CN113724949B - Surface-mounted thermistor - Google Patents
Surface-mounted thermistor Download PDFInfo
- Publication number
- CN113724949B CN113724949B CN202111036334.0A CN202111036334A CN113724949B CN 113724949 B CN113724949 B CN 113724949B CN 202111036334 A CN202111036334 A CN 202111036334A CN 113724949 B CN113724949 B CN 113724949B
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- encapsulation
- membrane
- film
- packaging
- thermosensitive
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/008—Thermistors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/02—Housing; Enclosing; Embedding; Filling the housing or enclosure
Abstract
The invention provides a chip thermistor, relates to a chip thermistor which is folded and packaged during use and is convenient to transport, and belongs to the field of electrical elements. The utility model provides a through adopting in the substrate before there are two sets of resistance element, through folding substrate, forms resistance element's amalgamation, carries out the combination of resistive element, and the substrate is encapsulated simultaneously and is formed thermistor, including encapsulation subassembly, resistance element, the encapsulation subassembly is the transparent membrane of moulding, moulds the coating of membrane surface and has the encapsulation glued membrane, and resistance element divide into two sets ofly, and the symmetry inlays on the encapsulation subassembly, through along the fifty percent discount in encapsulation subassembly middle part, two sets of resistance element amalgamations form resistance element, the encapsulation subassembly includes packaging film, encapsulation glued membrane, from the type membrane, resistance element includes electrode, thermistor body.
Description
Technical Field
The invention provides a chip thermistor, relates to a chip thermistor which is folded and packaged during use and is convenient to transport, and belongs to the field of electrical elements.
Background
At present, the existing thermistor is directly packaged, the temperature sensing detection is carried out by connecting the two electrodes through a packaged structure, the packaged thermistor is prone to failure in the processes of transportation, storage and the like, and subsequent use problems are caused.
Publication No. CN101022046B discloses a thermistor element comprising a thermistor main body containing a perovskite phase of a perovskite-type crystal structure represented by the compositional formula ABO3, wherein a is at least one a-site element and B is at least one B-site element, and an anti-reduction coating covering the thermistor main body. The anti-reduction coating layer is formed of a composite oxide containing one or more of the at least one A-site element and one or more of the at least one B-site element.
Publication No. CN111418032A discloses a thermistor sensor including an intermediate laminated portion formed on a base material; and a main metal nitride film layer formed of a thermistor material of metal nitride on the intermediate laminated portion, the intermediate laminated portion including: a base thermistor layer formed of a thermistor material of metal nitride; and an intermediate oxynitride layer formed on the base thermistor layer, the main metal nitride film layer being formed on the intermediate oxynitride layer, the intermediate oxynitride layer being a metal oxynitride layer formed by oxidizing a thermistor material of the base thermistor layer right below.
Among the above-mentioned disclosed technical scheme, all be the encapsulation of accomplishing in the course of working, the easy trouble that breaks down, whole construction fault rate is high, is unfavorable for the storage transportation.
Disclosure of Invention
The invention provides a surface-mounted thermistor, which is formed by adopting two groups of resistance elements arranged in front of a base material, folding the base material to form splicing of the resistance elements, combining a resistance body and packaging the base material. Simple structure and convenient use.
The invention relates to a chip thermistor, which is realized as follows: the packaging assembly is a transparent plastic film, a packaging adhesive film is coated on the surface of the plastic film, the resistor elements are divided into two groups, the two groups of resistor elements are symmetrically embedded on the packaging assembly, and the two groups of resistor elements are spliced to form the resistor elements by folding along the middle part of the packaging assembly;
the packaging assembly comprises a packaging film, a packaging adhesive film and a release film, wherein the packaging adhesive film is arranged on the surface of the packaging film, the release film is arranged on the packaging adhesive film, side packaging hasps are arranged on the packaging film, the side packaging hasps are of strip structures extending from the edge of the packaging film and are respectively arranged on two sides of the packaging film, point cutting grooves are formed in the middle of the packaging film, creases are formed in two ends of the packaging film, the distance between the creases and the end parts of the packaging film is 1-2cm, and grooves for containing resistance elements are formed in the packaging film;
the resistance element comprises electrodes and two thermosensitive resistors, the thermosensitive resistors are embedded in the grooves of the packaging film, the thermosensitive resistors are symmetrically arranged on the packaging film, the electrodes are correspondingly arranged on the thermosensitive resistors and extend out of the packaging film, the electrodes are in lap joint with the corresponding thermosensitive resistors, and the thermosensitive resistors and the electrodes are positioned between the release film and the packaging film;
the middle part of the release film is provided with a middle penetrating belt groove, the middle part of the pulling belt penetrates through the middle penetrating belt groove, and two ends of the pulling belt extend to the end part of the release film;
the bonding surface of the thermistor body is a plane, the bonding surface is provided with a plurality of abutting blocks, the abutting blocks protrude out of the surface of the thermistor body, and the abutting blocks are distributed at equal intervals of 1-2 mm;
a thermosensitive resistor body adhesive is contained between the abutting blocks;
the thermosensitive resistors are connected through flat strips made of the same material;
the whole formed by splicing the thermosensitive resistor bodies comprises a core part and a surface layer, wherein the core part is a base material, the surface layer is a metal nitride film, and the base material is prepared from calcium carbonate, cerium dioxide, niobium pentoxide, tungsten trioxide and ytterbium trioxide;
silicone grease is arranged on the end face of the abutting block on the thermosensitive resistor body, and the coating thickness of the silicone grease is 3-5 nanometers;
the packaging adhesive film is a thermosetting adhesive.
