CN113707014A

CN113707014A - Display device

Info

Publication number: CN113707014A
Application number: CN202110946917.0A
Authority: CN
Inventors: 祝翠林
Original assignee: Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Current assignee: Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority date: 2021-08-18
Filing date: 2021-08-18
Publication date: 2021-11-26
Anticipated expiration: 2041-08-18
Also published as: CN113707014B

Abstract

The application provides a display device, including: the display panel is bent to form a first plane part, a bent part and a second plane part, and two ends of the bent part are respectively connected with the first plane part and the second plane part; and the reinforcing structure layer is arranged on the surface of the second plane part far away from the first plane part. The reinforcing structure layer is utilized to enhance the stiffness of the terminal area and increase the pressing area of the pressing head for bending the non-display area, so that the bending stress can be uniformly distributed, the circuit is prevented from cracking, and the bending mark is improved.

Description

Display device

Technical Field

The application relates to the technical field of display, in particular to a display device.

Background

With the development of display technology, the application of display technology is becoming more and more extensive, and among them, an Organic Light-Emitting Diode (OLED) display has the advantages of self-luminescence, fast response, wide viewing angle, high brightness, bright color, lightness and thinness, etc., so the OLED display is more widely applied.

The larger the OLED display, the longer its terminal areas, and the more drive elements the terminal areas need to be bound to. If the Pad area is bent to the back of the display substrate by adopting a conventional Pad bonding process, and the purpose of reducing the width of the frame is achieved, the terminal area is too long, and the stiffness is insufficient in the bending process, so that the circuit is broken.

Therefore, the prior art has defects which need to be solved urgently.

Disclosure of Invention

The application provides a display device, can solve the stress inequality that the terminal area leads to when buckling and cause the cracked problem of circuit.

In order to solve the above problems, the technical solution provided by the present application is as follows:

a display device, comprising:

a display panel including a first flat portion, a second flat portion, and a curved portion connecting the first flat portion and the second flat portion; and

and the reinforcing structure layer is positioned on the surface of the second plane part far away from the first plane part.

In some embodiments, the reinforcing structure layer is a composite structure layer formed by an adhesive layer and a first reinforcing layer or a composite structure layer formed by an adhesive layer and two first reinforcing layers stacked in sequence, and the adhesive layer is located on the surface of the second plane portion away from the first plane portion.

In some of these embodiments, the reinforcing structure layer is the composite structure layer that tie coat and second reinforcing layer constitute or the composite structure layer that tie coat, first reinforcing layer and second reinforcing layer stacked gradually and constitute or the composite structure layer that tie coat, second reinforcing layer and second reinforcing layer stacked gradually and constitute, the tie coat is located the second plane portion is kept away from the surface of first plane portion, and the material of first reinforcing layer and second reinforcing layer is different, and the ductility of second reinforcing layer is greater than the ductility of first reinforcing layer.

In some embodiments, when the reinforcing structure layer is a three-layer structure, the thickness of the reinforcing layer at the outermost layer is not greater than the thickness of the reinforcing layer at the inner layer.

In some embodiments, the thickness of the bonding layer ranges from 15 to 50 μm.

In some embodiments, the first stiffening layer is made of metal, and the thickness of the first stiffening layer is between 50 and 150 μm.

In some embodiments, the second stiffening layer is a buffer layer, and the thickness of the second stiffening layer is between 80 and 200 μm.

In some of these embodiments, further comprising a composite functional layer located between the first planar section and the second planar section.

In some embodiments, a driving IC is disposed on a surface of the second planar portion, and the reinforcing structure layer includes an avoiding groove, where a size of the avoiding groove is greater than or equal to a size of the driving IC.

In some embodiments, the surface of the driving IC is provided with a protective film, and the reinforcing structure layer covers and contacts the protective film.

The beneficial effect of this application does: the application provides a display device, before buckling the Pad district to display panel's the dorsal part of display area, attached reinforcement structure layer strengthens the stiffness in terminal area to increase the area that the non-display area buckled (Pad bonding) pressure head pressfitting simultaneously, thereby can share Pad bonding stress equally, avoid the circuit to produce the crackle, improve the impression of buckling simultaneously.

