CN113740351A - Test device and test method - Google Patents
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- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
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Abstract
The invention provides a testing device and a testing method, comprising the following steps: the over-excitation module is used for providing extreme working conditions for the tested piece so that the tested piece is burnt in the burning experiment process; and the high-speed camera module is used for shooting the inside of the tested piece in real time in the burning experiment process. The testing device provided by the invention uses the over-excitation module for excitation to carry out a burning experiment on the tested piece, so that the tested piece is burnt, at the moment of burning the tested piece, the condition of the components at the moment of burning can be clearly shot through the high-speed camera module, the shooting, recording and burning process is carried out, and the picture capture is completed.
Description
Technical Field
The present invention relates to the field of integrated circuit technologies, and in particular, to a test apparatus and a test method.
Background
With the continuous development of semiconductor technology, the feature size of semiconductor devices is continuously reduced, the integration level is continuously improved, and the reliability requirements of the devices are higher and higher. The existing device burning test technical scheme mainly uses means such as a microscope and the like to observe the burning condition inside the device after the device burning test, and the method has the defects that the dynamic condition of the device which is damaged at one moment of burning cannot be known, and the device can only be analyzed after the test.
Disclosure of Invention
In order to solve the technical problems, the invention designs a testing device and a testing method, which can shoot the interior of a tested element in real time in the burning experiment process and accurately analyze the burning position of the element.
A test apparatus, comprising:
the over-excitation module is used for providing extreme working conditions for the tested piece so that the tested piece is burnt in the burning experiment process; and the high-speed camera module is used for shooting the inside of the tested piece in real time in the burning experiment process.
In one embodiment, the overdrive module comprises a radio frequency signal source, a power amplifier and a direct current power supply. The output end of the radio frequency signal source is connected with the input end of the power amplifier, and the radio frequency signal source is used for providing input radio frequency signals for the power amplifier. The output end of the power amplifier is connected with the tested piece and used for amplifying the input radio frequency signal and then providing the amplified signal to the tested piece. The direct current power supply is connected with the tested piece and used for providing direct current voltage and direct current for the tested piece.
In one embodiment, the overdrive module further comprises a directional coupler, an attenuator, an input power meter, an output power meter and an industrial personal computer. The directional coupler comprises an input end, a coupling output end and a through output end, the input end of the directional coupler is connected with the output end of the power amplifier, and the directional coupler is used for separating the radio-frequency signal amplified by the power amplifier into two paths and outputting the two paths through the coupling output end and the through output end respectively; the coupling output end of the directional coupler is connected with the input power meter, and the through output end of the directional coupler is connected with the tested piece. The input end of the attenuator is connected with the tested piece, and the output end of the attenuator is connected with the output power meter; the industrial personal computer is connected with the input power meter, the output power meter and the direct current power supply and is used for monitoring and recording the radio frequency power and the direct current data of the real-time radio frequency signals.
In one embodiment, the testing device further comprises a light source module, and the light source module is used for providing illumination light rays for the tested piece.
In one embodiment, the light source module comprises a pulsed laser light source, the illumination light comprises illumination light of a single wavelength; the testing device further comprises a control module, wherein the control module is connected with the high-speed camera module and the light source module and is used for synchronizing the high-speed camera module and the light source module so that the shooting frame rate of the high-speed camera module is consistent with the frequency of the light source module.
In one embodiment, a light source module includes a controller, a laser, an optical fiber, and a beam expander. The controller is respectively connected with the control end of the laser and the control module through communication cables; the output end of the laser is connected with the optical fiber, the output port of the optical fiber is positioned in the beam expanding lens, and toughened glass is embedded outside the lens of the beam expanding lens.
In one embodiment, the high-speed camera module comprises a high-speed camera and a telephoto lens; the control module is respectively connected with the high-speed camera and the controller; the high-speed camera and the controller realize pulse synchronization; the measured piece is positioned on the imaging light path of the high-speed camera; the telephoto lens is mounted on the high-speed camera and located between the high-speed camera and the object to be measured.
