CN113673290A

CN113673290A - Electronic device and fingerprint identification module

Info

Publication number: CN113673290A
Application number: CN202010477872.2A
Authority: CN
Inventors: 林伯骐
Original assignee: Novatek Microelectronics Corp
Current assignee: Novatek Microelectronics Corp
Priority date: 2020-05-13
Filing date: 2020-05-29
Publication date: 2021-11-19
Also published as: TWM599952U

Abstract

An electronic device and a fingerprint identification module are provided. The back plate is opposite to the display panel and is provided with a fingerprint contact area which is used for sensing fingerprints and can be penetrated by light rays. The fingerprint identification module is located between the display panel and the back plate and comprises an optical fingerprint sensing wafer, wherein the optical fingerprint sensing wafer is provided with a fingerprint contact area with a sensing surface facing the back plate so as to sense light rays from the fingerprint contact area. The optical fingerprint sensing chip in the electronic device has a fingerprint contact area with a sensing surface facing a back plate, and can be applied to a back cover of a mobile communication device (such as a mobile phone), for example. The electronic device can utilize infrared light emitting diodes or other light sources as light sources. Besides fingerprint identification, other biological identification such as heartbeat or heart rhythm detection can be added, so that the anti-counterfeiting effect can be achieved and the identification rate can be improved.

Description

Electronic device and fingerprint identification module

Technical Field

The present disclosure relates to an electronic device, and more particularly, to an electronic device having a fingerprint recognition module.

Background

With the progress of science and technology, biometric identification (biometrics) applied to mobile devices has gradually become the mainstream of the market, and biometric identification uses unique features on human bodies as passwords on mobile devices to achieve the purpose of identifying users. The biometric identification is applied to fingerprint identification, face identification, iris identification, and the like.

Fingerprint recognition can be divided into capacitive and optical fingerprint recognition. The optical fingerprint identification is different from the capacitance type fingerprint identification, is not easy to influence the identification degree due to interference of sweat and the like, and has the advantages of higher durability and better stability. However, there is still a need for improvement in optical fingerprint recognition.

Disclosure of Invention

The present disclosure provides an electronic device including a display panel, a backplane, and a fingerprint identification module. The back plate is opposite to the display panel and is provided with a fingerprint contact area which is used for sensing fingerprints and can be penetrated by light rays. The fingerprint identification module is located between the display panel and the back plate and comprises an optical fingerprint sensing wafer, wherein the optical fingerprint sensing wafer is provided with a fingerprint contact area with a sensing surface facing the back plate so as to sense light rays from the fingerprint contact area.

In some embodiments, the back plate has an opening and a light transmissive medium is disposed within an area of the opening to serve as a fingerprint contact area.

In some embodiments, the back plate is made of a light-transmissive material, and the area of the light-transmissive material is used as a fingerprint contact area.

In some embodiments, the fingerprint recognition module further comprises at least one light source for providing light.

In some embodiments, the at least one light source includes a plurality of light sources, and the light sources are symmetrically disposed with respect to a center point of the optical fingerprint sensing chip.

In some embodiments, the fingerprint identification module further includes a light guide structure for guiding light of the at least one light source to the fingerprint contact area and/or guiding light of the fingerprint contact area to the sensing surface.

In some embodiments, the at least one light source has a light emitting surface, and the light emitting surface does not face the fingerprint contact region of the back plate.

In some embodiments, the at least one light source has a light emitting surface, and the light emitting surface faces the fingerprint contact region of the back plate.

In some embodiments, the fingerprint identification module further includes a light shielding structure for shielding a portion of light of the at least one light source.

In some embodiments, the light shielding structure is disposed between the at least one light source and the optical fingerprint sensing chip.

In some embodiments, the light shielding structure has an opening between the sensing surface and the fingerprint contact region, the opening allowing light from the fingerprint contact region to enter the sensing surface.

