CN113728734A

CN113728734A - Vehicle and control system thereof

Info

Publication number: CN113728734A
Application number: CN202080030163.8A
Authority: CN
Inventors: 贾鑫宇; 欧阳磊
Original assignee: SZ DJI Technology Co Ltd
Current assignee: SZ DJI Technology Co Ltd
Priority date: 2020-07-20
Filing date: 2020-07-20
Publication date: 2021-11-30
Also published as: WO2022016339A1

Abstract

A control system of a vehicle and the vehicle, the control system of the vehicle includes: the domain controller is arranged in the main body of the vehicle and used for receiving the parameters of the surrounding environment detected by a plurality of sensors of the vehicle and calculating the parameters so as to realize the control of the vehicle; the domain controller includes a housing (10) and an air-cooled structure disposed on a first side (101) of the housing and configured to direct cooling air from the first side (101) to a second side (102) opposite the first side (101) to dissipate heat generated by the domain controller. The control system of the vehicle adopts a scheme of an air cooling structure, and ensures that the domain controller works in a proper temperature range.

Description

Vehicle and control system thereof

Technical Field

The present invention relates generally to the field of automated driving, and more particularly to a vehicle and a control system for the vehicle.

Background

The autonomous driving automobile can sense the surrounding environment in a large range or even 360 degrees through multiple sensors (such as cameras, laser radars, millimeter wave radars and the like) and perform autonomous control and navigation, so that passengers are led to reach the destination. Because the perception of the automatic driving automobile to the surrounding environment depends on a more complex algorithm, the traditional automobile processor can not run the algorithm, so that after the vehicle-mounted sensors such as a laser radar, a camera, a millimeter wave radar and the like collect the surrounding environment information data of the automobile, the surrounding environment information data need to be input into a special domain controller for unified fusion and processing. The domain controller is limited by the existing hardware level, the chip carried by the domain controller has higher power consumption, and the heat productivity is very large. If the heat cannot be dissipated in time, the processing speed of the domain controller is affected, and in severe cases, downtime may be caused, and the driving feeling and the personal safety of passengers are affected. However, in order to achieve better heat dissipation of the domain controller, the existing method generally needs to arrange the heat dissipation system of the domain controller in front of and behind the entire vehicle to achieve better cooling effect, but this will put higher requirements on vehicle refitting, and will affect the space and appearance of the vehicle itself after refitting.

Therefore, how to quickly and effectively dissipate the heat of the domain controller and reduce the refitting of the vehicle becomes a problem to be solved at present.

Disclosure of Invention

The present invention has been made to solve at least one of the above problems. Specifically, the present invention provides, in one aspect, a control system of a vehicle, the control system including:

the domain controller is arranged in the main body of the vehicle and used for receiving the parameters of the surrounding environment detected by a plurality of sensors of the vehicle and calculating the parameters so as to realize the control of the vehicle;

the domain controller includes a housing and an air-cooling structure disposed at a first side of the housing and configured to guide the cooling air from the first side to a second side opposite to the first side, so as to dissipate heat generated by the domain controller.

Optionally, the domain controller comprises:

the communication structure is arranged in the shell;

and the processors are arranged around the communication structure, are in communication connection with the communication structure, and are used for receiving the parameters of the surrounding environment detected by the sensors and calculating the parameters.

Optionally, a heat dissipation structure is disposed on top of the processor and/or the communication structure.

Optionally, the heat dissipation structure comprises a plurality of plate-shaped heat dissipation fins arranged on top of the processor and/or the communication structure, the plate-shaped heat dissipation fins being spaced apart from each other and vertically arranged.

Optionally, the domain controller further comprises:

the base plate is arranged on the bottom plate of the shell and comprises a first surface and a second surface which are oppositely arranged, and the processor and the communication structure are fixedly arranged on the first surface of the base plate in a loading mode.

Optionally, a hollow first protrusion is disposed on the second surface of the substrate, a support structure is disposed on the bottom plate of the housing, and the first protrusion contacts with the support structure after the substrate is fixed on the bottom plate of the housing.

Optionally, the first protrusion is a nut, and/or the support structure is a raised cylindrical structure.

Optionally, a heat dissipation boss is further disposed on the bottom plate of the housing, wherein the heat dissipation boss is disposed below the processor and/or the communication structure.

Optionally, an elastic heat conducting element is disposed between the heat dissipation boss and the substrate, and the elastic heat conducting element fills a gap between the heat dissipation boss and the substrate.

Optionally, the resilient heat-conducting element comprises a thermally conductive grease.

Optionally, the housing is made of a metal material.

Optionally, a first number of functional devices of the domain controller is provided at the first side, and a second number of functional devices of the domain controller is provided at the second side, the first number being larger than the second number.

Optionally, the functional device of the domain controller disposed at the first side has a first height, and the functional device of the domain controller disposed at the second side has a second height, the first height being greater than the second height.

Optionally, the first side of the housing is disposed at a front end of the vehicle or a rear end disposed opposite to the front end.

Optionally, the air cooling structure includes a first wind scooper disposed outside the casing and configured to guide the cooling air into the casing.

Optionally, the air cooling structure includes a second wind scooper disposed inside the housing and configured to comb an airflow of the cooling air flowing through the domain controller.

