CN113686273A - Thickness measuring method for surface film layer of electroplated part - Google Patents
Thickness measuring method for surface film layer of electroplated part Download PDFInfo
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- CN113686273A CN113686273A CN202110855969.7A CN202110855969A CN113686273A CN 113686273 A CN113686273 A CN 113686273A CN 202110855969 A CN202110855969 A CN 202110855969A CN 113686273 A CN113686273 A CN 113686273A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B15/00—Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons
- G01B15/02—Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons for measuring thickness
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
- G01N23/22—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material
- G01N23/2202—Preparing specimens therefor
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
- G01N23/22—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material
- G01N23/225—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion
- G01N23/2251—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion using incident electron beams, e.g. scanning electron microscopy [SEM]
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Abstract
The invention provides a thickness measuring method of a surface film layer of an electroplated part, which comprises the following steps of S1: after a colored boundary layer is arranged on the electroplated part A to be tested, preparing a metallographic sample C; s2, measuring: the distance d between the colored boundary layer and the electroplated layer in the metallographic sample C is observed and measured through a microscope, and the distance d is the thickness of the surface film layer of the electroplated part A to be detected.
Description
Technical Field
The invention relates to the technical field of measurement, in particular to a thickness measuring method for a surface film layer of an electroplated part.
Background
In the production process of alloy or metal parts, such as zinc alloy parts, the zinc alloy has relatively negative potential, relatively poor chemical stability and is easy to corrode, and meanwhile, in order to meet the requirements of physical and chemical properties and visual appearance, the alloy or metal parts are often subjected to electroplating processing to form electroplated parts, and the electroplated layers on the surfaces of the alloy or metal parts are used for protecting or protecting and decorating the alloy or metal parts.
In addition, in order to greatly improve the physicochemical property and the appearance visual grade of the electroplated part, a layer of film such as a transparent paint film is often required to be sprayed on the surface of the electroplated part, so that the thickness of the transparent paint film plays a role in playing a role in improving the physicochemical property and the appearance visual grade of the product.
In the prior art, common manufacturers are generally limited to measuring the thicknesses of films such as paint films on the surfaces of devices by using vernier calipers, micrometer screws (micrometers), single-function portable instruments and the like to measure ultra-thick films, single-substrate surface films, colored films, magnetic films, conductive films and the like, and measurement results are easily affected by physical conditions such as electricity, magnetism, light, heat and the like, so that measurement errors are large. In addition, the film thickness measuring technology has the defects that the distribution condition of the film thickness cannot be visually displayed, the detection result has random contingency, and the film with local defects is easy to miss detection and the like.
For the ultrathin transparent insulating nonmagnetic film layer on the surface of the alloy electroplated part, such as a paint film and the like, because the thickness of the film layer is ultrathin, generally less than 3um, and the film layer is colorless, nonmagnetic and nonconductive, and various metal electroplated layers are usually present on the alloy substrate, for example: copper layer, silver layer, gold layer, copper-zinc alloy layer, copper-tin-zinc alloy layer, tin-cobalt alloy layer, etc., it is difficult to perform accurate thickness measurement on the ultra-thin transparent insulating nonmagnetic film layer on the surface of such electroplated parts by using the above-mentioned apparatus and method.
At present, for accurate thickness measurement of an ultrathin transparent insulating nonmagnetic film layer on the surface of a complex substrate, namely an alloy electroplated part, a scientific research institution mainly adopts high-end high-rise equipment such as an SEM (scanning electron microscope), an STM (scanning tunneling electron microscope), an STEM (scanning transmission electron microscope) to realize the thickness measurement, but the cost of sample preparation, electron microscope observation and electron microscope analysis is high, the process is complex, the professional technology dependence is high, and the difficulty of wide implementation and popularization is very high.
The present application is proposed to solve the above technical problems.
Disclosure of Invention
The invention designs a thickness measuring method for a surface film layer of an electroplated part, which aims to overcome the technical problems that the conventional common manufacturer cannot measure or a scientific research institution needs to use electron microscope equipment with complex process, high cost and high technical dependence.
In order to solve the problems, the invention discloses a thickness measuring method of a surface film layer of an electroplated part, which comprises the following steps:
s1, pretreatment stage: after a colored boundary layer is arranged on the electroplated part A to be tested, preparing a metallographic sample C;
s2, measuring: observing and measuring the distance d between the colored boundary layer and the electroplated layer in the metallographic sample C through a microscope, wherein the distance d is the thickness of the surface film layer of the electroplated part A to be measured.