Has the advantages that:
firstly, the resistor can be packaged before use, so that the service life of the resistor is prolonged;
the strip-shaped structure is convenient to store and store, is sealed and stored, and avoids internal oxidation and glue opening;
the transparent material can clearly know the state of the internal resistor body, so that the quality can be conveniently observed and judged;
fourthly, the structure is simple, and the use is convenient.
Drawings
Fig. 1 is a top view of a chip thermistor according to the present invention.
Fig. 2 is a side view of a chip thermistor according to the present invention.
Fig. 3 is a schematic structural diagram of a chip thermistor according to the present invention.
Fig. 4 is a schematic structural view of a release film of a chip thermistor according to the present invention.
Fig. 5 is a schematic combined structure of a chip thermistor according to the present invention.
FIG. 6 is a schematic diagram of a thermistor body of a chip thermistor according to the present invention
In the drawings:
1. an electrode; 2. packaging the film; 3. a thermistor body; 4. packaging the adhesive film; 5. a release film; 6. pulling the belt; 7. the middle part is provided with a trough; 8. a side-sealing hasp; 9. and a butting block.
Detailed Description
The invention is further described below with reference to the accompanying drawings.
According to fig. 1-6: the invention relates to a chip thermistor, which is realized as follows: the packaging assembly is a transparent plastic film, a packaging adhesive film 4 is coated on the surface of the plastic film, the resistance elements are divided into two groups and symmetrically embedded on the packaging assembly, and the two groups of resistance elements are spliced to form the resistance elements by folding along the middle part of the packaging assembly;
the packaging assembly comprises a packaging film 2, a packaging adhesive film 4 and a release film 5, wherein the packaging adhesive film 4 is arranged on the surface of the packaging film 2, the release film 5 is arranged on the packaging adhesive film 4, a side packaging hasp 8 is arranged on the packaging film 2, the side packaging hasp 8 is a strip structure extending from the edge of the packaging film 2 and is respectively arranged on two sides of the packaging film 2, a point cutting groove is arranged in the middle of the packaging film 2, folding marks are arranged at two ends of the packaging film 2, the distance between the folding marks and the end part of the packaging film 2 is 1-2cm, and a groove for accommodating a resistance element is arranged on the packaging film 2;
the resistance element comprises electrodes 1 and thermosensitive resistors 3, the thermosensitive resistors 3 are embedded in grooves of a packaging film 2, the two thermosensitive resistors 3 are symmetrically arranged on the packaging film 2, the electrodes 1 are correspondingly arranged on the thermosensitive resistors 3 and extend out of the packaging film 2, the electrodes 1 are in lap joint with the corresponding thermosensitive resistors 3, and the thermosensitive resistors 3 and the electrodes 1 are positioned between a release film 5 and the packaging film 2;
the middle part of the release film 5 is provided with a middle penetrating belt groove 7, the middle part of the pulling belt 6 penetrates through the middle penetrating belt groove 7, and two ends of the pulling belt extend to the end part of the release film 5;
the bonding surface of the thermosensitive resistor body 3 is a plane, the bonding surface is provided with a plurality of abutting blocks 9, the abutting blocks 9 protrude out of the surface of the thermosensitive resistor body 3, and the abutting blocks 9 are distributed at equal intervals with the interval of 1-2 mm;
the thermal resistor 3 adhesive is contained between the abutting blocks 9, and the adhesive can be filled between the abutting blocks 9 to fix and adhere the thermal resistor 3;
the thermosensitive resistors 3 are connected through flat strips made of the same material, can be directly separated through a release film 5 in an unfolded state of the packaging film 2, are attached through a packaging adhesive film 4, and work by matching with the electrodes 1 at two ends to form work in various forms;
the whole formed by splicing the thermosensitive resistor body 3 comprises a core part and a surface layer, wherein the core part is a base material, the surface layer is a metal nitride film, the base material is prepared by adopting calcium carbonate, cerium dioxide, niobium pentoxide, tungsten trioxide and ytterbium trioxide as raw materials, and an internal base material structure can be formed to be combined with silicone grease to form an integral adhesion;
silicone grease is arranged on the end face of the abutting blocks 9 on the thermosensitive resistor body 3, the coating thickness of the silicone grease is 3-5 nanometers, a silicone grease layer can be formed between the thermosensitive resistor bodies 3, after high temperature, the silicone grease layer between the abutting blocks 9 is hardened to form a semiconductor structure, and a coaxial axis is formed by matching with the thermosensitive resistor bodies 3;
the packaging adhesive film 4 is a thermosetting adhesive, and the packaging adhesive film 4 can form closed adhesion on the packaging film 2, so that the combination stability of the internal thermosensitive resistor 3 is improved;
during the use, through with packaging film 2 along the middle part fifty percent discount, make whole correspondence laminating, and thermistor body 3 corresponds, then through the tractive area 6 tractive, from the separation of type membrane 5 from middle part tractive, and simultaneously, packaging film 2 corresponds the bonding from the crease position, progressively from the separation of type membrane 5, make packaging film 2 form the fifty percent discount encapsulation, thermistor body 3 corresponds the laminating, derive through electrode 1, form complete resistor body, the crease at packaging film 2 both ends turns up and forms foldingly, be used for pasting fixedly, thermistor body 3 carries out the closure through closure piece 9 and fixes, and the adhesive at middle part bonds fixedly, form thermistor body 3's combination, reach the purpose that can the thermistor carries out the encapsulation and use.
The present invention and its embodiments have been described above, and the description is not intended to be limiting, and the drawings are only one embodiment of the present invention, and the actual structure is not limited thereto. In summary, those skilled in the art should appreciate that they can readily use the disclosed conception and specific embodiments as a basis for designing or modifying other structures for carrying out the same purposes of the present invention without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (8)
1. A chip thermistor, characterized in that: the packaging assembly is a transparent plastic film, a packaging adhesive film (4) is coated on the surface of the plastic film, the resistance elements are divided into two groups and symmetrically embedded on the packaging assembly, and the two groups of resistance elements are folded along the middle part of the packaging assembly to form a resistor body in a splicing manner;
the encapsulation subassembly includes encapsulation membrane (2), encapsulation glued membrane (4), from type membrane (5), encapsulation membrane (2) surface is provided with encapsulation glued membrane (4), arrange encapsulation glued membrane (4) in from type membrane (5), be provided with side encapsulation hasp (8) on encapsulation membrane (2), side encapsulation hasp (8) are the stripe structure of encapsulation membrane (2) edge extension, and arrange encapsulation membrane (2) both sides respectively in, encapsulation membrane (2) middle part is provided with some grooving, encapsulation membrane (2) both ends are provided with the crease, the crease is apart from encapsulation membrane (2) tip 1-2cm, be provided with the recess of holding resistive element on encapsulation membrane (2).
2. A chip thermistor according to claim 1, characterized in that: the resistance element comprises electrodes (1) and two thermosensitive resistors (3), wherein the thermosensitive resistors (3) are embedded in grooves of a packaging film (2), the thermosensitive resistors (3) are symmetrically arranged on the packaging film (2), the electrodes (1) are correspondingly arranged on the thermosensitive resistors (3) and extend out of the packaging film (2), the electrodes (1) are in lap joint with the corresponding thermosensitive resistors (3), and the thermosensitive resistors (3) and the electrodes (1) are located between a release film (5) and the packaging film (2).
3. A chip thermistor according to claim 1, characterized in that: from type membrane (5) middle part is provided with middle part and wears trough of belt (7), and draw string (6) middle part is passed middle part and is worn trough of belt (7), and both ends extend to from type membrane (5) tip.
4. A chip thermistor according to claim 2, characterized in that: the bonding surface of the thermosensitive resistor body (3) is a plane, the bonding surface is provided with a plurality of abutting blocks (9), the abutting blocks (9) protrude out of the surface of the thermosensitive resistor body (3), and the abutting blocks (9) are distributed at equal intervals of 1-2 mm.
