CN113708600A - High-frequency current source switch DC converter - Google Patents
High-frequency current source switch DC converter Download PDFInfo
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- CN113708600A CN113708600A CN202110819091.1A CN202110819091A CN113708600A CN 113708600 A CN113708600 A CN 113708600A CN 202110819091 A CN202110819091 A CN 202110819091A CN 113708600 A CN113708600 A CN 113708600A
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- 238000006243 chemical reaction Methods 0.000 claims abstract description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 12
- 238000001816 cooling Methods 0.000 claims abstract description 11
- 230000000694 effects Effects 0.000 claims abstract description 11
- 230000017525 heat dissipation Effects 0.000 claims abstract description 10
- 239000007788 liquid Substances 0.000 claims description 24
- 238000000034 method Methods 0.000 claims description 13
- 230000009977 dual effect Effects 0.000 claims description 2
- 230000002035 prolonged effect Effects 0.000 abstract description 4
- 230000005540 biological transmission Effects 0.000 abstract description 2
- 239000000110 cooling liquid Substances 0.000 description 4
- 230000003321 amplification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000003199 nucleic acid amplification method Methods 0.000 description 2
- 230000000087 stabilizing effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J7/00—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
- H02J7/0029—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries with safety or protection devices or circuits
- H02J7/00309—Overheat or overtemperature protection
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J7/00—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
- H02J7/0042—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries characterised by the mechanical construction
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J7/00—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
- H02J7/0063—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries with circuits adapted for supplying loads from the battery
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M3/00—Conversion of dc power input into dc power output
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20909—Forced ventilation, e.g. on heat dissipaters coupled to components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20927—Liquid coolant without phase change
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J2207/00—Indexing scheme relating to details of circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
- H02J2207/20—Charging or discharging characterised by the power electronics converter
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Dc-Dc Converters (AREA)
Abstract
The invention discloses a high-frequency current source switch DC converter, comprising: the integrated device comprises an integrated shell, a double-channel supercharging mechanism, a cut-off mechanism and an internal heat dissipation mechanism are respectively and fixedly arranged in the integrated shell, a water cooling mechanism is fixedly arranged at the top of the integrated shell, after the voltage frequency is transmitted by the display screen, the start key on the controller is manually pressed, the information enters the processor through the transmission of the data connecting line in the power-on wire pipe, the GPU body issues a command to block the output channel, force the unconditional current to enter the magnetic lantern ring B, apply the secondary pressurization by using the conversion coil on the magnetic lantern ring B, when the preset value of the working of the carrier equipment is reached, the output channel is opened and acts in the carrier equipment, the device has the capacity of voltage processing twice through the conditions, and the current after secondary pressurization, the impact activity is higher, so that the service time of the carrier equipment is prolonged, and the working efficiency of the equipment is further increased.
Description
Technical Field
The invention relates to the technical field of converter equipment, in particular to a high-frequency current source switch direct current converter.
Background
A DC converter is a voltage converter that converts an input voltage and then effectively outputs a fixed voltage. DC/DC converters are divided into three categories: a step-up DC/DC converter, a step-down DC/DC converter, and a step-up/step-down DC/DC converter. Three types of control can be used as required. The PWM control type is efficient and has good output voltage ripple and noise. The PFM control type has an advantage of low power consumption even when used for a long time, particularly when used under a small load. The PWM/PFM switching type PFM control is carried out at the time of a small load, and is automatically switched to the PWM control at the time of a heavy load. DC-DC converters are widely used in products such as mobile phones, MP3, digital cameras, portable media players, and the like. Belonging to chopper circuits in circuit type classification.
The existing high-frequency current source switch direct current converter has the characteristics of equipment, the internal battery of a carrier can be supercharged, the service life of the equipment is prolonged, most of the existing devices adopt a single-wire processing mode, voltage conversion of different parts can not be carried out, the internal coordination regulation capacity is poor, when the single-wire supercharging process does not reach a limit value, the secondary processing process can not be carried out, the existing devices have limited cooling capacity for internal chips, the GPU chip is easily influenced by high temperature to reduce the voltage conversion rate, and the efficiency of the whole working process is slow.
We therefore propose a high frequency current source switching dc converter in order to solve the problems set out above.
