CN113696574A - Flexible circuit board and processing technology thereof - Google Patents

Flexible circuit board and processing technology thereof Download PDF

Info

Publication number
CN113696574A
CN113696574A CN202111280193.7A CN202111280193A CN113696574A CN 113696574 A CN113696574 A CN 113696574A CN 202111280193 A CN202111280193 A CN 202111280193A CN 113696574 A CN113696574 A CN 113696574A
Authority
CN
China
Prior art keywords
layer
flexible
parts
moisture
proof film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202111280193.7A
Other languages
Chinese (zh)
Inventor
赵明杰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sycosys New Energy Technology Suzhou Co ltd
Original Assignee
Sycosys New Energy Technology Suzhou Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sycosys New Energy Technology Suzhou Co ltd filed Critical Sycosys New Energy Technology Suzhou Co ltd
Priority to CN202111280193.7A priority Critical patent/CN113696574A/en
Publication of CN113696574A publication Critical patent/CN113696574A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/304—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising vinyl halide (co)polymers, e.g. PVC, PVDC, PVF, PVDF
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/42—Layered products comprising a layer of synthetic resin comprising condensation resins of aldehydes, e.g. with phenols, ureas or melamines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/043—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a moving tool for milling or cutting the conductive material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/206—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/56—Damping, energy absorption
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/724—Permeability to gases, adsorption
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/726—Permeability to liquids, absorption
    • B32B2307/7265—Non-permeable

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)

Abstract

The invention provides a flexible circuit board, which comprises a substrate layer, a flexible conductive sheet, a flexible insulating material layer and a protective layer, wherein the substrate layer, the flexible conductive sheet, the flexible insulating material layer and the protective layer are sequentially arranged from bottom to top; the protective layer comprises a first moisture-proof film layer arranged on the flexible insulating material layer, a buffer layer arranged on the middle layer and positioned on the first moisture-proof film layer, and a second moisture-proof film layer arranged on the buffer layer; the first moisture-proof film layer and the second moisture-proof film layer both comprise the following materials in parts by weight: 60-80 parts of diallyl terephthalate; 10-14 parts of polyether ketone; 3-5 parts of tetrafluoroethylene-hexafluoropropylene-perfluoroalkyl vinyl ether copolymer; 1-5 parts of gamma-glycidyl ether oxypropyltrimethoxysilane; 2-4 parts of hexamethylene carbonate and 0.05-0.08 part of gadolinium oxide. The flexible circuit board and the processing technology thereof can effectively reduce the permeability of oxygen and water vapor and obtain lower thermal expansion coefficient.

