CN113717493A - Halogen-free low-expansion-coefficient resin composition for copper-clad plate - Google Patents
Halogen-free low-expansion-coefficient resin composition for copper-clad plate Download PDFInfo
- Publication number
- CN113717493A CN113717493A CN202111053765.8A CN202111053765A CN113717493A CN 113717493 A CN113717493 A CN 113717493A CN 202111053765 A CN202111053765 A CN 202111053765A CN 113717493 A CN113717493 A CN 113717493A
- Authority
- CN
- China
- Prior art keywords
- parts
- copper
- halogen
- expansion
- resin composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 28
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims abstract description 20
- 239000005011 phenolic resin Substances 0.000 claims abstract description 20
- 229920001568 phenolic resin Polymers 0.000 claims abstract description 20
- 239000002994 raw material Substances 0.000 claims abstract description 19
- 239000003292 glue Substances 0.000 claims abstract description 11
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229910052698 phosphorus Inorganic materials 0.000 claims abstract description 10
- 239000011574 phosphorus Substances 0.000 claims abstract description 10
- PYSRRFNXTXNWCD-UHFFFAOYSA-N 3-(2-phenylethenyl)furan-2,5-dione Chemical compound O=C1OC(=O)C(C=CC=2C=CC=CC=2)=C1 PYSRRFNXTXNWCD-UHFFFAOYSA-N 0.000 claims abstract description 9
- 229920000147 Styrene maleic anhydride Polymers 0.000 claims abstract description 9
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 5
- 239000011256 inorganic filler Substances 0.000 claims abstract description 5
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 5
- 239000002904 solvent Substances 0.000 claims abstract description 5
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 claims description 18
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 18
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims description 9
- 239000010445 mica Substances 0.000 claims description 9
- 229910052618 mica group Inorganic materials 0.000 claims description 9
- 239000000843 powder Substances 0.000 claims description 9
- 229910052710 silicon Inorganic materials 0.000 claims description 9
- 239000010703 silicon Substances 0.000 claims description 9
- WGHUCJVZWJRELE-UHFFFAOYSA-N CC(C)(C1(N=CNC1(CC)CC)CC)C Chemical compound CC(C)(C1(N=CNC1(CC)CC)CC)C WGHUCJVZWJRELE-UHFFFAOYSA-N 0.000 claims description 8
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 claims description 8
- 239000000463 material Substances 0.000 abstract description 21
- 229920005989 resin Polymers 0.000 abstract description 12
- 239000011347 resin Substances 0.000 abstract description 12
- 230000007547 defect Effects 0.000 abstract description 2
- MHNMEERHZSPWFL-NSOVKSMOSA-N 4-[(1s)-1-amino-1-(3-methylimidazol-4-yl)ethyl]-2-[3-[(3s)-3-ethyl-1-methyl-2-oxoazepan-3-yl]phenoxy]benzonitrile Chemical compound C=1C=CC(OC=2C(=CC=C(C=2)[C@](C)(N)C=2N(C=NC=2)C)C#N)=CC=1[C@]1(CC)CCCCN(C)C1=O MHNMEERHZSPWFL-NSOVKSMOSA-N 0.000 abstract 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 229910052802 copper Inorganic materials 0.000 description 8
- 239000010949 copper Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 5
- 239000003063 flame retardant Substances 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 229910052736 halogen Inorganic materials 0.000 description 3
- 150000002367 halogens Chemical class 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000012779 reinforcing material Substances 0.000 description 2
- 230000008961 swelling Effects 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- WQZGKKKJIJFFOK-QTVWNMPRSA-N D-mannopyranose Chemical compound OC[C@H]1OC(O)[C@@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-QTVWNMPRSA-N 0.000 description 1
- IAJILQKETJEXLJ-UHFFFAOYSA-N Galacturonsaeure Natural products O=CC(O)C(O)C(O)C(O)C(O)=O IAJILQKETJEXLJ-UHFFFAOYSA-N 0.000 description 1
- WQZGKKKJIJFFOK-GASJEMHNSA-N Glucose Natural products OC[C@H]1OC(O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-GASJEMHNSA-N 0.000 description 1
- AEMOLEFTQBMNLQ-WAXACMCWSA-N alpha-D-glucuronic acid Chemical compound O[C@H]1O[C@H](C(O)=O)[C@@H](O)[C@H](O)[C@H]1O AEMOLEFTQBMNLQ-WAXACMCWSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- WQZGKKKJIJFFOK-VFUOTHLCSA-N beta-D-glucose Chemical compound OC[C@H]1O[C@@H](O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-VFUOTHLCSA-N 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000002522 swelling effect Effects 0.000 description 1
- 238000001757 thermogravimetry curve Methods 0.000 description 1
- 239000002341 toxic gas Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
- C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
- C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/22—Halogen free composition
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Laminated Bodies (AREA)
Abstract
The invention provides a halogen-free low-expansion-coefficient resin composition for a copper-clad plate, and relates to the technical field of copper-clad laminates. The halogen-free low-expansion-coefficient resin composition of the copper-clad plate comprises phenolic resin, phosphorus-containing phenolic resin, styrene maleic anhydride, BNE, yellow glue, a solvent, a curing agent, an inorganic filler and the like. The invention overcomes the defects of the prior art, uses less resin raw materials, effectively reduces the thermal expansion coefficient of the material, improves the heat-resisting temperature of the copper-clad plate and improves the service performance of the material while ensuring the basic dielectric property of the copper-clad plate.