Disclosure of Invention
The invention aims to provide a high-frequency current source switch direct-current converter, which aims to solve the problem that secondary boosting cannot be carried out when the voltage does not reach a rated value in the single-wire conversion process in the background technology.
In order to achieve the purpose, the invention provides the following technical scheme: a high frequency current source switching dc converter comprising: the integrated air conditioner comprises an integrated shell, a water cooling mechanism and a water inlet pipe, wherein a double-channel supercharging mechanism, a shutoff mechanism and an internal heat dissipation mechanism are respectively and fixedly arranged in the integrated shell, and the top of the integrated shell is fixedly provided with the water cooling mechanism;
the two-channel boosting mechanism is used for effectively collecting and converting the voltage of a battery inside the equipment, wherein: the circuit board comprises a circuit board body, wherein the top of the circuit board body is respectively provided with two mounting grooves A and two mounting grooves B, the inner wall bottom of the mounting grooves A is respectively fixedly provided with a voltage input device A and a voltage input device B, one side of the outer wall of an integrated shell is provided with two grooves A, the inner surface walls of the two grooves A are respectively fixedly provided with a wiring plugboard A and a wiring plugboard B, one sides of the outer walls of the wiring plugboard A and the wiring plugboard B, which are far away from the integrated shell, are respectively provided with a group of electrifying jacks, the top of the circuit board body is respectively fixedly provided with a magnetic lantern ring A and a magnetic lantern ring B, the outer surfaces of the magnetic lantern ring A and the magnetic lantern ring B are respectively fixedly sleeved with a conversion coil, the inner bottoms of the two mounting grooves B are respectively fixedly provided with a voltage output device A and a voltage output device B, one side of the outer wall of the integrated shell, which is close to the voltage output device A, is provided with two grooves B, the inner surface walls of the two grooves B are respectively and fixedly provided with a processing plugboard A and a processing plugboard B, and one sides of the outer walls of the processing plugboard A and the processing plugboard B, which are far away from the collective shell, are respectively and fixedly provided with a group of electrifying contact pins;
the mechanism that dams is used for the not good frequency channel of single line voltage treatment effect, restricts its output, carries out the secondary pressure boost, wherein: the intelligent control device comprises a controller, the positive surface of controller is provided with display screen and start key respectively, fixed intercommunication has the order spool between the rear surface of controller and the exterior wall of the magnetic sleeve ring A, fixed intercommunication has the circular telegram pipe between the exterior wall of the magnetic sleeve ring A and the magnetic sleeve ring B, the fixed GPU body that is provided with in top of circuit bottom plate.
Preferably, a plurality of heat carrying scales are fixedly inserted into the top of the collective housing, and the tops of the plurality of heat carrying scales are in contact with the bottom of the circuit bottom plate.
Preferably, the water cooling mechanism is used for controlling the temperature of the GPU body on the processor, wherein: the liquid conveying device comprises a top plate, wherein a groove C is formed in the bottom of the top plate, and a liquid conveying plate is fixedly mounted at the top of the inner wall of the groove C.
Preferably, the bottom of the liquid transport plate is fixedly provided with a support frame, the center of the bottom of the support frame is fixedly inserted with a motor A, and the output end of the motor A is fixedly provided with a fan A.
Preferably, the bottom of the liquid conveying plate is fixedly communicated with a liquid conveying pipe, the output end of the liquid conveying pipe is fixedly communicated with a reactor, and the bottom of the reactor is fixedly arranged at the top of the GPU body.
Preferably, the internal heat dissipation mechanism is used for dissipating heat generated by all elements inside the collective housing, wherein: two include mounting groove C, two the equal fixed mounting of mounting groove C's interior table wall has the mounting panel, two the round hole has all been seted up, two to the positive surface and the rear surface of mounting panel the equal fixed difference in surface of mounting panel is equipped with L type frame, two the inside of L type frame is all fixed to be inserted and is equipped with motor B, two the equal fixed mounting of motor B's output has fan B.
Preferably, two the equal fixed mounting of interior table wall of mounting groove C has the baffle, two the outer wall of baffle is kept away from collective shell's one side and is all seted up a set of air-out groove.
Preferably, the bottom of the circuit bottom board is fixedly arranged at the bottom of the inner wall of the collective shell, the rear surface of the controller is fixedly arranged on the front surface of the collective shell, the outer surface of the top board is fixedly arranged on the top of the collective shell, and the two mounting grooves C are respectively arranged on the front surface and the rear surface of the collective shell.