Drawings

The technical solution and other advantages of the present application will become apparent from the detailed description of the embodiments of the present application with reference to the accompanying drawings.

Fig. 1 is a display device according to a first embodiment of the present application;

fig. 2 is a display device according to a second embodiment of the present application;

fig. 3 is a display device according to a third embodiment of the present application;

fig. 4 is a display device according to a fourth embodiment of the present application;

fig. 5 is a display device according to a fifth embodiment of the present application;

fig. 6 is a flowchart illustrating a method for manufacturing a display device according to the present disclosure.

Description of the reference numerals

100. 200, 300, 400, 500-display device

1-a display panel; 2-a first backplane; 3-second backboard

4-a composite functional layer; 5-reinforcing structural layer; 6-a polarizer; 11-glue material

7-a transparent adhesive layer; 8-cover plate; 9-a protective layer; 101-driver IC

102-a protective film; 10-a first planar portion; 12-a second planar section; 14-a bend;

16-a connecting part; 50-a tie layer; 52-first stiffening layer;

54-a second stiffening layer; 501-avoidance groove; 103-FPC

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

In the description of the present application, it is to be understood that the terms "longitudinal," "lateral," "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," and the like are used in the orientation or positional relationship indicated in the drawings, which are based on the orientation or positional relationship shown in the drawings, and are used merely for convenience of description and for simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and therefore should not be considered as limiting the present application. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.

The present application may repeat reference numerals and/or letters in the various examples, which have been repeated for purposes of simplicity and clarity and do not in themselves dictate a relationship between the various embodiments and/or arrangements discussed.

The display device of the present application will be described in detail with reference to specific embodiments.

Referring to fig. 1, fig. 1 is a display device 100 according to a first embodiment of the present application, including: the display panel comprises a display panel 1, a first back plate 2, a second back plate 3, a composite functional layer 4, a reinforcing structural layer 5, a polaroid 6, a transparent adhesive layer 7 and a cover plate 8, wherein the polaroid 6, the transparent adhesive layer 7 and the cover plate are sequentially positioned in the light emergent direction of the display panel 1.

The display panel 1 includes a first flat section 10, a second flat section 12, and a curved section 14 connecting the first flat section 10 and the second flat section 12. It is understood that the first plane part 10 is disposed opposite to the second plane part 12, and the first plane part 10 is a display area of the display device 100. The second plane portion 12 is provided with a driving IC101 and a pad (not shown) bonded to an external line.

In this embodiment, the first back plate 2 is disposed on the back surface (the surface away from the light emitting surface) of the first plane portion 10; the second back plate 3 is disposed on a surface of the second planar portion 12 facing away from the driving IC 101. The first backplane 2 and the second backplane 3 are used for supporting the display panel 1.

The composite functional layer 4 is provided between the first flat surface portion 10 and the second flat surface portion 12. Specifically, the composite functional layer 4 is located between the first backplane 2 and the second backplane 3, and the composite functional layer 4 and the second backplane 3 are fixed by the adhesive material 11. The adhesive material 11 here may be a Pressure Sensitive Adhesive (PSA).

In the present embodiment, the composite functional layer 4 is used to achieve the functions of shading, buffering, dissipating heat and electromagnetic shielding. The composite functional layer 4 may include an opaque tape (EMBO), Foam (Foam), and a copper foil in order in a direction from the first backsheet 2 to the second backsheet 3; or sequentially comprises a shading adhesive tape, foam, Polyimide (PI) and copper foil; or shading tape, foam, PI, graphite layer and copper foil; or a light-shielding tape, foam, polyethylene terephthalate (PET) and copper foil, or a light-shielding tape, stainless steel (SUS), graphite layer and PET.

The shading adhesive tape can play a role in shading and discharging bubbles, the foam can play a role in protection and buffering, and the copper foil can play a role in heat dissipation and electromagnetic shielding. The graphite layer can improve the heat dissipation performance of the display device.

