CN113740141A - Metallographic developing solution for superfine nickel-titanium memory alloy wire and preparation method thereof - Google Patents
Metallographic developing solution for superfine nickel-titanium memory alloy wire and preparation method thereof Download PDFInfo
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- CN113740141A CN113740141A CN202110982665.7A CN202110982665A CN113740141A CN 113740141 A CN113740141 A CN 113740141A CN 202110982665 A CN202110982665 A CN 202110982665A CN 113740141 A CN113740141 A CN 113740141A
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- 229910001000 nickel titanium Inorganic materials 0.000 title claims abstract description 36
- 229910001285 shape-memory alloy Inorganic materials 0.000 title claims abstract description 30
- HZEWFHLRYVTOIW-UHFFFAOYSA-N [Ti].[Ni] Chemical compound [Ti].[Ni] HZEWFHLRYVTOIW-UHFFFAOYSA-N 0.000 title claims abstract description 27
- 238000002360 preparation method Methods 0.000 title claims abstract description 10
- VLTRZXGMWDSKGL-UHFFFAOYSA-N perchloric acid Chemical compound OCl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-N 0.000 claims abstract description 39
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims abstract description 36
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims abstract description 24
- 230000007797 corrosion Effects 0.000 claims abstract description 24
- 238000005260 corrosion Methods 0.000 claims abstract description 24
- 239000003112 inhibitor Substances 0.000 claims abstract description 24
- 229910017604 nitric acid Inorganic materials 0.000 claims abstract description 24
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 19
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims abstract description 17
- 239000007788 liquid Substances 0.000 claims abstract description 15
- 239000000463 material Substances 0.000 claims abstract description 10
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 claims abstract description 7
- 239000007787 solid Substances 0.000 claims abstract description 5
- 239000000243 solution Substances 0.000 claims description 41
- 238000003756 stirring Methods 0.000 claims description 17
- 239000005457 ice water Substances 0.000 claims description 16
- 238000001816 cooling Methods 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 10
- 239000011521 glass Substances 0.000 claims description 6
- 239000011259 mixed solution Substances 0.000 claims description 6
- 150000004673 fluoride salts Chemical class 0.000 claims description 3
- 230000002378 acidificating effect Effects 0.000 claims description 2
- HLXZNVUGXRDIFK-UHFFFAOYSA-N nickel titanium Chemical compound [Ti].[Ti].[Ti].[Ti].[Ti].[Ti].[Ti].[Ti].[Ti].[Ti].[Ti].[Ni].[Ni].[Ni].[Ni].[Ni].[Ni].[Ni].[Ni].[Ni].[Ni].[Ni].[Ni].[Ni].[Ni] HLXZNVUGXRDIFK-UHFFFAOYSA-N 0.000 claims description 2
- 238000005088 metallography Methods 0.000 claims 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 15
- 230000018109 developmental process Effects 0.000 description 5
- 230000003628 erosive effect Effects 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 230000003068 static effect Effects 0.000 description 5
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 229920000742 Cotton Polymers 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 238000000861 blow drying Methods 0.000 description 3
- 238000007664 blowing Methods 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 3
- 238000005498 polishing Methods 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 2
- 244000137852 Petrea volubilis Species 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- RKTYLMNFRDHKIL-UHFFFAOYSA-N copper;5,10,15,20-tetraphenylporphyrin-22,24-diide Chemical compound [Cu+2].C1=CC(C(=C2C=CC([N-]2)=C(C=2C=CC=CC=2)C=2C=CC(N=2)=C(C=2C=CC=CC=2)C2=CC=C3[N-]2)C=2C=CC=CC=2)=NC1=C3C1=CC=CC=C1 RKTYLMNFRDHKIL-UHFFFAOYSA-N 0.000 description 2
- KHYBPSFKEHXSLX-UHFFFAOYSA-N iminotitanium Chemical compound [Ti]=N KHYBPSFKEHXSLX-UHFFFAOYSA-N 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- 229960000583 acetic acid Drugs 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000012362 glacial acetic acid Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 229910000040 hydrogen fluoride Inorganic materials 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000003446 memory effect Effects 0.000 description 1
- 230000007334 memory performance Effects 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
- G01N1/32—Polishing; Etching
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03C—PHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES; PHOTOGRAPHIC PROCESSES, e.g. CINE, X-RAY, COLOUR, STEREO-PHOTOGRAPHIC PROCESSES; AUXILIARY PROCESSES IN PHOTOGRAPHY
- G03C5/00—Photographic processes or agents therefor; Regeneration of such processing agents
- G03C5/26—Processes using silver-salt-containing photosensitive materials or agents therefor
- G03C5/29—Development processes or agents therefor
- G03C5/30—Developers
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
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- Investigating And Analyzing Materials By Characteristic Methods (AREA)
Abstract
The invention discloses a metallographic developing solution for an ultrafine nickel-titanium memory alloy wire and a preparation method thereof, belonging to the technical field of preparation of the metallographic developing solution, wherein the metallographic developing solution consists of phosphoric acid, nitric acid, perchloric acid, a corrosion inhibitor and water; the corrosion inhibitor is solid, and the rest is liquid component; the volume percentage of each liquid component is as follows: phosphoric acid: 5-18%; nitric acid: 7-24%; perchloric acid: 7-25%; the balance of water; the corrosion inhibitor contains fluoride, and the addition amount of the corrosion inhibitor is 1 g-5 g per 100mL of liquid components. The nickel-titanium memory alloy metallographic developer can clearly display the internal appearance characteristics of the nickel-titanium alloy microstructure grains, and is particularly suitable for observing the nickel-titanium memory alloy filament material metallographic structure.
