CN113683439B - Shell, preparation method thereof and electronic equipment - Google Patents

Shell, preparation method thereof and electronic equipment Download PDF

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CN113683439B
CN113683439B CN202110917644.7A CN202110917644A CN113683439B CN 113683439 B CN113683439 B CN 113683439B CN 202110917644 A CN202110917644 A CN 202110917644A CN 113683439 B CN113683439 B CN 113683439B
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CN113683439A (en
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滕双双
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Guangdong Oppo Mobile Telecommunications Corp Ltd
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    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
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    • C04B41/00After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/60After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only artificial stone
    • C04B41/61Coating or impregnation
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    • C04B26/00Compositions of mortars, concrete or artificial stone, containing only organic binders, e.g. polymer or resin concrete
    • C04B26/02Macromolecular compounds
    • C04B26/10Macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
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    • C04B35/00Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/01Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
    • C04B35/453Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on zinc, tin, or bismuth oxides or solid solutions thereof with other oxides, e.g. zincates, stannates or bismuthates
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    • C04B35/00Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/622Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
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    • C04B41/00After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/45Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
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    • C04B41/00After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/45Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
    • C04B41/50Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
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    • C04B41/00After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/45Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
    • C04B41/52Multiple coating or impregnating multiple coating or impregnating with the same composition or with compositions only differing in the concentration of the constituents, is classified as single coating or impregnation
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    • C04B41/00After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/60After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only artificial stone
    • C04B41/61Coating or impregnation
    • C04B41/70Coating or impregnation for obtaining at least two superposed coatings having different compositions
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus

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Abstract

本申请提供了一种壳体的制备方法,包括:将聚合物陶瓷坯体涂覆和/或浸泡前处理液,经干燥后在所述聚合物陶瓷坯体表面形成前处理层,得到复合坯体,其中,所述聚合物陶瓷坯体包括聚合物,所述前处理液包括能够促进所述聚合物交联的促进剂;所述复合坯体经过热处理和热压后,再去除所述前处理层,得到聚合物陶瓷层,制得壳体。通过前处理液处理聚合物陶瓷坯体后,在其表面形成了前处理层,从而可以在后续热处理过程中,提高聚合物陶瓷坯体中聚合物的交联程度,同时大幅度降低热处理的时间,进而在提升壳体机械性能的同时又降低了壳体的制备时长。本申请还提供了一种壳体和电子设备。

Figure 202110917644

The present application provides a method for preparing a shell, comprising: coating and/or soaking a polymer ceramic body in a pretreatment liquid, and after drying, a pretreatment layer is formed on the surface of the polymer ceramic body to obtain a composite body body, wherein the polymer ceramic body includes a polymer, and the pretreatment liquid includes an accelerator capable of promoting the cross-linking of the polymer; after the composite body is heat-treated and hot-pressed, the pretreatment The layer is treated to obtain a polymer ceramic layer, and a shell is produced. After the polymer ceramic body is treated with the pretreatment liquid, a pretreatment layer is formed on its surface, so that in the subsequent heat treatment process, the degree of crosslinking of the polymer in the polymer ceramic body can be improved, and the heat treatment time can be greatly reduced. , thereby improving the mechanical properties of the casing and reducing the preparation time of the casing. The present application also provides a housing and an electronic device.

Figure 202110917644

Description

壳体及其制备方法和电子设备Shell and its preparation method and electronic equipment

技术领域technical field

本申请属于电子产品技术领域,具体涉及壳体及其制备方法和电子设备。The application belongs to the technical field of electronic products, and in particular relates to a casing, a preparation method thereof, and electronic equipment.

背景技术Background technique

随着消费水平的提高,消费者对电子产品不仅追求功能的多样化,而且对其外观、质感等也有越来越高的要求。近年来,陶瓷材料以其温润的质感成为电子设备壳体的研究的热点。相关技术中通过树脂与陶瓷材料形成的复合材料制备产品,但目前产品的制备周期长,同时与真正的陶瓷产品相比,其强度还有差距。因此,目前陶瓷壳体及其制备方法仍有待改进。With the improvement of consumption level, consumers not only pursue the diversification of functions of electronic products, but also have higher and higher requirements for their appearance and texture. In recent years, ceramic materials have become a hot spot in the research of electronic equipment casings due to their warm and moist texture. In the related art, products are prepared by composite materials formed of resin and ceramic materials, but the production cycle of the current products is long, and at the same time, compared with real ceramic products, there is still a gap in its strength. Therefore, the current ceramic shell and its preparation method still need to be improved.

发明内容Contents of the invention

鉴于此,本申请提供了一种壳体及其制备方法和电子设备。In view of this, the present application provides a casing, a preparation method thereof, and an electronic device.

第一方面,本申请提供了一种壳体的制备方法,包括:将聚合物陶瓷坯体涂覆和/或浸泡前处理液,经干燥后在所述聚合物陶瓷坯体表面形成前处理层,得到复合坯体,其中,所述聚合物陶瓷坯体包括聚合物,所述前处理液包括能够促进所述聚合物交联的促进剂;所述复合坯体经过热处理和热压后,再去除所述前处理层,得到聚合物陶瓷层,制得壳体。In the first aspect, the present application provides a method for preparing a shell, comprising: coating and/or soaking a polymer ceramic body with a pretreatment liquid, and forming a pretreatment layer on the surface of the polymer ceramic body after drying , to obtain a composite green body, wherein, the polymer ceramic green body includes a polymer, and the pretreatment liquid includes an accelerator capable of promoting the crosslinking of the polymer; after the composite green body is heat-treated and hot-pressed, then The pretreatment layer is removed to obtain a polymer ceramic layer to obtain a casing.

第二方面,本申请提供了一种壳体,通过第一方面所述的制备方法制得,所述壳体包括聚合物陶瓷层。In a second aspect, the present application provides a casing manufactured by the preparation method described in the first aspect, the casing comprising a polymer ceramic layer.

第三方面,本申请提供了一种电子设备,包括第二方面所述的壳体。In a third aspect, the present application provides an electronic device, including the casing described in the second aspect.

本申请提供了一种壳体和壳体的制备方法,通过前处理液处理聚合物陶瓷坯体后,在其表面形成了前处理层,从而可以在后续热处理过程中,提高聚合物陶瓷坯体中聚合物的交联程度,同时大幅度降低热处理的时间,进而在提升壳体机械性能的同时又降低了壳体的制备时长;具有该壳体的电子设备具有优异的机械性能,更能够满足用户需求。The application provides a shell and a method for preparing the shell. After the polymer ceramic body is treated with a pretreatment liquid, a pretreatment layer is formed on its surface, so that the polymer ceramic body can be improved in the subsequent heat treatment process. The degree of cross-linking of the polymer in the medium, while greatly reducing the time of heat treatment, thereby improving the mechanical properties of the shell while reducing the preparation time of the shell; the electronic device with the shell has excellent mechanical properties, and can better meet User needs.

附图说明Description of drawings

为了更清楚地说明本申请实施方式中的技术方案,下面将对本申请实施方式中所需要使用的附图进行说明。In order to more clearly describe the technical solutions in the embodiments of the present application, the following will describe the drawings that need to be used in the embodiments of the present application.

图1为本申请一实施方式提供的壳体的制备方法流程图。FIG. 1 is a flowchart of a method for preparing a housing provided in an embodiment of the present application.

图2为本申请一实施方式提供的聚合物陶瓷坯体的制备方法流程图。Fig. 2 is a flowchart of a method for preparing a polymer ceramic green body provided by an embodiment of the present application.

图3为本申请另一实施方式提供的聚合物陶瓷坯体的制备方法流程图。Fig. 3 is a flowchart of a method for preparing a polymer ceramic green body provided in another embodiment of the present application.

图4为本申请一实施方式提供的壳体的结构示意图。FIG. 4 is a schematic structural diagram of a housing provided in an embodiment of the present application.

图5为本申请另一实施方式提供的壳体的结构示意图。FIG. 5 is a schematic structural diagram of a housing provided in another embodiment of the present application.

图6为本申请一实施方式提供的电子设备的结构示意图。FIG. 6 is a schematic structural diagram of an electronic device provided in an embodiment of the present application.

图7为本申请一实施方式提供的电子设备的结构组成示意图。FIG. 7 is a schematic diagram of the structure and composition of an electronic device provided by an embodiment of the present application.

具体实施方式Detailed ways

以下是本申请的优选实施方式,应当指出,对于本技术领域的普通技术人员来说,在不脱离本申请原理的前提下,还可以做出若干改进和润饰,这些改进和润饰也视为本申请的保护范围。The following are preferred embodiments of the application. It should be pointed out that for those skilled in the art, without departing from the principle of the application, some improvements and modifications can also be made, and these improvements and modifications are also considered as the present invention. The scope of protection applied for.

下文的公开提供了许多不同的实施方式或例子用来实现本申请的不同结构。为了简化本申请的公开,下文中对特定例子的部件和设置进行描述。当然,它们仅仅为示例,并且目的不在于限制本申请。此外,本申请可以在不同例子中重复参考数字和/或参考字母,这种重复是为了简化和清楚的目的,其本身不指示所讨论各种实施方式和/或设置之间的关系。此外,本申请提供了各种特定的工艺和材料的例子,但是本领域普通技术人员可以意识到其他工艺的应用和/或其他材料的使用。The following disclosure provides many different implementations or examples for implementing different structures of the present application. To simplify the disclosure of the present application, components and arrangements of specific examples are described below. Of course, they are examples only and are not intended to limit the application. Furthermore, the present application may repeat reference numerals and/or reference letters in various instances, such repetition is for simplicity and clarity and does not in itself indicate a relationship between the various embodiments and/or arrangements discussed. In addition, the present application provides examples of various specific processes and materials, but one of ordinary skill in the art may recognize the use of other processes and/or the use of other materials.

请参阅图1,为本申请一实施方式提供的壳体的制备方法流程图,包括:Please refer to Fig. 1, which is a flow chart of the preparation method of the housing provided in an embodiment of the present application, including:

S101:将聚合物陶瓷坯体涂覆和/或浸泡前处理液,经干燥后在聚合物陶瓷坯体表面形成前处理层,得到复合坯体,其中,聚合物陶瓷坯体包括聚合物,前处理液包括能够促进聚合物交联的促进剂。S101: Coating and/or immersing the polymer ceramic body in a pretreatment liquid, and forming a pretreatment layer on the surface of the polymer ceramic body after drying to obtain a composite body, wherein the polymer ceramic body includes a polymer, and the pretreatment layer is formed on the surface of the polymer ceramic body. The treatment fluid includes an accelerator capable of promoting crosslinking of the polymer.

S102:复合坯体经过热处理和热压后,再去除前处理层,得到聚合物陶瓷层,制得壳体。S102: After the composite green body is heat-treated and hot-pressed, the pre-treatment layer is removed to obtain a polymer ceramic layer to obtain a casing.