Description

Flexible circuit board and processing technology thereof
Technical Field
The invention relates to the field of circuit board manufacturing, in particular to a flexible circuit board and a processing technology thereof.
Background
Flexible wiring boards refer to printed circuits made from flexible, insulating substrates. Since the flexible wiring board has excellent electrical properties and flexibility, it is widely used in various electronic devices such as computers, mobile phones, digital cameras, printers, and information search machines in public halls.
However, the existing flexible circuit board has high oxygen and water vapor transmission rate and large thermal expansion coefficient, thereby limiting the application of the flexible circuit board in the electronic and other fields.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provides a flexible circuit board and a processing technology thereof, so that the oxygen and water vapor transmission rate and the thermal expansion coefficient of the flexible circuit board are reduced. The technical scheme adopted by the invention is as follows:
a flexible wiring board, wherein: the flexible conductive board comprises a substrate layer, a flexible conductive sheet, a flexible insulating material layer and a protective layer which are sequentially arranged from bottom to top;
the protective layer comprises a first moisture-proof film layer arranged on the flexible insulating material layer, a buffer layer arranged on the middle layer and positioned on the first moisture-proof film layer, and a second moisture-proof film layer arranged on the buffer layer;
the first moisture-proof film layer and the second moisture-proof film layer both comprise the following materials in parts by weight: 60-80 parts of diallyl terephthalate; 10-14 parts of polyether ketone; 3-5 parts of tetrafluoroethylene-hexafluoropropylene-perfluoroalkyl vinyl ether copolymer; 1-5 parts of gamma-glycidyl ether oxypropyltrimethoxysilane; 2-4 parts of hexamethylene carbonate and 0.05-0.08 part of gadolinium oxide.
Preferably, the flexible wiring board, wherein: the first moisture-proof film layer and the second moisture-proof film layer further comprise 1-3 parts of N-hydroxymethyl acrylamide.
Preferably, the flexible wiring board, wherein: the first moisture-proof film layer and the second moisture-proof film layer further comprise 0.004-0.008 parts of strontium oxide.
Preferably, the flexible wiring board, wherein: the first moisture-proof film layerAnd the second moisture-proof film layer also comprises La4-xCrxSi2O10 0.002-0.006 part of La4-xCrxSi2O10Wherein x is more than or equal to 2.0 and less than or equal to 2.4.
Preferably, the flexible wiring board, wherein: the number average molecular weight of the tetrafluoroethylene-hexafluoropropylene-perfluoroalkyl vinyl ether copolymer is 3000-3200 g/mol.
Preferably, the flexible wiring board, wherein: the buffer layer comprises 45-55 parts of polyamide-imide, 5-7 parts of lithium fluoride, 3-6 parts of polyamide wax, 1-10 parts of ethylene-hexafluoropropylene-vinyl acetate copolymer fiber and 0.6-1.5 parts of phenyl trimethyl oxysilane.
Preferably, the flexible wiring board, wherein: the material of the substrate layer is selected from one of polyimide, polyvinylidene fluoride or polyetherimide.
Preferably, the flexible wiring board, wherein: the material of the flexible insulating material layer is selected from one of epoxy resin, urea-formaldehyde resin or melamine resin.
A processing technology of a flexible circuit board is disclosed, wherein: the method comprises the following steps:
s1, opening a die on a circular knife roller to enable die-cut patterns to be matched with a circuit diagram of a produced flexible circuit board;
s2, attaching the flexible conductive sheet to the substrate layer, passing the substrate layer and the flexible conductive sheet together below a circular knife roller, and cutting the flexible conductive sheet through a circular knife cutting device;
s3, tearing off waste materials of the cut flexible conductive sheet from the substrate layer, wherein the flexible conductive sheet on the substrate layer forms a circuit;
s4, covering a flexible insulating material layer and a protective layer on the flexible conductive sheet on the substrate layer to form a flexible circuit board;
and S5, cutting and separating each group of flexible circuit boards.
The invention has the advantages that:
(1) the flexible circuit board and the processing technology thereof can effectively reduce the permeability of oxygen and water vapor and obtain lower thermal expansion coefficient.
(2) The flexible circuit board comprises a substrate layer, a flexible conductive sheet, a flexible insulating material layer and a protective layer which are sequentially arranged from bottom to top; the protective layer comprises a first moisture-proof film layer arranged on the flexible insulating material layer, a buffer layer and a second moisture-proof film layer arranged on the buffer layer, polydiallyl terephthalate is the main component of the moisture-proof film layer, is acid-resistant, alkali-resistant and aging-resistant, is not brittle and not cracked after long-term use, has excellent electrical property, small molding shrinkage and good fluidity, but has poor waterproof property and weaker mechanical capability. In addition, in order to obtain a lampshade material with lower oxygen and water vapor transmission rate of the flexible circuit board, the scheme introduces nanoscale gadolinium oxide, strontium oxide and La with the functions of water resistance and oxygen resistance in a synergistic manner4- xCrxSi2O10Wherein gadolinium oxide has outstanding water-proof and oxygen-proof properties, strontium oxide has excellent aging-proof and water-proof properties, La4-xCrxSi2O10The three nano additives are used as an organic whole to play a role in cooperation with each other, the content of each nano additive is limited, if the content is lower than the weight part, the corresponding functional effect is reduced, and if the content is higher than the weight part, agglomeration among the particles is caused, sedimentation is caused, and meanwhile, the oxygen and water vapor transmission rate of the flexible circuit board is increased.
Detailed Description
The present invention will be further described with reference to the following specific examples.
Examples
A flexible wiring board, wherein: the flexible conductive board comprises a substrate layer, a flexible conductive sheet, a flexible insulating material layer and a protective layer which are sequentially arranged from bottom to top;
the protective layer comprises a first moisture-proof film layer arranged on the flexible insulating material layer, a buffer layer arranged on the middle layer and positioned on the first moisture-proof film layer, and a second moisture-proof film layer arranged on the buffer layer;
the first moisture-proof film layer and the second moisture-proof film layer both comprise the following materials in parts by weight: 60-80 parts of diallyl terephthalate; 10-14 parts of polyether ketone; 3-5 parts of tetrafluoroethylene-hexafluoropropylene-perfluoroalkyl vinyl ether copolymer; 1-5 parts of gamma-glycidyl ether oxypropyltrimethoxysilane; 2-4 parts of hexamethylene carbonate and 0.05-0.08 part of gadolinium oxide.