In some embodiments, the light guide structure includes one or more of a lens, a microlens array, a light collimating element, and a filter disposed between the fingerprint contact region and the sensing surface of the optical fingerprint sensing wafer.

In some embodiments, the fingerprint sensor module further includes a substrate, and the optical fingerprint sensing chip, the at least one light source and the light shielding structure are disposed on the substrate, wherein the light shielding structure includes a wall and a top plate, and the wall is connected to the substrate and surrounds the optical fingerprint sensing chip. The top plate extends inwardly from the perimeter wall and the edges of the top plate define the contours of the opening.

In some embodiments, the backlight module further comprises a light homogenizing layer disposed between the fingerprint recognition module and the fingerprint contact area of the back plate.

In some embodiments, the fingerprint recognition module further comprises a light guide plate (light guide plate) disposed between the fingerprint recognition module and the fingerprint contact area of the back plate, wherein the light guide plate has an upper surface into which light from the fingerprint contact area enters.

In some embodiments, a light diffusing sheet and a reflective layer are also included. The light diffusion sheet is arranged between the fingerprint contact areas of the light guide plate and the back plate. The reflecting layer is arranged between the light guide plate and the fingerprint identification module.

In some embodiments, the light guide plate further comprises a fixing member, wherein the fixing member is connected to the light guide plate and the at least one light source for fixing the light guide plate and the at least one light source.

In some embodiments, the display panel is located on the front side of the electronic device, and the back panel is located on the back side of the electronic device.

In some embodiments, the electronic device is a mobile communication device.

In some embodiments, the fingerprint recognition module further comprises a processor for receiving the sensing data provided by the fingerprint recognition module and recognizing the fingerprint.

In some embodiments, the processor further detects a change in blood flow in the human microvasculature based on the sensed data.

The disclosure provides a fingerprint identification module for being disposed in an electronic device, the electronic device including a display panel and a back plate, the back plate and the display panel being disposed opposite to each other, the back plate having a fingerprint contact area for sensing a fingerprint and allowing light to penetrate therethrough, wherein the fingerprint identification module is disposed between the display panel and the back plate, and the fingerprint identification module includes an optical fingerprint sensing wafer having a sensing surface for being disposed facing the fingerprint contact area of the back plate to sense light from the fingerprint contact area.

In some embodiments, the lighting system further comprises at least one light source for providing light.

In some embodiments, the fingerprint sensor further comprises a light shielding structure disposed between the at least one light source and the optical fingerprint sensing chip.

In some embodiments, the fingerprint sensor further comprises a light guide structure for guiding at least light from the light source to the fingerprint contact area and/or guiding light from the fingerprint contact area to the sensing surface.

In some embodiments, the light guide structure includes at least one of a light collimating element, a lens, a micro-lens array, and a filter for being disposed between the fingerprint contact area and the sensing surface of the optical fingerprint sensing wafer.

In some embodiments, the fingerprint recognition module is configured to provide the sensed data to the processor to cause the processor to recognize the fingerprint.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are intended to provide further explanation of the invention as claimed.

Drawings

The detailed description of the present disclosure will be best understood when read in conjunction with the appended drawings. It should be noted that, in accordance with standard practice in the industry, the various features are not drawn to scale and are used for illustrative purposes only. In fact, the dimensions of the various features may be arbitrarily increased or reduced for clarity of discussion.

Fig. 1 is a schematic cross-sectional view illustrating an electronic device according to an embodiment of the invention;

fig. 2 to 12 are schematic partial cross-sectional views of electronic devices according to various embodiments of the present invention;

FIGS. 13-14 are schematic diagrams of a microlens array according to some embodiments of the present invention;

fig. 15-16 are cross-sectional schematic views of electronic devices according to some embodiments of the invention;

fig. 17 is a partial cross-sectional view of an electronic device according to an embodiment of the invention;

fig. 18 to 20 are cross-sectional schematic views of electronic devices according to some embodiments of the invention.

