CN113737170A - Copper alloy pantograph and preparation method thereof - Google Patents
Copper alloy pantograph and preparation method thereof Download PDFInfo
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- CN113737170A CN113737170A CN202111050789.8A CN202111050789A CN113737170A CN 113737170 A CN113737170 A CN 113737170A CN 202111050789 A CN202111050789 A CN 202111050789A CN 113737170 A CN113737170 A CN 113737170A
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- 229910000881 Cu alloy Inorganic materials 0.000 title claims abstract description 133
- 238000002360 preparation method Methods 0.000 title claims abstract description 25
- 239000000758 substrate Substances 0.000 claims abstract description 71
- 238000000151 deposition Methods 0.000 claims abstract description 65
- 230000008021 deposition Effects 0.000 claims abstract description 54
- 239000002994 raw material Substances 0.000 claims abstract description 54
- 239000007787 solid Substances 0.000 claims abstract description 32
- 238000000034 method Methods 0.000 claims abstract description 19
- 238000004519 manufacturing process Methods 0.000 claims abstract description 15
- 238000012545 processing Methods 0.000 claims abstract description 15
- 239000007789 gas Substances 0.000 claims description 77
- 239000000843 powder Substances 0.000 claims description 65
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 30
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 27
- 229910052782 aluminium Inorganic materials 0.000 claims description 27
- 238000000227 grinding Methods 0.000 claims description 26
- 239000002245 particle Substances 0.000 claims description 26
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 19
- 229910052802 copper Inorganic materials 0.000 claims description 18
- 239000010949 copper Substances 0.000 claims description 18
- 238000010438 heat treatment Methods 0.000 claims description 15
- 238000005498 polishing Methods 0.000 claims description 13
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 10
- 229910000684 Cobalt-chrome Inorganic materials 0.000 claims description 10
- WAIPAZQMEIHHTJ-UHFFFAOYSA-N [Cr].[Co] Chemical compound [Cr].[Co] WAIPAZQMEIHHTJ-UHFFFAOYSA-N 0.000 claims description 10
- 239000010952 cobalt-chrome Substances 0.000 claims description 10
- 239000003570 air Substances 0.000 claims description 6
- 238000005137 deposition process Methods 0.000 claims description 6
- 239000001307 helium Substances 0.000 claims description 5
- 229910052734 helium Inorganic materials 0.000 claims description 5
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 claims description 5
- 229910052757 nitrogen Inorganic materials 0.000 claims description 5
- QZLJNVMRJXHARQ-UHFFFAOYSA-N [Zr].[Cr].[Cu] Chemical compound [Zr].[Cr].[Cu] QZLJNVMRJXHARQ-UHFFFAOYSA-N 0.000 claims description 4
- 239000000463 material Substances 0.000 abstract description 10
- 230000008569 process Effects 0.000 abstract description 9
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- 239000011159 matrix material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 241001391944 Commicarpus scandens Species 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C24/00—Coating starting from inorganic powder
- C23C24/02—Coating starting from inorganic powder by application of pressure only
- C23C24/04—Impact or kinetic deposition of particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60L—PROPULSION OF ELECTRICALLY-PROPELLED VEHICLES; SUPPLYING ELECTRIC POWER FOR AUXILIARY EQUIPMENT OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRODYNAMIC BRAKE SYSTEMS FOR VEHICLES IN GENERAL; MAGNETIC SUSPENSION OR LEVITATION FOR VEHICLES; MONITORING OPERATING VARIABLES OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRIC SAFETY DEVICES FOR ELECTRICALLY-PROPELLED VEHICLES
- B60L5/00—Current collectors for power supply lines of electrically-propelled vehicles
- B60L5/18—Current collectors for power supply lines of electrically-propelled vehicles using bow-type collectors in contact with trolley wire
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C24/00—Coating starting from inorganic powder
- C23C24/02—Coating starting from inorganic powder by application of pressure only
- C23C24/04—Impact or kinetic deposition of particles
- C23C24/045—Impact or kinetic deposition of particles by trembling using impacting inert media
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- Mechanical Engineering (AREA)
- Organic Chemistry (AREA)
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- Chemical Kinetics & Catalysis (AREA)
- Power Engineering (AREA)
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Abstract
The invention discloses a copper alloy pantograph and a preparation method thereof, and belongs to the technical field of pantographs. The method comprises the following steps: depositing a copper alloy raw material on the surface of a substrate by adopting a gas dynamic solid deposition mode to form a copper alloy component, then separating the copper alloy component from the substrate, and processing the separated copper alloy component into a preset pantograph shape. The adoption of the gas dynamic solid deposition mode can avoid the oxidation in the manufacturing process of the material and the change of the material structure at high temperature, the preparation and the forming can be directly carried out on the substrate in the preparation process, and the subsequent processing is carried out to obtain the pantograph workpiece with the performance superior to that of the cast material, thereby prolonging the service life and the conductive and wear-resistant performances of the pantograph. In addition, the method can also control the deposition track, reduce the complexity of the process and increase the production efficiency of the workpiece.