Further, the step S1 includes:
s11, preparing a to-be-tested electroplated part A;
s12, preparing a working solution of the colored pigment;
s13, coating the colored pigment working solution on the surface of the electroplated part A to be tested, and drying to constant weight to obtain an electroplated part B to be tested with a colored boundary layer;
and S14, cutting the electroplated part B to be tested, exposing the cross section of the surface film layer of the electroplated part B to be tested, and then casting and grinding the electroplated part B to prepare a metallographic sample C.
Further, in the step S12, the color pigment working solution is prepared using a color pigment other than black.
Further, in the step S12, the color pigment working solution is prepared by using a non-transparent color paint.
Further, in the step S13, the color pigment working solution is coated on the surface of the to-be-tested electroplated part a by dip coating or spray coating.
Further, in the step S13, the colored pigment working solution is dip-coated or spray-coated on the surface of the electroplated part a to be tested, and then dried at 80-120 ℃ to constant weight, so as to obtain the electroplated part B to be tested.
Further, in the step S14, cutting is performed perpendicular to the surface of the electroplated part B to be tested, so that the cross section of the film layer on the surface of the electroplated part B to be tested is exposed vertically.
Further, in the step S14, the cross section of the film layer on the surface of the to-be-tested electroplated part B after casting is exposed vertically.
Further, the step S2 includes:
s21, placing the metallographic specimen C on an objective table of a microscope, and adjusting the microscope until a clear boundary image of the metallographic specimen C is seen under a low magnification;
s22, increasing the magnification of the microscope until a clear boundary image of the electroplated layer in the metallographic sample C is seen under the high magnification;
s23, slowly increasing the brightness of the light source until clear boundary images on two sides of the film layer to be detected between the electroplated layer and the colored boundary layer in the metallographic sample C are seen;
and S24, measuring the distance d between the nonferrous boundary layer and the electroplated layer in the metallographic specimen C by using microscopic image analysis software.
Further, the microscope is a metallographic microscope.
The thickness measuring method for the surface film layer of the electroplated part has the following advantages:
firstly, the thickness measuring method of the surface film layer of the electroplated part can be widely applied to the measurement of the thickness of various film layers, is not limited to an ultra-thick film layer, a colored film layer, a magnetic film layer, a conductive film layer or a single substrate surface film layer, and can accurately measure the thickness of the ultra-thin film layer, the colorless film layer, the non-magnetic film layer and the non-conductive film layer of the complex substrate surface film layer;
secondly, the distribution condition of the film thickness can be more visually displayed;
and thirdly, a film layer with clear boundary can be observed, the error of a measuring result is extremely small, the accuracy and the precision are high, and the film layer is not influenced by physical conditions such as electromagnetic photo-thermal and the like.
Fourthly, the method does not depend on expensive equipment such as an electron microscope and professional technology, and is not time-consuming and labor-consuming. The operation steps are strictly carried out according to the invention, the process is simple, the whole process is easy and convenient to operate, and the success rate is high.
Drawings
FIG. 1 is a diagram of an object of a to-be-tested electroplated part A according to an embodiment of the present invention;
FIG. 2 is a diagram of a working solution of a colored pigment according to an embodiment of the present invention;
FIG. 3 is a diagram of an object of a plated item B to be tested according to an embodiment of the present invention;
FIG. 4 is a diagram of a metallographic sample C according to an embodiment of the present invention;
FIG. 5 is a first interface of the microscopic image analysis software according to an embodiment of the present invention;
FIG. 6 is a second interface of the microscopic image analysis software according to the embodiment of the present invention;
FIG. 7 is a third interface of the microscopic image analysis software according to the embodiment of the present invention;
FIG. 8 is a fourth interface of the microscopic image analysis software according to the embodiment of the present invention;
FIG. 9 is a fifth interface of the microscopic image analysis software according to an embodiment of the present invention;
fig. 10 is a schematic structural diagram of a metallographic specimen C under a metallographic microscope according to an embodiment of the present invention.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below.
A method for measuring the thickness of the surface film layer of an electroplated part comprises the following steps
S1, pretreatment stage: after a colored boundary layer is arranged on the electroplated part A to be tested, preparing a metallographic sample C;
s2, measuring: observing and measuring the distance d between the colored boundary layer and the electroplated layer in the metallographic sample C through a microscope, wherein the distance d is the thickness of the surface film layer of the electroplated part A to be measured.