The poly (diallyl terephthalate) is the main component of the moisture-proof film layer, is acid-resistant, alkali-resistant and aging-resistant, is not brittle and does not crack after long-term use, has excellent electrical property, small molding shrinkage and good fluidity, but has poor waterproof property and weaker mechanical capability. In addition, in order to obtain a circuit board material with lower oxygen and water vapor transmission rate of the flexible circuit board, the scheme introduces nanoscale gadolinium oxide, strontium oxide and La with the functions of water resistance and oxygen resistance in a synergistic manner4-xCrxSi2O10Wherein gadolinium oxide has outstanding water-proof and oxygen-proof properties, strontium oxide has excellent aging-proof and water-proof properties, La4- xCrxSi2O10The three nano additives are used as an organic whole to play a role in cooperation with each other, the content of each nano additive is limited, if the content is lower than the weight part, the corresponding functional effect is reduced, if the content is higher than the weight part, agglomeration among particles is caused, sedimentation is caused, and meanwhile, the oxygen and water vapor transmission rate of the flexible circuit board is increased.
Wherein: the first moisture-proof film layer and the second moisture-proof film layer further comprise 1-3 parts of N-hydroxymethyl acrylamide.
After the N-hydroxymethyl acrylamide is combined with the tetrafluoroethylene-hexafluoropropylene-perfluoroalkyl vinyl ether copolymer, the moisture-proof film layer can keep better structural toughness and moisture-proof performance, so that the service life of the flexible circuit board is ensured. After the hexamethylene carbonate and the tetrafluoroethylene-hexafluoropropylene-perfluoroalkyl vinyl ether copolymer are combined, the heat resistance of the flexible circuit board at high temperature and the crack resistance of the flexible circuit board at low temperature can be effectively improved, and the hexamethylene carbonate and the N-hydroxymethyl acrylamide can generate a synergistic effect and jointly generate an effect on the tetrafluoroethylene-hexafluoropropylene-perfluoroalkyl vinyl ether copolymer.
Wherein: the first moisture-proof film layer and the second moisture-proof film layer further comprise 0.004-0.008 parts of strontium oxide.
Wherein: the first moisture-proof film layer and the second moisture-proof film layer also comprise La4-xCrxSi2O10 0.002-0.006 part of La4-xCrxSi2O10Wherein x is more than or equal to 2.0 and less than or equal to 2.4.
Wherein: the number average molecular weight of the tetrafluoroethylene-hexafluoropropylene-perfluoroalkyl vinyl ether copolymer is 3000-3200 g/mol.
Wherein: the buffer layer comprises 45-55 parts of polyamide-imide, 5-7 parts of lithium fluoride, 3-6 parts of polyamide wax, 1-10 parts of ethylene-hexafluoropropylene-vinyl acetate copolymer fiber and 0.6-1.5 parts of phenyl trimethyl oxysilane. The buffer layer enables the flexible circuit board to have low thermal expansion coefficient, the ethylene-hexafluoropropylene-vinyl acetate copolymer is a random copolymer, the synthesis method of the ethylene-hexafluoropropylene-vinyl acetate copolymer is the same as the synthesis condition of polyvinyl acetate, and the polymerization can be started only by uniformly mixing the three monomers according to the designed proportion during synthesis. The ethylene-hexafluoropropylene-vinyl acetate copolymer fiber has excellent rigidity and weather resistance of polyvinyl acetate, improves the toughness, waterproof performance and buffering performance of the fiber due to the modification of hexafluoropropylene, increases the impact strength of the fiber, reduces the deformation amplitude of the fiber and reduces the thermal expansion coefficient of a circuit board. In addition, due to the introduction of hexafluoropropylene in the ethylene-hexafluoropropylene-vinyl acetate copolymer fiber, the water resistance of the circuit board is improved, so that the circuit board has a moisture-proof function. The polyamide imide is firstly found to be mixed with the ethylene-hexafluoropropylene-vinyl acetate copolymer fiber for use, so that the thermal expansion coefficient of the circuit board can be synergistically reduced, and after the polyamide wax, the ethylene-hexafluoropropylene-vinyl acetate copolymer fiber and the lithium fluoride are combined, the flexible circuit board has higher strength and heat resistance, so that the thermal expansion coefficient of the flexible circuit board is reduced, and the oxygen and water vapor transmission rate of the flexible circuit board can be further reduced.
In the ethylene-hexafluoropropylene-vinyl acetate copolymer fiber, the ethylene content accounts for 35-45 wt%, the hexafluoropropylene content accounts for 12-16 wt%, and the balance is vinyl acetate. The research shows that when the proportion of the ethylene, the hexafluoropropylene and the vinyl acetate is limited, the buffer layer can obtain better buffer performance.
Wherein: the material of the substrate layer is selected from one of polyimide, polyvinylidene fluoride or polyetherimide.
Wherein: the material of the flexible insulating material layer is selected from one of epoxy resin, urea-formaldehyde resin or melamine resin.
A processing technology of a flexible circuit board is disclosed, wherein: the method comprises the following steps:
s1, opening a die on a circular knife roller to enable die-cut patterns to be matched with a circuit diagram of a produced flexible circuit board;
s2, attaching the flexible conductive sheet to the substrate layer, passing the substrate layer and the flexible conductive sheet together below a circular knife roller, and cutting the flexible conductive sheet through a circular knife cutting device;
s3, tearing off waste materials of the cut flexible conductive sheet from the substrate layer, wherein the flexible conductive sheet on the substrate layer forms a circuit;
s4, covering a flexible insulating material layer and a protective layer on the flexible conductive sheet on the substrate layer to form a flexible circuit board;
and S5, cutting and separating each group of flexible circuit boards.
Example 1
A flexible wiring board, wherein: the flexible conductive board comprises a substrate layer, a flexible conductive sheet, a flexible insulating material layer and a protective layer which are sequentially arranged from bottom to top;
the protective layer comprises a first moisture-proof film layer arranged on the flexible insulating material layer, a buffer layer arranged on the middle layer and positioned on the first moisture-proof film layer, and a second moisture-proof film layer arranged on the buffer layer;
the first moisture-proof film layer and the second moisture-proof film layer both comprise the following materials in parts by weight: 60 parts of polydiallyl terephthalate; 10 parts of polyether ketone; 3 parts of tetrafluoroethylene-hexafluoropropylene-perfluoroalkyl vinyl ether copolymer; 1 part of gamma-glycidyl ether oxypropyltrimethoxysilane; 2 parts of hexamethylene carbonate, 0.05 part of gadolinium oxide, 1 part of N-hydroxymethyl acrylamide, 0.004 part of strontium oxide and La4-xCrxSi2O10 0.002 part of the La4-xCrxSi2O10Wherein x =2.0, and the number average molecular weight of the tetrafluoroethylene-hexafluoropropylene-perfluoroalkyl vinyl ether copolymer is 3000 g/mol.