Optionally, the second wind scooper includes a first guide plate and a second guide plate sequentially arranged from the first side to the second side, where the first guide plate is horizontally arranged, and the second guide plate is inclined downward.

Optionally, the angle between the second baffle and the horizontal plane ranges from 18 degrees to 43 degrees.

Optionally, the second air guiding hood further includes a third air guiding plate, and the third air guiding plate includes a first portion horizontally disposed and a second portion vertically disposed, where the second portion is disposed on two sides of the first portion.

Optionally, the first baffle, the second baffle, and the third baffle are integrally disposed or interconnected.

Optionally, the casing further includes a third side and a fourth side that are disposed opposite to each other, one end of the first baffle, the second baffle, and the third baffle is fixed to the third side, and/or the other end of the first baffle, the second baffle, and the third baffle is fixed to the fourth side or a heat dissipation structure at the top of the processor on the fourth side.

Optionally, the first wind scooper has a cavity structure with an opening, and an air inlet corresponding to the opening is formed in the first side surface to guide the cooling air into the housing.

Optionally, an air outlet is provided on the second side.

Optionally, the air cooling structure further includes a cooling air delivery device disposed inside the housing and at the air inlet.

Optionally, the cooling air delivery apparatus comprises a plurality of fans.

Optionally, a first deflector in the second wind scooper of the air-cooling structure is fixed to the cooling wind conveying equipment.

Optionally, the control system further comprises a solid state hard disk cartridge disposed within the housing.

Optionally, the solid state hard disk cartridge is disposed inside the second side and at the top of the housing.

Optionally, the control system further comprises a mounting bracket, and the solid-state hard disk cartridge is mounted on the mounting bracket.

Optionally, the control system further comprises a display unit configured to display an operating state of the domain controller.

Optionally, the display unit includes a display panel disposed on the top of the housing and a light guide structure disposed between the display panel and the substrate.

Optionally, the light guide structure is a transparent light guide columnar structure.

Optionally, the cooling air is cooling air generated by the vehicle refrigeration equipment.

Optionally, the upper surface of the control system is substantially flush with the ground of the vehicle trunk.

Another aspect of the invention provides a vehicle having the control system as hereinbefore described mounted in the body of the vehicle.

The control system of the vehicle adopts the scheme of the air cooling structure, introduces cooling air, obtains the optimal cooling effect by simulating and optimizing the air guide structure, and ensures that the domain controller works in a proper temperature range. The air cooling structure is portable in installation and easy to maintain; the structure is simple, and the weight and the overall dimension are relatively small; the reliability is high, and low in manufacturing cost can shorten the repacking time of vehicle greatly and reduce the repacking influence, and it is less to the dependence of vehicle arrangement, is applicable to the repacking of different motorcycle types. The improvement of the invention not only can effectively dissipate heat, but also further reduces cost.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive labor.

Fig. 1 shows a schematic diagram of the overall structure of the domain controller in one embodiment of the present invention;

fig. 2 is a schematic structural diagram showing an internal constitution of the domain controller in one embodiment of the present invention;

fig. 3 shows a schematic diagram of the installation of the processor in the domain controller in an embodiment of the present invention;

FIG. 4 is a schematic structural diagram of a bottom plate of a housing in the domain controller in one embodiment of the present invention;

fig. 5 is a schematic structural view illustrating a first wind scooper in the air-cooling structure according to an embodiment of the present invention;

fig. 6 is a schematic structural view of a second wind scooper in the air-cooling structure according to an embodiment of the present invention;

fig. 7 is a schematic structural diagram showing an internal configuration of the control system in one embodiment of the present invention.

Reference symbols of the drawings

10. Shell body

101. First side surface

102. Second side surface

103. Third side

104. The fourth side

105. Top board

106. Base plate

11. Substrate

12. Processor with a memory having a plurality of memory cells

13. Communication structure

14. Heat radiation structure

15. First bump

16. Support structure

17. Bolt

18. Heat radiation boss

19. First wind scooper

191. Opening of the container

20. Second wind scooper

201. First guide plate

202. Second guide plate

203. Third guide plate

2031. The first part

2032. The second part

21. Display unit

210. Display panel

211. Light guide structure

22. Solid state hard disk cartridge

23. Mounting bracket

24. Air inlet

25. Cooling air conveying equipment

26. Air outlet

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, exemplary embodiments according to the present invention will be described in detail below with reference to the accompanying drawings. It is to be understood that the described embodiments are merely a subset of embodiments of the invention and not all embodiments of the invention, with the understanding that the invention is not limited to the example embodiments described herein. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the invention described herein without inventive step, shall fall within the scope of protection of the invention.

In the following description, numerous specific details are set forth in order to provide a more thorough understanding of the present invention. It will be apparent, however, to one skilled in the art, that the present invention may be practiced without one or more of these specific details. In other instances, well-known features have not been described in order to avoid obscuring the invention.

It is to be understood that the present invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. As used herein, the term "and/or" includes any and all combinations of the associated listed items.

In order to provide a thorough understanding of the present invention, a detailed structure will be set forth in the following description in order to explain the present invention. Alternative embodiments of the invention are described in detail below, however, the invention may be practiced in other embodiments that depart from these specific details.

