CN113725391A - Manufacturing method of display panel, display panel and electronic equipment - Google Patents
Manufacturing method of display panel, display panel and electronic equipment Download PDFInfo
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- CN113725391A CN113725391A CN202111011150.9A CN202111011150A CN113725391A CN 113725391 A CN113725391 A CN 113725391A CN 202111011150 A CN202111011150 A CN 202111011150A CN 113725391 A CN113725391 A CN 113725391A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8428—Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
Abstract
The embodiment of the application provides a manufacturing method of a display panel, the display panel and an electronic device, and relates to the technical field of display. The organic packaging layer consists of an organic packaging cofferdam and an organic packaging film layer positioned in the organic packaging cofferdam, the organic packaging cofferdam is manufactured firstly, then the organic packaging film layer is manufactured, due to the existence of the organic packaging cofferdam, when the organic packaging film layer in the organic packaging cofferdam is manufactured, the organic packaging film layer can be in direct contact with the organic packaging cofferdam, the coffee ring effect generated by direct contact of the edge of an organic material and air in the forming process of the organic packaging film layer is weakened, the organic packaging film layer positioned in the organic packaging cofferdam can have uniform thickness, the organic packaging film layer positioned on the light-emitting device layer can be ensured to be uniformly transparent, and the display quality of the display panel is improved.
Description
Technical Field
The application relates to the technical field of display, in particular to a manufacturing method of a display panel, the display panel and electronic equipment.
Background
The display uniformity of the display panel is a key index for measuring the display quality of the display panel, but the display panel inevitably has the phenomenon of display color difference. In order to improve the display quality of the display panel, improving or reducing the display color difference is a technical problem that needs to be solved urgently by those skilled in the art.
Disclosure of Invention
In order to overcome the technical problems mentioned in the above technical background, embodiments of the present application provide a method for manufacturing a display panel, a display panel and an electronic device.
In a first aspect of the present application, a method for manufacturing a display panel is provided, where the method includes:
manufacturing a first inorganic packaging layer on the light emergent side of the light-emitting device layer;
manufacturing an organic packaging cofferdam on one side of the first inorganic packaging layer far away from the light-emitting device layer;
manufacturing an organic packaging film layer which is in contact with the organic packaging cofferdam in the organic packaging cofferdam on one side of the first inorganic packaging layer far away from the light-emitting device layer;
and manufacturing a second inorganic packaging layer on one side of the first inorganic packaging layer, the organic packaging cofferdam and the organic packaging film layer far away from the light-emitting device layer.
In the method, the organic packaging layer consists of the organic packaging cofferdam and the organic packaging film layer positioned in the organic packaging cofferdam which are respectively manufactured, the organic packaging cofferdam is manufactured firstly, and then the organic packaging film layer is manufactured, so that the organic packaging film layer positioned in the organic packaging cofferdam has uniform thickness, the organic packaging film layer positioned on the luminescent device layer can be ensured to be uniformly transparent, the display chromatic aberration caused by the non-uniform thickness of the organic packaging film layer is overcome, and the display quality of the display panel is improved.
In one possible embodiment of the present application, the display panel includes an effective display area and a non-display area surrounding the effective display area, and the step of forming an organic encapsulation dam on a side of the first inorganic encapsulation layer away from the light emitting device layer includes:
forming the organic packaging cofferdam by adopting a first organic material in the area corresponding to the non-display area of the display panel and the first inorganic packaging layer;
the step of manufacturing an organic encapsulation film layer in contact with the organic encapsulation cofferdam in the organic encapsulation cofferdam at one side of the first inorganic encapsulation layer far away from the light-emitting device layer comprises the following steps:
and forming the organic packaging film layer in the area corresponding to the effective display area of the display panel and the first inorganic packaging layer in the organic packaging cofferdam by adopting a second organic material, wherein the viscosity of the first organic material is higher than that of the second organic material.