In one embodiment, the high-speed camera module further comprises a filter, and the filter is located between the telephoto lens and the measured piece.
Further, the high-speed camera module also comprises a camera adjusting bracket, and the high-speed camera is installed on the camera adjusting bracket.
A testing method using the testing device according to any one of the above aspects, comprising:
exciting a tested piece by using the over-excitation module, and carrying out a burning experiment on the tested piece to ensure that the tested piece is burnt; and at the moment of burning the tested piece, finishing the shooting and recording process through the high-speed camera to finish picture capture.
Further, the overdrive module is used for exciting the tested piece, and a burning experiment is carried out on the tested piece, so that the burning of the tested piece comprises the following steps: and increasing the voltage of a direct current power supply in the over-excitation module by adopting an over-voltage mode until the tested piece is burnt.
Further, the overdrive module is used for exciting the tested piece, and a burning experiment is carried out on the tested piece, so that the burning of the tested piece comprises the following steps: and increasing the input radio frequency signal of the radio frequency signal source in the overdrive module by adopting an overdrive radio frequency signal mode until the tested piece is burnt.
The testing device and the testing method have the following beneficial effects:
the testing device provided by the invention uses the over-excitation module for excitation to carry out a burning experiment on the tested piece, so that the tested piece is burnt, at the moment of burning the tested piece, the condition of the components at the moment of burning can be clearly shot through the high-speed camera module, the shooting, recording and burning process is carried out, and the picture capture is completed.
By arranging the filter between the telephoto lens of the camera device and the tested device, even when a large amount of white light is generated in the moment of burning, the photos can be clearly shot, the burning position of the device can be accurately analyzed, the dynamic failure process of the device can be obtained, and the failure mode of the semiconductor device can be better analyzed.
Through addding light source module, light source module can provide illuminating light to being surveyed the piece, can provide sufficient illumination for camera device, can further improve the definition of shooing.
Drawings
FIG. 1 is a block diagram of a test apparatus according to an embodiment of the present invention.
FIG. 2 is a block diagram of an overdrive module in accordance with an embodiment of the present invention.
Fig. 3 is a structural view of a light source module according to an embodiment of the present invention.
Fig. 4 is a block diagram of a high-speed camera module according to an embodiment of the invention.
Description of reference numerals:
10. a control module; 20. an overdrive module; 30. a light source module; 40. a high-speed camera module; 50. an object stage; 21. a radio frequency signal source; 22. a power amplifier; 23. a directional coupler; 24. a measured piece; 25. an attenuator; 26. an input power meter; 27. an output power meter; 28. a direct current power supply; 29. an industrial personal computer; 31. a controller; 32. a laser; 33. an optical fiber; 34. a beam expander; 41. a high-speed camera; 42. a telephoto lens; 43. a filter plate; 44. the camera adjusts the support.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.
In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
With the continuous development of semiconductor technology, the feature size of semiconductor devices is continuously reduced, the integration level is continuously improved, and the reliability requirements of the devices are higher and higher. The existing device burning test technical scheme mainly uses means such as a microscope and the like to observe the burning condition inside the device after the device burning test, and the method has the defects that the dynamic condition of the device which is damaged at one moment of burning cannot be known, and the device can only be analyzed after the test.
The invention designs a testing device and a testing method, which can shoot the interior of a tested element in real time in the burning experiment process and accurately analyze the burning position of the element.
FIG. 1 is a diagram showing an overall configuration of a test apparatus according to an embodiment. As shown in fig. 1, the test apparatus includes: the over-excitation module 20 is used for providing extreme working conditions for the tested piece 24 so that the tested piece 24 is burnt in the burning experiment process; and the high-speed camera module 40 is used for shooting the inside of the tested piece 24 in real time in the burning experiment process.