[ notation ] to show

100 electronic device

110 display panel

120 back plate

122 opening of the hole

124 light-transmitting medium

130 fingerprint identification module

132 optical fingerprint sensing chip

134 light shielding structure

134a opening

135 casing wall

136 top plate

138 lens

139 base plate

140 light source

142 microlens array

144 optical filter

146 light collimating element

150 light-equalizing layer

160 light guide plate

160a incident light surface

170 light diffusion sheet

180 reflective layer

190 fixing part

192 camera lens

200, finger

210 wafer

220, a battery

A1 fingerprint contact area

C center point

S1 sensing surface

Detailed Description

For a more complete and complete description of the present disclosure, reference is now made to the accompanying drawings, in which like numerals represent the same or similar elements, and to the various embodiments described below.

In the following description, for purposes of explanation, numerous implementation details are set forth in order to provide a thorough understanding of the various embodiments of the present invention. It should be understood, however, that these implementation details are not to be interpreted as limiting the invention. That is, in some embodiments of the invention, such implementation details are not necessary. In addition, for the sake of simplicity, some conventional structures and elements are shown in the drawings in a simple schematic manner.

Referring to fig. 1, fig. 1 is a cross-sectional view of an electronic device according to an embodiment of the invention. As shown in fig. 1, an electronic device 100 includes a back plate 120, a fingerprint identification module 130 and a display panel 110 in sequence from top to bottom. In detail, the back plate 120 is disposed opposite to the display panel 110, and the back plate 120 has a fingerprint contact area a1, the fingerprint contact area a1 is used for sensing the fingerprint of the finger 200 and allowing light to penetrate through. It should be noted that the fingerprint contact area a1 may be a specific area on the back plate 120, and has a range of areas that can be sensed by the optical fingerprint sensing chip 132. The fingerprint recognition module 130 is disposed between the display panel 110 and the back plate 120, and the fingerprint recognition module 130 includes an optical fingerprint sensing chip 132, a substrate 139 and a light source 140, wherein the optical fingerprint sensing chip 132 has a sensing surface S1 facing the fingerprint contact area a1 of the back plate 120 for sensing light from the fingerprint contact area a 1. In more detail, the optical fingerprint sensing chip 132 and the light source 140 may be disposed on the substrate 139, wherein the light source 140 is used for providing light, and the light source 140 may be disposed on one or more sides (e.g., two sides) of the optical fingerprint sensing chip 132 with the center point C of the optical fingerprint sensing chip 132 as the center.

In one embodiment, the display panel 110 may be a Thin Film Transistor (TFT) display panel, a Thin Film Diode (TFD) display panel, an organic light-emitting diode (OLED) display panel, an active-matrix organic light-emitting diode (AMOLED) display panel, and the like, but is not limited thereto.

In one embodiment, the back plate 120 of the electronic device 100 is made of a light-transmissive material, and the area of the light-transmissive material is used as the fingerprint contact area a 1. In an embodiment, the back plate 120 of the electronic device 100 is transparent to the light source 140, for example, the material of the back plate 120 of the electronic device 100 may be glass, sapphire, plastic, or ceramic material, but is not limited thereto. In this embodiment, the back plate is made of a transparent material, so that no hole needs to be dug to serve as the fingerprint contact area A1. In an alternative embodiment, the back plate 120 has an opening 122 and a light transmissive medium 124 is disposed in the area of the opening 122 for fingerprint contact areas A1. The back plate 120 itself may be made of an opaque material.

In some embodiments, the back plate 120 may be a uniform material or a non-uniform material. In one embodiment, the electronic device 100 may further include one or more other light guide structures, such as a light guide plate (light guide plate), a reflective layer, a light diffuser, a light homogenizing layer, or a combination thereof.

