CN113691664B - Ceramic shell, preparation method thereof and electronic equipment - Google Patents
Ceramic shell, preparation method thereof and electronic equipment Download PDFInfo
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- CN113691664B CN113691664B CN202110908825.3A CN202110908825A CN113691664B CN 113691664 B CN113691664 B CN 113691664B CN 202110908825 A CN202110908825 A CN 202110908825A CN 113691664 B CN113691664 B CN 113691664B
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- 239000000919 ceramic Substances 0.000 title claims abstract description 233
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- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical group [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 2
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- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
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- 230000001413 cellular effect Effects 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 229910000423 chromium oxide Inorganic materials 0.000 description 1
- 229910000428 cobalt oxide Inorganic materials 0.000 description 1
- IVMYJDGYRUAWML-UHFFFAOYSA-N cobalt(ii) oxide Chemical compound [Co]=O IVMYJDGYRUAWML-UHFFFAOYSA-N 0.000 description 1
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- 239000012535 impurity Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
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- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/18—Telephone sets specially adapted for use in ships, mines, or other places exposed to adverse environment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M1/00—Inking and printing with a printer's forme
- B41M1/12—Stencil printing; Silk-screen printing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M1/00—Inking and printing with a printer's forme
- B41M1/26—Printing on other surfaces than ordinary paper
- B41M1/34—Printing on other surfaces than ordinary paper on glass or ceramic surfaces
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/10—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on aluminium oxide
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/48—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on zirconium or hafnium oxides, zirconates, zircon or hafnates
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
- C04B35/58—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides
- C04B35/58007—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides based on refractory metal nitrides
- C04B35/58028—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides based on refractory metal nitrides based on zirconium or hafnium nitrides
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/64—Burning or sintering processes
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
- C04B37/04—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with articles made from glass
- C04B37/047—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with articles made from glass by means of an interlayer consisting of an organic adhesive, e.g. phenol resin or pitch
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Structural Engineering (AREA)
- Inorganic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Composite Materials (AREA)
- Signal Processing (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
The embodiment of the application provides a ceramic shell, which comprises a ceramic cover plate and a glass plate, wherein the ceramic cover plate comprises an inner surface and an outer surface. The glass plate is combined with the inner surface, and the transmittance of the ceramic cover plate is more than or equal to 70 percent, so that when external light rays sequentially penetrate through the outer surface and the inner surface and are reflected by the glass plate, the reflected light rays can penetrate through the outer surface. By bonding a glass plate to the inner surface, external light can pass through the ceramic cover plate and be reflected by the glass plate, so that the glass plate can be visually recognized from the outer surface side of the ceramic cover plate. Thus, the whole ceramic shell can be more abundant in appearance by carrying out different designs such as patterns, colors or textures on the glass plate. And because the glass plate is positioned on the inner surface of the ceramic cover plate, the glass plate cannot be worn in the daily use process, and patterns, colors or textures on the glass plate cannot fall off, so that the color difference problem is generated. In addition, the embodiment of the application also provides a preparation method of the ceramic shell and electronic equipment.
Description
Technical Field
The application relates to the technical field of mobile terminals, in particular to a ceramic shell, a preparation method thereof and electronic equipment.
Background
In the related art, the structures such as a middle frame and a rear cover which occupy a larger part of the area of the outer surface of electronic equipment such as a mobile phone and a tablet personal computer are metal shells, and signals are difficult to pass through the electronic equipment due to the electromagnetic shielding effect of the metal shells. At present, the ceramic shell not only can reduce the electromagnetic shielding effect brought by the metal shell, but also can meet the pursuit of consumers on the overall appearance texture of electronic equipment such as mobile phones, tablet computers and the like.
Thus, products have appeared that partially employ ceramic housings as rear covers for electronic devices, but such ceramic housings are often produced using dry pressing, casting or injection molding processes. The green body appearance of the ceramic structural member is relatively monotonous. In order to increase the appearance selection of the ceramic shell, a part of the product is provided with an independent color layer attached to the ceramic structure, but the film stress between the color layer and the ceramic part is larger, so that the adhesive force between the color layer and the ceramic part is poor. The phenomenon that the color layer is partially fallen easily occurs in the long-term use process of the electronic product, and the surface appearance of the ceramic cover plate presents larger chromatic aberration after the color layer falls off.
Disclosure of Invention
The application aims to provide a ceramic shell, a preparation method thereof and electronic equipment, so that the ceramic shell has a richer appearance and color difference is avoided.
In a first aspect, embodiments of the present application provide a ceramic housing comprising a ceramic cover plate and a glass plate, the ceramic cover plate comprising an inner surface and an outer surface opposite the inner surface. The glass plate is combined with the inner surface, and the transmittance of the ceramic cover plate is more than or equal to 70 percent, so that when external light rays sequentially penetrate through the outer surface and the inner surface and are reflected by the glass plate, the reflected light rays can penetrate through the outer surface.
In a second aspect, an embodiment of the present application further provides a method for preparing a ceramic shell, including obtaining a ceramic cover plate, where the ceramic cover plate includes an inner surface and an outer surface opposite to the inner surface, and the transmittance of the ceramic cover plate is equal to or greater than 70%; the glass plate is bonded to the inner surface, and when external light passes through the outer surface and the inner surface in order and is reflected by the glass plate, the reflected light can pass through the outer surface.
In a third aspect, an embodiment of the present application further provides an electronic device, where the electronic device includes the ceramic shell, and an outer surface of the ceramic shell is exposed as at least a part of an appearance surface of the electronic device.