在本申请中,聚合物陶瓷坯体用前处理液处理后,在热处理过程中前处理液中的促进剂能够促进聚合物陶瓷坯体中聚合物的交联,同时极大地降低了热处理的时间,从而既能够提高制得的壳体100的机械性能,又大幅度减小了制备时长,提升制备效率。相关技术中,玻璃、金属、塑胶、陶瓷等多种材料均可以在电子设备200中使用,然而玻璃的介电损耗高,在毫米波上使用有一定局限性,并且其抗跌落性能有待提高;金属由于导电会产品信号屏蔽;塑胶的质感有待提升;陶瓷介电常数高,会导致信号受损严重。在本申请中,通过设置聚合物陶瓷层10,既保留了陶瓷的高级质感,并且介电性能满足毫米波的要求,以符合5G通信技术的要求。同时,本申请发明人研究发现,聚合物陶瓷层10的表面硬度较低,抗划伤能力差,产品强度不够,无法实现较薄的厚度,并且整体加工时间长,生产效率低;因此,本申请发明人通过将聚合物陶瓷坯体涂覆和/或浸泡前处理液,从而在热处理过程中,前处理液中的促进剂可以促进聚合物陶瓷坯体中聚合物的交联,提高聚合物的交联程度,从而还可以大幅度降低热处理的时长,提升生产效率,并且提高了壳体100的硬度,提升抗划伤能力,更有利于其应用。In this application, after the polymer ceramic body is treated with the pretreatment liquid, the accelerator in the pretreatment liquid can promote the crosslinking of the polymer in the polymer ceramic body during the heat treatment process, and at the same time greatly reduce the time of heat treatment , so as to not only improve the mechanical properties of the manufactured shell 100, but also greatly reduce the preparation time and improve the preparation efficiency. In related technologies, various materials such as glass, metal, plastic, and ceramics can be used in the electronic device 200. However, the dielectric loss of glass is high, and its use on millimeter waves has certain limitations, and its anti-drop performance needs to be improved; Metal will shield the product signal due to conductivity; the texture of plastic needs to be improved; ceramics have a high dielectric constant, which will seriously damage the signal. In this application, by setting the polymer ceramic layer 10, the high-grade texture of ceramics is retained, and the dielectric properties meet the requirements of millimeter waves, so as to meet the requirements of 5G communication technology. At the same time, the inventors of the present application found that the surface hardness of the polymer ceramic layer 10 is low, the scratch resistance is poor, the product strength is not enough, and a thinner thickness cannot be realized, and the overall processing time is long, and the production efficiency is low; therefore, the present invention The inventor of the application coats and/or soaks the pre-treatment liquid on the polymer ceramic body, so that during the heat treatment, the accelerator in the pre-treatment liquid can promote the crosslinking of the polymer in the polymer ceramic body and improve the performance of the polymer. The degree of cross-linking can also greatly reduce the length of heat treatment, improve production efficiency, and increase the hardness of the shell 100, improve the ability to resist scratches, and is more conducive to its application.

在S101中,通过将聚合物陶瓷坯体涂覆和/或浸泡前处理液,经干燥后在聚合物陶瓷坯体表面形成前处理层,得到复合坯体。通过前处理,在聚合物陶瓷坯体的表面形成前处理层,聚合物陶瓷坯体包括聚合物,前处理层中具有能够促进所述聚合物交联的促进剂,从而可以在后续热处理过程中促进聚合物的交联,提高交联度。In S101, a composite body is obtained by coating and/or immersing the polymer ceramic body in a pretreatment liquid, and forming a pretreatment layer on the surface of the polymer ceramic body after drying. Through the pretreatment, a pretreatment layer is formed on the surface of the polymer ceramic body, the polymer ceramic body includes a polymer, and there is an accelerator that can promote the crosslinking of the polymer in the pretreatment layer, so that the subsequent heat treatment process can Promote the cross-linking of polymers and increase the degree of cross-linking.

请参阅图2,为本申请一实施方式提供的聚合物陶瓷坯体的制备方法流程图,包括:Please refer to FIG. 2 , which is a flow chart of a method for preparing a polymer ceramic green body provided in an embodiment of the present application, including:

S1011:陶瓷颗粒与聚合物混合后,经造粒得到注塑喂料。S1011: After the ceramic particles are mixed with the polymer, the injection molding feed is obtained by granulation.

S1012:注塑喂料经注塑得到聚合物陶瓷坯体。S1012: The injection molding feed is injected to obtain a polymer ceramic green body.

在S1011中,通过将陶瓷颗粒和聚合物混合、造粒形成注塑喂料,有利于后续注塑的进行。In S1011, the injection molding feed is formed by mixing and granulating the ceramic particles and the polymer, which facilitates subsequent injection molding.

在本申请实施方式中,陶瓷颗粒包括氧化锌、氧化锆、氧化铝、二氧化硅、氧化钛和碳化硅中的至少一种。上述陶瓷颗粒耐高温、耐腐蚀、硬度高、强度佳,有利于壳体100性能的提升使用。在一实施例中,陶瓷颗粒的折射率大于2,从而有利于进一步提升壳体100的陶瓷质感。在本申请实施方式中,陶瓷颗粒的直径为20nm-1μm。选择上述尺寸的陶瓷颗粒有利于与聚合物之间的混合,同时有利于提高壳体100的陶瓷相含量。进一步的,陶瓷颗粒的直径为100nm-800nm。更进一步的,陶瓷颗粒的直径为300nm-600nm。具体的,陶瓷颗粒的直径可以但不限于为50nm、100nm、250nm、400nm、500nm、650nm、700nm、800nm、900nm或1μm等。可以理解的,陶瓷颗粒的形貌可以但不限于为球体、类球体等。In the embodiment of the present application, the ceramic particles include at least one of zinc oxide, zirconium oxide, aluminum oxide, silicon dioxide, titanium oxide and silicon carbide. The above-mentioned ceramic particles are resistant to high temperature, corrosion, high in hardness and good in strength, which is beneficial for improving the performance of the housing 100 . In one embodiment, the refractive index of the ceramic particles is greater than 2, which is beneficial to further enhance the ceramic texture of the casing 100 . In the embodiment of the present application, the diameter of the ceramic particles is 20 nm-1 μm. Selecting the ceramic particles with the above size is beneficial to mixing with the polymer, and at the same time, it is beneficial to increase the ceramic phase content of the housing 100 . Further, the diameter of the ceramic particles is 100nm-800nm. Furthermore, the diameter of the ceramic particles is 300nm-600nm. Specifically, the diameter of the ceramic particles may be, but not limited to, 50nm, 100nm, 250nm, 400nm, 500nm, 650nm, 700nm, 800nm, 900nm or 1 μm. It can be understood that the morphology of the ceramic particles can be, but not limited to, a sphere, a spheroid, and the like.

在本申请中,通过将陶瓷颗粒与聚合物混合,有利于降低壳体100的质量,同时提高壳体100的韧性。在本申请实施方式中,聚合物包括热塑性树脂,热塑性树脂包括聚苯硫醚、聚亚苯基砜、聚酰胺和乙烯-醋酸乙烯共聚物中的至少一种。上述热聚合物的理化性能可以匹配壳体100的制备工艺,不会在制备过程中发生分解,同时也不会增加制备工艺难度,有利于降低生产成本。In the present application, by mixing the ceramic particles with the polymer, it is beneficial to reduce the mass of the housing 100 while improving the toughness of the housing 100 . In the embodiment of the present application, the polymer includes a thermoplastic resin, and the thermoplastic resin includes at least one of polyphenylene sulfide, polyphenylene sulfone, polyamide, and ethylene-vinyl acetate copolymer. The physical and chemical properties of the above-mentioned thermal polymer can match the manufacturing process of the housing 100 , and will not decompose during the manufacturing process, and will not increase the difficulty of the manufacturing process, which is beneficial to reduce production costs.

可以理解的,陶瓷颗粒和聚合物混合时,陶瓷颗粒和聚合物的混合比例可以根据聚合物陶瓷层10中各物质的含量进行选择,对此不作限定。在一实施例中,陶瓷颗粒和聚合物的质量比为(0.5-0.8):(0.2-0.5),有利于制得硬度高、强度好、陶瓷质感强的聚合物陶瓷层10。在一具体实施例中,将质量含量为50%-80%的陶瓷颗粒与20%-50%的聚合物混合,形成混合物。It can be understood that when the ceramic particles and the polymer are mixed, the mixing ratio of the ceramic particles and the polymer can be selected according to the content of each substance in the polymer ceramic layer 10 , which is not limited. In one embodiment, the mass ratio of the ceramic particles to the polymer is (0.5-0.8):(0.2-0.5), which is conducive to preparing the polymer ceramic layer 10 with high hardness, good strength and strong ceramic texture. In a specific embodiment, the mass content of 50%-80% of the ceramic particles is mixed with 20%-50% of the polymer to form a mixture.

在本申请实施方式中,混合包括采用共混和密炼中的至少一种方式进行。具体的,可以在共混挤出机和密炼机中的至少一种中进行混合,以使混合物中各物质均匀分散。在一实施例中,将混合物进行共混和/或密炼2-5次,一次共混或密炼的时长为1h-2h。具体的,共混或密炼的温度为300℃-350℃。在本申请中,将混合后的物质进行造粒即可得到注塑喂料。在一实施例中,可以将陶瓷颗粒和聚合物混合后,置于密炼造粒一体机中,经密炼造粒后得到注塑喂料。具体的,密炼造粒的温度可以但不限于为200℃-350℃,密炼造粒的时间可以但不限于为1h-12h。进一步的,密炼过程为负压状态,压力绝对值小于0.01MPa,从而有效防止聚合物被氧化,并且可以有效促进副反应生成的气体的排除。In the embodiment of the present application, mixing includes at least one of blending and banburying. Specifically, mixing can be carried out in at least one of a blending extruder and an internal mixer, so that the substances in the mixture are uniformly dispersed. In one embodiment, the mixture is blended and/or banburyed for 2-5 times, and the duration of one blending or banburying is 1h-2h. Specifically, the temperature of blending or banburying is 300°C-350°C. In this application, injection molding feed can be obtained by granulating the mixed material. In one embodiment, the ceramic particles and the polymer can be mixed, placed in an integrated mixing and granulating machine, and the injection molding feed can be obtained after mixing and granulating. Specifically, the temperature of banburying and granulation can be but not limited to 200°C-350°C, and the time of banburying and granulation can be but not limited to 1h-12h. Furthermore, the banburying process is in a negative pressure state, and the absolute value of the pressure is less than 0.01MPa, so as to effectively prevent the polymer from being oxidized, and can effectively promote the elimination of gases generated by side reactions.

在S1012中,注塑的工艺参数可以根据选用的聚合物的性质进行选择。在本申请一实施方式中,在注塑前还包括对注塑喂料进行烘干处理。在一实施例中,烘干处理包括在90℃-150℃烘干8h-12h。通过烘干处理以去除注塑喂料中的水分。在本申请一实施方式中,聚合物包括聚苯硫醚、聚亚苯基砜、聚酰胺和乙烯-醋酸乙烯共聚物中的至少一种时,注塑的成型温度为320℃-360℃,注射速度为70%-100%,注射压力为120MPa-250MPa;模具温度为130℃-180℃,保压时间为2s-60s,得到聚合物陶瓷坯体。进一步的,注塑的成型温度为320℃-340℃,注射速度为70%-90%,注射压力为150MPa-200MPa;模具温度为140℃-170℃,保压时间为5s-50s,得到聚合物陶瓷坯体。采用上述条件进行注塑成型,可以得到成型效果佳、成型良率高的聚合物陶瓷坯体。注塑得到的聚合物陶瓷坯体的形状可以需要进行选择,聚合物陶瓷坯体的厚度也可以根据需要进行选择。可以理解,还可以采用流延成型等其他成型方式制备聚合物陶瓷坯体。在本申请中,采用注塑成型的方法操作更加简单,相较于流延成型,无需考虑溶剂与聚合物相之间的相容性问题,制备成本低。In S1012, the technical parameters of injection molding can be selected according to the properties of the selected polymer. In one embodiment of the present application, drying the injection molding feedstock is also included before injection molding. In one embodiment, the drying treatment includes drying at 90°C-150°C for 8h-12h. Drying process to remove moisture from injection molding feedstock. In one embodiment of the present application, when the polymer includes at least one of polyphenylene sulfide, polyphenylene sulfone, polyamide and ethylene-vinyl acetate copolymer, the injection molding temperature is 320°C-360°C, and the injection The speed is 70%-100%, the injection pressure is 120MPa-250MPa; the mold temperature is 130°C-180°C, and the holding time is 2s-60s to obtain a polymer ceramic green body. Further, the molding temperature of injection molding is 320°C-340°C, the injection speed is 70%-90%, the injection pressure is 150MPa-200MPa; the mold temperature is 140°C-170°C, and the holding time is 5s-50s to obtain the polymer Ceramic bodies. By adopting the above-mentioned conditions for injection molding, a polymer ceramic green body with good molding effect and high molding yield can be obtained. The shape of the polymer ceramic body obtained by injection molding can be selected as needed, and the thickness of the polymer ceramic body can also be selected according to needs. It can be understood that other molding methods such as tape casting can also be used to prepare the polymer ceramic green body. In this application, the method of injection molding is simpler to operate, and compared with tape casting, there is no need to consider the compatibility problem between the solvent and the polymer phase, and the preparation cost is low.

