CN113702290A - Method and equipment for automatically and optically checking and correcting solder mask pattern of circuit board - Google Patents
Method and equipment for automatically and optically checking and correcting solder mask pattern of circuit board Download PDFInfo
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- CN113702290A CN113702290A CN202111002447.9A CN202111002447A CN113702290A CN 113702290 A CN113702290 A CN 113702290A CN 202111002447 A CN202111002447 A CN 202111002447A CN 113702290 A CN113702290 A CN 113702290A
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/01—Arrangements or apparatus for facilitating the optical investigation
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/288—Removal of non-metallic coatings, e.g. for repairing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
Abstract
The invention relates to a method and a device for automatically and optically checking and correcting a solder mask pattern of a circuit board. The invention can automatically correct the defects of the solder mask manufacturing process of the circuit board and improve the yield. The invention uses the structured light with the shape and the color matched with the detected pattern as a light source, the inspection process is easy, and the result is accurate; the CAM data is directly utilized, laser is used for removing, jet printing is used for repairing leakage, a chemical manufacturing process is not needed, the automation degree is high, the precision is high, and the environment is friendly. The invention is suitable for inspecting and correcting the solder resist pattern during the manufacture of the bare circuit board and before the assembly of the circuit board, and is suitable for directly removing the solder resist material to manufacture the solder resist pattern; and is also suitable for checking and correcting patterns in other processing processes.
Description
Technical Field
The invention belongs to the technical field of circuit manufacturing, relates to a solder mask pattern inspection and correction technology, and particularly relates to a method and equipment for automatically and optically inspecting and correcting a solder mask pattern of a circuit board.
Background
In electronic products, the circuit board plays a role of a skeleton, provides a physical channel for electrical connection between components, and is a structural carrier for fixing and mounting the components. The electric connection channel is realized by the conductive pattern and the metallized hole, the quality of the element installation and fixation is closely related to the performance of the solder resist pattern and the welding area, and the main production process of the circuit board is also the solderability of the circuit board surrounding the conductive pattern, the metallized hole, the solder resist pattern and the welding area.
Wherein the processing of the solder resist pattern and the solderability treatment is performed after the conductive pattern and the hole metallization are completed. This means that even if the conductive pattern and the metallized holes are acceptable, if the solder resist pattern and the solderability treatment are defective, the circuit board will be scrapped and a large loss will occur. Furthermore, once the solder mask pattern and the land defects enter the assembly stage, besides the explicit component mounting problem, such as short circuit between the solder joints, hidden problems, such as insufficient solder joints, may be caused, which affects the reliability of the electronic product. Therefore, for the production of electronic products, the inspection of whether the solder resist pattern and the welding area are qualified or not and the correction of the defects of the solder resist pattern and the welding area are of great significance.
The solder resist masks and protects the surface of the printed wire and the blank area of the board surface, and when the component and the circuit board are welded together, the solder resist plays a role in isolation, so that the short circuit phenomenon between the wires or the welding pads caused by the free flow of the molten solder can be prevented to a certain extent. In addition, the solder resist is insulating, heat-resistant and chemical-resistant, is a permanent protective layer on the surface of the printed board, plays a role in mechanical isolation, can prevent the printed board from being scratched and scratched when being stored and used, and also plays a role in protecting the printed board from moisture, salt mist, mold and other weather-resistant and environment-resistant three-proofing functions.
On the surface of the circuit board, the solder resist is a protective covering layer for the circuit board, the protective covering layer is selectively coated on the surface of a finished printed board, except for a bonding pad and the inner wall of a metalized hole, the solder resist is coated on all other positions of the surface of the circuit board, and a solder resist pattern is formed in an area covered with the solder resist. In the existing circuit board production, the solder resist pattern is made by a pattern transfer process, which is an indirect manufacturing technology. The common methods include a screen printing method and a photochemical imaging method, and the process routes of the two methods need to firstly photopattern a bottom plate and then carry out pattern transfer.
Taking photochemical imaging as an example, the brief process is: substrate and ink preparation → first full panel coating → predrying → second full panel coating → predrying → exposure → development → post cure. Firstly, coating liquid photosensitive solder resist coating on the whole board, pre-drying, exposing the circuit board by taking the bottom plate as a light-resistant masking film, then developing and washing to remove unexposed solder resist on a masked area to form an initial solder resist pattern, finally, completely curing the formed solder resist pattern, and finishing the solder resist pattern manufacturing flow. The photo-chemical imaging method uses a photosensitive solder resist, and in order to prevent the master from sticking to the solder resist, the solder resist is pre-cured before exposure, and the solder resist can be completely cured after development. The whole process is complicated, the operation window is small, the pre-curing, also called pre-drying, is one of the key points of the manufacturing process, the pre-curing is not complete curing, the time is short, the strength is weak, and if the local liquid state of the solder resist is dominant, the solder resist can be stuck to the plate, so that the bottom plate is wasted; the time is a little longer, the intensity is a little bigger, if the solder resist has been solidified partially, the solder resist can not be removed or can not be removed cleanly when developing, causing the solder resist to remain on the welding area defect.