Description
Technical Field
The invention relates to the technical field of pantographs, in particular to a copper alloy pantograph and a preparation method thereof.
Background
The pantograph is a very important part in the subway and the electric locomotive at present, and the abrasion of parts and the loss of electric power can occur in the process of high-speed running of the locomotive, so the conductivity and the wear resistance of the pantograph are very important for the running of the subway and the electric locomotive, the current pantograph usually adopts copper as a base body, the problem of the conductivity and the wear resistance of the pantograph is solved in a mode of adhering a graphite component to the surface of the copper, but the pantograph needs to be frequently replaced due to long-distance running in the process of continuous running of the subway at a speed of more than 200 km.
In view of this, the invention is particularly proposed.
Disclosure of Invention
One of the objectives of the present invention is to provide a method for manufacturing a copper alloy pantograph, which can manufacture a copper alloy pantograph with better conductivity and wear resistance, thereby prolonging the service life of the pantograph and greatly reducing the replacement frequency.
The second purpose of the present invention is to provide a copper alloy pantograph manufactured by the above manufacturing method.
The application can be realized as follows:
in a first aspect, the present application provides a method for manufacturing a copper alloy pantograph, comprising the following steps: depositing a copper alloy raw material on the surface of a substrate by adopting a gas dynamic solid deposition mode to form a copper alloy component, then separating the copper alloy component from the substrate, and processing the separated copper alloy component into a preset pantograph shape.
In an alternative embodiment, the gas-powered solid state deposition process is powered by a compressed gas.
In alternative embodiments, the gas in the compressed gas comprises air, nitrogen or helium.
In an alternative embodiment, the compressed gas has a gas pressure of 3 to 7 MPa.
In an alternative embodiment, the temperature of the compressed gas is 400-800 ℃.
In an alternative embodiment, the nozzle is located at a distance of 20-50mm from the substrate during the gas dynamic solid state deposition process.
In an alternative embodiment, the copper donation in the copper alloy feedstock comprises copper clad cobalt chromium powder or chromium zirconium copper powder.
In an alternative embodiment, the copper donor powder has a particle size of 10-100 μm.
In an alternative embodiment, 5-15 wt% of tungsten powder is added to the copper alloy raw material.
In an alternative embodiment, the tungsten powder has a powder particle size of 20 to 80 μm.
In an alternative embodiment, the substrate is an aluminum sheet.
In an alternative embodiment, the substrate has a thickness of 5-10 mm.
In an alternative embodiment, the copper alloy feedstock is preheated prior to deposition.
In an alternative embodiment, the preheating temperature is 50-150 ℃.
In an alternative embodiment, the step of heat treating the substrate with the copper alloy component deposited thereon is further included before the step of separating the copper alloy component from the substrate.
In an alternative embodiment, the heat treatment is carried out at 300-500 ℃ for 2-4 h.
In an alternative embodiment, the method further comprises grinding and polishing the copper alloy component processed into the preset pantograph shape.
In an alternative embodiment, 500-.
In a second aspect, the present application provides a copper alloy pantograph manufactured by the manufacturing method of any one of the preceding embodiments.