In one possible embodiment of the present application, the step of forming the organic encapsulation dam by using a first organic material in a region corresponding to the first inorganic encapsulation layer and the non-display region of the display panel includes:
printing the first organic material to an area corresponding to a non-display area of the display panel and the first inorganic encapsulation layer by adopting an ink-jet printing mode to form the organic encapsulation cofferdam;
the step of forming the organic encapsulation film by using a second organic material in the area corresponding to the effective display area of the display panel and the first inorganic encapsulation layer in the organic encapsulation cofferdam comprises the following steps:
and printing the second organic material to an area corresponding to the effective display area of the display panel and the first inorganic packaging layer in the organic packaging cofferdam by adopting an ink-jet printing mode to form the organic packaging film.
In one possible embodiment of the present application, in the step of printing the first organic material onto the first inorganic encapsulation layer by inkjet printing to form the organic encapsulation dam in an area corresponding to the non-display area of the display panel,
the width of the formed organic encapsulation cofferdam in the direction vertical to the extension direction of the organic encapsulation cofferdam is 0.1-1% of the width of the display panel.
In one possible embodiment of the present application, the viscosity of the first organic material is in a range of 12 to 16 mpa/sec, and the viscosity of the second organic material is in a range of 20 to 25 mpa/sec.
In one possible embodiment of the present application, the first organic material and the second organic material are epoxy-based materials or acryl-based materials.
In a second aspect, an embodiment of the present application further provides a display panel, where the display panel is manufactured by the display panel manufacturing method in the first aspect, and the display panel includes a light emitting device layer and an encapsulation layer located on the light emitting device layer;
the packaging layer comprises a first inorganic packaging layer, an organic packaging layer and a second inorganic packaging layer;
the first inorganic encapsulation layer is positioned on the light emitting side of the light emitting device layer;
the organic packaging layer is positioned on one side of the first inorganic packaging layer far away from the light-emitting device layer;
the second inorganic packaging layer is positioned on one side of the organic packaging layer far away from the light-emitting device layer;
the organic packaging layer comprises an organic packaging cofferdam and an organic packaging film layer which is positioned in the organic packaging cofferdam and is in contact with the organic packaging cofferdam.
In one possible embodiment of the present application, the organic encapsulation dam and the organic encapsulation film layer have the same height in a direction perpendicular to the display surface of the display panel;
preferably, the height of the organic encapsulation cofferdam and the organic encapsulation film layer in the direction vertical to the display surface of the display panel is 8um to 12 um.
In a third aspect of the present application, there is also provided an electronic device including the display panel of the second aspect.
Compared with the prior art, the method for manufacturing the display panel, the display panel and the electronic device provided by the embodiment of the application are provided, wherein the organic packaging layer of the display panel is composed of the organic packaging cofferdam and the organic packaging film layer positioned in the organic packaging cofferdam, the organic packaging cofferdam is manufactured firstly, and then the organic packaging film layer is manufactured, due to the existence of the organic packaging cofferdam, when the organic packaging film layer in the organic packaging cofferdam is manufactured, the organic packaging film layer can be in direct contact with the organic packaging cofferdam, so that the coffee ring effect of the organic packaging film layer in the forming process is weakened, the organic packaging film layer positioned in the organic packaging cofferdam can be enabled to have uniform thickness, the organic packaging film layer positioned on the luminescent device layer can be ensured to be uniformly transparent, and the display quality of the display panel is improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained from the drawings without inventive effort.
FIG. 1 is a schematic diagram of a film layer structure of a display panel in the prior art;
FIG. 2 is a schematic diagram of another prior art film structure of a display panel;
fig. 3 is a flowchart of a method for manufacturing a display panel according to an embodiment of the present disclosure;
FIG. 4 is a process diagram corresponding to the steps shown in FIG. 3.
Fig. 5 is a schematic view of a film layer structure of a display panel according to an embodiment of the present disclosure;
FIG. 6 is a diagram illustrating a relative position relationship between an organic encapsulation layer and an active display region and a non-display region according to an embodiment of the present disclosure;
fig. 7 is a schematic view of another film structure of a display panel according to an embodiment of the present disclosure.