The chip carried by the domain controller of the existing automatic driving automobile has higher power consumption and very large heat productivity. If the heat cannot be dissipated in time, the processing speed of the domain controller is affected, and in severe cases, downtime may be caused, and the driving feeling and the personal safety of passengers are affected.

In order to solve the problem, the domain controller of the current automatic driving generally uses a water cooling heat dissipation technology, and besides the structure of the water cooling heat dissipation technology, the vehicle is also required to be provided with accessories such as a water pump, a water tank and a pipeline. If the common vehicle is automatically refitted, the change of the whole vehicle part is involved, the preparation period is long, and the change amount is large.

In addition, the size of the domain controller for water cooling is large, and more space in the vehicle is occupied; the weight is large, which is very unfavorable for the light weight of the automobile; in order to avoid the blockage or backflow of a waterway, the pipeline arrangement is high in requirement; most seriously, the water cooling solution suffers from poor reliability, and once the water pipe joint or the cold plate leaks, the circuit board is directly short-circuited and scrapped, so that irreparable loss is caused.

In order to solve the above problem, the present invention provides a control system of a vehicle, the control system including:

The control system of the vehicle adopts the scheme of the air cooling structure, introduces cooling air, obtains the optimal cooling effect by simulating and optimizing the air guide structure, and ensures that the domain controller works in a proper temperature range. The air cooling structure is portable in installation and easy to maintain; the structure is simple, and the weight and the overall dimension are relatively small; the reliability is high, and low in manufacturing cost can shorten the system time of reforming of vehicle greatly, and just it is less to the reliance that the vehicle arranged, is applicable to the repacking of different motorcycle types. The improvement of the invention not only can effectively dissipate heat, but also further reduces cost.

The control system of the vehicle of the present application will be described in detail with reference to fig. 1 to 7. The features of the following examples and embodiments may be combined with each other without conflict.

The control system of the vehicle is used for receiving the parameters of the surrounding environment detected by the sensors of the vehicle, performing fusion calculation on the parameters, automatically completing a series of plans, and sending a control command to the vehicle execution mechanism to realize the control of the vehicle.

The control system can be applied to vehicles, particularly unmanned automobiles, and can be further applied to mobile equipment such as unmanned planes, airplanes and ships.

For convenience of explanation and explanation of the control system of the vehicle of the present invention, a case where the control system is applied to the vehicle is mainly taken as an example.

As an example, the domain controller is disposed in a main body of a vehicle, for example, embedded in a body of the vehicle, so that the domain controller can be hidden to the maximum extent on the premise of ensuring that the domain controller can work normally, damage to the appearance and the beauty of the vehicle (for example, the vehicle) is avoided, and modification to the vehicle is reduced.

In a specific embodiment of the invention, the domain controller is arranged in a space below a trunk at the tail part of the vehicle, on one hand, cooling air generated by the vehicle is convenient to be introduced into the domain controller, and on the other hand, the modification of the vehicle is reduced.

Further, the upper surface of the control system is substantially flush with the ground of the vehicle trunk to avoid affecting normal use of the trunk.

The configuration of the domain controller, as shown in fig. 1 and 2, will be described in detail below, wherein the domain controller includes: a housing 10, an air-cooled structure, a communication structure 13, and a plurality of processors 12.

The housing 10 is configured to form an accommodating space to accommodate each functional device of the domain controller while protecting the functional device therein. In addition, the casing 10 is also used for supporting and fixing the air-cooled structure, for example, the air deflector of the air-cooled structure may be fixedly disposed on the side wall of the casing. In addition, a part of a display device may be disposed on the housing 10.

In order to satisfy the above function, the housing 10 needs to be made of a material having certain hardness, strength, light weight, and rapid heat dissipation.

In the present invention, the housing 10 may be made of a metal material, and in a specific embodiment, the housing 10 may be made of an aluminum alloy, which not only has a light weight, but also can dissipate heat quickly. It should be noted that other materials can be selected for the housing, and the selection can be performed according to actual needs.

The shape of the housing 10 may be designed according to the shape and the installation position of the vehicle, and is not limited to a specific shape, and in an embodiment of the present invention, the housing is in the shape of a square box, for example, a box in the shape of a square or a rectangular parallelepiped.

Wherein, casing 10 is formed by 6 aluminium alloy plate amalgamations, can dismantle between the 6 aluminium alloy plate to in overhaul.

In one embodiment of the present invention, the housing comprises four sides, a top plate 105 and a bottom plate 106, as shown in fig. 1, the four sides comprise a first side 101 and a second side 102 which are oppositely disposed, and a third side 103 and a fourth side 104 which are oppositely disposed.

The air cooling structure is disposed on a first side surface 101 of the housing, and is configured to guide the cooling air from the first side surface 101 to a second side surface 102 opposite to the first side surface, so as to dissipate heat generated by the domain controller.

The domain controller comprises a communication structure 13 and a plurality of processors 12, wherein the communication structure 13 and the processors 12 are arranged in the shell.

The processor 12 is configured to receive parameters of the surrounding environment detected by a plurality of sensors of the vehicle and perform a fusion calculation on the parameters, wherein the type and number of the processors 12 may be selected according to actual needs, and are not further limited herein.

The communication structure 13 may be a switch (switch) communicatively connected to the processor 12, and in an embodiment of the present invention, the communication structure 13 is a processor communication switch chip.