The reinforcing structure layer 5 is disposed on the surface of the second plane portion 12 away from the first plane portion 10.

In this embodiment, the driving IC101 is disposed on the surface of the second planar portion 12, the reinforcing structure layer 5 includes an avoiding groove 501, and the size of the avoiding groove 501 is greater than or equal to that of the driving IC 101. Thus, the driver IC101 can be surely positioned in the escape groove 501 of the reinforcing structure layer 5.

The reinforcing structure layer 5 needs to have ductility and/or cushioning characteristics, and when the reinforcing structure layer 5 is adhered to and covered on the surface of the display panel 1 and the display panel 1 is bent, the bent position of the display panel 1 can be protected from cracks. The thickness of the reinforcing structure layer 5 is between 60 microns and 400 microns, and preferably, the thickness of the reinforcing structure layer 5 is between 100 microns and 250 microns. Within this thickness range, the reinforcing structure layer 5 can ensure the overall thickness of the display device 100 to be light and thin, and can also ensure the quality of the display panel 1.

In this embodiment, the reinforcing structure layer 5 is a composite structure layer composed of an adhesive layer 50, a first reinforcing layer 52 and a second reinforcing layer 54. It is understood that the reinforcing structure layer 5 is formed on the surface of the second plane portion 12 through the adhesive layer 50.

Because the bonding layer 50 is used for bonding, the first reinforcing layer 52 has better ductility, and the second reinforcing layer 54 has a function of bending and bending, so that the reinforcing structure layer 5 formed by matching the above structure layers covers the second plane part 12, when the terminal area is bent, the reinforcing structure layer 5 can enhance the stiffness of the terminal area and increase the area for pressing the pad bonding pressure head, thereby uniformly spreading the pad bonding stress, avoiding the circuit from generating cracks, and improving the bending mark. Because the second plane portion 12 needs to be pressed when the second plane portion 12 is bent to the back of the first plane portion 10, if the reinforcing structure layer 5 is not provided, the pressing head needs to avoid the driving IC101 during pressing, so that the pressing area of the pressing head is small, the pressing effect is poor, and with the reinforcing structure layer 5, the pressing head is pressed on the surface of the reinforcing structure layer 5, so that the pressing area is increased.

The bonding layer 50 is made of PSA glue. The thickness of the adhesive layer 50 is between 15 microns and 50 microns. The thickness of the adhesive layer 50 is considered firstly from the overall thickness of the reinforcing structural layer 5 and secondly from the function to be fulfilled by the reinforcing structural layer. That is, the thickness of the adhesive layer 50 is within this range, and the thickness of the first and second reinforcing layers 52 and 54 is not affected while the function of adhesion is achieved.

The first reinforcing layer 52 is made of PET/PI/foam, and the thickness of the first reinforcing layer 52 is between 80 and 200 microns. The first reinforcing layer 52 plays a good role in buffering, and the thickness of the first reinforcing layer 52 is considered from the whole thickness of the reinforcing structure layer 5, and the thickness of the material of the first reinforcing layer 52 is considered from the thickness of the material itself. The thickness of the first reinforcing layer 52 is within this range, so that the stress of the display panel 1 can be uniformly distributed when the terminal region needs to be bent. The second reinforcing layer 54 is made of SUS/nickel alloy, copper foil, or the like. The thickness of the second stiffening layer 54 is between 50-150 μm. The thickness of the second reinforcing layer 54 is within this range, and the outermost layer of the reinforcing structure layer can play a role in supplementing and supporting the hardness of the display panel 1 when the terminal region of the display panel needs to be bent.

From the consideration of material saving cost and deformation caused by bending, when the reinforcing structure layer 5 is a 3-layer structure, the thickness of the outermost reinforcing layer in the two first reinforcing layers is not greater than that of the inner reinforcing layer. That is, in the present embodiment, the thickness in the first reinforcing layer 52 is greater than the thickness of the second reinforcing layer 54.