For clarity, the two side surfaces of the surface film layer of the electroplated component are respectively referred to as an "outer boundary" and an "inner boundary", where the "outer boundary" is an interface between the surface film layer of the electroplated component and the outside air; the "inner boundary" is the interface between the surface film layer of the electroplated component and the electroplated layer on the electroplated component. Further, after a colored boundary layer is arranged on the electroplated part A to be tested, the outer boundary is an interface between the surface film layer of the electroplated part and the colored boundary layer.
The measurement principle described in this application is as follows: in the pre-treatment stage, a colored boundary layer is arranged on the surface of the electroplated part A to be measured, and a colored outer boundary convenient for observation and measurement is formed on the outer side of the surface film layer of the electroplated part A to be measured; then find out the interior boundary between the electroplating layer and the outer boundary between rete and the coloured boundary layer on waiting to examine electroplating piece A surface film layer and the electroplating piece A through the microscope, so, the material between outer boundary and the interior boundary is exactly the rete on electroplating piece A surface that awaits measuring, so, through the microscope measurement during distance d between coloured pigment working solution and the electroplating layer among the metallographic specimen C, can obtain the thickness measurement of electroplating piece A surface film layer that awaits measuring.
Specifically, the step S1 includes:
s11, preparing a to-be-tested electroplated part A;
s12, preparing a working solution of the colored pigment;
s13, coating the colored pigment working solution on the surface of the electroplated part A to be tested, and drying to constant weight to obtain an electroplated part B to be tested with a colored boundary layer;
and S14, cutting the electroplated part B to be tested, exposing the cross section of the surface film layer of the electroplated part B to be tested, and then casting and grinding the electroplated part B to prepare a metallographic sample C.
Through the steps S11-S14, a colored boundary layer convenient for observation and measurement can be formed on the outer side of the surface film layer of the electroplated part A to be measured; and then, exposing the cross section of the surface film layer of the electroplated part A to be detected by cutting, and preparing a metallographic sample C by casting and grinding, thereby laying a foundation for subsequent microscopic observation.
It should be noted that the steps S11 to S14 are pre-treatment before measurement, the sequence of the steps S11 to S14 is very important, and the metallographic sample C needs to be prepared step by step according to the operation steps, otherwise, a film layer on the surface of the plated workpiece may not be observed in the measurement stage.
Furthermore, since the thickness of the film layer is not detected by the color, the material of the substrate, the magnetism and the conductivity of the film layer, in step S11, the substrate of the electroplated component a to be detected may be zinc-based, copper-based, iron-based, aluminum-based, magnesium-based … …, and their alloys, and various non-metallic plastic components, etc. The electroplated layer of the electroplated part A to be tested can be a zinc layer, a copper layer, a tin layer, a nickel layer, a silver layer, a chromium layer … …, and their alloy coatings, and various precious metal coatings, etc. And the rete on plated item A surface that awaits measuring can be for ultra-thin (thickness is less than 3um), transparent, insulating, the rete of no magnetism, also can be other super thickness retes, single base member surface retes, has the colour rete, has magnetism rete and can electrically conduct rete etc. the material of rete is also not limited, if can be composite material rete, inorganic non-metallic material rete, macromolecular material rete, metallic material rete etc. for example lacquer rete, ceramic film layer, metal conversion rete etc. figure 1 has given a kind of material object drawing of plated item A awaits measuring. Compared with the existing measuring instruments such as a vernier caliper, a screw micrometer (micrometer) and a single-function portable instrument, the thickness measuring method for the surface film layer of the electroplated part has the advantages of higher measuring accuracy and wider application range.
Preferably, in the step S12, a color pigment working solution is prepared using a commercially available color pigment other than black. Since the metallographic casting material is also black under a microscope, if a working solution of a colored pigment is prepared by using a black colored pigment, it is difficult to distinguish a colored boundary layer from the metallographic casting material.
More preferably, a non-transparent colored paint other than black can be used to prepare the colored pigment working fluid.
As some examples of the present application, in the step S12, the color pigment working fluid is prepared using a red paint. The specific implementation process comprises the following steps: 30-100 g of commercially available non-transparent red paint is taken, 0.5-0.8 times of the weight of the matched diluent is added, after the mixture is uniformly stirred, a non-transparent red paint working solution is obtained, the non-transparent red paint working solution is used as a colored pigment working solution to be coated on the surface of the electroplated part to be tested, and after the mixture is dried to constant weight, the electroplated part B to be tested can be obtained, and the attached drawing 2 of the application provides a physical diagram of the colored pigment working solution.
As some embodiments of the present application, in the step S12, a colored boundary layer may be formed on the surface of the electroplated part a to be tested by means of glue dropping, injection molding, film pasting, Physical Vapor Deposition (PVD), Chemical Vapor Deposition (CVD), or the like, instead of the above-mentioned baking and drying method using the non-transparent colored paint.
Preferably, in the step S13, the colored pigment working solution may be applied to the surface of the to-be-tested electroplated part a by dip coating or spray coating, and after drying to a constant weight, the to-be-tested electroplated part B with a colored boundary layer is obtained.
More preferably, in the step S13, the colored pigment working solution is dip-coated or spray-coated on the surface of the electroplated part a to be tested, and then dried at 80-120 ℃ to constant weight, so as to obtain the electroplated part B to be tested. In the drying process, if the drying temperature is too high, a colored boundary layer formed by the colored pigment working solution is easy to bubble, peel, become brittle or crack, and even burn, so that the difficulty of subsequently preparing a metallographic specimen C is increased, and the later-stage measurement of the thickness of a film layer is not facilitated; if the drying temperature is too low, the drying speed of the working liquid of the colored pigment is slow, the working liquid of the colored pigment on the surface is easy to flow in the drying process, so that the coating is not uniform, an obvious colored boundary layer may not exist locally, and the thickness measurement of a later-period film layer is not facilitated. FIG. 3 of the present application shows a physical diagram of the plated item B to be tested.
Preferably, in the step S14, cutting is performed perpendicular to the surface of the electroplated part B to be measured, so that the cross section of the film layer on the surface of the electroplated part B to be measured is exposed perpendicularly, which is beneficial to improving the accuracy of measurement.
As some examples of the present application, in the step S14, commercially available metallographic rubber powder and metallographic curing agent are used, and cast and molded in a mold, so that the cross section of the surface film layer of the electroplated part B to be tested is exposed vertically, and is ground and polished into a metallographic sample C, and fig. 4 of the present application shows a physical diagram of the metallographic sample C.
Specifically, the step S2 includes:
s21, placing the metallographic specimen C on a stage of a microscope, and adjusting the microscope until a clear boundary image of the metallographic specimen C can be seen under low magnification as shown in FIG. 5;
s22, increasing the magnification of the microscope until a clear boundary image of the electroplated layer in the metallographic specimen C can be seen under the high magnification as shown in FIG. 6;
s23, slowly increasing the brightness of the light source until clear boundary images at two sides of the film layer to be detected between the electroplated layer and the colored boundary layer in the metallographic sample C can be seen as shown in FIG. 7;
and S24, measuring the distance d between the nonferrous boundary layer and the electroplated layer in the metallographic specimen C by using microscopic image analysis software.
In the step S21-24, firstly, a microscope is adjusted to see a clear boundary image of the metallographic sample C under a low magnification, then the magnification of the microscope is increased to see a clear boundary image of an electroplated layer in the metallographic sample C under a high magnification, then the brightness of a light source is increased to see boundary images of two sides of a film layer to be detected between the electroplated layer and a colored boundary layer in the metallographic sample C, the boundary images are gradually adjusted to finally obtain clear boundary images between two sides of the film layer and the colored boundary layer and the electroplated layer, namely images between the inner boundary and the outer boundary of two sides of the film layer, and the distance d between the colored boundary layer and the electroplated layer in the metallographic sample C is measured through microscopic image analysis software to obtain the thickness of the film layer, so that the measurement of the thickness of the film layer is realized.
It should be noted that the steps S21 to S24 are operation steps in the measurement stage, the sequence of the steps S21 to S24 is very important, and the microscope needs to be adjusted step by step according to the operation steps, otherwise, the film layer to be measured on the surface of the electroplated part may not be observed.
Preferably, in step S21, the metallographic specimen C is first placed on a stage of a microscope, the stage is then adjusted to make the metallographic specimen under a light source of an objective lens, then a 5-fold objective lens is selected, the brightness of the light source is adjusted, and the focusing knob is adjusted after rough adjustment until a clear boundary image of the metallographic specimen C is seen.
