CN113694976A - Low-temperature processing clamp for high polymer micro-fluidic chip - Google Patents
Low-temperature processing clamp for high polymer micro-fluidic chip Download PDFInfo
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- CN113694976A CN113694976A CN202111055050.6A CN202111055050A CN113694976A CN 113694976 A CN113694976 A CN 113694976A CN 202111055050 A CN202111055050 A CN 202111055050A CN 113694976 A CN113694976 A CN 113694976A
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- clamp
- microfluidic chip
- heat exchange
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
- B01L3/50—Containers for the purpose of retaining a material to be analysed, e.g. test tubes
- B01L3/502—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
- B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
- B01L3/502707—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip characterised by the manufacture of the container or its components
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
- B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
- B25B11/002—Magnetic work holders
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D3/00—Devices using other cold materials; Devices using cold-storage bodies
- F25D3/10—Devices using other cold materials; Devices using cold-storage bodies using liquefied gases, e.g. liquid air
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Mechanical Engineering (AREA)
- General Health & Medical Sciences (AREA)
- Analytical Chemistry (AREA)
- Dispersion Chemistry (AREA)
- Hematology (AREA)
- Clinical Laboratory Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Combustion & Propulsion (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A low-temperature processing clamp for a high polymer micro-fluidic chip is characterized in that: the heat exchanger comprises a clamp gland (1), heat exchange fins (2), an electromagnetic module and a clamp base. The clamp gland is used for compressing and positioning the microfluidic chip substrate; the heat exchange fins are used for increasing the cooling and heat exchange area of the microfluidic chip substrate and improving the cooling speed; the electromagnetic module part comprises a ferromagnetic core (5), a coil (6), a power supply module (7) and a power switch (9), and is used for controlling the generation of a magnetic field through the power switch and providing a pressing force for the microfluidic chip substrate by matching with a clamp gland; the clamp base part comprises a base main body (4), a base bottom cover (8) and a backflow structure (10) and is used for installing the electromagnetic module and preventing the electromagnetic module from being corroded by parts and short-circuited due to condensation of water vapor in air. The invention has simple assembly and disassembly, is beneficial to improving the cooling speed of the microfluidic chip during processing, inhibiting the cooling deformation of the substrate and improving the processing precision.
Description
Technical Field
The invention relates to a fixture, in particular to a fixing fixture for assisting in cooling a high polymer micro-fluidic chip substrate for low-temperature processing by using low-temperature cooling consumables such as low-temperature gas, liquid nitrogen, liquid hydrogen or dry powder and the like, and particularly relates to a low-temperature processing fixture for a high polymer micro-fluidic chip.
Background
As is known, in the micro-fluidic chip technology, basic operations such as sample preparation, reaction, separation, detection, and the like in an analysis process are integrated on a micron-sized chip through a special flow channel structure inside the chip, so that the whole analysis process is automatically completed. High polymer materials such as Polycarbonate (PC), polymethyl methacrylate (PMMA) and Polydimethylsiloxane (PDMS) are widely applied to the manufacture of microfluidic chips by virtue of the advantages of convenient processing and forming, low price, good optical property, chemical inertness, electrical insulation and thermal property.
The low-temperature processing method of the high polymer microfluidic chip is a manufacturing method aiming at small-batch and various application requirements, such as low-temperature cutting, milling, abrasive gas jet flow and the like, wherein common auxiliary cooling methods comprise a low-temperature pool immersion cooling method and a low-temperature jet flow impact cooling method. The cooling deformation of the substrate of the microfluidic chip in low-temperature processing is very critical to control the processing precision, the mechanical pressing fixture can solve the problem of cooling deformation, but the assembly and disassembly are complicated, and water vapor in the air is very easy to condense in a part contact gap of the fixture after the processing is finished, so that the disassembly is difficult, even the fixture is damaged, and the positioning precision and the assembly and disassembly efficiency of the substrate of the microfluidic chip are influenced. In addition, the higher cooling speed of the microfluidic chip substrate can effectively reduce the consumption of cooling consumables, and the mechanical pressing clamp does not consider the problem of improving the cooling speed.
Disclosure of Invention
The invention aims to design a high polymer micro-fluidic chip low-temperature processing clamp aiming at the problem that the processing quality and the processing effect are affected due to the inconvenience in clamping in the conventional high polymer micro-fluidic chip low-temperature processing, so that the cooling speed of a micro-fluidic chip substrate is improved, cooling consumables are saved, the cost is reduced, cooling deformation is inhibited, and the processing precision is improved.