In other words, the fingerprint contact area a1 may be at least provided with the material of the back plate itself, or a transparent medium additionally provided for the back plate with a hole. In addition, the structure of the fingerprint contact area A1 can be a single layer (the back plate itself or a light-transmitting medium) or a multi-layer structure (additionally adding a light guide plate, a reflection layer, a light diffusion sheet, a light homogenizing layer and the like).

In one embodiment, the number of the light sources 140 may be multiple, and the multiple light sources 140 may be symmetrically disposed with respect to the center point C of the optical fingerprint sensing chip 132. Specifically, the number of the light sources 140 may be one or more, and when the number of the light sources 140 is two or more, the light sources are symmetrically arranged around an active area (active area).

In one embodiment, the light source 140 has a light emitting surface facing the fingerprint contact area A1 of the back plate 120, such as an under-lighting design. In an alternative embodiment, the light source 140 has a light emitting surface, and the light emitting surface does not face the fingerprint contact area a1 of the back plate 120, such as for a side-lit design.

In some embodiments, the light source 140 may be designed according to different applications, and the light source 140 may be visible light, infrared light, ultraviolet light, etc., but is not limited thereto. In some embodiments, the light source of the light source 140 may be a light-emitting diode (LED) or other light source, such as an infrared light-emitting diode (IR LED).

In one embodiment, the fingerprint identification module 130 further includes a light guide structure for guiding the light of the light source 140 to the fingerprint contact area a1 and/or guiding the light of the fingerprint contact area a1 to the sensing surface S1. In various embodiments, different light guide structures may be disposed according to design application requirements, and the light guide structure may include one or more of a lens 138, a microlens array 142, a light collimating element 146, and a filter 144 disposed between the fingerprint contact area a1 and the sensing surface S1 of the optical fingerprint sensing chip 132.

In some embodiments, if the light source 140 is visible light, the light guide structure of the fingerprint identification module 130 may include an infrared filter (IR filter) for blocking infrared rays, so as to prevent an image from being unclear due to factors such as stray light during imaging. In some embodiments, if the light source 140 is infrared light, the fingerprint identification module 130 includes a band pass filter (IR bandpass filter), which may be configured with a broadband filter or a narrowband filter according to design requirements, or may not be configured with a band pass filter according to design requirements.

In one embodiment, the display panel 110 of the electronic device 100 is located on the front side of the electronic device 100, and the back panel 120 is located on the back side of the electronic device 100. In one embodiment, the electronic device 100 is a mobile communication device, such as a mobile phone or a tablet computer.

In some embodiments, reflected light or/and transmitted light is used for biometric identification and anti-counterfeiting. The electronic device may further include a processor, such as an application processor (application processor), for receiving the sensing data provided by the fingerprint identification module 130, comparing the sensing data with fingerprint data in the database to identify a fingerprint and authenticate the user. In other words, the sensed data is related data including fingerprint recognition. In some embodiments, the processor may further detect a change in blood flow in the human microvasculature based on the sensed data. In other words, the sensing data includes more data related to biological identification such as blood flow

Specifically, imaging may include providing light from the light source 140 to the finger 200 through the fingerprint contact area A1 of the back plate 120, and then reflecting light from the finger 200 through the fingerprint contact area A1 of the back plate 120 to the optical fingerprint sensor chip 132, and the optical fingerprint sensor chip 132 analyzes the fingerprint of the finger 200 by the received reflected light or/and transmitted light to be identified.

In addition, in some embodiments, the light source 140 provides light to illuminate the finger 200, and the electronic device can further detect the blood flow changes in the human body blood capillary, so as to calculate the heart rate and heartbeat of the human body, thereby performing biometric identification.

It is noted that the embodiments provide fingerprint identification and heart rate/heartbeat detection for mobile phone back covers, which are different from the conventional fingerprint identification under the screen, and can add other biological identification, so that the user can achieve the effects of anti-counterfeiting and improving the identification rate through the mobile phone back cover.

