CN113677094B - Feeding device and feeding method for horizontal electroplating of PCB - Google Patents
Feeding device and feeding method for horizontal electroplating of PCB Download PDFInfo
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- CN113677094B CN113677094B CN202110841514.XA CN202110841514A CN113677094B CN 113677094 B CN113677094 B CN 113677094B CN 202110841514 A CN202110841514 A CN 202110841514A CN 113677094 B CN113677094 B CN 113677094B
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- 238000009713 electroplating Methods 0.000 title claims abstract description 33
- 238000000034 method Methods 0.000 title claims abstract description 21
- 238000001514 detection method Methods 0.000 claims abstract description 30
- 238000001179 sorption measurement Methods 0.000 claims abstract description 29
- 238000010009 beating Methods 0.000 claims abstract description 17
- 150000003071 polychlorinated biphenyls Chemical class 0.000 claims abstract description 8
- 230000000903 blocking effect Effects 0.000 claims description 11
- 230000009467 reduction Effects 0.000 abstract description 2
- 230000008569 process Effects 0.000 description 6
- 238000012545 processing Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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- 230000001360 synchronised effect Effects 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
Abstract
The invention discloses a horizontal electroplating feeding device for a PCB (printed circuit board), which is characterized by comprising a rack, a PCB conveying device arranged on the rack, a plate beating device arranged at the feeding end of the PCB conveying device, a plate tracing positioning device arranged on the rack, a feeding inductor and a control device, wherein the PCB conveying device is arranged on the rack; when the feeding inductor detects that the PCB is fed in place, the control device controls a clapper motor of the clapper device to work, drives a clapper baffle to act to enable the PCB to be close to the edge, and controls the adsorption device to act to enable the PCB to be positioned; the control device controls the lifting device to act, and adjusts the running speed of the sliding table according to the distance signal between the feeding plate and the following plate detected by the distance detection sensor, so that the distance between the feeding plate and the following plate is consistent with the distance between other PCBs. The horizontal electroplating feeding device for the PCB provided by the invention has the advantages of high precision of board edge positioning and board tracing positioning, time and labor saving and labor cost reduction. The invention also provides a horizontal electroplating feeding method of the PCB.
Description
Technical Field
The invention relates to the technical field of printed circuit board manufacturing, in particular to a horizontal electroplating feeding device and a horizontal electroplating feeding method for a PCB.
Background
A Printed Circuit Board (PCB) is an important electronic component, a support for an electronic component, and a carrier for electrical connection of the electronic component. In the production process of the PCB, the PCB needs to be subjected to plate-beating alignment so as to enable the position of the PCB to be suitable for subsequent production and processing; meanwhile, the adjacent circuit boards need to be traced and positioned, so that the distance between the adjacent circuit boards is always and the same as the same horizontal line, and the subsequent process is convenient to carry out.
The existing horizontal electroplating feeding process of the circuit board is as follows: the process comprises the following steps of manual plate placing- > manual edge positioning- > manual plate tracking positioning and limiting, and has the following defects: two manual stations are occupied, and the labor cost is high; personnel efficiency is low and cannot work for a long time; the positioning precision of the side-abutting positioning and the positioning and limiting precision of the manual plate-following positioning are low, and the processing precision of the subsequent circuit board is influenced.
In view of the above, it is necessary to provide a new process to solve the above technical problems.
Disclosure of Invention
The technical problem to be solved by the invention is to provide a feeding device and a feeding method for horizontal electroplating of a PCB, which have the advantages of high precision of plate edge positioning and plate tracing positioning, time and labor saving and labor cost reduction.
In order to solve the problems, the technical scheme of the invention is as follows:
a PCB horizontal electroplating feeding device comprises a rack, a PCB conveying device arranged on the rack, a plate beating device arranged at a feeding end of the PCB conveying device, a plate tracing positioning device arranged on the rack, a feeding sensor and a control device;
the clapper device comprises a clapper motor, a connecting block arranged on an output shaft of the clapper motor, and a plurality of clapper baffle rods which are arranged on the connecting block and are distributed at intervals, wherein the extending direction of the clapper baffle rods is vertical to the PCB;
the board tracking positioning device comprises a sliding table in sliding connection with the rack, a lifting device arranged on the sliding table, an adsorption device driven by the lifting device to lift and used for positioning the PCB, and a distance detection sensor arranged on the rack and used for detecting the distance between the feeding board and the tracking board;
the feeding inductor is arranged at the end part of the adsorption device and used for detecting whether the PCB is fed in place or not;
when the feeding inductor detects that the PCB is fed in place, the control device controls a clapper motor of the clapper device to work, drives a clapper baffle to act to enable the PCB to lean against the edge, and controls the adsorption device to act to enable the PCB to be positioned;
the control device controls the lifting device to act, and adjusts the running speed of the sliding table according to the distance signal between the feeding plate and the chasing plate detected by the distance detection sensor, so that the distance between the feeding plate and the chasing plate is consistent with the distance between other PCBs.
Furthermore, the PCB conveying device comprises a plurality of conveying rollers, and each clapper blocking rod is inserted between two adjacent conveying rollers.
Furthermore, the two groups of clapper devices are arranged, and a group of clapper devices are respectively arranged on two opposite sides of the PCB conveying device.
Further, the clapping device comprises X clapping modes, wherein X is an integer greater than or equal to 2; the clapper modes comprise left alignment, right alignment or center alignment.
Furthermore, the PCB conveying devices are arranged in two groups and distributed at intervals, and the board tracking positioning device is arranged between the two groups of PCB conveying devices.
Further, the chasing plate positioning device comprises Y chasing plate modes, wherein Y is an integer greater than or equal to 2; the plate tracking mode comprises a mode of calculating the distance between the feeding plate and the tail end of the tracking plate to adjust the running speed of the sliding table, a mode of calculating the distance between the feeding plate and the front end of the tracking plate to adjust the running speed of the sliding table, or a mode of adjusting the running speed of the sliding table according to the distance between the feeding plate and the front end and the tail end of the tracking plate.
The invention also provides a horizontal electroplating feeding method of the PCB, which comprises the following steps:
step S1, starting the PCB conveying device, and conveying the PCB to the adsorption device above the sliding table;
step S2, the feeding inductor detects whether the PCB is fed in place or not and sends a detection signal to the control device;
step S3, when detecting that the feeding of the PCB is in place, the control device controls the motion of the clapper device, and the output shaft of the clapper motor drives the clapper blocking rod to slide, so that the edge of the PCB is limited by the clapper blocking rod;
step S4, the control device controls the adsorption device to move, adsorbs the PCB feeding plate to position the PCB feeding plate, and controls the lifting device to ascend so that the PCB feeding plate is higher than the conveying rollers of the PCB conveying device;
step S5, the distance detection sensor detects the distance between the PCB feeding plate and the chasing plate and transmits a detection signal to the control device, and the control device controls the sliding table to slide and adjusts the running speed of the sliding table, so that the distance between the PCB feeding plate and the chasing plate reaches a set requirement;
step S6, the control device controls the lifting device to descend, so that the PCB feeding plate is supported on the conveying roller of the PCB conveying device, and simultaneously controls the adsorption device to release the PCB feeding plate, so that the PCB feeding plate is conveyed by the PCB conveying device;
in step S7, the control device controls the slide table to retract to the standby position.
Further, the clapping device comprises X clapping modes, wherein X is an integer greater than or equal to 2; the clapper modes comprise left alignment, right alignment or center alignment.
Further, the chasing plate positioning device comprises Y chasing plate modes, wherein Y is an integer greater than or equal to 2; the plate tracking mode comprises a mode of calculating the running speed of the distance adjusting sliding table at the tail end of the feeding plate and the tracking plate, a mode of calculating the running speed of the distance adjusting sliding table at the front end of the feeding plate and the tracking plate, or a mode of adjusting the running speed of the sliding table according to the distance between the feeding plate and the front end and the tail end of the tracking plate.
Compared with the prior art, the horizontal electroplating feeding device and the horizontal electroplating feeding method for the PCB have the advantages that:
the PCB horizontal electroplating feeding device and the feeding method provided by the invention combine the plate beating device and the plate chasing positioning device to realize automatic limiting and automatic positioning, and can automatically adjust the distance between the feeding plate and the chasing plate to ensure that the distance between two adjacent PCBs is consistent. Compared with the prior art, the horizontal electroplating feeding device and the horizontal electroplating feeding method for the PCB have the advantages that the positioning precision by the side and the positioning and limiting precision of the board chasing are high, and the processing precision of a subsequent circuit board can be ensured; meanwhile, the labor cost is greatly saved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic structural diagram of a horizontal electroplating feeding device for PCB boards according to the present invention.