The buffer layer comprises 45 parts of polyamide imide, 5 parts of lithium fluoride, 3 parts of polyamide wax, 1 part of ethylene-hexafluoropropylene-vinyl acetate copolymer fiber and 0.6 part of phenyltrimethoxysilane.
The substrate layer is made of polyimide, and the flexible insulating material layer is made of epoxy resin.
A processing technology of a flexible circuit board is disclosed, wherein: the method comprises the following steps:
s1, opening a die on a circular knife roller to enable die-cut patterns to be matched with a circuit diagram of a produced flexible circuit board;
s2, attaching the flexible conductive sheet to the substrate layer, passing the substrate layer and the flexible conductive sheet together below a circular knife roller, and cutting the flexible conductive sheet through a circular knife cutting device;
s3, tearing off waste materials of the cut flexible conductive sheet from the substrate layer, wherein the flexible conductive sheet on the substrate layer forms a circuit;
s4, covering a flexible insulating material layer and a protective layer on the flexible conductive sheet on the substrate layer to form a flexible circuit board;
and S5, cutting and separating each group of flexible circuit boards.
Example 2
A flexible wiring board, wherein: the flexible conductive board comprises a substrate layer, a flexible conductive sheet, a flexible insulating material layer and a protective layer which are sequentially arranged from bottom to top;
the protective layer comprises a first moisture-proof film layer arranged on the flexible insulating material layer, a buffer layer arranged on the middle layer and positioned on the first moisture-proof film layer, and a second moisture-proof film layer arranged on the buffer layer;
the first moisture-proof film layer and the second moisture-proof film layer both comprise the following materials in parts by weight: 70 parts of diallyl terephthalate; 12 parts of polyether ketone; 4 parts of tetrafluoroethylene-hexafluoropropylene-perfluoroalkyl vinyl ether copolymer; 3 parts of gamma-glycidyl ether oxypropyl trimethoxy silane; 3 parts of hexamethylene carbonate, 0.07 part of gadolinium oxide, 2 parts of N-hydroxymethyl acrylamide, 0.006 part of strontium oxide, and La4-xCrxSi2O10 0.005 part of the La4-xCrxSi2O10Wherein x =2.2, the number average molecular weight of the tetrafluoroethylene-hexafluoropropylene-perfluoroalkyl vinyl ether copolymer is 3100 g/mol.
The buffer layer comprises 50 parts of polyamide imide, 6 parts of lithium fluoride, 5 parts of polyamide wax, 6 parts of ethylene-hexafluoropropylene-vinyl acetate copolymer fiber yarn and 1.2 parts of phenyltrimethoxysilane.
The material of base plate layer is polyvinylidene fluoride, and the material of flexible insulating material layer is urea-formaldehyde resin.
A processing technology of a flexible circuit board is disclosed, wherein: the method comprises the following steps:
s1, opening a die on a circular knife roller to enable die-cut patterns to be matched with a circuit diagram of a produced flexible circuit board;
s2, attaching the flexible conductive sheet to the substrate layer, passing the substrate layer and the flexible conductive sheet together below a circular knife roller, and cutting the flexible conductive sheet through a circular knife cutting device;
s3, tearing off waste materials of the cut flexible conductive sheet from the substrate layer, wherein the flexible conductive sheet on the substrate layer forms a circuit;
s4, covering a flexible insulating material layer and a protective layer on the flexible conductive sheet on the substrate layer to form a flexible circuit board;
and S5, cutting and separating each group of flexible circuit boards.
Example 3
A flexible wiring board, wherein: the flexible conductive board comprises a substrate layer, a flexible conductive sheet, a flexible insulating material layer and a protective layer which are sequentially arranged from bottom to top;
the protective layer comprises a first moisture-proof film layer arranged on the flexible insulating material layer, a buffer layer arranged on the middle layer and positioned on the first moisture-proof film layer, and a second moisture-proof film layer arranged on the buffer layer;
the first moisture-proof film layer and the second moisture-proof film layer both comprise the following materials in parts by weight: 80 parts of polydiallyl terephthalate; 14 parts of polyether ketone; 5 parts of tetrafluoroethylene-hexafluoropropylene-perfluoroalkyl vinyl ether copolymer; 5 parts of gamma-glycidyl ether oxypropyltrimethoxysilane; 4 parts of hexamethylene carbonate, 0.08 part of gadolinium oxide, 3 parts of N-hydroxymethyl acrylamide, 0.008 part of strontium oxide, and La4-xCrxSi2O10 0.006 part of the La4-xCrxSi2O10Wherein x =2.4, the number average molecular weight of the tetrafluoroethylene-hexafluoropropylene-perfluoroalkyl vinyl ether copolymer is 3200 g/mol.
The buffer layer comprises 55 parts of polyamide imide, 7 parts of lithium fluoride, 6 parts of polyamide wax, 10 parts of ethylene-hexafluoropropylene-vinyl acetate copolymer fiber yarn and 1.5 parts of phenyltrimethoxysilane.
The substrate layer is made of polyetherimide, and the flexible insulating material layer is made of melamine resin.
A processing technology of a flexible circuit board is disclosed, wherein: the method comprises the following steps:
s1, opening a die on a circular knife roller to enable die-cut patterns to be matched with a circuit diagram of a produced flexible circuit board;
s2, attaching the flexible conductive sheet to the substrate layer, passing the substrate layer and the flexible conductive sheet together below a circular knife roller, and cutting the flexible conductive sheet through a circular knife cutting device;
s3, tearing off waste materials of the cut flexible conductive sheet from the substrate layer, wherein the flexible conductive sheet on the substrate layer forms a circuit;
s4, covering a flexible insulating material layer and a protective layer on the flexible conductive sheet on the substrate layer to form a flexible circuit board;
and S5, cutting and separating each group of flexible circuit boards.
Comparative example 1
A flexible wiring board, wherein: the flexible conductive board comprises a substrate layer, a flexible conductive sheet, a flexible insulating material layer and a protective layer which are sequentially arranged from bottom to top;
the protective layer comprises a first moisture-proof film layer arranged on the flexible insulating material layer, a buffer layer arranged on the middle layer and positioned on the first moisture-proof film layer, and a second moisture-proof film layer arranged on the buffer layer;