The beneficial effects of the invention include:
the copper alloy pantograph is prepared by adopting a gas dynamic solid deposition mode, so that oxidation and material structure change at high temperature in the material manufacturing process can be avoided. The preparation process can be directly used for preparing and forming the base plate, and then the pantograph workpiece with the performance superior to that of an as-cast material is obtained through subsequent processing, so that the service life and the electric conduction and wear resistance of the pantograph are favorably improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
FIG. 1 is a schematic diagram of a gas dynamic solid state deposition in the present application;
FIG. 2 is a flow chart of the late preparation stage in the present application;
fig. 3 is a diagram of a copper alloy pantograph prepared according to the present application.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below. The examples, in which specific conditions are not specified, were conducted under conventional conditions or conditions recommended by the manufacturer. The reagents or instruments used are not indicated by the manufacturer, and are all conventional products available commercially.
The following provides a detailed description of the copper alloy pantograph and the preparation method thereof.
The application provides a preparation method of a copper alloy pantograph, which comprises the following steps: depositing a copper alloy raw material on the surface of a substrate by adopting a gas dynamic solid deposition mode (the principle is shown in figure 1) to form a copper alloy component, then separating the copper alloy component from the substrate, and processing the separated copper alloy component into a preset pantograph shape.
The mode can ensure that the raw materials are deposited in a pure solid state form, and can effectively avoid oxidation in the manufacturing process of the materials and the change of the material structure at high temperature. It should be noted that chemical vapor deposition is generally used to prepare pantographs in the prior art, and such deposition has the following disadvantages compared with the gas dynamic solid deposition in the present application:
(1) the gas pressure of the existing gas dynamic deposition equipment with the parameter reaching more than 3MPa is difficult;
(2) the proportion of tungsten powder in the copper alloy component prepared by the gas dynamic deposition technology is difficult to regulate and control, related researches are few, and the particle size and the shape of the powder need to be researched by a large number of experiments, so that the high conductivity and the wear resistance of the component are realized.
The gas dynamic solid deposition mode can effectively overcome the problems. In the application, compressed gas is used as power in the gas-powered solid deposition process. The gas in the compressed gas may be referred to as air, nitrogen or helium.
The pressure of the compressed gas during deposition is 3-7MPa, such as 3MPa, 3.5MPa, 4MPa, 4.5MPa, 5MPa, 5.5MPa, 6MPa, 6.5MPa or 7MPa, and may be any other value within the range of 3-7 MPa.
Under the gas pressure range, the copper alloy raw material can obtain higher deposition speed and better deposition effect, and a copper alloy component with high density and high hardness is obtained. It is worth explaining that when the gas pressure is lower than 3MPa, the internal combination of the component is easy to cause poor, the workpiece is easy to break in the processing process, and the gas pressure is higher than 7MPa, the cost of gas dynamic deposition is higher, the damage to the equipment is serious, and the long-term stable use of the equipment cannot be realized.
The temperature of the compressed gas is 400-800 deg.C, such as 400 deg.C, 450 deg.C, 500 deg.C, 550 deg.C, 600 deg.C, 650 deg.C, 700 deg.C, 750 deg.C or 800 deg.C, etc., or may be any other value within the range of 400-800 deg.C.
Under the gas temperature range, on one hand, the copper alloy raw material can be prevented from being melted, and on the other hand, the deposition speed can be accelerated. It is worth mentioning that when the temperature of the compressed gas is lower than 400 ℃, the temperature is lower when the powder is easily sprayed out from the muzzle, the mixed powder inside the component cannot be fully combined, and when the temperature is higher than 800 ℃, the copper alloy powder is easily adhered inside the muzzle at a higher temperature, so that the performance of the component is reduced in the subsequent production process, and the muzzle needs to be frequently replaced, so that the production efficiency is reduced.
In the above-mentioned gas dynamic solid deposition process, the distance between the nozzle and the substrate is 20-50mm, such as 20mm, 25mm, 30mm, 35mm, 40mm, 45mm or 50mm, and may be any other value within the range of 20-50 mm. The deposition is carried out at the distance, so that the copper alloy raw material can be effectively deposited on the surface of the substrate and a good deposition effect can be obtained. If the distance between the nozzle and the substrate is less than 20mm, the speed and the temperature are high when the powder is sprayed out from the muzzle, and the powder rebounded from the matrix can damage the muzzle; longer than 50mm easily causes heat and power of the powder reaching the substrate to be lost in a long deposition path, so that the speed and temperature of the powder particles reaching the surface of the substrate are reduced, thereby causing the bonding strength of the member to be reduced.