Compared with the prior art, the invention has the beneficial effects that:
1. the invention carries out final processing by stabilizing the voltage frequency in the voltage follower A and the voltage follower B in the mounting groove B after the voltage in the two channels reaches the preset value, in the process, the number of the channels in the device is increased to replace the existing single-wire processing mode, the voltage amplification in the battery of the carrier equipment is accelerated, when the voltage in the single wire does not reach the preset value of working in the processing process, a data connecting wire in a command wire tube is connected with a controller, after the voltage frequency is transmitted by a display screen, a start key on the controller is manually pressed, information enters the processor through the transmission of the data connecting wire in a power-on wire tube, a GPU body issues a command to separate the output channel, current which does not reach the condition is forced to enter a magnetic lantern ring B, secondary pressurization is carried out by using a conversion coil on the magnetic lantern ring, the output channel is started after the preset value of working of the carrier equipment is reached, the device has the capacity of voltage treatment twice through the conditions, the impact activity is higher through the current after secondary pressurization, the service time of the carrier equipment is prolonged, and the working efficiency of the equipment is further increased.
2. According to the invention, the reactor connected to the GPU body is started, the liquid transport plate at the bottom of the top plate starts to operate, the motor A fixed on the support frame is started to drive the fan A to rotate, the generated cold air acts on the bottom of the liquid transport plate to continuously cool the internal cooling liquid, the cooling liquid enters the ground of the reactor through the transportation of the liquid transport pipe in the starting process of the reactor, the low temperature acts on the bottom of the reactor and cools the GPU body, and the GPU body is effectively cooled through the conditions, so that the problem of slow working efficiency caused by high temperature is prevented.
3. According to the invention, the motor B on the L-shaped frame is started to drive the fan B to rotate, mixed air is adsorbed into the circular hole and then enters the air exhaust device through the air outlet groove on the baffle plate, so that the speed of the air in the device is accelerated, and the heat dissipation effect of the device is improved.
Drawings
FIG. 1 is a perspective view of the main structure of a high-frequency current source switch DC converter according to the present invention;
FIG. 2 is a perspective view of the high frequency current source switch DC converter of the present invention, which is a side view of the mechanism of FIG. 1;
FIG. 3 is a perspective view of the bottom structure of the high frequency current source switch DC converter of FIG. 1;
FIG. 4 is a perspective view of the high frequency current source switch DC converter of the present invention in an air-cooled structure;
FIG. 5 is an enlarged perspective view of the high frequency current source switch DC converter of the present invention at A in FIG. 1;
fig. 6 is an enlarged perspective view of the high-frequency current source switch dc converter of the present invention at the position B in fig. 1.
In the figure: 1. a collective housing; 2. a dual channel booster mechanism; 21. a circuit substrate; 22. mounting grooves A; 23. mounting grooves B; 24. a voltage input device A; 25. a voltage input device B; 26. a magnetic collar A; 27. a magnetic collar B; 28. a voltage follower A; 29. a voltage follower B; 210. a wiring plugboard A; 211. a wiring plug board B; 213. processing the plugboard A; 214. processing the plugboard B; 3. a shut-off mechanism; 31. a controller; 32. a display screen; 33. a start key; 34. a command line pipe; 35. a power-on wire tube; 36. a processor; 37. a GPU body; 4. heat-carrying scale; 5. a water cooling mechanism; 51. a top plate; 52. a liquid transport plate; 53. a support frame; 54. a motor A; 55. a fan A; 56. a liquid conveying pipe; 57. a reactor; 6. an internal heat dissipation mechanism; 61. mounting a groove C; 62. mounting a plate; 63. an L-shaped frame; 64. a circular hole; 65. a motor B; 66. a fan B; 67. a baffle plate; 68. and (4) an air outlet groove.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-6, the present invention provides a technical solution: a high frequency current source switching dc converter comprising: the integrated shell 1, the inside of integrated shell 1 is fixed respectively and is provided with binary channels booster mechanism 2, cut-off mechanism 3 and inside heat dissipation mechanism 6, and the fixed water cooling body 5 that is provided with in top of integrated shell 1.