请参阅图3,为本申请另一实施方式提供的聚合物陶瓷坯体的制备方法流程图,包括:Please refer to FIG. 3 , which is a flowchart of a method for preparing a polymer ceramic green body provided in another embodiment of the present application, including:

S2010:陶瓷颗粒进行预处理后,得到处理后的陶瓷颗粒。S2010: After the ceramic particles are pretreated, processed ceramic particles are obtained.

S2011:处理后的陶瓷颗粒与聚合物混合后,经造粒得到注塑喂料。S2011: After the treated ceramic particles are mixed with the polymer, the injection molding feed is obtained by granulation.

S2012:注塑喂料经注塑得到聚合物陶瓷坯体。S2012: The injection molding feed is injected to obtain a polymer ceramic green body.

在S1011中,通过将陶瓷颗粒和聚合物混合、造粒形成注塑喂料,有利于后续注塑的进行。In S1011, the injection molding feed is formed by mixing and granulating the ceramic particles and the polymer, which facilitates subsequent injection molding.

可以理解的,S2011和S2012的详细描述请参见上述实施方式中S1011和S1012对应部分的描述,在此不再赘述。It can be understood that, for detailed descriptions of S2011 and S2012, refer to the descriptions of the corresponding parts of S1011 and S1012 in the foregoing implementation manners, and details are not repeated here.

在本申请一实施方式中,陶瓷颗粒进行预处理后,得到处理后的陶瓷颗粒包括:对陶瓷颗粒进行改性处理,经喷雾造粒后得到处理后的陶瓷颗粒。通过对陶瓷颗粒进行改性,提升陶瓷颗粒与聚合物的相容性,从而提高壳体100的性能。In one embodiment of the present application, after the pretreatment of the ceramic particles, obtaining the processed ceramic particles includes: performing modification treatment on the ceramic particles, and obtaining the processed ceramic particles after spray granulation. By modifying the ceramic particles, the compatibility between the ceramic particles and the polymer is improved, thereby improving the performance of the housing 100 .

在本申请一实施例中,通过将陶瓷颗粒与改性剂混合,从而对陶瓷颗粒进行改性。可选的,改性剂包括硅烷偶联剂、柠檬酸铵、聚丙烯酸、聚甲基丙烯酸铵和三乙醇铵中的至少一种。在本申请中,改性剂可以根据聚合物的性质进行选择。在本申请另一实施例中,陶瓷颗粒与改性剂混合时,按重量份数计,陶瓷颗粒为60份-98份,改性剂为0.1份-3份。上述混合比例可以使得陶瓷颗粒改性完全,并且不会使改性剂发生团聚。进一步的,陶瓷颗粒与改性剂混合时,按重量分数计,陶瓷颗粒为60份-80份,改性剂为0.5份-2份。在本申请又一实施例中,陶瓷颗粒与改性剂混合时,还加入有分散助剂,从而使得陶瓷颗粒更好地均匀分散。具体的,按重量份数计,混合时陶瓷颗粒为60份-98份,改性剂为0.1份-3份,分散助剂为0.1份-1份。在本申请又一实施例中,陶瓷颗粒与改性剂混合时,还加入有着色剂,从而可以改善聚合物陶瓷坯体的外观色彩。具体的,按重量份数计,混合时陶瓷颗粒为60份-98份,改性剂为0.1份-3份,着色剂为1份-20份。在本申请中,着色剂包括有机着色剂和无机着色剂中的至少一种,着色剂可以根据所需的颜色进行选择,例如着色剂可以选用氧化钴或炭黑等,使聚合物陶瓷坯体呈现黑色,又如着色剂可以但不限于为选自氧化铁、氧化铈、氧化镍、氧化铋、氧化锌、氧化锰、氧化铬、氧化铜、氧化钒和氧化锡中的至少一种等。在本申请又一实施例中,陶瓷颗粒与改性剂混合时,还加入有分散剂和着色剂,陶瓷颗粒为60份-98份,改性剂为0.1份-3份,分散助剂为0.1份-1份,着色剂为1份-20份。In an embodiment of the present application, the ceramic particles are modified by mixing the ceramic particles with a modifier. Optionally, the modifying agent includes at least one of silane coupling agent, ammonium citrate, polyacrylic acid, ammonium polymethacrylate and triethanolammonium. In this application, the modifier can be selected according to the properties of the polymer. In another embodiment of the present application, when the ceramic particles are mixed with the modifier, the ceramic particles are 60-98 parts by weight, and the modifier is 0.1-3 parts. The above mixing ratio can completely modify the ceramic particles without agglomerating the modifying agent. Further, when the ceramic particles are mixed with the modifying agent, by weight fraction, the ceramic particle is 60-80 parts, and the modifying agent is 0.5-2 parts. In yet another embodiment of the present application, when the ceramic particles are mixed with the modifier, a dispersing aid is also added, so that the ceramic particles can be better uniformly dispersed. Specifically, in terms of parts by weight, when mixing, the amount of ceramic particles is 60-98 parts, the modifier is 0.1-3 parts, and the dispersion aid is 0.1-1 part. In yet another embodiment of the present application, when the ceramic particles are mixed with the modifying agent, a coloring agent is also added, so that the appearance color of the polymer ceramic body can be improved. Specifically, in terms of parts by weight, when mixing, the ceramic particle is 60-98 parts, the modifier is 0.1-3 parts, and the coloring agent is 1-20 parts. In the present application, the colorant includes at least one of an organic colorant and an inorganic colorant, and the colorant can be selected according to the desired color, for example, the colorant can be selected from cobalt oxide or carbon black, etc., so that the polymer ceramic body Appearing black, and for example, the coloring agent can be, but not limited to, at least one selected from iron oxide, cerium oxide, nickel oxide, bismuth oxide, zinc oxide, manganese oxide, chromium oxide, copper oxide, vanadium oxide, and tin oxide. In yet another embodiment of the present application, when the ceramic particles are mixed with the modifier, a dispersant and a colorant are also added, the ceramic particles are 60-98 parts, the modifier is 0.1-3 parts, and the dispersion aid is 0.1-1 part, coloring agent is 1-20 parts.

在本申请另一实施例中,陶瓷颗粒与改性剂混合后得到混合材料,混合材料进行球磨,得到混合浆料。可以理解的,当加入有分散剂和/或着色剂时,在所有物质混合后得到混合材料,混合材料再进行球磨。可选的,球磨包括将混合材料、水和球磨珠混合,球磨12h-48h,以使陶瓷颗粒改性完全。在一实施例中,混合材料、水和球磨珠质量比为1:(1-3):(0.5-1),有利于混合材料的充分混合,有利于陶瓷颗粒的改性。具体的,混合材料、水和球磨珠质量比可以但不限于为1:1:1、1:2:1、1:3:1、1:1.5:0.5、1:2:0.5、1:2:0.8或1:2.5:1等。在本申请中,球磨可以在室温中进行,如15℃-35℃等。In another embodiment of the present application, the ceramic particles are mixed with the modifier to obtain a mixed material, and the mixed material is ball milled to obtain a mixed slurry. It can be understood that when a dispersant and/or a colorant is added, a mixed material is obtained after all materials are mixed, and the mixed material is then ball milled. Optionally, ball milling includes mixing the mixed material, water and ball milling beads, and ball milling for 12h-48h, so as to completely modify the ceramic particles. In one embodiment, the mass ratio of the mixed material, water and ball milling beads is 1:(1-3):(0.5-1), which is beneficial to the thorough mixing of the mixed material and the modification of the ceramic particles. Specifically, the mass ratio of the mixed material, water and ball milling beads can be, but not limited to, 1:1:1, 1:2:1, 1:3:1, 1:1.5:0.5, 1:2:0.5, 1:2 :0.8 or 1:2.5:1 etc. In the present application, ball milling can be performed at room temperature, such as 15°C-35°C and the like.

在本申请又一实施例中,混合浆料将喷雾造粒后得到处理后的陶瓷颗粒。具体的,喷雾造粒的温度可以根据混合浆料中溶剂的温度进行选择,喷雾造粒可以置于喷雾造粒机中进行。在一实施例中,喷雾造粒过程中进料温度为70-80℃,进风温度为130-160℃,排风温度为70-85℃,塔内温度为70-90℃,塔内负压为50pa-150pa。通过上述工艺,可以形成尺寸均匀的处理后的陶瓷颗粒,有利于与聚合物之间的混合。具体的,经喷雾造粒后,处理后的陶瓷颗粒的直径为100nm-1μm。In yet another embodiment of the present application, the mixed slurry is spray-granulated to obtain treated ceramic particles. Specifically, the temperature of the spray granulation can be selected according to the temperature of the solvent in the mixed slurry, and the spray granulation can be performed in a spray granulator. In one embodiment, during the spray granulation process, the feed temperature is 70-80°C, the inlet air temperature is 130-160°C, the exhaust air temperature is 70-85°C, the temperature in the tower is 70-90°C, and the negative pressure in the tower is The pressure is 50pa-150pa. Through the above process, treated ceramic particles with uniform size can be formed, which is beneficial for mixing with polymers. Specifically, after spray granulation, the diameter of the treated ceramic particles is 100 nm-1 μm.

在本申请实施方式中,聚合物陶瓷坯体包括聚合物和陶瓷颗粒。进一步的,陶瓷颗粒均匀分散在聚合物陶瓷坯体中。In the embodiment of the present application, the polymer ceramic body includes polymer and ceramic particles. Further, the ceramic particles are evenly dispersed in the polymer ceramic body.

在S101中,前处理液包括能够促进聚合物交联的促进剂。在本申请实施方式中,促进剂包括有机促进剂和金属促进剂中的至少一种,以促进聚合物的交联。在一实施例中,有机促进剂包括胺类、酚类、苯类和醚类中的至少一种。具体的,有机促进剂包括三聚氰胺、六甲氧甲基三聚氰胺、三羟基苯、季戊四醇三烯丙基醚、苯酚和受阻酚类中的至少一种。在另一实施例中,金属促进剂包括银、铜、铁、铅、锌和镁中的至少一种。在本申请中,前处理液可以仅包含有机促进剂,还可以仅包含金属促进剂;也可以既包括有机促进剂,又包括金属促进剂。本申请发明人研究发现,同时加入有机促进剂和金属促进剂可以进一步提升交联速度,在相同时间内达到更高地交联水平,同时进一步降低了处理时间,缩短制备时长。在一实施例中,促进剂中所述有机促进剂和所述金属促进剂的质量比为1.2-4,从而有利于后续热处理中聚合物交联程度的快速提高。进一步的,促进剂中所述有机促进剂和所述金属促进剂的质量比为1.5-3.5。具体的,促进剂中所述有机促进剂和所述金属促进剂的质量比可以但不限于为1.5、2、2.5、2.8、3、3.4或3.5等。在一具体实施例中,可以将三聚氰胺和锌按质量比1.2-4混合作为促进剂。在本申请另一实施方式中,前处理中促进剂的质量含量为10%-50%。上述含量的促进剂可以保证在后续处理过程中有效促进聚合物的交联,同时可以很好的分散在前处理液中。进一步的,前处理中促进剂的质量含量为15%-45%。更进一步的,前处理中促进剂的质量含量为20%-40%。具体的,前处理中促进剂的质量含量可以但不限于为15%、18%、22%、25%、27%、30%、35%、40%或43%等。In S101, the pretreatment liquid includes an accelerator capable of accelerating polymer crosslinking. In the embodiment of the present application, the accelerator includes at least one of an organic accelerator and a metal accelerator, so as to accelerate the cross-linking of the polymer. In one embodiment, the organic accelerator includes at least one of amines, phenols, benzenes and ethers. Specifically, the organic accelerator includes at least one of melamine, hexamethoxymethyl melamine, trihydroxybenzene, pentaerythritol triallyl ether, phenol and hindered phenols. In another embodiment, the metal promoter includes at least one of silver, copper, iron, lead, zinc, and magnesium. In the present application, the pretreatment liquid may contain only organic accelerators or metal accelerators; it may also include both organic accelerators and metal accelerators. The inventors of the present application found that adding an organic accelerator and a metal accelerator at the same time can further increase the crosslinking speed, achieve a higher level of crosslinking within the same time, and further reduce the processing time and shorten the preparation time. In one embodiment, the mass ratio of the organic accelerator to the metal accelerator in the accelerator is 1.2-4, which is conducive to the rapid improvement of the crosslinking degree of the polymer in the subsequent heat treatment. Further, the mass ratio of the organic accelerator and the metal accelerator in the accelerator is 1.5-3.5. Specifically, the mass ratio of the organic accelerator to the metal accelerator in the accelerator may be, but not limited to, 1.5, 2, 2.5, 2.8, 3, 3.4 or 3.5. In a specific embodiment, melamine and zinc may be mixed in a mass ratio of 1.2-4 as an accelerator. In another embodiment of the present application, the mass content of the accelerator in the pretreatment is 10%-50%. The accelerator in the above content can effectively promote the crosslinking of the polymer in the subsequent treatment process, and can be well dispersed in the pretreatment liquid at the same time. Further, the mass content of the accelerator in the pretreatment is 15%-45%. Furthermore, the mass content of the accelerator in the pretreatment is 20%-40%. Specifically, the mass content of the accelerator in the pretreatment may be, but not limited to, 15%, 18%, 22%, 25%, 27%, 30%, 35%, 40% or 43%.

