CN113740585A - Current sensor, current probe and current detection system - Google Patents
Current sensor, current probe and current detection system Download PDFInfo
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- CN113740585A CN113740585A CN202110932505.1A CN202110932505A CN113740585A CN 113740585 A CN113740585 A CN 113740585A CN 202110932505 A CN202110932505 A CN 202110932505A CN 113740585 A CN113740585 A CN 113740585A
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Abstract
The invention discloses a current sensor, a current probe and a current detection system. The common mode inductance module in the technical scheme has higher self-resonant frequency, and the bandwidth of the current sensor can be improved by arranging each common mode inductance module with higher self-resonant frequency on the electromagnetic circuit.
Description
Technical Field
The invention relates to the technical field of current detection, in particular to a current sensor, a current probe and a current detection system.
Background
The current sensor is a detection device which can sense the information of the current to be detected and convert the sensed information into an electric signal meeting certain standards or other information in required forms according to a certain rule for output so as to meet the requirements of information transmission, processing, storage, display, recording, control and the like.
In the existing zero-flux current sensor technology, a hall element is used as a sensing element and is used as a zero-flux hall current sensor most frequently, a coil group of the hall current sensor is formed by directly connecting coils distributed on a magnetic core of the hall current sensor, and the coil group is formed in a mode that the bandwidth of the hall current sensor is small and the detection effect is poor.
Disclosure of Invention
The embodiment of the invention provides a current sensor, a current probe and a current detection system, which aim to solve the problem that the bandwidth of the current sensor is small.
A current sensor comprising an electromagnetic circuit and at least one common mode inductance module, each common mode inductance module being disposed on the electromagnetic circuit.
Further, the number of the common mode inductance modules is at least two, and at least two common mode inductance modules are arranged on the electromagnetic circuit in series.
Further, the common-mode inductance module comprises a first coil, a second coil and a common-mode magnetic bead; the first coil and the second coil are oppositely arranged on the electromagnetic circuit in parallel; the homonymous ends of the first coil and the second coil are connected in parallel to form a first lead and a second lead; the first lead and the second lead are arranged in the common-mode magnetic bead in a penetrating mode.
Further, the number of turns of the first coil is the same as the number of turns of the second coil.
Further, the common mode magnetic bead is a ring magnetic bead.
Further, if the number of the common mode inductance modules is 1, a first lead of the common mode inductance module is a first connection end of the current sensor, and a second lead of the common mode inductance module is a second connection end of the current sensor;
if the number of the common mode inductance modules is N, a first lead of the 1 st common mode inductance module is a first connection end of the current sensor, a second lead of the ith common mode inductance module is connected with a first lead of the (i + 1) th common mode inductance module, a second lead of the Nth common mode inductance module is a second connection end of the current sensor, N is more than or equal to 2, and i is more than or equal to 1 and less than or equal to N-1.
Further, the electromagnetic circuit comprises a first magnetic core and a second magnetic core which are oppositely arranged in parallel, and at least one common mode inductance module is arranged on the first magnetic core and the second magnetic core.
Further, the electromagnetic circuit further comprises a third magnetic core and a fourth magnetic core; the first end of the third magnetic core is connected with the first end of the first magnetic core, and the second end of the third magnetic core is connected with the first end of the second magnetic core; and the first end of the fourth magnetic core is connected with the second end of the first magnetic core, and the second end of the fourth magnetic core is connected with the second end of the second magnetic core.
A current probe comprises a front-end signal processing circuit and the current sensor, wherein the current sensor is connected with the front-end signal processing circuit.
A current detection system comprises a rear-end amplification circuit, an oscilloscope and the current probe; a front-end signal processing circuit in the current probe is connected with the rear-end amplifying circuit; the rear end amplifying circuit is connected with the oscilloscope.
Above-mentioned current sensor, current probe and current detection system, current sensor include electromagnetic circuit and at least one common mode inductance module, because this common mode inductance module has higher self-resonant frequency, therefore, this embodiment is through setting up each common mode inductance module that has higher self-resonant frequency on electromagnetic circuit, just can improve current sensor's bandwidth.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments of the present invention will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without inventive labor.
FIG. 1 is a schematic diagram of a current sensor according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of another embodiment of a current sensor;
FIG. 3 is a schematic diagram of another embodiment of a current sensor;
FIG. 4 is a schematic diagram of a current probe according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of a current detection system according to an embodiment of the invention.
In the figure: 10. a current sensor; 11. an electromagnetic circuit; 111. a first magnetic core; 112. a second magnetic core; 113. a third magnetic core; 114. a fourth magnetic core; 12. a common mode inductance module; 121. a first coil; 122. a second coil; 123. common mode magnetic beads; 124. a first lead; 125. a second lead; 30. a current probe; 31. a front-end signal processing circuit; 41. a back-end amplification circuit; 42. an oscilloscope.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It is to be understood that the present invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. In the drawings, the size and relative sizes of layers and regions may be exaggerated for clarity to indicate like elements throughout.
It will be understood that when an element or layer is referred to as being "on" …, "adjacent to …," "connected to" or "coupled to" other elements or layers, it can be directly on, adjacent to, connected to or coupled to the other elements or layers or intervening elements or layers may be present. In contrast, when an element is referred to as being "directly on …," "directly adjacent to …," "directly connected to" or "directly coupled to" other elements or layers, there are no intervening elements or layers present. It will be understood that, although the terms first, second, third, etc. may be used to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the present invention.
Spatial relationship terms such as "under …", "under …", "below", "under …", "above …", "above", and the like, may be used herein for ease of description to describe the relationship of one element or feature to another element or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, then elements or features described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the exemplary terms "below …" and "below …" can encompass both an orientation of up and down. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatial descriptors used herein interpreted accordingly.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. As used herein, the term "and/or" includes any and all combinations of the associated listed items.
In the following description, for purposes of explanation, specific details are set forth in order to provide a thorough understanding of the present invention. The following detailed description of the preferred embodiments of the invention, however, the invention is capable of other embodiments in addition to those detailed.
The present embodiment provides a current sensor 10, as shown in fig. 1, the current sensor 10 includes an electromagnetic circuit 11 and at least one common mode inductor module 12, and each common mode inductor module 12 is disposed on the electromagnetic circuit 11.
Wherein the current sensor 10 is a hall current sensor 10. Preferably, the hall current sensor 10 is a zero-flux hall current sensor 10, i.e. a closed-loop hall sensor. The electromagnetic magnetic circuit 11 is a closed path through which magnetic flux in the current sensor 10 passes. The common mode inductance module 12 is a module equivalent to a common mode inductance. Optionally, the common mode inductance module 12 includes a coil assembly equivalent to common mode inductance. Optionally, the coil assembly includes, but is not limited to, a coil and a magnetic bead. For example, a coil assembly equivalent to a common mode inductance is formed by combining a coil and magnetic beads, so that distributed capacitance existing in the coil assembly is cancelled, and the self-resonance frequency of the coil assembly is improved.
In a specific embodiment, as shown in fig. 1, the current sensor 10 includes an electromagnetic circuit 11 and at least one common mode inductor module 12, and each common mode inductor module 12 is disposed on the electromagnetic circuit 11. Since the distributed capacitance in the common mode inductor module 12 can be cancelled by the common mode inductor module 12, so that the common mode inductor module 12 has a higher self-resonant frequency, and therefore, the bandwidth of the current sensor 10 can be increased by disposing each common mode inductor module 12 on the electromagnetic magnetic circuit 11.
In the present embodiment, the current sensor 10 includes the electromagnetic circuit 11 and at least one common mode inductance module 12, and since the distributed capacitance in the common mode inductance module 12 can be cancelled by the common mode inductance module 12, so that the common mode inductance module 12 has a higher self-resonant frequency, the present embodiment can increase the bandwidth of the current sensor 10 by disposing each common mode inductance module 12 on the electromagnetic circuit 11.
In one embodiment, as shown in fig. 2 to 3, the number of the common mode inductance modules 12 is at least two, and at least two common mode inductance modules 12 are arranged in series on the electromagnetic circuit 11.
In an embodiment, as shown in fig. 2, if the number of the common mode inductance modules 12 is at least two, at least two common mode inductance modules 12 are serially connected to the electromagnetic circuit 11, wherein the at least two common mode inductance modules 12 are serially connected in such a manner that the magnetic field directions of the at least two common mode inductance modules 12 are the same.
In this embodiment, if the number of the common mode inductance modules 12 in the current sensor 10 is at least two, the current sensor 10 including at least two common mode inductance modules 12 can also have a higher bandwidth by serially connecting at least two common mode inductance modules 12 on the electromagnetic magnetic circuit 11 and ensuring that the magnetic field directions of the at least two common mode inductance modules 12 are the same in the serial connection manner.
In one embodiment, as shown in fig. 1, the common mode inductance module 12 includes a first coil 121, a second coil 122, and a common mode magnetic bead 123; the first coil 121 and the second coil 122 are oppositely arranged on the electromagnetic magnetic circuit 11 in parallel; the ends of the first coil 121 and the second coil 122 with the same name are connected in parallel to form a first lead 124 and a second lead 125; a first lead 124 and a second lead 125 are disposed within the common mode magnetic bead 123.
The common mode magnetic bead 123 is a magnetic bead in the common mode inductance module 12. Alternatively, the common mode magnetic bead 123 may be a ring-shaped magnetic bead, so that the first lead 124 and the second lead 125 are conveniently arranged in the common mode magnetic bead 123.
In one embodiment, as shown in fig. 1, common mode inductance module 12 includes a coil assembly equivalent to a common mode inductance. Optionally, the coil assembly comprises a first coil 121, a second coil 122 and a common mode magnetic bead 123. In this embodiment, the first coil 121, the second coil 122 and the common mode magnetic bead 123 are equivalent to a common mode inductance, so as to cancel the distributed capacitance of the first coil 121 and the second coil 122, further improve the self-resonant frequency of the first coil 121 and the second coil 122, and achieve the purpose of improving the bandwidth of the current sensor 10.
In a specific embodiment, the first coil 121 and the second coil 122 are oppositely disposed on the electromagnetic circuit 11 in parallel, and the ends of the same name of the first coil 121 and the second coil 122 are connected in parallel to form a first lead 124 and a second lead 125. As an example, the positive pole of the first coil 121 is connected to the positive pole of the second coil 122, and the negative pole of the first coil 121 is connected to the negative pole of the second coil 122, that is, the terminals of the same name of the first coil 121 and the second coil 122 are connected in parallel. As another example, the first lead 124 is formed at a connection node of the positive electrode of the first coil 121 and the positive electrode of the second coil 122, and the second lead 125 is formed at a connection node of the negative electrode of the first coil 121 and the negative electrode of the second coil 122.
In a specific embodiment, the first lead 124 and the second lead 125 are disposed in the common mode magnetic bead 123, so that the first lead 124, the second lead 125 and the common mode magnetic bead 123 can be equivalent to a common mode inductance, and the equivalent common mode inductance can cancel distributed capacitances of the first coil 121 and the second coil 122, thereby increasing a self-resonant frequency of the first coil 121 and the second coil 122, that is, increasing a self-resonant frequency of the common mode inductance module 12, and further achieving a purpose of increasing a bandwidth of the current sensor 10.
As an example, a first coil 121 and a second coil 122 are oppositely arranged on the electromagnetic magnetic circuit 11 in parallel, and the ends of the same name of the first coil 121 and the second coil 122 are connected in parallel to form a first lead 124 and a second lead 125; the first lead 124 and the second lead 125 are disposed in the common mode magnetic bead 123, and compared with the case where the first coil 121 and the second coil 122 are directly disposed on the electromagnetic magnetic circuit 11, the purpose of increasing the bandwidth of the current sensor 10 can be achieved. For example, two coils of 100 turns with a diameter of 5 mm are directly connected in series or in parallel on the electromagnetic circuit 11, and the self-resonant frequency of both coils is lower than 50 MHZ. If two coils of 100 turns with the diameter of 5 mm are oppositely arranged on the electromagnetic magnetic circuit 11 in parallel, and the ends with the same name of the two coils are connected in parallel to form a first lead 124 and a second lead 125, the first lead 124 and the second lead 125 are arranged in the common mode magnetic bead 123 in a penetrating manner, the first lead 124 and the second lead 125 are equivalent to a common mode inductor when penetrating through the common mode magnetic bead 123, the distributed capacitance of the two coils is offset, so that the self-resonance frequency of the two coils is improved to be more than 100MHZ, and the bandwidth of the current sensor 10 is also improved to be more than 100 MHZ.
In this embodiment, the common mode inductance module 12 includes a first coil 121, a second coil 122 and a common mode magnetic bead 123, and the first coil 121 and the second coil 122 are oppositely disposed in parallel on the electromagnetic magnetic circuit 11, and the ends of the first coil 121 and the second coil 122 having the same name are connected in parallel to form a first lead 124 and a second lead 125, and the first lead 124 and the second lead 125 are inserted into the common mode magnetic bead 123. Therefore, the first lead 124, the second lead 125 and the common-mode magnetic bead 123 can be equivalent to a common-mode inductor, and the equivalent common-mode inductor can cancel the distributed capacitance of the first coil 121 and the second coil 122, so as to improve the self-resonant frequency of the first coil 121 and the second coil 122, that is, improve the self-resonant frequency of the common-mode inductor module 12, and further achieve the purpose of increasing the bandwidth of the current sensor 10.
Optionally, the number of turns of the coil in any one common mode inductance module 12 of the at least two common mode inductance modules 12 may be the same as or different from the number of turns of the coil in the other common mode inductance modules 12 of the at least two common mode inductance modules 12, which is not limited herein.
Optionally, the number of coil turns between the coils in each common mode inductance module 12 is the same.
In one embodiment, the common mode inductance module 12 includes a first coil 121 and a second coil 122, and the number of turns of the first coil 121 is the same as that of the second coil 122.
In one embodiment, as shown in fig. 1, if the number of the common mode inductance modules 12 is 1, the first lead 124 of the common mode inductance module 12 is the first connection terminal of the current sensor 10, and the second lead 125 of the common mode inductance module 12 is the second connection terminal of the current sensor 10; if the number of the common mode inductance modules 12 is N, the first lead 124 of the 1 st common mode inductance module 12 is the first connection end of the current sensor 10, the second lead 125 of the ith common mode inductance module 12 is connected with the first lead 124 of the (i + 1) th common mode inductance module 12, the second lead 125 of the nth common mode inductance module 12 is the second connection end of the current sensor 10, N is greater than or equal to 2, and i is greater than or equal to 1 and less than or equal to N-1.
In a specific embodiment, as shown in fig. 2, the number of the common mode inductance modules 12 is 1, the common mode inductance module 12 includes a first connection terminal and a second connection terminal, and the current sensor 10 further includes an output socket J1. The first connection terminal of the common mode inductance module 12 is connected to the first output terminal of the output socket J1, and the second connection terminal of the common mode inductance module 12 is connected to the second output terminal of the output socket J1. In this example, the first connection end of the common mode inductance module 12 may be used as the first lead 124, the second connection end of the current sensor 10 may be used as the first lead 124, and the first lead 124 and the second lead 125 are inserted into the common mode magnetic bead 123, so that the first lead 124, the second lead 125, and the common mode magnetic bead 123 can be equivalent to a common mode inductance, and the equivalent common mode inductance can cancel distributed capacitance of a coil in the common mode inductance module 12, thereby increasing a self-resonant frequency of the common mode inductance module 12, and further achieving a purpose of increasing a bandwidth of the current sensor 10.
In another embodiment, as shown in fig. 3, if the number N of the common mode inductance modules 12 is 2, that is, the number of the common mode inductance modules 12 is 2, the first lead 124 (positive electrode) of the 1 st common mode inductance module 12 is a first connection end of the current sensor 10, the second lead 125 (negative electrode) of the 1 st common mode inductance module 12 is connected to the first lead 124 (negative electrode) of the 2 nd common mode inductance module 12, the second lead 125 (positive electrode) of the 2 nd common mode inductance module 12 is a second connection end of the current sensor 10, and the first lead 124 and the second lead 125 of the 1 st common mode inductance module 12 are inserted into the common mode magnetic bead 123 of the 1 st common mode inductance module 12 to form an equivalent common mode inductance and increase a self-resonant frequency of the 1 st common mode inductance module 12; the first lead 124 and the second lead 125 of the 2 nd common mode inductor module 12 are inserted into the common mode magnetic bead 123 of the 2 nd common mode inductor module 12 to form an equivalent common mode inductor, so as to improve the self-resonant frequency of the 2 nd common mode inductor module 12, thereby improving the bandwidth of the current sensor 10.
In another embodiment, if the number N of the common mode inductor modules 12 is 3, that is, the number of the common mode inductor modules 12 is 3, then the first lead 124 (positive electrode) of the 1 st common mode inductor module 12 is the first connection terminal of the current sensor 10, the second lead 125 (negative electrode) of the 1 st common mode inductor module 12 is connected to the first lead 124 (negative electrode) of the 2 nd common mode inductor module 12, the second lead 125 (positive electrode) of the 2 nd common mode inductor module 12 is connected to the first lead 124 (positive electrode) of the 3 rd common mode inductor module 12, the second lead 125 (negative electrode) of the 3 rd common mode inductor module 12 is the second connection terminal of the current sensor 10, and the first lead 124 and the second lead 125 of the 1 st common mode inductor module 12 are inserted into the common mode magnetic bead 123 of the 1 st common mode inductor module 12 to form an equivalent common mode inductor, increasing the self-resonant frequency of the 1 st common mode inductance module 12; a first lead 124 and a second lead 125 of the 2 nd common mode inductor module 12 are arranged in the common mode magnetic bead 123 of the 2 nd common mode inductor module 12 in a penetrating manner to form an equivalent common mode inductor, so that the self-resonance frequency of the 2 nd common mode inductor module 12 is improved; the first lead 124 and the second lead 125 of the 3 rd common mode inductor module 12 are inserted into the common mode magnetic bead 123 of the 3 rd common mode inductor module 12 to form an equivalent common mode inductor, so as to improve the self-resonant frequency of the 3 rd common mode inductor module 12, thereby improving the bandwidth of the current sensor 10.
It should be noted that, if the number of the common mode inductance modules 12 is N, only the first lead 124 and the second lead 125 on at least one common mode inductance module 12 in the N common mode inductance modules need to be inserted into the common mode magnetic bead 123, so as to achieve the purpose of increasing the bandwidth of the current sensor 10. Preferably, the first lead 124 and the second lead 125 on each common-mode inductor module 12 in the N shared inductor modules are disposed in a common-mode magnetic bead 123, so as to further increase the bandwidth of the current sensor 10. As an example, only the first lead 124 and the second lead 125 of the 1 st common mode inductance module 12 need to be inserted into the common mode magnetic bead 123 of the 1 st common mode inductance module 12, and the first lead 124 and the second lead 125 of the 2 nd common mode inductance module 12 and the first lead 124 and the second lead 125 of the 3 rd common mode inductance module 12 are not inserted into the common mode magnetic bead 123, which can also achieve the purpose of increasing the bandwidth of the current sensor 10.
In this embodiment, if the number of the common mode inductance modules 12 is 1, the first lead 124 of the common mode inductance module 12 is the first connection end of the current sensor 10, and the second lead 125 of the common mode inductance module 12 is the second connection end of the current sensor 10; if the number of the common mode inductance modules 12 is N, the first lead 124 of the 1 st common mode inductance module 12 is the first connection end of the current sensor 10, the second lead 125 of the ith common mode inductance module 12 is connected to the first lead 124 of the (i + 1) th common mode inductance module 12, the second lead 125 of the nth common mode inductance module 12 is the second connection end of the current sensor 10, N is greater than or equal to 2, and i is greater than or equal to 1 and less than or equal to N-1, so that the current sensor 10 can maintain a higher bandwidth when having different numbers of common mode inductance modules 12, and the current detection effect of the current sensor 10 is improved.
In one embodiment, as shown in fig. 1, the electromagnetic circuit 11 includes a first core 111 and a second core 112 disposed in parallel and opposite to each other, and at least one common mode inductance module 12 is disposed on the first core 111 and the second core 112.
In a specific embodiment, the electromagnetic circuit 11 includes a first magnetic core 111 and a second magnetic core 112 disposed in parallel and opposite to each other. Optionally, the first and second cores 111, 112 are ferrite cores.
In a particular embodiment, at least one common mode inductance module 12 is disposed on first core 111 and second core 112. As an example, the at least one common mode inductance module 12 includes a first coil 121 and a second coil 122, the first coil 121 is disposed on the first magnetic core 111, the second coil 122 is disposed on the second magnetic core 112, and the first coil 121 and the second coil 122 are disposed in parallel and opposite to each other.
In the present embodiment, the electromagnetic circuit 11 includes the first magnetic core 111 and the second magnetic core 112 disposed oppositely in parallel, and the common mode inductance module 12 in at least one of the above embodiments is disposed on the first magnetic core 111 and the second magnetic core 112, so that the current sensor 10 has a higher bandwidth, thereby improving the current detection effect of the current sensor 10.
In one embodiment, as shown in fig. 2, the electromagnetic circuit 11 further includes a third magnetic core 113 and a fourth magnetic core 114; a first end of the third magnetic core 113 is connected to a first end of the first magnetic core 111, and a second end of the third magnetic core 113 is connected to a first end of the second magnetic core 112; a first end of fourth core 114 is coupled to a second end of first core 111 and a second end of fourth core 114 is coupled to a second end of second core 112.
Wherein, the electromagnetic circuit 11 further comprises a third magnetic core 113 and a fourth magnetic core 114. Optionally, the third core 113 and the fourth core 114 are ferrite cores.
In one embodiment, a first end of the third core 113 is connected to a first end of the first core 111, and a second end of the third core 113 is connected to a first end of the second core 112; a first end of fourth core 114 is connected to a second end of first core 111, and a second end of fourth core 114 is connected to a second end of second core 112, thereby forming electromagnetic circuit 11 in the above-described embodiment.
Optionally, a hall magnetic field sensor H1 is further included in the electromagnetic magnetic circuit 11 for detecting the magnetic field of the electromagnetic magnetic circuit 11. As an example, the hall magnetic field sensor H1 is disposed between the second end of the fourth magnetic core 114 and the second end of the second magnetic core 112, and the output terminal of the hall magnetic field sensor H1 is connected to the output socket J1.
In the present embodiment, the electromagnetic circuit 11 further includes a third magnetic core 113 and a fourth magnetic core 114; a first end of the third magnetic core 113 is connected to a first end of the first magnetic core 111, and a second end of the third magnetic core 113 is connected to a first end of the second magnetic core 112; a first end of fourth core 114 is connected to a second end of first core 111, and a second end of fourth core 114 is connected to a second end of second core 112, to form electromagnetic circuit 11 in the above-described embodiment.
