CN113737073A - Copper-tungsten alloy material and preparation method and application thereof - Google Patents

Copper-tungsten alloy material and preparation method and application thereof Download PDF

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Publication number
CN113737073A
CN113737073A CN202111017755.9A CN202111017755A CN113737073A CN 113737073 A CN113737073 A CN 113737073A CN 202111017755 A CN202111017755 A CN 202111017755A CN 113737073 A CN113737073 A CN 113737073A
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copper
alloy material
tungsten
powder
tungsten alloy
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Inventor
丁一
祝志祥
庞震
陈新
韩钰
陈保安
张强
朱承治
章姝俊
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State Grid Corp of China SGCC
State Grid Zhejiang Electric Power Co Ltd
Global Energy Interconnection Research Institute
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State Grid Corp of China SGCC
State Grid Zhejiang Electric Power Co Ltd
Global Energy Interconnection Research Institute
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    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C27/00—Alloys based on rhenium or a refractory metal not mentioned in groups C22C14/00 or C22C16/00
    • C22C27/04—Alloys based on tungsten or molybdenum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/12—Both compacting and sintering
    • B22F3/14—Both compacting and sintering simultaneously
    • B22F3/15—Hot isostatic pressing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/02—Making metallic powder or suspensions thereof using physical processes
    • B22F9/04—Making metallic powder or suspensions thereof using physical processes starting from solid material, e.g. by crushing, grinding or milling
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/04—Making non-ferrous alloys by powder metallurgy
    • C22C1/05—Mixtures of metal powder with non-metallic powder
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C23C18/405—Formaldehyde
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/02—Contacts characterised by the material thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/02—Making metallic powder or suspensions thereof using physical processes
    • B22F9/04—Making metallic powder or suspensions thereof using physical processes starting from solid material, e.g. by crushing, grinding or milling
    • B22F2009/043—Making metallic powder or suspensions thereof using physical processes starting from solid material, e.g. by crushing, grinding or milling by ball milling

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Powder Metallurgy (AREA)

Abstract

The invention relates to the technical field of electrical materials, in particular to a copper-tungsten alloy material and a preparation method and application thereof. The copper-tungsten alloy material provided by the invention comprises the following components in percentage by mass: 18.0 to 20.0 percent; nano aluminum oxide: 0.005-0.1%, and total C content: less than or equal to 0.15 percent; the balance being W and other unavoidable trace impurities. According to the copper-tungsten alloy material provided by the invention, the nano aluminum oxide is added into the copper-tungsten alloy material, so that the mechanical property and the conductivity of the copper-tungsten alloy material can be obviously improved.

Description

Copper-tungsten alloy material and preparation method and application thereof
Technical Field
The invention relates to the technical field of electrical materials, in particular to a copper-tungsten alloy material and a preparation method and application thereof.
Background
The domestic research and development and the application of the high-voltage heavy-current circuit breaker equipment have important significance for guaranteeing the construction of the ultra-high voltage alternating current ring network engineering in China, relieving the problem of short circuit and standard exceeding of the ultra-high voltage hybrid power grid and ensuring the safe and stable operation of the large power grid.
SF for high-voltage and ultra-high voltage power transmission and transformation system with voltage of 110kV and above6The circuit breaker dominates. SF6In the process of multiple operations of the circuit breaker, inrush current ablation which is several times higher than rated current and mechanical abrasion between moving and static arc contacts can cause contact deformation and generate metal steam, and the insulating property of an arc extinguish chamber is easily damaged. High pressure SF6The electric contact material of the arc extinguish chamber of the circuit breaker still adopts the traditional CuW alloy, and the conductivity and the ablation resistance performance are more and more incapable ofThe service requirements of high power and long service life are met, the failure is caused seriously by burning loss after a few electric contacts are cut off for 5-6 times at full-breaking capacity, and the technical iteration upgrading of the high-voltage electric contacts is urgently needed. Ideal high-voltage electrical contact materials require high current breaking capacity, voltage resistance, small contact resistance, good fusion welding resistance, wear resistance, small cut-off current, high mechanical strength and good processability.
However, the existing CuW alloy material has poor mechanical properties and electrical conductivity and is difficult to well meet the performance requirements of arc ablation resistance and mechanical wear resistance under the working condition of extra-high voltage and high current. Therefore, the development of an electrical contact having both excellent mechanical and electrical properties is the main development direction of the current electrical contact material research.