在本申请一实施方式中,前处理液中包括溶剂。在一实施例中,前处理液中溶剂的质量含量为50%-80%。进一步的,前处理液中溶剂的质量含量为60%-80%。更进一步的,前处理液中溶剂的质量含量为65%-75%。具体的,前处理中溶剂的质量含量可以但不限于为52%、55%、57%、60%、63%、65%、70%、76%或79%等。在本申请中,溶剂包括水、乙醇和丙酮中的至少一种。在本申请另一实施方式中,前处理液中包括分散剂。通过加入分散剂提高促进剂的均匀分散程度。在一实施例中,前处理液中分散剂的质量含量为0.5%-5%。进一步的,前处理液中分散剂的质量含量为1%-3.5%。具体的,前处理中分散剂的质量含量可以但不限于为0.5%、1%、1.8%、2%、2.5%、3%、3.7%、4%或4.5%等。在另一实施例中,分散剂包括硅烷偶联剂、硬脂酸、硬脂酸铵和聚乙二醇中的至少一种。在本申请又一实施方式中,前处理液中包括粘结剂。通过加入粘结剂使得在喷涂、浸泡后促进剂附着在聚合物陶瓷坯体的表面。在一实施例中,前处理液中粘结剂的质量含量为1%-5%。进一步的,前处理液中粘结剂的质量含量为1.5%-4%。更进一步的,前处理液中粘结剂的质量含量为2%-3.5%。具体的,前处理中粘结剂的质量含量可以但不限于为1%、1.8%、2%、2.5%、3%、3.5%、4%、4.5%或4.7%等。在另一实施例中,粘结剂包括聚乙烯醇、聚乙烯醇缩丁醛酯、聚乙二醇和丙烯酸树脂中的至少一种。在一具体实施例中,前处理液包括促进剂、分散剂、粘结剂和溶剂。进一步的,前处理液中促进剂的质量含量为10%-50%,分散剂的质量含量为0.5%-5%,所述粘结剂的质量含量为1%-5%,所述溶剂的质量含量为50%-80%,从而可以保证促进剂的均匀分散,以及在处理聚合陶瓷坯体后可以附着在聚合物陶瓷坯体的表面。In one embodiment of the present application, the pretreatment liquid includes a solvent. In one embodiment, the mass content of the solvent in the pretreatment liquid is 50%-80%. Further, the mass content of the solvent in the pretreatment liquid is 60%-80%. Furthermore, the mass content of the solvent in the pretreatment liquid is 65%-75%. Specifically, the mass content of the solvent in the pretreatment may be, but not limited to, 52%, 55%, 57%, 60%, 63%, 65%, 70%, 76% or 79%. In the present application, the solvent includes at least one of water, ethanol and acetone. In another embodiment of the present application, the pretreatment liquid includes a dispersant. The degree of uniform dispersion of the accelerator can be improved by adding a dispersant. In one embodiment, the mass content of the dispersant in the pretreatment liquid is 0.5%-5%. Further, the mass content of the dispersant in the pretreatment liquid is 1%-3.5%. Specifically, the mass content of the dispersant in the pretreatment may be, but not limited to, 0.5%, 1%, 1.8%, 2%, 2.5%, 3%, 3.7%, 4% or 4.5%. In another embodiment, the dispersant includes at least one of silane coupling agent, stearic acid, ammonium stearate and polyethylene glycol. In yet another embodiment of the present application, the pretreatment liquid includes a binder. The accelerator is attached to the surface of the polymer ceramic body after spraying and soaking by adding a binder. In one embodiment, the mass content of the binder in the pretreatment liquid is 1%-5%. Further, the mass content of the binder in the pretreatment liquid is 1.5%-4%. Furthermore, the mass content of the binder in the pretreatment liquid is 2%-3.5%. Specifically, the mass content of the binder in the pretreatment may be, but not limited to, 1%, 1.8%, 2%, 2.5%, 3%, 3.5%, 4%, 4.5% or 4.7%. In another embodiment, the binder includes at least one of polyvinyl alcohol, polyvinyl butyral, polyethylene glycol, and acrylic resin. In a specific embodiment, the pretreatment liquid includes accelerators, dispersants, binders and solvents. Further, the mass content of the accelerator in the pretreatment liquid is 10%-50%, the mass content of the dispersant is 0.5%-5%, the mass content of the binder is 1%-5%, and the mass content of the solvent is The mass content is 50%-80%, so that the homogeneous dispersion of the accelerator can be ensured, and the accelerator can be attached to the surface of the polymer ceramic body after processing the polymer ceramic body.

在本申请中,可以通过涂覆的方式,将前处理液涂覆在聚合物陶瓷坯体的表面,也可以将聚合物陶瓷坯体浸泡至前处理液中,从而可以在干燥后在聚合物陶瓷坯体的表面形成前处理层。在本申请实施方式中,涂覆和/或浸泡包括在15℃-40℃下处理1h-2h,以便于前处理液更好地均匀附着在聚合物陶瓷坯体上。进一步的,涂覆和/或浸泡包括在20℃-35℃下处理1h-2h。在本申请实施方式中,干燥包括在80℃-100℃进行处理。进一步的,干燥包括在85℃-100℃进行处理。具体的,干燥时间可以根据溶剂挥发情况进行选择。In this application, the pretreatment liquid can be coated on the surface of the polymer ceramic body by coating, and the polymer ceramic body can also be soaked in the pretreatment liquid, so that the polymer ceramic body can be dried after drying. A pretreatment layer is formed on the surface of the ceramic body. In the embodiment of the present application, the coating and/or immersion includes treatment at 15° C.-40° C. for 1 h-2 h, so that the pre-treatment liquid can better and uniformly adhere to the polymer ceramic body. Further, the coating and/or soaking includes treating at 20°C-35°C for 1h-2h. In the embodiment of the present application, drying includes processing at 80°C-100°C. Further, drying includes processing at 85°C-100°C. Specifically, the drying time can be selected according to the volatilization of the solvent.

在本申请实施方式中,前处理层的厚度为10μm-100μm。具体的,前处理层的厚度可以但不限于为10μm、20μm、40μm、50μm、70μm、85μm或100μm等。设置上述厚度的前处理层能够在后续热处理过程中促进聚合物的交联,同时又不会浪费。在本申请中复合坯体为聚合物陶瓷坯体以及设置在聚合物陶瓷坯体表面的前处理层。可以理解的,前处理层可以位于聚合物陶瓷坯体的一个或多个表面上,也可以位于聚合物陶瓷坯体的所有表面,可以根据需要进行选择。In the embodiment of the present application, the thickness of the pretreatment layer is 10 μm-100 μm. Specifically, the thickness of the pretreatment layer may be, but not limited to, 10 μm, 20 μm, 40 μm, 50 μm, 70 μm, 85 μm or 100 μm. Setting the pre-treatment layer with the above-mentioned thickness can promote the cross-linking of the polymer in the subsequent heat treatment process without waste. In this application, the composite body is a polymer ceramic body and a pretreatment layer arranged on the surface of the polymer ceramic body. It can be understood that the pretreatment layer can be located on one or more surfaces of the polymer ceramic body, or on all surfaces of the polymer ceramic body, and can be selected according to needs.

在S102中,通过热处理使聚合物陶瓷坯体中的聚合物发生交联,同时在促进剂的作用下,加快聚合物的交联程度,减少热处理的时间;并且在热压后消除内部的孔隙,提高致密度;进一步的将前处理层去除,获得聚合物陶瓷层10,制得壳体100。In S102, the polymer in the polymer ceramic body is cross-linked by heat treatment, and at the same time, under the action of the accelerator, the degree of cross-linking of the polymer is accelerated to reduce the time of heat treatment; and the internal pores are eliminated after hot pressing , improve the density; further remove the pre-treatment layer to obtain the polymer ceramic layer 10, and manufacture the shell 100.

在本申请实施方式中,热处理的时间小于或等于12h。进一步的,热处理的时间小于或等于8h。进一步的,热处理的时间小于或等于5h。相关技术中,通过热处理提高聚合物的交联程度,热处理时间在48h-72h,大大提高了制备时长,降低了生产效率。本申请发明人研究发现,通过在聚合物陶瓷坯体表面设置前处理层,在热处理过程中,促进剂与聚合物反应,在原有的聚合物交联的基础上进一步促进了聚合物的交联,从而提升整体交联度;相比于未经前处理液处理的聚合物陶瓷坯体,复合坯体制得的聚合物陶瓷层10中聚合物的交联程度更高,表面硬度高,抗划伤效果好,整体强度佳,同时热处理的时间大大缩短,热处理的时间小于或等于12h。In the embodiment of the present application, the heat treatment time is less than or equal to 12 hours. Further, the heat treatment time is less than or equal to 8 hours. Further, the heat treatment time is less than or equal to 5h. In related technologies, heat treatment is used to increase the degree of crosslinking of polymers, and the heat treatment time is 48h-72h, which greatly increases the preparation time and reduces production efficiency. The inventors of the present application found that by setting a pretreatment layer on the surface of the polymer ceramic body, the accelerator reacts with the polymer during the heat treatment process, which further promotes the crosslinking of the polymer on the basis of the original polymer crosslinking. , so as to improve the overall degree of crosslinking; compared with the polymer ceramic body without pretreatment liquid treatment, the polymer ceramic layer 10 made of the composite body has a higher degree of crosslinking, high surface hardness, and scratch resistance The wounding effect is good, the overall strength is good, and the time of heat treatment is greatly shortened, and the time of heat treatment is less than or equal to 12h.