The technical scheme of the invention is as follows:
the low-temperature processing clamp for the high polymer micro-fluidic chip is characterized by comprising four parts, namely a clamp gland 1, heat exchange fins 2, an electromagnetic module and a clamp base; the clamp gland 1 tightly presses the microfluidic chip substrate on the heat exchange fins 2 under the action of the electromagnetic module, and the machining cutter passes through a machining hole in the clamp gland 1 to machine the microfluidic chip substrate; the clamp gland 1 is used for compressing and positioning the microfluidic chip substrate; the heat exchange fins 2 are used for increasing the cooling and heat exchange area of the substrate of the microfluidic chip and improving the cooling speed; the electromagnetic module part comprises a ferromagnetic core 5, a coil 6, a power module 7 and a power switch 9, and is used for controlling the generation of a magnetic field through the power switch 9 and providing a pressing force for the microfluidic chip substrate by matching with the clamp gland 1; the clamp base part comprises a base body 4 and a base bottom cover 8 and is used for installing the electromagnetic module and preventing the electromagnetic module from being corroded by parts and short-circuited by condensation of water vapor in air.
The invention has the beneficial effects that:
the invention has simple assembly and disassembly, is beneficial to improving the cooling speed of the microfluidic chip during processing, inhibiting the cooling deformation of the substrate and improving the processing precision.
Drawings
Fig. 1 is a perspective exploded view of a cryogenic jet impingement cooled clamp.
Fig. 2 is a schematic perspective view of the clamp gland of fig. 1.
Fig. 3 is a perspective assembly view of a cryogenic jet impingement cooled clamp.
Fig. 4 is a perspective assembly view of the cryogenic bath immersion cooling fixture.
In the figure: 1. pressing a clamp cover; 2. heat exchange fins; 3. aluminum alloy support ribs; 4. a substrate body; 5. a ferromagnetic core; 6. a coil; 7. a power supply module; 8. a substrate bottom cover; 9. a power switch; 10. a reflow structure; 11. and (4) immersing the pool.
Detailed Description
The invention is further described below with reference to the figures and examples.
As shown in fig. 1-4.
A low-temperature processing clamp for a high polymer microfluidic chip comprises a clamp gland 1, heat exchange fins 2, an electromagnetic module and a clamp base, and is shown in figure 1. The clamp gland 1 is used for compressing and positioning the microfluidic chip substrate; the micro-fluidic chip substrate is tightly pressed between the clamp gland 1 and the heat exchange fin 2 under the action of the electromagnetic module. In order to facilitate processing, an opening for a cutter to enter and exit is processed on the clamp gland 1, in order to prevent the clamp gland 1 from rotating under stress in the processing process, four clamping pins with 90-degree folded edges need to be additionally arranged on the periphery of the clamp gland 1, as shown in fig. 2, the heat exchange fins 2 are used for increasing the cooling and heat exchange area of the microfluidic chip substrate and improving the cooling speed; the electromagnetic module part comprises a ferromagnetic core 5, a coil 6, a power module 7 and a power switch 9, and is used for controlling the generation of a magnetic field through the power switch 9 and providing a pressing force for the microfluidic chip substrate by matching with the clamp gland 1; the clamp base part comprises a base main body 4 and a base bottom cover 8 and is used for installing the electromagnetic module, the base main body 4 is connected with the base bottom cover 8 through screws, and sealing silica gel is coated on a contact surface to ensure good sealing performance and prevent the corrosion of parts and the short circuit of a circuit caused by the condensation of water vapor in air.