Description
Technical Field
The invention belongs to the technical field of preparation of metallographic developer, and particularly relates to metallographic developer for an ultrafine nickel-titanium memory alloy wire and a preparation method of the metallographic developer.
Background
The nickel-titanium shape memory alloy has excellent superelasticity, shape memory effect and damping performance, excellent fatigue performance, biocompatibility and development resistance, and good comprehensive mechanical property, so that the nickel-titanium shape memory alloy is widely applied to the industries of aerospace, ships, medical treatment, petrochemical industry and the like. The nickel titanium shape memory alloy thin wire has excellent memory performance and superelasticity performance, and is usually used in an aging state. These inclusion-containing microstructures have a large effect on the performance of the nitinol alloy due to the presence of small inclusion structures within the alloy matrix. Therefore, the metallographic analysis of the microstructure of the nickel-titanium memory alloy has important guiding significance for the application of memory alloy wire products.
The nickel-titanium memory alloy has strong development resistance, and the microstructure of the superfine wire is very fine and reaches dozens of microns, so the metallographic structure of the superfine wire is very difficult to display. Generally, a strain layer is formed on the surface of a sample in the grinding and polishing process of preparing a metallographic sample, and the observation effect after metallographic development is influenced. Therefore, higher requirements are put forward on the metallographic developing solution of the superfine nickel titanium memory alloy wire. The metallographic developing solution of the conventional nickel-titanium memory alloy comprises hydrofluoric acid, nitric acid and water, wherein the ratio of the hydrofluoric acid to the nitric acid is 1: 3-1: 1.5, the concentration of hydrofluoric acid reaches 10%. Patent 201010518846.6 discloses a nickel alloyThe titanium alloy developing solution comprises the following components in percentage by volume: h2SO4：HNO3：HF：H2O is 1-2: 1-1.5: 1-1.5: 0.5-1, wherein the concentration of the hydrofluoric acid can reach 25%. To enhance the development effect, these conventional developers contain highly toxic hydrofluoric acid, which causes difficult-to-cure burns, such as by vapor inhalation or contact with the skin. The liquid hydrogen fluoride has harsh storage conditions and is easy to cause danger in use and storage. The conventional nickel-titanium alloy metallographic developing solution can show a grain boundary, and when the internal structure of a microstructure grain is displayed, the characteristic of a fine structure is not clear.
Disclosure of Invention
In order to solve the problems, the invention provides a metallographic developing solution for an ultrafine nickel-titanium memory alloy wire, which consists of phosphoric acid, nitric acid, perchloric acid, a corrosion inhibitor and water; the corrosion inhibitor is solid, and the rest is liquid component;
the volume percentage of each liquid component is as follows: phosphoric acid: 5-18%; nitric acid: 7-24%; perchloric acid: 7-25%; the balance of water;
the corrosion inhibitor contains fluoride, and the addition amount of the corrosion inhibitor is 1 g-5 g per 100mL of liquid components.
The fluoride comprises a less acidic fluoride salt.
The mass percentage concentration of the phosphoric acid is 85 percent; the mass percentage concentration of the nitric acid is 65 percent; the mass percentage concentration of perchloric acid is 72%.