在本申请一实施例中,热处理的温度大于聚合物的熔融温度且小于聚合物的分解温度。在本申请另一实施例中,热处理包括在0.5h-1h内从15℃-40℃升温至220℃-280℃后保温0.5h-2h,再在0.5h-1h内从220℃-280℃升温至300℃-380℃后保温0.5h-4h。采用上述分段热处理过程,可以使复合坯体受热均匀,聚合物的交联程度均匀。在第一阶段,聚合物陶瓷坯体中的聚合物预软化,前处理层中的促进剂可以渗入聚合物陶瓷坯体中,与聚合物发生反应;在第二阶段,温度升高,聚合物之间发生进一步的交联,从而提高壳体100的表面硬度以及整体的强度。在一实施例中,当聚合物陶瓷坯体之间进行热处理时,热处理包括在0.5h-1h内从15℃-40℃升温至220℃-280℃后保温24h,再在0.5h-1h内从220℃-280℃升温至300℃-380℃后保温24h,远大于上述的热处理时间。在一具体实施例中,当聚合物包括聚苯硫醚、聚亚苯基砜、聚酰胺和乙烯-醋酸乙烯共聚物中的至少一种时,可以采用上述的热处理过程,大大降低热处理时长,并且聚合物的交联程度提高。In an embodiment of the present application, the heat treatment temperature is higher than the melting temperature of the polymer and lower than the decomposition temperature of the polymer. In another embodiment of the present application, the heat treatment includes raising the temperature from 15°C-40°C to 220°C-280°C within 0.5h-1h, then keeping it warm for 0.5h-2h, and then changing the temperature from 220°C-280°C within 0.5h-1h After heating up to 300°C-380°C, keep it warm for 0.5h-4h. By adopting the above-mentioned segmented heat treatment process, the composite green body can be heated evenly, and the degree of crosslinking of the polymer can be uniform. In the first stage, the polymer in the polymer ceramic body is pre-softened, and the accelerator in the pretreatment layer can penetrate into the polymer ceramic body and react with the polymer; in the second stage, the temperature rises, and the polymer Further cross-linking occurs between them, thereby improving the surface hardness and overall strength of the housing 100 . In one embodiment, when the heat treatment is performed between the polymer ceramic bodies, the heat treatment includes raising the temperature from 15°C-40°C to 220°C-280°C within 0.5h-1h and then keeping it warm for 24h, and then within 0.5h-1h After heating from 220°C-280°C to 300°C-380°C, keep it warm for 24 hours, which is much longer than the above-mentioned heat treatment time. In a specific embodiment, when the polymer includes at least one of polyphenylene sulfide, polyphenylene sulfone, polyamide and ethylene-vinyl acetate copolymer, the above-mentioned heat treatment process can be used to greatly reduce the length of heat treatment, And the degree of cross-linking of the polymer increases.

在本申请中,通过热压提升内部的致密性,降低了内部的微观缺陷,提高了壳体100的强度。在本申请实施方式中,热压的温度大于聚合物的玻璃化转变温度且小于聚合物的分解温度。进一步的,热压的温度比聚合物的玻璃化转变温度高20℃-60℃。在此范围内,聚合物处理高弹状态,分子链可以发生运动,在压力作用下使其与陶瓷颗粒之间更加紧密,提高壳体100性能。在本申请一实施例中,热压包括在20MPa-80MPa、300℃-400℃下处理2h-12h。采用上述热压工艺可以加强聚合物陶瓷层10内部的致密程度,进一步提升壳体100强度。进一步的,热压包括在30MPa-70MPa、310℃-460℃下处理3h-10h。具体的,热压的压力可以但不限于为28MPa、35MPa、40MPa、45MPa、50MPa、60MPa或75MPa等,热压的温度可以但不限于为310℃、320℃、340℃、350℃、360℃或380℃等,热压的时间可以但不限于为2h、4h、5h、7h、10h或11h等。在本申请另一实施例中,当聚合物包括聚苯硫醚、聚亚苯基砜、聚酰胺和乙烯-醋酸乙烯共聚物中的至少一种时,可以采用上述的热压工艺。具体的,热压可以但不限于在热压烧结炉中进行,整个过程在惰性气氛下进行,如可以通入氮气或氩气等。在本申请中,经热压后,待自然降温后即可去除聚合物陶瓷层10。In the present application, the internal compactness is improved by hot pressing, the internal microscopic defects are reduced, and the strength of the casing 100 is improved. In the embodiment of the present application, the temperature of the hot pressing is higher than the glass transition temperature of the polymer and lower than the decomposition temperature of the polymer. Further, the temperature of hot pressing is 20°C-60°C higher than the glass transition temperature of the polymer. Within this range, the polymer is in a highly elastic state, and the molecular chains can move, making them closer to the ceramic particles under pressure, improving the performance of the housing 100 . In an embodiment of the present application, the hot pressing includes processing at 20MPa-80MPa and 300°C-400°C for 2h-12h. The above-mentioned hot pressing process can enhance the compactness inside the polymer ceramic layer 10 and further enhance the strength of the casing 100 . Further, hot pressing includes processing at 30MPa-70MPa and 310°C-460°C for 3h-10h. Specifically, the pressure of hot pressing can be but not limited to 28MPa, 35MPa, 40MPa, 45MPa, 50MPa, 60MPa or 75MPa, etc. The temperature of hot pressing can be but not limited to 310°C, 320°C, 340°C, 350°C, 360°C Or 380°C, etc., the hot pressing time can be but not limited to 2h, 4h, 5h, 7h, 10h or 11h, etc. In another embodiment of the present application, when the polymer includes at least one of polyphenylene sulfide, polyphenylene sulfone, polyamide and ethylene-vinyl acetate copolymer, the above hot pressing process can be used. Specifically, the hot pressing can be performed, but not limited to, in a hot pressing sintering furnace, and the whole process is performed under an inert atmosphere, such as nitrogen or argon, etc. can be introduced. In this application, after hot pressing, the polymer ceramic layer 10 can be removed after natural cooling.

在本申请中,在热压后,还要将前处理层进行去除,从而可以得到表面硬度高、强度佳的聚合物陶瓷层10。在本申请实施方式中,通过计算机数字化控制精密机械加工(CNC加工)和研磨抛光中的至少一种方法去除前处理层。通过CNC加工可以去除前处理层,并且获得最终所需组装配合尺寸的聚合物陶瓷层10;例如,通过CNC加工使得聚合物陶瓷层10更加平整。CNC加工的工艺条件可以根据需要进行选择。在一具体实施例中,将热压后的聚合物陶瓷坯体按照所需形状进行CNC加工,CNC加工选用聚晶金刚石(PCD)铣刀,主轴转速为10000rpm-25000rpm,单次切削量为10μm-500μm。通过研磨抛光,既能够去除前处理层,还可以降低聚合物陶瓷层10表面的粗糙度。在本申请中,可以选用五轴研磨抛光机、13.6B双面研磨机或扫光机等进行处理。在一实施例中,研磨抛光包括粗抛和精抛。具体的,粗抛可以选用扫光机、双面研磨机、五轴抛光机中的至少一种,抛光盘选自猪毛、磨皮盘、阻尼布、胶丝、铜丝、地毯或猪毛配合磨皮复合材料中的一种或多种,粗抛抛光液包括水系钻石抛光液和油系钻石抛光液中的至少一种,粗抛抛光液中钻石微粉的粒度为0.5μm-20μm,粗抛抛光液的浓度1wt%-30wt%;精抛可以选用扫光机、双面研磨机中的至少一种,精抛抛光液包括氧化硅抛光液和氧化铈抛光液中的至少一种,精抛抛光液中颗粒的粒度为50nm-500nm,精抛抛光液的浓度5wt%-45wt%。在一具体实施例中,可以先进行CNC加工,然后再进行研磨抛光,从而可以有效去除前处理层,并且获得表面光滑的聚合物陶瓷层10。In this application, after hot pressing, the pre-treatment layer is also removed, so that the polymer ceramic layer 10 with high surface hardness and good strength can be obtained. In the embodiment of the present application, the pre-treatment layer is removed by at least one of computer numerical control precision machining (CNC machining) and grinding and polishing. The pre-treatment layer can be removed by CNC processing, and the polymer ceramic layer 10 with the final size required for assembly can be obtained; for example, the polymer ceramic layer 10 can be made smoother by CNC processing. The process conditions of CNC machining can be selected according to needs. In a specific embodiment, the hot-pressed polymer ceramic body is CNC processed according to the desired shape, and the CNC processing uses a polycrystalline diamond (PCD) milling cutter, the spindle speed is 10000rpm-25000rpm, and the single cutting amount is 10μm -500 μm. Grinding and polishing can not only remove the pretreatment layer, but also reduce the surface roughness of the polymer ceramic layer 10 . In this application, five-axis grinding and polishing machines, 13.6B double-sided grinding machines or sweeping machines can be used for processing. In one embodiment, abrasive polishing includes rough polishing and fine polishing. Specifically, at least one of a sweeping machine, a double-sided grinding machine, and a five-axis polishing machine can be used for rough polishing, and the polishing disc is selected from pig hair, dermabrasion disc, damping cloth, rubber wire, copper wire, carpet or pig hair Cooperate with one or more of the skin grinding composite materials, the rough polishing liquid includes at least one of water-based diamond polishing liquid and oil-based diamond polishing liquid, the particle size of diamond micropowder in the rough polishing liquid is 0.5 μm-20 μm, coarse The concentration of the polishing liquid is 1wt%-30wt%; fine polishing can be selected from at least one of a sweeping machine and a double-sided grinding machine, and the fine polishing liquid includes at least one of silicon oxide polishing liquid and cerium oxide polishing liquid. The grain size of the particles in the polishing liquid is 50nm-500nm, and the concentration of the fine polishing liquid is 5wt%-45wt%. In a specific embodiment, CNC processing can be performed first, and then grinding and polishing can be performed, so that the pretreatment layer can be effectively removed, and the polymer ceramic layer 10 with a smooth surface can be obtained.

在本申请实施方式中,壳体100的制备方法还包括在聚合物陶瓷层10的表面喷涂或沉积保护材料,形成保护层20;具体的,保护层20的厚度可以但不限于为0.5μm-3μm,沉积可以但不限于为蒸发镀膜、溅射、真空镀等。在一实施例中,通过在聚合物陶瓷层10表面涂覆抗指纹剂,形成抗指纹层,提升壳体100的抗指纹效果。在另一实施例中,通过在聚合物陶瓷层10表面蒸镀硬化材料,形成硬化层。具体的,硬化材料可以但不限于包括石墨、氧化铝、氧化锆、氧化硅、氮化铬和氮化钛中的至少一种。In the embodiment of the present application, the preparation method of the shell 100 also includes spraying or depositing a protective material on the surface of the polymer ceramic layer 10 to form the protective layer 20; specifically, the thickness of the protective layer 20 can be, but not limited to, 0.5 μm- 3μm, deposition can be, but not limited to, evaporation coating, sputtering, vacuum plating, etc. In one embodiment, an anti-fingerprint layer is formed by coating an anti-fingerprint agent on the surface of the polymer ceramic layer 10 to improve the anti-fingerprint effect of the casing 100 . In another embodiment, the hardened layer is formed by evaporating a hardened material on the surface of the polymer ceramic layer 10 . Specifically, the hardening material may include, but is not limited to, at least one of graphite, aluminum oxide, zirconium oxide, silicon oxide, chromium nitride, and titanium nitride.

本申请还提供了一种壳体100,通过上述任一实施方式所述的制备方法制得,该壳体100包括聚合物陶瓷层10。请参阅图4,为本申请一实施方式提供的壳体100的结构示意图,壳体100包括聚合物陶瓷层10。本申请提供的壳体100的表面硬度高,强度佳,并且陶瓷质感好,具有广泛的应用前景。The present application also provides a casing 100 manufactured by the preparation method described in any one of the above-mentioned embodiments, and the casing 100 includes a polymer ceramic layer 10 . Please refer to FIG. 4 , which is a schematic structural diagram of a casing 100 provided by an embodiment of the present application. The casing 100 includes a polymer ceramic layer 10 . The shell 100 provided by the present application has high surface hardness, good strength, and good ceramic texture, and has wide application prospects.

在本申请实施方式中,聚合物陶瓷层10包括聚合物和陶瓷颗粒。在一实施例中,聚合物陶瓷层10中聚合物交联呈三维网状结构,陶瓷颗粒分散在三维网状结构中。在本申请实施方式中,聚合物包括热塑性树脂,热塑性树脂包括聚苯硫醚、聚亚苯基砜、聚酰胺和乙烯-醋酸乙烯共聚物中的至少一种。In the embodiment of the present application, the polymer ceramic layer 10 includes polymer and ceramic particles. In one embodiment, the polymer in the polymer ceramic layer 10 is cross-linked to form a three-dimensional network structure, and ceramic particles are dispersed in the three-dimensional network structure. In the embodiment of the present application, the polymer includes a thermoplastic resin, and the thermoplastic resin includes at least one of polyphenylene sulfide, polyphenylene sulfone, polyamide, and ethylene-vinyl acetate copolymer.

在本申请实施方式中,聚合物陶瓷层10中陶瓷颗粒的质量含量大于或等于40%。聚合物陶瓷层10中陶瓷颗粒的含量较多可以提高表面硬度,同时提升陶瓷质感。进一步的,聚合物陶瓷层10中陶瓷颗粒的质量含量为40%-80%。具体的,聚合物陶瓷层10中陶瓷颗粒的质量含量可以但不限于为40%、45%、50%、58%、60%、65%、72%、75%或80%等。在本申请实施方式中,陶瓷颗粒包括氧化锌、氧化锆、氧化铝、二氧化硅、氧化钛和碳化硅中的至少一种。上述陶瓷颗粒耐高温、耐腐蚀、硬度高、强度佳,有利于壳体100性能的提升使用。In the embodiment of the present application, the mass content of ceramic particles in the polymer ceramic layer 10 is greater than or equal to 40%. The higher content of ceramic particles in the polymer ceramic layer 10 can improve the surface hardness and enhance the texture of ceramics. Further, the mass content of ceramic particles in the polymer ceramic layer 10 is 40%-80%. Specifically, the mass content of ceramic particles in the polymer ceramic layer 10 may be, but not limited to, 40%, 45%, 50%, 58%, 60%, 65%, 72%, 75% or 80%. In the embodiment of the present application, the ceramic particles include at least one of zinc oxide, zirconium oxide, aluminum oxide, silicon dioxide, titanium oxide and silicon carbide. The above-mentioned ceramic particles are resistant to high temperature, corrosion, high in hardness and good in strength, which is beneficial for improving the performance of the housing 100 .

本申请通过采用GB/T 6739-1996标准,在1kg压力下对聚合物陶瓷层10表面的硬度进行检测。在本申请实施方式中,聚合物陶瓷层10表面的铅笔硬度大于或等于3H。进一步的,聚合物陶瓷层10表面的铅笔硬度为3H-7H,从而大幅度提高了壳体100的硬度和强度。更进一步的,聚合物陶瓷层10表面的铅笔硬度为4H-7H。具体的,聚合物陶瓷层10表面的铅笔硬度可以但不限于为3H、4H、5H、6H或7H等。In this application, the hardness of the surface of the polymer ceramic layer 10 is detected under a pressure of 1 kg by adopting the GB/T 6739-1996 standard. In the embodiment of the present application, the pencil hardness of the surface of the polymer ceramic layer 10 is greater than or equal to 3H. Further, the pencil hardness of the surface of the polymer ceramic layer 10 is 3H-7H, thereby greatly improving the hardness and strength of the casing 100 . Furthermore, the pencil hardness of the surface of the polymer ceramic layer 10 is 4H-7H. Specifically, the pencil hardness of the surface of the polymer ceramic layer 10 may be, but not limited to, 3H, 4H, 5H, 6H or 7H.

本申请通过采用GB/T 16534-2009标准,在1kg压力下对聚合物陶瓷层10的维氏硬度进行检测。在本申请实施方式中,聚合物陶瓷层10的维氏硬度大于或等于400HV。进一步的,聚合物陶瓷层10的维氏硬度为400HV-800HV。更进一步的,聚合物陶瓷层10的维氏硬度为500HV-700HV。具体的,聚合物陶瓷层10的维氏硬度可以但不限于为400HV、450HV、500HV、550HV、600HV、700HV或800HV等。In the present application, the Vickers hardness of the polymer ceramic layer 10 is detected under a pressure of 1 kg by adopting GB/T 16534-2009 standard. In the embodiment of the present application, the Vickers hardness of the polymer ceramic layer 10 is greater than or equal to 400HV. Further, the Vickers hardness of the polymer ceramic layer 10 is 400HV-800HV. Furthermore, the Vickers hardness of the polymer ceramic layer 10 is 500HV-700HV. Specifically, the Vickers hardness of the polymer ceramic layer 10 may be, but not limited to, 400HV, 450HV, 500HV, 550HV, 600HV, 700HV or 800HV.

在本申请中,采用落球冲击性能测试检测聚合物陶瓷层10的性能,其中,落球为32g的不锈钢球,聚合物陶瓷层10厚度为0.8mm。在一实施例中,将聚合物陶瓷层10支撑于治具上,其中聚合物陶瓷层10的四周边缘有5mm的支撑,中部悬空;将32g的不锈钢球从一定高度自由落下至待测聚合物陶瓷层10表面上的待检测点,记录使聚合物陶瓷层10破碎的高度为落球高度。进一步的,将32g的不锈钢球从一定高度自由落下至待测聚合物陶瓷层10表面的中心,每个高度测试5次,记录使聚合物陶瓷层10破碎的高度为落球高度。在本申请实施方式中,聚合物陶瓷层10的落球高度大于或等于70cm。进一步的,聚合物陶瓷层10的落球高度为70cm-100cm。更进一步的,聚合物陶瓷层10的落球高度为80cm-95cm。本申请中聚合物陶瓷层10具有优异抗跌落性能,韧性强。In the present application, the performance of the polymer ceramic layer 10 is detected by using a falling ball impact test, wherein the falling ball is a 32 g stainless steel ball, and the thickness of the polymer ceramic layer 10 is 0.8 mm. In one embodiment, the polymer ceramic layer 10 is supported on the jig, wherein the surrounding edges of the polymer ceramic layer 10 are supported by 5 mm, and the middle part is suspended; 32 g of stainless steel balls are freely dropped from a certain height to the polymer to be tested. For the point to be detected on the surface of the ceramic layer 10, record the height at which the polymer ceramic layer 10 is broken as the falling ball height. Further, a 32g stainless steel ball was freely dropped from a certain height to the center of the surface of the polymer ceramic layer 10 to be tested, and each height was tested 5 times, and the height at which the polymer ceramic layer 10 was broken was recorded as the falling ball height. In the embodiment of the present application, the falling ball height of the polymer ceramic layer 10 is greater than or equal to 70 cm. Further, the falling ball height of the polymer ceramic layer 10 is 70cm-100cm. Furthermore, the falling ball height of the polymer ceramic layer 10 is 80cm-95cm. In this application, the polymer ceramic layer 10 has excellent drop resistance and strong toughness.

本申请通过采用GB/T 6569-2006标准,对聚合物陶瓷层10的四点抗弯强度进行检测。在本申请实施方式中,聚合物陶瓷层10的四点抗弯强度大于或等于400N。进一步的,聚合物陶瓷层10的四点抗弯强度为400N-800N。更进一步的,聚合物陶瓷层10的维氏硬度为500N-750N。具体的,聚合物陶瓷层10的四点抗弯强度可以但不限于为400N、450N、500N、600N、650N、700N或750N等。In this application, the four-point bending strength of the polymer ceramic layer 10 is detected by adopting the GB/T 6569-2006 standard. In the embodiment of the present application, the four-point bending strength of the polymer ceramic layer 10 is greater than or equal to 400N. Further, the four-point bending strength of the polymer ceramic layer 10 is 400N-800N. Furthermore, the Vickers hardness of the polymer ceramic layer 10 is 500N-750N. Specifically, the four-point bending strength of the polymer ceramic layer 10 may be, but not limited to, 400N, 450N, 500N, 600N, 650N, 700N or 750N.

在本申请中,将聚合物陶瓷层10置于挤压夹具上,用直径10mm的球形抗压压头的顶端对准聚合物陶瓷层10的中间位置,以压缩速度为5mm/min对聚合物陶瓷层10进行施压,直到聚合物陶瓷层10推破为止,记录此时的压力峰值即为挤压力。在本申请实施方式中,聚合物陶瓷层10的挤压力大于或等于500N。进一步的,聚合物陶瓷层10的挤压力为500N-700N。更进一步的,聚合物陶瓷层10的挤压力为550N-650N。具体的,聚合物陶瓷层10的挤压力可以但不限于为500N、550N、570N、600N、650N、680N或700N等。In this application, the polymer ceramic layer 10 is placed on the extrusion fixture, and the top of the spherical anti-compression head with a diameter of 10 mm is aligned with the middle position of the polymer ceramic layer 10, and the polymer ceramic layer 10 is pressed at a compression speed of 5 mm/min. The ceramic layer 10 is pressed until the polymer ceramic layer 10 is broken, and the peak pressure at this time is recorded as the extrusion force. In the embodiment of the present application, the extrusion force of the polymer ceramic layer 10 is greater than or equal to 500N. Further, the extrusion force of the polymer ceramic layer 10 is 500N-700N. Furthermore, the extrusion force of the polymer ceramic layer 10 is 550N-650N. Specifically, the extrusion force of the polymer ceramic layer 10 may be, but not limited to, 500N, 550N, 570N, 600N, 650N, 680N or 700N.

在本申请实施方式中,聚合物陶瓷层10还可以具有着色剂,从而使得壳体100具有不同的颜色外观,改善视觉效果。具体的,着色剂可以但不限于为分别选自炭黑、氧化铁、氧化钴、氧化铈、氧化镍、氧化铋、氧化锌、氧化锰、氧化铬、氧化铜、氧化钒和氧化锡中的至少一种。在一实施例中,聚合物陶瓷层10中着色剂的质量含量小于或等于15%,从而既能够改善聚合物陶瓷层10的颜色,同时又不会影响陶瓷颗粒的含量。进一步的,聚合物陶瓷层10中着色剂的质量含量为0.5%-10%。In the embodiment of the present application, the polymer ceramic layer 10 may also have a colorant, so that the casing 100 has different color appearances and improves the visual effect. Specifically, the coloring agent can be but not limited to be selected from carbon black, iron oxide, cobalt oxide, cerium oxide, nickel oxide, bismuth oxide, zinc oxide, manganese oxide, chromium oxide, copper oxide, vanadium oxide and tin oxide at least one. In one embodiment, the mass content of the colorant in the polymer ceramic layer 10 is less than or equal to 15%, so as to improve the color of the polymer ceramic layer 10 without affecting the content of ceramic particles. Further, the mass content of the colorant in the polymer ceramic layer 10 is 0.5%-10%.

请参阅图5,为本申请另一实施方式提供的壳体的结构示意图,壳体100还可以包括保护层20,保护层20设置在聚合物陶瓷层10的表面。壳体100在使用过程中具有相对设置的内表面和外表面,保护层20位于外表面一侧,从而在壳体100的使用中起到保护作用。具体的,保护层20可以但不限于为抗指纹层、硬化层等。具体的,保护层20的厚度可以但不限于为0.5μm-3μm。在一实施例中,保护层20包括抗指纹层。可选的,抗指纹层的接触角大于105°。接触角是衡量液体对材料表面润湿性能的重要参数,抗指纹层的接触角大于105°,表明液体很容易在抗指纹层上移动,从而避免对其表面的污染,具有优异的抗指纹的性能。可选的,抗指纹层包括含氟化合物。具体的,含氟化合物可以但不限于为氟硅聚合物、全氟聚醚、含氟丙烯酸酯等。进一步的,抗指纹层还包括二氧化硅,通过添加二氧化硅进一步提升抗指纹层的耐摩擦性能。在另一实施例中,保护层20包括硬化层。通过设置硬化层进一步提升壳体100的表面硬度和抗划伤能力。可选的,硬化层的材质包括石墨、氧化铝、氧化锆、氧化硅、氮化铬和氮化钛中的至少一种。Please refer to FIG. 5 , which is a schematic structural diagram of a housing provided in another embodiment of the present application. The housing 100 may further include a protective layer 20 disposed on the surface of the polymer ceramic layer 10 . The casing 100 has an inner surface and an outer surface oppositely disposed during use, and the protective layer 20 is located on one side of the outer surface, so as to play a protective role in the use of the casing 100 . Specifically, the protective layer 20 may be, but not limited to, an anti-fingerprint layer, a hardened layer, and the like. Specifically, the thickness of the protection layer 20 may be, but not limited to, 0.5 μm-3 μm. In one embodiment, the protection layer 20 includes an anti-fingerprint layer. Optionally, the contact angle of the anti-fingerprint layer is greater than 105°. The contact angle is an important parameter to measure the wettability of the liquid on the surface of the material. The contact angle of the anti-fingerprint layer is greater than 105°, indicating that the liquid is easy to move on the anti-fingerprint layer, thereby avoiding pollution to its surface, and has excellent anti-fingerprint properties. performance. Optionally, the anti-fingerprint layer includes fluorine-containing compounds. Specifically, the fluorine-containing compound may be, but not limited to, fluorosilicon polymer, perfluoropolyether, fluorine-containing acrylate, and the like. Further, the anti-fingerprint layer also includes silicon dioxide, and the friction resistance of the anti-fingerprint layer is further improved by adding silicon dioxide. In another embodiment, the protective layer 20 includes a hardened layer. The surface hardness and scratch resistance of the casing 100 are further improved by providing a hardened layer. Optionally, the material of the hardened layer includes at least one of graphite, aluminum oxide, zirconium oxide, silicon oxide, chromium nitride and titanium nitride.