the first moisture-proof film layer and the second moisture-proof film layer both comprise the following materials in parts by weight: 60 parts of polydiallyl terephthalate; 10 parts of polyether ketone; 3 parts of tetrafluoroethylene-hexafluoropropylene-perfluoroalkyl vinyl ether copolymer; 1 part of gamma-glycidyl ether oxypropyltrimethoxysilane; 2 parts of hexamethylene carbonate, 0.05 part of gadolinium oxide, 0.004 part of strontium oxide and La4- xCrxSi2O10 0.002 part of the La4-xCrxSi2O10Wherein x =2.0, and the number average molecular weight of the tetrafluoroethylene-hexafluoropropylene-perfluoroalkyl vinyl ether copolymer is 3000 g/mol.
The buffer layer comprises 45 parts of polyamide imide, 5 parts of lithium fluoride, 3 parts of polyamide wax, 1 part of ethylene-hexafluoropropylene-vinyl acetate copolymer fiber and 0.6 part of phenyltrimethoxysilane.
The substrate layer is made of polyimide, and the flexible insulating material layer is made of epoxy resin.
A processing technology of a flexible circuit board is disclosed, wherein: the method comprises the following steps:
s1, opening a die on a circular knife roller to enable die-cut patterns to be matched with a circuit diagram of a produced flexible circuit board;
s2, attaching the flexible conductive sheet to the substrate layer, passing the substrate layer and the flexible conductive sheet together below a circular knife roller, and cutting the flexible conductive sheet through a circular knife cutting device;
s3, tearing off waste materials of the cut flexible conductive sheet from the substrate layer, wherein the flexible conductive sheet on the substrate layer forms a circuit;
s4, covering a flexible insulating material layer and a protective layer on the flexible conductive sheet on the substrate layer to form a flexible circuit board;
and S5, cutting and separating each group of flexible circuit boards.
Comparative example 2
A flexible wiring board, wherein: the flexible conductive board comprises a substrate layer, a flexible conductive sheet, a flexible insulating material layer and a protective layer which are sequentially arranged from bottom to top;
the protective layer comprises a first moisture-proof film layer arranged on the flexible insulating material layer, a buffer layer arranged on the middle layer and positioned on the first moisture-proof film layer, and a second moisture-proof film layer arranged on the buffer layer;
the first moisture-proof film layer and the second moisture-proof film layer both comprise the following materials in parts by weight: 60 parts of polydiallyl terephthalate; 10 parts of polyether ketone; 3 parts of tetrafluoroethylene-hexafluoropropylene-perfluoroalkyl vinyl ether copolymer; 1 part of gamma-glycidyl ether oxypropyltrimethoxysilane; 2 parts of hexamethylene carbonate, 0.05 part of gadolinium oxide, 1 part of N-hydroxymethyl acrylamide and La4-xCrxSi2O10 0.002 part of the La4-xCrxSi2O10Wherein x =2.0, and the number average molecular weight of the tetrafluoroethylene-hexafluoropropylene-perfluoroalkyl vinyl ether copolymer is 3000 g/mol.
The buffer layer comprises 45 parts of polyamide imide, 5 parts of lithium fluoride, 3 parts of polyamide wax, 1 part of ethylene-hexafluoropropylene-vinyl acetate copolymer fiber and 0.6 part of phenyltrimethoxysilane.
The substrate layer is made of polyimide, and the flexible insulating material layer is made of epoxy resin.
A processing technology of a flexible circuit board is disclosed, wherein: the method comprises the following steps:
s1, opening a die on a circular knife roller to enable die-cut patterns to be matched with a circuit diagram of a produced flexible circuit board;
s2, attaching the flexible conductive sheet to the substrate layer, passing the substrate layer and the flexible conductive sheet together below a circular knife roller, and cutting the flexible conductive sheet through a circular knife cutting device;
s3, tearing off waste materials of the cut flexible conductive sheet from the substrate layer, wherein the flexible conductive sheet on the substrate layer forms a circuit;
s4, covering a flexible insulating material layer and a protective layer on the flexible conductive sheet on the substrate layer to form a flexible circuit board;
and S5, cutting and separating each group of flexible circuit boards.
Comparative example 3
A flexible wiring board, wherein: the flexible conductive board comprises a substrate layer, a flexible conductive sheet, a flexible insulating material layer and a protective layer which are sequentially arranged from bottom to top;
the protective layer comprises a first moisture-proof film layer arranged on the flexible insulating material layer, a buffer layer arranged on the middle layer and positioned on the first moisture-proof film layer, and a second moisture-proof film layer arranged on the buffer layer;
the first moisture-proof film layer and the second moisture-proof film layer both comprise the following materials in parts by weight: 70 parts of diallyl terephthalate; 12 parts of polyether ketone; 4 parts of tetrafluoroethylene-hexafluoropropylene-perfluoroalkyl vinyl ether copolymer; 3 parts of gamma-glycidyl ether oxypropyl trimethoxy silane; 3 parts of hexamethylene carbonate, 0.07 part of gadolinium oxide, 2 parts of N-hydroxymethyl acrylamide, 0.006 part of strontium oxide and 3100g/mol of the number average molecular weight of a tetrafluoroethylene-hexafluoropropylene-perfluoroalkyl vinyl ether copolymer.
The buffer layer comprises 50 parts of polyamide imide, 6 parts of lithium fluoride, 5 parts of polyamide wax, 6 parts of ethylene-hexafluoropropylene-vinyl acetate copolymer fiber yarn and 1.2 parts of phenyltrimethoxysilane.
The material of base plate layer is polyvinylidene fluoride, and the material of flexible insulating material layer is urea-formaldehyde resin.
A processing technology of a flexible circuit board is disclosed, wherein: the method comprises the following steps:
s1, opening a die on a circular knife roller to enable die-cut patterns to be matched with a circuit diagram of a produced flexible circuit board;
s2, attaching the flexible conductive sheet to the substrate layer, passing the substrate layer and the flexible conductive sheet together below a circular knife roller, and cutting the flexible conductive sheet through a circular knife cutting device;
s3, tearing off waste materials of the cut flexible conductive sheet from the substrate layer, wherein the flexible conductive sheet on the substrate layer forms a circuit;
s4, covering a flexible insulating material layer and a protective layer on the flexible conductive sheet on the substrate layer to form a flexible circuit board;
and S5, cutting and separating each group of flexible circuit boards.
Comparative example 4
A flexible wiring board, wherein: the flexible conductive board comprises a substrate layer, a flexible conductive sheet, a flexible insulating material layer and a protective layer which are sequentially arranged from bottom to top;
the protective layer comprises a first moisture-proof film layer and a second moisture-proof film layer which are arranged on the flexible insulating material layer;
the first moisture-proof film layer and the second moisture-proof film layer both comprise the following materials in parts by weight: 70 parts of diallyl terephthalate; 12 parts of polyether ketone; 4 parts of tetrafluoroethylene-hexafluoropropylene-perfluoroalkyl vinyl ether copolymer; 3 parts of gamma-glycidyl ether oxypropyl trimethoxy silane; 3 parts of hexamethylene carbonate, 0.07 part of gadolinium oxide, 2 parts of N-hydroxymethyl acrylamide, 0.006 part of strontium oxide, and La4-xCrxSi2O10 0.005 part of the La4-xCrxSi2O10Wherein x =2.2, the number average molecular weight of the tetrafluoroethylene-hexafluoropropylene-perfluoroalkyl vinyl ether copolymer is 3100 g/mol.