A preparation method of a metallographic developing solution for superfine nickel titanium memory alloy wires is carried out in an open glassware cooled by ice water, and comprises the following steps:
1) determining the proportion of each component of the developing solution;
2) pouring weighed water into an open glass vessel with ice water cooling according to the selected proportion;
3) slowly adding phosphoric acid, nitric acid and perchloric acid in sequence according to a proportion, uniformly stirring in the adding process, and cooling to the temperature of ice water;
4) and finally, slowly adding the corrosion inhibitor, uniformly stirring the mixed solution, and cooling to room temperature to obtain the metallographic developing solution.
The invention has the beneficial effects that:
aiming at the defects of the existing conventional nickel-titanium memory alloy metallographic developing solution, the invention provides a novel environmentally-friendly metallographic developing solution which is particularly suitable for observing the microstructure of an ultrafine nickel-titanium shape memory alloy wire material and can clearly display the internal appearance characteristics of nickel-titanium alloy microstructure grains; meanwhile, the harm of hydrofluoric acid to human bodies and the environment is greatly reduced.
Drawings
FIG. 1 is a 1000-fold metallographic structure photograph of a filament material prepared by using the developer in example 1;
FIG. 2 is a 1000-fold metallographic structure photograph of a filament material prepared by using the developer in example 2;
FIG. 3 is a 500-fold metallographic structure photograph of a filament material prepared by using the developer in example 3;
FIG. 4 is a 500-fold metallographic structure photograph of a filament material produced using the developer solution of comparative example 1;
fig. 5 is a 1000-fold metallographic structure photograph of a filament material prepared by using the developer of comparative example 1.
Detailed Description
The invention is described in further detail below with reference to the following figures and specific examples:
a preparation method of a metallographic developing solution for an ultrafine nickel-titanium memory alloy wire comprises the following specific steps:
1) determining the ratio of each component of the metallographic developer; the metallographic developing solution consists of phosphoric acid, nitric acid, perchloric acid, a corrosion inhibitor and water; the corrosion inhibitor is solid, and the rest is liquid component; the volume percentage of each liquid component is as follows: phosphoric acid with a mass percentage concentration of 85%: 5-18%; 65% by mass of nitric acid: 7-24%; 72% perchloric acid: 7-25%; the balance of water;
the corrosion inhibitor contains fluoride, including fluoride salts with weaker acidity; the adding amount of the corrosion inhibitor is 1g to 5g per 100mL of liquid component.
2) Pouring weighed water into an open glass vessel with ice water cooling according to the selected proportion.
3) Then slowly adding phosphoric acid and nitric acid one by one according to the proportion, and slowly adding perchloric acid after cooling.
4) Finally, slowly adding the corrosion inhibitor. Slowly adding the mixture during the adding process, and then slowly stirring the mixture uniformly; and (5) obtaining the finished product metallographical developing solution after the developing solution is static and the temperature is stabilized to the room temperature.
The specific process is as follows: and taking a small amount of metallographical developing solution, and putting the developing solution into a metallographical sample for developing. During the process of using nitric acid, phosphoric acid and perchloric acid, protective articles such as protective gloves are required, and the using method and safety matters of each acid solution are known in advance. The corrosion inhibitor is solid, contains fluoride, comprises salt with weaker acidity than hydrofluoric acid, can promote development, and greatly reduces the volatilization of acid liquor. When the corrosion inhibitor is added, the solution is ensured to be in a low temperature state.
Example 1
1) Determining the mixture ratio of each component: firstly, selecting the component proportion of the developing solution according to the diameter (0.16mm) of the wire and the heat treatment state of the wire, and determining the volume percentage of each liquid component as H3PO4：HNO3：HClO4：H2O＝5：24：7：64。
2) Pouring 64mL of water into an open glass vessel with ice water cooling;
3) then slowly adding 5mL of phosphoric acid (with the mass percent concentration of 85%), stirring the solution, then adding 24mL of nitric acid (with the mass percent concentration of 65%), uniformly stirring, slowly adding 7mL of constant boiling perchloric acid (with the mass percent concentration of 72%) when the mixed solution is static and the temperature is reduced to the temperature of ice water, gently stirring and uniformly mixing, and standing to the temperature of the ice water;
4) and finally, adding 2g of corrosion inhibitor, slowly stirring, uniformly dissolving, and cooling to room temperature to obtain the metallographic developer.
And (3) immersing the polished nickel-titanium memory alloy metallographic sample into the prepared developing solution, immersing the observation surface of the metallographic sample until the horizontal plane of the developing solution is vertical, and slightly shaking the sample during erosion or slightly wiping the metallographic surface by using cotton until a clear image is displayed. And repeatedly washing the corroded sample with water, cleaning the metallographic sample with alcohol, and blow-drying the metallographic observation surface by electric air blowing. Then, the metallographic specimen was observed under a metallographic microscope and photographed.