According to the ceramic shell and the preparation method thereof, the transmissivity of the ceramic cover plate exceeds 70%, so that the ceramic cover plate can transmit light, and the glass plate can be visually observed from one side of the outer surface of the ceramic cover plate through combining the glass plate on the inner surface of the ceramic cover plate, wherein external light can transmit the ceramic cover plate and be reflected by the glass plate. Thus, the whole ceramic shell can be more abundant in appearance by carrying out different designs such as patterns, colors or textures on the glass plate. And because the glass plate is positioned on the inner surface of the ceramic cover plate, the glass plate cannot be worn in the daily use process, and patterns, colors or textures on the glass plate cannot fall off, so that the color difference problem is generated.
When the ceramic shell is applied to the electronic equipment, the appearance of the electronic equipment can be rich, and the radio frequency communication effect of the electronic equipment can be improved because the ceramic shell can not generate electromagnetic shielding phenomenon.
These and other aspects of the present application will be more readily apparent from the following description of the embodiments.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the description of the embodiments will be briefly introduced below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present application.
Fig. 2 is a schematic structural diagram of a housing assembly in an electronic device according to an embodiment of the present application.
Fig. 3 is a partial cross-sectional view of the electronic device shown in fig. 1.
Fig. 4 is a schematic structural view of a ceramic shell according to an embodiment of the present application.
Fig. 5 is a schematic structural view of another ceramic housing provided in an embodiment of the present application.
Fig. 6 is a flowchart of a method for manufacturing a ceramic shell according to an embodiment of the present application.
Fig. 7 is a schematic structural view of a ceramic shell according to an embodiment of the present application.
Fig. 8 is a schematic cross-sectional view of a ceramic housing shown in fig. 7.
Detailed Description
The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.
At present, products partially adopting a ceramic shell as a rear cover of electronic equipment are appeared, but the ceramic shell is mostly produced by adopting dry pressing, casting or injection molding processes. The green body of the ceramic structural member is usually in a color such as black, white, red, blue and the like, and has a monotonous appearance. In order to increase the appearance selection of the ceramic shell, a part of the product is provided with an independent color layer attached to the ceramic structure, but the film stress between the color layer and the ceramic part is larger, so that the adhesive force between the color layer and the ceramic part is poor. The phenomenon that the color layer is partially fallen easily occurs in the long-term use process of the electronic product, the appearance of the surface is larger in color difference after the color layer falls off, and the hand feeling is rough. In addition, some products have color layers formed on the ceramic shell by electroplating or coating, and the color layers can reduce the wear resistance of the surface of the ceramic structural member and degrade the hand feel in the preparation process, and the color layers can also wear and color difference in the long-term use process.
Based on this, the inventors of the present application have proposed the ceramic housing, the manufacturing method thereof, and the electronic device of the embodiments of the present application, in order to improve the above-described drawbacks. Embodiments of the present application are described in detail below with reference to the accompanying drawings.
Referring to fig. 1, the present embodiment provides an electronic device 10, in this embodiment, a mobile phone is taken as an example, and the electronic device 10 includes a housing assembly 20, a display screen 60, a motherboard (not shown), and the like. As shown in fig. 2, the housing assembly 20 includes a middle frame 40, a front shell 50 and a ceramic housing 30, wherein the front shell 50 and the ceramic housing 30 are respectively assembled on two opposite sides of the middle frame 40, and the display screen 60 is assembled on the front shell 50; the ceramic housing 30 is assembled to the middle frame 40 as a rear cover, and forms a receiving space together with the middle frame 40 and the front case 50, and various components such as a motherboard, a camera, an antenna, a processor, etc. can be disposed in the receiving space.
The display screen 60 may employ an LCD (Liquid Crystal Display ) screen for displaying information, which may be a TFT (Thin Film Transistor ) screen or an IPS (In-Plane Switching) screen or an SLCD (Splice Liquid Crystal Display, splice-specific liquid crystal display) screen. In other embodiments, the display screen 60 may employ an OLED (Organic Light-emitting diode) screen for displaying information, and the OLED screen may be an AMOLED (Active Matrix OrganicLight Emitting Diode ) screen or a Super AMOLED (Super ActiveMatrix Organic Light Emitting Diode, super active driving Organic Light emitting diode) screen or a Super AMOLED Plus (Super Active Matrix Organic Light Emitting Diode Plus, magic screen) screen, which will not be described herein.
Specifically, in one embodiment, as shown in fig. 3, the ceramic housing 30 is configured in a flat plate-like structure, and the side of the middle frame 40 away from the display screen 60 is provided with a step 41, and the ceramic housing 30 is assembled on the step 41 and exposed as a part of the exterior surface of the electronic device 10. The electronic device 10 further includes a battery 70, which is disposed in the accommodating space and in an area between the ceramic housing 30 and the middle frame 40, and the battery 70 is used for supplying power to other components of the electronic device 10, such as the display screen 60.
Referring to fig. 3 and 4 together, the ceramic housing 30 includes a ceramic cover 310 and a glass plate 320, the ceramic cover 310 includes an inner surface 312 and an outer surface 311, the outer surface 311 is opposite to the inner surface 312, and during assembly, the inner surface 312 faces the front housing 50, i.e. the inner surface 312 faces the accommodating space and various components disposed in the accommodating space, and the outer surface 311 is exposed as a part of the exterior surface of the electronic device 10. Glass plate 320 is bonded to inner surface 312 and is secured relative to ceramic cover plate 310.
