CN113690147A - Integrated circuit packaging structure and method thereof - Google Patents
Integrated circuit packaging structure and method thereof Download PDFInfo
- Publication number
- CN113690147A CN113690147A CN202110940256.0A CN202110940256A CN113690147A CN 113690147 A CN113690147 A CN 113690147A CN 202110940256 A CN202110940256 A CN 202110940256A CN 113690147 A CN113690147 A CN 113690147A
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- Prior art keywords
- glue
- integrated circuit
- plate
- rubber coating
- device main
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 65
- 238000000034 method Methods 0.000 title claims abstract description 17
- 239000003292 glue Substances 0.000 claims abstract description 65
- 238000010073 coating (rubber) Methods 0.000 claims abstract description 40
- 238000004026 adhesive bonding Methods 0.000 claims abstract description 33
- 239000000758 substrate Substances 0.000 claims description 48
- 238000010030 laminating Methods 0.000 claims description 20
- 239000000463 material Substances 0.000 claims description 20
- 238000007599 discharging Methods 0.000 claims description 19
- 230000001681 protective effect Effects 0.000 claims description 19
- 239000011248 coating agent Substances 0.000 claims description 18
- 238000000576 coating method Methods 0.000 claims description 18
- 238000001514 detection method Methods 0.000 claims description 7
- 238000005538 encapsulation Methods 0.000 abstract description 12
- 230000000694 effects Effects 0.000 abstract description 11
- 239000002699 waste material Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 239000011120 plywood Substances 0.000 description 2
- 231100000241 scar Toxicity 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Coating Apparatus (AREA)
Abstract
The invention relates to the technical field of integrated circuit packaging structures, in particular to an integrated circuit packaging structure and a method thereof. Set up for the rectangle form through the rubber coating groove, and only the through-hole with the inside intercommunication of dwang is seted up in the four corners, make only a small amount glue can reach in the rubber coating groove, when avoiding going out to glue too much and leading to overflowing, can utilize the dwang when removing, order about the dwang and drive out offset plate and encapsulation base plate, the limiting plate rotates, thereby let the glue in the rubber coating inslot four corners throw away under the effect of centrifugal force and distribute whole rubber coating groove, produce the effect that one was dragged to gluing, thereby guarantee to glue evenly adhere to and avoid having the bubble in it, and then guarantee the leakproofness of encapsulation.
Description
Technical Field
The invention relates to the technical field of integrated circuit packaging structures, in particular to an integrated circuit packaging structure and a method thereof.
Background
To meet the trend of light weight and small size of electronic products, devices such as CPU chips are highly integrated in a structure with a limited area, and in order to protect such important devices, it is necessary to package the devices on the outer side to ensure the durability of the devices.
But the function of the existing integrated circuit packaging equipment is relatively single, so that the equipment cannot be inspected when being formed into a complex structure, the external damage of a chip substrate is avoided, the waste product cost is increased when the equipment enters the next procedure, dislocation and glue overflow are easily caused during packaging, and the problem of poor packaging tightness caused by bubbles in the glue is solved.
Disclosure of Invention
An integrated circuit package structure and a method thereof are provided to solve the technical problems in the background art.
The utility model provides an integrated circuit packaging structure, includes the device main part, the outside front mounting of device main part has drive arrangement, device main part internally mounted has fortune flitch, and fortune flitch is articulated setting each other, CDD check out test set is installed in the inside upper end left side of device main part, the inside upper end mid-mounting of device main part has row material runner, the rubber coating device is installed on the inside upper end right side of device main part, the rubber coating device outside is provided with the laminating and changes the board, the rubber coating device outside still is provided with out the offset plate, the inside storage gluey chamber of having seted up of rubber coating device, and the device main part inner wall is installed one end and is set up the dead lever inside the rubber coating device, the inside draw-in groove that is provided with of fortune flitch, draw-in groove internally mounted has outer roof.
Preferably, the CDD detection device is connected with an external central control device, and the discharge rotating wheel is connected with the external central control device.