Detailed Description
In order to make the technical solutions in the embodiments of the present invention better understood and make the above objects, features and advantages of the present invention more comprehensible, specific embodiments thereof will be described in detail below with reference to the accompanying drawings.
It should be noted that the description of the embodiments is provided to help understanding of the present invention, and is not intended to limit the present invention. In addition, the technical features involved in the embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.
Fig. 1 is a schematic structural diagram of a horizontal electroplating feeding device for a PCB according to the present invention. The invention provides a horizontal electroplating feeding device 100 for a PCB (printed circuit board) which comprises a rack 1, a PCB conveying device 2, a plate beating device 3, a plate tracking positioning device 4, a feeding sensor 5 and a control device 6.
The PCB conveying device 2 is used for conveying PCBs and comprises a plurality of conveying rollers 21, the PCBs are supported on the conveying rollers, and the power device drives the conveying rollers to rotate so as to drive the PCBs to move. In this embodiment, the PCB conveying devices 2 are two sets, and the two sets of PCB conveying devices are spaced apart from each other, and the PCB is supported on the conveying rollers of the two sets of PCB conveying devices, so that the two sets of PCB conveying devices are synchronous. And a board tracking positioning device 4 is arranged between the two groups of PCB conveying devices.
The clapper device 3 is arranged on the frame 1 and is arranged at the feeding end of the PCB conveying device, and comprises a clapper motor 31, a connecting block (not numbered) arranged at the output shaft of the clapper motor 31, and a plurality of clapper baffle rods 33 which are arranged at intervals and are arranged at the connecting block 31 and have the extending direction vertical to the PCB, wherein the motor output shaft drives the clapper baffle rods 33 to move so as to realize the edge leaning of the PCB. In this embodiment, each flap lever 33 is inserted between two adjacent conveying rollers 21, the flap motor 31 is a linear motor, an output shaft of the linear motor drives the flap lever 33 to make linear motion, and when the flap lever 33 moves toward the center, the edge of the PCB abuts against the flap lever 33 and is limited by the flap lever 33; after the PCB completes limiting and positioning, the clapper motor rotates reversely, and the motor output shaft retracts.
Preferably, the two clapper devices 3 are correspondingly arranged on two sides of the PCB conveying device, and when the PCB conveying device works, one of the clapper devices can be controlled to work according to design requirements, or the two clapper devices can be controlled to work simultaneously; correspondingly, the clapper mode of the clapper device is multiple, namely the PCB is aligned to the left, aligned to the right or aligned in the middle. The left alignment means that the clapper device positioned on the left side of the PCB conveying device acts to align the edge of the PCB with the clapper stop lever on the left side; the right aligning means that the clapper device positioned on the right side of the PCB conveying device acts to align the edge of the PCB with the clapper blocking rod on the right side; the centering alignment means that the clapper devices on the two sides act simultaneously to align the board edges on the two sides of the PCB with the corresponding clapper blocking rods.
The board tracking positioning device 4 is installed on the rack 1 and located between two sets of PCB conveying devices, and comprises a sliding table 41 connected with the rack 1 in a sliding manner, a lifting device 42 arranged on the sliding table 41, an adsorption device 43 driven by the lifting device 42 to lift and used for positioning the PCB, and a distance detection sensor 44 arranged on the rack 1 and used for detecting the distance between a feeding board and a tracking board.
The sliding table 41 is matched with the frame 1 through a sliding guide rail and is driven by a driving device to realize sliding connection.
The lifting device 42 is used for driving the adsorption device 43 to perform lifting movement, and when the adsorption device is driven to lift, the PCB supported on the adsorption device 43 is separated from the PCB conveying device, so that the sliding table 41 can drive the adsorption device and the PCB to slide conveniently; when the adsorption device is driven to descend, the PCB is supported on the PCB conveying device and conveyed by the PCB conveying device.
The suction device 43 has a plurality of through holes 431, and the through holes 431 are connected to a vacuum supply device (not shown). The vacuum supply device works to provide negative pressure, so that the PCB is adsorbed to realize positioning. In this embodiment, the adsorption device 43 is an adsorption platform for supporting the PCB, and the surface thereof is flat.