The ceramic cover 310 may be transparent to light, i.e., light may pass through the ceramic cover 310 and exit the inner surface 312 when light is incident from the side of the outer surface 311, and light may pass through the ceramic cover 310 and exit the outer surface 311 when light is incident from the side of the inner surface 312. In this embodiment, the ceramic cover plate 310 may be made of a ceramic green body through the processes of discharging glue, sintering, and grinding, and the ceramic green body may be made of a ceramic slurry through the processes of dry pressing, casting, injection molding, etc., and the ceramic slurry may be made of a ceramic raw material powder and a binder, and the ceramic raw material powder may be one or more selected from alumina powder, zirconia powder, and zirconia powder. The transmittance of the ceramic cover plate 310 is equal to or greater than 70%, wherein the transmittance refers to the proportion of the light intensity of the outgoing light to the light intensity of the incoming light when the light passes through the ceramic cover plate 310. For example: when the incident light is incident from the outer surface 311 side toward the inner surface 312 side, the intensity of the light transmitted through the inner surface 312 is equal to or more than 70% of the intensity of the incident light. The transmittance is more than or equal to 70% to ensure that the glass plate 320 can be visually observed through the outer surface of the ceramic cover plate 310, and simultaneously ensure that textures, patterns or colors on the glass plate 320 can be visually observed through the outer surface 311 of the ceramic cover plate 310. In one embodiment, the ceramic cover 310 may have a transmittance of 70% or more for visible light, wherein the wavelength of visible light may range from 390nm to 780nm.
By controlling the haze of the ceramic cover plate 310, the transmittance of the ceramic cover plate 310 can be changed, so that the ceramic cover plate 310 can transmit light. Where haze refers to the percentage of transmitted light that deviates from the incident light by more than 2.5 degrees from the total transmitted light intensity, a greater haze is generally detrimental to transmittance, while a too small haze may result in poor ceramic gloss and weak structural strength. Meanwhile, the thickness of the ceramic cover plate 310 also affects the light transmittance of the whole ceramic cover plate 310, the larger the thickness of the ceramic cover plate 310 is, the worse the light transmittance is, the lower the transmittance is, and the thickness is too large, so that the thickness of the whole electronic equipment 10 is too large, the thinning of the electronic equipment 10 is not facilitated, and the heat dissipation difficulty is also increased. However, the thickness of the ceramic cover plate 310 is too small, which reduces the structural strength of the ceramic cover plate 310 and easily causes cracking, and in some embodiments, the thickness of the ceramic cover plate 310 can be controlled to be 0.05-0.25mm, so that on one hand, the ceramic cover plate 310 is ensured to have sufficient structural strength and not to be easy to crack, and meanwhile, the total thickness of the prepared ceramic shell 30 can be controlled, so that the overlarge overall thickness is avoided.
In order to obtain better product parameters of ceramic cover plate 310, the inventors devised the following experiments:
the ceramic cover plates 3101 to 10 are prepared according to the above preparation method, wherein the thickness, haze and other parameters of each ceramic cover plate 310 are different, and the obtained ceramic cover plate 310 is subjected to a transmittance test by using a transmittance tester (a card-type transmittance tester DR 82). The test results are shown in the following table:
table 1 table 310 transmittance test data for ceramic cover plate
As can be seen from the above table data, when the haze of the ceramic cover plate 310 is about 10% -35%, for example, 12%, 14%, 16%, 18%, 20%, 22%, etc., the transmittance can be controlled to be about 74% -79%, and the change amount of the transmittance value during the thickness change of the ceramic cover plate 310 is small, so in some more specific embodiments, the haze of the ceramic cover plate 310 can be controlled to be 10% -35%, under the haze condition, it can be ensured that the glass plate 320 can penetrate the ceramic cover plate 310 and be visually observed from the outer surface 311 side, and at the same time, the ceramic cover plate 310 does not lose ceramic luster, and the structural strength is moderate. Further, as can be seen from the above table data, when the haze of the ceramic cover plate 310 is about 23% -35%, for example, 25%, 26%, 27%, 28%, 29%, 30%, 33%, 35%, etc., the transmittance change amount of the ceramic cover plate 310 is small along with the thickness change of the ceramic cover plate 310, and can be kept about 75% -76%, so that not only can sufficient light transmittance be ensured, but also the thickness of the ceramic cover plate 310 can be conveniently and reasonably controlled, and the total thickness of the whole ceramic housing 30 can be controlled.
Of course, the haze of the ceramic cover plate 310 is greater than 35% or less than 10%, and the purpose of transmitting light can be achieved. However, too much haze may result in a significant decrease in light transmittance, and the glass sheet 320 may not be more clearly exposed from the outer surface 311. However, the haze is too small, and although the light transmittance is better, the structural strength of the ceramic cover plate 310 is reduced, which is unfavorable for the application in the electronic device 10, and is easy to crack or break during the drop and collision.
The glass plate 320 is configured as a planar glass, and when external light passes through the outer surface 311 and the inner surface 312 in order and is reflected by the glass plate 320, the reflected light can pass through the outer surface 311, that is, the glass plate 320 can be visually recognized from the side of the outer surface 311.
In one embodiment, glass sheet 320 is a unitary transparent glass, and glass sheet 320 may be configured to fully cover inner surface 312 of ceramic cover plate 310 to form ceramic shell 30 with a more uniform and regular appearance. Of course, in other embodiments, the glass plate 320 may cover only a portion of the inner surface 312 of the ceramic cover plate 310, e.g., the glass plate 320 may cover 85% or more of the inner surface 312 of the ceramic cover plate 310, and is not limited thereto. In this embodiment, the ceramic housing 30 further includes an adhesive layer 330, the glass plate 320 can be bonded to the inner surface 312 through the adhesive layer 330, specifically, the adhesive layer 330 is disposed on the inner surface 312, the glass plate 320 is bonded to the adhesive layer 330, and the adhesive layer 330 is transparent to light. The thickness of the adhesive layer 330 is only required to ensure stable connection between the glass plate 320 and the ceramic cover plate 310, and for example, the thickness of the adhesive layer 330 may be 0.08-0.12mm.