Preferably, the inner wall of the device main body is provided with a slide rail, and two sides of the attaching rotating plate are provided with connecting rods embedded in the slide rail.
Preferably, the gluing device is connected with the driving device on one side, the slide rail is formed by connecting multiple sections of slide grooves with different radians, and the limiting plate is installed on the inner side of the laminating rotating plate.
As preferred, rubber coating device one side is provided with small-size pressurized equipment, it is connected with the dwang to go out offset plate one side, go out offset plate one side and seted up the rubber coating groove, the dwang is the cavity setting.
Preferably, the rotating rod one end is penetrated through the glue storage cavity and is contacted with the fixed rod, a bevel gear is arranged at one end of the rotating rod, and gear teeth capable of being meshed with the bevel gear on the rotating rod are arranged on the fixed rod.
Preferably, the glue coating groove is rectangular, and only four corners of the glue coating groove are provided with through holes communicated with the inside of the rotating rod.
Preferably, the clamping grooves are arranged on the integral material conveying plate at intervals, and the two sides of the inner wall of each clamping groove are provided with bumps made of rubber materials.
Preferably, one end of the outer top plate penetrates through the inside of the clamping groove and is arranged in an arc-shaped protruding mode, and a top block with one side inclined into an arc shape is arranged inside the device main body.
A method of packaging an integrated circuit, comprising the steps of:
the method comprises the following steps that firstly, a chip packaging substrate and a protective cover are placed on a material conveying plate, wherein the protective cover is placed in a clamping groove;
secondly, sequentially checking the chip packaging substrates by using a CDD detection setting;
thirdly, discharging the packaging substrate detected to be damaged by using a discharging rotating wheel;
fourthly, uniformly adhering glue on the adhesive coating device;
and fifthly, attaching the protective cover and the packaging substrate through the outer top plate and the top block to complete packaging.
Preferably, the glue discharging plate on the gluing device can make the glue uniformly adhere by using centrifugal force.
Preferably, the packaging substrate and the protective cover are arranged on the material conveying plate in a mutually spaced and crossed mode.
Compared with the prior art, the invention has the following beneficial effects:
1. be connected through CDD check out test set and outside well accuse equipment, arrange the material runner and be connected with outside well accuse equipment, then when fortune flitch removes and takes the packaging substrate to CDD check out test set lower extreme, just can transmit its optical image to outside in the accuse equipment, thereby judge whether to have the damage to packaging substrate, when detecting to have the scar on the packaging substrate, then can start to arrange the material runner and rotate, utilize the commentaries on classics piece in its outside to outwards discharge packaging substrate, avoid it to get into next process and increase waste product cost.
2. The gluing device is characterized in that a gluing rotating plate is arranged on the outer side of the gluing device, a slide rail is arranged on the inner wall of the device main body, connecting rods embedded in the slide rail are arranged on two sides of the gluing rotating plate, when the driving device drives the gluing device to rotate, the gluing rotating plate can move along the track of the slide rail, the gluing rotating plate with the lower end outwards rotated can be used for contacting and shoveling a packaging substrate on a conveying plate, then the packaging substrate can directly enter a limiting plate in the gluing rotating plate along with the continuous rotation of the gluing device, the sliding rail is formed by connecting a plurality of sections of slide grooves with different radians, the gluing rotating plate can rotate along with the continuous rotation of the gluing device, the limiting plate drives the packaging substrate to contact with a glue outlet plate, so that the packaging substrate is fixed to avoid gluing dislocation, and the glued packaging substrate can slide downwards under the action of an inclined plate to be discharged under the action of the inclined plate when the gluing rotating plate moves to the lower end of the gluing device, set up for the interval through the draw-in groove on holistic fortune flitch, and draw-in groove inner wall both sides are provided with rubber materials's lug, make can be through placing the protection casing inside the draw-in groove, thereby when avoiding laminating commentaries on classics board also upwards to drive it, also can not drop when the protection casing moves down ejection of compact conveyer belt upper end, and then can correspond from top to bottom with the encapsulation base plate after the rubber coating, then can utilize the cambered surface contact of outer roof and kicking block to ejecting and encapsulation base plate laminating downwards with the protection casing, reach the effect of accurate laminating encapsulation.
3. One side of the glue discharging plate is connected with a rotating rod, one side of the glue discharging plate is provided with a glue coating groove, the rotating rod is arranged in a hollow manner, glue in the glue storage cavity can enter the rotating rod under the action of a pressurizing device and reach the glue coating groove, the glue coating groove is arranged in a rectangular manner, only four corners of the rotating rod are provided with through holes communicated with the inside of the rotating rod, only a small amount of glue can reach the glue coating groove, when the overflow caused by excessive glue discharging is avoided, one end of the rotating rod can penetrate through the inside of the glue storage cavity and is contacted with the fixing rod, one end of the rotating rod is provided with a bevel gear, the fixing rod is provided with gear teeth capable of being occluded with the bevel gear on the rotating rod, the rotating rod can be driven to drive the glue discharging plate to be contacted with the gear teeth on the fixing rod along with the glue coating device, the limiting plate rotates, and the glue at four corners of the glue coating groove is thrown to be full of the whole glue coating groove under the action of centrifugal force, the glue is pulled, so that the glue is ensured to be uniformly attached to avoid bubbles in the glue, and the sealing property of the package is ensured.
Drawings
FIG. 1 is a system block diagram of the apparatus of the present invention;
FIG. 2 is a perspective view of the main body of the device of the present invention;
FIG. 3 is a perspective view of the interior of the body of the device of the present invention;
FIG. 4 is an enlarged view taken at A of FIG. 3 according to the present invention;
FIG. 5 is an enlarged view of the invention at B of FIG. 3;
FIG. 6 is a perspective view of the glue dispensing plate of the present invention;
FIG. 7 is a top view of the gluing device of the present invention;
FIG. 8 is a front view of the slide of the present invention;
fig. 9 is a perspective view of the inside of a rotating lever of the present invention.
In FIGS. 1-9: 1-a device body, 2-a material conveying plate, 3-a driving device, 4-CDD detection equipment, 5-a discharging rotating wheel, 6-a gluing device, 7-a sliding rail, 8-an inclined plate, 9-a discharging conveying belt, 10-a laminating rotating plate, 11-a gluing groove, 12-a limiting plate, 13-a gluing plate, 14-a rotating rod, 15-a glue storage cavity, 16-a fixing rod, 17-a clamping groove, 18-an outer top plate, 19-a top block and 20-a convex block.
Detailed Description
Referring to fig. 1 to 9, a planar structure diagram and a three-dimensional structure diagram of an integrated circuit package structure and a method thereof are shown.
The utility model provides an integrated circuit packaging structure, including device main part 1, drive arrangement 3 is openly installed to 1 outside of device main part, 1 internally mounted of device main part has fortune flitch 2, and fortune flitch 2 sets up for articulated each other, CDD check out test set 4 is installed in 1 inside upper end left side of device main part, 1 inside upper end mid-mounting of device main part has row material runner 5, rubber coating device 6 is installed on 1 inside upper end right side of device main part, the 6 outside of rubber coating device is provided with laminating commentaries on classics board 10, the 6 outside of rubber coating device still is provided with out offset plate 13, rubber coating device 6 is inside to have seted up and to store up gluey chamber 15, the dead lever 16 of one end setting in 6 insides of rubber coating device is installed to 1 inner wall of device main part, 2 inside draw-in groove 17 that is provided with of fortune flitch, draw-in groove 17 internally mounted has outer roof 18.
In the concrete implementation, CDD check out test set 4 is connected with outside well accuse equipment, arrange material runner 5 and outside well accuse equipment and be connected, then when fortune flitch 2 removes and takes the packaging substrate to CDD check out test set 4 lower extreme, just can transmit its optical image to outside well accuse equipment in to judge whether there is the damage to the packaging substrate, when detecting to have the scar on the packaging substrate, then can start row material runner 5 and rotate, utilize the commentaries on classics piece in its outside outwards to discharge the packaging substrate, avoid it to get into next process and increase the waste product cost.
In the concrete implementation, slide rail 7 has been seted up to device main part 1 inner wall, laminating commentaries on classics board 10 both sides are provided with the connecting rod of gomphosis in slide rail 7 inside, then when drive arrangement 3 drove rubber coating device 6 rotatory, can let laminating commentaries on classics board 10 remove along the track of slide rail 7, just can utilize the laminating commentaries on classics board 10 that its lower extreme outwards rolled out to contact with the encapsulation base plate on fortune flitch 2 and shovels it up, then along with rubber coating device 6's continuation is rotatory, encapsulation base plate can directly get into in the limiting plate 12 in laminating commentaries on classics board 10.
In concrete implementation, 6 one sides of rubber coating device are connected with drive arrangement 3, slide rail 7 is the spout connection constitution of the different radians of multistage, the limiting plate 12 is installed to laminating commentaries on classics board 10 inboard, make along with the continuation of rubber coating device 6 rotatory, laminating commentaries on classics board 10 can be rotatory in the 6 outsides of rubber coating device mutually, let limiting plate 12 drive packaging substrate and play offset 13 contact, thereby fix the packaging substrate and avoid the rubber coating dislocation, and the packaging substrate who has scribbled the glue can be changeed board 10 in the laminating and remove when 6 lower extremes of rubber coating device the roll-off downwards and reach discharge conveyor 9 under the effect of swash plate 8 on.
In concrete implementation, 6 one sides of rubber coating device are provided with small-size pressurized equipment, it is connected with dwang 14 to go out plywood 13 one side, it has seted up rubber coating groove 11 to go out plywood 13 one side, dwang 14 sets up for cavity, rubber coating groove 11 sets up for the rectangle form, and only the through-hole with the inside intercommunication of dwang 14 is seted up in the four corners, then store up glue in the chamber 15 glue just can get into the dwang 14 under pressurized equipment's effect in reacing rubber coating groove 11, and only a small amount of glue can reach in the rubber coating groove 11, avoid going out to glue too much and lead to spilling over.
In concrete implementation, dwang 14 one end is run through and is stored up gluey 15 inside and dead lever 16 and contact, dwang 14 one end is provided with bevel gear, be provided with on the dead lever 16 can with the dwang 14 on the teeth of a cogwheel interlock, then dwang 14 is along with the wheel tooth contact back on 6 rebound of rubber coating device and the dead lever 16, just can order about dwang 14 to drive out offset plate 13 and packaging substrate, limiting plate 12 rotates, thereby let glue of four corners throw away under the effect of centrifugal force and be covered with whole rubber coating groove 11 in the rubber coating groove 11, produce the effect that one was dragged to gluing, thereby guarantee to glue evenly to adhere to and avoid there being the bubble in it, and then guarantee the leakproofness of encapsulation.
In concrete implementation, the inside draw-in groove 17 of wearing out and just setting up for the arc evagination of roof 18 one end, the inside kicking block 19 that is provided with the lopsidedness arc form of device main part 1, make can be through placing the protection casing inside draw-in groove 17, thereby avoid laminating commentaries on classics board 10 when also upwards driving it, also can not drop when the protection casing moves down discharging conveyor 9 upper ends, and then can correspond from top to bottom with the encapsulation base plate after the rubber coating, then can utilize the cambered surface contact of roof 18 and kicking block 19 to ejecting and the encapsulation base plate laminating downwards with the protection casing, reach the effect of accurate laminating encapsulation.
A method of packaging an integrated circuit, comprising the steps of:
firstly, placing a chip packaging substrate and a protective cover on a material conveying plate 2, wherein the protective cover is placed in a clamping groove 17;
secondly, sequentially checking the chip packaging substrates by using a CDD detection device 4;
thirdly, discharging the packaging substrate detected to be damaged by using a discharging rotating wheel 5;
fourthly, glue is evenly attached to the glue coating device 6;
and fifthly, attaching the protective cover and the packaging substrate through the outer top plate 18 and the top block 19 to complete packaging.