The preparation method of the metallographic structure photo comprises the following specific steps:
1) cutting the nickel-titanium memory alloy thin wire into small sections of 5-10 mm, and taking 2-10 pieces;
2) 2-10 filaments are arranged in parallel and adhered to a tetragonal titanium (alloy) block or a tetragonal nickel-titanium alloy block by using a quick adhesive;
3) the sample is embedded, a titanium (alloy) block or a nickel-titanium alloy block adhered with the thin wire material is embedded with the sample by using a sample embedding machine, and a polished surface of the sample are selected according to the requirement of observing the cross section or the longitudinal section of the nickel-titanium memory alloy wire material;
4) and (4) flattening and polishing the metallographic specimen on sand paper. The sand paper selected for use is: 180# -400 # -600 # -800 # -1200 # -2400 # water sandpaper;
5) electrolytic polishing: using a mixed solution of glacial acetic acid and perchloric acid as an electrolytic polishing solution, wherein the voltage is 18-60V, and the time is 5-60 s;
6) and (3) developing: using the developing solution, the erosion time is not higher than 75 s;
7) and taking pictures by a metallographic microscope.
As shown in FIG. 1, it is a photograph of the annealed microstructure of the thin Nitinol wire manufactured by using the developing solution prepared in the present example. The figure clearly shows the structural features within the grains of the microstructure. Meanwhile, the figure shows the boundaries of the grains, and the grain boundaries and the grain sizes can be distinguished according to the characteristics of the internal microstructure.
Example 2
1) Determining the mixture ratio of each component: firstly, the component proportion of the developing solution is selected according to the diameter (0.16mm) of the wire and the heat treatment system, and the volume percentage of each liquid component is selected to be H3PO4：HNO3：HClO4：H2O＝18：7：10：65。
2) Pouring 65mL of water into an open glass vessel with ice water cooling;
3) then slowly adding 18mL of phosphoric acid (with the mass percent concentration of 85%), stirring the solution, then adding 7mL of nitric acid (with the mass percent concentration of 65%), uniformly stirring, slowly adding 10mL of constant boiling perchloric acid (with the mass percent concentration of 72%) when the mixed solution is static and the temperature is reduced to the temperature of ice water, gently stirring and uniformly mixing, and standing to the temperature of the ice water;
4) and finally, adding 5g of corrosion inhibitor, slowly stirring, uniformly dissolving, and cooling to room temperature to obtain the finished metallographic developer.
And (3) immersing the polished nickel-titanium memory alloy metallographic sample into the prepared developing solution, wherein the observation surface immersed into the metallographic sample is vertical to the horizontal plane of the developing solution horizontal plane, and the sample can be slightly shaken during erosion or the metallographic surface can be observed by lightly wiping cotton until a clear image is displayed. And repeatedly washing the corroded sample with water, cleaning the metallographic sample with alcohol, and blow-drying the metallographic observation surface by electric air blowing. Then, the metallographic specimen was observed under a metallographic microscope and photographed.
The detailed procedure for preparing the metallographic structure photograph was the same as in example 1.
As shown in FIG. 2, it is a photograph of the annealed microstructure of the thin Nitinol wire manufactured by using the developing solution prepared in the present example. The figure clearly shows the structural features within the grains of the microstructure. Meanwhile, the figure shows the boundaries of the grains, and the grain boundaries and the grain sizes can be distinguished according to the characteristics of the internal microstructure.
Example 3
1) Determining the mixture ratio of each component: firstly, the component proportion of the developing solution is selected according to the diameter (0.5mm) of the wire and the heat treatment system, and H is selected according to the volume percentage of each component3PO4：HNO3：HClO4：H2O＝10：8：25：57。
2) Pouring 57mL of water into an open glass vessel with ice water cooling;
3) then slowly adding 10mL of phosphoric acid (with mass percent concentration of 85%), stirring the solution, adding 8mL of nitric acid (with mass percent concentration of 65%), stirring uniformly, slowly adding 25mL of azeotropic perchloric acid (with mass percent concentration of 72%) when the mixed solution is static and the temperature is reduced to the temperature of ice water, stirring uniformly gently, and standing until the temperature of the ice water is static
4) Adding 3g of corrosion inhibitor, slowly stirring, uniformly dissolving, and cooling to room temperature to obtain the finished metallographic developer.