As shown in fig. 1-3 and 5: the two-channel boost mechanism 2 is used for efficient collection and conversion of the battery voltage inside the device, wherein: the integrated circuit comprises a circuit bottom plate 21, the top of the circuit bottom plate 21 is respectively provided with two mounting grooves A22 and a mounting groove B23, the bottoms of the inner walls of two mounting grooves A22 are respectively and fixedly provided with a voltage input device A24 and a voltage input device B25, one side of the outer wall of an integrated housing 1 is provided with two grooves A, the inner surface walls of the two grooves A are respectively and fixedly provided with a wiring plugboard A210 and a wiring plugboard B211, one sides of the outer walls of the wiring plugboard A210 and the wiring plugboard B211, which are far away from the integrated housing 1, are respectively provided with a group of electrifying jacks, the top of the circuit bottom plate 21 is respectively and fixedly provided with a magnetic lantern ring A26 and a magnetic lantern ring B27, the outer surfaces of the magnetic lantern ring A26 and the magnetic lantern ring B27 are respectively and fixedly provided with conversion coils, the inner bottoms of the two mounting grooves B23 are respectively and fixedly provided with a voltage output device A28 and a voltage output device B29, one side of the outer wall of the integrated housing 1, which is close to the voltage output device A28, is provided with two grooves B, and the interior table wall of two recesses B is fixed mounting respectively has handles picture peg A213 and handles picture peg B214, and the outer wall of handling picture peg A213 and handling picture peg B214 all is fixed to be provided with a set of circular telegram contact pin in one side of keeping away from collective shell 1, and the mechanism 3 that dams is used for the not good frequency channel of single line voltage treatment effect, limits its output, carries out the secondary pressure boost, wherein: the intelligent control device comprises a controller 31, a display screen 32 and a start key 33 are respectively arranged on the front surface of the controller 31, a command line pipe 34 is fixedly communicated between the rear surface of the controller 31 and the outer wall of a magnetic lantern ring A26, a power line pipe 35 is fixedly communicated between the outer wall of a magnetic lantern ring A26 and the outer wall of a magnetic lantern ring B27, a GPU body 37 is fixedly arranged on the top of a circuit bottom plate 21, a plurality of heat carrying scales 4 are fixedly inserted in the top of a collective housing 1, and the tops of the heat carrying scales 4 are in contact with the bottom of the circuit bottom plate 21.
The effect that its whole binary channels booster mechanism 2 and the mechanism 3 that dams reached does: firstly, the device is installed on a carrier device, the device and the carrier device are communicated in an electric connection mode, when the voltage of a battery in the carrier device is lower than a preset value of an output structure, the voltage is connected into a power-on jack in a voltage input device A24 and a voltage input device B25 through an external wire of the carrier device, weak frequency range voltage is firstly transmitted into the voltage input device A24 and then enters a magnetic lantern ring A26 and a magnetic lantern ring B27, low voltage passes through the movement of tracks of multiple turns through conversion coils on the two devices, the movement of electrons per se is in an accelerated state, when the low turns enter, the generated current intensity is increased, when the voltages in the two channels reach the preset value, the voltage output device A28 and the voltage output device B29 in an installation groove B23 are subjected to final treatment for stabilizing voltage frequency, and in the process, the number of the channels in the device is increased, the method replaces the existing single wire processing mode, accelerates the voltage amplification inside the battery of the carrier device, when the voltage in the single wire does not reach the preset value of working in the processing process, the data connecting wire in the command wire pipe 34 is connected with the controller 31, after the voltage frequency is transmitted by the display screen 32, the start key 33 on the controller 31 is manually pressed, the information is transmitted into the processor 36 through the data connecting wire in the electrifying wire pipe 35, the GPU body 37 issues a command to block an output channel, current which does not reach the condition is forced to enter the magnetic lantern ring B27, the conversion coil on the GPU is used for secondary pressurization, when the preset value of working of the carrier device is reached, the output channel is opened and acts in the carrier device, the device has the capacity of twice voltage processing through the condition, and the impact activity is higher through the current after the secondary pressurization, the service time of the carrier equipment is prolonged, and the working efficiency of the equipment is further increased.