As shown in fig. 2, in one embodiment, the overdrive module 20 includes a radio frequency signal source 21, a power amplifier 22 and a dc power supply 28; the output end of the radio frequency signal source 21 is connected to the input end of the power amplifier 22, the radio frequency signal source 21 is configured to provide an input radio frequency signal to the power amplifier 22, the radio frequency signal is a signal output by the radio frequency signal source 21 and is also an input signal required by the tested piece 24, and a characterization parameter of the size of the radio frequency signal is radio frequency power; the output end of the power amplifier 22 is connected to the tested piece 24, and is configured to amplify the input radio frequency signal and provide the amplified input radio frequency signal to the tested piece 24, so that the tested piece 24 reaches a rated input power required by normal driving; the dc power supply 28 is connected to the device under test 24 and is configured to provide a dc voltage and a dc current to the device under test 24. The gate of the device under test 24 is connected to the voltage VGG of the dc power supply 28, the drain is connected to the voltage VDD of the dc power supply 28, and the source is connected to the ground of the dc power supply 28.
With continued reference to fig. 2, in one embodiment, the overdrive module 20 further includes a directional coupler 23, an attenuator 25, an input power meter 26, an output power meter 27, and an industrial personal computer 29.
The directional coupler 23 includes an input end, a coupled output end and a through output end, the input end of the directional coupler 23 is connected to the output end of the power amplifier 22, and the directional coupler 23 is configured to separate the radio frequency signal amplified by the power amplifier 22 into two paths, and output the two paths via the coupled output end and the through output end respectively; the coupling output end of the directional coupler 23 is connected to the input power meter 26, and the through output end of the directional coupler 23 is connected to the tested piece 24. The input end of the attenuator 25 is connected with the tested piece 24, the output end of the attenuator 25 is connected with the output power meter 27, and the attenuator 25 is used for controlling the power of the output signal of the tested piece 24 and avoiding the output power meter 27 from being burnt by overlarge power. The industrial personal computer 29 is connected with the input power meter 26, the output power meter 27 and the direct current power supply 28, and the industrial personal computer 29 is provided with monitoring software of the power meter and the direct current power supply and used for monitoring and recording data of real-time radio frequency power, direct current voltage and direct current. The real-time rf power is recorded to determine the working status of the tested piece 24, so as to ensure that the tested piece 24 can work normally before burning.
As shown in FIG. 1, in one embodiment, the testing apparatus further comprises a light source module 30, wherein the light source module 30 is used for providing illumination light to the tested piece 24.
In one embodiment, the light source module 30 may include, but is not limited to, a pulsed laser light source; the illumination light provided by the light source module 30 to the measured object 24 may include, but is not limited to, illumination light of a single wavelength, such as laser light of a single wavelength.
With reference to fig. 1, in an embodiment, the testing apparatus includes a control module 10, the control module 10 is installed with light source software and camera control software, the control module 10 is connected to both the high-speed camera module 40 and the light source module 30, and the control module 10 is configured to synchronize the high-speed camera module 40 and the light source module 30, so that a shooting frame rate of the high-speed camera module 40 is consistent with a frequency of the light source module 30, thereby ensuring that a light source can illuminate a tested object while shooting.
As shown in FIG. 3, in one embodiment, the light source module 30 includes a controller 31, a laser 32, an optical fiber 33, and a beam expander 34. The controller 31 is used as a master switch of the light source module 30, and is respectively connected to the control end of the laser 32 and the control module 10 through communication cables; the output end of the laser 32 is connected with the input port of the optical fiber 33, and the output port of the optical fiber 33 is located in the beam expander 34 for focusing on the measured piece 24 to provide a light source, so that the quality of the shot picture is improved.
Specifically, the beam expander 34 is fixed to the workpiece 24 obliquely above by a robot, and supplies a light source from the side.
