CN113732423B - Self-adaptive laser soldering device based on size of bonding pad and welding method - Google Patents
Self-adaptive laser soldering device based on size of bonding pad and welding method Download PDFInfo
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- CN113732423B CN113732423B CN202111084930.6A CN202111084930A CN113732423B CN 113732423 B CN113732423 B CN 113732423B CN 202111084930 A CN202111084930 A CN 202111084930A CN 113732423 B CN113732423 B CN 113732423B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/005—Soldering by means of radiant energy
- B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
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Abstract
The invention relates to the technical field of laser soldering, in particular to a self-adaptive laser soldering device and a welding method based on the size of a bonding pad, wherein the self-adaptive laser soldering device comprises a cylinder a, a cylinder b, a cylinder c, a cylinder d, a collimating lens a and a top plate; the bottom of the cylinder body a is provided with a protective base, and a tin feeding device is arranged on the protective base; the cylinder b is connected with the cylinder c, the cylinder c is communicated with the cylinder a, the cylinder c is connected with the cylinder d, the cylinder d is arranged obliquely, the top of the cylinder b is provided with a laser transmission optical fiber, and convex lenses are arranged on the inner wall of the cylinder a and the inner wall of the cylinder d; the collimating lens a is arranged on the inner wall of the cylinder b; a reflector a, a reflector b and a reflector c are respectively arranged at the joint of the cylinder b and the cylinder c, the joint of the cylinder c and the cylinder a and the joint of the cylinder c and the cylinder d; an optical imaging recognition device is arranged on the top plate. According to the invention, welding process parameters can be switched according to the size of the bonding pad, the laser rate is high, and the temperature monitoring is more accurate.
Description
Technical Field
The invention relates to the technical field of laser soldering, in particular to a self-adaptive laser soldering device and a soldering method based on the size of a bonding pad.
Background
Chinese patent with application number CN201911347950.0 discloses a pad size-based adaptive laser soldering device, which comprises a base part of three lens barrels, a pad detection and soldering parameter control mechanism, a temperature detection range adaptive adjustment mechanism, a laser soldering head and a light spot adaptive adjustment mechanism, wherein the three lens barrels of the base part are respectively a left axis lens barrel, a middle axis lens barrel and a right axis lens barrel, the pad detection and soldering parameter control mechanism is installed in the middle axis lens barrel, the temperature detection range adaptive adjustment mechanism is installed in the left axis lens barrel, and the laser soldering head and the light spot adaptive adjustment mechanism are installed in the right axis lens barrel. The welding method has the advantages that the multi-point automatic welding of one-time clamping is carried out on workpieces with welding pads of different sizes, the welding quality is guaranteed through soldering parameter control, and the adaptability of the laser soldering machine to complex workpieces and the welding efficiency are greatly improved.
However, the above-mentioned published solutions have the following disadvantages: the temperature detector passes through two groups of 45-degree reflectors and then passes through a common lens, the common lens needs to be a convex lens for focusing laser, light rays emitted by the temperature detector are focused on a small point after passing through the common lens, infrared temperature imaging around a laser welding spot is difficult to detect completely, the judgment on the temperature is accurate and low, the second 45-degree reflector needs to transmit light rays emitted by the temperature detector and reflect laser emitted by the laser transmission optical fiber simultaneously, the second 45-degree reflector can only be made of one-way transparent glass and the like, the reflectivity of the material of the one-way light transmission is not hundred percent, a part of laser penetrates through the second 45-degree reflector, laser loss is caused, in order to achieve the same welding effect, the laser irradiation power needs to be increased, and the utilization rate of the laser is low.
Disclosure of Invention
The invention aims to provide a self-adaptive laser soldering device and a welding method based on the size of a bonding pad, aiming at the problems that the temperature of a welding spot is difficult to completely detect when the detection light of a temperature detector is converged at one point and the utilization rate of laser is low in the background technology.