More preferably, the microscope is a metallographic microscope, such as a leica dm2500M metallographic microscope. The metallographic microscope is a high-tech product developed and developed by perfectly combining an optical microscope technology, a photoelectric conversion technology and a computer image processing technology, can be used for microscopic observation on an eyepiece, can be used for observing a real-time dynamic image on a computer screen, and can be used for conveniently observing a metallographic image, a microstructure and surface morphology, so that a metallographic atlas is subjected to technical processing such as analysis, rating and measurement, and a required picture is edited, stored and printed.
In addition, by applying the same principle or similar steps, other similar optical microscopic observation devices or equipment phase transformation can be used instead of a metallographic microscope to realize the thickness measurement of the surface film layer of the electroplated part, which can be realized by simple replacement for those skilled in the art, and detailed description is omitted here.
Preferably, in the step S2, the distance d between the boundary layer and the electroplated layer in the metallographic sample C is observed and measured by using LAS V4.0-LASCore microscopic image analysis software.
As some embodiments of the present application, in step S21, the computer is turned on, the LAS V4.0-LASCore microscopic image analysis software is double-tapped, the power supply of the leica dm2500M metallographic microscope is turned on, the metallographic sample C is placed on the stage of the microscope, the stage is adjusted to be located under the objective light source, the objective with the brightness 5 times that of the objective is selected, the brightness of the light source is adjusted, and the focusing knob is adjusted after rough adjustment until a clear boundary image of the metallographic sample C is seen.
Preferably, in step S22, the magnification of the objective lens is gradually changed from low magnification to high magnification (e.g. 5 times → 10 times → 20 times → 50 times → 100 times), until a clear boundary image between the electroplated layer and the colored boundary layer is seen under the objective lens of 100 times.
As some embodiments of the present application, in the step S24, the detailed process of measuring the distance d between the boundary layer and the electroplated layer in the metallographic sample C by using LAS V4.0-LASCore microscopic image analysis software is shown in the attached FIGS. 7-9: firstly, clicking a button of 'collecting images' at the lower left corner of an interface shown in figure 7, selecting an objective lens '100 x', selecting a zoom device '1 x', and clicking 'collecting' to store images in a pop-up window as shown in figure 8; then clicking the 'processing' button at the upper left corner of the interface shown in the figure 9, displaying the saved image on a computer screen, and checking the 'default containing scale' option in the 'comment' menu at the left side of the interface
"show", select and select the option of "line
The distance line is displayed, the distance line is selected, then the thickness of the film layer is measured, firstly, the bright and dazzling electroplated layer boundary adjacent to the film layer to be measured is clicked as the starting point of the distance line, then, a left button of a mouse is pressed to drag the distance line to the boundary of the colored boundary layer adjacent to the film layer to be measured as the end point of the distance line, and finally, a button for combining all the buttons at the lower left corner of the interface is clicked to obtain the length of the distance line, namely the distance d between the colored boundary layer and the electroplated layer in the metallographic sample C.
In addition, in the microscopic image analysis software or the microscope, the morphology, the distribution uniformity and the like of the surface film layer of the electroplated part can be directly observed.
In summary, it is easy to find that: the thickness measuring method for the surface film layer of the electroplated part has the following advantages:
firstly, the thickness measuring method of the surface film layer of the electroplated part can be widely applied to the measurement of the thickness of various film layers, is not limited to an ultra-thick film layer, a colored film layer, a magnetic film layer, a conductive film layer or a single substrate surface film layer, and can accurately measure the thickness of the ultra-thin film layer, the colorless film layer, the non-magnetic film layer and the non-conductive film layer of the complex substrate surface film layer;
secondly, the distribution condition of the film thickness can be more visually displayed;
and thirdly, a film layer with clear boundary can be observed, the error of a measuring result is extremely small, the accuracy and the precision are high, and the film layer is not influenced by physical conditions such as electromagnetic photo-thermal and the like.
Fourthly, the method does not depend on expensive equipment such as an electron microscope and professional technology, and is not time-consuming and labor-consuming. The operation steps are strictly carried out according to the invention, the process is simple, the whole process is easy and convenient to operate, and the success rate is high.
Although the present invention is disclosed above, the present invention is not limited thereto. In the description herein, references to the description of the term "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Various changes and modifications may be effected therein by one skilled in the art without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (10)
1. The thickness measuring method of the surface film layer of the electroplated part is characterized by comprising the following steps
S1, pretreatment stage: after a colored boundary layer is arranged on the electroplated part A to be tested, preparing a metallographic sample C;
s2, measuring: observing and measuring the distance d between the colored boundary layer and the electroplated layer in the metallographic sample C through a microscope, wherein the distance d is the thickness of the surface film layer of the electroplated part A to be measured.
2. The method for measuring thickness of surface film layer of electroplated component according to claim 1, wherein said step S1 comprises:
s11, preparing a to-be-tested electroplated part A;
s12, preparing a working solution of the colored pigment;
s13, coating the colored pigment working solution on the surface of the electroplated part A to be tested, and drying to constant weight to obtain an electroplated part B to be tested with a colored boundary layer;
and S14, cutting the electroplated part B to be tested, exposing the cross section of the surface film layer of the electroplated part B to be tested, and then casting and grinding the electroplated part B to prepare a metallographic sample C.
3. The method for measuring thickness of surface film layer of plated item according to claim 2, wherein in step S12, the working solution of color pigment is prepared using color pigment other than black.
4. The method for measuring thickness of surface film layer of electroplated component according to claim 2 or 3, wherein in step S12, the color pigment working solution is prepared by using non-transparent color paint.
5. The method for measuring thickness of surface film layer of electroplated component according to claim 2, wherein in step S13, the color pigment working solution is applied to the surface of the electroplated component a to be tested by dip coating or spray coating.
6. The method for measuring the thickness of the surface film layer of the electroplated part as claimed in claim 2, wherein in step S13, the color pigment working solution is dip-coated or spray-coated on the surface of the electroplated part a to be measured, and then dried at 80-120 ℃ to constant weight to obtain the electroplated part B to be measured.
7. The method for measuring the thickness of the surface film layer of the electroplated component as claimed in claim 2, wherein in step S14, cutting is performed perpendicularly to the surface of the electroplated component B to be tested, so that the cross section of the surface film layer of the electroplated component B to be tested is perpendicularly exposed.
8. The method for measuring the thickness of a surface film layer of an electroplated component as claimed in claim 2, wherein in step S14, the cross section of the surface film layer of the electroplated component B to be tested after casting is exposed vertically.
9. The method for measuring thickness of surface film layer of electroplated component according to claim 1, wherein said step S2 comprises:
s21, placing the metallographic specimen C on an objective table of a microscope, and adjusting the microscope until a clear boundary image of the metallographic specimen C is seen under a low magnification;
s22, increasing the magnification of the microscope until clear electroplated layer boundary images in the metallographic sample C are seen under high magnification;
s23, slowly increasing the brightness of the light source until clear boundary images on two sides of the film layer to be detected between the electroplated layer and the colored boundary layer in the metallographic sample C are seen;
and S24, measuring the distance d between the nonferrous boundary layer and the electroplated layer in the metallographic specimen C by using microscopic image analysis software.
10. The method of claim 9, wherein the microscope is a metallographic microscope.
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| CN202110855969.7A Pending CN113686273A (en) | 2021-07-28 | 2021-07-28 | Thickness measuring method for surface film layer of electroplated part |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108844455A (en) * | 2018-07-26 | 2018-11-20 | 武汉燎原模塑有限公司 | A kind of automotive paints part film thickness measurement method |
| CN109839287A (en) * | 2019-03-15 | 2019-06-04 | 深圳市仁创艺电子有限公司 | A kind of lateral erosion, crackle, cavity measure microsection manufacture method |
| CN110749596A (en) * | 2019-09-05 | 2020-02-04 | 北京北汽模塑科技有限公司 | Method for testing thickness of paint film of automobile multi-coating paint part |
| CN111766127A (en) * | 2020-07-29 | 2020-10-13 | 郑州飞机装备有限责任公司 | Membrane thickness detection method |
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- 2021-07-28 CN CN202110855969.7A patent/CN113686273A/en active Pending
Patent Citations (4)
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| CN108844455A (en) * | 2018-07-26 | 2018-11-20 | 武汉燎原模塑有限公司 | A kind of automotive paints part film thickness measurement method |
| CN109839287A (en) * | 2019-03-15 | 2019-06-04 | 深圳市仁创艺电子有限公司 | A kind of lateral erosion, crackle, cavity measure microsection manufacture method |
| CN110749596A (en) * | 2019-09-05 | 2020-02-04 | 北京北汽模塑科技有限公司 | Method for testing thickness of paint film of automobile multi-coating paint part |
| CN111766127A (en) * | 2020-07-29 | 2020-10-13 | 郑州飞机装备有限责任公司 | Membrane thickness detection method |
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