As shown in fig. 2, in the present invention, the processor 12 is disposed around the communication structure 13, for example, disposed around the communication structure 13, and the disposing of the processor 12 around the communication structure 13 can shorten a connection circuit between the processor 12 and the communication structure 13, reduce an area of a substrate of the domain controller, reduce a space of the domain controller, and ensure integrity and transmission of a communication signal between the processor 12 and the communication structure 13.

Besides, the processor 12 may be disposed around the communication structure 13, and the processor 12 may be disposed on the first side surface 101 in a more concentrated manner, that is, disposed upstream of the cooling air in a more concentrated manner, which is more beneficial for the cooling air to cool the processor 12 concentrated on the upstream, and is also more beneficial for heat dissipation of the entire domain controller, thereby improving heat dissipation efficiency.

In an embodiment of the present invention, as shown in fig. 2, for example, the domain controller includes seven processors 12 and one communication structure 13, wherein four processors 12 are disposed on the first side 101, i.e., upstream of the cooling wind, for example, on the first side, and are disposed side by side, and three processors 12 are disposed closer to the second side 102, for example, on the second side, and the communication structure 13 is disposed between the four processors 12 and the three processors.

In the invention, fewer or lower-height hardware devices are arranged at the downstream air inlet of the domain controller, so that the heat dissipation wind resistance is reduced.

Specifically, when the direction of the cooling wind is from the first side surface 101 to the second side surface 102, a first number of the functional devices of the domain controller are disposed on the first side surface, and a second number of the functional devices of the domain controller are disposed on the second side surface, where the first number is greater than the second number.

Meanwhile, the functional device of the domain controller disposed at the first side surface has a first height, and the functional device of the domain controller disposed at the second side surface has a second height, and the first height is greater than the second height.

Wherein the functional devices include, but are not limited to, the processor 12 and the communication structure 13. The domain controller may further include other functional devices, such as MOS transistors, functional inductors, clock chips, camera cards, network cards, GPUs, etc., which are not listed herein.

Optionally, in order to dissipate the heat generated by the above functional device more quickly and effectively in time, the present invention further provides a heat dissipation structure 14 on the functional device, for example, a heat dissipation structure 14 is provided at least on the top of the processor 12 and/or the communication structure 13.

As shown in fig. 2, the heat dissipation structure 14 is a plurality of plate-shaped heat dissipation fins disposed on the top of the processor 12 and/or the communication structure 13, wherein the plate-shaped heat dissipation fins are disposed at intervals and vertically disposed on the top of the processor 12 and/or the communication structure 13, and the intervals between the plate-shaped heat dissipation fins can be set as required.

The heat dissipation structure 14 includes a plurality of plate-shaped heat dissipation fins arranged in parallel, or adjacent plate-shaped heat dissipation fins may contact each other.

Further, the domain controller further includes: and the substrate 11 is arranged on the bottom plate 106 of the shell and is used for bearing the functional devices. Wherein, the substrate 11 includes a first surface and a second surface which are oppositely arranged, and the processor 12 and the communication structure 13 are loaded and fixed on the first surface of the substrate 11.

The substrate 11 may include various types of substrates such as a Printed Circuit Board (PCB), a ceramic substrate, a Pre-injection molding (Pre-mold) substrate, and the like, where the ceramic substrate may be an aluminum nitride substrate or an aluminum oxide substrate.

The PCB is manufactured by processing different components and various complex process technologies, and the like, wherein the PCB circuit board has a single-layer structure, a double-layer structure and a multi-layer structure, and different hierarchical structures have different manufacturing modes.

Alternatively, the printed circuit board is primarily comprised of pads, vias, mounting holes, wires, components, connectors, fills, electrical boundaries, and the like.

Further, common board Layer structures of printed circuit boards include three types, namely a Single Layer board (Single Layer PCB), a Double Layer board (Double Layer PCB) and a Multi Layer board (Multi Layer PCB), and specific structures thereof are as follows:

(1) single-layer board: i.e. a circuit board with only one side copper-clad and the other side not copper-clad. Typically, the components are placed on the side that is not copper-clad, the copper-clad side being used primarily for wiring and soldering.

(2) Double-layer plate: i.e., a circuit board with both sides copper-clad, is commonly referred to as a Top Layer (Top Layer) on one side and a Bottom Layer (Bottom Layer) on the other side. The top layer is generally used as the surface for placing components, and the bottom layer is used as the surface for welding components.

(3) Multilayer board: that is, a circuit board including a plurality of working layers includes a plurality of intermediate layers in addition to a top layer and a bottom layer, and the intermediate layers can be used as a conductive layer, a signal layer, a power layer, a ground layer, etc. The layers are insulated from each other and the connections between the layers are usually made by vias.

The printed circuit board includes many types of working layers, such as a signal layer, a protective layer, a silk-screen layer, an internal layer, and so on, which are not described herein again.

In addition, the substrate in the present application may be a ceramic substrate, in which the copper foil is directly bonded to alumina (Al) at a high temperature₂O₃) Or a special process plate on the surface (single or double side) of an aluminum nitride (AlN) ceramic substrate. The manufactured ultrathin composite substrate has excellent electrical insulation performance, high heat conduction characteristic, excellent soft solderability and high adhesion strength, can be etched into various patterns like a PCB (printed circuit board), and has great current carrying capacity.