在本申请中,壳体100的厚度可以根据其应用场景的需要进行选择,对此不作限定;在一实施方式中,壳体100可以作为电子设备200的外壳、中框、装饰件等,如作为手机、平板电脑、笔记本电脑、手表、MP3、MP4、GPS导航仪、数码相机的外壳等。本申请实施方式中的壳体100可以为2D结构、2.5D结构、3D结构等,具体可以根据需要进行选择。在一实施例中,壳体100作为手机后盖使用时,壳体100的厚度为0.5mm-1.2mm。具体的,壳体100的厚度可以但不限于为0.6mm、0.7mm、0.8mm、0.9mm、1mm、1.1mm或1.2mm。在另一实施例中,壳体100作为手机后盖使用时,壳体100包括主体部和设置在主体部边缘的延伸部,延伸部向主体部弯折;此时壳体100呈曲面状。In this application, the thickness of the housing 100 can be selected according to the needs of its application scenarios, which is not limited; in one embodiment, the housing 100 can be used as the shell, middle frame, decoration, etc. of the electronic device 200, such as As the casing of mobile phones, tablet computers, notebook computers, watches, MP3, MP4, GPS navigators, digital cameras, etc. The casing 100 in the embodiment of the present application may have a 2D structure, a 2.5D structure, a 3D structure, etc., which may be selected according to needs. In an embodiment, when the casing 100 is used as a mobile phone back cover, the thickness of the casing 100 is 0.5mm-1.2mm. Specifically, the thickness of the housing 100 may be, but not limited to, 0.6mm, 0.7mm, 0.8mm, 0.9mm, 1mm, 1.1mm or 1.2mm. In another embodiment, when the case 100 is used as the back cover of a mobile phone, the case 100 includes a main body and an extension portion disposed on the edge of the main body, and the extension is bent toward the main body; at this time, the case 100 is curved.

在本申请实施方式中,壳体100的表面粗糙度小于0.1μm。通过提供表面粗糙度小的壳体100,进而有利于增强其陶瓷质感,提升视觉效果。进一步的,壳体100的表面粗糙度为0.02μm-0.08μm。在本申请实施方式中,壳体100的密度小于或等于2.6g/cm3。进一步的,壳体100的密度为2.3g/cm3-2.6g/cm3。本申请提供的壳体100密度小,有利于满足轻薄化的发展需求。In the embodiment of the present application, the surface roughness of the casing 100 is less than 0.1 μm. By providing the casing 100 with a small surface roughness, it is beneficial to enhance its ceramic texture and enhance the visual effect. Further, the surface roughness of the casing 100 is 0.02 μm-0.08 μm. In the embodiment of the present application, the density of the housing 100 is less than or equal to 2.6 g/cm 3 . Further, the density of the casing 100 is 2.3g/cm 3 -2.6g/cm 3 . The casing 100 provided by the present application has a low density, which is beneficial to meet the development demand of lightness and thinness.

以下通过具体实施例及对比例对本申请实施提供的壳体的制备方法以及制得壳体的性能做进一步的说明。The preparation method of the casing provided by the implementation of the present application and the performance of the obtained casing will be further described below through specific examples and comparative examples.

实施例1Example 1

一种壳体的制备方法,包括:A method for preparing a casing, comprising:

将粒径为100nm-150nm的球形氧化锌、粒径为100-200nm的球形氧化铝按质量比10:1进行混合;将20kg复合陶瓷颗粒、占复合陶瓷颗粒质量1%的硅烷偶联剂、占复合陶瓷颗粒质量0.5%的聚乙烯醇以及占复合陶瓷颗粒质量2%的炭黑混合得到混合材料;混合材料中加入水和氧化铝研磨珠,其中混合材料、水和球磨珠质量比为1:2:0.5,并置于球磨罐中球磨分散48h,得到混合浆料。混合浆料进行喷雾干燥造粒制得处理后的陶瓷颗粒,其中,进料温度为80℃,进风温度为150℃,排风温度为80℃,塔内温度为85℃,塔内负压为100pa。将处理后的陶瓷颗粒与聚合物按质量比8:2进行混合形成混合物,聚合物包括聚苯硫醚和聚亚苯基砜;将混合物置于共混挤出机中,共混3次,然后挤出造粒获得注塑喂料。将注塑喂料在120℃烘干12h,随后加入注射机中进行注射成型;成型温度为345℃,注射速度为90%,注射压力为200MPa,模具温度为145℃,保压时间为30s,制得聚合物陶瓷坯体。Spherical zinc oxide with a particle size of 100nm-150nm and spherical alumina with a particle size of 100-200nm are mixed at a mass ratio of 10:1; 20kg of composite ceramic particles, silane coupling agent accounting for 1% of the mass of the composite ceramic particles, The polyvinyl alcohol accounting for 0.5% of the mass of the composite ceramic particles and the carbon black accounting for 2% of the mass of the composite ceramic particles are mixed to obtain a mixed material; water and alumina grinding beads are added to the mixed material, wherein the mass ratio of the mixed material, water and ball milling beads is 1 :2:0.5, and placed in a ball mill tank for ball milling and dispersion for 48 hours to obtain a mixed slurry. The mixed slurry is spray-dried and granulated to obtain the treated ceramic particles, wherein the feed temperature is 80°C, the inlet air temperature is 150°C, the exhaust air temperature is 80°C, the temperature inside the tower is 85°C, and the negative pressure inside the tower is is 100pa. Mix the treated ceramic particles with the polymer at a mass ratio of 8:2 to form a mixture, and the polymer includes polyphenylene sulfide and polyphenylene sulfone; the mixture is placed in a blending extruder and blended 3 times, It is then extruded and pelletized to obtain injection molding feed. The injection molding feed was dried at 120°C for 12 hours, and then injected into the injection machine for injection molding; the molding temperature was 345°C, the injection speed was 90%, the injection pressure was 200MPa, the mold temperature was 145°C, and the holding time was 30s. A polymer ceramic body is obtained.

将三聚氰胺和锌按质量比6:4进行混合,并加入乙醇、硬脂酸铵和聚乙烯醇,经搅拌6h获得前处理液,其中前处理液中促进剂的质量含量为40%,乙醇的质量含量为55%,硬脂酸铵的质量含量为1%,聚乙烯醇的质量含量为1%。将前处理液采用涂覆的方式均匀涂覆在聚合物陶瓷坯体上,并于80℃烘干,形成前处理层,得到复合坯体。Mix melamine and zinc in a mass ratio of 6:4, add ethanol, ammonium stearate and polyvinyl alcohol, and stir for 6 hours to obtain a pretreatment liquid, wherein the mass content of the accelerator in the pretreatment liquid is 40%, and the amount of ethanol The mass content is 55%, the mass content of ammonium stearate is 1%, and the mass content of polyvinyl alcohol is 1%. The pretreatment liquid is evenly coated on the polymer ceramic body by means of coating, and dried at 80° C. to form a pretreatment layer to obtain a composite body.

将复合坯体放于治具中,随后一起放入烘箱中以下曲线进行热处理:室温1h升温到250℃,在250℃保温1h;1h从250℃升温至330℃,在330℃保温2h,随后自然降温制得第一坯体。将第一坯体放于热压烧结炉中进行热压,其中热压温度为360℃,保温时间为4h,热压压力为40MPa,热压气氛为氮气,热压完成后自然降温制得第二坯体。Put the composite green body in the jig, and then put them together in the oven for heat treatment according to the following curve: room temperature rises to 250°C for 1h, keeps at 250°C for 1h; heats up from 250°C to 330°C for 1h, keeps at 330°C for 2h, then The first green body was obtained by natural cooling. Put the first green body in a hot-pressing sintering furnace for hot-pressing. The hot-pressing temperature is 360°C, the holding time is 4h, the hot-pressing pressure is 40MPa, and the hot-pressing atmosphere is nitrogen. After the hot-pressing is completed, the temperature is naturally lowered to obtain the first Two body.

将第二坯体按产品图纸进行CNC加工,CNC加工选用PCD铣刀,主轴转速为22000rpm,单次切削量为50μm;而后在用扫光机进行粗抛,抛光盘为猪毛配合磨皮复合材料,粗抛抛光液为水系钻石抛光液,粗抛抛光液中钻石微粉的粒度为2μm,粗抛抛光液的浓度10wt%;粗抛后采用扫光机进行精抛,精抛抛光液中氧化硅的粒度为200nm,精抛抛光液的浓度40wt%,从而去除前处理层,得到聚合物陶瓷层,制得壳体。Carry out CNC machining on the second green body according to the product drawings. PCD milling cutter is used for CNC machining, the spindle speed is 22000rpm, and the single cutting amount is 50μm; then rough polishing is carried out with a sweeping machine, and the polishing disc is made of pig hair combined with microdermabrasion Material, rough polishing liquid is water system diamond polishing liquid, the particle size of diamond micropowder in the rough polishing liquid is 2 μm, the concentration of rough polishing liquid is 10wt%; The particle size of the silicon is 200nm, and the concentration of the fine polishing liquid is 40wt%, so that the pretreatment layer is removed, a polymer ceramic layer is obtained, and the casing is obtained.

实施例2Example 2

与实施例1大致相同,不同之处在于,在制得聚合物陶瓷层后,采用蒸发镀膜的方式在聚合物陶瓷层表面镀一层硬化层,硬化层的材质为氧化铝,硬化层的厚度为1μm,然后在硬化层的表面镀抗指纹层,制得壳体。Roughly the same as Example 1, the difference is that after the polymer ceramic layer is prepared, a hardened layer is coated on the surface of the polymer ceramic layer by evaporation coating, the material of the hardened layer is alumina, and the thickness of the hardened layer is 1 μm, and then plate an anti-fingerprint layer on the surface of the hardened layer to make a shell.

对比例1Comparative example 1

一种氧化锆陶瓷壳体,通过氧化锆陶瓷坯体烧结而成。A zirconia ceramic shell is formed by sintering a zirconia ceramic green body.

对比例2Comparative example 2

根据专利CN108483991A中实施例1所示的方法制备壳体。The casing is prepared according to the method shown in Example 1 of the patent CN108483991A.

对比例3Comparative example 3

与实施例1大致相同,不同之处在于,不进行前处理液的喷涂,聚合物陶瓷坯体直接进行热处理。It is roughly the same as in Example 1, except that the polymer ceramic body is directly heat-treated without spraying the pretreatment liquid.

对比例4Comparative example 4

与对比例3大致相同,不同之处在于,热处理过程包括室温1h升温到250℃,在250℃保温24h;1h从250℃升温至330℃,在330℃保温24h。Roughly the same as Comparative Example 3, the difference is that the heat treatment process includes heating from room temperature to 250°C for 1 hour, holding at 250°C for 24 hours; heating from 250°C to 330°C for 1 hour, and holding at 330°C for 24 hours.

性能检测Performance testing

根据说明书中记载的检测方法,对实施例和对比例制得的壳体进行铅笔硬度、维氏硬度、落球高度、四点抗弯强度、挤压力以及密度的测试,结果如表1所示,其中每项测试中实施例和对比例制得的壳体的厚度保持一致。According to the detection method recorded in the description, the casings prepared in the examples and comparative examples were tested for pencil hardness, Vickers hardness, falling ball height, four-point bending strength, extrusion force and density, and the results are shown in Table 1 , wherein the thicknesses of the shells made in the examples and the comparative examples in each test are consistent.