Disclosure of Invention
Therefore, the technical problem to be solved by the invention is to overcome the defects that the electrical contact material in the prior art has poor electrical and mechanical properties and cannot be considered at the same time, so that the copper-tungsten alloy material and the preparation method and application thereof are provided.
Therefore, the invention provides the following technical scheme:
the copper-tungsten alloy material comprises the following components in percentage by mass: 18.0 to 20.0 percent; nano aluminum oxide: 0.005-0.1%, and total C content: less than or equal to 0.15 percent; the balance being W and other unavoidable trace impurities.
The invention also provides a preparation method of the copper-tungsten alloy material, which comprises the following steps:
1) weighing the raw materials according to the selected proportion, and then ball-milling and mixing tungsten powder, nano aluminum oxide and copper powder to obtain mixed powder;
2) pressing and molding the mixed powder to obtain a green body;
3) and carrying out hot isostatic pressing treatment on the green body to obtain the copper-tungsten alloy material.
Preferably, in the step 1), the copper-clad tungsten powder and the nano aluminum oxide are mixed by ball milling to obtain mixed powder.
The copper-clad tungsten powder can be obtained by commercial purchase or the existing method,
optionally, the copper-clad tungsten powder takes metal tungsten as a core, the surface of the metal tungsten is coated with metal copper, and the mass ratio of the copper to the tungsten is 1: (3.8-4.2).
Optionally, the surface of the metal tungsten is coated with metal copper with the thickness of 0.8-1.2 μm, and the particle size of the metal tungsten is 6.2-6.8 μm.
Preferably, the copper-clad tungsten powder is obtained by a method of plating copper on the surface of tungsten powder. The method for plating copper on the surface of tungsten powder is a conventional means in the field, and is not described herein. Optionally, the preparation method of the copper-clad tungsten powder comprises the following steps:
1) pretreatment of W powder
Sequentially carrying out alkali washing, water washing, acid washing, water washing and alcohol washing on tungsten powder, and drying for later use after washing;
preferably, the tungsten powder is firstly ultrasonically cleaned by NaOH solution with the concentration of 8-12 wt.% for 8-15min, then cleaned by deionized water for 3-5 times, then ultrasonically cleaned by HCl solution with the concentration of 8-12% for 8-15min, cleaned by deionized water for 3-5 times, finally cleaned by absolute ethyl alcohol for 1-3 times, and dried for later use after cleaning.
2) Preparing plating solution
Adding complexing agent potassium sodium tartrate, copper sulfate and stabilizer bipyridine into water, and then adjusting the pH value of the solution to 7.8-8.2 to prepare the required plating solution; the concentration of potassium sodium tartrate in the plating solution is 45-55 g.L-1The concentration of bipyridine is 8-10 g.L-1；
3) Chemical plating
Adding the tungsten powder obtained in the step 1) into the plating solution at the temperature of 58-65 ℃, wherein the adding amount of the tungsten powder is that the mass ratio of metal copper to tungsten in the solution is 1: (3.8-4.2) preferably; then adding a reducing agent formaldehyde, stirring, continuously adding alkali liquor into the reaction liquid in the reaction process to maintain the pH value of the solution to be 7.8-8.2, and stopping stirring after the pH value of the reaction liquid is not changed and the reaction liquid becomes clear;
preferably, the reducing agent is added in an amount of 18-22 mL. L-1。
4) Cleaning and drying copper-coated tungsten powder
And filtering the reaction solution, washing the filter cake for 3-5 times by using water and ethanol respectively, and drying after washing to obtain the copper-clad tungsten powder.
Preferably, in the step 1), the nano aluminum oxide accounts for 0.005-0.1% of the total mass of the raw materials, and the copper powder accounts for 18-20% of the total mass of the raw materials; optionally, the tungsten powder copper powder accounts for 78-80% of the total mass of the raw materials.
Preferably, the ball milling speed in the step 1) is 1500-; the ball milling can be carried out all the time in the ball milling process, and the ball milling can also be stopped for 10-20 min every 0.5 h.
The pressing and forming in the step 2) is cold pressing and forming, the pressing temperature is 20-30 ℃, the pressing pressure is 500-700MPa, and the pressing time is 0.3-3 h;
according to the invention, the mixed powder is added into a sheath for pressing, optionally, the loose relative density is 60-70%, and a green body with the green compact density of 75-85% of the theoretical density is obtained after cold pressing.