Reference numbers:
1-a display panel; 10A-active display area; 10B-non-display area; 11-an array substrate; 111-dikes; 12-a light emitting device layer; 13-an encapsulation layer; 131-a first inorganic encapsulation layer; 132-organic encapsulation layer; 1321-organic encapsulation cofferdam; 1322-an organic encapsulation film layer; 133-second inorganic encapsulation layer.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. The components of the embodiments of the present application, generally described and illustrated in the figures herein, can be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present application, presented in the accompanying drawings, is not intended to limit the scope of the claimed application, but is merely representative of selected embodiments of the application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present application, it should be noted that the terms "upper", "lower", and the like refer to orientations or positional relationships based on orientations or positional relationships shown in the drawings or orientations or positional relationships that the products of the application usually place when using, are only used for convenience of description and simplification of description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present application.
It should be noted that, in case of conflict, different features in the embodiments of the present application may be combined with each other.
In view of the problem of display color difference mentioned in the background art, the inventor finds that the problem of display color difference is more obvious in the area of the effective display area close to the non-display area and other areas in the effective display area. The inventors have found that, by performing a disassembly analysis on a display panel having a large amount of the display color difference, the organic encapsulating layer in the encapsulating layer of the display panel may have a non-uniform thickness.
As shown in fig. 1, the inventors further conducted research on the manufacturing process of the encapsulation layer 13 and found that the encapsulation layer 13 is generally located on the light emitting side of the light emitting device layer 12, i.e., the side of the light emitting device layer 12 away from the array substrate 11, and the encapsulation layer 13 may include a first inorganic encapsulation layer 131, a second inorganic encapsulation layer 133, and an organic encapsulation layer 132 located between the first inorganic encapsulation layer 131 and the second inorganic encapsulation layer 133. When the organic encapsulation layer 132 is manufactured, the organic ink is generally printed in the corresponding region by an inkjet printing method, specifically, the organic ink is required to be printed in the bank 111 of the display panel, wherein the bank 111 is formed when the array substrate 11 is manufactured, and when the size of the region to be printed in the bank 111 of the display panel is a B, after the organic encapsulation layer with the size of a B is printed, since the organic ink has a certain fluidity, a ring shape with a thickness higher than that of the central region of the organic encapsulation layer 132 is formed at the edge of the organic encapsulation layer 132 close to the bank 111 under the influence of the coffee ring effect (the edge region of the printed organic ink does not directly contact with the bank 111, the air contacting the edge region of the bank per unit area is larger than that of the central region of the organic ink, the evaporation rate of the edge region of the organic encapsulation layer close to the bank 111 is larger than that of the central region far away from the bank, this causes an outward capillary flow inside the organic ink, carrying the particles suspended in the organic ink to the edges of the organic ink where they are deposited in a ring). In the direction perpendicular to the display surface of the display panel 1, the edge of the organic ink may form a ring having a thickness greater than that of the central region, the height of the ring formed at the edge may exceed the height of the bank 111, and the organic ink may flow along the bank 111 after contacting the bank 111 and eventually overflow out of the bank 111 during the formation of the organic ink. After the encapsulation is completed, moisture may enter the display panel 1 through the organic encapsulation layer 132 formed by the overflowed organic ink, thereby causing the encapsulation to fail.
In order to solve the above problem, a possible implementation is to reduce the size of the printed organic ink by using a shrinking printing method, for example, when the size of the area to be printed is a × B, the actual size of the printing may be (a-a) × (B-B), where a > a and B > B. The above embodiment can solve the problem of organic ink overflow caused by the coffee ring effect, but as shown in fig. 2, since the size of the printed organic ink is smaller than the actual size to be printed, the organic ink flows around during the forming process, so that the thickness of the edge film layer of the organic encapsulation film layer 132 formed after flowing is smaller than that of the middle film layer. The above solution may cause the thickness of the organic encapsulation film 132 to be uneven, so that the same light emitted from the light emitting device layer 12 has display color difference in display.