On the other hand, the copper alloy component has higher hardness and wear resistance.
Specifically, during deposition, a gas-powered solid-state deposition device is adopted, and deposition is performed according to a set robot arm shape circuit program. The pantograph is prepared by adopting a gas power solid deposition mode, and a basic part shape can be processed by reasonably controlling a deposition track in the preparation process, so that the process complexity is reduced, the work piece production efficiency is increased, and the work piece performance is improved. In addition, the pantograph can be directly prepared and molded on the surface of the substrate in the preparation process of the pantograph, and a pantograph workpiece with the performance superior to that of an as-cast material is obtained through subsequent processing, so that the service life and the conductivity and wear resistance of the pantograph are improved.
In an alternative embodiment, the copper alloy feedstock used herein may include, for example, a copper clad cobalt chromium powder or a chromium zirconium copper powder, which may be advantageous for providing the component with better electrical conductivity.
In the application, tungsten powder is added in the copper alloy raw material, and the wear resistance of the copper alloy component can be further improved while higher conductivity is ensured by adding the tungsten powder.
The content of the tungsten powder in the copper alloy raw material is, as a reference, 5 to 15 wt% (e.g., 5 wt%, 8 wt%, 10 wt%, 12 wt%, 15 wt%, etc.). Preferably, the particle size of the copper powder is 10 to 100 μm (preferably 10 to 80 μm), and the particle size of the tungsten powder is 20 to 80 μm. The above powder particle size can be achieved by sieving, and the mixing of the copper supply and the tungsten powder can be achieved by a stirrer.
The powder having the above particle size range and content is used as the copper alloy raw material, and is advantageous in that the member has good internal bonding ability.
As the powder without adding the copper alloy can only reach the conductivity meeting the requirement, through a large amount of experimental researches, the tungsten powder is added, the higher conductivity of the component can be ensured, meanwhile, the wear resistance of the component is increased, and the optimal component meeting the workpiece is obtained under the balance of the conductivity and the wear resistance of the component in consideration of the influence of the content of the tungsten powder on the component.
In an alternative embodiment, the substrate may be an aluminum plate, and in addition, other substrate materials commonly used for copper members may also be used, and preferably, an aluminum plate is used. The invention adopts the aluminum plate as the deposition matrix, can improve the deposition efficiency of the gas dynamic solid deposition, and the deposited copper alloy member has higher conductivity and wear resistance, and the aluminum plate has low cost and is easy to remove.
The thickness of the substrate may be, for example, 5 to 10mm, such as 5mm, 6mm, 7mm, 8mm, 9mm or 10mm, and may be any other value within the range of 5 to 10 mm. It is worth noting that if the thickness of the substrate is too thin, and if it is thinner than 5mm, it is easy to deform during deposition, affecting the performance of the component.
In some preferred embodiments, the copper alloy feedstock may also be preheated (possibly in a drying oven) prior to deposition. The preheating temperature can be 50-150 deg.C, such as 50 deg.C, 80 deg.C, 100 deg.C, 120 deg.C or 150 deg.C, or other arbitrary values within the range of 50-150 deg.C.
By preheating at the above temperature, the copper alloy raw material can be reasonably softened, and subsequent deposition is facilitated.
In addition, before deposition, the surface of the substrate can be polished to increase the roughness of the surface of the substrate, so that the deposition of the copper alloy raw material is facilitated. The grinding can be performed by a grinder.
Further, after the copper alloy member is obtained, the substrate on which the copper alloy member is deposited is subjected to heat treatment, and then the copper alloy member is separated from the substrate.
In alternative embodiments, the heat treatment can be performed at 300-. Preferably, the heat treatment is carried out at 400 ℃ for 2 h. The heat treatment process described above may be carried out in a muffle furnace.