Further, the substrate 11 may be a Pre-injection molded (Pre-mold) substrate, wherein the Pre-injection molded substrate has an injection molding wire and a pin, the injection molding wire is embedded in the main structure of the substrate, and the pin is located on a surface of the main structure of the substrate, such as an inner surface and/or an outer surface, so as to electrically connect the substrate and the functional device, respectively.

In the invention, the substrate with better heat dissipation effect can be selected. In order to further improve the heat dissipation effect, a heat sink may be further disposed between the substrate and the functional device. The material of the heat sink comprises a metal or a metallization material.

Alternatively, as shown in fig. 3 and 4, a hollow first protrusion 15 is disposed on the second surface of the substrate 11, a support structure 16 is disposed on the bottom plate of the housing, and after the substrate 11 is fixed on the bottom plate 106 of the housing, the first protrusion 15 and the support structure 16 are in contact to support the substrate 11 and prevent the substrate 11 from bending and deforming.

Further, the first protrusion 15 and the support structure 16 are in contact but are not integrally connected to each other, so that they can be quickly disassembled for repair in case of malfunction.

In an embodiment of the present invention, wherein the first protrusion 15 is a nut, for example, a nut M3 is welded on the lower surface of the PCB, the support structure 16 is a protruded column structure, for example, the support structure is a boss.

Further, a heat dissipation boss 18 is further disposed on the bottom plate 106 of the housing for dissipating heat generated by the substrate in time, wherein the heat dissipation boss 18 is disposed below the processor and/or the communication structure. For example, the heat dissipation bosses 18 are designed at the corresponding positions of the bottom plate of the chip with the heat dissipation requirement on the lower surface of the substrate PCB, and the height of the heat dissipation bosses is lower, so that components are prevented from being collided when the PCB is assembled.

In order to further improve the heat dissipation effect and prevent the gap from forming an air interlayer, an elastic heat conduction element is arranged between the heat dissipation boss 18 and the substrate 11, and the elastic heat conduction element fills the gap between the heat dissipation boss and the substrate, so that the air interlayer is eliminated, and the heat dissipation efficiency is further improved.

The elastic heat conducting element includes heat conducting grease, but is not limited to the heat conducting grease, and the elastic heat conducting element may be made of a material with elasticity and good heat conducting performance.

In the present invention, the air-cooling structure is disposed on the first side surface 101 of the housing, wherein the first side surface 101 of the housing is disposed at the front end of the vehicle or the tail end opposite to the front end. When the first side surface 101 is disposed at the front end of the vehicle, the cooling air is blown from the tail of the vehicle to the head of the vehicle; when the first side surface 101 is disposed at the tail end of the vehicle, the direction of the cooling wind is from the head of the vehicle to the tail of the vehicle, and the direction can be selected according to the position of the cooling wind.

The cooling air can be externally conveyed cooling air or cooling air generated by the vehicle.

In an embodiment of the present invention, the cooling air may be cooling air generated by a vehicle itself, wherein the first side surface 101 is disposed at an end close to the cooling air outlet. For example, when the cooling air is generated near the front end of the vehicle, the first side surface 101 is provided at the front end of the vehicle, and when the cooling air is generated near the rear end of the vehicle, the first side surface is provided at the rear end of the vehicle, so that the cooling air generated by the vehicle can be introduced into the air-cooled structure more easily.

In one embodiment of the present invention, the air conditioner of the vehicle is disposed at the rear of the vehicle, so that the first side of the housing is disposed at the rear of the vehicle, near the trunk.

The air cooling structure includes a first wind scooper 19, as shown in fig. 5, the first wind scooper 19 is disposed outside the casing 10, and is configured to guide the cooling air into the casing 10.

As shown in fig. 5, the first wind scooper is a cavity structure having an opening 191, and the first side surface 101 is provided with an air inlet 24 corresponding to the opening, as shown in fig. 7, so as to guide the cooling air into the housing.

One end of the first wind scooper 19 may be fixed to one side of the vehicle body, and the bottom of the first wind scooper is fixed to a horizontal plane of the vehicle body on which the domain controller is supported.

The first wind scooper 19 may be provided to have the opening corresponding to the wind inlet and an inlet for introducing the cooling wind into the first wind scooper, and may have a completely closed structure except for the opening and the inlet.

Further, the bottom of the first wind scooper 19 may be fixed on a horizontal plane of the vehicle body on which the domain controller is carried, so as to seal the bottom of the first wind scooper, thereby forming a sealed cavity.

In one embodiment of the present invention, the first wind scooper 19 is disposed near a right air-conditioning opening of a vehicle trunk, and the vehicle air-conditioning cool air is introduced through the first wind scooper 19.

Further, the air cooling structure further includes a second wind scooper 20, the second wind scooper 20 is disposed inside the casing 10, and the second wind scooper 20 is configured to guide a flow direction of the cooling air and comb an air flow of the cooling air flowing through the surface of the domain controller.

Further, as shown in fig. 7, an air outlet 26 is disposed on the second side surface, the first wind scooper 19 introduces cooling air into the housing 10 of the domain controller, and the second wind scooper 20 combs air flow of the cooling air flowing through the surface of the domain controller, and then the air flow is led out of the housing through the air outlet 26 on the second side surface 102, and simultaneously carries away heat emitted by the domain controller.