In the specific implementation, the glue discharging plate on the gluing device 6 can make the glue be uniformly attached by using centrifugal force.
In a specific implementation, the package substrate and the protective cover are alternately arranged on the material conveying plate 2 at intervals.
The working principle of the integrated circuit packaging structure and the method thereof is as follows.
Firstly, the CDD detection device 4 is connected with an external central control device, the discharging rotating wheel 5 is connected with the external central control device, when the material conveying plate 2 moves to bring the packaging substrate to the lower end of the CDD detection device 4, an optical image of the packaging substrate can be transmitted into the external central control device, so that whether the packaging substrate is damaged or not is judged, when a flaw is detected on the packaging substrate, the discharging rotating wheel 5 can be started to rotate, the packaging substrate is discharged outwards by using a rotating sheet on the outer side of the packaging substrate, the phenomenon that the packaging substrate enters the next procedure to increase waste cost is avoided, then, the gluing device 6 is provided with a bonding rotating plate 10 on the outer side, the inner wall of the device main body 1 is provided with a sliding rail 7, connecting rods embedded in the sliding rail 7 are arranged on two sides of the bonding rotating plate 10, when the driving device 3 drives the gluing device 6 to rotate, the bonding rotating plate 10 can move along the rail of the sliding rail 7, the bonding rotating plate 10 with the lower end outwards rotated can be contacted with and shovels the packaging substrate on the conveying plate 2, then the packaging substrate can directly enter the limiting plate 12 in the bonding rotating plate 10 along with the continuous rotation of the gluing device 6, and the sliding rail 7 is formed by connecting a plurality of sections of sliding chutes with different radians, so that the bonding rotating plate 10 can rotate along with the continuous rotation of the gluing device 6, the limiting plate 12 drives the packaging substrate to be contacted with the glue outlet plate 13, thereby the packaging substrate is fixed to avoid gluing dislocation, the glued packaging substrate can downwards slide out under the action of the inclined plate 8 to reach the discharging conveyor belt 9 when the bonding rotating plate 10 moves to the lower end of the gluing device 6, the clamping grooves 17 are arranged on the integral conveying plate 2 at intervals, and the two sides of the inner wall of the clamping groove 17 are provided with the convex blocks 20 made of rubber materials, so that the protective cover can be placed in the clamping grooves 17, thereby, when the protective cover moves downwards to the upper end of the discharging conveyor belt 9, the protective cover does not fall off when the attaching rotating plate 10 is prevented from driving the protective cover upwards, and further can vertically correspond to the packaged substrate after being glued, then the protective cover can be ejected downwards by utilizing the contact of the outer top plate 18 and the cambered surface of the top block 19 to be attached to the packaged substrate, so that the effect of accurate attaching and packaging is achieved, wherein one side of the glue outlet plate 13 is connected with a rotating rod 14, one side of the glue outlet plate 13 is provided with a glue coating groove 11, the rotating rod 14 is arranged in a hollow way, glue in the glue storage cavity 15 can enter the rotating rod 14 to reach the glue coating groove 11 under the action of the pressurizing equipment, the glue coating groove 11 is arranged in a rectangular way, only four corners are provided with through holes communicated with the inside of the rotating rod 14, so that only a small amount of glue can reach the glue coating groove 11, and when the overflow caused by excessive glue outlet is avoided, one end of the rotating rod 14 can penetrate through the inside of the glue storage cavity 15 to be contacted with a fixed rod 16, dwang 14 one end is provided with bevel gear, be provided with on the dead lever 16 can with the dwang 14 on the teeth of a cogwheel of bevel gear interlock, then the dwang 14 is along with the rubber coating device 6 rebound and the dead lever 16 on the wheel tooth contact after, just can order about dwang 14 and drive out offset plate 13 and packaging substrate, limiting plate 12 rotates, thereby let glue in 11 interior four corners of glue coating groove throw under the effect of centrifugal force and be covered with whole glue coating groove 11, produce the effect that drags to gluing, thereby guarantee to glue evenly to adhere to and avoid having the bubble in it, and then guarantee the leakproofness of encapsulation.