Therefore, the reinforcing structure layer 5 can be selected differently according to the thickness of the electronic component and/or the driver IC101 of the second plane portion 12. In this embodiment, the overall thickness of the reinforcing structure layer 5 is slightly larger than the thickness of the driver IC101, so that the second reinforcing structure layer 54 at the outermost layer of the reinforcing structure layer 5 is disposed at a distance from the driver IC 101.

The transparent adhesive layer 7 may be a pressure sensitive adhesive or an optically clear adhesive.

The cover plate 8 is used to protect the display panel 1 and the like, and the cover plate 8 may be, for example, glass or plastic.

In the present embodiment, the surface of the curved portion 14 is provided with a protective layer 9. The protective layer 9 protects the display panel 1 and also realizes the bending and curling properties of the display panel. The material of the protective layer 9 may be PET, PI, UV glue.

Referring to fig. 2, fig. 2 is a display device 200 according to a second embodiment of the present application, the display device 200 according to the second embodiment has substantially the same structure as the display device 100 according to the first embodiment, and the difference therebetween is that: the reinforcing structure layer 5 is a composite structure layer formed by the bonding layer 50, the second reinforcing layer 54 and the second reinforcing layer 54.

The reinforcing structure layer 5 is a 3-layer composite structure layer formed by sequentially laminating an adhesive layer 50, a second reinforcing layer 54 and a second reinforcing layer 54. Here, the reason why the two second reinforcing layers 54 are provided is that: the thickness of the adhesive layer 50 and the second reinforcing layer 54 is just as thick as the driver IC101, but in order to protect the driver IC101, a second reinforcing layer 54 with the same thickness is added to cover the driver IC101, since the avoiding groove 501 needs to be obtained by etching or laser drilling, the thickness of the reinforcing structure layer 5 is too thin to control the depth of the drilling, and it is a common practice to open a through hole penetrating through the entire second reinforcing layer 54.

When the reinforcing structure layer 5 is a three-layer structure, thus, the avoiding groove 501 only needs to be formed in the bonding layer 50 and the first second reinforcing layer 54, the other second reinforcing layer 54 of the two second reinforcing layers 54 is formed on the surface of the second reinforcing layer 54 with the open hole after the open hole is completed, and the subsequent second reinforcing layer 54 is used for covering the surface of the driver IC101 to protect the driver IC101, because the outermost second reinforcing layer 54 also plays a role in protecting the driver IC101, therefore, two second reinforcing layers 54 with different thicknesses can be selected according to actual needs. Therefore, the portion of the remainder due to the hole is only the sum of the remainder of the hole portion of the adhesive layer 50 and the remainder of the hole portion of the second reinforcing layer 54 bonded to the adhesive layer 50.

If the reinforcing structure layer 5 is a two-layer structure formed by the bonding layer 50 and the second reinforcing layer with twice thickness, the hole portion excess material caused by the hole opening is the hole portion excess material of the bonding layer 50 and the hole portion excess material caused by the hole opening in the second reinforcing layer 54, compared with a three-layer structure, the hole portion excess material with one-layer structure is wasted, and the IC cannot be driven to form protection. Therefore, the three-layer structure layer has the same thickness as the two-layer structure, but can make full use of the material, realize the maximum utilization of the second reinforcing layer 54 and avoid waste.

It is understood that, in other embodiments, the reinforcing structure layer 5 may also be a composite structure layer composed of the adhesive layer 50 and a second reinforcing layer 54.

Referring to fig. 3, fig. 3 is a display device 300 according to a third embodiment of the present application, the display device 300 according to the third embodiment has substantially the same structure as the display device 100 according to the first embodiment, and the difference therebetween is that: the reinforcing structure layer 5 is a composite structure layer composed of an adhesive layer 50, a first reinforcing layer 52 and a first reinforcing layer 52.

Here, the reason why two first reinforcing layers 52 are provided is: the thickness of the adhesive layer 50 and the first reinforcing layer 52 is just as thick as the driver IC101, but in order to protect the driver IC101, a first reinforcing layer 52 with the same thickness is added to cover the driver IC101, since the avoiding groove 501 needs to be obtained by etching or laser drilling, the thickness of the reinforcing structure layer 5 is too thin to control the depth of the drilling, and it is a common practice to provide a through hole penetrating through the entire layer.