According to fig. 1 and 4: the water cooling mechanism 5 is used for performing temperature control processing on the GPU body 37 on the processor 36, wherein: including roof 51, roof 51's bottom is seted up flutedly C, and recess C's inner wall top fixed mounting has liquid transport board 52, liquid transport board 52's bottom fixed mounting has support frame 53, support frame 53's bottom center department is fixed to be inserted and is equipped with motor A54, motor A54's output fixed mounting has fan A55, liquid transport board 52's fixed intercommunication in bottom has fortune liquid pipe 56, the fixed intercommunication of output of fortune liquid pipe 56 has reactor 57, the fixed top that sets up at GPU body 37 in bottom of reactor 57.
The whole water cooling mechanism 5 has the following effects: when the device is used for carrying out secondary pressurization, the GPU body 37 is used for working, a large amount of heat can be generated by internal threads in the process, the reactor 57 connected to the GPU body 37 is started, the liquid transport plate 52 at the bottom of the top plate 51 starts to operate, the motor A54 fixed on the supporting frame 53 is started to drive the fan A55 to rotate, generated cold air acts on the bottom of the liquid transport plate 52 and continuously cools the internal cooling liquid, in the starting process of the reactor 57, the cooling liquid enters the reactor 57 through the transportation of the liquid transport pipe 56, low temperature acts on the bottom of the reactor 57 and cools the GPU body 37, the temperature is effectively cooled for the GPU body 37 through the conditions, and the problem that the working efficiency is slow due to high temperature is solved.
As shown in fig. 1-3 and 6: the internal heat dissipation mechanism 6 is used for dissipating heat generated by all elements inside the collective housing 1, wherein: two including mounting groove C61, the equal fixed mounting of the interior table wall of two mounting grooves C61 has mounting panel 62, round hole 64 has all been seted up to two mounting panel 62's positive surface and rear surface, the equal fixed difference in surface of two mounting panels 62 is equipped with L type frame 63, the inside of two L type frame 63 is all fixed to be inserted and is equipped with motor B65, the equal fixed mounting of output of two motor B65 has fan B66, the equal fixed mounting of the interior table wall of two mounting grooves C61 has baffle 67, a set of air outlet groove 68 has all been seted up to one side that collective shell 1 was kept away from to the outer wall of two baffle 67, the bottom fixed mounting of circuit board 21 is in the inner wall bottom of collective shell 1, the rear surface fixed mounting of controller 31 is at the positive surface of collective shell 1, the fixed surface of roof 51 sets up the top at collective shell 1, two mounting grooves C61 are seted up respectively at the positive surface and the rear surface of collective shell 1.
The effect that its whole inside heat dissipation mechanism 6 reaches does: after the internal member of collective shell 1 is continuously doing work, the heat of inside production can mix with the air, starts motor B65 on the L type frame 63 and drives fan B66 and rotate, adsorbs into the round hole 64 inside with the mixed air, outside air exhaust apparatus was advanced to air-out groove 68 on the rethread baffle 67, and then made the inside air speed of device accelerate, improved its radiating effect.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that various changes in the embodiments and/or modifications of the invention can be made, and equivalents and modifications of some features of the invention can be made without departing from the spirit and scope of the invention.
Claims (8)
1. High frequency current source switch dc converter, its characterized in that: the method comprises the following steps: the water-cooled solar water heater comprises a collective shell (1), wherein a double-channel supercharging mechanism (2), a shutoff mechanism (3) and an internal heat dissipation mechanism (6) are respectively and fixedly arranged in the collective shell (1), and a water cooling mechanism (5) is fixedly arranged at the top of the collective shell (1);
the dual channel boost mechanism (2) is used for efficient collection and conversion of the battery voltage inside the device, wherein: including circuit bottom plate (21), two mounting groove A (22) and mounting groove B (23) have been seted up respectively at the top of circuit bottom plate (21), two the inner wall bottom of mounting groove A (22) is fixed mounting respectively has voltage input ware A (24) and voltage input ware B (25), two recess A have been seted up to outer wall one side of collective shell (1), and two recess A's interior table wall fixed mounting respectively has wiring picture peg A (210) and wiring picture peg B (211), one side that collective shell (1) was kept away from to the outer wall of wiring picture peg A (210) and wiring picture peg B (211) all is provided with a set of circular telegram jack, the top of circuit bottom plate (21) is fixed mounting respectively has the magnetic sleeve ring A (26) and the magnetic sleeve ring B (27), the outer surface of the magnetic sleeve ring A (26) and the magnetic sleeve ring B (27) all fixes the cover and is equipped with the conversion coil, the bottom parts of the insides of the two mounting grooves B (23) are respectively fixedly provided with a voltage follower A (28) and a voltage follower B (29), one side, close to the voltage follower A (28), of the outer wall of the collective shell (1) is provided with two grooves B, the inner surface walls of the two grooves B are respectively fixedly provided with a processing plugboard A (213) and a processing plugboard B (214), and one sides, far away from the collective shell (1), of the outer walls of the processing plugboard A (213) and the processing plugboard B (214) are respectively fixedly provided with a group of electrifying contact pins;
mechanism (3) dams is used for the not good frequency channel of single line voltage treatment effect, restricts its output, carries out the secondary pressure boost, wherein: including controller (31), the positive surface of controller (31) is provided with display screen (32) and start key (33) respectively, fixed intercommunication has command spool (34) between the exterior wall of the rear surface of controller (31) and the magnetic sleeve ring A (26), fixed intercommunication has electrified wire pipe (35) between the exterior wall of the magnetic sleeve ring A (26) and the magnetic sleeve ring B (27), the fixed GPU body (37) that is provided with in top of circuit bottom plate (21).