Description
Technical Field
The invention relates to the technical field of copper clad laminates, in particular to a halogen-free low-expansion-coefficient resin composition for a copper clad laminate.
Background
A Copper Clad Laminate (CCL) is a plate-like material, which is simply called a Copper Clad Laminate, prepared by impregnating electronic glass fiber cloth or other reinforcing materials with resin, coating Copper foil on one or both surfaces, and performing hot pressing. Various printed circuit boards with different forms and different functions are manufactured into different printed circuits by selectively carrying out the working procedures of processing, etching, drilling, copper plating and the like on a copper-clad plate.
The traditional printed circuit board uses a large amount of materials containing halogen flame retardants to achieve a good flame retardant grade, but the halogen flame retardants generate a large amount of toxic gases during combustion to cause serious pollution to the environment, manufacturers begin to reduce the use of the halogen flame retardants at the present stage, halogen-free copper clad plate materials are gradually developed, most of the materials adopt a plurality of raw materials to prepare resin compositions to coat or impregnate a base material, however, the copper clad plate has certain requirements on performances such as dielectric loss and the like in the using process in order to achieve fineness, and the resin materials have certain thermal swelling property, and the developed resin composition with a thermal swelling coefficient at the bottom can effectively improve the use stability of the copper clad plate.
The existing copper-clad plate resin material belongs to about 3.0-4.0 under the thermal expansion, and the application number 201811511136.3 discloses a halogen-free high heat resistance resin composition for an HDI copper-clad plate, wherein a combined resin with good high temperature resistance is prepared by mixing a plurality of resin materials and auxiliary materials, the copper-clad plate prepared by the combined resin has a relatively low thermal expansion coefficient, but the thermal expansion coefficient also reaches about 2.9-3.0, and certain limitation is caused to the practical use of a printed circuit.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides the halogen-free low-expansion-coefficient resin composition for the copper-clad plate, which uses less resin raw materials, effectively reduces the thermal expansion coefficient of the material, improves the heat-resisting temperature of the copper-clad plate and improves the service performance of the material while ensuring the basic dielectric property of the copper-clad plate material.
In order to achieve the above purpose, the technical scheme of the invention is realized by the following technical scheme:
the halogen-free low-expansion-coefficient resin composition for the copper-clad plate comprises the following raw materials in parts by weight: 10-40 parts of phenolic resin, 10-35 parts of phosphorus-containing phenolic resin, 5-20 parts of styrene maleic anhydride, 15-60 parts of BNE, 1-10 parts of yellow glue, 15-70 parts of solvent, 0.2-2 parts of curing agent and 20-100 parts of inorganic filler.
Preferably, the solvent comprises the following substances in parts by weight: 10-40 parts of propylene glycol methyl ether and 5-30 parts of acetone.
Preferably, the curing agent comprises the following substances in parts by weight: dicyandiamide 0.1-1 part and dimethyl tetraethyl imidazole 0.1-1 part.
Preferably, the inorganic filler comprises the following substances in parts by weight: 5-30 parts of molten silicon, 5-20 parts of mica powder and 10-50 parts of aluminum hydroxide.