The technical scheme of the invention is as follows: a self-adaptive laser soldering device based on the size of a bonding pad comprises a cylinder a, a cylinder b, a cylinder c, a cylinder d, a laser transmission optical fiber, a collimating lens a, a reflector b, a reflector c, a convex lens and a top plate;
the barrel a is vertically arranged, the bottom of the barrel a is provided with a protective base, the barrel a forms an opening at the bottom of the protective base, and the protective base is provided with a tin feeding device; the barrel b is vertically arranged, the top of the barrel b is closed, the bottom of the barrel b is connected with one end of a barrel c, the barrel c is horizontally arranged, the barrel c is communicated with the barrel a, the other end of the barrel c is connected with a barrel d, the barrel d is obliquely arranged, and the bottom of the barrel d penetrates through the protective base and forms an opening at the bottom of the protective base; the laser transmission optical fiber is arranged at the top of the cylinder b, and the laser emission direction of the laser transmission optical fiber is vertical downward; the collimating lens a is horizontally arranged on the inner wall of the cylinder b and is positioned below the laser transmission optical fiber; the reflector a, the reflector b and the reflector c are respectively arranged at the joint of the cylinder b and the cylinder c, the joint of the cylinder c and the cylinder a and the joint of the cylinder c and the cylinder d, the inclination angles of the reflector a and the reflector b are forty-five degrees, and the included angle of the reflector c and the horizontal plane is ninety degrees minus half of the included angle of the cylinder d and the cylinder c; the two groups of convex lenses are respectively arranged on the inner wall of the bottom of the cylinder a and the inner wall of the bottom of the cylinder d; the barrel a is internally provided with a temperature monitoring assembly for detecting the laser welding spot and the ambient temperature thereof, and the temperature monitoring assembly comprises an infrared temperature measuring device, a collimating lens b and a concave lens; the infrared temperature measuring device, the collimating lens b and the concave lens are sequentially arranged on the inner wall of the cylinder a from top to bottom, and the concave lens is positioned above the reflector b; the top plate is horizontally arranged at the top of the cylinder body a, and an optical imaging recognition device for detecting the size of the bonding pad is arranged on the top plate.
Preferably, the protection base is provided with a spherical hole, and the spherical hole forms an opening at the lower end face of the protection base.
Preferably, mirror a and mirror c are opaque mirrors.
Preferably, the bottom of the protective base is provided with an illuminating lamp.
Preferably, the protective base is provided with a strip-shaped groove in an inclined mode, and the tin feeding device is arranged on the wall of the strip-shaped groove.
Preferably, the top plate is a circular plate, the optical imaging recognition devices are arranged on the outer peripheral wall of the top plate in multiple groups, and the multiple groups of optical imaging recognition devices are uniformly distributed along the circumference by taking the axis of the top plate as the center.
Preferably, the welding method comprises the steps of: s1, setting different welding process parameters according to welding pads with different sizes, and establishing a one-to-one correspondence relationship between the welding pads and the welding process parameters; s2, photographing through an optical imaging recognition device, matching the shape and the image, and recognizing the size of the current bonding pad; s3, according to the welding pad identified by the optical imaging identification device, selecting corresponding welding process parameters, enabling the laser transmission optical fiber and the tin feeding device to work for laser welding, enabling the infrared temperature measuring device to work at the same time, and monitoring real-time welding temperature of the welding spot and the periphery of the welding spot; and S4, when the real-time welding temperature monitored by the infrared temperature measuring device is higher than the upper limit value of the set temperature interval corresponding to the welding process parameter, the output power of the laser transmission optical fiber is reduced by the external control system until the real-time welding temperature returns to the set temperature interval corresponding to the welding process parameter, otherwise, when the real-time welding temperature monitored by the infrared temperature measuring device is lower than the lower limit value of the set temperature interval corresponding to the welding process parameter, the output power of the laser transmission optical fiber is increased by the external control system until the real-time welding temperature returns to the set temperature interval corresponding to the welding process parameter.
Compared with the prior art, the invention has the following beneficial technical effects: the optical imaging recognition device recognizes the bonding pad, is convenient for switch welding process parameters, has stronger practicability, and laser is divided into two parts to be intensively irradiated on the welding spot, thereby improving the laser efficiency, and the temperature monitoring range is distributed around the welding spot and the welding spot, so that the temperature monitoring is more accurate.
Drawings
FIG. 1 is a schematic structural diagram of an embodiment of the present invention;
FIG. 2 is a front cross-sectional view of FIG. 1;
fig. 3 is a flow chart of a welding method.
Reference numerals are as follows: 1. a cylinder body a; 2. a cylinder b; 3. a cylinder c; 4. a cylinder d; 5. a protective base; 6. a lighting lamp; 7. a laser transmission optical fiber; 8. a collimating lens a; 9. a reflector a; 10. a reflecting mirror b; 11. a mirror c; 12. a convex lens; 13. an infrared temperature measuring device; 14. a collimating lens b; 15. a concave lens; 16. a strip-shaped groove; 17. a tin feeding device; 18. a top plate; 19. an optical imaging recognition device.