2. The high frequency current source switched dc converter of claim 1, wherein: the top of the collective shell (1) is fixedly inserted with a plurality of heat-carrying scales (4), and the tops of the heat-carrying scales (4) are contacted with the bottom of the circuit bottom plate (21).
3. The high frequency current source switched dc converter of claim 1, wherein: the water cooling mechanism (5) is used for carrying out temperature control processing on a GPU body (37) on the processor (36), wherein: the device comprises a top plate (51), wherein a groove C is formed in the bottom of the top plate (51), and a liquid conveying plate (52) is fixedly mounted on the top of the inner wall of the groove C.
4. The high frequency current source switched dc converter of claim 3, wherein: the bottom of liquid transport board (52) is fixed and is installed support frame (53), the bottom center department of support frame (53) is fixed to be inserted and is equipped with motor A (54), the output fixed mounting of motor A (54) has fan A (55).
5. The high frequency current source switched dc converter of claim 3, wherein: the bottom of the liquid conveying plate (52) is fixedly communicated with a liquid conveying pipe (56), the output end of the liquid conveying pipe (56) is fixedly communicated with a reactor (57), and the bottom of the reactor (57) is fixedly arranged at the top of the GPU body (37).
6. The high frequency current source switched dc converter of claim 1, wherein: the internal heat dissipation mechanism (6) is used for dissipating heat generated by all elements in the collective housing (1), wherein: two include mounting groove C (61), two the equal fixed mounting of interior table wall of mounting groove C (61) has mounting panel (62), two round hole (64), two have all been seted up to the positive surface and the rear surface of mounting panel (62) the equal fixed difference in surface of mounting panel (62) is equipped with L type frame (63), two the inside of L type frame (63) is all fixed to be inserted and is equipped with motor B (65), two the equal fixed mounting of output of motor B (65) has fan B (66).
7. The high frequency current source switched dc converter of claim 6, wherein: two equal fixed mounting of interior table wall of mounting groove C (61) has baffle (67), two one side that collective shell (1) was kept away from to the outer wall of baffle (67) has all seted up a set of air-out groove (68).
8. The high frequency current source switched dc converter of claim 3, wherein: the bottom of the circuit bottom plate (21) is fixedly arranged at the bottom of the inner wall of the collective shell (1), the rear surface of the controller (31) is fixedly arranged on the front surface of the collective shell (1), the outer surface of the top plate (51) is fixedly arranged at the top of the collective shell (1), and the two mounting grooves C (61) are respectively arranged on the front surface and the rear surface of the collective shell (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110819091.1A CN113708600A (en) | 2021-07-20 | 2021-07-20 | High-frequency current source switch DC converter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110819091.1A CN113708600A (en) | 2021-07-20 | 2021-07-20 | High-frequency current source switch DC converter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113708600A true CN113708600A (en) | 2021-11-26 |
Family
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| Application Number | Title | Priority Date | Filing Date |
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| CN202110819091.1A Pending CN113708600A (en) | 2021-07-20 | 2021-07-20 | High-frequency current source switch DC converter |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116482423A (en) * | 2023-05-09 | 2023-07-25 | 深圳市三行技术有限公司 | Sampling circuit abnormality detection equipment of medium-voltage variable-frequency driver |
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Application publication date: 20211126 |