The distance detection sensor 44 is arranged on the rack and used for detecting the distance between the feeding plate and the chasing plate and sending a detection signal to the control device 6, and the control device 6 controls the sliding table to work according to the detection signal value. In this embodiment, the distance detection sensors 44 are preferably provided in two sets, and are disposed on the chassis at intervals in the PCB board conveying direction. Two sets of distance detection sensor 44 are used for detecting PCB pan feeding board respectively and chasing the terminal interval of board and be used for detecting PCB pan feeding board and chasing the interval of board front end, and detection signal between them feeds back to controlling means simultaneously, and controlling means can adjust the operating parameter of slip table according to one of them detection signal, also can adjust the operating parameter of slip table according to two detection signal simultaneously, and the messenger chases the board mode of board positioner and is multiple.
The feeding sensor 5 is arranged at the end part of the adsorption device 43 and used for detecting whether the PCB is fed in place or not and transmitting a detection signal to the control device 6, and the control device 6 controls the plate beating device 3 to act according to the detection signal of the feeding sensor. The feeding sensor 5 can be a travel switch or a camera.
In the invention, the control device 6 is electrically connected with the feeding sensor 5, the clapper motor 31 of the clapper device, the sliding table 41, the lifting device 42, the vacuum providing device and the distance detection sensor 44, and the control working principle is as follows:
the feeding sensor 5 detects a signal whether the PCB feeding plate is in place or not, and transmits the detection signal to the control device 6, when the PCB feeding plate is detected to be in place, the control device controls the plate beating motor 31 of the plate beating device 3 to act, the output shaft of the plate beating motor 31 drives the plate beating blocking rod 33 to approach the edge of the PCB feeding plate, and when the edge of the PCB feeding plate is abutted against the plate beating blocking rod 33, the control device 6 controls the plate beating motor 31 to stop acting;
the control device 6 controls the action of a vacuum providing device connected with the through hole, and provides vacuum to fix the PCB feeding plate on the adsorption device 43 so as to realize the positioning of the PCB feeding plate; and controlling the lifting device 42 to ascend, so that the PCB feeding plate is higher than the conveying roller of the PCB conveying device; then the control device 6 controls the clapper motor of the clapper device to run reversely to drive the clapper baffle rod to return to the original position;
the distance detection sensor 44 detects the distance between the PCB feeding plate and the PCB chasing plate and transmits a detection signal to the control device 6, and the control device 6 controls the sliding table to slide and adjusts the running speed of the sliding table, so that the distance between the PCB feeding plate and the PCB chasing plate reaches a set requirement; then, the control device 6 controls the lifting device 42 to descend, so that the PCB feeding plates are supported on the conveying rollers of the PCB conveying device, and meanwhile, the adsorption device is controlled to release the PCB feeding plates, so that the PCB feeding plates are conveyed by the PCB conveying device, and at the moment, the distance between every two adjacent PCB plates is kept consistent; subsequently, the control device 6 controls the slide table to retract to the standby position, and the next cycle process is performed.
Based on the PCB horizontal electroplating feeding device, the invention also provides a PCB horizontal electroplating feeding method, which comprises the following steps:
step S1, starting the PCB conveying device, and conveying the PCB to the adsorption device above the sliding table;
step S2, the feeding inductor detects whether the PCB is fed in place or not, and sends a detection signal to the control device;
step S3, when detecting that the feeding of the PCB is in place, the control device controls the motion of the clapper device, and the output shaft of the clapper motor drives the clapper blocking rod to slide, so that the edge of the PCB is limited by the clapper blocking rod;
specifically, the clapper device comprises X clapper modes, wherein X is an integer greater than or equal to 2; the clapper modes comprise left alignment, right alignment or center alignment;
step S4, the control device controls the adsorption device to move, adsorbs the PCB feeding plate to position the PCB feeding plate, and controls the lifting device to ascend so that the PCB feeding plate is higher than the conveying rollers of the PCB conveying device;
specifically, after the PCB feeding plate is fixed by the adsorption device, the control device controls the plate beating device to move, and the plate beating motor drives the plate beating baffle to return to the original position. The PCB feeding board is higher than the conveying roller of the PCB conveying device, so that the PCB feeding board is separated from the restraint of the PCB conveying device, the PCB feeding board is driven to run only by the sliding table in the distance adjusting process, and the accuracy of data adjustment can be improved.
Step S5, the distance detection sensor detects the distance between the PCB feeding board and the chasing board and transmits a detection signal to the control device, and the control device controls the sliding table to slide and adjusts the running speed of the sliding table, so that the distance between the PCB feeding board and the chasing board reaches the set requirement;
specifically, the chasing plate positioning device comprises Y chasing plate modes, wherein Y is an integer greater than or equal to 2; the plate tracking mode comprises a mode of calculating the distance between the feeding plate and the tail end of the tracking plate to adjust the running speed of the sliding table, a mode of calculating the distance between the feeding plate and the front end of the tracking plate to adjust the running speed of the sliding table, or a mode of adjusting the running speed of the sliding table according to the distance between the feeding plate and the front end and the tail end of the tracking plate.
Step S6, the control device controls the lifting device to descend, so that the PCB feeding plate is supported on the conveying roller of the PCB conveying device, and simultaneously controls the adsorption device to release the PCB feeding plate, so that the PCB feeding plate is conveyed by the PCB conveying device;
in step S7, the control device controls the slide table to retract to the standby position.
The PCB horizontal electroplating feeding device and the feeding method provided by the invention combine the plate beating device and the plate chasing positioning device to realize automatic limiting and automatic positioning, and can automatically adjust the distance between the feeding plate and the chasing plate to ensure that the distance between two adjacent PCBs is consistent. Compared with the prior art, the horizontal electroplating feeding device and the horizontal electroplating feeding method for the PCB have the advantages that the positioning and limiting precision of the side positioning and the board tracing positioning is high, and the processing precision of a subsequent circuit board can be guaranteed; meanwhile, the labor cost is greatly saved.
The embodiments of the present invention are described in detail above with reference to the drawings, but the present invention is not limited to the described embodiments. Various changes, modifications, substitutions and alterations to these embodiments will occur to those skilled in the art without departing from the spirit and scope of the present invention.
Claims (9)
1. A horizontal electroplating feeding device for a PCB (printed Circuit Board) is characterized by comprising a rack, a PCB conveying device arranged on the rack, a plate beating device arranged at the feeding end of the PCB conveying device, a plate tracing positioning device arranged on the rack, a feeding sensor and a control device, wherein the PCB conveying device is arranged on the rack;
the clapper device comprises a clapper motor, a connecting block arranged on an output shaft of the clapper motor, and a plurality of clapper baffle rods which are arranged on the connecting block and are distributed at intervals, wherein the extending direction of the clapper baffle rods is vertical to the PCB;
the board chasing positioning device comprises a sliding table, a lifting device, an adsorption device and a distance detection sensor, wherein the sliding table is connected with the rack in a sliding manner, the lifting device is arranged on the sliding table, the adsorption device is driven by the lifting device to lift and is used for positioning a PCB, and the distance detection sensor is arranged on the rack and is used for detecting the distance between the feeding board and the chasing board;
the feeding inductor is arranged at the end part of the adsorption device and used for detecting whether the PCB is fed in place or not;
when the feeding inductor detects that the PCB is fed in place, the control device controls a clapper motor of the clapper device to work, drives a clapper baffle to act to enable the PCB to be close to the edge, and controls the adsorption device to act to enable the PCB to be positioned;
the control device controls the lifting device to act, and adjusts the running speed of the sliding table according to the distance signal between the feeding plate and the following plate detected by the distance detection sensor, so that the distance between the feeding plate and the following plate is consistent with the distance between other PCBs.
2. The apparatus as claimed in claim 1, wherein the apparatus comprises a plurality of conveyor rollers, and each of the plurality of flap bars is inserted between two adjacent conveyor rollers.
3. The PCB horizontal electroplating feeding device according to claim 2, wherein the two groups of clapper devices are arranged, and one group of clapper devices are respectively arranged at two opposite sides of the PCB conveying device.
4. The PCB horizontal electroplating feeding device according to claim 3, wherein the clapper device comprises X clapper modes, wherein X is an integer greater than or equal to 2; the clapper pattern includes left justification, right justification, or center justification.
5. The PCB horizontal electroplating feeding device according to claim 1, wherein the PCB conveying devices are arranged in two groups and are distributed at intervals, and the board tracking positioning device is arranged between the two groups of PCB conveying devices.
6. The PCB horizontal electroplating feeding device according to claim 5, wherein the board tracking positioning device comprises Y board tracking modes, wherein Y is an integer greater than or equal to 2; the plate tracking mode comprises a mode of calculating the running speed of the distance adjusting sliding table at the tail end of the feeding plate and the tracking plate, a mode of calculating the running speed of the distance adjusting sliding table at the front end of the feeding plate and the tracking plate, or a mode of adjusting the running speed of the sliding table according to the distance between the feeding plate and the front end and the tail end of the tracking plate.
7. A horizontal electroplating feeding method of a PCB (printed circuit board), which is characterized in that the horizontal electroplating feeding device of the PCB as claimed in claim 1 is applied, and comprises the following steps:
step S1, starting the PCB conveying device, and conveying the PCB to the adsorption device above the sliding table;
step S2, the feeding inductor detects whether the PCB is fed in place and sends a detection signal to the control device;
step S3, when detecting that the feeding of the PCB is in place, the control device controls the motion of the clapper device, and the output shaft of the clapper motor drives the clapper blocking rod to slide, so that the edge of the PCB is limited by the clapper blocking rod;
step S4, the control device controls the adsorption device to move, adsorbs the PCB feeding plate to position the PCB feeding plate, and controls the lifting device to ascend so that the PCB feeding plate is higher than the conveying rollers of the PCB conveying device;
step S5, the distance detection sensor detects the distance between the PCB feeding plate and the chasing plate and transmits a detection signal to the control device, and the control device controls the sliding table to slide and adjusts the running speed of the sliding table, so that the distance between the PCB feeding plate and the chasing plate reaches a set requirement;
step S6, the control device controls the lifting device to descend, so that the PCB feeding plate is supported on the conveying roller of the PCB conveying device, and simultaneously controls the adsorption device to release the PCB feeding plate, so that the PCB feeding plate is conveyed by the PCB conveying device;
in step S7, the control device controls the slide table to retract to the standby position.
8. The PCB horizontal electroplating feeding method as claimed in claim 7, wherein the clapper device comprises X clapper modes, wherein X is an integer greater than or equal to 2; the clapper modes comprise left alignment, right alignment or center alignment.
9. The PCB horizontal electroplating feeding method of claim 7, wherein the board tracking positioning device comprises Y board tracking modes, wherein Y is an integer greater than or equal to 2; the plate tracking mode comprises a mode of calculating the running speed of the distance adjusting sliding table at the tail end of the feeding plate and the tracking plate, a mode of calculating the running speed of the distance adjusting sliding table at the front end of the feeding plate and the tracking plate, or a mode of adjusting the running speed of the sliding table according to the distance between the feeding plate and the front end and the tail end of the tracking plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110841514.XA CN113677094B (en) | 2021-07-26 | 2021-07-26 | Feeding device and feeding method for horizontal electroplating of PCB |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110841514.XA CN113677094B (en) | 2021-07-26 | 2021-07-26 | Feeding device and feeding method for horizontal electroplating of PCB |
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| CN113677094A CN113677094A (en) | 2021-11-19 |
| CN113677094B true CN113677094B (en) | 2022-08-23 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US7497318B2 (en) * | 2007-03-07 | 2009-03-03 | Chun-Wei Lin | Conveying and stacking device for corrugated boards |
| CA2658278A1 (en) * | 2008-03-13 | 2009-09-13 | Robert Ahrens | Vacuum suction transport carriage for a selection and bundling apparatus for random length materials |
| DE102013112056A1 (en) * | 2013-10-31 | 2015-04-30 | Viscom Ag | Conveying device for conveying workpieces, in particular printed circuit boards, in the conveying direction along a conveying path |
| CN108792498A (en) * | 2018-08-14 | 2018-11-13 | 昆山瑞鸿诚自动化设备科技有限公司 | A kind of PCB plate putting machines |
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Denomination of invention: A PCB board horizontal electroplating feeding device and feeding method Effective date of registration: 20230705 Granted publication date: 20220823 Pledgee: China Construction Bank Corporation Jishui sub branch Pledgor: JIANGXI XUSHENG ELECTRONICS Co.,Ltd. Registration number: Y2023980047563 |
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Address after: 331601 Jishui Industrial Park, Jishui County, Ji'an City, Jiangxi Province, on the east side of Jingong Avenue and the south side of Jingong Avenue, Chengxi Industrial Park Patentee after: Jiangxi Xusheng Electronics Co.,Ltd. Country or region after: China Address before: 331600 Jishui Industrial Park, Jishui County, Ji'an City, Jiangxi Province Patentee before: JIANGXI XUSHENG ELECTRONICS Co.,Ltd. Country or region before: China |
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Granted publication date: 20220823 Pledgee: China Construction Bank Corporation Jishui sub branch Pledgor: JIANGXI XUSHENG ELECTRONICS Co.,Ltd. Registration number: Y2023980047563 |