Detailed Description
Example one
As shown in fig. 1-2, the adaptive laser soldering device based on pad size according to the present invention includes a barrel a1, a barrel b2, a barrel c3, a barrel d4, a laser transmission fiber 7, a collimating lens a8, a mirror a9, a mirror b10, a mirror c11, a convex lens 12, and a top plate 18;
the tin feeding device comprises a cylinder a1, a protective base 5, a lamp 6, a tin feeding device 17, a spherical hole, a lamp base 5 and a lamp, wherein the cylinder a1 is vertically arranged, the protective base 5 is arranged at the bottom of the cylinder a1, the cylinder a1 forms an opening at the bottom of the protective base 5, a strip-shaped groove 16 is obliquely arranged on the protective base 5, the tin feeding device 17 is arranged on the groove wall of the strip-shaped groove 16, the protective base 5 is provided with the spherical hole, the opening is formed in the lower end face of the protective base 5 by the spherical hole, and the lamp 6 is arranged at the bottom of the protective base 5; the barrel b2 is vertically arranged, the top of the barrel b2 is closed, the bottom of the barrel b2 is connected with one end of a barrel c3, the barrel c3 is horizontally arranged, the barrel c3 is communicated with the barrel a1, the other end of the barrel c3 is connected with a barrel d4, the barrel d4 is obliquely arranged, and the bottom of the barrel d4 penetrates through the protective base 5 and forms an opening at the bottom of the protective base 5; the laser transmission optical fiber 7 is arranged at the top of the cylinder b2, and the laser emission direction of the laser transmission optical fiber 7 is vertical downward; the collimating lens a8 is horizontally arranged on the inner wall of the cylinder b2 and is positioned below the laser transmission optical fiber 7; the reflector a9, the reflector b10 and the reflector c11 are respectively arranged at the joint of the cylinder b2 and the cylinder c3, the joint of the cylinder c3 and the cylinder a1 and the joint of the cylinder c3 and the cylinder d4, the inclination angles of the reflector a9 and the reflector b10 are forty-five degrees, the included angle of the reflector c11 and the horizontal plane is ninety degrees minus half of the included angle of the cylinder d4 and the cylinder c3, and the reflector a9 and the reflector c11 are opaque reflectors; the two groups of convex lenses 12 are respectively arranged on the inner wall of the bottom of the cylinder a1 and the inner wall of the bottom of the cylinder d 4; a temperature monitoring assembly for detecting the laser welding spot and the ambient temperature thereof is arranged in the cylinder a 1; the top plate 18 is horizontally arranged at the top of the cylinder body a1, the top plate 18 is provided with optical imaging recognition devices 19 used for detecting the size of the bonding pad, the top plate 18 is a circular plate, the optical imaging recognition devices 19 are arranged on the outer circumferential wall of the top plate 18 in multiple groups, and the multiple groups of optical imaging recognition devices 19 are uniformly distributed along the circumference by taking the axis of the top plate 18 as the center. The laser tin soldering device is also provided with a control system, the control system is connected with the temperature monitoring assembly in a data transmission mode, and the control system is connected with the tin feeding device 17 and the laser emitting device of the laser transmission optical fiber 7 in a control mode.
In this embodiment, the bonding pad is identified by the optical imaging identification device 19, so that the corresponding laser welding process parameters can be conveniently selected according to the size of the bonding pad, the laser emitted from the laser transmission fiber 7 is reflected to the reflector b10 through the reflector a9, most of the laser is reflected and then emitted to the convex lens 12 for focusing, a small part of the laser passes through the reflector b10 and is emitted to the reflector c11, then the laser emitted from the reflector c11 is emitted to the convex lens 12, the laser emitted from the barrel a1 and the laser emitted from the barrel d4 are irradiated to the same point, the laser emitted from the laser transmission fiber 7 is fully utilized, and the utilization rate of the laser is greatly improved.
Example two
Compared with the first embodiment, the temperature monitoring assembly comprises an infrared temperature measuring device 13, a collimating lens b14 and a concave lens 15; the infrared temperature measuring device 13, the collimating lens b14 and the concave lens 15 are sequentially arranged on the inner wall of the cylinder a1 from top to bottom, and the concave lens 15 is positioned above the reflector b 10.
In the embodiment, the infrared rays are emitted by the concave lens 15 and then emitted to the convex lens 12, and gathered by the convex lens 12 and emitted to the welding point and the periphery of the welding point, so that the temperature monitoring area is effectively increased, and the temperature monitoring accuracy is improved.