The invention provides a halogen-free low-expansion-coefficient resin composition for a copper-clad plate, which has the following advantages compared with the prior art:
(1) the invention adopts phenolic resin, phosphorus-containing phenolic resin and styrene maleic anhydride as base materials, ensures the basic performance of the product, and simultaneously mixes the yellow glue, wherein the molecular structure of the yellow glue consists of D-glucose, D-mannose and D-glucuronic acid, the secondary structure of the yellow glue is that the side chain is reversely wound around the main chain framework, and a rodlike double-helix structure is formed through a hydrogen bond system, so that the molecular chain of the yellow glue can effectively wind the molecular chain of the resin material, the curling shrinkage and expansion of the heated raw material in the later period are reduced, and the thermal expansion coefficient of the product is effectively reduced by mixing the styrene maleic anhydride, and the thermal stability of the product is improved;
(2) according to the application, propylene glycol methyl ether and acetone are used as mixed solvents, the processing performance of raw materials is improved, and molten silicon, mica powder and aluminum hydroxide are added as fillers, so that the final basic performance of the product is ensured.
Description of the drawings:
FIG. 1: a thermal mechanical analysis curve chart of the copper-clad plate prepared from the resin material in the embodiment 3;
FIG. 2: a thermogravimetric analysis curve chart of the copper-clad plate prepared from the resin material in example 3.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention are clearly and completely described below in conjunction with the embodiments of the present invention, and it is obvious that the described embodiments are some embodiments of the present invention, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1:
the halogen-free low-expansion-coefficient resin composition for the copper-clad plate comprises the following raw materials in parts by weight: 10 parts of phenolic resin, 10 parts of phosphorus-containing phenolic resin, 5 parts of styrene maleic anhydride, 15 parts of BNE, 1 part of yellow glue, 10 parts of propylene glycol methyl ether, 5 parts of acetone, 0.1 part of dicyandiamide, 0.1 part of dimethyl tetraethyl imidazole, 5 parts of molten silicon, 5 parts of mica powder and 10 parts of aluminum hydroxide.
The raw materials are mixed and stirred for 240min at the rotating speed of 500r/min at room temperature, and the resin composition is obtained.
Example 2:
the halogen-free low-expansion-coefficient resin composition for the copper-clad plate comprises the following raw materials in parts by weight: 40 parts of phenolic resin, 35 parts of phosphorus-containing phenolic resin, 20 parts of styrene maleic anhydride, 60 parts of BNE, 10 parts of yellow glue, 40 parts of propylene glycol methyl ether, 30 parts of acetone, 1 part of dicyandiamide, 1 part of dimethyl tetraethylimidazole, 30 parts of molten silicon, 20 parts of mica powder and 50 parts of aluminum hydroxide.
The raw materials are mixed and stirred for 240min at the rotating speed of 500r/min at room temperature, and the resin composition is obtained.
Example 3:
the halogen-free low-expansion-coefficient resin composition for the copper-clad plate comprises the following raw materials in parts by weight: 25 parts of phenolic resin, 20 parts of phosphorus-containing phenolic resin, 12 parts of styrene maleic anhydride, 40 parts of BNE, 5 parts of yellow glue, 25 parts of propylene glycol methyl ether, 18 parts of acetone, 0.5 part of dicyandiamide, 0.5 part of dimethyl tetraethyl imidazole, 18 parts of molten silicon, 12 parts of mica powder and 30 parts of aluminum hydroxide.
The raw materials are mixed and stirred for 240min at the rotating speed of 500r/min at room temperature, and the resin composition is obtained.
Comparative example 1:
the halogen-free low-expansion-coefficient resin composition for the copper-clad plate comprises the following raw materials in parts by weight: 25 parts of phenolic resin, 20 parts of phosphorus-containing phenolic resin, 12 parts of styrene maleic anhydride, 40 parts of BNE, 25 parts of propylene glycol methyl ether, 18 parts of acetone, 0.5 part of dicyandiamide, 0.5 part of dimethyl tetraethylimidazole, 18 parts of molten silicon, 12 parts of mica powder and 30 parts of aluminum hydroxide.
The raw materials are mixed and stirred for 240min at the rotating speed of 500r/min at room temperature, and the resin composition is obtained.
Comparative example 2:
the halogen-free low-expansion-coefficient resin composition for the copper-clad plate comprises the following raw materials in parts by weight: 25 parts of phenolic resin, 20 parts of phosphorus-containing phenolic resin, 40 parts of BNE, 5 parts of yellow glue, 25 parts of propylene glycol methyl ether, 18 parts of acetone, 0.5 part of dicyandiamide, 0.5 part of dimethyl tetraethylimidazole, 18 parts of molten silicon, 12 parts of mica powder and 30 parts of aluminum hydroxide.
The raw materials are mixed and stirred for 240min at the rotating speed of 500r/min at room temperature, and the resin composition is obtained.