The material of base plate layer is polyvinylidene fluoride, and the material of flexible insulating material layer is urea-formaldehyde resin.
A processing technology of a flexible circuit board is disclosed, wherein: the method comprises the following steps:
s1, opening a die on a circular knife roller to enable die-cut patterns to be matched with a circuit diagram of a produced flexible circuit board;
s2, attaching the flexible conductive sheet to the substrate layer, passing the substrate layer and the flexible conductive sheet together below a circular knife roller, and cutting the flexible conductive sheet through a circular knife cutting device;
s3, tearing off waste materials of the cut flexible conductive sheet from the substrate layer, wherein the flexible conductive sheet on the substrate layer forms a circuit;
s4, covering a flexible insulating material layer and a protective layer on the flexible conductive sheet on the substrate layer to form a flexible circuit board;
and S5, cutting and separating each group of flexible circuit boards.
Comparative example 5
A flexible wiring board, wherein: the flexible conductive board comprises a substrate layer, a flexible conductive sheet, a flexible insulating material layer and a protective layer which are sequentially arranged from bottom to top;
the protective layer comprises a first moisture-proof film layer arranged on the flexible insulating material layer, a buffer layer arranged on the middle layer and positioned on the first moisture-proof film layer, and a second moisture-proof film layer arranged on the buffer layer;
the first moisture-proof film layer and the second moisture-proof film layer both comprise the following materials in parts by weight: 80 parts of polydiallyl terephthalate; 14 parts of polyether ketone; 5 parts of tetrafluoroethylene-hexafluoropropylene-perfluoroalkyl vinyl ether copolymer; 5 parts of gamma-glycidyl ether oxypropyltrimethoxysilane; 4 parts of hexamethylene carbonate, 0.08 part of gadolinium oxide, 3 parts of N-hydroxymethyl acrylamide, 0.008 part of strontium oxide, and La4-xCrxSi2O10 0.006 part of the La4-xCrxSi2O10Wherein x =2.4, the number average molecular weight of the tetrafluoroethylene-hexafluoropropylene-perfluoroalkyl vinyl ether copolymer is 3200 g/mol.
The buffer layer comprises 55 parts of polyamide imide, 7 parts of lithium fluoride, 6 parts of polyamide wax and 1.5 parts of phenyltrimethoxysilane.
The substrate layer is made of polyetherimide, and the flexible insulating material layer is made of melamine resin.
A processing technology of a flexible circuit board is disclosed, wherein: the method comprises the following steps:
s1, opening a die on a circular knife roller to enable die-cut patterns to be matched with a circuit diagram of a produced flexible circuit board;
s2, attaching the flexible conductive sheet to the substrate layer, passing the substrate layer and the flexible conductive sheet together below a circular knife roller, and cutting the flexible conductive sheet through a circular knife cutting device;
s3, tearing off waste materials of the cut flexible conductive sheet from the substrate layer, wherein the flexible conductive sheet on the substrate layer forms a circuit;
s4, covering a flexible insulating material layer and a protective layer on the flexible conductive sheet on the substrate layer to form a flexible circuit board;
and S5, cutting and separating each group of flexible circuit boards.
Comparative example 6
A flexible wiring board, wherein: the flexible conductive board comprises a substrate layer, a flexible conductive sheet, a flexible insulating material layer and a protective layer which are sequentially arranged from bottom to top;
the protective layer comprises a first moisture-proof film layer arranged on the flexible insulating material layer, a buffer layer arranged on the middle layer and positioned on the first moisture-proof film layer, and a second moisture-proof film layer arranged on the buffer layer;
the first moisture-proof film layer and the second moisture-proof film layer both comprise the following materials in parts by weight: 80 parts of polydiallyl terephthalate; 14 parts of polyether ketone; 5 parts of gamma-glycidyl ether oxypropyltrimethoxysilane; 4 parts of hexamethylene carbonate, 0.08 part of gadolinium oxide, 3 parts of N-hydroxymethyl acrylamide, 0.008 part of strontium oxide, and La4-xCrxSi2O10 0.006 part of the La4- xCrxSi2O10Medium x = 2.4.
The buffer layer comprises 55 parts of polyamide imide, 7 parts of lithium fluoride, 6 parts of polyamide wax, 10 parts of ethylene-hexafluoropropylene-vinyl acetate copolymer fiber yarn and 1.5 parts of phenyltrimethoxysilane.
The substrate layer is made of polyetherimide, and the flexible insulating material layer is made of melamine resin.
A processing technology of a flexible circuit board is disclosed, wherein: the method comprises the following steps:
s1, opening a die on a circular knife roller to enable die-cut patterns to be matched with a circuit diagram of a produced flexible circuit board;
s2, attaching the flexible conductive sheet to the substrate layer, passing the substrate layer and the flexible conductive sheet together below a circular knife roller, and cutting the flexible conductive sheet through a circular knife cutting device;
s3, tearing off waste materials of the cut flexible conductive sheet from the substrate layer, wherein the flexible conductive sheet on the substrate layer forms a circuit;
s4, covering a flexible insulating material layer and a protective layer on the flexible conductive sheet on the substrate layer to form a flexible circuit board;
and S5, cutting and separating each group of flexible circuit boards.
The results of the performance tests of examples 1-3 and comparative examples 1-6 are set forth below in Table 1:
TABLE 1
Example 1 Example 2 Example 3 Comparative example 1 Comparative example 2 Comparative example 3 Comparative example 4 Comparative example 5 Comparative example 6
Oxygen (ml/m)2.T） 0.61 0.55 0.49 1.74 1.41 3.12 1.02 1.58 3.34
Steam (g/m)2.T） 0.28 0.34 0.21 13.24 10.12 15.46 2.05 4.31 18.54
CTE（ppm/℃） 11.2 10.5 11.0 13.5 11.5 12.8 29.4 20.1 12.3
Note: the water vapor refers to the standard GB 1037 cup method for testing the water vapor permeability of plastic films and sheets.
As can be seen from Table 1, the flexible printed circuit board of the present invention can effectively reduce the permeability of oxygen and water vapor, and obtain a low thermal expansion coefficient.
Finally, it should be noted that the above embodiments are only for illustrating the technical solutions of the present invention and not for limiting, and although the present invention has been described in detail with reference to examples, it should be understood by those skilled in the art that modifications or equivalent substitutions may be made on the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, which should be covered by the claims of the present invention.