And (3) immersing the polished nickel-titanium memory alloy metallographic sample into the prepared developing solution, wherein the observation surface of the immersed metallographic sample is vertical to the horizontal plane, and the sample can be slightly shaken during erosion or the metallographic surface is observed by lightly wiping cotton, wherein the erosion time is 36 seconds. And after the sample is corroded, repeatedly washing the sample by using water, cleaning the metallographic sample by using alcohol, and blow-drying the metallographic observation surface by using electric air blowing. Then, the metallographic specimen was observed under a metallographic microscope and photographed.
The detailed procedure for preparing the metallographic structure photograph was the same as in example 1.
As shown in FIG. 3, it is a photograph of the annealed microstructure of the thin Nitinol wire manufactured by using the developing solution prepared in the present example. The figure shows the structural features inside the grains of the microstructure. Meanwhile, the figure shows the boundaries of the grains, and the grain boundaries and the grain sizes can be distinguished according to the characteristics of the internal microstructure.
Comparative example 1
The metallographic structure photograph of the wire prepared by using the conventional nickel-titanium memory alloy metallographic developing solution comprises the following components in percentage by volume: HNO3：H2O is 1: 2: 10. as shown in FIGS. 4 and 5, the metallographic structure photographs of the Ni-Ti memory alloy wire (0.5mm in diameter) containing 50.8% Ni (atomic percent) are 1000 times and 500 times the cross section of the annealed Ni-Ti memory alloy wire, and grain boundaries can be seen from the photographs, but the internal structure of the grains is not substantially distinguished.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (4)
1. A metallography developing solution for superfine nickel titanium memory alloy wire is characterized in that the metallography developing solution consists of phosphoric acid, nitric acid, perchloric acid, corrosion inhibitor and water; the corrosion inhibitor is solid, and the rest is liquid component;
the volume percentage of each liquid component is as follows: phosphoric acid: 5-18%; nitric acid: 7-24%; perchloric acid: 7-25%; the balance of water;
the corrosion inhibitor contains fluoride, and the addition amount of the corrosion inhibitor is 1 g-5 g per 100mL of liquid components.
2. The metallographic developer for ultra fine nitinol wires according to claim 1, characterized in that the fluoride comprises a less acidic fluoride salt.
3. The metallographic developer for ultrafine nickel titanium memory alloy wires according to claim 1, wherein the phosphoric acid is present in a concentration of 85% by mass; the mass percentage concentration of the nitric acid is 65 percent; the mass percentage concentration of perchloric acid is 72%.
4. The method for preparing the metallographic developer for the superfine nickel titanium memory alloy wire material according to claim 1, wherein the preparation process of the metallographic developer is carried out in an open glassware cooled by ice water, and the method comprises the following steps:
1) determining the proportion of each component of the developing solution;
2) pouring weighed water into an open glass vessel with ice water cooling according to the selected proportion;
3) slowly adding phosphoric acid, nitric acid and perchloric acid in sequence according to a proportion, uniformly stirring in the adding process, and cooling to the temperature of ice water;
4) and finally, slowly adding the corrosion inhibitor, uniformly stirring the mixed solution, and cooling to room temperature to obtain the metallographic developing solution.
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1677248A (en) * | 2004-03-31 | 2005-10-05 | 东友Fine-Chem株式会社 | Photoresist stripping agent composition |
| CN101736343A (en) * | 2008-11-27 | 2010-06-16 | 北京有色金属研究总院 | Metallurgical phase corrosive agent |
| KR20100126981A (en) * | 2009-05-25 | 2010-12-03 | 한국기계연구원 | Etchant composition of nickle-based superalloy and method of etching the alloy |
| CN106757030A (en) * | 2016-12-29 | 2017-05-31 | 北京有色金属研究总院 | A kind of metallographic etching agent of titanium alloy |
| CN110359048A (en) * | 2018-04-11 | 2019-10-22 | 天津大学 | A kind of titanium-carbon steel composite board etchant and application method |
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1677248A (en) * | 2004-03-31 | 2005-10-05 | 东友Fine-Chem株式会社 | Photoresist stripping agent composition |
| CN101736343A (en) * | 2008-11-27 | 2010-06-16 | 北京有色金属研究总院 | Metallurgical phase corrosive agent |
| KR20100126981A (en) * | 2009-05-25 | 2010-12-03 | 한국기계연구원 | Etchant composition of nickle-based superalloy and method of etching the alloy |
| CN106757030A (en) * | 2016-12-29 | 2017-05-31 | 北京有色金属研究总院 | A kind of metallographic etching agent of titanium alloy |
| CN110359048A (en) * | 2018-04-11 | 2019-10-22 | 天津大学 | A kind of titanium-carbon steel composite board etchant and application method |
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