Although the cost is low, the precision is limited, and the fine requirement of electronic products is more difficult to meet by screen printing and solder resist coating. In fact, in any technique, it is difficult to clearly and cleanly manufacture a finer pattern structure due to the limitations of pattern resolution and position accuracy, and the solder mask pattern defect becomes a difficult process problem and is difficult to completely eradicate. On one hand, in the area without the solder resist, the solder resist appears, namely, the solder resist is welded on a welding pad to pollute the welding area, and the consequence is poor welding and false welding; on the other hand, in the area where the solder resist should be coated, for example, between two pads, there is no solder resist coating, that is, there is no solder resist blank, and the solder does not function to prevent the solder from flowing between the pads when soldering, and as a result, the solder bridges and short circuits.
At present, the solder resist pattern inspection still remains manual inspection or is performed by using common circuit board appearance inspection equipment. Manual inspection is carried out, the speed is slow, and the operation quality is unstable; the common appearance inspection equipment is influenced by the environment and the color of a solder resist, the identification accuracy is large in fluctuation, and the effect is not ideal. For defective circuit boards, it is currently common practice to remove the solder resist and rework the solder resist pattern. It is not easy to remove the completely cured solder resist, and most of them use alkali solution with higher concentration, and they are soaked for a long time at higher temperature, so the operating environment is worse, and the inherent quality of the circuit board is also affected. And the solder resist pattern is manufactured again, because the manufacturing technology is not changed and is not completely successfully mastered, after repeated processing, if the defects cannot be eradicated, the product can only be scrapped, which is an important reason for high cost and resource waste in the production of the circuit board.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides a method and equipment for automatically and optically inspecting and correcting a solder mask pattern of a circuit board, which are used for automatically and optically inspecting and correcting the solder mask pattern of the circuit board and directly removing the solder mask to prepare the solder mask pattern. The invention uses the structured light which has the same shape with the detected area and is complementary with the detected material in color as a light source, uses the pattern contour line obtained by photographing as a boundary to generate a processing path, removes the solder resist material polluting a welding area by laser photoetching, and replenishes the missing of the solder resist by a spray printing coating method.
In the invention, the solder resist pattern is checked and corrected, and the solder resist pattern is divided into two stages: one stage is used for checking and correcting the pollution of the solder mask of the welding area, and when the solder mask appears on the checked area, the solder mask needs to be removed by laser photoetching; one stage is used for checking and correcting the missing of the solder mask in the solder mask area, and when the substrate material is exposed on the checked and repaired area, the solder mask needs to be sprayed and printed.
In the stage of checking and correcting the solder resist pollution of the welding area, structural light with the shape and the color complementary with the solder resist pattern is used as a light source, a camera is used for taking a picture, whether the solder resist pollution exists on the welding area or not is checked, namely whether a solder resist upper welding pad exists or not and the distribution condition of the solder resist which should not exist on the welding pad are checked; then, regarding the defects of the welding pad on the solder mask, using a pattern contour line obtained by photographing as a boundary to generate a processing path, and removing the solder mask material which should not exist by laser photoetching; and finally, illuminating by using a structural light source, taking a picture by using a camera, obtaining surface information of the welding area, and judging whether the defects are corrected or not. The method comprises the following specific steps:
and (1) generating a pattern with a shape complementary to the solder resist pattern by using the circuit board solder resist pattern CAM data. Different CAM systems, different manufacturing techniques, patterns, and data formats vary. The pattern required for this step is a pattern of lands or pads that are not masked by the solder resist. The pattern of this step is not necessarily the same as the pattern of SMT stencil openings, since in some cases the area to which solder paste is applied is smaller than the solder paste spreadable area.
And (2) generating structured light data by using the obtained pattern. The structured light in the present invention refers to a light beam having a cross section completely matching the shape and size of the pattern, or a light spot projected on the target pattern, and the shape and size of the light spot is exactly equal to the target pattern. The structured light data is generated by the CAM system, or by the CAM system and the control system, respectively, and includes configuration data and control data for configuring and controlling the camera light source and the structured light generator of the laser processing system. The configuration data defines the shape and color of the light projected by the structured light generator, such that the shape is the same as the inspected area and the color is complementary to the color of the inspected surface. And the control data generates driving instructions for the structural light generator, the camera, the laser light source and the motion control system according to the definition of the configuration data, and executes processing actions such as projection, photographing and the like.