When reinforcement structure layer 5 is 3 layer structures, like this, it just only needs to set up in tie coat 50 and first reinforcing layer 52 to dodge groove 501, and another first reinforcing layer 52 in two first reinforcing layers 52 is formed on the surface of second reinforcing layer 54 that has the trompil again after the trompil is accomplished, and follow-up being used for the cover drive IC 101's surface is in order to protect drive IC101, because outermost first reinforcing layer 52 still plays the effect of protection drive IC101, so, can be according to actual need, can select two first reinforcing layers 52 that the thickness is different. Thus, the portion of the remainder due to the hole is only the sum of the remainder of the hole portion of the adhesive layer 50 and the remainder of the hole portion of the first reinforcing layer 52 bonded to the adhesive layer 50. If the reinforcing structure layer 5 is a two-layer structure formed by the bonding layer 50 and the first reinforcing layer with double thickness, the hole portion excess material caused by the hole opening is the hole portion excess material of the bonding layer 50 and the hole portion excess material caused by the hole opening in the first reinforcing layer 52, compared with a three-layer structure, the hole portion excess material with one-layer structure is wasted, and the IC cannot be driven to form protection. Therefore, compared with a two-layer structure, the three-layer structure layer has the same thickness, but can make full use of materials, realize the maximum utilization of the first reinforcing layer 52 and avoid waste.

Referring to fig. 4, fig. 4 is a display device 400 according to a fourth embodiment of the present disclosure, the display device 400 according to the fourth embodiment has substantially the same structure as the display device 100 according to the first embodiment, but the difference therebetween is that: the reinforcing structure layer 5 is a composite structure layer formed by the bonding layer 50 and a second reinforcing layer 54. Here, an adhesive layer having a cushioning effect is preferably used. The thickness of the reinforcing structure layer 5 is greater than that of the driving IC101, and the reinforcing structure layer 5 completely exposes the driving IC 101. The protective film 102 is disposed on the surface of the driving IC101, and the driving IC101 is protected by the protective film 102, so that the thickness of the display device 100 can be thinner and the heat dissipation of the driving IC can be better.

The sum of the thickness of the protective film 102 and the thickness of the driving IC101 is consistent with the thickness of the reinforcing structure layer 5 in consideration of flatness.

It is understood that the thickness of the reinforcing structure layer 5 may be selected according to the thickness of the driving IC101, and in other embodiments, the reinforcing structure layer 5 may also be a composite structure layer composed of the adhesive layer 50 and one first reinforcing layer 52.

Referring to fig. 5, fig. 5 is a display device 500 according to a fifth embodiment of the present disclosure, the display device 500 according to the fifth embodiment has substantially the same structure as the display device 100 according to the first embodiment, except that: the reinforcing structure layer 5 also covers a part of the bonding area between the surfaces of the protective layer 9 and the second plane part 12 and the flexible circuit board. The reinforcing structure layer 5 is used for protecting the protective layer 9 and the FPC 103, and a pressure-sensitive adhesive can be filled in a gap between the reinforcing structure layer 5 and the FPC 103.

Compared with the display device 100 of the first embodiment, in the present embodiment, the surface of the driving IC101 is provided with a protective film 102, and the reinforcing structure layer 5 covers and contacts the protective film 102. Thus, the protective film 102 can protect the driving IC101 and also dissipate heat generated by the driving IC101 to the reinforcing structure layer 5 through the protective film 102. The protective film 102 is preferably a film layer having a heat conductive function.

Referring to fig. 6, fig. 6 illustrates a method for manufacturing a display device 400, including:

providing a display panel 1, wherein the display panel 1 is divided into a first plane part 10, a second plane part 12 and a connecting part 16 for connecting the first plane part 10 and the second plane part 12;

arranging a reinforcing structure layer 5 on the surface of the second plane part 12; and

and bending the connecting part 16 to enable the composite functional layer 4 to be positioned between the first plane part 10 and the second plane part 12, enable the reinforcing structure layer 5 to be positioned on the surface of the second plane part 12 far away from the first plane part 10, and enable the connecting part 16 to form a bent part 14, so that the display device 400 is obtained.