The hot isostatic pressing treatment in the step 3) comprises the following steps: under vacuum degree of 6.0X 10-3Pa-6.5×10-3And (2) carrying out hot pressing on the green body under Pa, adopting nitrogen or inert gas as a pressure transmission medium, carrying out hot pressing at the temperature of 900-1100 ℃, carrying out hot pressing at the pressure of 90-120MPa for 1.5-2.5h, and cooling after the hot pressing is finished to obtain the copper-tungsten alloy material.
Preferably, the average particle size of the tungsten powder is 6-8 μm, the average particle size of the copper powder is 10-70 μm, the average particle size of the nano aluminum oxide is 100-200nm, and the average particle size of the copper-coated tungsten powder is 6-10 μm.
Preferably, the copper powder is electrolytic copper powder.
Preferably, the copper-tungsten alloy material is a copper-tungsten alloy electrical contact material.
The invention also provides an application of the copper-tungsten alloy material or the copper-tungsten alloy material prepared by the preparation method of the copper-tungsten alloy material in an electrical contact material for a high-voltage SF6 circuit breaker.
The technical scheme of the invention has the following advantages:
1. according to the copper-tungsten alloy material provided by the invention, a specific amount of nano-alumina is added into the copper-tungsten alloy material with a specific proportion to modify the copper-tungsten alloy material, the nano-alumina can be uniformly distributed in the alloy matrix material, so that the nano-alumina has stronger stability and dispersibility in a matrix, and therefore, the copper-tungsten alloy material has higher enhancement efficiency, and meanwhile, the nano-alumina has very high positive electricity tendency.
The density of the nano aluminum oxide modified copper-tungsten alloy material provided by the invention is more than or equal to 15.3g/cm3The Hardness (HB) is not less than 233, the room-temperature conductivity is not less than 42.8% IACS (20 ℃), and the bending strength is not less than 1070MPa, compared with the copper-tungsten alloy material prepared under the same conditions, the density, the hardness, the conductivity, the tensile strength and the like are all improved. Meanwhile, due to the inherent excellent performance of the nano aluminum oxide, the electrical physical property and the ablation resistance of the traditional electrical contact are comprehensively improved.
2. According to the preparation method of the copper-tungsten alloy material, the nano aluminum oxide is firstly mixed with the tungsten powder and the copper powder in a ball milling mode, so that the nano aluminum oxide is dispersed and distributed in the tungsten powder and the copper powder, hot isostatic pressing is carried out, the prepared copper-tungsten alloy material has a compact microstructure, meanwhile, the nano aluminum oxide is dissociated at the internal defect of the material and a continuous conductive network is constructed, the influence of the internal micro defect on the conductive performance is greatly reduced, the conductivity and the mechanical performance of the nano aluminum oxide modified copper-tungsten alloy material are improved, the problems of large capacity and long service life of an electrical contact material are solved, the process is simple, the production and manufacturing cost is low, the preparation process is efficient and low in cost, and the environment is not polluted in the preparation process. .
3. The preparation method of the copper-tungsten alloy material provided by the invention further comprises the step 1) of ball-milling and mixing the copper-coated tungsten powder and the nano aluminum oxide to obtain mixed powder. According to the invention, copper is plated on the surface of tungsten powder to obtain copper-coated tungsten powder, the copper-coated tungsten powder and nano aluminum oxide are subjected to ball milling and mixing, and hot isostatic pressing preparation is carried out, so that the prepared copper-tungsten alloy material has better electrical conductivity and mechanical property.
Detailed Description
The following examples are provided to further understand the present invention, not to limit the scope of the present invention, but to provide the best mode, not to limit the content and the protection scope of the present invention, and any product similar or similar to the present invention, which is obtained by combining the present invention with other prior art features, falls within the protection scope of the present invention.
The examples do not show the specific experimental steps or conditions, and can be performed according to the conventional experimental steps described in the literature in the field. The reagents or instruments used are not indicated by manufacturers, and are all conventional reagent products which can be obtained commercially.