Further, in order to accelerate the flow of the wind speed and improve the heat dissipation effect, the air cooling structure further includes a cooling wind conveying device 25 disposed inside the casing and at the air inlet, so as to guide the cooling wind introduced by the first wind scooper 19 into the casing and accelerate the cooling wind.

Wherein the cooling air delivery apparatus includes a plurality of fans. For example 4 fans are arranged on the first side inside the housing.

In one embodiment of the present invention, 4 6025 type axial flow fans are selected. The method is characterized in that the actual use condition of the vehicle simulation fan is tested, the noise condition generated at the middle position of the front row at different rotating speeds is tested, the rotating speed is 4500-5000 hours (the duty ratio is 60% -65%), the subjective auditory sensation is good, the test value of a noise meter is 43dB, and the air cooling scheme cannot bring large noise pollution.

As shown in fig. 6 and 7, the second wind scooper 20 includes a first baffle 201, a second baffle 202, and a third baffle 203 sequentially disposed from the first side 101 to the second side 102, that is, the first baffle 201, the second baffle 202, and the third baffle 203 are sequentially disposed along the flow direction of the cooling wind.

The first baffle 201 is horizontally disposed, and is used for fixing the second wind scooper 20, for example, the second wind scooper 20 is disposed on the cooling air conveying equipment 25.

In an embodiment of the present invention, an included angle between the second flow guide plate 202 and a horizontal plane is 18 degrees to 43 degrees, for example, in an embodiment, the included angle is 27 degrees, and by continuously adjusting a height of the fan relative to the heat dissipation structure and an inclination angle of the second flow guide plate 202, a temperature of a surface of the chip heat dissipation structure is reduced to a minimum value on the premise of increasing a small amount of wind resistance, so as to achieve an optimal cooling effect, so that each device has no over-temperature at an ambient temperature of 50 ℃, and has a large margin, and the domain controller can meet normal operating conditions.

When the included angle between the second air deflector 202 and the horizontal plane is 18 degrees, the highest temperature of the control system is 51.6 degrees, when the included angle between the second air deflector 202 and the horizontal plane is 27 degrees, the highest temperature of the control system is 50.0 degrees, when the included angle between the second air deflector 202 and the horizontal plane is 43 degrees, the highest temperature of the control system is 52.1 degrees, and therefore the included angle between the second air deflector 202 and the horizontal plane ranges from 18 degrees to 43 degrees, and the temperature requirement of the control system is met.

The third baffle 203 can be arranged horizontally or obliquely, and can be selected according to the height of each functional device on the second side.

Further, the third baffle 203 includes a first portion 2031 disposed horizontally and a second portion 2032 disposed vertically, wherein the second portion 2032 is disposed on both sides of the first portion 2031, that is, the second portion 2032 is disposed adjacent to the third side 103 and the fourth side 104.

Wherein the first baffle 201, the second baffle 202 and the third baffle 203 are integrally arranged, or the first baffle 201, the second baffle 202 and the third baffle 203 are separately arranged and then integrally connected with each other.

One end of the first baffle 201, the second baffle 202, and the third baffle 203 is fixed to the third side, and/or the other end of the first baffle 201, the second baffle 202, and the third baffle 203 is fixed to the fourth side or a heat dissipation structure at the top of the processor on the fourth side.

In an embodiment of the present invention, the first guide plate 201 is disposed on the fan, one end of the first guide plate 201 is fixed to the third side or the fourth side, and the other end is fixed to one side of the fan.

In an embodiment of the invention, after the second flow guiding plate 202 and the third flow guiding plate 203 are connected to each other, one end of the second flow guiding plate is fixed to the third side or the fourth side, and the other end of the second flow guiding plate is fixed to a heat dissipation structure on the top of the processor.

Optionally, as shown in fig. 7, the control system further comprises a solid-state hard disk cartridge 22 disposed in the housing to facilitate retrieval of large amounts of data stored by the domain controller for off-line analysis.

The solid state hard disk cartridge 22 is fixed at the downwind port of the casing 10, that is, the solid state hard disk cartridge 22 is arranged inside the second side surface and is located inside the casing 10 and at the top of the casing 10.

Wherein the control system further comprises a mounting bracket 23 having an accommodating recess into which the solid state hard disk cartridge 22 is horizontally inserted.

Further, the control system further includes a display unit 21 for conveniently recognizing the operating state of the domain controller.

Optionally, the display unit 21 includes a display panel 210 disposed at the top of the housing and a light guide structure 211 disposed between the display panel and the substrate, where the light guide structure 211 is a transparent light guide columnar structure.

Further, connector plugs are arranged outside the first side face and used for achieving electric connection of all functional devices, wherein all the connector plugs are distributed along the direction from the third side face to the fourth side face. And determining the position of the connector on the board according to a circuit schematic diagram, the actual wiring requirement on the vehicle, the line end size of the connector and hardware.

Specifically, the control system of the vehicle of the embodiment of the invention is applicable to a vehicle that is mountable on a platform body of the vehicle.