The adhesive layer 330 is formed by depositing an adhesive, which may be selected from one or more of paraffin, polyethylene glycol, stearic acid, dioctyl phthalate, polyethylene, polypropylene, polymethyl methacrylate, and polyoxymethylene. The adhesive can also be an acrylic ester adhesive such as a-cyanoacrylate instant adhesive, an anaerobic adhesive, an acrylic acid structure adhesive, an ethyl acrylic ester adhesive, an epoxy acrylic ester adhesive and the like, or a hot melt adhesive such as a hot melt adhesive tape, colloidal particles, adhesive powder, EVA hot melt adhesive, rubber hot melt adhesive, polypropylene, polyester, polyamide, polyurethane hot melt adhesive, styrene hot melt adhesive, novel hot melt adhesive, polyethylene and ethylene copolymer hot melt adhesive and the like. In other embodiments, the adhesive may be a solid polymer adhesive, a solution polymer adhesive, an emulsion polymer adhesive, a monomer polymer adhesive, or other adhesive, and the material of the adhesive is not limited herein. Wherein, when preparing the adhesive, the viscosity of the adhesive can be controlled to be 200cc-500 cc.
By arranging the adhesive layer 330, the composite connection strength between the ceramic cover plate 310 and the glass plate 320 can be enhanced, and meanwhile, the adhesive layer 330 adopts transparent adhesive, so that light can be transmitted, and the exposure of the glass plate 320 can not be influenced.
The glass plate 320 may be provided as colorless glass, and in this embodiment, the glass plate 320 is configured to have a different color from the ceramic cover plate 310, that is, the glass plate 320 may generate light having a wavelength different from the color of the ceramic cover plate 310. The main chemical composition of glass sheet 320 is Na 2 SiO 3 、CaSiO 3 、SiO 2 Or Na (or) 2 O·CaO·6SiO 2 And the like, the main component is silicate double salt, and the silicate double salt is amorphous solid with a random structure. As an embodiment, the glass sheet 320 may be formed into different colors by doping the glass sheet 320 with a colorant, for example: doping of chromium oxide (Cr) 2 O 3 ) The glass is green; manganese dioxide (MnO) is added 2 ) The glass is purple; additive cobalt oxide (Co) 2 O 3 ) The glass is blue, etc. It will be appreciated that when the glass sheet 320 is doped with a colorant, one colorant may be doped, or a plurality of colorants may be doped. In one embodiment, the glass sheet 320 may be divided into a plurality of regions, each of the different regions being doped with the same or different colorants such that the glass sheet 320 exhibits an gradual change in color or the regions are of different colors, enabling a varied appearance scheme.
To control the thickness of the entire ceramic housing 30 to avoid excessive thickness of the ceramic housing 30, the thickness of the glass plate 320 may be controlled to be, for example, 0.25-0.45mm. After the ceramic cover plate 310 is connected by the adhesive layer 330, the structural strength of the ceramic cover plate 310 and the structural strength of the glass plate 320 can be mutually reinforced, so that the structural strength of the whole ceramic housing 30 is increased. If the thickness of the glass plate 320 is too thin, the body structure of the glass plate 320 is weak, and is easily damaged and broken when assembled on the ceramic cover plate 310, and the thickness is too large, which is not beneficial to the light and thin ceramic housing 30.
In particular, in one embodiment, as shown in fig. 5, a pattern layer 340 may be further disposed in the glass plate 320, and the pattern layer 340 may be disposed on a surface of the glass plate 320 remote from the ceramic cover plate 310, and similarly, when external light sequentially passes through the outer surface 311 and the inner surface 312 and is reflected by the pattern layer 340, the reflected light may pass through the outer surface 311, that is, the pattern layer 340 may be visually observed from the outer surface 311 side, so that the ceramic housing 30 may have a more varied appearance. By providing different pattern layers 340, personalized customization of the ceramic shell 30 may be achieved. The pattern layer 340 is disposed on the surface of the glass plate 320 away from the ceramic cover plate 310, so as to avoid damage to the pattern layer 340 during the bonding process of the glass plate 320 and the ceramic cover plate 310. It should be noted that, the pattern layer 340 includes, but is not limited to, various patterns such as a texture pattern, a color pattern, a painting pattern, etc., and the pattern layer 340 may be formed by paint or texture directly on the glass plate 320, which is not limited herein.
The pattern layer 340 may be formed on the surface of the glass plate 320 remote from the ceramic cover plate 310 by screen printing, spraying, pasting, or the like.
To avoid exposing the components inside the electronic device 10, in some embodiments, the surface of the glass plate 320 away from the ceramic cover plate 310 may further be provided with a reflective film layer 350, the reflective film layer 350 may reflect light, and the reflective film layer 350 may cover all or part of the surface of the glass plate 320 away from the ceramic cover plate 310, so that only the color or pattern on the glass plate 320 is exposed from the outer surface 311 without exposing the internal components of the electronic device 10 to the user. The thickness of the light reflecting film 350 can be controlled to be smaller and better to avoid increasing the thickness of the ceramic housing 30, for example: the thickness of the reflective film 350 may be 0.02-0.05mm, and the reflective film 350 may be adhered to the glass plate 320 by means of adhesive bonding. In a more specific embodiment, the reflective film layer 350 may be disposed on the surface of the pattern layer 340 away from the glass plate 320, so that the back surface of the pattern layer 340 may be shielded from light, and the light reflection effect may be improved, so that the pattern layer 340 may be more clearly visualized.