Example 1
The embodiment provides a copper-tungsten alloy material, and a preparation method thereof is as follows:
1) placing 80g of tungsten powder (with the average particle size of 6 mu m), 0.005g of nano-alumina (with the average particle size of 100 mu m) and 19.995g of copper powder (with the average particle size of 10 mu m) on an Emax high-energy ball mill, and carrying out ball milling and mixing for 1h at the speed of 2000rad/min to obtain mixed powder;
2) putting the mixed powder into a sheath of low-carbon steel which is cleaned by ultrasonic waves and has the size of phi 50mm multiplied by 100mm, and then carrying out cold press molding, wherein the pressing pressure is 700MPa, the pressing temperature is 25 ℃, and the pressing time is 0.3h, so as to obtain a green body;
3) under vacuum degree of 6.3X 10-3And (2) carrying out hot pressing on the green body in the jacket by QIH-15L hot isostatic pressing equipment under Pa, adopting argon as a pressure transmission medium, cooling to room temperature after the hot pressing is finished, and stopping introducing the argon to obtain the copper-tungsten alloy material, wherein the hot pressing temperature is 1100 ℃, the hot pressing pressure is 90MPa, and the hot pressing time is 2.5 h.
Through element analysis, according to mass percent, Cu in the copper-tungsten alloy material is: 20.8 percent; nano aluminum oxide: 0.08%, and total C content: 0.05 percent; the W content is 79.1%; other inevitable trace impurities.
Example 2
The embodiment provides a copper-tungsten alloy material, and a preparation method thereof is as follows:
1) 99.995g of copper-coated tungsten powder (the average particle size is 6 mu m, the copper-coated tungsten powder takes metal tungsten as a core, the surface of the metal tungsten is coated with metal copper, and the mass ratio of the copper to the tungsten is 1: 3.9) and 0.005g of nano aluminum oxide (the average grain diameter is 100 mu m) are placed on an Emax high-energy ball mill to be ball-milled and mixed for 1h at the speed of 2000rad/min, and mixed powder is obtained;
the preparation method of the copper-clad tungsten powder comprises the following steps:
a) pretreatment of W powder
Firstly, ultrasonically cleaning tungsten powder for 10min by adopting a NaOH solution with the concentration of 10 wt.%, then cleaning for 3 times by using deionized water, ultrasonically cleaning for 10min by using an HCl solution with the concentration of 10%, cleaning for 3 times by using deionized water, finally cleaning for 1 time by using absolute ethyl alcohol, and drying for later use after cleaning;
b) preparing plating solution
Adding 50g of complexing agent sodium potassium tartrate, 5g of CuSO4 & 5H2O and 8g of stabilizer bipyridine into 1L of water, and then adjusting the pH value of the solution to 8.0 to prepare the required plating solution;
c) chemical plating
Adding 5g of tungsten powder obtained in the step 1) into a plating solution at 60 ℃, then adding 20mL of reducing agent formaldehyde, stirring, continuously supplementing sodium hydroxide solution into the reaction solution in the reaction process to maintain the pH value of the solution to be 8.0, and stopping stirring after the pH value of the reaction solution is not changed and the reaction solution becomes clear;
d) cleaning and drying copper-coated tungsten powder
And filtering the reaction solution, washing the filter cake for 3 times by using water and ethanol respectively, and drying after washing to obtain the copper-coated tungsten powder.
2) Putting the mixed powder into a sheath of low-carbon steel which is cleaned by ultrasonic waves and has the size of phi 50mm multiplied by 100mm, and then carrying out cold press molding, wherein the pressing pressure is 700MPa, the pressing temperature is 25 ℃, and the pressing time is 0.3h, so as to obtain a green body;
3) under vacuum degree of 6.3X 10-3Hot pressing the green body in the jacket by QIH-15L hot isostatic pressing equipment under Pa, adopting argon as a pressure transmission medium, controlling the hot pressing temperature to be 1100 ℃, the hot pressing pressure to be 90MPa, controlling the hot pressing time to be 2.5h, and cooling to the temperature of the green body after the hot pressing is finishedAnd stopping introducing argon at room temperature to obtain the copper-tungsten alloy material.
Through element analysis, according to mass percent, Cu in the copper-tungsten alloy material is: 21.3 percent; nano aluminum oxide: 0.07%, and total C content: 0.05 percent; the W content is 78.6%; other inevitable trace impurities.