EXAMPLE III
As shown in fig. 3, the welding method based on the pad size-based adaptive laser soldering apparatus includes the following steps:
s1, setting different welding process parameters according to welding pads with different sizes, and establishing a one-to-one correspondence relationship between the welding pads and the welding process parameters;
s2, photographing through the optical imaging recognition device 19, matching the shape and the image, and recognizing the size of the current bonding pad;
s3, according to the welding pad identified by the optical imaging identification device 19, selecting corresponding welding process parameters, enabling the laser transmission optical fiber 7 and the tin feeding device 17 to work for laser welding, enabling the infrared temperature measuring device 13 to work at the same time, and monitoring the welding point and the real-time welding temperature around the welding point;
and S4, when the real-time welding temperature monitored by the infrared temperature measuring device 13 is higher than the upper limit value of the set temperature interval corresponding to the welding process parameter, the external control system reduces the output power of the laser transmission optical fiber 7 until the real-time welding temperature returns to the set temperature interval corresponding to the welding process parameter, otherwise, when the real-time welding temperature monitored by the infrared temperature measuring device 13 is lower than the lower limit value of the set temperature interval corresponding to the welding process parameter, the external control system increases the output power of the laser transmission optical fiber 7 until the real-time welding temperature returns to the set temperature interval corresponding to the welding process parameter.
In this embodiment, the optical imaging recognition device 19 recognizes the bonding pad, is convenient for switch welding process parameter, and the practicality is stronger, and laser falls into two parts and concentrates on shining on the solder joint, has improved the laser rate and has rateed, and the temperature monitoring range distributes around solder joint and solder joint, and temperature monitoring is more accurate.
The embodiments of the present invention have been described in detail with reference to the drawings, but the present invention is not limited thereto, and various changes can be made within the knowledge of those skilled in the art without departing from the gist of the present invention.
Claims (7)
1. A self-adaptive laser soldering device based on the size of a pad is characterized by comprising a cylinder a (1), a cylinder b (2), a cylinder c (3), a cylinder d (4), a laser transmission optical fiber (7), a collimating lens a (8), a reflector a (9), a reflector b (10), a reflector c (11), a convex lens (12) and a top plate (18);
the tin soldering machine is characterized in that the cylinder a (1) is vertically arranged, the bottom of the cylinder a (1) is provided with a protective base (5), the cylinder a (1) forms an opening at the bottom of the protective base (5), and the protective base (5) is provided with a tin feeding device (17); the barrel b (2) is vertically arranged, the top of the barrel b (2) is closed, the bottom of the barrel b (2) is connected with one end of a barrel c (3), the barrel c (3) is horizontally arranged, the barrel c (3) is communicated with the barrel a (1), the other end of the barrel c (3) is connected with a barrel d (4), the barrel d (4) is obliquely arranged, and the bottom of the barrel d (4) penetrates through the protective base (5) and forms an opening at the bottom of the protective base (5); the laser transmission optical fiber (7) is arranged at the top of the cylinder b (2), and the laser emission direction of the laser transmission optical fiber (7) is vertical downward; the collimating lens a (8) is horizontally arranged on the inner wall of the cylinder b (2) and is positioned below the laser transmission optical fiber (7); the reflecting mirror a (9), the reflecting mirror b (10) and the reflecting mirror c (11) are respectively arranged at the joint of the cylinder b (2) and the cylinder c (3), the joint of the cylinder c (3) and the cylinder a (1) and the joint of the cylinder c (3) and the cylinder d (4), the inclined angles of the reflecting mirror a (9) and the reflecting mirror b (10) are forty-five degrees, and the included angle between the reflecting mirror c (11) and the horizontal plane is ninety degrees minus half of the included angle between the cylinder d (4) and the cylinder c (3); the two groups of convex lenses (12) are respectively arranged on the inner wall of the bottom of the cylinder a (1) and the inner wall of the bottom of the cylinder d (4); a temperature monitoring assembly for detecting laser welding spots and the ambient temperature thereof is arranged in the cylinder body a (1), and the temperature monitoring assembly comprises an infrared temperature measuring device (13), a collimating lens b (14) and a concave lens (15); the infrared temperature measuring device (13), the collimating lens b (14) and the concave lens (15) are sequentially arranged on the inner wall of the cylinder a (1) from top to bottom, and the concave lens (15) is positioned above the reflector b (10); the top plate (18) is horizontally arranged at the top of the cylinder body a (1), and an optical imaging recognition device (19) for detecting the size of the bonding pad is arranged on the top plate (18).
2. The pad-size-based adaptive laser soldering apparatus according to claim 1, wherein the protective base (5) is provided with a spherical hole, and the spherical hole forms an opening at a lower end face of the protective base (5).
3. The pad size based adaptive laser soldering apparatus according to claim 1, wherein the mirrors a (9) and c (11) are opaque mirrors.
4. The pad size-based adaptive laser soldering device according to claim 1, wherein an illuminating lamp (6) is arranged at the bottom of the protective base (5).