It should be noted that the above prior art solutions have defects which are the results of practical and careful study by the inventor, therefore, the discovery process of the above technical problems and the solutions proposed by the following embodiments of the present application for the above problems should be the contribution of the inventor to the present application in the course of the invention creation process, and should not be understood as technical contents known by those skilled in the art.
In order to solve the technical problem, in the embodiment of the present application, the organic encapsulation layer is composed of an organic encapsulation cofferdam and an organic encapsulation film layer located in the organic encapsulation cofferdam, the organic encapsulation cofferdam is firstly manufactured, then the organic encapsulation film layer is manufactured, due to the existence of the organic encapsulation cofferdam, when the organic encapsulation film layer is manufactured, the organic ink used for forming the organic encapsulation film layer can be in direct contact with the organic encapsulation cofferdam, the air in contact with the edge region of the organic ink in unit area is equivalent to the central region of the organic ink, so that the coffee ring effect of the organic encapsulation film layer in the forming process is weakened, the organic encapsulation film layer located in the organic encapsulation cofferdam can have uniform thickness, and the organic encapsulation layer located on the light emitting device layer can be ensured to be uniformly transparent.
Specific implementations of the present application will be described in detail below with reference to the accompanying drawings.
First embodiment
Referring to fig. 3 and 4, fig. 3 is a schematic flow chart of a manufacturing method of a display panel, fig. 4 is a manufacturing process diagram corresponding to fig. 3, and the manufacturing method provided in this embodiment is described below with reference to fig. 3 and 4.
In step S101, a first inorganic encapsulation layer 131 is formed on the light emitting side of the light emitting device layer 12.
It can be understood that, in this embodiment, before step S101, the array substrate 11 and the light emitting device layer 12 located on the array substrate 11 may be fabricated first, where the array substrate 11 may include, but is not limited to, a substrate layer, a buffer layer, a pixel driving layer, and other film layer structures, and the light emitting device layer 12 may include, but is not limited to, an anode film layer, an organic light emitting material layer, a pixel defining layer, a cathode film layer, and other film layer structures, and since the structures of the array substrate 11 and the light emitting device layer 12 are existing structures, detailed descriptions of the fabrication processes of the two film layers are omitted here.
In step S101, the first inorganic encapsulation layer 131 may be formed on the light emitting side of the light emitting device layer by Chemical Vapor Deposition (CVD).
In step S102, an organic encapsulation dam 1321 is formed on the side of the first inorganic encapsulation layer 131 away from the light emitting device layer 12.
In this embodiment, in step S102, the organic encapsulation dam 1321 may be formed by printing on the side of the first inorganic encapsulation layer 131 away from the light emitting device layer 12 by using an Ink Jet Printing (IJP) method.
Specifically, in the embodiment of the present application, the display panel 10 may include an effective display area 10A and a non-display area 10B, and the step S102 may be implemented by specifically adopting the following manner:
the organic encapsulation dam 1321 is formed by using a first organic material in a region of the first inorganic encapsulation layer 131 corresponding to the non-display region 10B of the display panel 10.
In step S103, an organic encapsulation film 1322 is formed on the side of the first inorganic encapsulation layer 131 away from the light emitting device layer 12, and is in contact with the organic encapsulation dam 1321 in the organic encapsulation dam 1321.
In this embodiment, in step S103, an inkjet printing method may be adopted to fabricate an organic encapsulation film 1322 in contact with the organic encapsulation dam 1321 in the organic encapsulation dam 1321 on the side of the first inorganic encapsulation layer 131 away from the light emitting device layer 12.
Specifically, in the embodiment of the present application, step S103 may be implemented specifically in the following manner:
the organic encapsulating film layer 132 is formed in the organic encapsulating dam 1321 by using a second organic material in the area corresponding to the first inorganic encapsulating layer 131 and the effective display area 10A of the display panel 1.
Wherein the viscosity of the first organic material is greater than the viscosity of the second organic material.
In step S104, a second inorganic encapsulation layer 133 is formed on the first inorganic encapsulation layer 131, the organic encapsulation dam 1321 and the organic encapsulation film 1322 away from the light emitting device layer 12.