And (3) taking a picture by using the structured light with the color complementary with the solder mask pattern as a light source. In order to highlight the target pattern, the area is photographed by using colored light having the same shape and size as the area not masked by the solder resist and the color complementary to the solder resist as a light source. The light source with the same shape and size as the inspected area is used for illumination, so that the obtained information can be limited in an effective and limited range, the interference of irrelevant information is eliminated, and the result is clear at a glance; the colored light which is complementary to the color of the solder resist is used as a light source, so that whether the details in the obtained information come from the redundant solder resist or not is conveniently distinguished, because under complementary light, the contrast of an image which is generated in a defect-free area is not large and not prominent, the contrast between the redundant solder resist and the colors of other materials is amplified, the existence of the solder resist is darker, the defect that the solder resist pollutes the bonding pad is more prominent, and the image processing work only needs to pay attention to the information which reaches a certain degree of black.
And (4) generating a processing path by taking the contour line of the obtained pattern as the boundary of the pattern removed by the laser photoetching. The CAM system generates a machining path according to a machining method of the laser machining system, that is, a shape and a size of a region to be machined to which a laser beam for lithography is irradiated. In a general laser processing system, the cross section of a laser beam is round, and when materials are removed, the materials on a round area with the diameter of about tens of microns can be removed by processing point by point and line by line and projecting laser once; the structured laser processing system can generate laser spots with the same shape and size as those of the selected processed area, and the laser spots act with materials in a sheet-forming mode, so that the structured laser processing system is a patterning processing mode, and can remove materials on a pattern area with diagonal lines of about a plurality of millimeters by one-time laser projection.
And (5) removing the solder resist material forming the pattern from the welding area by structured laser photoetching. Most solder resists are high molecular polymers, and compared with the base metal of a welding area, the threshold value of the optical power removed by laser is obviously low, so that a processing system can be easily selected, and the solder resists can be removed cleanly without damaging the base metal of the welding area. For example, CO may be selected2The laser and the optical fiber laser are used as infrared band processing equipment of a light source, and ultraviolet band light source laser processing equipment can be selected, but laser processing equipment with the same band as the color of the solder resist is not selected. For example, a fiber laser machining apparatus may be selected, and a laser machining apparatus having various pulse widths may be selected. The important parameter for laser processing is the laser power per unit area, and in the present invention, only the solder resist material on the pad needs to be removed, so that the focused laser optical power density used during processing is maintained to be greater than the minimum power density required for removing the organic material of the solder resist, preferably greater than 1.2 times the minimum optical power density required for removing the solder resist and lower than or close to the minimum optical power density required for removing the underlying metal layer.
And (6) taking a picture by using the structured light with the color complementary with the solder mask pattern as a light source again, comparing the data obtained by taking the picture with standard data, and checking the removal effect.
And (7) circularly processing or reporting the result.
In the stage of checking and correcting solder mask missing, taking a picture by a camera by using structured light which has the same shape as a solder mask pattern and is complementary with the color of a substrate material as a light source, and checking the missing and the distribution condition of the solder mask on the solder mask area, namely confirming the position where the solder mask is supposed to exist, and whether the situations of pinholes, gaps and blocking missing exist; then, regarding the defects on the solder mask area, generating a processing path by taking a pattern contour line obtained by photographing as a boundary, and complementing the solder mask material by jet printing; and finally, illuminating by using a structural light source, taking a picture by using a camera to obtain the surface information of the solder mask area, and judging whether the defects are corrected or not. The method comprises the following specific steps:
and (1) generating structured light data with the same shape as the solder mask pattern by using the circuit board solder mask pattern CAM data. The structured light in this step is a light beam whose cross section is completely matched with the shape and size of the solder resist pattern, or a light spot projected on a target pattern, and the shape and size of the light beam are exactly equal to those of the solder resist pattern. The structured light data is generated by the CAM system, or by the CAM system and the control system, respectively, and includes configuration data and control data for configuring and controlling the camera light source and the structured light generator of the laser processing system. The configuration data defines the shape and color of the light projected by the structured light generator, such that the shape is the same as the inspected area and the color is complementary to the color of the inspected surface. And the control data generates driving instructions for the structural light generator, the camera, the laser light source and the motion control system according to the definition of the configuration data, and executes processing actions such as projection, photographing and the like.
And (2) taking a picture by using the structured light which is to be masked by the solder mask as a light source. In order to highlight the solder resist pattern area, the solder resist should be coated, but the defect of the solder resist is lost, and the surface information of the area is obtained by taking a picture by using colored light which has the same shape and size as the solder resist pattern and has the color complementary to the color of the base material as a light source. The light source with the same shape and size as the inspected area is used for illumination, so that the obtained information can be limited in an effective and limited range, the interference of irrelevant information is eliminated, and the result is clear at a glance; the color light which is complementary to the color of the base material which should be masked by the solder resist but may be exposed due to the solder resist coating problem is used as the light source, so that the detail in the obtained information can be distinguished conveniently, whether the detail comes from the missing of the solder resist or not is judged, because under the complementary light, the image contrast generated by the non-defective area is not large and not prominent, the contrast between the base material which is not exposed in the defective area and other color materials is amplified, the exposed point appears darker, and the image processing work only needs to pay attention to the information which reaches a certain degree of black.