By the heat treatment, the bonding strength and performance of the member can be further improved.
The separation can be performed using a wire cutting instrument (see fig. 2). In fig. 2, the uppermost diagram represents a one-time batch process, and the lower diagram represents a process of substrate cutting, fillet machining, and shape cutting using one of the members as an example.
Further, the separated copper alloy component is processed into a preset pantograph shape, and then grinding and polishing are carried out.
The machining may include round corner machining and shape cutting.
The sanding and polishing can be performed by using 500-2000-mesh sandpaper. The smoothness and smoothness of the product meet the use requirements through grinding and polishing.
Correspondingly, the application also provides a copper alloy pantograph (shown in figure 3) prepared by the preparation method, and the pantograph has excellent conductive wear-resisting property and long service life and is beneficial to long-term stable operation of subways and electric power locomotives.
The features and properties of the present invention are described in further detail below with reference to examples.
Example 1
The embodiment provides a conductive wear-resistant copper alloy pantograph which comprises the following preparation method:
and S1, grinding the surface of the aluminum substrate with the thickness of 5mm by using a grinding machine to ensure that the surface roughness of the substrate is Ra 3-Ra 5.
S2, sieving the copper-coated cobalt-chromium powder by a sieve to obtain powder with the particle size of 10-50 mu m; the tungsten powder is subjected to powder sieving treatment to obtain powder with the particle size of 40-60 mu m. The two powders were thoroughly mixed by a stirrer to obtain a copper alloy raw material. The mass fraction of the tungsten powder in the whole copper alloy raw material is 5%.
And S3, preheating the mixed copper alloy raw material in a drying box at the preheating temperature of 100 ℃ for 1h, and then sending the preheated copper alloy raw material into a powder feeder.
And S4, depositing the copper alloy raw material on the surface of the aluminum substrate by adopting a gas dynamic solid deposition mode to form the copper alloy member.
The parameters of the gas dynamic solid deposition are as follows: compressed nitrogen is used as propulsion power gas, the gas pressure is 3MPa, the gas temperature is 600 ℃, and the distance between a nozzle and a substrate is 35 mm.
S5, the deposited copper alloy component is subjected to heat treatment in a muffle furnace (400 ℃, 2h), and then the heat-treated copper alloy is separated from the aluminum substrate by a wire cutting instrument, and is subjected to fillet processing and shape cutting into a preset part shape, and then is subjected to grinding and polishing by 1000-mesh abrasive paper.
Example 2
The embodiment provides a conductive wear-resistant copper alloy pantograph which comprises the following preparation method:
and S1, grinding the surface of the aluminum substrate with the thickness of 5mm by using a grinding machine to ensure that the surface roughness of the substrate is Ra 3-Ra 5.
S2, sieving the copper-coated cobalt-chromium powder by a sieve to obtain powder with the particle size of 10-50 mu m; the tungsten powder is subjected to powder sieving treatment to obtain powder with the particle size of 40-60 mu m. The two powders were thoroughly mixed by a stirrer to obtain a copper alloy raw material. The mass fraction of the tungsten powder in the whole copper alloy raw material is 5%.
And S3, preheating the mixed copper alloy raw material in a drying box at the preheating temperature of 100 ℃ for 1h, and then sending the preheated copper alloy raw material into a powder feeder.
And S4, depositing the copper alloy raw material on the surface of the aluminum substrate by adopting a gas dynamic solid deposition mode to form the copper alloy member.
The parameters of the gas dynamic solid deposition are as follows: compressed nitrogen is used as propulsion power gas, the gas pressure is 5MPa, the gas temperature is 800 ℃, and the distance between a nozzle and a substrate is 35 mm.
S5, the deposited copper alloy component is subjected to heat treatment in a muffle furnace (400 ℃, 2h), and then the heat-treated copper alloy is separated from the aluminum substrate by a wire cutting instrument, and is subjected to fillet processing and shape cutting into a preset part shape, and then is subjected to grinding and polishing by 1000-mesh abrasive paper.