Claims (9)

1. A flexible wiring board characterized in that: the flexible conductive board comprises a substrate layer, a flexible conductive sheet, a flexible insulating material layer and a protective layer which are sequentially arranged from bottom to top;
the protective layer comprises a first moisture-proof film layer arranged on the flexible insulating material layer, a buffer layer arranged on the middle layer and positioned on the first moisture-proof film layer, and a second moisture-proof film layer arranged on the buffer layer;
the first moisture-proof film layer and the second moisture-proof film layer both comprise the following materials in parts by weight: 60-80 parts of diallyl terephthalate; 10-14 parts of polyether ketone; 3-5 parts of tetrafluoroethylene-hexafluoropropylene-perfluoroalkyl vinyl ether copolymer; 1-5 parts of gamma-glycidyl ether oxypropyltrimethoxysilane; 2-4 parts of hexamethylene carbonate; 0.05-0.08 part of gadolinium oxide.
2. The flexible wiring board of claim 1, wherein: the first moisture-proof film layer and the second moisture-proof film layer further comprise 1-3 parts of N-hydroxymethyl acrylamide.
3. The flexible wiring board of claim 1, wherein: the first moisture-proof film layer and the second moisture-proof film layer further comprise 0.004-0.008 parts of strontium oxide.
4. The flexible wiring board of claim 1, wherein: the first moisture-proof film layer and the second moisture-proof film layer also comprise La4-xCrxSi2O10 0.002-0.006 part of La4-xCrxSi2O10Wherein x is more than or equal to 2.0 and less than or equal to 2.4.
5. The flexible wiring board of claim 1, wherein: the number average molecular weight of the tetrafluoroethylene-hexafluoropropylene-perfluoroalkyl vinyl ether copolymer is 3000-3200 g/mol.
6. The flexible wiring board of claim 1, wherein: the buffer layer comprises 45-55 parts of polyamide-imide, 5-7 parts of lithium fluoride, 3-6 parts of polyamide wax, 1-10 parts of ethylene-hexafluoropropylene-vinyl acetate copolymer fiber and 0.6-1.5 parts of phenyl trimethyl oxysilane.
7. The flexible wiring board of claim 1, wherein: the material of the substrate layer is selected from one of polyimide, polyvinylidene fluoride or polyetherimide.
8. The flexible wiring board of claim 1, wherein: the material of the flexible insulating material layer is selected from one of epoxy resin, urea-formaldehyde resin or melamine resin.
9. The processing technology of the flexible circuit board is characterized in that: the method comprises the following steps:
s1, opening a die on a circular knife roller to enable die-cut patterns to be matched with a circuit diagram of a produced flexible circuit board;
s2, attaching the flexible conductive sheet to the substrate layer, passing the substrate layer and the flexible conductive sheet together below a circular knife roller, and cutting the flexible conductive sheet through a circular knife cutting device;
s3, tearing off waste materials of the cut flexible conductive sheet from the substrate layer, wherein the flexible conductive sheet on the substrate layer forms a circuit;
s4, covering a flexible insulating material layer and a protective layer on the flexible conductive sheet on the substrate layer to form a flexible circuit board;
and S5, cutting and separating each group of flexible circuit boards.
CN202111280193.7A 2021-11-01 2021-11-01 Flexible circuit board and processing technology thereof Pending CN113696574A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202111280193.7A CN113696574A (en) 2021-11-01 2021-11-01 Flexible circuit board and processing technology thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202111280193.7A CN113696574A (en) 2021-11-01 2021-11-01 Flexible circuit board and processing technology thereof