Fig. 2 to 12 are schematic partial cross-sectional views of electronic devices according to various embodiments of the invention. For convenience of illustration, the electronic device 100 in fig. 2 to 12 only shows the back plate 120 and the fingerprint identification module 130, and the rest is substantially similar to the structure disclosed in fig. 1, and thus the description is omitted.

Referring to fig. 2, the fingerprint identification module 130 further includes a micro lens array 142 for improving the optical imaging quality. The microlens array 142 may be disposed on the optical fingerprint sensing wafer 132 and located between the optical fingerprint sensing wafer 132 and the back-plate 120.

Referring to fig. 3, the fingerprint identification module 130 may further include an optical filter 144 for filtering light beams with wavelengths other than the specific wavelength, so as to improve the optical imaging quality. The filter 144 may be disposed on the optical fingerprint sensing wafer 132 and located between the optical fingerprint sensing wafer 132 and the back plate 120.

Referring to fig. 4, the fingerprint identification module 130 further includes a light collimating element (collimator)146 for improving a light path and improving optical imaging quality. The light collimating element 146 may be disposed on the optical fingerprint sensing chip 132 and located between the optical fingerprint sensing chip 132 and the back plate 120.

It should be noted that the microlens array 142, the filter 144 and the light collimating element 146 described in fig. 2 to fig. 4 can be combined and arranged according to different design requirements, and the detailed description can refer to fig. 5 to fig. 12.

Referring to fig. 5, the fingerprint identification module 130 further includes a micro lens array 142 and a filter 144. The microlens array 142 is disposed on the optical fingerprint sensing wafer 132, the filter 144 is disposed on the microlens array 142, and the microlens array 142 and the filter 144 are disposed between the optical fingerprint sensing wafer 132 and the back plate 120.

Referring to fig. 6, the fingerprint identification module 130 further includes a micro lens array 142 and a filter 144. The filter 144 is disposed on the optical fingerprint sensing wafer 132, the micro lens array 142 is disposed on the filter 144, and the micro lens array 142 and the filter 144 are disposed between the optical fingerprint sensing wafer 132 and the back plate 120.

Referring to fig. 7, the fingerprint recognition module 130 further includes a micro lens array 142 and a light collimating element 146. The microlens array 142 is disposed on the optical fingerprint sensing wafer 132, the light collimating element 146 is disposed on the microlens array 142, and the microlens array 142 and the light collimating element 146 are disposed between the optical fingerprint sensing wafer 132 and the back plate 120.

Referring to FIG. 8, the fingerprint recognition module 130 further includes a micro-lens array 142 and a light collimating element 146. The light collimating element 146 is disposed on the optical fingerprint sensing chip 132, the micro-lens array 142 is disposed on the light collimating element 146, and the micro-lens array 142 and the light collimating element 146 are disposed between the optical fingerprint sensing chip 132 and the back plate 120.

Referring to fig. 9, the fingerprint recognition module 130 further includes a filter 144 and a light collimating element 146. The optical filter 144 is disposed on the optical fingerprint sensing wafer 132, the light collimating element 146 is disposed on the optical filter 144, and the optical filter 144 and the light collimating element 146 are disposed between the optical fingerprint sensing wafer 132 and the back plate 120.

Referring to fig. 10, the fingerprint recognition module 130 further includes a filter 144 and a light collimating element 146. The light collimating element 146 is disposed on the optical fingerprint sensing chip 132, the filter 144 is disposed on the light collimating element 146, and the filter 144 and the light collimating element 146 are disposed between the optical fingerprint sensing chip 132 and the back plate 120.

Referring to fig. 11, the fingerprint recognition module 130 further includes a micro lens array 142, a filter 144 and a light collimating element 146. The microlens array 142 is disposed on the optical fingerprint sensing chip 132, the filter 144 is disposed on the microlens array 142, the light collimating element 146 is disposed on the filter 144, and the microlens array 142, the filter 144, and the light collimating element 146 are disposed between the optical fingerprint sensing chip 132 and the back plate 120.