Example 3
The embodiment provides a conductive wear-resistant copper alloy pantograph which comprises the following preparation method:
and S1, grinding the surface of the aluminum substrate with the thickness of 5mm by using a grinding machine to ensure that the surface roughness of the substrate is Ra 3-Ra 5.
S2, sieving the copper-coated cobalt-chromium powder by a sieve to obtain powder with the particle size of 10-50 mu m; the tungsten powder is subjected to powder sieving treatment to obtain powder with the particle size of 40-60 mu m. The two powders were thoroughly mixed by a stirrer to obtain a copper alloy raw material. The mass fraction of the tungsten powder in the whole copper alloy raw material is 5%.
And S3, preheating the mixed copper alloy raw material in a drying box at the preheating temperature of 100 ℃ for 1h, and then sending the preheated copper alloy raw material into a powder feeder.
And S4, depositing the copper alloy raw material on the surface of the aluminum substrate by adopting a gas dynamic solid deposition mode to form the copper alloy member.
The parameters of the gas dynamic solid deposition are as follows: compressed helium is used as propulsion power gas, the gas pressure is 3MPa, the gas temperature is 600 ℃, and the distance between a nozzle and a substrate is 35 mm.
S5, the deposited copper alloy component is subjected to heat treatment in a muffle furnace (400 ℃, 2h), and then the heat-treated copper alloy is separated from the aluminum substrate by a wire cutting instrument, and is subjected to fillet processing and shape cutting into a preset part shape, and then is subjected to grinding and polishing by 1000-mesh abrasive paper.
Example 4
The embodiment provides a conductive wear-resistant copper alloy pantograph which comprises the following preparation method:
and S1, grinding the surface of the aluminum substrate with the thickness of 5mm by using a grinding machine to ensure that the surface roughness of the substrate is Ra 3-Ra 5.
S2, sieving the copper-coated cobalt-chromium powder by a sieve to obtain powder with the particle size of 10-50 mu m; the tungsten powder is subjected to powder sieving treatment to obtain powder with the particle size of 40-60 mu m. The two powders were thoroughly mixed by a stirrer to obtain a copper alloy raw material. The mass fraction of the tungsten powder in the whole copper alloy raw material is 5%.
And S3, preheating the mixed copper alloy raw material in a drying box at the preheating temperature of 100 ℃ for 1h, and then sending the preheated copper alloy raw material into a powder feeder.
And S4, depositing the copper alloy raw material on the surface of the aluminum substrate by adopting a gas dynamic solid deposition mode to form the copper alloy member.
The parameters of the gas dynamic solid deposition are as follows: compressed helium is used as propulsion power gas, the gas pressure is 3MPa, the gas temperature is 800 ℃, and the distance between a nozzle and a substrate is 35 mm.
S5, the deposited copper alloy component is subjected to heat treatment in a muffle furnace (400 ℃, 2h), and then the heat-treated copper alloy is separated from the aluminum substrate by a wire cutting instrument, and is subjected to fillet processing and shape cutting into a preset part shape, and then is subjected to grinding and polishing by 1000-mesh abrasive paper.
Example 5
The embodiment provides a conductive wear-resistant copper alloy pantograph which comprises the following preparation method:
s1, grinding the surface of the aluminum substrate with the thickness of 10mm by using a grinding machine to ensure that the surface roughness of the substrate is Ra 3-Ra 5.
S2, sieving the chromium-zirconium-copper powder by using a sieve to obtain powder with the particle size of 10-80 mu m; the tungsten powder is subjected to powder sieving treatment to obtain powder with the particle size of 20-80 mu m. The two powders were thoroughly mixed by a stirrer to obtain a copper alloy raw material. The mass fraction of the tungsten powder in the whole copper alloy raw material is 10%.
And S3, preheating the mixed copper alloy raw material in a drying box at the preheating temperature of 100 ℃ for 1h, and then sending the preheated copper alloy raw material into a powder feeder.
And S4, depositing the copper alloy raw material on the surface of the aluminum substrate by adopting a gas dynamic solid deposition mode to form the copper alloy member.
The parameters of the gas dynamic solid deposition are as follows: high-pressure air is used as propulsion power gas, the gas pressure is 5MPa, the gas temperature is 600 ℃, and the distance between a nozzle and a substrate is 35 mm.