Furthermore, toughened glass is embedded outside the lens of beam expanding lens 34, prevents that the piece that is surveyed from burning out the piece that splashes when exploding scrapes the colored camera lens.
As shown in fig. 4, in one embodiment, the high-speed camera module 40 includes a high-speed camera 41 and a telephoto lens 42; the control module 10 is respectively connected with the high-speed camera 41 and the controller 31; the high-speed camera 41 and the controller 31 realize pulse synchronization; specifically, the high-speed camera 41 is connected with the control module 10 through a camera cable, and the control module 10 is connected with the controller 31 through a communication cable, so as to control the high-speed camera 41 and the controller 31 to be pulse-synchronized; the measured piece 24 is positioned on an imaging optical path of the high-speed camera 41; the telephoto lens 42 is mounted on the high-speed camera 41 and is located between the high-speed camera 41 and the object to be measured 24.
Specifically, the high-speed camera 41 in the high-speed camera module 40 is connected to the control module 10. With continued reference to fig. 4, in one embodiment, the high-speed camera module 40 further includes a filter 43, and the filter 43 is located between the telephoto lens 42 and the device under test 24. Because the device can generate a large amount of white light when being burnt out, the filter 43 is additionally arranged to filter other wavelengths of light, and only single wavelength of light is passed, so that the high-speed camera 41 can shoot clear images in the device.
Specifically, the filter 43 can pass only a single wavelength of the illumination light provided by the light source module 30, so that other light can be filtered.
Further, the telephoto lens 42 is detachably mounted on the high-speed camera 41.
With continued reference to fig. 4, in one embodiment, the high speed camera module 40 further includes a camera adjustment bracket 44, the high speed camera 41 is mounted on the camera adjustment bracket 44, and the object under test 24 is placed on an omni-directional movable stage such that the object under test 24 is visible in the field of view of the high speed camera 42.
Further, the high-speed camera 41 is detachably mounted on the camera adjusting bracket 44.
Specifically, the size of the captured image is selected according to the performance of the high-speed camera lens and the camera. The size of the captured image and the frame rate affect each other, and generally, the higher the frame rate is, the narrower the field of view is, and the smaller the image size is. In one embodiment, the photographing frame rate is set to 50000fps, the photographing resolution is 512 × 512, and the exposure time is 1 μ s. Of course, in other embodiments, the lens and camera may be any other camera and lens that can meet the shooting requirement, and is not limited to such a high-speed camera and a telephoto lens.
In one embodiment, the distance between the lens and the measured object is determined according to the performance of the lens and the camera of the high-speed camera, so as to ensure that the camera can clearly shoot the measured object.
Specifically, the distance between the lens and the measured piece is set to be 5cm-15cm, deformation and burning conditions of an internal bonding wire, a microstructure and the like need to be observed during actual shooting, so that the distance between the lens and the measured piece can be set to be 5cm, 8cm, 10cm, 12cm and 15cm according to requirements during actual shooting, and in other embodiments, all distances meeting shooting requirements are protected by the invention.
In addition, the invention also designs a test method adopting the test device of any scheme, which comprises the following steps:
exciting a tested piece by using the over-excitation module 20, and carrying out a burning experiment on the tested piece 24 to enable the tested piece 24 to be burnt; at the moment of burning the tested piece, the shooting and recording process is completed through the high-speed camera 41, and the picture capture is completed.