In other embodiments, the adhesive layer 330 may not be provided, and in this case, the glass plate 320 may be directly attached to the ceramic cover 310, and after the ceramic housing 30 is integrally assembled to the electronic device 10, the glass plate 320 may be pressed against the middle frame 40 by bonding or clamping the ceramic cover 310 on the outer side of the electronic device 10 to form a fixation.
Referring to fig. 6, the ceramic housing 30 described above may be prepared as follows:
step S110: a ceramic cover plate 310 is obtained, the ceramic cover plate 310 comprising an inner surface 312 and an outer surface 311 opposite to the inner surface 312.
The ceramic cover plate 310 may be made of a ceramic green body through binder removal, sintering, and grinding, and the ceramic green body may be made of a ceramic slurry through processes such as dry pressing, casting, injection molding, and the like, and the ceramic slurry may be mixed with a binder, and the ceramic raw material powder may be one or more selected from alumina powder, zirconia powder, and zirconia powder.
In a more specific embodiment, the ceramic cover plate may be prepared as follows:
(1) Grinding and filtering the ceramic slurry until the particle size is less than or equal to 180 meshes. Specifically, the ceramic raw material may include Y 2 O 3 、Al 2 O 3 The sintering aid may be, for example, magnesium oxide, and the dispersing agent may be, for example, polyacrylic acid, polyvinyl alcohol, or the like. Mixing ceramic raw materials, adding the mixture into a ball milling tank for ball milling, wherein the ball milling rotating speed is 160-170r/min, the ball milling time is more than 10 hours, and the ball milling medium is alumina balls or other hard balls. In the ball milling process, a surfactant can be added to promote the dispersion effect in the subsequent slurry preparation, and the surfactant can be polyether organic matters.
After ball milling, adding pure water, heating and stirring, adding polyvinyl alcohol, cooling after dissolution, and further ball milling to form ceramic slurry. In this process, the amount of water to be added may be controlled so that the solid content of the ceramic slurry is controlled to 55-60wt%. Filtering, wherein the number of the filtering meshes is 180 meshes. By controlling the particle size of the ceramic slurry, it is ensured that the ceramic formed during the subsequent sintering process has a low bubble rate to form the ceramic cover plate 310 that is transparent to light.
(2) And casting the ceramic green body raw material to obtain a biscuit, cutting and then discharging glue. Specifically, the casting operation may be performed in a casting machine, and the casting tension may be controlled to be, for example, 5 to 7N, and the casting rate may be, for example, 0.1 to 0.12cm/min. After casting, the green body is cut according to the design dimensions of the ceramic cover plate 310. Then placing the mixture in a glue discharging machine for glue discharging treatment to remove organic matters and partial bubbles, wherein the temperature can be 800-850 ℃ and the glue discharging time can be more than 5 hours in the glue discharging process.
(3) And (3) preserving heat, sintering and discharging glue for at least 10h under the condition that the vacuum degree is less than 0.01Pa and the temperature is more than or equal to 1000 ℃, and annealing for at least 12h under the condition that the temperature is more than or equal to 1500 ℃ after sintering to form the ceramic cover plate. The parameter control of the sintering process is important for the transmittance of the ceramic cover plate 310, so that the vacuum degree in the sintering process needs to be ensured to be high, the bubble rate can be reduced to be less than or equal to 0.25% even if bubbles in the green body are discharged, the green body is vitrified at high temperature, and the ceramic cover plate formed after sintering can have the transmittance of more than or equal to 70% by precisely controlling the parameter in the sintering process.
(4) And polishing the outer surface of the ceramic cover plate to enable the outer surface to be smooth and have certain ceramic luster.
The transmittance of the ceramic cover plate prepared by the preparation method can be more than or equal to 70%, and the requirements of preparing the ceramic shell are met.
Step S120: the glass sheet 320 is bonded to the inner surface 312 such that the glass sheet 320 is exposed to the outer surface 311 through the ceramic cover 310.
Specifically, in the present embodiment, an adhesive layer 330 is provided on the inner surface 312 of the ceramic cover plate 310, and the glass plate 320 is adhered to the adhesive layer 330 and baked to cure the adhesive layer. For example: the ceramic cover plate 310 can be fixed by the jig, the inner surface 312 of the ceramic cover plate 310 faces upwards relative to the outer surface 311, then the adhesive is uniformly sprayed on the inner surface 312 of the ceramic cover plate 310 by using a spray gun to form an adhesive layer 330, the adhesive is controlled between 200 and 500cc, and the air pressure of the spray gun can be between 0.6MPa and 0.8MPa, for example. The pressure is applied to the glass plate 320 to adhere the glass plate 320 to the adhesive layer 330, wherein when the pressure is applied to the glass plate 320, the pressure value can be controlled to be approximately 1.8 kgf-2.2 kgf, for example, the adhesion pressure is controlled to be 2kgf, and the pressure is maintained for at least 2s, so that the glass plate 320 is fully adhered and fixed with the ceramic cover plate 310 through the adhesive layer 330, and after the pressure maintaining, the overflow glue at the joint of the ceramic cover plate 310 and the glass plate 320 is cleaned. The adhesive layer is baked to cure, and the baking temperature may be, for example, 60 to 100℃and the baking time may be 8 to 12 mi. In a more specific embodiment, the baking temperature is controlled to 85 ℃ and the baking time is controlled to 10mi n.
In some embodiments, the glass plate 320 may be pre-patterned with a reflective film layer and then bonded to the inner surface 312 of the ceramic cover plate 310 along with the glass plate 320.
Specifically, the operation may be performed as follows:
(a) A glass substrate, which is a transparent glass plate, is prepared. Preparing a printing screen with patterns, and coating light guide ink on the surface of the printing screen. Specifically, description will be given by taking an example of forming an ink pattern: firstly, preparing a printing screen, coating photoresist on the printing screen, and transferring uniform dot patterns to the photoresist surface of the screen by matching a UV lamp with a film; the lattice point pattern consists of uniformly distributed light guide lattice points. The light guide ink is prepared and can be a commercial product, and the light guide ink is uniformly stirred and then uniformly coated on the surface of the photoresist.
(b) Printing the surface of the printing screen coated with the light guide ink on one side surface of the glass substrate to form a pattern layer. For example: a doctor blade may be used to print the light directing ink onto the glass sheet to form the patterned layer.
(c) And arranging a reflective film layer on the surface of the pattern layer far away from the glass substrate to form the glass plate with the pattern layer. The reflective film layer can be adhered to the surface of the pattern layer, which is far away from the glass plate, through optical cement. In the bonding process, bubbles are prevented from being generated between the reflective film layer and the pattern layer, the reflective film layer is wrinkled as much as possible, and dust, impurities and the like are mixed as much as possible.
And then bonding the surface of the glass plate far away from the pattern layer to the inner surface, namely preparing the glass plate with the pattern layer. The pattern layer forming mode can enable the pattern layer to have good bonding force with the glass plate, and color difference is not easy to break away. And the reflective film layer can greatly improve the reflectivity of light, so that when external light sequentially passes through the outer surface 311 and the inner surface 312 and is reflected by the glass plate 320 and the pattern layer, most of light can be reflected, and further the reflected light can have higher brightness after passing through the outer surface 311, so that a user can clearly see the pattern layer.
The ceramic housing 30 provided in this embodiment can make the glass plate 320 exposed from the outer surface 311 of the ceramic cover plate 310, and has a more diversified appearance, and the whole has ceramic luster, and maintains a better structural strength, and can be applied to various types of electronic devices 10. The method for manufacturing the ceramic housing 30 can stabilize the connection between the glass plate 320 and the ceramic cover plate 310, and maintain the ceramic luster and light transmittance of the outer surface 311.
Referring to fig. 7, this embodiment provides another ceramic housing 30, which is different from the first embodiment in that the ceramic housing 30 is different in structure, and only the differences in this embodiment are described, and the same points refer to the related matters of the first embodiment.
The electronic device 10 is typically provided with a rear camera, a fingerprint module, and the like, which typically require an opening in the rear cover and extend from the opening. Because the glass plate 320 has a planar structure, the position corresponding to the opening needs to be provided with the opening, and the edge of the glass plate 320 is easy to be damaged under a slight external force during the assembly process.
In this embodiment, as shown in fig. 8, the ceramic housing 30 includes an inner surface 312 and an outer surface 311, the inner surface 312 and the outer surface 311 being disposed opposite to each other. The ceramic housing 30 includes a planar plate 311, a first surrounding portion 312, and a second surrounding portion 313, the planar plate 311 is provided with a through hole 301, and the through hole 301 penetrates the planar plate 311 and is used for exposing a part of elements of the electronic device 10, such as a camera, a fingerprint module, etc. The first surrounding edge 312 is disposed on the planar plate 311 and protrudes toward one side of the planar plate 311, and the first surrounding edge 312 is adjacent to the through hole 301, the first surrounding edge 312 is annular and surrounds the through hole 301, the second surrounding edge 313 is disposed along the outer edge of the planar plate 311 and protrudes toward one side of the planar plate 311, and the first surrounding edge 312 and the second surrounding edge 313 are located on the same side of the planar plate 311. The outer edge of the planar plate 311 refers to the edge of the planar plate 311 away from the through hole 301. The inner surface 312 is formed on the planar plate 311, the surface of the first peripheral portion 312 facing the second peripheral portion 313, and the surface of the second peripheral portion 313 facing the first peripheral portion 312.
The ceramic housing 30 further includes a glass plate 320 and an adhesive layer 330, wherein the adhesive layer 330 is disposed on a surface of the first peripheral edge portion 312 facing the second peripheral edge portion 313 and a surface of the second peripheral edge portion 313 facing the first peripheral edge portion 312, and the glass plate 320 is adhered to the adhesive layer 330 and combined with the ceramic cover plate 310. The configuration of the glass plate 320 is configured to be the same as that of the planar plate body 311, and the glass plate 320 is provided with a mounting hole, and the first peripheral edge portion 312 is embedded in the mounting hole.
The arrangement mode has the advantages that:
1) Because the adhesive layer 330 is disposed on the first surrounding edge 312 and the second surrounding edge 313, and the adhesive layer 330 is not required to be disposed on the planar plate 311, the thickness of the entire ceramic housing 30 can be reduced, and because the adhesive layer 330 is not required to be disposed on the planar plate 311, the transmittance of the adhesive layer 330 is prevented from being reduced, and the light transmission effect is better.
2) Because the thickness of the adhesive layer 330 is reduced, the thickness of the ceramic cover plate 310 and/or the glass plate 320 may be appropriately increased to enhance the structural strength of the entire ceramic housing 30.