In step S104, a second inorganic encapsulation layer 133 may be formed on the first inorganic encapsulation layer 131, the organic encapsulation bank 1321 and the side of the organic encapsulation film 1322 away from the light-emitting device layer 12 by using a chemical vapor deposition method.
In the above method, the organic encapsulation layer 132 may be composed of a machine encapsulation dam 1321 and an organic encapsulation film 1322, where the organic encapsulation film 1322 is located in the organic encapsulation dam 1321. When the organic encapsulation film 1322 is manufactured, the edge of the organic ink for manufacturing the organic encapsulation film 1322 can be in contact with the organic encapsulation cofferdam 1321, so that the contact between the edge of the organic ink and air can be reduced, the influence of the coffee ring effect on the film thickness in the process of forming the organic encapsulation film 1322 by the organic ink is weakened, the organic encapsulation film 1322 with uniform thickness is formed in the organic encapsulation cofferdam 1321, the organic encapsulation film 1322 with uniform thickness is ensured to have uniform light transmittance, and the display color difference caused by the non-uniform thickness of the organic encapsulation film 1322 is further improved.
In the embodiment, the viscosity of the first organic material may be in a range of 12 to 16 mPa/s, and the viscosity of the second organic material may be in a range of 20 to 25 mPa/s. In a preferred embodiment of the present embodiment, the first organic material and the second organic material may have a larger viscosity difference, for example, the viscosity of the first organic material may be 12 mpa/sec, and the viscosity of the second organic material may be 25 mpa/sec. By such selection, the coffee ring effect of the first organic material in the process of forming the organic encapsulation cofferdam 1321 can be reduced, the film forming time of the second organic material for forming the organic encapsulation film 1322 can be shortened, and the film forming efficiency and the film forming quality of the organic encapsulation layer 132 can be improved.
Further, in the embodiment of the present application, in step S102, the width of the formed organic encapsulation dam in the direction perpendicular to the extending direction of the organic encapsulation dam may be 0.1% to 1% of the width of the display panel.
Still further, in the embodiment of the present application, the first organic material and the second organic material may be an epoxy material or an acryl material. Specifically, the first organic material and the second organic material may both be epoxy materials; or all the materials can be acrylic materials; the first organic material can also be an epoxy material, and the second organic material can be an acrylic material; the first organic material may be an acrylic material, and the second organic material may be an epoxy material.
Second embodiment
Referring to fig. 5, fig. 5 illustrates a schematic diagram of a film structure of a display panel 1 according to an embodiment of the present disclosure, where the display panel 1 is manufactured by the display panel manufacturing method according to the first embodiment, and as shown in fig. 5, the display panel 1 may include an array substrate 11, a light emitting device layer 12, and an encapsulation layer 13, which are sequentially stacked.
The encapsulation layer 13 may include a first inorganic encapsulation layer 131, an organic encapsulation layer 132 and a second inorganic encapsulation layer 133, wherein the first inorganic encapsulation layer 131 is located on the light emitting side of the light emitting device layer 12, that is, the first inorganic encapsulation layer 131 is located on the side of the light emitting device layer 12 away from the array substrate 11; the organic encapsulation layer 132 is positioned on the side of the first inorganic encapsulation layer 131 away from the light emitting device layer 12; the second inorganic encapsulation layer 133 is located on a side of the organic encapsulation layer 132 away from the light emitting device layer 12.
Further, in the embodiment of the present application, please refer to fig. 6 and 7, fig. 6 illustrates a relative position relationship diagram of the organic encapsulation layer 132, the effective display area 10A and the non-display area 10B provided in the embodiment of the present application, fig. 7 illustrates another film structure diagram of the display panel 1 provided in the embodiment of the present application, the display panel 1 may include the effective display area 10A and the non-display area 10B, wherein the non-display area 10B surrounds the effective display area 10A.