In one embodiment, the overdrive module 20 is used to excite the tested piece 24, and a burn-out experiment is performed on the tested piece 24, so that before the tested piece 24 is burned out, the test method includes preparation work before the experiment, and specifically includes the following steps:
(1) configuring an overdrive module 20; before the stress begins, a power meter and direct-current power supply monitoring software are configured on the industrial personal computer 29, the working frequency and amplitude of the radio-frequency signal source 21 are set, and the direct-current power supply 28 is adjusted to enable a tested piece to be in a normal working state at the beginning of an experiment;
(2) when the stress starts, the voltage output switch of the direct current power supply 28 is turned on, then the radio frequency signal output switch of the radio frequency signal source 21 is turned on, the power meter of the industrial personal computer 29 and the direct current power supply monitoring software are turned on, and data of input and output radio frequency power, direct current voltage and direct current are recorded after the reading is stable. The recording of the radio frequency power is to determine the working state of the tested device 24 and ensure that the device can normally work before being burnt;
(3) before the burn-out experiment is carried out, the light source module 30 and the high-speed camera module 40 are started;
(4) configuring light source software and camera control software on the control module 10, and adjusting the signal synchronization of the light source software and the camera control software;
(5) adjusting the position of the optical fiber 33 in the beam expander 34 enables the generated light spot to be focused inside the whole device, so as to provide sufficient illumination;
(6) the height of the stage 50 is adjusted to allow the high-speed camera 41 to focus the inside of the device and clearly photograph the internal structure of the device. And after the configuration is finished, the camera continuously captures the internal picture of the device.
In one embodiment, the overdriving module 20 is used to excite the tested piece 24, and a burn-out experiment is performed on the tested piece 24, so that the burn-out of the tested piece 24 includes: the Voltage (VDD) of the dc power supply 28 in the overdrive module 20 is increased by an overvoltage manner until the device under test 24 is burned out, that is, when the source-drain voltage (difference between the source voltage and the drain voltage) of the device under test 24 is large enough, the device under test 24 is burned out.
In one embodiment, the overdriving module 20 is used to excite the tested piece 24, and a burn-out experiment is performed on the tested piece 24, so that the burn-out of the tested piece 24 includes: the Voltage (VGG) of the dc power supply 28 in the overdrive module 20 is increased by an overvoltage manner until the device under test 24 is burned, i.e. when the gate-source voltage (the voltage difference between the gate and the source) of the device under test 24 is large enough, the device under test 24 is burned.
In one embodiment, the overdriving module 20 is used to excite the tested piece 24, and a burn-out experiment is performed on the tested piece 24, so that the burn-out of the tested piece 24 includes: and increasing the input radio frequency signal of the radio frequency signal source 21 in the overdrive module 20 by adopting an overdrive radio frequency signal mode until the tested piece 24 is burnt.
In one embodiment, the testing device provided by the invention is matched with the later analysis software to perform frame-by-frame analysis, so that the testing result can be repeatedly reproduced, and a researcher can conveniently analyze the failure condition of a tested piece for many times.
According to the testing device and the testing method, the over-excitation module is used for exciting, a burning experiment is carried out on the tested piece, so that the tested piece is burnt, at the moment of burning of the tested piece, the condition of the components at the moment of burning can be clearly shot through the high-speed camera module, the shooting, recording and burning process is carried out, and the picture capture is completed; by arranging the filter between the long-focus lens of the camera device and the tested device, even if a large amount of white light is generated at the moment of burning, the picture can be clearly shot, the burning position of the device can be accurately analyzed, the dynamic failure process of the device can be obtained, and the failure mode of the semiconductor device can be better analyzed; through addding light source module, light source module can provide illuminating light to being surveyed the piece, can provide sufficient illumination for camera device, can further improve the definition of shooing. The invention overcomes the defect that the current analysis equipment can only reflect the burning position of the semiconductor device statically and indirectly, and provides efficient, convenient and visual test results for researchers.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (12)
1. A test apparatus, the apparatus comprising:
the over-excitation module is used for providing extreme working conditions for the tested piece so that the tested piece is burnt in the burning experiment process;
and the high-speed camera module is used for shooting the inside of the tested piece in real time in the burning experiment process.