And (3) generating a jet printing path and a photocuring path by taking the contour line of the obtained pattern as the boundary of the processed area. The CAM system generates a machining path based on the parameters of the equipment used in the following steps (4) and (5). The processing path generation in the step is carried out according to the principle of' Dingning. According to the invention of claim 3, it is preferred to repair solder mask missing in the solder mask area first and then solder mask contamination in the solder area, the requirements for the solder mask spray printing system are not high, it is important to ensure that all parts with solder mask missing are coated with solder mask, and it is not intended whether the spray printing system has excessive solder mask coating in the parts without solder mask coating, because even if there is excessive solder mask coating, it must be found and repaired at the stage of repairing solder mask contamination in the solder area.
And (4) spray-printing a solder resist material. And the spray printing equipment which can spray and print and cure simultaneously is preferably used, so that the processing steps are reduced.
And (5) curing the solder resist material subjected to jet printing by using the structured light as a light source. Of course, the optical power density of the laser beam used to remove the solder resist may be reduced so that it does not reach the threshold value for removing the solder resist, such as defocusing the use of the laser beam to cure the solder resist in this step.
And (6) taking a picture by using the structured light with the color complementary with that of the substrate material as a light source, comparing the data obtained by taking the picture with standard data, and checking the jet printing effect.
And (7) circularly processing or reporting the result.
The equipment of the invention consists of a data processing system, an equipment operating system, a workpiece and processing head motion control system, a lighting and photocuring system, a laser photoetching removal system, a spray printing coating system, a workpiece fixing, automatic and manual feeding and discharging system and a positive pressure and negative pressure cleaning system. The cross section of light used for illumination, light curing and laser photoetching is structured light with controlled shape and color, the structured light is projected to a light spot of a target pattern, and the shape and the size of the structured light are exactly equal to those of a due solder resist pattern and a due welding area pattern. The structured light required by the equipment is generated by a DMD device, the DMD distributes and transmits the received light, and the light is subjected to shaping, light homogenizing and color matching before entering the DMD to be processed.
In addition to the functions of a typical laser machining and automatic optical inspection apparatus, the software of the present invention, i.e., the data processing and apparatus operating system of the apparatus, also generates the data required by the structured light generator DMD, including configuration data and control data, for configuring and controlling the photographic light source and the structured light generator of the laser machining system. The configuration data defines the shape and color of the light projected by the structured light generator, such that the shape is the same as the inspected area and the color is complementary to the color of the inspected surface. And the control data generates driving instructions for the structural light generator, the camera, the laser light source and the motion control system according to the definition of the configuration data, and executes processing actions such as projection, photographing and the like.
According to the method of the invention, the equipment is divided into a plurality of functional units, including an automatic optical inspection unit, a laser solder resist photoetching removal processing unit and a solder resist spray printing unit. Wherein the automatic optical inspection and the laser processing select different light sources and DMD devices, respectively, to produce structured light of different physical properties. The invention preferentially adopts the design that each unit is an independent functional module which can be spliced into a whole set, and workpieces sequentially enter each functional module to be checked and corrected. The invention also supports the use of a multi-functional integrated design, i.e., the integration of the automatic optical inspection function with the laser machining function, or the jet printing function. The equipment of the invention adopts the opaque material to manufacture the hood so as to isolate the interference of the ambient light on the photographing and improve the inspection accuracy. In the same way, in order to ensure that the spray printing effects are consistent, the constant temperature system is designed in the invention, so that the material storage, the conveying and the distribution of the spray printing coating system are not interfered by the change of the environmental temperature. For the application of the invention in direct laser solder resist removal, the laser photoetching removal can be completed by using common laser beams without using a DMD device, and the transmission and distribution control of light can be realized by using a universal scanning device.
The invention has the advantages and effects that:
1. the invention provides a technical scheme for systematically checking and correcting the solder resist pattern and the manufacturing defects of solderability treatment, and the automation degree is high.
2. The invention uses the structured light matched with the inspected area and the material for illumination, thereby increasing the contrast of defect display and having accurate inspection effect.
3. The invention removes the solder resist pollutant in the welding area by laser photoetching, and adds the solder resist loss by spray printing solder resist technology, the process is environment-friendly, and the result is precise.
4. The invention uses the structured laser to remove the solder resist, can replace the prior photochemical method or silk screen printing missing method, is used for manufacturing the solder resist pattern, and has the advantages of few steps, high precision and low cost.