Example 3
The embodiment provides a copper-tungsten alloy material, and a preparation method thereof is as follows:
1) placing 80g of tungsten powder (with the average particle size of 8 mu m), 0.1g of nano-alumina (with the average particle size of 200 mu m) and 19.9g of electrolytic copper powder (with the average particle size of 70 mu m) on an Emax high-energy ball mill, and ball-milling and mixing at the speed of 1500rad/min for 3 hours to obtain mixed powder;
2) putting the mixed powder into a sheath of low-carbon steel which is cleaned by ultrasonic waves and has the size of phi 50mm multiplied by 100mm, and then carrying out cold press molding, wherein the pressing pressure is 650MPa, the pressing temperature is 25 ℃, and the pressing time is 0.5h, so as to obtain a green body;
3) under vacuum degree of 6.3X 10-3And (2) carrying out hot pressing on the green body in the jacket by QIH-15L hot isostatic pressing equipment under Pa, adopting argon as a pressure transmission medium, cooling to room temperature after the hot pressing is finished, and stopping introducing the argon to obtain the copper-tungsten alloy material, wherein the hot pressing temperature is 950 ℃, the hot pressing pressure is 110MPa, and the hot pressing time is 2 h.
Through element analysis, according to mass percent, Cu in the copper-tungsten alloy material is: 19.9 percent; nano aluminum oxide: 0.08%, and total C content: 0.05 percent; the W content is 79.9%; other inevitable trace impurities.
Comparative example 1 (compare with example 1)
The comparative example provides a copper-tungsten alloy material, and the preparation method comprises the following steps:
1) placing 80g of tungsten powder (with the average particle size of 6 mu m) and 20g of copper powder (with the average particle size of 10 mu m) on an Emax high-energy ball mill, and carrying out ball milling and mixing for 1h at the speed of 2000rad/min to obtain mixed powder;
2) putting the mixed powder into a sheath of low-carbon steel which is cleaned by ultrasonic waves and has the size of phi 50mm multiplied by 100mm, and then carrying out cold press molding, wherein the pressing pressure is 700MPa, the pressing temperature is 25 ℃, and the pressing time is 0.3h, so as to obtain a green body;
3) under vacuum degree of 6.3X 10-3And (2) carrying out hot pressing on the green body in the jacket by QIH-15L hot isostatic pressing equipment under Pa, adopting argon as a pressure transmission medium, cooling to room temperature after the hot pressing is finished, and stopping introducing the argon to obtain the copper-tungsten alloy material, wherein the hot pressing temperature is 1100 ℃, the hot pressing pressure is 90MPa, and the hot pressing time is 2.5 h.
Comparative example 2 (compare with example 1)
The comparative example provides a copper-tungsten alloy material, and the preparation method comprises the following steps:
1) putting 70g of tungsten powder (with the average particle size of 6 mu m), 0.005g of nano-alumina (with the average particle size of 100 mu m) and 29.995g of copper powder (with the average particle size of 10 mu m) on an Emax high-energy ball mill, and carrying out ball milling and mixing for 1h at the speed of 2000rad/min to obtain mixed powder;
2) putting the mixed powder into a sheath of low-carbon steel which is cleaned by ultrasonic waves and has the size of phi 50mm multiplied by 100mm, and then carrying out cold press molding, wherein the pressing pressure is 700MPa, the pressing temperature is 25 ℃, and the pressing time is 0.3h, so as to obtain a green body;
3) under vacuum degree of 6.3X 10-3And (2) carrying out hot pressing on the green body in the jacket by QIH-15L hot isostatic pressing equipment under Pa, adopting argon as a pressure transmission medium, cooling to room temperature after the hot pressing is finished, and stopping introducing the argon to obtain the copper-tungsten alloy material, wherein the hot pressing temperature is 1100 ℃, the hot pressing pressure is 90MPa, and the hot pressing time is 2.5 h.
Comparative example 3
The comparative example provides a copper-tungsten alloy material, and the preparation method comprises the following steps:
1) placing 80g of tungsten powder (with the average particle size of 6 microns), 0.005g of nano-alumina (with the average particle size of 100 microns) and 3.5g of copper powder (with the average particle size of 40 microns) on an Emax high-energy ball mill, and carrying out ball milling and mixing for 1.2h at the speed of 2500rad/min to obtain mixed powder;
2) pressing the mixture powder in a hard alloy die under 600MPa, and then at 1150 deg.C and 2 × 10-2Sintering for 0.5h under the Pa vacuum degree, and cooling to room temperature to obtain a sintered blank;
3) after the surface of the sintered blank is cleaned, 16.495g of copper is infiltrated in a vacuum furnace, the temperature of the infiltrated copper is 1250 ℃, and the time is 1 h;
4) and cooling the sample subjected to vacuum infiltration of copper to 600 ℃ along with the furnace, then carrying out vacuum annealing at 600 ℃ for 1h, and cooling to room temperature along with the furnace to finally obtain the copper-tungsten alloy material.