3) The edge of the glass plate 320 is very easy to be damaged, and slight external force can enable the glass plate 320 to generate stress and fracture, and as the first surrounding edge 312 is deep into the mounting hole, the first surrounding edge 312 can play a role in protecting the glass plate 320, so that the electronic equipment 10 is prevented from contacting the edge of the glass plate 320 or forming force on the glass plate 320 when parts such as a camera and a fingerprint module are assembled, and the glass plate 320 is prevented from being damaged.
4) The adhesive layer 330 is disposed in the bending arc region of the ceramic cover plate 310, and can effectively buffer the glass plate 320, so as to avoid damage caused by extruding the glass plate 320 during assembly.
Further, in some embodiments, the surface of the glass plate 320 away from the ceramic cover plate 310 may be flush with the surface of the first peripheral edge portion 312 away from the planar plate body 311 and/or the surface of the second peripheral edge portion 313 away from the planar plate body 311, which may make the thickness of the entire ceramic housing 30 uniform and more convenient in assembly. Of course, the surface of the first edge 312 facing away from the planar plate 311 and/or the surface of the second edge 313 facing away from the planar plate 311 may also protrude from the surface of the glass plate 320 facing away from the ceramic cover plate 310.
The ceramic housing 30 provided in this embodiment can be used for setting other parts such as a camera or a fingerprint module, and will not damage the glass plate 320 during the setting process, and the thickness of the ceramic housing 30 can be reduced.
The ceramic housing 30 provided in this embodiment may be prepared in the following manner:
step S110: a ceramic cover plate 310 is obtained, the ceramic cover plate 310 comprising an inner surface 312 and an outer surface 311 opposite to the inner surface 312. In particular, a ceramic blank may be injected into a mold, and the ceramic cover plate 310 and the through-hole 301 may be integrally formed. It should be noted that the specific preparation method of the ceramic cover plate 310 may be performed with reference to the foregoing description.
Step S120: the glass sheet 320 is bonded to the inner surface 312 such that the glass sheet 320 is exposed to the outer surface 311 through the ceramic cover 310. Specifically, the mounting hole may be first cut in the glass plate 320, and then the adhesive layer 330 is disposed on the surface of the first peripheral edge portion 312 facing the second peripheral edge portion 313 of the ceramic cover plate 310 and the surface of the second peripheral edge portion 313 facing the first peripheral edge portion 312, so that the mounting hole of the glass plate 320 is aligned with the through hole 301 in the ceramic cover plate 310, and is mounted and adhered to the ceramic cover plate 310.
It should be noted that the patterned layer and the reflective film layer may be formed on the glass plate 320, and the specific preparation method may be performed according to the foregoing description.
The electronic device 10 in the present application may be a mobile phone or a smart phone (e.g., iPhone (TM) -based, android (TM) -based phones), portable gaming devices (e.g., nintendo (TM) -based, playStation Portable (TM) -Gameboy Advance TM, iPhone (TM)), laptops, PDAs, portable internet devices, music players, and data storage devices, other handheld devices, and devices such as watches, headphones, pendants, headphones, etc., the electronic device 10 may also be other wearable devices (e.g., head-mounted devices (HMDs) such as e-glasses, e-clothing, e-bracelets, e-necklaces, e-tattoos, the electronic device 10, or smart watches).
The electronic device 10 may also be any of a number of electronic devices 10, the number of electronic devices 10 including, but not limited to, cellular telephones, smart phones, other wireless communication devices, personal digital assistants, audio players, other media players, music recorders, video recorders, cameras, other media recorders, radios, medical devices, vehicle transportation equipment, calculators, programmable remote controls, pagers, laptop computers, desktop computers, printers, netbooks, personal Digital Assistants (PDAs), portable Multimedia Players (PMPs), moving picture experts group (MPEG-1 or MPEG-2) audio layer 3 (MP 3) players, portable medical devices, and digital cameras, and combinations thereof.
The foregoing description is only of the preferred embodiments of the present application and is not intended to limit the same, but rather, various modifications and variations may be made by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application should be included in the protection scope of the present application.
Claims (10)
1. A ceramic shell, comprising:
a ceramic cover plate comprising an inner surface and an outer surface opposite to the inner surface, wherein the thickness of the ceramic cover plate is 0.05-0.25mm, the haze of the ceramic cover plate is 10% -35%, and the transmittance of the ceramic cover plate to light with a wavelength ranging from 390nm to 780nm is greater than or equal to 71.10% and less than or equal to 78.40%;
and the surface, far away from the ceramic cover plate, of the glass plate is also provided with a reflective film layer, so that when external light sequentially passes through the outer surface and the inner surface and is reflected by the glass plate, the reflected light can pass through the outer surface.
2. The ceramic housing of claim 1, further comprising an adhesive layer disposed on the inner surface, the glass sheet adhered to the adhesive layer, the adhesive layer being transparent to light.
3. The ceramic shell of claim 2, wherein the thickness of the adhesive layer is 0.08-0.12mm.
4. A ceramic housing according to any one of claims 1 to 3, further comprising a light shielding layer disposed on a surface of the glass sheet remote from the ceramic cover plate.