In the present embodiment, before bending the connecting portion 16, the method further includes providing the composite functional layer 4 on the back surface of the first plane portion 10.

In the present embodiment, before bending the connecting portion 16, a protective layer 9 is disposed on the surface of the connecting portion 16. The protection layer 9 is malleable to protect the display panel 1 and to achieve the bending and curling properties of the display panel. The material of the protective layer 9 may be PET, PI, UV glue.

In this embodiment, before the composite functional layer 4 is disposed, a first backsheet 2 is disposed on the back surface of the first planar portion 10, and a second backsheet 3 is disposed on the back surface of the first planar portion, wherein the composite functional layer 4 is located between the first backsheet 2 and the second backsheet 3, and the composite functional layer 4 is fixed to the first backsheet 2 and the second backsheet 3 by a glue material 11.

In summary, according to the

display devices

100, 200, 300, 400, and 500 and the manufacturing method thereof provided by the present application, before the second plane portion 12 is disposed on the back surface of the first plane portion 10, the reinforcing structure layer 5 is disposed on the second plane portion 12, so as to enhance the stiffness of the terminal area and increase the area of the pad bonding press head, thereby uniformly distributing the pad bonding stress, avoiding the generation of cracks in the lines, and improving the bending marks; in addition, the reinforcing structure layer 5 is only arranged on the second plane portion 12, and the reinforcing structure layer 5 is not arranged on the connecting portion 16, so that the problem that when the connecting portion 16 is bent to form the bent portion 14, ductility of different structure layers is different, and inner diameters of different structure layers are different during bending, and thus position dislocation of the structure layers is caused, and the purpose of protecting the second plane portion 12 cannot be achieved is solved.

In summary, although the present application has been described with reference to the preferred embodiments, the above-described preferred embodiments are not intended to limit the present application, and those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present application, so that the scope of the present application shall be determined by the appended claims.

Claims

1. A display device, comprising:

2. The display device according to claim 1, wherein the reinforcing structure layer is a composite structure layer formed by an adhesive layer and a first reinforcing layer or a composite structure layer formed by an adhesive layer and two first reinforcing layers stacked in sequence, and the adhesive layer is located on a surface of the second plane portion away from the first plane portion.

3. The display device according to claim 1, wherein the reinforcing structure layer is a composite structure layer formed by bonding layers and second reinforcing layers or a composite structure layer formed by bonding layers, first reinforcing layers and second reinforcing layers which are sequentially stacked or a composite structure layer formed by bonding layers, second reinforcing layers and second reinforcing layers which are sequentially stacked, the bonding layer is located on the surface of the second plane portion away from the first plane portion, the first reinforcing layers and the second reinforcing layers are made of different materials, and ductility of the second reinforcing layers is greater than ductility of the first reinforcing layers.

4. A display device according to any one of claims 2 to 3, wherein when the reinforcing structure layer is a three-layer structure, the thickness of the reinforcing layer at the outermost layer is not greater than the thickness of the reinforcing layer at the inner layer.

5. A display device according to any one of claims 2 to 3, wherein the thickness of the adhesive layer is in the range of 15 to 50 μm.

6. The display device according to any one of claims 2 to 3, wherein the first reinforcing layer is made of metal, and the thickness of the first reinforcing layer is between 50 and 150 μm.

7. The display device according to claim 3, wherein the second stiffening layer is a buffer layer, and the thickness of the second stiffening layer is between 80 and 200 μm.

8. The display device of claim 1, further comprising a composite functional layer between the first planar portion and the second planar portion.

9. The display device according to claim 1, wherein the surface of the second planar portion is provided with a driving IC, the reinforcing structure layer includes an avoiding groove, and a size of the avoiding groove is greater than or equal to a size of the driving IC.

10. The display device according to claim 9, wherein the surface of the driver IC is provided with a protective film, and the reinforcing structure layer covers and contacts the protective film.