Publications (1)

Publication Number Publication Date
CN113696574A true CN113696574A (en) 2021-11-26

Family

ID=78647675

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202111280193.7A Pending CN113696574A (en) 2021-11-01 2021-11-01 Flexible circuit board and processing technology thereof

Country Status (1)

Country Link
CN (1) CN113696574A (en)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN203282784U (en) * 2013-03-11 2013-11-13 苏州宝腾包装科技有限公司 Universal high temperature release cover film of PCB circuit board and FPC circuit board
KR20130128312A (en) * 2012-05-16 2013-11-26 아이비컴(주) The flexible printed circuit board have a waterproof film and the manufacturing method of the flexible printed circuit board have a waterproof film
CN103415139A (en) * 2013-08-06 2013-11-27 鑫茂电子（昆山）有限公司 Water-proof LED circuit board
CN106220984A (en) * 2016-08-12 2016-12-14 广州大禹防漏技术开发有限公司 A kind of high anti-tearing strength EVA waterproof sheet and preparation method thereof
CN111246660A (en) * 2020-03-17 2020-06-05 万安裕维电子有限公司 Dampproofing dehumidification type PCB board
CN112589913A (en) * 2021-03-05 2021-04-02 赛柯赛斯新能源科技(苏州)有限公司 Flexible circuit board circular knife cutting process and processing device thereof
CN113135006A (en) * 2021-05-12 2021-07-20 苏州清之绿新材料有限公司 High-strength plastic composite sheet and preparation process thereof

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20130128312A (en) * 2012-05-16 2013-11-26 아이비컴(주) The flexible printed circuit board have a waterproof film and the manufacturing method of the flexible printed circuit board have a waterproof film
CN203282784U (en) * 2013-03-11 2013-11-13 苏州宝腾包装科技有限公司 Universal high temperature release cover film of PCB circuit board and FPC circuit board
CN103415139A (en) * 2013-08-06 2013-11-27 鑫茂电子（昆山）有限公司 Water-proof LED circuit board
CN106220984A (en) * 2016-08-12 2016-12-14 广州大禹防漏技术开发有限公司 A kind of high anti-tearing strength EVA waterproof sheet and preparation method thereof
CN111246660A (en) * 2020-03-17 2020-06-05 万安裕维电子有限公司 Dampproofing dehumidification type PCB board
CN112589913A (en) * 2021-03-05 2021-04-02 赛柯赛斯新能源科技(苏州)有限公司 Flexible circuit board circular knife cutting process and processing device thereof
CN113135006A (en) * 2021-05-12 2021-07-20 苏州清之绿新材料有限公司 High-strength plastic composite sheet and preparation process thereof

Similar Documents

Publication Publication Date Title
CN102807658B (en) Polyphenyl ether resin composite and prepreg and copper clad laminate made of polyphenyl ether resin composite
CN106795307B (en) Prepreg, metal-clad laminate, and printed wiring board
CN114181652B (en) Insulating adhesive film with low dielectric loss and preparation method and application thereof
WO2016074291A1 (en) Halogen-free resin composition and prepreg and laminate prepared therefrom
CN102443138A (en) Epoxy resin composition as well as prepreg and copper-foil-clad laminated board prepared by using same
WO2016074290A1 (en) Halogen-free resin composition and prepreg and laminated board prepared therefrom
KR102145067B1 (en) Laminate for flexible printed circuit board having low dielectric constant and low-loss properties
CN111378243A (en) Multifunctional modified resin blended prepreg hydrocarbon composition, application thereof and method for preparing high-frequency high-speed copper-clad plate by using same
CN112048155A (en) Glue solution for halogen-free medium-Tg loss copper-clad plate and preparation method and application thereof
KR102342147B1 (en) adhesive film with thermosetting property and coverlay film comprising the same
KR100710099B1 (en) Polyimide Film, Manufacturing Method of Same, and Usage of Same
CN113696574A (en) Flexible circuit board and processing technology thereof
CN108676475B (en) Halogen-free resin composition, covering film for flexible printed circuit board, flexible copper clad laminate and preparation method thereof
CN107266683B (en) Thermoplastic polyimide film and non-glue flexible copper-clad plate prepared from same
TWI715028B (en) Resin composition, insulation film and product using the insulation film
KR20220134460A (en) Method for manufacturing printed wiring board
CN110607064A (en) Resin composition, prepreg and related substrate
KR101476895B1 (en) Resin compositions and metal foil laminate comprising the resin composition
KR100912918B1 (en) Metal foil with resin and multilayer printed circuit board
JPH08151462A (en) Production of laminate
CN114276668B (en) Halogen-free low-dielectric resin composition and application thereof
KR102578499B1 (en) A thermosetting adhesive film having a high glass transition temperature and a coverlay film comprising the same
CN117264419B (en) Halogen-free flame-retardant high-Tg resin composition, resin glue solution, prepreg, copper-clad plate and preparation method thereof, and circuit board
CN112679912B (en) Resin composition, and prepreg, laminated board and printed circuit board prepared from resin composition
JP2002544332A (en) Thermosetting polymer systems and electronic laminates

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication

Application publication date: 20211126

RJ01 Rejection of invention patent application after publication