In an implementation manner of the embodiment of the present application, the organic encapsulation dam 1321 may be located in the non-display area 10B, and the organic encapsulation film 1322 is located in the active display area 10A. That is, in this embodiment, the orthographic projection of the side wall of the organic encapsulating bank 1321 on the display surface on the side facing the effective display area 10A is just coincident with the edge of the effective display area 10A.
In another implementation manner of the embodiment of the present application, the organic encapsulation dam 1321 may be located in the non-display area 10B, and the organic encapsulation film 1322 may include a first portion located in the active display area 10A and a second portion located in the non-display area 10B. That is, in this embodiment, the orthographic projection of the side wall of the organic encapsulating bank 1321 facing the effective display area 10A on the display surface may at least partially coincide with the edge of the effective display area 10A, or the orthographic projection of the side wall of the organic encapsulating bank 1321 facing the effective display area 10A on the display surface may be located outside the edge of the effective display area 10A.
In the above two embodiments, the light emitted from the light emitting device layer 12 only passes through the organic encapsulating film 1322 when passing through the organic encapsulating film 132, so that the light generated in the effective display area 10A can be uniformly transmitted when passing through the organic encapsulating film 132, and the display color difference of the display panel is improved.
Further, in the embodiment of the present application, the organic encapsulation film 1322 and the organic encapsulation dam 1321 may be formed by using an organic material (e.g., an organic ink). The viscosity of the material of the organic encapsulation film 1322 in the liquid state is lower than the viscosity of the material of the organic encapsulation dam 1321 in the liquid state. Therefore, the viscosity of the material of the organic encapsulation dam 1321 in the liquid state is relatively high, so that the organic encapsulation dam 1321 can be quickly formed when being manufactured, and the coffee ring effect caused by the flow of the organic encapsulation dam 1321 in the liquid state in the forming process is reduced. In addition, because the viscosity of the material of the organic encapsulating film 1322 is relatively low in a liquid state, it can be ensured that the material is quickly leveled in the process of manufacturing the organic encapsulating film 1322, a film structure with uniform thickness is formed, and the manufacturing efficiency of the organic encapsulating layer 132 is improved. Compared with the situation that the organic material is adopted to manufacture the organic packaging layer 132, the coffee ring effect in the process of manufacturing the organic packaging layer 132 by adopting the material with lower viscosity can be weakened, and the uniformity of the thickness of the film layer is ensured; and the film forming time in the process of manufacturing the organic encapsulation layer 132 by using a material with higher viscosity can be shortened, and the manufacturing efficiency of the organic encapsulation layer 132 is improved.
In the embodiment of the present application, the height of the organic encapsulation dam 1321 in the direction perpendicular to the display surface of the display panel 1 may be equal to (or substantially equal to) the height of the organic encapsulation film layer 1322 in the direction perpendicular to the display surface of the display panel 1.
Further, the height of the organic encapsulation dam 1321 and the height of the organic encapsulation film 1322 in the direction perpendicular to the display surface of the display panel 1 may range from 8um to 12um, and preferably, the height of the organic encapsulation dam 1321 and the height of the organic encapsulation film 1322 in the direction perpendicular to the display surface of the display panel 1 may range from 8um, 8.5um, 9.0um, 9.2um, 9.5um, and 10 um.
In the embodiment of the present application, in a plane parallel to the display surface of the display panel 1, in a direction perpendicular to the extending direction of the organic encapsulation dam 1321, the width of the organic encapsulation dam 1321 may be 0.1% to 1% of the entire width of the display panel 1. Illustratively, as shown in fig. 4, the extending direction of the organic encapsulation dam 1321 is a direction surrounding the organic encapsulation film layer 1322, the width of the organic encapsulation dam 1321 is d1, the width of the organic encapsulation film layer 1322 is d2, and then d1 is 0.1% to 1% of d 2. Preferably, the width of the organic encapsulation dam 1321 may be 0.25%, 0.5%, and 0.75% of the entire width of the display panel 1.