The invention also provides a vehicle which is provided with the control system. The vehicle can further comprise a sensor, the mainly used sensor comprises a scanning laser radar, a visible light camera, a millimeter wave radar, an ultrasonic sensor, a wheel odometer, an IMU (inertial measurement Unit), a GPS (global positioning system) and the like, the sensing of the surrounding environment at 360 degrees without dead angles is realized, and reliable and stable environment sensing data are provided with less redundancy; the sensor calibration can be conveniently and rapidly carried out, and the requirement of real-time calibration result verification can be met. In addition, different sensors constitute a set of independent sensor modules, thereby covering specific detection areas and ranges. The information of all the sensors is integrated, the data of the surrounding environment can be obtained in real time, a driving road surface and other pedestrians and vehicles are detected, and then the control system guides the vehicles (such as vehicles) to automatically drive.

In the invention, through the improvement of the domain controller and the air cooling structure, thermal simulation software Flotherm is adopted to carry out analog simulation, and the simulation result shows that the temperature of the domain controller is reduced to the lowest to achieve the best cooling effect, and each device has no overtemperature and larger margin at the environment temperature of 50 ℃, thereby showing that the domain controller can meet the use of normal working conditions.

For the above improvement, the temperature of the control system after the improvement was measured, and the results are shown in table 1.

TABLE 1 temperature test

Under the working condition that the whole domain controller is fully loaded, the thermocouple sensors are used for measuring the temperatures of a plurality of positions in the table 1, and a plurality of devices with worst temperature resistance have no overtemperature condition in actual measurement in simulation, so that the air cooling scheme is proved to be effective, a complex water cooling scheme can be replaced, and the domain controller can work in an ideal temperature range.

In addition, noise testing was also performed on the improved control system, with the results shown in table 2.

TABLE 2 noise test

The rotating speed of the fan is adjusted to 60%, and noise decibel values are measured on the first side face and the second side face respectively, and the results are within an acceptable range of human ears. In practical measurement, the subjective auditory sensation is good, and the air cooling scheme is proved not to bring large noise pollution.

In addition, the present invention also compares the air-cooled structure and the water-cooled structure, and the results are shown in table 3.

TABLE 3 air and Water Cooling comparison

As can be seen from Table 3, the air cooling structure has the advantages of good heat dissipation effect, smaller size, lighter weight, lower cost, smaller modification change of the vehicle, better reliability and better maintenance, and meets the temperature requirement of the domain controller.

Although the illustrative embodiments have been described herein with reference to the accompanying drawings, it is to be understood that the foregoing illustrative embodiments are merely exemplary and are not intended to limit the scope of the invention thereto. Various changes and modifications may be effected therein by one of ordinary skill in the pertinent art without departing from the scope or spirit of the present invention. All such changes and modifications are intended to be included within the scope of the present invention as set forth in the appended claims.

Those of ordinary skill in the art will appreciate that the various illustrative elements and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware or combinations of computer software and electronic hardware. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the implementation. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present invention.

In the several embodiments provided in the present application, it should be understood that the disclosed apparatus and method may be implemented in other ways. For example, the above-described device embodiments are merely illustrative, and for example, the division of the units is only one logical functional division, and other divisions may be realized in practice, for example, a plurality of units or components may be combined or integrated into another device, or some features may be omitted, or not executed.

In the description provided herein, numerous specific details are set forth. It is understood, however, that embodiments of the invention may be practiced without these specific details. In some instances, well-known methods, structures and techniques have not been shown in detail in order not to obscure an understanding of this description.

Similarly, it should be appreciated that in the description of exemplary embodiments of the invention, various features of the invention are sometimes grouped together in a single embodiment, figure, or description thereof for the purpose of streamlining the invention and aiding in the understanding of one or more of the various inventive aspects. However, the method of the present invention should not be construed to reflect the intent: that the invention as claimed requires more features than are expressly recited in each claim. Rather, as the following claims reflect, inventive aspects lie in less than all features of a single disclosed embodiment. Thus, the claims following the detailed description are hereby expressly incorporated into this detailed description, with each claim standing on its own as a separate embodiment of this invention.

It will be understood by those skilled in the art that all of the features disclosed in this specification (including any accompanying claims, abstract and drawings), and all of the processes or elements of any method or apparatus so disclosed, may be combined in any combination, except combinations where such features are mutually exclusive. Each feature disclosed in this specification (including any accompanying claims, abstract and drawings) may be replaced by alternative features serving the same, equivalent or similar purpose, unless expressly stated otherwise.

Furthermore, those skilled in the art will appreciate that while some embodiments described herein include some features included in other embodiments, rather than other features, combinations of features of different embodiments are meant to be within the scope of the invention and form different embodiments. For example, in the claims, any of the claimed embodiments may be used in any combination.

The various component embodiments of the invention may be implemented in hardware, or in software modules running on one or more processors, or in a combination thereof. Those skilled in the art will appreciate that a microprocessor or Digital Signal Processor (DSP) may be used in practice to implement some or all of the functionality of some of the modules according to embodiments of the present invention. The present invention may also be embodied as apparatus programs (e.g., computer programs and computer program products) for performing a portion or all of the methods described herein. Such programs implementing the present invention may be stored on computer-readable media or may be in the form of one or more signals. Such a signal may be downloaded from an internet website or provided on a carrier signal or in any other form.