2. The testing device of claim 1, wherein the overdrive module comprises a radio frequency signal source, a power amplifier and a dc power supply;
the output end of the radio frequency signal source is connected with the input end of the power amplifier, and the radio frequency signal source is used for providing an input radio frequency signal for the power amplifier;
the output end of the power amplifier is connected with the tested piece and used for amplifying the input radio frequency signal and then providing the amplified signal to the tested piece;
and the direct current power supply is connected with the tested piece and used for providing direct current voltage and direct current for the tested piece.
3. The testing device of claim 2, wherein the overdrive module further comprises a directional coupler, an attenuator, an input power meter, an output power meter and an industrial personal computer;
the directional coupler comprises an input end, a coupling output end and a through output end, the input end of the directional coupler is connected with the output end of the power amplifier, and the directional coupler is used for separating the radio-frequency signal amplified by the power amplifier into two paths and outputting the two paths through the coupling output end and the through output end respectively; the coupling output end of the directional coupler is connected with the input power meter, and the through output end of the directional coupler is connected with the tested piece;
the input end of the attenuator is connected with the tested piece, and the output end of the attenuator is connected with the output power meter;
the industrial personal computer is connected with the input power meter, the output power meter and the direct current power supply and is used for monitoring and recording the radio frequency power and direct current data of real-time radio frequency signals.
4. The testing device of any one of claims 1-3, further comprising a light source module for providing illumination to the item under test.
5. The testing device of claim 4, wherein the light source module comprises a pulsed laser light source, the illumination light comprising a single wavelength of illumination light; the testing device further comprises a control module, wherein the control module is connected with the high-speed camera module and the light source module and is used for synchronizing the high-speed camera module and the light source module so that the shooting frame rate of the high-speed camera module is consistent with the frequency of the light source module.
6. The testing device of claim 5, wherein the light source module comprises a controller, a laser, an optical fiber, and a beam expander;
the controller is respectively connected with the control end of the laser and the control module through communication cables;
the output end of the laser is connected with the input port of the optical fiber; the output port of the optical fiber is positioned in the beam expanding lens, and toughened glass is embedded outside the lens of the beam expanding lens.
7. The testing device of claim 6, wherein the high-speed camera module comprises a high-speed camera and a telephoto lens;
the control module is respectively connected with the high-speed camera and the controller; the high-speed camera and the controller realize pulse synchronization; the measured piece is positioned on an imaging light path of the high-speed camera; the telephoto lens is mounted on the high-speed camera and located between the high-speed camera and the measured object.
8. The testing device of claim 7, wherein the high speed camera module further comprises a filter positioned between the telephoto lens and the piece under test.
9. The testing device of claim 8, wherein the high speed camera module further comprises a camera adjustment bracket; the high-speed camera is mounted on the camera adjusting bracket.
10. A test method using the test apparatus of any one of claims 1 to 9, comprising:
exciting a tested piece by using the over-excitation module, and carrying out a burning experiment on the tested piece to ensure that the tested piece is burnt;
and finishing the shooting and recording process through the high-speed camera at the moment that the detected piece is burnt out, and finishing the picture capture.
11. The testing method of claim 10, wherein the overdriving module is used to excite a tested object, and a burn-out experiment is performed on the tested object, so that the tested object is burned out, comprising: and increasing the voltage of a direct current power supply in the over-excitation module by adopting an over-voltage mode until the tested piece is burnt.
12. The testing method of claim 10, wherein the overdriving module is used to excite a tested object, and a burn-out experiment is performed on the tested object, so that the tested object is burned out, comprising: and increasing the input radio frequency signal of the radio frequency signal source in the overdrive module by adopting an overdrive radio frequency signal mode until the tested piece is burnt.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110924290.9A CN113740351A (en) | 2021-08-12 | 2021-08-12 | Test device and test method |
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| CN110658443A (en) * | 2019-10-21 | 2020-01-07 | 浙江大学 | Aging system for radio frequency front-end device |
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| JP2005136657A (en) * | 2003-10-30 | 2005-05-26 | Shimadzu Corp | High speed video camera |
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