Specifically, the shape of the organic encapsulation dam 1321 may be the same as the shape of the effective display area 10A, and the organic encapsulation dam 1321 may extend along the edge of the effective display area 10A and be formed on the side of the first inorganic encapsulation layer 131 away from the light emitting device layer 12. Taking the effective display area 10A as a rectangle as an example, the organic encapsulation dam 1321 may be a rectangular ring, and the width of the organic encapsulation dam 1321 may correspond to the width of each side of the rectangular ring; taking the effective display area 10A as a circle, the organic encapsulation dam 1321 may be a circle, and the width of the organic encapsulation dam 1321 may correspond to the width of the circle. Due to the size setting, the organic material needed by the printed organic encapsulation cofferdam 1321 is less, and the organic encapsulation cofferdam 1321 can be quickly molded when the organic material with higher viscosity is used for printing.
In the embodiment of the present invention, the organic encapsulating film 1322 and the organic encapsulating dam 1321 may be made of an epoxy material or an acryl material. Specifically, the organic film layer 1322 and the organic encapsulation dam 1321 may be both epoxy materials; or all the materials can be acrylic materials; the material of the organic packaging film layer 1322 can also be an epoxy material, and the material of the organic packaging cofferdam 1321 is an acrylic material; the material of the organic film 1322 may be acrylic material, and the material of the organic encapsulation dam 1321 may be epoxy material.
In the embodiment of the present application, whether the materials of the organic encapsulating film 1322 and the organic encapsulating dam 1321 are the same series of materials or not, the organic encapsulating film 1322 is made of a material having lower viscosity than that of the organic encapsulating dam 1321. Optionally, the viscosity of the material of the organic encapsulation film 1322 in the liquid state may be in a range of 12 to 16 mpa/sec, and the viscosity of the material of the organic encapsulation dam 1321 in the liquid state may be in a range of 20 to 25 mpa/sec. In a preferred embodiment of the present application, the organic encapsulating film 1322 and the organic encapsulating dam 1321 may be implemented by selecting a larger viscosity difference, for example, the viscosity of the material of the organic encapsulating film 1322 in a liquid state is 12 mpa/sec, and the viscosity of the material of the organic encapsulating dam 1321 in a liquid state is 25 mpa/sec. By such selection, the coffee ring effect in the process of forming the organic encapsulation cofferdam 1321 can be reduced, the film forming time of the organic encapsulation film layer 1322 can be shortened, and the film forming efficiency and the film forming quality of the organic encapsulation layer 132 can be improved.
The embodiment of the application further provides an electronic device, the electronic device can adopt the display panel 1 described above to be used for information display, the display panel 1 can weaken the display chromatic aberration caused by the uneven thickness of the organic packaging film layer 1321, the display effect of the electronic device can be improved, the satisfaction degree of user experience is improved, and the market competitiveness of the product is increased.
In summary, in the method for manufacturing a display panel, the display panel and the electronic device provided in the embodiments of the present application, the organic encapsulation layer is composed of the organic encapsulation cofferdam and the organic encapsulation film layer located in the organic encapsulation cofferdam, the organic encapsulation cofferdam is manufactured first, and then the organic encapsulation film layer is manufactured, because of the existence of the organic encapsulation cofferdam, when the organic packaging film layer in the organic packaging cofferdam is manufactured, the organic packaging film layer can be directly contacted with the organic packaging cofferdam, therefore, the coffee ring effect generated by the direct contact of the edge of the organic material and the air in the forming process of the organic packaging film layer can be weakened, the organic packaging film layer positioned in the organic packaging cofferdam can have uniform thickness, therefore, the organic packaging film layer on the light-emitting device layer can be ensured to be uniformly transparent, the display chromatic aberration caused by the uneven thickness of the organic packaging film layer is overcome, and the display quality of the display panel is improved.
The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims (10)
1. A method for manufacturing a display panel, the method comprising:
manufacturing a first inorganic packaging layer on the light emergent side of the light-emitting device layer;
manufacturing an organic packaging cofferdam on one side of the first inorganic packaging layer far away from the light-emitting device layer;
manufacturing an organic packaging film layer which is in contact with the organic packaging cofferdam in the organic packaging cofferdam on one side of the first inorganic packaging layer far away from the light-emitting device layer;
and manufacturing a second inorganic packaging layer on one side of the first inorganic packaging layer, the organic packaging cofferdam and the organic packaging film layer far away from the light-emitting device layer.