5. The pad-size-based adaptive laser soldering device according to claim 1, wherein the protective base (5) is provided with a strip-shaped groove (16) in an inclined manner, and the tin feeding device (17) is arranged on the groove wall of the strip-shaped groove (16).
6. The pad size-based adaptive laser soldering apparatus according to claim 1, wherein the top plate (18) is a circular plate, the optical imaging recognition devices (19) are arranged in a plurality of sets on the outer peripheral wall of the top plate (18), and the plurality of sets of optical imaging recognition devices (19) are uniformly distributed along the circumference around the axis of the top plate (18).
7. A method of welding a pad size adaptive laser soldering apparatus according to any one of claims 1 to 6, comprising the steps of:
s1, setting different welding process parameters according to welding pads with different sizes, and establishing a one-to-one correspondence relationship between the welding pads and the welding process parameters;
s2, photographing through an optical imaging recognition device (19), matching shapes and images, and recognizing the size of the current bonding pad;
s3, according to the welding pad identified by the optical imaging identification device (19), selecting corresponding welding process parameters, enabling the laser transmission optical fiber (7) and the tin feeding device (17) to work for laser welding, enabling the infrared temperature measuring device (13) to work at the same time, and monitoring the real-time welding temperature of the welding spot and the periphery of the welding spot;
and S4, when the real-time welding temperature monitored by the infrared temperature measuring device (13) is higher than the upper limit value of the set temperature interval corresponding to the welding process parameter, the external control system reduces the output power of the laser transmission optical fiber (7) until the real-time welding temperature returns to the set temperature interval corresponding to the welding process parameter, otherwise, when the real-time welding temperature monitored by the infrared temperature measuring device (13) is lower than the lower limit value of the set temperature interval corresponding to the welding process parameter, the external control system increases the output power of the laser transmission optical fiber (7) until the real-time welding temperature returns to the set temperature interval corresponding to the welding process parameter.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111084930.6A CN113732423B (en) | 2021-09-16 | 2021-09-16 | Self-adaptive laser soldering device based on size of bonding pad and welding method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111084930.6A CN113732423B (en) | 2021-09-16 | 2021-09-16 | Self-adaptive laser soldering device based on size of bonding pad and welding method |
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| CN113732423A CN113732423A (en) | 2021-12-03 |
| CN113732423B true CN113732423B (en) | 2022-10-14 |
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| CN114505553B (en) * | 2022-04-11 | 2022-09-23 | 深圳市紫宸激光设备有限公司 | Laser soldering method, device and system |
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| US5449882A (en) * | 1993-03-15 | 1995-09-12 | Reliant Laser Corporation | Mirror-based laser-processing system with temperature and position control of moving laser spot |
| CN207881843U (en) * | 2018-02-02 | 2018-09-18 | 优利德科技(中国)股份有限公司 | A kind of optical mirror slip and its infrared temperature-measuring gun for infrared temperature-measuring gun |
| CN208743253U (en) * | 2018-07-18 | 2019-04-16 | 深圳市汇泽激光科技有限公司 | A kind of integrated laser cleaning electro-optical system |
| CN110524111A (en) * | 2019-08-21 | 2019-12-03 | 苏州迅镭激光科技有限公司 | A kind of laser soldering device based on dynamic combined light beam |
| CN212470114U (en) * | 2020-07-06 | 2021-02-05 | 深圳市紫宸激光设备有限公司 | Laser welding tin head with coaxial temperature measurement |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003273422A (en) * | 2002-03-13 | 2003-09-26 | Sumitomo Heavy Ind Ltd | Laser oscillating apparatus, laser processing apparatus, and laser output compensating apparatus |
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2021
- 2021-09-16 CN CN202111084930.6A patent/CN113732423B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5449882A (en) * | 1993-03-15 | 1995-09-12 | Reliant Laser Corporation | Mirror-based laser-processing system with temperature and position control of moving laser spot |
| CN207881843U (en) * | 2018-02-02 | 2018-09-18 | 优利德科技(中国)股份有限公司 | A kind of optical mirror slip and its infrared temperature-measuring gun for infrared temperature-measuring gun |
| CN208743253U (en) * | 2018-07-18 | 2019-04-16 | 深圳市汇泽激光科技有限公司 | A kind of integrated laser cleaning electro-optical system |
| CN110524111A (en) * | 2019-08-21 | 2019-12-03 | 苏州迅镭激光科技有限公司 | A kind of laser soldering device based on dynamic combined light beam |
| CN212470114U (en) * | 2020-07-06 | 2021-02-05 | 深圳市紫宸激光设备有限公司 | Laser welding tin head with coaxial temperature measurement |
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