The present embodiment provides a current probe 30, as shown in fig. 4, which includes a front-end signal processing circuit 31 and the current sensor 10 in the above embodiments, and the current sensor 10 is connected to the front-end signal processing circuit 31.
In the present embodiment, the current probe 30 includes the front-end signal processing circuit 31 and the current sensor 10 in the above-described embodiment, and the current sensor 10 is connected to the front-end signal processing circuit 31. Since the current sensor 10 has a high bandwidth, the current detection effect of the current probe 30 can be improved.
The present embodiment provides a current detection system, as shown in fig. 5, including a back-end amplification circuit 41, an oscilloscope 42, and the current probe 30 in the above embodiments; the front end signal processing circuit 31 in the current probe 30 is connected with the rear end amplifying circuit 41; the back-end amplification circuit 41 is connected to an oscilloscope 42.
In the present embodiment, the back-end amplification circuit 41, the oscilloscope 42, and the current probe 30 in the above-described embodiment; the front end signal processing circuit 31 in the current probe 30 is connected with the rear end amplifying circuit 41; the rear-end amplifier circuit 41 is connected to the oscilloscope 42, and the current sensor 10 in the current probe 30 has a high bandwidth, so that the current detection effect of the current detection system can be improved.
The above-mentioned embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the same; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not substantially depart from the spirit and scope of the embodiments of the present invention, and are intended to be included within the scope of the present invention.
Claims (10)
1. A current sensor comprising an electromagnetic circuit and at least one common mode inductance module, each common mode inductance module being disposed on the electromagnetic circuit.
2. The current sensor of claim 1, wherein the number of common mode inductance modules is at least two, at least two of the common mode inductance modules being disposed in series on the electromagnetic circuit.
3. The current sensor of claim 1 or 2, wherein the common mode inductance module comprises a first coil, a second coil, and a common mode magnetic bead; the first coil and the second coil are oppositely arranged on the electromagnetic circuit in parallel; the homonymous ends of the first coil and the second coil are connected in parallel to form a first lead and a second lead; the first lead and the second lead are arranged in the common-mode magnetic bead in a penetrating mode.
4. The current sensor of claim 3, wherein the number of coil turns of the first coil and the number of coil turns of the second coil are the same.
5. The current sensor of claim 3, wherein the common mode magnetic bead is a ring magnetic bead.
6. The current sensor according to claim 1, wherein if the number of the common mode inductance modules is 1, the first lead of the common mode inductance module is the first connection terminal of the current sensor, and the second lead of the common mode inductance module is the second connection terminal of the current sensor;
if the number of the common mode inductance modules is N, a first lead of the 1 st common mode inductance module is a first connection end of the current sensor, a second lead of the ith common mode inductance module is connected with a first lead of the (i + 1) th common mode inductance module, a second lead of the Nth common mode inductance module is a second connection end of the current sensor, N is more than or equal to 2, and i is more than or equal to 1 and less than or equal to N-1.
7. The current sensor of claim 1, wherein the electromagnetic circuit comprises first and second parallel oppositely disposed cores, at least one of the common mode inductance modules being disposed on the first and second cores.
8. The current sensor of claim 7, wherein the electromagnetic circuit further comprises a third magnetic core and a fourth magnetic core; the first end of the third magnetic core is connected with the first end of the first magnetic core, and the second end of the third magnetic core is connected with the first end of the second magnetic core; and the first end of the fourth magnetic core is connected with the second end of the first magnetic core, and the second end of the fourth magnetic core is connected with the second end of the second magnetic core.
9. A current probe comprising a front end signal processing circuit and a current sensor according to any one of claims 1 to 8, said current sensor being connected to said front end signal processing circuit.
10. A current sensing system comprising a back-end amplification circuit, an oscilloscope, and a current probe according to claim 9; a front-end signal processing circuit in the current probe is connected with the rear-end amplifying circuit; the rear end amplifying circuit is connected with the oscilloscope.
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