5. A chip thermistor according to claim 2, characterized in that: the whole formed by splicing the thermosensitive resistor body (3) comprises a core part and a surface layer, wherein the core part is a base material, the surface layer is a metal nitride film, and the base material is prepared from calcium carbonate, cerium dioxide, niobium pentoxide, tungsten trioxide and ytterbium trioxide.
6. The chip thermistor according to claim 4, characterized in that: and a thermosensitive resistor body (3) adhesive is contained between the abutting blocks (9).
7. The chip thermistor according to claim 6, characterized in that: the end face of the abutting block (9) on the thermosensitive resistor body (3) is provided with silicone grease, and the coating thickness of the silicone grease is 3-5 nanometers.
8. A chip thermistor according to claim 1, characterized in that: the packaging adhesive film (4) is a thermosetting adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111036334.0A CN113724949B (en) | 2021-09-06 | 2021-09-06 | Surface-mounted thermistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111036334.0A CN113724949B (en) | 2021-09-06 | 2021-09-06 | Surface-mounted thermistor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113724949A CN113724949A (en) | 2021-11-30 |
| CN113724949B true CN113724949B (en) | 2022-05-17 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111036334.0A Active CN113724949B (en) | 2021-09-06 | 2021-09-06 | Surface-mounted thermistor |
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Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4328167A1 (en) * | 1993-08-21 | 1995-03-02 | Mayser Gmbh & Co | Switching arrangement |
| US6441717B1 (en) * | 1998-04-09 | 2002-08-27 | Matsushita Electric Industrial Co., Ltd. | PTC thermister chip |
| KR100628436B1 (en) * | 2005-07-15 | 2006-09-26 | 모딘코리아 유한회사 | Ptc rod assembly and pre-heater including the same |
| JP2009099654A (en) * | 2007-10-15 | 2009-05-07 | Ryoichi Shimoda | Planar temperature sensor |
| CN201331989Y (en) * | 2008-12-31 | 2009-10-21 | 上海长园维安电子线路保护股份有限公司 | Replaceable over-current protection component of double-layer chip |
| CN202749173U (en) * | 2012-07-27 | 2013-02-20 | 苏州星火电子科技有限公司 | Thermistor packaged with thin film |
| CN110140185A (en) * | 2017-01-16 | 2019-08-16 | 株式会社巴川制纸所 | Resistive element |
| CN110678941A (en) * | 2017-05-19 | 2020-01-10 | 菲尼克斯电气公司 | Isolating device for piezoresistor |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101692360B (en) * | 2009-09-10 | 2012-02-01 | 广东风华高新科技股份有限公司 | Chip type thermal resistor and manufacturing method thereof |
| IT201700065507A1 (en) * | 2017-06-13 | 2018-12-13 | Irca Spa | FLEXIBLE RESISTOR |
| CN214123623U (en) * | 2020-11-18 | 2021-09-03 | 惠州市大容电子科技有限公司 | Paster thermistor rolling device |
-
2021
- 2021-09-06 CN CN202111036334.0A patent/CN113724949B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4328167A1 (en) * | 1993-08-21 | 1995-03-02 | Mayser Gmbh & Co | Switching arrangement |
| US6441717B1 (en) * | 1998-04-09 | 2002-08-27 | Matsushita Electric Industrial Co., Ltd. | PTC thermister chip |
| KR100628436B1 (en) * | 2005-07-15 | 2006-09-26 | 모딘코리아 유한회사 | Ptc rod assembly and pre-heater including the same |
| JP2009099654A (en) * | 2007-10-15 | 2009-05-07 | Ryoichi Shimoda | Planar temperature sensor |
| CN201331989Y (en) * | 2008-12-31 | 2009-10-21 | 上海长园维安电子线路保护股份有限公司 | Replaceable over-current protection component of double-layer chip |
| CN202749173U (en) * | 2012-07-27 | 2013-02-20 | 苏州星火电子科技有限公司 | Thermistor packaged with thin film |
| CN110140185A (en) * | 2017-01-16 | 2019-08-16 | 株式会社巴川制纸所 | Resistive element |
| CN110678941A (en) * | 2017-05-19 | 2020-01-10 | 菲尼克斯电气公司 | Isolating device for piezoresistor |
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| Publication number | Publication date |
|---|---|
| CN113724949A (en) | 2021-11-30 |
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