-05-28 | Temperature control device, system and electronic equipment |
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| CN206698553U (en) * | 2017-03-15 | 2017-12-01 | 天津莱尔德电子材料有限公司 | Heat transfer piece and electronic equipment |
| CN110017835A (en) * | 2015-10-30 | 2019-07-16 | 深圳市大疆创新科技有限公司 | The movable fixture of Inertial Measurement Unit and the application Inertial Measurement Unit |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102089895A (en) * | 2008-07-14 | 2011-06-08 | 阿尔卡特朗讯美国公司 | Stacked thermoelectric modules |
| CN201917836U (en) * | 2010-12-27 | 2011-08-03 | 西安中星测控有限公司 | Temperature control device based on ultra-low-temperature environment operation |
| CN106257371A (en) * | 2015-06-16 | 2016-12-28 | 鹦鹉无人机股份有限公司 | Including because becoming in temperature to compensate the unmanned plane of the higher-level device of inertance element deviation |
| CN110017835A (en) * | 2015-10-30 | 2019-07-16 | 深圳市大疆创新科技有限公司 | The movable fixture of Inertial Measurement Unit and the application Inertial Measurement Unit |
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