Drawings
FIG. 1 is a structural diagram of an automatic optical inspection and correction device for solder resist contamination of a circuit board according to embodiment 1 of the present invention;
in the figure: 1. an automatic feeding system; 2. a granite platform; 3.A workbench; 4. a structured light projection assembly; 5. a photographing camera; an X1 movement system; 7. an equipment operating and control system; 8. a granite beam; y1 movement system; 10. an automatic blanking system; a B workbench; 12. structuring the laser head; an X2 mobile system; y2 mobile system.
FIG. 2 is a diagram of structured light generated by the structured light projection component that is complementary to the shape and color of the solder resist pattern.
Fig. 3 is a schematic diagram of a photographing camera photographing a structured light projection.
In the figure: 4-1. a light source; 4-2. color wheel; DMD; 4-4. a reflector; 4-5, projection objective; 4-6. structured light; 4-7, a solder mask region; 4-8 structured light projection; 5. and a photographing camera.
Fig. 4 is a schematic view of a solder resist contaminating a circuit board area.
In the figure: 4-7-1. a pad; 4-7, a solder mask region; 4-7-2 solder resist contamination
Fig. 5 is a solder resist contamination image obtained by photographing.
FIG. 6 is a flow chart of the automatic optical inspection and removal process of solder mask contamination of circuit board in embodiment 1 of the present invention.
Fig. 7 is a structural diagram of an automatic optical detection and correction device for solder mask missing of a circuit board in embodiment 2 of the present invention.
In the figure: 1. an automatic feeding system; 2. a granite platform; 3.A workbench; 4. a structured light projection assembly; 5. a photographing camera; an X1 movement system; 7. an equipment operating and control system; 8. a granite beam; y1 movement system; 10. an automatic blanking system; a B workbench; an X2 mobile system; y2 mobile system; 15. curing the structured light; 16. an inkjet head.
Fig. 8 is a diagram of structured light generated by the structured light projection component having the same shape as the solder resist pattern and complementary color to the base material masked by the solder resist.
FIG. 9 is a schematic view of solder resist voiding on a circuit board;
in the figure: 4-7-1. a pad; 4-7, a solder mask region; 4-7-3, solder resist is leaked.
Fig. 10 is a photograph of a region of the circuit board with solder resist voids obtained by photographing.
FIG. 11 is a flow chart of the automatic optical inspection and removal process for solder mask voids in circuit boards of example 2.
Detailed Description
The invention will be further described with reference to the following examples. The following examples are illustrative and not intended to be limiting, and are not intended to limit the scope of the invention.
Example 1
An apparatus for automatic optical inspection and correction of solder resist contamination of a circuit board, as shown in fig. 1, comprising: the automatic feeding system comprises an automatic feeding system 1, a granite platform 2, an A workbench 3, a structured light projection assembly 4, a photographing camera 5, an X1 moving system 6, an equipment operation and control system 7, a granite beam 8, a Y1 moving system 9, an automatic discharging system 10, a B workbench 11, a structured laser head 12, an X2 moving system 13 and a Y2 moving system 14, the Y1 moving system 9 and the Y2 moving system 14 are fixedly arranged on the granite platform 2 in parallel at intervals, the A workbench 3 is arranged on the Y1 moving system 9 in a sliding mode, and the B workbench 11 is arranged on the Y2 moving system 14 in a sliding mode. One end of the Y1 moving system 9 is connected with the automatic feeding system 1, the other end is connected with the automatic discharging system 10, the Y2 moving system 14 is the same as the Y1 moving system 9, one end is connected with the automatic feeding system 1, the other end is connected with the automatic discharging system 10, and the directions of feeding and discharging are opposite to that of the Y1 moving system 9. The granite beam 8 is installed above the Y1 moving system 9 and the Y2 moving system 14, and the granite beam 8 is arranged perpendicular to the Y1 moving system 9 and the Y2 moving system 14. An X1 moving system 6 is slidably mounted on one side surface of the granite beam 8, an X2 moving system 13 is mounted on the other side surface opposite to the granite beam, the structured light projection module 4 and the photographing camera 5 are slidably mounted on the X1 moving system 6, and the structured laser head 12 is slidably mounted on the X2 moving system 13.