In specific implementation, the clamp gland 1 should be made of an antirust and magnetically attractable material, such as martensitic stainless steel, and a groove (as shown in fig. 2) having a length and a width consistent with the dimensions of the microfluidic chip substrate and a thickness of 1/2 is designed at a contact position of the clamp gland 1 and the microfluidic chip substrate so as to facilitate positioning of the microfluidic chip substrate; the bottom of the groove is provided with an opening to reserve a space for the cutter to process the substrate; the right-angle baffle structures at four corners of the clamp gland 1 are used for positioning the clamp gland 1 and the heat exchange fins 2 to prevent the clamp gland 1 from rotating in the machining process, and meanwhile, the smaller contact area of the clamp gland and the heat exchange fins 2 is ensured, and the difficulty in disassembly caused by the condensation of water vapor in contact gaps is avoided; the clamp gland 1 is low in material price and simple in structure, and in order to achieve the best positioning and clamping effect, the clamp glands 1 with different sizes can be customized for microfluidic chip substrates with different sizes. The heat exchange fins 2 are made of copper, aluminum or alloy with excellent heat conductivity, and a heat exchange flow channel is arranged in the heat exchange fins to provide a larger area for heat exchange between low-temperature gas, liquid or powder cooling consumables and the heat exchange fins 2; the cooled heat exchange fins 2 are cooled by contacting with the bottom surface of the substrate of the microfluidic chip, so that the heat exchange area of the substrate of the microfluidic chip is increased, the cooling speed is improved, the cooling material consumption is saved, and the cost is reduced. The aluminum alloy support ribs 3 in interference fit can be embedded into the heat exchange flow channels of the heat exchange fins 2 so as to increase the structural strength of the heat exchange fins 2 and prevent extrusion deformation caused by overlarge pressing force, and meanwhile, the aluminum alloy support ribs 3 are fixed on the base main body 4. The electromagnetic module is mainly responsible for controlling the coil 6 to enable the ferromagnetic core 5 to generate a longitudinal magnetic field, the ferromagnetic core 5 is made of low-carbon steel, pure iron or soft iron materials, and an anti-rust coating is added on the surface of the ferromagnetic core, so that the pressing force can be adjusted by adjusting the current or the number of turns of the coil under different working conditions; meanwhile, the power module 7 provides short-circuit protection and leakage protection functions; during processing, the clamp gland 1 is pressed and fixed on the microfluidic chip substrate under the suction force of the magnetic field, the power switch 9 is turned off after the processing is finished, and the magnetic field of the ferromagnetic core 5 disappears so as to be convenient for taking down the clamp gland 1 and the microfluidic chip substrate. In order to ensure good sealing performance of the device, the power switch 9 is mounted by adopting a touch power switch 9 and being mounted on the side surface of the substrate main body 4, or by adopting a split type external power switch 9. The clamp base body part is made of aluminum alloy or other rustproof materials which do not affect the distribution of a magnetic field, the interior of the clamp base body part is hollow and used for installing the electromagnetic module, and the upper surface of the clamp base body part is used for installing the clamp gland 1 and the heat exchange fins 2. The substrate main body 4 is designed with a backflow structure 10 aiming at a low-temperature jet impact cooling method, namely a tilted cover plate is arranged on the substrate main body 4, and the backflow structure is mainly used for guiding cooling consumables which are not completely utilized to flow back into the heat exchange fins 2, cooling the heat exchange fins 2 to low temperature, and further cooling the bottom surface of the high polymer micro-fluidic chip. The base main body 4 is designed with an immersion tank 11 aiming at a low-temperature tank immersion cooling type low-temperature processing method, and directly immerses the microfluidic chip substrate, the clamp gland 1 and the heat exchange fins 2 by using cooling consumables, so that the heat exchange fins 2 are efficiently cooled, and further the bottom surface of the high polymer microfluidic chip is cooled. The substrate main body 4 and the substrate bottom cover 8 are connected by using screws, and sealing silica gel is added on a contact surface to ensure good sealing performance.
The working process of the invention is as follows:
when the clamping is started, the power switch 9 is turned on, the power module 7 supplies power to the coil 6 to generate a magnetic field under the guidance of the ferromagnetic core 5, the clamp gland 1 compresses the microfluidic chip substrate under the attraction of the electromagnet, the fixation of the processed substrate is completed, and the processing precision is improved; when the machining is started, for the low-temperature jet impact cooling type clamp, the backflow structure 10 on the base main body 4 can guide the cooling consumables which are not fully utilized to flow into the flow channel of the heat exchange fins 2, and for the low-temperature pool immersion cooling type clamp, the cooling consumables can directly immerse the heat exchange fins 2 to enter the flow channel, so that the heat exchange fins 2 with excellent heat conductivity are efficiently cooled, the cooled heat exchange fins 2 cool the microfluidic chip substrate from the bottom, the cooling heat exchange area is increased, the cooling speed of the microfluidic chip substrate is improved, the consumption of the cooling consumables is saved, and the cost is reduced; after the processing is finished, the power switch 9 is switched off, the electromagnet is demagnetized, and the clamp gland 1 and the micro-fluidic chip substrate can be easily taken down.
When the clamp is used for clamping a PDMS sheet with the thickness of 4mm, compared with a PDMS sheet with the bottom surface not participating in cooling, the cooling speed of the PDMS sheet is reduced from 25 ℃ at room temperature to-147 ℃ of obvious embrittlement temperature, and is increased from 22.698 mu m/s to 64.187 mu m/s at most. The cooling deformation of the PDMS sheet is close to the central convex warping deformation, the cooling deformation of the compression area of the microfluidic chip is inhibited by the compression force, the compression area is approximately equal to the contact area between the clamp gland and the PDMS sheet, the warping deformation of the whole sheet is reduced, and the deformation of a processing area is reduced, so that the processing precision is improved.
The parts not involved in the present invention are the same as or can be implemented using the prior art.
Claims (10)
1. The low-temperature processing clamp for the high polymer micro-fluidic chip is characterized by comprising four parts, namely a clamp gland (1), heat exchange fins (2), an electromagnetic module and a clamp base; the clamp gland (1) tightly presses the microfluidic chip substrate on the heat exchange fins (2) under the action of the electromagnetic module, and a machining cutter passes through a machining hole in the clamp gland (1) to machine the microfluidic chip substrate; the clamp gland (1) is used for compressing and positioning the microfluidic chip substrate; the heat exchange fins (2) are used for increasing the cooling and heat exchange area of the substrate of the microfluidic chip and improving the cooling speed; the electromagnetic module part comprises a ferromagnetic core (5), a coil (6), a power module (7) and a power switch (9), and is used for controlling the generation of a magnetic field through the power switch (9) and providing a pressing force for the microfluidic chip substrate by matching with the clamp gland (1); the clamp base part comprises a base main body (4) and a base bottom cover (8) and is used for installing the electromagnetic module and preventing the electromagnetic module from being corroded by parts and short-circuited by condensation of water vapor in air.
2. The low-temperature processing clamp for the high polymer microfluidic chip according to claim 1, wherein the clamp gland (1) is made of an antirust and magnetically attractable material, and a groove with a length, a width and a thickness equal to those of the microfluidic chip substrate 1/2 is designed at a contact position of the clamp gland (1) and the microfluidic chip substrate so as to facilitate the positioning of the microfluidic chip substrate; the bottom of the groove is provided with an opening to reserve a space for the cutter to process the substrate; the right angle baffle structure at four corners of anchor clamps gland (1) is used for fixing a position with heat transfer fin (2) in order to prevent the rotation of anchor clamps gland (1) in the course of working, has guaranteed simultaneously with the less area of contact of heat transfer fin (2), avoids steam to condense in the contact gap and leads to dismantling the difficulty.
3. The clamp for low-temperature processing of the high polymer microfluidic chip according to claim 1, wherein the heat exchange fins (2) are made of copper, aluminum or alloy with excellent thermal conductivity, and an internal heat exchange flow channel provides a larger heat exchange area between low-temperature gas, liquid or powder cooling consumables and the heat exchange fins (2); the cooled heat exchange fins (2) are cooled by contacting with the bottom surface of the substrate of the microfluidic chip, so that the heat exchange area of the substrate of the microfluidic chip is increased, and the cooling speed is increased.
4. The low-temperature processing clamp for the high polymer microfluidic chip according to claim 1, wherein an interference-fit aluminum alloy support rib (3) can be embedded in the heat exchange flow channel of the heat exchange fin (2) to increase the structural strength of the heat exchange fin (2) to prevent the pressing force from being too large to cause extrusion deformation, and meanwhile, the aluminum alloy support rib (3) is fixed on the base body (4).
5. The clamp for low-temperature processing of the high polymer microfluidic chip according to claim 1, wherein the electromagnetic module is mainly responsible for controlling the coil (6) to enable the ferromagnetic core (5) to generate a longitudinal magnetic field, the ferromagnetic core (5) is made of low-carbon steel, pure iron or soft iron materials, and an anti-rust coating is added on the surface of the ferromagnetic core, and the magnitude of the pressing force can be adjusted by adjusting the magnitude of current or the number of turns of the coil under different working conditions; meanwhile, the power supply module (7) provides short-circuit protection and leakage protection functions; when the clamp is processed, the clamp gland (1) is used for fixedly pressing the microfluidic chip substrate under the suction force of the magnetic field, the power switch (9) is turned off after the processing is finished, and the magnetic field of the ferromagnetic core (5) disappears so as to be convenient for taking down the clamp gland (1) and the microfluidic chip substrate.