S5, the deposited copper alloy component is subjected to heat treatment in a muffle furnace (400 ℃, 2h), and then the heat-treated copper alloy is separated from the aluminum substrate by a wire cutting instrument, and is subjected to fillet processing and shape cutting into a preset part shape, and then is subjected to grinding and polishing by 1000-mesh abrasive paper.
Example 6
The embodiment provides a conductive wear-resistant copper alloy pantograph which comprises the following preparation method:
and S1, grinding the surface of the aluminum substrate with the thickness of 8mm by using a grinding machine to ensure that the surface roughness of the substrate is Ra 3-Ra 5.
S2, sieving the copper-coated cobalt-chromium powder by using a sieve to obtain powder with the particle size of 10-100 mu m; the tungsten powder is subjected to powder sieving treatment to obtain powder with the particle size of 20-40 mu m. The two powders were thoroughly mixed by a stirrer to obtain a copper alloy raw material. The mass fraction of the tungsten powder in the whole copper alloy raw material is 12%.
And S3, preheating the mixed copper alloy raw material in a drying box at the preheating temperature of 50 ℃ for 2h, and then feeding the preheated copper alloy raw material into a powder feeder.
And S4, depositing the copper alloy raw material on the surface of the aluminum substrate by adopting a gas dynamic solid deposition mode to form the copper alloy member.
The parameters of the gas dynamic solid deposition are as follows: high-pressure air is used as propulsion power gas, the gas pressure is 4MPa, the gas temperature is 400 ℃, and the distance between a nozzle and a substrate is 20 mm.
S5, heat-treating the deposited copper alloy member in a muffle furnace (380 ℃, 2.5h), then separating the heat-treated copper alloy from the aluminum substrate by using a wire cutting instrument, and performing round-corner processing and shape cutting to a predetermined part shape, and then performing grinding and polishing by using 500-mesh abrasive paper.
Example 7
The embodiment provides a conductive wear-resistant copper alloy pantograph which comprises the following preparation method:
and S1, grinding the surface of the aluminum substrate with the thickness of 6mm by using a grinding machine to ensure that the surface roughness of the substrate is Ra 3-Ra 5.
S2, sieving the copper-coated cobalt-chromium powder by a sieve to obtain powder with the particle size of 50-80 mu m; the tungsten powder is subjected to powder sieving treatment to obtain powder with the particle size of 60-80 mu m. The two powders were thoroughly mixed by a stirrer to obtain a copper alloy raw material. The mass fraction of the tungsten powder in the whole copper alloy raw material is 15%.
And S3, preheating the mixed copper alloy raw material in a drying box at the preheating temperature of 150 ℃ for 0.5h, and then feeding the preheated copper alloy raw material into a powder feeder.
And S4, depositing the copper alloy raw material on the surface of the aluminum substrate by adopting a gas dynamic solid deposition mode to form the copper alloy member.
The parameters of the gas dynamic solid deposition are as follows: high-pressure air is used as propulsion power gas, the gas pressure is 7MPa, the gas temperature is 500 ℃, and the distance between a nozzle and a substrate is 50 mm.
S5, heat-treating the deposited copper alloy member in a muffle furnace (420 ℃, 2h), then separating the heat-treated copper alloy from the aluminum substrate by using a wire cutting apparatus, and performing round-corner processing and shape cutting to a predetermined part shape, and then performing grinding and polishing with 2000-mesh abrasive paper.
Comparative example
Taking examples 1-7 as examples, comparative examples 1-9 were set up:
comparative example 1 is essentially the same as example 1 except that: the copper alloy raw material does not contain tungsten powder, and the tungsten powder is supplemented by the same amount of copper-coated cobalt-chromium powder.
Comparative example 2 is essentially the same as example 1 except that: the content of tungsten powder in the copper alloy raw material is 20 wt%.
Comparative example 3 is essentially the same as example 2, except that: the gas pressure of the compressed gas was 2.5 MPa.
Comparative example 4 is essentially the same as example 3, except that: the gas temperature of the compressed gas was 300 ℃.