Comparative example 3:
the halogen-free low-expansion-coefficient resin composition for the copper-clad plate comprises the following raw materials in parts by weight: 25 parts of phenolic resin, 20 parts of phosphorus-containing phenolic resin, 40 parts of BNE, 25 parts of propylene glycol methyl ether, 18 parts of acetone, 0.5 part of dicyandiamide, 0.5 part of dimethyl tetraethylimidazole, 18 parts of molten silicon, 12 parts of mica powder and 30 parts of aluminum hydroxide.
The raw materials are mixed and stirred for 240min at the rotating speed of 500r/min at room temperature, and the resin composition is obtained.
And (3) detection:
coating the resin compositions prepared in the above examples 1 to 3 and comparative examples 1 to 3 on a reinforcing material, baking at 130 ℃ for 2min to obtain a film, cutting the film into 20 x 20cm pieces, cutting 5 pieces, and pressing to obtain a laminated board for performance detection:
the laminates made from the materials of examples 1-3 were tested for dielectric constant (Dk) and dielectric loss tangent (Df), and the results are shown in table 1 below:
table 1:
the laminates obtained in examples 1 to 3 and comparative examples 1 to 3 were tested for their properties, and the results are shown in Table 2 below:
table 2:
when the laminate made of the material of example 3 is subjected to TGA test, the TD thereof is 401.15 (as shown in fig. 2), and as summarized above, the resin material made in the present application has a lower thermal swelling coefficient, which is a significant improvement over the prior art.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
The above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (4)
1. The halogen-free low-expansion-coefficient resin composition for the copper-clad plate is characterized by comprising the following raw materials in parts by weight: 10-40 parts of phenolic resin, 10-35 parts of phosphorus-containing phenolic resin, 5-20 parts of styrene maleic anhydride, 15-60 parts of BNE, 1-10 parts of yellow glue, 15-70 parts of solvent, 0.2-2 parts of curing agent and 20-100 parts of inorganic filler.
2. The halogen-free low-expansion-coefficient resin composition for copper-clad plates according to claim 1, wherein the solvent comprises the following components in parts by weight: 10-40 parts of propylene glycol methyl ether and 5-30 parts of acetone.
3. The halogen-free low-expansion-coefficient resin composition for copper-clad plates according to claim 1, wherein the curing agent comprises the following components in parts by weight: dicyandiamide 0.1-1 part and dimethyl tetraethyl imidazole 0.1-1 part.
4. The halogen-free low-expansion-coefficient resin composition for copper-clad plates according to claim 1, wherein the inorganic filler comprises the following components in parts by weight: 5-30 parts of molten silicon, 5-20 parts of mica powder and 10-50 parts of aluminum hydroxide.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111053765.8A CN113717493A (en) | 2021-09-09 | 2021-09-09 | Halogen-free low-expansion-coefficient resin composition for copper-clad plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111053765.8A CN113717493A (en) | 2021-09-09 | 2021-09-09 | Halogen-free low-expansion-coefficient resin composition for copper-clad plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113717493A true CN113717493A (en) | 2021-11-30 |
Family
ID=78682783
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111053765.8A Pending CN113717493A (en) | 2021-09-09 | 2021-09-09 | Halogen-free low-expansion-coefficient resin composition for copper-clad plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113717493A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101928444A (en) * | 2010-08-20 | 2010-12-29 | 广东生益科技股份有限公司 | Halogen-free thermosetting resin composition, prepreg and metal clad foil laminated plate manufactured by using same |
| CN102633990A (en) * | 2012-04-05 | 2012-08-15 | 广东生益科技股份有限公司 | Epoxy resin composition, prepreg made of epoxy resin composition and copper-coated laminate made of epoxy resin composition |
| CN106433124A (en) * | 2016-10-17 | 2017-02-22 | 无锡宏仁电子材料有限公司 | Halogen-free resin composition containing ester curing agent for high-frequency and high-speed printed-circuit board |
| CN108250675A (en) * | 2016-12-28 | 2018-07-06 | 广东生益科技股份有限公司 | A kind of phosphorous active ester and its halogen-free composition and copper clad foil substrate |
| CN108250676A (en) * | 2016-12-28 | 2018-07-06 | 广东生益科技股份有限公司 | A kind of phosphorous active ester and its halogen-free composition and copper clad foil substrate |