Claims (9)
1. A method of packaging an integrated circuit, comprising the steps of:
firstly, placing a chip packaging substrate and a protective cover on a material conveying plate (2), wherein the protective cover is placed in a clamping groove (17);
secondly, sequentially checking the chip packaging substrate and the protective cover by using a CDD detection device (4);
thirdly, discharging the packaging substrate and the protective cover which are detected to be damaged by using a discharging rotating wheel (5);
fourthly, glue is evenly attached to the glue coating device (6);
fifthly, the protective cover and the packaging substrate are attached through the outer top plate (18) and the top block (19) to complete packaging.
2. The integrated circuit packaging method of claim 1, wherein: the glue outlet plate on the gluing device (6) can make glue uniformly adhere by using a rotary centrifugal force.
3. The integrated circuit packaging method of claim 1, wherein: the packaging substrate and the protective cover are alternately arranged on the material conveying plate (2) at intervals.
4. An integrated circuit package structure comprising a device body (1), characterized in that: device main part (1) internally mounted has a plurality of articulated fortune flitch (2) that link to each other, fortune flitch (2) are inside still including draw-in groove (17) and outer roof (18), CDD check out test set (4) are installed in the inside upper end left side of device main part (1), device main part (1) is inside still to be provided with rubber coating device (6), and the rubber coating device (6) outside is connected with laminating commentaries on classics board (10), rubber coating device (6) and laminating commentaries on classics board (10) are gone up and are provided with play flitch (13) and limiting plate (12) that can laminate mutually, rubber coating device (6) are inside to have been seted up and to store up gluey chamber (15), and device main part (1) inner wall is installed one end and is set up dead lever (16) inside rubber coating device (6).
5. The integrated circuit package structure of claim 4, wherein: CDD check out test set (4) are connected with outside well accuse equipment, the inside upper end of device main part (1) is installed and is arranged material runner (5) that link to each other with outside well accuse equipment.
6. The integrated circuit package structure of claim 4, wherein: the gluing device is characterized in that a driving device (3) is installed on the front face of the device main body (1), the driving device (3) is connected with one side of the gluing device (6), a sliding rail (7) is arranged on the inner wall of the device main body (1), and connecting rods embedded in the sliding rail (7) are arranged on two sides of the laminating rotating plate (10).
7. The integrated circuit package structure of claim 4, wherein: go out offset plate (13) one side and be connected with dwang (14), go out offset plate (13) one side and still seted up rubber coating groove (11).
8. The integrated circuit package structure of claim 7, wherein: dwang (14) one end is run through and is stored up gluey intracavity (15) inside and contact with dead lever (16), dwang (14) one end is provided with bevel gear.
9. The integrated circuit package structure of claim 4, wherein: the device is characterized in that bumps (20) made of rubber materials are arranged on two sides of the inner wall of the clamping groove (17), one end of the outer top plate (18) penetrates out of the clamping groove (17), and a top block (19) which is inclined to one side and is arc-shaped is arranged in the device main body (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110940256.0A CN113690147A (en) | 2021-08-17 | 2021-08-17 | Integrated circuit packaging structure and method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110940256.0A CN113690147A (en) | 2021-08-17 | 2021-08-17 | Integrated circuit packaging structure and method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113690147A true CN113690147A (en) | 2021-11-23 |
Family
ID=78580177
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110940256.0A Withdrawn CN113690147A (en) | 2021-08-17 | 2021-08-17 | Integrated circuit packaging structure and method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113690147A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117524958A (en) * | 2024-01-08 | 2024-02-06 | 四川晁禾微电子有限公司 | Semiconductor packaging chip discharging device |
-
2021
- 2021-08-17 CN CN202110940256.0A patent/CN113690147A/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117524958A (en) * | 2024-01-08 | 2024-02-06 | 四川晁禾微电子有限公司 | Semiconductor packaging chip discharging device |
| CN117524958B (en) * | 2024-01-08 | 2024-03-08 | 四川晁禾微电子有限公司 | Semiconductor packaging chip discharging device |
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Application publication date: 20211123 |
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