The working flow of the equipment is as follows: the automatic feeding system 1 transmits the single circuit board coated with the solder resist in the material frame to the A workbench 3 and fixes the single circuit board; the structured light projection component 4 generates structured light with the shape and color complementary to the shape and color of the solder resist pattern as shown in FIG. 2, the structured light is projected to a circuit board, the photographing camera 5 photographs the structured light projection as shown in FIG. 3, and if the solder resist pollutes a circuit welding area as shown in FIG. 4, the photographing is carried out to obtain a solder resist pollution image as shown in FIG. 5; generating a processing path by taking the contour line of the obtained pattern as the boundary of the pattern removed by laser photoetching; the workbench (3) moves to the other side of the granite beam (8), and a structured laser head (12) is used for removing the pollution of the solder resist; meanwhile, the workbench (11) is loaded, and the steps of structured light projection, photographing, image processing, structured laser processing path generation and the like are sequentially executed in the same way; after the laser processing of the workbench A3 is finished, the workbench returns to the structured light projection area, the structured light projection assembly 4 and the photographing camera 5 project and photograph the circuit board again, and meanwhile, the workbench B11 moves to the other side of the granite beam 8 after the projection and photographing are finished and is subjected to the removal processing of the pollution of the solder resist by the structured laser head 12; if the secondary projection photographing result of the circuit board of the workbench A still has solder resist pollution, the structured laser is continuously used for removing; meanwhile, after the laser processing of the workbench B is finished, the workbench B returns to the other side of the beam to perform secondary projection photographing; the two steps of the structured light projection photographing and the structured laser solder resist pollution removal are alternately and circularly carried out on the workbench A and the workbench B until the data obtained by photographing the images are completely consistent with the standard data, the automatic blanking system 10 executes blanking, and the platform returns and carries out the feeding again. The above process flow is shown in FIG. 6.
Example 2
An automatic optical inspection and correction device for solder resist leakage of a circuit board comprises an automatic feeding system 1, a granite platform 2, an A workbench 3, a structured light projection assembly 4, a photographing camera 5, an X1 moving system 6, a device operation and control system 7, a granite beam 8, a Y1 moving system 9, an automatic blanking system 10, a B workbench 11, a solidified structured light 15, a jet printing head 16, an X2 moving system 13 and a Y2 moving system 14, wherein the Y1 moving system 9 and the Y2 moving system 14 are fixedly arranged on the granite platform 2 in parallel at intervals, the A workbench 3 is arranged on the Y1 moving system 9 in a sliding mode, and the B workbench 11 is arranged on the Y2 moving system 14 in a sliding mode, wherein the X2 moving system is arranged on the granite platform 2 in a sliding mode, and the Y1 is arranged on the granite platform. One end of the Y1 moving system 9 is connected with the automatic feeding system 1, the other end is connected with the automatic discharging system 10, the Y2 moving system 14 is the same as the Y1 moving system 9, one end is connected with the automatic feeding system 1, the other end is connected with the automatic discharging system 10, and the directions of feeding and discharging are opposite to that of the Y1 moving system 9. The granite beam 8 is installed above the Y1 moving system 9 and the Y2 moving system 14, and the granite beam 8 is arranged perpendicular to the Y1 moving system 9 and the Y2 moving system 14. An X1 moving system 6 is slidably mounted on one side surface of the granite beam 8, an X2 moving system 13 is mounted on the other side surface opposite to the granite beam, the structured light projection module 4 and the photographing camera 5 are slidably mounted on the X1 moving system 6, and the curing structured light 15 and the inkjet head 16 are slidably mounted on the X2 moving system 13.
The equipment work flow is as follows: the automatic feeding system 1 transmits the single circuit board coated with the solder resist in the material frame to the A workbench 3 and fixes the single circuit board; the structured light projection component 4 generates structured light which is the same as the solder resist pattern in shape and is complementary to the color of the base material masked by the solder resist, the structured light is projected to a circuit board, a photographing camera 5 photographs the structured light projection, if the circuit board has a solder resist empty part, such as a pattern 9, a solder resist empty image, such as a pattern 10, is obtained, and the boundary of the image is processed to generate a jet printing path; the workbench (3) moves to the other side of the granite beam (8), and the spray printing head (16) sprays and prints solder resist at the solder resist leakage position; the solidified structured light system generates structured light with the same shape as the solder resist void area, and solidifies the sprayed solder resist; when the workbench A3 carries out jet printing and solidification, the workbench B11 carries out feeding, and the steps of structured light projection, photographing, image processing and jet printing path generation are also carried out; the workbench (3) returns to the structured light projection area after the solder resist is sprayed and cured, and the structured light projection assembly (4) and the photographing camera (5) project and photograph the solder resist area of the circuit board again; meanwhile, the workbench (11) is moved to the other side of the granite beam (8) after projection and photographing are finished, the solder resist is sprayed and printed at the solder resist empty position by the spray printing head (16), and the solidified structural light (15) is solidified and sprayed and printed for welding; the above-mentioned structure light projection is shot and is spouted printing, structure light solidification process and is gone on alternately and circularly between A workstation and B workstation, until the data that the picture of shooing obtained is identical with standard data completely, carry out the unloading by automatic unloading system 10, the platform returns and the material loading again. The process flow is shown in FIG. 11.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various changes and modifications can be made without departing from the inventive concept, and these changes and modifications are all within the scope of the present invention.