| CN111019346A (en) * | 2019-12-26 | 2020-04-17 | 艾蒙特成都新材料科技有限公司 | Flame-retardant high-heat-resistance resin composition, copper-clad plate and preparation method thereof |
-
2021
- 2021-09-09 CN CN202111053765.8A patent/CN113717493A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101928444A (en) * | 2010-08-20 | 2010-12-29 | 广东生益科技股份有限公司 | Halogen-free thermosetting resin composition, prepreg and metal clad foil laminated plate manufactured by using same |
| CN102633990A (en) * | 2012-04-05 | 2012-08-15 | 广东生益科技股份有限公司 | Epoxy resin composition, prepreg made of epoxy resin composition and copper-coated laminate made of epoxy resin composition |
| CN106433124A (en) * | 2016-10-17 | 2017-02-22 | 无锡宏仁电子材料有限公司 | Halogen-free resin composition containing ester curing agent for high-frequency and high-speed printed-circuit board |
| CN108250675A (en) * | 2016-12-28 | 2018-07-06 | 广东生益科技股份有限公司 | A kind of phosphorous active ester and its halogen-free composition and copper clad foil substrate |
| CN108250676A (en) * | 2016-12-28 | 2018-07-06 | 广东生益科技股份有限公司 | A kind of phosphorous active ester and its halogen-free composition and copper clad foil substrate |
| CN111019346A (en) * | 2019-12-26 | 2020-04-17 | 艾蒙特成都新材料科技有限公司 | Flame-retardant high-heat-resistance resin composition, copper-clad plate and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101508083B1 (en) | Halogen-free resin composition and method for fabricating halogen-free copper clad laminate using the same | |
| CN101684191B (en) | Halogen-less high frequency resin composition, and prepreg and laminate manufacturing by using same | |
| CA1056541A (en) | Heat-resistant resin composition comprising polyaminobismaleimide, polyepoxy compound and aromatic vinyl copolymer and method for using the same | |
| AU2011376206B2 (en) | Halogen-free resin composition and method for preparation of copper clad laminate with same | |
| CN102618033B (en) | Composition, LED (light-emitting diode) circuit board substrate comprising same and preparation method thereof | |
| KR101887841B1 (en) | Organosilicon resin composition and prepreg using it, laminate, copper-clad laminate and aluminum substrate | |
| JP6998527B2 (en) | Resin composition, prepreg, metal-clad laminate and printed wiring board | |
| CN108219371B (en) | Epoxy resin composition, prepreg, laminate, and printed wiring board | |
| AU2014411039B2 (en) | Halogen-free resin composition and prepreg and laminated board prepared therefrom | |
| CN101914265A (en) | A kind of non-halogen phosphorus-containing flame retardant high-frequency epoxy resin based composition and the application in bonding sheet and copper-clad plate thereof | |
| CN111378243B (en) | Multifunctional modified resin blended prepreg hydrocarbon composition, application thereof and method for preparing high-frequency high-speed copper-clad plate by using same | |
| CN105566621A (en) | Composition and preparation method of low-dielectric phosphorus-containing polyester compound | |
| AU2014411037A1 (en) | Thermosetting resin composition and prepreg and laminated board prepared therefrom | |
| CN109749396B (en) | Polyphenyl ether resin composition and application thereof | |
| JP2017031276A (en) | Thermosetting resin composition, resin varnish, metal foil with resin, resin film, metal clad laminated board and printed wiring board using the same | |
| WO2015101233A1 (en) | Halogen-free epoxy resin composition and use thereof | |
| CN113978061A (en) | Preparation method of copper-clad plate with low dielectric constant, low dielectric loss and low CTE | |
| CN113844129A (en) | Preparation method of halogen-free copper-clad plate with low dielectric loss and high heat resistance | |
| CN108219134B (en) | Prepolymer and resin composition of modified composite bismaleimide resin, and prepreg and laminated board manufactured by using prepolymer and resin composition | |
| CN113717493A (en) | Halogen-free low-expansion-coefficient resin composition for copper-clad plate | |
| TWI596155B (en) | Halogen-free thermosetting resin composition and prepreg and printed circuit laminate using the same | |
| CN108192281A (en) | A kind of halogen-free thermosetting resin composite and use its prepreg, laminate, metal-clad laminate and printed circuit board | |
| CN108047647A (en) | A kind of halogen-free thermosetting resin composite and use its prepreg, laminate, metal-clad laminate and printed circuit board (PCB) | |
| CN114644824A (en) | Flame-retardant polyphenyl ether resin composition, copper-clad plate and preparation method thereof | |
| TWI548693B (en) | Polyphenylene ether modified phenol-benzaldehyde multifunctional epoxy resin and use |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |