CN113681180A - High-precision laser drilling system applied to carrier tape - Google Patents
High-precision laser drilling system applied to carrier tape Download PDFInfo
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- CN113681180A CN113681180A CN202110793562.6A CN202110793562A CN113681180A CN 113681180 A CN113681180 A CN 113681180A CN 202110793562 A CN202110793562 A CN 202110793562A CN 113681180 A CN113681180 A CN 113681180A
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- carrier tape
- rewinding
- support frame
- laser
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- 238000005553 drilling Methods 0.000 title claims abstract description 27
- 238000004080 punching Methods 0.000 claims description 20
- 230000006698 induction Effects 0.000 claims description 11
- 230000003993 interaction Effects 0.000 claims description 8
- 230000008878 coupling Effects 0.000 claims description 2
- 238000010168 coupling process Methods 0.000 claims description 2
- 238000005859 coupling reaction Methods 0.000 claims description 2
- 238000005096 rolling process Methods 0.000 description 12
- 238000002955 isolation Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 7
- 230000008569 process Effects 0.000 description 6
- 238000001514 detection method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000012423 maintenance Methods 0.000 description 4
- 238000004804 winding Methods 0.000 description 3
- 230000002457 bidirectional effect Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 101100456571 Mus musculus Med12 gene Proteins 0.000 description 1
- 241000053227 Themus Species 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 238000004100 electronic packaging Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000010408 sweeping Methods 0.000 description 1
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
- B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
- B23K26/703—Cooling arrangements
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses a high-precision laser drilling system applied to a carrier tape, which belongs to the technical field of high-speed drilling of carrier tapes and comprises an underframe, wherein one side of the top end of the underframe is connected with a computer control module through a support frame, one side of the top end of the underframe, which is positioned close to the computer control module, is connected with a coil stretcher module, one side of the top end of the underframe, which is positioned far away from the computer control module, is connected with a rewinder module, a carrier tape is movably connected between the rewinder module and the coil stretcher module, and one side of the middle position of the top end of the underframe, which is positioned at one side of the carrier tape, is connected with a first support frame; according to the invention, a 2-micron nanosecond pulse laser drilling mode is introduced into carrier tape drilling, compared with a traditional mechanical drilling mode, the 2-micron nanosecond pulse laser drilling mode has the advantages of high precision which can reach 0.001mm, no consumption part, high efficiency, no need of manual die replacement and high automation and intelligence degree.
Description
Technical Field
The invention belongs to the technical field of high-speed punching of carrier bands, and particularly relates to a high-precision laser punching system applied to carrier bands.
Background
The carrier tape is a strip product applied to the field of electronic packaging, has a specific thickness, and is provided with cavities for holding electronic components and positioning for index positioning at equal intervals in the length direction.
The most predominant mode of preparation carrier band pocket or die cavity is to adopt machinery to punch and laser beam perforation two kinds of modes, the change that need not stop among the mechanical punching process punches the mould, degree of automation and intellectuality are low, and laser beam perforation generally adopts CO2 laser system, pulse type CO2 laser is generally the mus, use and can appear the hole edge yellow or punch and directly not appear falling "trapezoidal" scheduling problem in the paper punching process, in addition, CO2 laser photoelectric conversion is low, the energy consumption is bigger, and need often take a breath, the maintenance cost is high, the outer light path is complicated, the installation, the debugging is big with the maintenance degree of difficulty.
Disclosure of Invention
To solve the problems set forth in the background art described above. The invention provides a high-precision laser drilling system applied to a carrier tape, which has the characteristics of high efficiency, no need of manual replacement of a die, high automation and intelligence, capability of effectively avoiding the angle deviation of a square hole from a circle or an inverted triangle, simple structure, good light beam quality, easiness in integration, easiness in operation and no maintenance.
In order to achieve the purpose, the invention provides the following technical scheme: the high-precision laser drilling system applied to the carrier tape comprises a chassis, wherein one side of the top end of the chassis is connected with a computer control module through a support frame, one side, close to the computer control module, of the top end of the chassis is connected with a roll pulling module, one side, far away from the computer control module, of the top end of the chassis is connected with a rewinding machine module, the carrier tape is movably connected between the rewinding machine module and the roll pulling module, a first support frame is connected to one side, located at the middle position of the top end of the chassis, of the carrier tape, a laser drilling module is assembled on the first support frame, a second support frame is connected to the other side, located at the top end of the chassis, of the carrier tape, of the second support frame, a machine vision module is assembled on the second support frame, and the roll pulling module, the laser drilling module, the machine vision module, The machine vision module and the rewinding machine module are respectively electrically connected with the computer control module.
Further, the computer control module comprises a computer shell, the computer shell is connected with the bottom frame, an FPGA controller and a human-computer interaction device are respectively embedded in the computer shell, an output port of the human-computer interaction device is connected with the FPGA controller, and the FPGA controller is electrically connected with the machine vision module in a bidirectional mode.
The invention further discloses a rolling machine module, which comprises a rolling machine shell, wherein the rolling machine shell is connected with a chassis, a straight servo motor is assembled on the outer side wall of the rolling machine shell, the straight servo motor is electrically connected with an FPGA (field programmable gate array) controller, a rolling roller is arranged inside the rolling machine shell, the rolling roller is in limit connection with a carrier band, two ends of the rolling roller are connected with rolling shafts, one end of each rolling shaft is connected with the rolling machine shell through a bearing, and the other end of each rolling shaft is connected with the straight servo motor through a coupler.
Further, the laser punching module comprises a micron nanosecond pulse laser, a collimation isolation output head, a beam expander and a high-speed vibration mirror, the micron nanosecond pulse laser, the collimation isolation output head, the beam expander and the high-speed vibration mirror are all connected with a first support frame, the collimation isolation output head and the beam expander are located at a laser beam outlet of the micron nanosecond pulse laser, the high-speed vibration mirror is located below the collimation isolation output head and the beam expander, the high-speed vibration mirror is located above the carrier belt, and the micron nanosecond pulse laser and the high-speed vibration mirror are connected with the FPGA controller.
The rewinding machine module further comprises a rewinding machine shell, the rewinding machine shell is connected with the bottom frame, an induction motor is assembled on the outer side wall of the rewinding machine shell, the induction motor is electrically connected with the FPGA controller, a rewinding roller is arranged inside the rewinding machine shell and is in limit connection with the carrier tape, rewinding shafts are connected to two ends of the rewinding roller, one end of each rewinding shaft is connected with the rewinding machine shell through a bearing, and the other end of each rewinding shaft is connected with the induction motor through a coupler.
Further, the FPGA controller and the micron nanosecond pulse laser are both provided with air-cooled radiators.
Compared with the prior art, the invention has the beneficial effects that:
1. according to the invention, a 2-micron nanosecond pulse laser drilling mode is introduced into carrier tape drilling, compared with a traditional mechanical drilling mode, the 2-micron nanosecond pulse laser drilling mode has the advantages of high precision which can reach 0.001mm, no consumption part, high efficiency, no need of manual die replacement and high automation and intelligence degree.
2. Compared with the traditional CO2 laser paper bag punching mode, the method has the advantages that the heat affected zone is small, the power density is high, the peak power is high, the acting time is short, and the square hole angle is prevented from deviating from a circle or an inverted triangle.
3. The photoelectric conversion rate of the 2-micron nanosecond pulse laser can reach more than 20%, and the 2-micron nanosecond pulse laser is more energy-saving compared with the traditional CO2 laser, has the characteristics of simple structure, good beam quality, easiness in integration, easiness in operation, no maintenance and the like, and is more suitable for high-precision punching of carrier tapes.
Drawings
FIG. 1 is a schematic perspective view of the present invention;
FIG. 2 is a block diagram of a refinement module of the computer control module of the present invention;
FIG. 3 is a block diagram of a refinement module of the coil puller module of the present invention;
FIG. 4 is a block diagram of a detailed module of the laser drilling module of the present invention;
fig. 5 is a detailed block diagram of the rewinder module of the present invention;
FIG. 6 is a flow chart of the system control of the present invention;
in the figure: 1. a computer control module; 11. an FPGA controller; 12. a human-computer interaction device; 13. a computer housing; 2. a lapper module; 21. pulling the roll casing; 22. a direct servo motor; 23. pulling the reel; 24. a drawing roller; 3. carrying a belt; 4. a laser drilling module; 41. 2 μm nanosecond pulsed laser; 42. the output head and the beam expanding lens are isolated in a collimation way; 43. a high-speed galvanometer; 5. a first support frame; 6. a second support frame; 7. a machine vision module; 8. a rewinder module; 81. rewinding machine shells; 82. an induction motor; 83. rewinding shafts; 84. rewinding rollers; 9. a chassis; 10. an air-cooled radiator.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-6, the present invention provides the following technical solutions: a high-precision laser punching system applied to a carrier tape comprises a chassis 9, one side of the top end of the chassis 9 is connected with a computer control module 1 through a support frame, one side, close to the computer control module 1, of the top end of the chassis 9 is connected with a coil drawing machine module 2, one side, far away from the computer control module 1, of the top end of the chassis 9 is connected with a rewinding machine module 8, a carrier tape 3 is movably connected between the rewinding machine module 8 and the coil drawing machine module 2, a first support frame 5 is connected to the middle position of the top end of the chassis 9 and located on one side of the carrier tape 3, a laser punching module 4 is assembled on the first support frame 5, a second support frame 6 is connected to the top end of the chassis 9 and located on the other side of the carrier tape 3, the second support frame 6 is located on one side, close to the rewinding machine module 8, a machine vision module 7 is assembled on the second support frame 6, and a coil drawing machine module 2, The laser drilling module 4, the machine vision module 7 and the rewinder module 8 are respectively electrically connected with the computer control module 1.
Specifically, the computer control module 1 comprises a computer housing 13, the computer housing 13 is connected with the bottom frame 9, the FPGA controller 11 and the human-computer interaction device 12 are respectively embedded in the computer housing 13, an output port of the human-computer interaction device 12 is connected with the FPGA controller 11, and the FPGA controller 11 is electrically connected with the machine vision module 7 in a bidirectional mode.
Specifically, draw a roll machine module 2 including drawing a roll casing 21, draw a roll casing 21 and be connected with chassis 9, the lateral wall that draws a roll casing 21 is equipped with straight servo motor 22, straight servo motor 22 and 11 electric connection of FPGA controller, the inside of drawing a roll casing 21 is provided with draws a winding up roller 24, draw winding up roller 24 and 3 spacing connections of carrier band, the both ends of drawing winding up roller 24 all are connected with and draw spool 23, one end is drawn the spool 23 and is drawn and roll casing 21 and pass through the bearing and be connected, the other end is drawn and is passed through the coupling joint between spool 23 and straight servo motor 22.
Specifically, the laser drilling module 4 includes a 2 μm nanosecond pulse laser 41, a collimation isolation output head, a beam expander 42 and a high-speed vibrating mirror 43, the 2 μm nanosecond pulse laser 41, the collimation isolation output head, the beam expander 42 and the high-speed vibrating mirror 43 are all connected to the first support frame 5, in this embodiment, preferably, the 2 μm nanosecond pulse laser 41 may be any one of a 2 μm nanosecond MOPA fiber laser and a 2 μm nanosecond Q-switched fiber laser, the collimation isolation output head and the beam expander 42 are located at a laser beam outlet position of the 2 μm nanosecond pulse laser 41, the high-speed vibrating mirror 43 is located below the collimation isolation output head and the beam expander 42, the high-speed vibrating mirror 43 is located above the carrier tape 3, and the 2 μm nanosecond pulse laser 41 and the high-speed vibrating mirror 43 are connected to the FPGA controller 11.
Specifically, the rewinding machine module 8 comprises a rewinding machine shell 81, the rewinding machine shell 81 is connected with the bottom frame 9, an induction motor 82 is assembled on the outer side wall of the rewinding machine shell 81, the induction motor 82 is electrically connected with the FPGA controller 11, a rewinding roller 84 is arranged inside the rewinding machine shell 81, the rewinding roller 84 is in limit connection with the carrier tape 3, rewinding shafts 83 are connected to two ends of the rewinding roller 84, one end of each rewinding shaft 83 is connected with the rewinding machine shell 81 through a bearing, and the other end of each rewinding shaft 83 is connected with the induction motor 82 through a coupler.
Specifically, the air-cooled heat sink 10 is disposed on both the FPGA controller 11 and the 2 μm nanosecond pulse laser 41.
The working principle and the using process of the invention are as follows: before the punching process of the laser paper of the carrier tape 3, the simulation and parameters of the 2-micron nanosecond pulse laser 41 are controlled through the FPGA controller 11, the laser beam output of the 2-micron nanosecond pulse laser 41 is realized through a 2-micron nanosecond laser program driving circuit, the spot shape of the laser beam is regulated and controlled through a collimation isolation output head and a beam expanding lens 42, the sweeping speed and frequency of a high-speed vibrating mirror 43 are controlled through the FPGA controller 11, the high-speed swinging of the high-speed vibrating mirror 43 is realized through a driving circuit of the high-speed vibrating mirror 43, and the spot shape of 0.2-0.4 mm is realized through focusing;
when the carrier tape 3 is punched by laser paper, the motion trail of laser processing is input through the human-computer interaction device 12, the FPGA controller 11 controls the 2-micrometer nanosecond pulse laser 41 and the high-speed vibrating mirror 43 to act, and punching operation is carried out on the carrier tape 3 by the laser paper;
in the process of punching laser paper on the carrier tape 3, the machine vision detection drive is controlled through the FPGA controller 11, the punching vision detection of the carrier tape 3 is realized, the result is fed back to the FPGA controller 11, the FPGA controller 11 regulates and controls the drive of the induction motor 82 according to the feedback result, and the high-speed collecting and collecting & controlling of the carrier tape 3 are realized
Meanwhile, the FPGA controller 11 regulates and controls the analog quantity of the straight servo motor 22 according to the feedback result, and further controls a straight pull driving circuit of the straight servo motor 22 to realize high-speed pulling of the carrier tape 3, so that the pulling speed of the laser punching module 4 and the pulling and coiling speed of the coil drawing machine module 2 are matched with the coiling speed of the rewinding machine module 8, and high-precision and high-speed punching is realized;
in the process of punching the laser paper of the carrier tape 3, the FPGA controller 11 controls the machine vision detection drive to realize the punching vision detection of the carrier tape 3, when burrs or rounding occur at the punched edge, the result is fed back to the FPGA controller 11, the FPGA controller 11 regulates and controls the laser beam parameters of the 2 mu m nanosecond pulse laser 41 and the parameters of the high-speed vibrating mirror 43, including laser power, pulse width, frequency, vibrating mirror swinging speed and broadband, when the punching shape is compared with the standard punching shape and the contact ratio exceeds more than 95%, the 2 mu m nanosecond pulse laser 41 and the high-speed vibrating mirror 43 are considered to be matched in parameters, and otherwise, the laser beam parameters of the 2 mu m nanosecond pulse laser 41 and the parameters of the high-speed vibrating mirror 43 are continuously optimized.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides a be applied to high accuracy laser drilling system of carrier band, includes chassis (9), its characterized in that: one side of the top end of the bottom frame (9) is connected with a computer control module (1) through a support frame, one side, close to the computer control module (1), of the top end of the bottom frame (9) is connected with a coil stretcher module (2), one side, far away from the computer control module (1), of the top end of the bottom frame (9) is connected with a rewinder module (8), a carrier tape (3) is movably connected between the rewinder module (8) and the coil stretcher module (2), one side, located at the middle position of the top end of the bottom frame (9), of the carrier tape (3) is connected with a first support frame (5), a laser punching module (4) is assembled on the first support frame (5), the other side, located at the carrier tape (3), of the top end of the bottom frame (9) is connected with a second support frame (6), and the second support frame (6) is located at one side, close to the rewinder module (8), of the first support frame (5), the machine vision module (7) is assembled on the second support frame (6), and the coil drawing machine module (2), the laser drilling module (4), the machine vision module (7) and the rewinding machine module (8) are respectively electrically connected with the computer control module (1).
2. The high-precision laser drilling system for the carrier tape according to claim 1, wherein: computer control module (1) includes computer housing (13), computer housing (13) are connected with chassis (9), the inside of computer housing (13) inlays respectively and is equipped with FPGA controller (11) and man-machine interaction ware (12), the output port of man-machine interaction ware (12) is connected with FPGA controller (11), FPGA controller (11) and machine vision module (7) two-way electric connection.
3. The high-precision laser drilling system for the carrier tape according to claim 2, wherein: draw a roll machine module (2) including drawing a roll casing (21), draw a roll casing (21) and be connected with chassis (9), the lateral wall that draws a roll casing (21) is equipped with straight servo motor (22), straight servo motor (22) and FPGA controller (11) electric connection, the inside of drawing a roll casing (21) is provided with draws a roll roller (24), draw roll roller (24) and carry belt (3) spacing connection, the both ends of drawing roll roller (24) all are connected with draws spool (23), one end draw spool (23) and draw a roll casing (21) between be connected through the bearing, the other end draw through the coupling joint between spool (23) and straight servo motor (22).
4. The high-precision laser drilling system for the carrier tape according to claim 2, wherein: laser boring module (4) are kept apart output head and beam expanding mirror (42) and high-speed mirror (43) that shakes including 2 mu m nanosecond pulse laser (41), collimation, keep apart output head and beam expanding mirror (42) and shake at a high speed mirror (43) and all be connected with first support frame (5) 2 mu m nanosecond pulse laser (41), collimation, keep apart output head and beam expanding mirror (42) and be located the laser beam exit position of 2 mu m nanosecond pulse laser (41), shake at a high speed mirror (43) and be located the below that output head and beam expanding mirror (42) were kept apart in the collimation, shake at a high speed mirror (43) and be located the top of carrying band (3), 2 mu m nanosecond pulse laser (41) and high-speed mirror (43) that shakes are connected with FPGA controller (11).
5. The high-precision laser drilling system for the carrier tape according to claim 2, wherein: the rewinding machine module (8) comprises a rewinding machine shell (81), the rewinding machine shell (81) is connected with the bottom frame (9), an induction motor (82) is assembled on the outer side wall of the rewinding machine shell (81), the induction motor (82) is electrically connected with the FPGA controller (11), a rewinding roller (84) is arranged inside the rewinding machine shell (81), the rewinding roller (84) is in limit connection with the carrier tape (3), rewinding shafts (83) are connected to two ends of the rewinding roller (84), one end of each rewinding shaft (83) is connected with the rewinding machine shell (81) through a bearing, and the other end of each rewinding shaft (83) is connected with the induction motor (82) through a coupler.
6. The high-precision laser drilling system for the carrier tape according to claim 4, wherein: and air-cooled radiators (10) are arranged on the FPGA controller (11) and the 2-micrometer nanosecond pulse laser (41).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110793562.6A CN113681180A (en) | 2021-07-14 | 2021-07-14 | High-precision laser drilling system applied to carrier tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110793562.6A CN113681180A (en) | 2021-07-14 | 2021-07-14 | High-precision laser drilling system applied to carrier tape |
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| Publication Number | Publication Date |
|---|---|
| CN113681180A true CN113681180A (en) | 2021-11-23 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110793562.6A Pending CN113681180A (en) | 2021-07-14 | 2021-07-14 | High-precision laser drilling system applied to carrier tape |
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| Country | Link |
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| CN (1) | CN113681180A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101462204A (en) * | 2009-01-16 | 2009-06-24 | 华中科技大学 | Cigarette tipping paper laser boring method and apparatus |
| CN102207733A (en) * | 2010-03-29 | 2011-10-05 | 深圳市先阳软件技术有限公司 | General laser processing device controller and control method thereof |
| CN202146440U (en) * | 2011-01-10 | 2012-02-22 | 杨君 | Full-automatic multifunctional high-speed laser punching machine for osmotic pumps |
| CN202877728U (en) * | 2012-09-14 | 2013-04-17 | 武汉市凯瑞迪激光技术有限公司 | Laser drilling device for thin materials |
| CN106001942A (en) * | 2016-06-08 | 2016-10-12 | 青岛易科锐自动化技术有限公司 | Laser perforating device and plastic film and plastic label processing equipment |
| CN107745188A (en) * | 2017-09-30 | 2018-03-02 | 深圳信息职业技术学院 | A kind of picosecond laser process equipment |
| CN207888088U (en) * | 2017-12-20 | 2018-09-21 | 上海亚洲化学品有限公司 | A kind of industrial laser-beam drilling machine |
-
2021
- 2021-07-14 CN CN202110793562.6A patent/CN113681180A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101462204A (en) * | 2009-01-16 | 2009-06-24 | 华中科技大学 | Cigarette tipping paper laser boring method and apparatus |
| CN102207733A (en) * | 2010-03-29 | 2011-10-05 | 深圳市先阳软件技术有限公司 | General laser processing device controller and control method thereof |
| CN202146440U (en) * | 2011-01-10 | 2012-02-22 | 杨君 | Full-automatic multifunctional high-speed laser punching machine for osmotic pumps |
| CN202877728U (en) * | 2012-09-14 | 2013-04-17 | 武汉市凯瑞迪激光技术有限公司 | Laser drilling device for thin materials |
| CN106001942A (en) * | 2016-06-08 | 2016-10-12 | 青岛易科锐自动化技术有限公司 | Laser perforating device and plastic film and plastic label processing equipment |
| CN107745188A (en) * | 2017-09-30 | 2018-03-02 | 深圳信息职业技术学院 | A kind of picosecond laser process equipment |
| CN207888088U (en) * | 2017-12-20 | 2018-09-21 | 上海亚洲化学品有限公司 | A kind of industrial laser-beam drilling machine |
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Application publication date: 20211123 |