5. The ceramic shell according to claim 2, wherein the ceramic cover plate comprises a planar plate body, a first edge portion and a second edge portion, the planar plate body is provided with a through hole, the first edge portion is arranged on the planar plate body and surrounds the through hole, the second edge portion is arranged along the edge of the planar plate body far away from the first edge portion and is positioned on the same side of the planar plate body as the first edge portion, the adhesive layer is arranged on the surface of the first edge portion facing the second edge portion and the surface of the second edge portion facing the first edge portion, the glass plate is adhered to the planar plate body and is adhered to the adhesive layer
6. A method of making a ceramic shell comprising:
obtaining a ceramic cover plate, wherein the ceramic cover plate comprises an inner surface and an outer surface opposite to the inner surface, the thickness of the ceramic cover plate is 0.05-0.25mm, the haze of the ceramic cover plate is 10-35%, and the transmittance of the ceramic cover plate to light with the wavelength ranging from 390nm to 780nm is more than or equal to 71.10% and less than or equal to 78.40%;
and combining the glass plate with the inner surface, wherein a reflective film layer is further arranged on the surface, far away from the ceramic cover plate, of the glass plate, and when external light sequentially penetrates through the outer surface and the inner surface and is reflected by the glass plate, the reflected light can penetrate through the outer surface.
7. The method of claim 6, wherein the obtaining a ceramic cover plate comprises:
grinding and filtering the ceramic slurry until the particle size is less than or equal to 180 meshes;
casting the ceramic green body raw material to obtain a biscuit, cutting and then discharging glue;
the green body after glue discharging is sintered at the temperature of more than or equal to 1000 ℃ for at least 10 hours under the vacuum degree of less than 0.01Pa, and is annealed for at least 12 hours at the temperature of more than or equal to 1500 ℃ after sintering, so that the ceramic cover plate is formed;
and polishing the outer surface of the ceramic cover plate.
8. The method of claim 6, wherein prior to bonding the glass sheet to the inner surface, further comprising:
preparing a printing screen with patterns, coating light guide ink on the surface of the printing screen, printing the surface of the printing screen coated with the light guide ink on one side surface of a glass substrate to form a pattern layer, and arranging a reflective film layer on the surface of the pattern layer far away from the glass plate to form the glass plate with the pattern layer;
the bonding of the glass sheet to the inner surface comprises:
a surface of the glass sheet remote from the patterned layer is bonded to the inner surface.
9. The method of any one of claims 6-8, wherein bonding the glass sheet to the inner surface comprises:
and arranging an adhesive layer on the inner surface of the ceramic cover plate, adhering the glass plate to the adhesive layer, and baking to cure the adhesive layer.
10. An electronic device comprising the ceramic housing of any one of claims 1-5, wherein the outer surface is exposed as at least part of an exterior surface of the electronic device.
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Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106887486A (en) * | 2017-03-03 | 2017-06-23 | 中国科学院宁波材料技术与工程研究所 | Structure of Bar-code fluorescence ceramics for white light LED part and preparation method and application |
| CN109022882A (en) * | 2018-07-16 | 2018-12-18 | 昆明理工大学 | A kind of preparation method of ceramic particle reinforced metal base body space lattice composite material |
| CN110357621A (en) * | 2019-08-12 | 2019-10-22 | Oppo广东移动通信有限公司 | Ceramic shell and preparation method thereof, electronic equipment |
| CN111016328A (en) * | 2019-12-31 | 2020-04-17 | 潮州三环（集团）股份有限公司 | Ceramic and glass composite shell for mobile terminal to be light and thin |
| CN111152586A (en) * | 2019-12-31 | 2020-05-15 | Oppo广东移动通信有限公司 | Housing, electronic device, and method for manufacturing housing |
| CN210745739U (en) * | 2019-09-12 | 2020-06-12 | Oppo广东移动通信有限公司 | Ceramic case and electronic device |
| CN112299847A (en) * | 2020-10-30 | 2021-02-02 | 新沂市锡沂高新材料产业技术研究院有限公司 | 5G communication signal-based unshielded microcrystalline ceramic backboard preparation method |
| CN112492066A (en) * | 2019-09-11 | 2021-03-12 | 苹果公司 | Electronic device having cover member with adhesive layer |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102640704B1 (en) * | 2018-08-02 | 2024-02-27 | 삼성전자 주식회사 | A cover class and an elelctronic apparturs compsrising the same |
-
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- 2021-08-09 CN CN202110908825.3A patent/CN113691664B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106887486A (en) * | 2017-03-03 | 2017-06-23 | 中国科学院宁波材料技术与工程研究所 | Structure of Bar-code fluorescence ceramics for white light LED part and preparation method and application |
| CN109022882A (en) * | 2018-07-16 | 2018-12-18 | 昆明理工大学 | A kind of preparation method of ceramic particle reinforced metal base body space lattice composite material |
| CN110357621A (en) * | 2019-08-12 | 2019-10-22 | Oppo广东移动通信有限公司 | Ceramic shell and preparation method thereof, electronic equipment |
| CN112492066A (en) * | 2019-09-11 | 2021-03-12 | 苹果公司 | Electronic device having cover member with adhesive layer |
| CN210745739U (en) * | 2019-09-12 | 2020-06-12 | Oppo广东移动通信有限公司 | Ceramic case and electronic device |
| CN111016328A (en) * | 2019-12-31 | 2020-04-17 | 潮州三环（集团）股份有限公司 | Ceramic and glass composite shell for mobile terminal to be light and thin |
| CN111152586A (en) * | 2019-12-31 | 2020-05-15 | Oppo广东移动通信有限公司 | Housing, electronic device, and method for manufacturing housing |
| CN112299847A (en) * | 2020-10-30 | 2021-02-02 | 新沂市锡沂高新材料产业技术研究院有限公司 | 5G communication signal-based unshielded microcrystalline ceramic backboard preparation method |
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