It should be noted that the above-mentioned embodiments illustrate rather than limit the invention, and that those skilled in the art will be able to design alternative embodiments without departing from the scope of the appended claims. In the claims, any reference signs placed between parentheses shall not be construed as limiting the claim. The invention may be implemented by means of hardware comprising several distinct elements, and by means of a suitably programmed computer. In the unit claims enumerating several means, several of these means may be embodied by one and the same item of hardware. The usage of the words first, second and third, etcetera do not indicate any ordering. These words may be interpreted as names.

Claims

1. A control system of a vehicle, characterized by comprising:

2. The control system of claim 1, wherein the domain controller comprises:

the communication structure is arranged in the shell;

3. The control system of claim 2, wherein a heat dissipating structure is provided on top of the processor and/or the communication structure.

4. The control system of claim 3, wherein the heat dissipating structure comprises a plurality of spaced and vertically disposed plate-like heat dissipating fins disposed on top of the processor and/or the communication structure.

5. The control system of claim 2, wherein the domain controller further comprises:

6. The control system of claim 5, wherein a first hollow protrusion is disposed on the second surface of the base plate, a support structure is disposed on the bottom plate of the housing, and the first protrusion contacts the support structure after the base plate is secured to the bottom plate of the housing.

7. The control system of claim 6, wherein the first protrusion is a nut and/or the support structure is a raised cylindrical structure.

8. The control system of claim 5, further comprising a heat sink boss disposed on the bottom plate of the housing, wherein the heat sink boss is disposed below the processor and/or the communication structure.

9. The control system of claim 8, wherein an elastic thermal conductive element is disposed between the heat dissipating boss and the base plate, the elastic thermal conductive element filling a gap between the heat dissipating boss and the base plate.

10. The control system of claim 9, wherein the resilient heat-conducting element comprises a thermally conductive grease.

11. The control system of claim 2, wherein the housing is made of a metal material.

12. Control system according to any of claims 1-11, characterized in that a first number of functional devices of the domain controller is provided at the first side and a second number of functional devices of the domain controller is provided at the second side, the first number being larger than the second number.

13. The control system according to any of the preceding claims, wherein the functional means of the domain controller arranged at the first side has a first height and the functional means of the domain controller arranged at the second side has a second height, the first height being larger than the second height.

14. The control system of any preceding claim, wherein the first side of the housing is provided at a front end of the vehicle or at a rear end disposed opposite the front end of the vehicle.

15. The control system of any one of the preceding claims, wherein the air-cooled structure comprises a first air scooper disposed outside the housing and configured to direct the cooling air into the housing.

16. The control system of any one of the preceding claims, wherein the air-cooled structure includes a second wind scooper disposed within the housing and configured to groom the airflow of the cooling air flowing through the domain controller.

17. The control system of claim 16 wherein the second wind scooper comprises a first baffle and a second baffle disposed in sequence from the first side to the second side, wherein the first baffle is disposed horizontally and the second baffle is disposed downwardly.

18. The control system of claim 17, wherein the second baffle is angled from horizontal in a range of 18 degrees to 43 degrees.

19. The control system of claim 17 wherein the second wind scooper further comprises a third deflector comprising a horizontally disposed first portion and a vertically disposed second portion, wherein the second portion is disposed on either side of the first portion.

20. The control system of claim 19, wherein the first baffle, the second baffle, and the third baffle are integrally disposed or interconnected.

21. The control system of claim 19, wherein the housing further comprises a third side and a fourth side opposite to each other, one end of the first baffle, the second baffle, and the third baffle is fixed to the third side, and/or the other end of the first baffle, the second baffle, and the third baffle is fixed to the fourth side or a heat dissipation structure on the top of the processor on the fourth side.

22. The control system of claim 15, wherein the first wind scooper is a cavity structure having an opening, and an air inlet corresponding to the opening is disposed on the first side surface to guide the cooling air into the housing.

23. The control system of claim 22, wherein an air outlet is provided on the second side.

24. The control system of claim 22, wherein the air-cooled structure further comprises a cooling air delivery device disposed inside the housing and at the air intake.

25. The control system of claim 24, wherein the cooling wind delivery apparatus comprises a plurality of fans.

26. The control system of claim 24, wherein the first baffle of the second wind scooper of the air-cooled structure is fixed to the cooling wind delivery device.

27. The control system of claim 11, further comprising a solid state hard disk cartridge disposed within the housing.

28. The control system of claim 27, wherein the solid state hard disk cartridge is disposed inside the second side and at a top of the housing.

29. The control system of claim 27, further comprising a mounting bracket on which the solid state hard disk cartridge is mounted.

30. The control system of claim 11, further comprising a display unit configured to display an operating state of the domain controller.

31. The control system of claim 30, wherein the display unit comprises a display panel disposed on top of the housing and a light guide structure disposed between the display panel and a substrate.

32. The control system of claim 31, wherein the light-guiding structure is a transparent light-guiding columnar structure.

33. The control system of any preceding claim, wherein the cooling air is refrigeration air generated by the vehicle refrigeration appliance.

34. The control system of claim 1, wherein an upper surface of the control system is substantially flush with a floor of the vehicle trunk.

35. A vehicle characterized in that the control system of one of claims 1 to 34 is installed in a main body of the vehicle.