表1性能检测结果Table 1 performance test results

Figure BDA0003205538880000151
Figure BDA0003205538880000151

本申请实施例提供壳体的铅笔硬度和维氏硬度高,具有优异的抗划伤能力,同时落球高度高、四点抗弯强度大,挤压力强,具有优异的韧性和强度,并且整体密度低。相比于对比例1,本申请实施例提供的壳体整体韧性提升,密度降低;相比于对比例2-4,本申请实施例提供的壳体表面硬度、整体强度得到大幅度提高,更有利于其应用。The embodiments of the present application provide a casing with high pencil hardness and Vickers hardness, excellent scratch resistance, high ball drop height, high four-point bending strength, strong extrusion force, excellent toughness and strength, and overall low density. Compared with Comparative Example 1, the overall toughness of the shell provided by the embodiment of the present application is improved, and the density is reduced; compared with Comparative Examples 2-4, the surface hardness and overall strength of the shell provided by the embodiment of the present application are greatly improved, and it is more conducive to its application.

本申请还提供了一种电子设备200,包括上述任一实施方式中的壳体100。可以理解的,电子设备200可以但不限于为手机、平板电脑、笔记本电脑、手表、MP3、MP4、GPS导航仪、数码相机等。请参阅图6,为本申请一实施方式提供的电子设备的结构示意图,其中,电子设备200包括壳体100。该壳体100可以提升电子设备200的强度和表面硬度,并且电子设备200具有陶瓷质感的外观,具有优异的产品竞争力。请参阅图7,为本申请一实施方式提供的电子设备的结构组成示意图,电子设备200的结构可以包括RF电路210、存储器220、输入单元230、显示单元240、传感器250、音频电路260、WiFi模块270、处理器280以及电源290等。其中,RF电路210、存储器220、输入单元230、显示单元240、传感器250、音频电路260、WiFi模块270分别与处理器280连接;电源290用于为整个电子设备200提供电能。具体而言,RF电路210用于接发信号;存储器220用于存储数据指令信息;输入单元230用于输入信息,具体可以包括触控面板以及操作按键等其他输入设备;显示单元240可以包括显示屏等;传感器250包括红外传感器、激光传感器等,用于检测用户接近信号、距离信号等;扬声器261以及传声器262通过音频电路260与处理器280连接,用于接发声音信号;WiFi模块270则用于接收和发射WiFi信号;处理器280用于处理电子设备200的数据信息。The present application also provides an electronic device 200, including the casing 100 in any one of the above-mentioned implementation manners. It can be understood that the electronic device 200 may be, but not limited to, a mobile phone, a tablet computer, a notebook computer, a watch, an MP3, an MP4, a GPS navigator, a digital camera, and the like. Please refer to FIG. 6 , which is a schematic structural diagram of an electronic device provided in an embodiment of the present application, wherein the electronic device 200 includes a casing 100 . The casing 100 can improve the strength and surface hardness of the electronic device 200, and the electronic device 200 has a ceramic texture appearance, which has excellent product competitiveness. Please refer to FIG. 7, which is a schematic diagram of the structure and composition of an electronic device provided in an embodiment of the present application. The structure of the electronic device 200 may include an RF circuit 210, a memory 220, an input unit 230, a display unit 240, a sensor 250, an audio circuit 260, a WiFi Module 270, processor 280, power supply 290 and so on. Wherein, RF circuit 210 , memory 220 , input unit 230 , display unit 240 , sensor 250 , audio circuit 260 , and WiFi module 270 are respectively connected to processor 280 ; power supply 290 is used to provide electric energy for the entire electronic device 200 . Specifically, the RF circuit 210 is used for sending and receiving signals; the memory 220 is used for storing data instruction information; the input unit 230 is used for inputting information, and may specifically include other input devices such as a touch panel and operation buttons; the display unit 240 may include a display screen, etc.; sensor 250 includes an infrared sensor, a laser sensor, etc., and is used to detect user approach signals, distance signals, etc.; speaker 261 and microphone 262 are connected to processor 280 through audio circuit 260, and are used to receive and send sound signals; WiFi module 270 It is used to receive and transmit WiFi signals; the processor 280 is used to process data information of the electronic device 200 .

以上对本申请实施方式所提供的内容进行了详细介绍,并对本申请的原理及实施方式进行了阐述与说明,但以上说明只是用于帮助理解本申请的方法及其核心思想;同时,对于本领域的一般技术人员,依据本申请的思想,在具体实施方式及应用范围上均会有改变之处。综上所述,本说明书内容不应理解为对本申请的限制。The content provided by the embodiment of the application has been introduced in detail above, and the principle and implementation of the application have been elaborated and explained, but the above description is only used to help understand the method of the application and its core idea; at the same time, for this field Those of ordinary skill in the art will have changes in specific implementation methods and application scopes based on the ideas of the present application. To sum up, the contents of this specification should not be understood as limiting the application.

Claims (13)

1.一种壳体的制备方法,其特征在于,包括:1. A preparation method for a shell, characterized in that, comprising: 将聚合物陶瓷坯体涂覆和/或浸泡前处理液,经干燥后在所述聚合物陶瓷坯体表面形成前处理层,得到复合坯体,其中,所述聚合物陶瓷坯体包括聚合物,所述前处理液包括能够促进所述聚合物交联的促进剂;Coating and/or immersing the polymer ceramic body in a pretreatment liquid, forming a pretreatment layer on the surface of the polymer ceramic body after drying, to obtain a composite body, wherein the polymer ceramic body includes polymer , the pretreatment liquid includes an accelerator capable of promoting crosslinking of the polymer; 所述复合坯体经过热处理和热压后,再去除所述前处理层,得到聚合物陶瓷层,制得壳体。After the composite green body is heat-treated and hot-pressed, the pre-treatment layer is removed to obtain a polymer ceramic layer and a casing. 2.如权利要求1所述的制备方法,其特征在于,所述前处理液中所述促进剂的质量含量为10%-50%。2. The preparation method according to claim 1, characterized in that, the mass content of the accelerator in the pretreatment liquid is 10%-50%. 3.如权利要求1所述的制备方法,其特征在于,所述促进剂包括有机促进剂和金属促进剂中的至少一种;3. preparation method as claimed in claim 1, is characterized in that, described accelerator comprises at least one in organic accelerator and metal accelerator; 所述有机促进剂包括三聚氰胺、六甲氧甲基三聚氰胺、三羟基苯、季戊四醇三烯丙基醚、苯酚和受阻酚类中的至少一种,所述金属促进剂包括银、铜、铁、铅、锌和镁中的至少一种。The organic accelerator includes at least one of melamine, hexamethoxymethyl melamine, trihydroxybenzene, pentaerythritol triallyl ether, phenol and hindered phenols, and the metal accelerator includes silver, copper, iron, lead, at least one of zinc and magnesium. 4.如权利要求3所述的制备方法,其特征在于,所述促进剂中所述有机促进剂和所述金属促进剂的质量比为1.2-4。4. The preparation method according to claim 3, characterized in that, the mass ratio of the organic accelerator and the metal accelerator in the accelerator is 1.2-4. 5.如权利要求1所述的制备方法,其特征在于,所述前处理液还包括分散剂、粘结剂和溶剂,所述前处理液中所述分散剂的质量含量为0.5%-5%,所述粘结剂的质量含量为1%-5%,所述溶剂的质量含量为50%-80%;5. preparation method as claimed in claim 1 is characterized in that, described pretreatment liquid also comprises dispersant, binding agent and solvent, and the mass content of described dispersant in described pretreatment liquid is 0.5%-5% %, the mass content of the binder is 1%-5%, and the mass content of the solvent is 50%-80%; 所述分散剂包括硅烷偶联剂、硬脂酸、硬脂酸铵和聚乙二醇中的至少一种,所述粘结剂包括聚乙烯醇、聚乙烯醇缩丁醛酯、聚乙二醇和丙烯酸树脂中的至少一种,所述溶剂包括水、乙醇和丙酮中的至少一种。The dispersant includes at least one of silane coupling agent, stearic acid, ammonium stearate and polyethylene glycol, and the binder includes polyvinyl alcohol, polyvinyl butyral ester, polyethylene glycol At least one of alcohol and acrylic resin, the solvent includes at least one of water, ethanol and acetone. 6.如权利要求1所述的制备方法,其特征在于,所述热处理的时间小于或等于12h。6. The preparation method according to claim 1, characterized in that, the time of the heat treatment is less than or equal to 12h. 7.如权利要求6所述的制备方法,其特征在于,所述热处理包括在0.5h-1h内从15℃-40℃升温至220℃-280℃后保温0.5h-2h,再在0.5h-1h内从220℃-280℃升温至300℃-380℃后保温0.5h-4h;所述热处理的温度大于所述聚合物的熔融温度且小于所述聚合物的分解温度。7. The preparation method according to claim 6, characterized in that, the heat treatment includes heating from 15°C-40°C to 220°C-280°C within 0.5h-1h and then keeping it warm for 0.5h-2h, and then -Raising the temperature from 220°C-280°C to 300°C-380°C within 1 hour and then keeping it warm for 0.5h-4h; the temperature of the heat treatment is higher than the melting temperature of the polymer and lower than the decomposition temperature of the polymer. 8.如权利要求1所述的制备方法,其特征在于,所述涂覆和/或浸泡包括在15℃-40℃下处理1h-2h,所述干燥的温度为80℃-100℃,所述前处理层的厚度为10μm-100μm。8. The preparation method according to claim 1, characterized in that, the coating and/or soaking includes treatment at 15°C-40°C for 1h-2h, the drying temperature is 80°C-100°C, the The thickness of the pretreatment layer is 10 μm-100 μm. 9.如权利要求1所述的制备方法,其特征在于,所述热压包括在20MPa-80MPa、300℃-400℃下处理2h-12h,所述热压的温度大于所述聚合物的玻璃化转变温度且小于所述聚合物的分解温度。9. The preparation method according to claim 1, characterized in that, the hot pressing includes treating at 20MPa-80MPa, 300°C-400°C for 2h-12h, and the temperature of the hot pressing is higher than that of the polymer glass transition temperature and less than the decomposition temperature of the polymer. 10.如权利要求1所述的制备方法,其特征在于,所述聚合物陶瓷坯体的制备,包括:10. The preparation method according to claim 1, wherein the preparation of the polymer ceramic body comprises: 陶瓷颗粒与所述聚合物混合后,经造粒得到注塑喂料;After the ceramic particles are mixed with the polymer, the injection molding feed is obtained through granulation; 所述注塑喂料经注塑得到聚合物陶瓷坯体。The injection molding feed is injected to obtain a polymer ceramic green body. 11.一种壳体,其特征在于,通过权利要求1-10任一项所述的制备方法制得,所述壳体包括聚合物陶瓷层。11. A housing, characterized in that it is manufactured by the preparation method according to any one of claims 1-10, and the housing comprises a polymer ceramic layer. 12.如权利要求11所述的壳体,其特征在于,所述聚合物陶瓷层中,所述聚合物交联形成网状结构,所述陶瓷颗粒分散在所述网状结构中;12. The casing according to claim 11, wherein in the polymer ceramic layer, the polymer is cross-linked to form a network structure, and the ceramic particles are dispersed in the network structure; 所述聚合物陶瓷层包括陶瓷颗粒和聚合物,所述陶瓷颗粒包括氧化锌、氧化锆、氧化铝、二氧化硅、氧化钛和碳化硅中的至少一种,所述陶瓷颗粒的直径为20nm-1μm,所述聚合物包括聚苯硫醚、聚亚苯基砜、聚酰胺和乙烯-醋酸乙烯共聚物中的至少一种。The polymer ceramic layer includes ceramic particles and polymers, the ceramic particles include at least one of zinc oxide, zirconium oxide, aluminum oxide, silicon dioxide, titanium oxide and silicon carbide, and the diameter of the ceramic particles is 20nm -1 μm, the polymer includes at least one of polyphenylene sulfide, polyphenylene sulfone, polyamide and ethylene-vinyl acetate copolymer. 13.一种电子设备,其特征在于,包括权利要求11-12任一项所述的壳体。13. An electronic device, comprising the casing according to any one of claims 11-12.
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