2. The method according to claim 1, wherein the display panel comprises an effective display area and a non-display area surrounding the effective display area, and the step of forming an organic encapsulation dam on a side of the first inorganic encapsulation layer away from the light emitting device layer comprises:
forming the organic packaging cofferdam by adopting a first organic material in the area corresponding to the non-display area of the display panel and the first inorganic packaging layer;
the step of manufacturing an organic encapsulation film layer in contact with the organic encapsulation cofferdam in the organic encapsulation cofferdam at one side of the first inorganic encapsulation layer far away from the light-emitting device layer comprises the following steps:
and forming the organic packaging film layer in the area corresponding to the effective display area of the display panel and the first inorganic packaging layer in the organic packaging cofferdam by adopting a second organic material, wherein the viscosity of the first organic material is higher than that of the second organic material.
3. The method according to claim 2, wherein the step of forming the organic encapsulation dam by using a first organic material in a region of the first inorganic encapsulation layer corresponding to the non-display region of the display panel comprises:
printing the first organic material to an area corresponding to a non-display area of the display panel and the first inorganic encapsulation layer by adopting an ink-jet printing mode to form the organic encapsulation cofferdam;
the step of forming the organic encapsulation film by using a second organic material in the area corresponding to the effective display area of the display panel and the first inorganic encapsulation layer in the organic encapsulation cofferdam comprises the following steps:
and printing the second organic material to an area corresponding to the effective display area of the display panel and the first inorganic packaging layer in the organic packaging cofferdam by adopting an ink-jet printing mode to form the organic packaging film.
4. The method according to claim 3, wherein in the step of forming the organic encapsulation dam by printing the first organic material on the first inorganic encapsulation layer in a region corresponding to the non-display region of the display panel by inkjet printing,
the width of the formed organic encapsulation cofferdam in the direction vertical to the extension direction of the organic encapsulation cofferdam is 0.1-1% of the width of the display panel.
5. The method of any one of claims 2 to 4, wherein the first organic material has a viscosity in a range of 12 to 16 mPa/s, and the second organic material has a viscosity in a range of 20 to 25 mPa/s.
6. The method for manufacturing a display panel according to claim 5, wherein the first organic material and the second organic material are epoxy materials or acryl materials.
7. A display panel manufactured by the method of claim 1, the display panel comprising a light emitting device layer and an encapsulation layer on the light emitting device layer;
the packaging layer comprises a first inorganic packaging layer, an organic packaging layer and a second inorganic packaging layer;
the first inorganic encapsulation layer is positioned on the light emitting side of the light emitting device layer;
the organic packaging layer is positioned on one side of the first inorganic packaging layer far away from the light-emitting device layer;
the second inorganic packaging layer is positioned on one side of the organic packaging layer far away from the light-emitting device layer;
the organic packaging layer comprises an organic packaging cofferdam and an organic packaging film layer which is positioned in the organic packaging cofferdam and is in contact with the organic packaging cofferdam.
8. The display panel of claim 7, wherein the display panel comprises an active display area and a non-display area surrounding the active display area, wherein:
the organic packaging cofferdam is positioned in the non-display area, and the organic packaging film layer is positioned in the effective display area; or
The organic encapsulation cofferdam is positioned in the non-display area, and the organic encapsulation film layer comprises a first part positioned in the effective display area and a second part positioned in the non-display area.
9. The display panel according to claim 8, wherein the organic encapsulation dam and the organic encapsulation film layer have the same height in a direction perpendicular to a display surface of the display panel;
preferably, the height of the organic encapsulation cofferdam and the organic encapsulation film layer in the direction vertical to the display surface of the display panel is 8um to 12 um.
10. An electronic device, characterized in that the electronic device comprises a display panel according to any one of claims 7-9.
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