6. The clamp for low-temperature processing of the high polymer microfluidic chip according to claim 1, wherein the power switch (9) is mounted on the side surface of the substrate body (4) by using a touch power switch (9) or by using a split external power switch (9) in order to ensure good sealing performance of the device.
7. The clamp for low-temperature processing of the high polymer microfluidic chip according to claim 1, wherein the clamp base body part is made of aluminum alloy or other materials which are rust-proof and do not affect magnetic field distribution, the inner part of the clamp base body part is hollow for installing the electromagnetic module, and the upper surface of the clamp base body part is used for installing the clamp gland (1) and the heat exchange fins (2).
8. The clamp for low-temperature processing of the high polymer microfluidic chip according to claim 1, wherein the base body (4) is designed with a reflow structure (10) for a low-temperature jet impingement cooling method, that is, a tilted cover plate is arranged on the base body (4) and mainly used for guiding the cooling consumables which are not fully utilized to reflow into the heat exchange fins (2) and cooling the heat exchange fins (2) to a low temperature, thereby cooling the bottom surface of the high polymer microfluidic chip.
9. The high polymer microfluidic chip low-temperature processing clamp according to claim 8, wherein the base body (4) is designed with an immersion tank (11) for a low-temperature tank immersion cooling type low-temperature processing method, and the microfluidic chip substrate, the clamp gland (1) and the heat exchange fins (2) are directly immersed by using cooling consumables, so that the heat exchange fins (2) are efficiently cooled, and further, the bottom surface of the high polymer microfluidic chip is cooled.
10. The low-temperature processing clamp for the high polymer microfluidic chip according to claim 8, wherein the substrate body (4) and the substrate bottom cover (8) are connected by screws, and sealing silica gel is added on the contact surface to ensure good sealing performance.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111055050.6A CN113694976A (en) | 2021-09-09 | 2021-09-09 | Low-temperature processing clamp for high polymer micro-fluidic chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111055050.6A CN113694976A (en) | 2021-09-09 | 2021-09-09 | Low-temperature processing clamp for high polymer micro-fluidic chip |
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| Publication Number | Publication Date |
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| CN113694976A true CN113694976A (en) | 2021-11-26 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202111055050.6A Pending CN113694976A (en) | 2021-09-09 | 2021-09-09 | Low-temperature processing clamp for high polymer micro-fluidic chip |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080236786A1 (en) * | 2007-03-29 | 2008-10-02 | Fujifilm Corporation | Micro fluid device |
| CN206767640U (en) * | 2017-04-17 | 2017-12-19 | 佛山市铬维科技有限公司 | A kind of linear pattern hole position polymeric micro-fluidic chip leads to liquid fixture |
| CN109926109A (en) * | 2019-03-24 | 2019-06-25 | 北京化工大学 | The modularization micro-fluidic chip clamp connect based on magnetic linkage |
| CN111349545A (en) * | 2020-03-13 | 2020-06-30 | 北京中科生仪科技有限公司 | A portable chip clamping device for nucleic acid amplification appearance |
| CN212982947U (en) * | 2020-06-28 | 2021-04-16 | 河北工业大学 | High-efficiency low-cost double-layer channel PCR thermal cycle microfluidic chip device |
| CN112675932A (en) * | 2019-10-17 | 2021-04-20 | 苏州新格元生物科技有限公司 | Automatic processing structure for micro-fluidic chip reaction |
-
2021
- 2021-09-09 CN CN202111055050.6A patent/CN113694976A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080236786A1 (en) * | 2007-03-29 | 2008-10-02 | Fujifilm Corporation | Micro fluid device |
| CN206767640U (en) * | 2017-04-17 | 2017-12-19 | 佛山市铬维科技有限公司 | A kind of linear pattern hole position polymeric micro-fluidic chip leads to liquid fixture |
| CN109926109A (en) * | 2019-03-24 | 2019-06-25 | 北京化工大学 | The modularization micro-fluidic chip clamp connect based on magnetic linkage |
| CN112675932A (en) * | 2019-10-17 | 2021-04-20 | 苏州新格元生物科技有限公司 | Automatic processing structure for micro-fluidic chip reaction |
| CN111349545A (en) * | 2020-03-13 | 2020-06-30 | 北京中科生仪科技有限公司 | A portable chip clamping device for nucleic acid amplification appearance |
| CN212982947U (en) * | 2020-06-28 | 2021-04-16 | 河北工业大学 | High-efficiency low-cost double-layer channel PCR thermal cycle microfluidic chip device |
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Application publication date: 20211126 |