Claims (10)
1. A method for correcting solder resist contamination of a circuit board land, comprising: and (3) taking the structured light with the shape and color complementary with the solder resist pattern as a light source, taking the pattern contour line obtained by photographing as a boundary, generating a processing path, and removing the solder resist material by laser photoetching.
2. The method of claim 1, wherein: the method comprises the following steps:
(1) generating a pattern with a shape complementary to the solder resist pattern by using the circuit board solder resist pattern CAM data;
(2) generating structured light data using the obtained pattern;
(3) projecting the structural light which is complementary with the solder resist pattern in color to the circuit board by using the structural light as a light source, and photographing the structural light projection by using a camera;
(4) generating a processing path by taking the contour line of the pattern obtained by photographing as the boundary of the pattern removed by laser photoetching;
(5) removing the solder resist material forming the pattern from the land by structured laser lithography;
(6) projecting the solder mask pattern to the circuit board by using the structural light with the color complementary with that of the solder mask pattern as a light source, photographing the structural light projection by using a camera, comparing data obtained by photographing with standard data, and checking the removal effect;
(7) cycle processing or report results.
3.A method for correcting solder mask missing in a solder mask area of a circuit board uses structured light which has the same shape as a solder mask pattern and is complementary to a substrate material as a light source, takes a pattern contour line obtained by photographing as a boundary, generates a processing path, and sprays and prints the solder mask material.
4. The method of claim 3, wherein: the method comprises the following steps:
(1) using the circuit board to resist the solder pattern CAM data to generate structured light data with the same shape as the solder pattern;
(2) projecting the structured light which is complementary to the color of the substrate material and is to be masked by the solder resist to the circuit board by using the structured light as a light source, and photographing the structured light projection by using a camera;
(3) generating a jet printing path and a photocuring path by taking the contour line of the pattern obtained by photographing as the boundary of the processed area;
(4) spray printing a solder resist material;
(5) curing the spray-printed solder resist material by using the structured light as a light source;
(6) projecting the structured light which is complementary with the color of the substrate material to the circuit board by using the structured light as a light source, photographing the structured light projection by using a camera, comparing the data obtained by photographing with standard data, and checking the jet printing effect;
(7) cycle processing or report results.
5. A method for automatically and optically inspecting and correcting a solder resist pattern of a circuit board is characterized in that: repairing solder mask missing in the solder mask area, then repairing solder mask contamination in the solder mask area,
the method for repairing the solder resist missing in the solder resist area comprises the following steps: using structured light which has the same shape as the solder resist pattern and the complementary color with the substrate material as a light source, using a pattern contour line obtained by photographing as a boundary, generating a processing path, and spray-printing the solder resist material;
the method for repairing the solder resist pollution of the welding area comprises the following steps: and (3) taking the structured light with the shape and color complementary with the solder resist pattern as a light source, taking the pattern contour line obtained by photographing as a boundary, generating a processing path, and removing the solder resist material by laser photoetching.
6. The utility model provides an equipment that automatic optics of circuit board hinders and welds pattern is inspected and is revised which characterized in that: including data processing system, equipment operating system, work piece and processing head motion control system, illumination and photocuring system, laser light corrosion remove system, spout seal coating system, the fixed and automatic and manual unloading system, the clean system of malleation and negative pressure of going up of work piece, its characterized in that: the cross section of the light used by the illumination and light curing system and the laser light etching removal system is structured light with controlled shape and color, the control of light transmission and distribution is realized by adopting a DMD device, and the light is shaped, homogenized and colored before entering the DMD device.
7. The apparatus according to claim 6, characterized in that: the equipment adopts a light-tight material to manufacture the hood, so as to isolate the interference of ambient light on photographing.
8. The apparatus according to claim 6, characterized in that: the light used by the laser photoetching removal system is a laser beam, and transmission and distribution control of the light is realized through a scanning device.
9. The apparatus according to claim 6, characterized in that: the material storage, the conveying and the distribution of the spray printing and coating system are all controlled by constant temperature.