Examples of the experiments
Respectively processing the copper-tungsten alloy materials prepared in each embodiment and each comparative example into cylinders with the diameter of 20mm and the height of 5mm, then respectively testing the electrical property and the mechanical property of the cylinders, respectively, randomly taking 1 point in the middle area and randomly taking 2 points in the edge area during testing the electrical property and the mechanical property according to the GB/T5586-2016 standard, and respectively testing the points for 3 points, and then respectively taking an average value; the test results are shown in table 1 below;
table 1 results of performance testing
Figure BDA0003238842000000101
As can be seen from Table 1, the comprehensive performance of the nano aluminum oxide modified copper-tungsten alloy material has obvious advantages, and the main performance index is comprehensively superior to the performance requirement of the copper-tungsten alloy material commonly used for the active high-voltage circuit breaker specified in GB/T8320-2017 copper-tungsten and silver-tungsten electrical contact.
It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications of the invention may be made without departing from the spirit or scope of the invention.

Claims (10)

1. The copper-tungsten alloy material is characterized by comprising the following components in percentage by mass: 18.0 to 20.0 percent; nano aluminum oxide: 0.005-0.1%, and total C content: less than or equal to 0.15 percent; the balance being W and other unavoidable trace impurities.
2. The preparation method of the copper-tungsten alloy material is characterized by comprising the following steps of:
1) weighing the raw materials according to the selected proportion, and then ball-milling and mixing tungsten powder, nano aluminum oxide and copper powder to obtain mixed powder;
2) pressing and molding the mixed powder to obtain a green body;
3) and carrying out hot isostatic pressing treatment on the green body to obtain the copper-tungsten alloy material.
3. The preparation method of the copper-tungsten alloy material according to claim 2, wherein the copper-coated tungsten powder and the nano aluminum oxide are mixed by ball milling in the step 1) to obtain a mixed powder.
4. The preparation method of the copper-tungsten alloy material according to claim 2 or 3, wherein the copper-clad tungsten powder takes metal tungsten as a core, the surface of the metal tungsten is coated with metal copper, and the mass ratio of copper to tungsten is 1: (3.8-4.2).
5. The method for preparing the copper-tungsten alloy material according to any one of claims 2 to 4, wherein the copper-clad tungsten powder is obtained by plating copper on the surface of tungsten powder.
6. The method for preparing the copper-tungsten alloy material according to any one of claims 2 to 5, wherein the nano aluminum oxide accounts for 0.005 to 0.1 percent of the total mass of the raw materials in the step 1), and the copper powder accounts for 18 to 20 percent of the total mass of the raw materials.
7. The method for preparing the copper-tungsten alloy material according to any one of claims 2 to 6, wherein the ball milling speed in the step 1) is 1500-;
the pressing and forming in the step 2) is cold pressing and forming, the pressing temperature is 20-30 ℃, the pressing pressure is 500-700MPa, and the pressing time is 0.3-3 h;
the hot isostatic pressing treatment in the step 3) comprises the following steps: under vacuum degree of 6.0X 10-3Pa-6.5×10-3And (2) carrying out hot pressing on the green body under Pa, adopting nitrogen or inert gas as a pressure transmission medium, carrying out hot pressing at the temperature of 900-1100 ℃, carrying out hot pressing at the pressure of 90-120MPa for 1.5-2.5h, and cooling after the hot pressing is finished to obtain the copper-tungsten alloy material.
8. The method for preparing the copper-tungsten alloy material according to any one of claims 2 to 7, wherein the average particle size of the tungsten powder is 4 to 8 μm, the average particle size of the copper powder is 10 to 70 μm, the average particle size of the nano-alumina is 100-200nm, and the average particle size of the copper-clad tungsten powder is 6 to 10 μm.
9. The method for preparing a copper-tungsten alloy material according to any one of claims 2 to 8, wherein the copper powder is electrolytic copper powder.
10. Use of the copper-tungsten alloy material according to claim 1 or the copper-tungsten alloy material prepared by the method according to any one of claims 2 to 9 in an electrical contact material for a high-voltage SF6 circuit breaker.
CN202111017755.9A 2021-08-31 2021-08-31 Copper-tungsten alloy material and preparation method and application thereof Pending CN113737073A (en)

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