Comparative example 5 is essentially the same as example 3, except that: the distance of the nozzle from the substrate was 60 mm.
Comparative example 6 is essentially the same as example 4, except that: the powder particle size of the copper providing object is larger than 70 μm, and the powder particle size of the tungsten powder is larger than 80 μm.
Comparative example 7 is essentially the same as example 5, except that: the copper alloy feedstock was not preheated prior to deposition.
Comparative example 8 is essentially the same as example 6, except that: the copper alloy member is not heat treated before being separated from the substrate.
Comparative example 9 is essentially the same as example 7, except that: the thermal spraying deposition mode is adopted for deposition, and the deposition process comprises the following steps: and (4) plasma spraying.
Test examples
The copper alloy pantograph obtained in the above examples 1 to 7 and comparative examples 1 to 9 were subjected to a performance test in which hardness was measured by a vickers hardness meter in accordance with GB/T4340.1-1999, abrasion resistance was compared with the weight loss volume of the same friction pair member by a dimensional change gravimetric method, and conductivity was measured by an eddy current instrument in accordance with GB/T11007-1989. The results are shown in Table 1.
TABLE 1 test results
As can be seen from table 1, the pantograph obtained according to the process and conditions provided in the present application is substantially more effective in hardness, conductivity and wear resistance than the pantograph obtained by the comparative example. The pantograph obtained in example 4 is the best in effect compared with examples 1 to 7, which shows that the corresponding preparation conditions are the best.
It is noted that comparative example 8 corresponds to a pantograph having a hardness higher than that of example 6 because comparative example 8 is not heat-treated, and the hardness is increased due to residual stress in the coating layer, and the wear resistance is high, but at the same time, the electric conductivity is decreased. In example 6, although the hardness is reduced after the heat treatment, the conductivity is increased, and the comprehensive performance of the pantograph corresponding to the heat treatment process is better in comprehensive consideration.
In summary, the preparation method provided by the application can increase the hardness and the wear resistance of the product while ensuring the conductivity of the product, can ensure that the product can run for a long time under a harsh working environment, and reduces the running cost of the product.
The above is only a preferred embodiment of the present invention, and is not intended to limit the present invention, and various modifications and changes will occur to those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A preparation method of a copper alloy pantograph is characterized by comprising the following steps: depositing a copper alloy raw material on the surface of a substrate by adopting a gas dynamic solid deposition mode to form a copper alloy component, then separating the copper alloy component from the substrate, and processing the separated copper alloy component into a preset pantograph shape.
2. The method of claim 1, wherein the gas-powered solid state deposition process is powered by a compressed gas;
preferably, the gas in the compressed gas comprises air, nitrogen or helium;
preferably, the gas pressure of the compressed gas is 3-7 MPa;
preferably, the temperature of the compressed gas is 400-.
3. A method of manufacturing as claimed in claim 2, wherein the distance of the nozzle from the substrate during the gas dynamic solid state deposition is 20-50 mm.
4. The method according to claim 1, wherein the copper provider in the copper alloy raw material includes copper-clad cobalt chromium powder or chromium zirconium copper powder;
preferably, the powder particle size of the copper provider is 10-100 μm.
5. The preparation method according to claim 1, wherein 5-15 wt% of tungsten powder is further added to the copper alloy raw material;
preferably, the powder particle size of the tungsten powder is 20-80 μm.
6. The method of claim 1, wherein the substrate is an aluminum plate;
preferably, the substrate has a thickness of 5-10 mm.
7. The production method according to claim 1, wherein the copper alloy raw material is preheated before deposition;
preferably, the preheating temperature is 50-150 ℃.
8. The production method according to any one of claims 1 to 7, further comprising, before the copper alloy member is separated from the substrate, subjecting the substrate on which the copper alloy member is deposited to heat treatment;
preferably, the heat treatment is carried out at 300-500 ℃ for 2-4 h.
9. The method according to claim 8, further comprising grinding and polishing the copper alloy member processed into a predetermined pantograph shape;
preferably, 500-2000 mesh sandpaper is used for sanding and polishing.
10. A copper alloy pantograph, characterized in that, it is prepared by the preparation method of any one of claims 1 to 9.
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