Referring to fig. 12, the fingerprint recognition module 130 further includes a micro lens array 142, a filter 144 and a light collimating element 146. The optical filter 144 is disposed on the optical fingerprint sensing chip 132, the light collimating element 146 is disposed on the optical filter 144, the micro-lens array 142 is disposed on the optical filter 144, and the micro-lens array 142, the optical filter 144 and the light collimating element 146 are disposed between the optical fingerprint sensing chip 132 and the back plate 120.

It is noted that the light guiding structure and the back plate 120 as described above in fig. 2 to 12 are configured without gaps. In practical design, the two parts can be designed to have a gap therebetween according to requirements, that is, the two parts can be separately arranged.

Fig. 13-14 are schematic diagrams of microlens arrays according to some embodiments of the present invention. In one embodiment, as shown in fig. 13, the aperture of the microlens array 142 is circular in shape. In one embodiment, as shown in fig. 14, the aperture of the microlens array 142 is square.

Referring to fig. 15, fig. 15 is a cross-sectional view of an electronic device according to some embodiments of the invention. It should be noted that the same or similar elements in fig. 15 as those in fig. 1 are given the same reference numerals, and description thereof is omitted. As shown in fig. 15, the fingerprint identification module 130 further includes a light shielding structure 134 and a lens 138, the light shielding structure 134 is used for shielding a portion of light of the light source 140, and the lens 138 is disposed on the optical fingerprint sensing chip 132 for allowing light from the fingerprint contact area a1 to pass through. The light shielding structure 134 comprises a wall 135 and a top plate 136, the wall 135 is connected to the substrate 139 and surrounds the optical fingerprint sensing chip 132 and is disposed between the optical fingerprint sensing chip 132 and the light source 140, the top plate 136 extends inward from the wall 135, and the edge of the top plate 136 defines the outline of the opening 134 a. The opening 134a is located between the sensing surface S1 and the fingerprint contact area A1, and the opening 134a allows light from the fingerprint contact area A1 to enter the sensing surface S1.

In other embodiments, the fingerprint recognition module 130 may further optionally include a light guide structure, which may include one or more of the microlens array 142, the light collimating element 146, and the filter 144, disposed between the fingerprint contact area a1 and the sensing surface S1 of the optical fingerprint sensing chip 132, which is not repeated here.

Referring to fig. 16, fig. 16 is a cross-sectional view of an electronic device according to some embodiments of the invention. It should be noted that the same or similar elements in fig. 16 as those in fig. 15 are given the same reference numerals, and description thereof is omitted. As shown in FIG. 16, the back plate 120 has an opening 122 and a light transmissive medium 124 is disposed in the area of the opening 122 for fingerprint contact areas A1.

Referring to fig. 17, the fingerprint identification module 130 may include a light guide structure including a light collimating element 146 and a micro-lens array 142, the micro-lens array 142 is disposed on the optical fingerprint sensing chip 132, the light collimating element 146 is disposed on the micro-lens array 142, and the micro-lens array 142 and the light collimating element 146 are disposed between the optical fingerprint sensing chip 132 and the light shielding structure 134. In various embodiments, different light guide structures may be disposed according to design application requirements, and the light guide structure may include one or more of a lens 138, a microlens array 142, a light collimating element 146, and a filter 144 disposed between the fingerprint contact area a1 and the sensing surface S1 of the optical fingerprint sensing chip 132.

In one embodiment, the light source 140 provides light to sense the fingerprint of the finger 200 from the inside of the electronic device 100 through the fingerprint contact area A1 of the back plate 120, and the angles of the light reflected by the finger 200 are different due to the uneven surface of the fingerprint on the finger 200. The reflected light passes through the back plate 120, the lens 138, the light collimating element 146 and/or the micro-lens array 142 to the optical fingerprint sensing chip 132, and the optical fingerprint sensing chip 132 analyzes the fingerprint of the finger 200 according to the received reflected light, so as to perform recognition. The light shielding structure 134 can prevent the interference of diffused or emitted light, thereby improving the description of the detection quality.

Fig. 18 to 20 are cross-sectional schematic views of electronic devices according to some embodiments of the invention. In fig. 18 to 20, the same or similar elements as those in fig. 15 are given the same reference numerals, and description thereof is omitted.

Referring to fig. 18, the electronic device 100 further includes a light-equalizing layer 150 for equalizing the light intensity received by the finger 200 at different positions, and the light-equalizing layer 150 is disposed between the fingerprint recognition module 130 and the fingerprint contact area a1 of the back plate 120.

Referring to fig. 19, the electronic device 100 includes a light guide plate 160, a light diffusion sheet 170 and a reflection layer 180, which function to make the light intensity received by the finger 200 at different positions more uniform. The light guide plate 160, the light diffusion sheet 170 and the reflection layer 180 are disposed between the fingerprint identification module 130 and the fingerprint contact area a1 of the back plate 120, specifically, the light diffusion sheet 170 is disposed under the back plate 120, the light guide plate 160 is disposed under the light diffusion sheet 170, and the reflection layer 180 is disposed under the light guide plate 160, wherein the light guide plate 160 has an upper surface, and light from the fingerprint contact area a1 enters the upper surface. It should be noted that the configurations of the light guide plate 160, the light diffusion sheet 170 and the reflection layer 180 are not limited thereto, and may be changed according to the requirements. The light source 140 for providing light is disposed at the side of the light guide plate 160, and the light emitting surface of the light source 140 faces the light guide plate 160 instead of the back plate 120. The light guide plate 160 has a light incident surface 160a for receiving light from the light source 140. In one embodiment, the electronic device 100 further includes a substrate 139, and the optical fingerprint sensing chip 132 is disposed on the substrate 139.

In one embodiment, the electronic device 100 further includes a camera lens 192, and the camera lens 192 may be disposed in the fixing member 190 and the back plate 120, for example, and has an outward lens, as shown in fig. 19.

In one embodiment, the electronic device 100 further includes a wafer 210 and a battery 220, the optical fingerprint sensing wafer 132 and the wafer 210 are disposed on the substrate 139, and the battery 220 is disposed under the substrate 139.

The chip 210 is provided with a processor for coupling to the fingerprint recognition module 130 and receiving the sensing data provided by the fingerprint recognition module 130 to recognize the fingerprint. In some embodiments, the processor may further detect a change in blood flow in the human body capillary based on the sensing data to calculate a human heart rhythm and heart beat, thereby performing biometric identification.

Referring to fig. 20, similar to fig. 19, the light source 140 for providing light is disposed at the side of the light guide plate 160. In addition, the electronic device 100 may further include a fixing member 190, which is connected to the light guide plate 160 and the light source 140 for fixing the light guide plate 160 and the light source 140. In one embodiment, the electronic device 100 further includes a camera lens 192, and the camera lens 192 may be disposed in the fixing member 190 and the back plate 120, for example, and has an outward lens, as shown in fig. 20.

The present disclosure provides a mechanical application of an optical fingerprint sensor, in which an optical fingerprint sensing chip in an electronic device of the present disclosure has a fingerprint contact area with a sensing surface facing a back plate, and can be applied to, for example, a back cover of a mobile communication device (e.g., a mobile phone). In addition, the electronic device of the present disclosure may utilize an infrared light emitting diode or other light source as a light source. In addition to fingerprint recognition, some embodiments may add other biometric features, such as heartbeat or heart rhythm detection, thereby providing anti-counterfeiting and improved recognition.

Although the present invention has been described in considerable detail with reference to certain embodiments, other embodiments are possible. Therefore, the spirit and scope of the appended claims should not be limited to the description of the embodiments contained herein.