10. The apparatus according to claim 6, characterized in that: the method comprises the following steps: the automatic feeding system (1), the granite platform (2), the A workbench (3), the structured light projection assembly (4), the photographing camera (5), the X1 moving system (6), the equipment operation and control system (7), the granite beam (8), the Y1 moving system (9), the automatic blanking system (10), the B workbench (11), the X2 moving system (13) and the Y2 moving system (14) are fixedly arranged on the granite platform (2) in parallel at intervals, the Y1 moving system (9) and the Y2 moving system (14) are arranged on the Y1 moving system (9) in a sliding mode, the B workbench (11) is arranged on the Y2 moving system (14) in a sliding mode, one end of the Y1 moving system (9) is connected with the automatic feeding system (1), the other end of the Y2 moving system (14) is connected with the automatic blanking system (10), and the Y2 moving system (14) is the same as the Y1 moving system (9), one end of the system is connected with an automatic feeding system (1), the other end of the system is connected with an automatic discharging system (10), only the direction of feeding and discharging is opposite to that of a Y1 moving system (9), a granite beam (8) is installed above the Y1 moving system (9) and the Y2 moving system (14), the granite beam (8) is vertically arranged with the Y1 moving system (9) and the Y2 moving system (14), an X1 moving system (6) is installed on one side surface of the granite beam (8) in a sliding mode, an X2 moving system (13) is installed on the other side surface opposite to the granite beam, a structured light projection component (4) and a photographing camera (5) are installed on the X1 moving system (6) in a sliding mode, and a structured laser head 12 or a solidified structured light (15) and a jet head (16) are installed on the X2 moving system (13) in a sliding mode.
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| CN202111002447.9A CN113702290A (en) | 2021-08-30 | 2021-08-30 | Method and equipment for automatically and optically checking and correcting solder mask pattern of circuit board |
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| CN202111002447.9A CN113702290A (en) | 2021-08-30 | 2021-08-30 | Method and equipment for automatically and optically checking and correcting solder mask pattern of circuit board |
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Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060065645A1 (en) * | 2004-09-27 | 2006-03-30 | Nobuaki Nakasu | Apparatus for repairing circuit pattern and method for manufacturing display apparatus using the same |
| CN103052271A (en) * | 2012-12-17 | 2013-04-17 | 天津市德中技术发展有限公司 | Method for producing resistance soldering pattern and capable of conducting solderability treatment on surface of welding area |
| CN106124538A (en) * | 2016-08-31 | 2016-11-16 | 天津三英精密仪器股份有限公司 | A kind of double multitask X-ray three-dimensional imaging detecting system |
| CN106770363A (en) * | 2016-12-31 | 2017-05-31 | 深圳眼千里科技有限公司 | screen automatic detecting machine |
| EP3244198A1 (en) * | 2016-05-13 | 2017-11-15 | ASM Assembly Systems GmbH & Co. KG | Method and apparatus for inspecting a solder paste deposit with a digital mirror device |
| CN110678003A (en) * | 2019-10-18 | 2020-01-10 | 深圳劲鑫科技有限公司 | PCB solder mask detection and repair integrated machine and process method |
| CN111735850A (en) * | 2020-06-24 | 2020-10-02 | 哈尔滨工业大学 | Scanning type circuit board solder joint insufficient solder joint automatic detection system and detection method |
| CN212514324U (en) * | 2020-06-16 | 2021-02-09 | 征图新视(江苏)科技股份有限公司 | Glass defect detection device |
| CN113068324A (en) * | 2021-03-15 | 2021-07-02 | 德中（天津）技术发展股份有限公司 | Method for manufacturing circuit board by using remelting solder as weldability protective layer |
-
2021
- 2021-08-30 CN CN202111002447.9A patent/CN113702290A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060065645A1 (en) * | 2004-09-27 | 2006-03-30 | Nobuaki Nakasu | Apparatus for repairing circuit pattern and method for manufacturing display apparatus using the same |
| CN103052271A (en) * | 2012-12-17 | 2013-04-17 | 天津市德中技术发展有限公司 | Method for producing resistance soldering pattern and capable of conducting solderability treatment on surface of welding area |
| EP3244198A1 (en) * | 2016-05-13 | 2017-11-15 | ASM Assembly Systems GmbH & Co. KG | Method and apparatus for inspecting a solder paste deposit with a digital mirror device |
| CN106124538A (en) * | 2016-08-31 | 2016-11-16 | 天津三英精密仪器股份有限公司 | A kind of double multitask X-ray three-dimensional imaging detecting system |
| CN106770363A (en) * | 2016-12-31 | 2017-05-31 | 深圳眼千里科技有限公司 | screen automatic detecting machine |
| CN110678003A (en) * | 2019-10-18 | 2020-01-10 | 深圳劲鑫科技有限公司 | PCB solder mask detection and repair integrated machine and process method |
| CN212514324U (en) * | 2020-06-16 | 2021-02-09 | 征图新视(江苏)科技股份有限公司 | Glass defect detection device |
| CN111735850A (en) * | 2020-06-24 | 2020-10-02 | 哈尔滨工业大学 | Scanning type circuit board solder joint insufficient solder joint automatic detection system and detection method |
| CN113068324A (en) * | 2021-03-15 | 2021-07-02 | 德中（天津）技术发展股份有限公司 | Method for manufacturing circuit board by using remelting solder as weldability protective layer |
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