It will be apparent to those skilled in the art that various modifications and variations can be made in the structure of the present invention without departing from the scope or spirit of the invention. In view of the foregoing, it is intended that the present invention cover modifications and variations of this invention provided they come within the scope of the appended claims.

Claims

1. An electronic device, comprising:

a display panel;

the back plate is arranged opposite to the display panel and is provided with a fingerprint contact area which is used for sensing fingerprints and can be penetrated by light; and

the fingerprint identification module is positioned between the display panel and the back plate and comprises an optical fingerprint sensing wafer, wherein the optical fingerprint sensing wafer is provided with a sensing surface facing the fingerprint contact area of the back plate so as to sense light rays from the fingerprint contact area.

2. The electronic device of claim 1, wherein the back plate has an opening and a light transmissive medium is disposed in the area of the opening to serve as the fingerprint contact area.

3. The electronic device of claim 1, wherein the back plate is a light transmissive material, and a region of the light transmissive material is used as the fingerprint contact region.

4. The electronic device of claim 1, wherein the fingerprint recognition module further comprises at least one light source for providing the light.

5. The electronic device of claim 4, wherein the at least one light source comprises a plurality of light sources, and the plurality of light sources are symmetrically disposed with respect to a center point of the optical fingerprint sensing chip.

6. The electronic device of claim 4, wherein the fingerprint identification module further comprises a light guide structure for guiding the light of the at least one light source to the fingerprint contact area and/or guiding the light of the fingerprint contact area to the sensing surface.

7. The electronic device of claim 4, wherein the at least one light source has a light emitting surface, and the light emitting surface does not face the fingerprint contact area of the back plate.

8. The electronic device of claim 4, wherein the at least one light source has a light emitting surface, and the light emitting surface faces the fingerprint contact area of the back plate.

9. The electronic device of claim 6, wherein the fingerprint identification module further comprises a light shielding structure for shielding a portion of light of the at least one light source.

10. The electronic device of claim 9, wherein the light shielding structure is disposed between the at least one light source and the optical fingerprint sensing chip.

11. The electronic device of claim 10, wherein the light shielding structure has an opening between the sensing surface and the fingerprint contact area, the opening allowing light from the fingerprint contact area to enter the sensing surface.

12. The electronic device of claim 6, wherein the light guide structure comprises one or more of a lens, a micro-lens array, a light collimating element, and a filter disposed between the fingerprint contact area and the sensing surface of the optical fingerprint sensing chip.

13. The electronic device of claim 11, wherein the fingerprint identification module further comprises a substrate, and the optical fingerprint sensor chip, the at least one light source and the light shielding structure are disposed on the substrate, wherein the light shielding structure comprises:

a surrounding wall connected to the substrate and surrounding the optical fingerprint sensing chip; and

a top plate extending inwardly from the peripheral wall, the edge of the top plate defining a contour of the opening.

14. The electronic device of claim 6, further comprising a light homogenizing layer disposed between the fingerprint recognition module and the fingerprint contact area of the back plate.

15. The electronic device of claim 4, further comprising:

the light guide plate is arranged between the fingerprint identification module and the fingerprint contact area of the back plate, and the light guide plate is provided with an upper surface, and the light rays from the fingerprint contact area enter the upper surface.

16. The electronic device of claim 15, further comprising:

a light diffusion sheet disposed between the light guide plate and the fingerprint contact region of the back plate; and

a reflection layer disposed between the light guide plate and the fingerprint identification module.

17. The electronic device of claim 15, further comprising:

and the fixing piece is connected with the light guide plate and the at least one light source and is used for fixing the light guide plate and the at least one light source.

18. The electronic device of claim 1, wherein the display panel is disposed on a front surface of the electronic device, and the back plate is disposed on a back surface of the electronic device.

19. The electronic device of claim 1, wherein the electronic device is a mobile communication device.

20. The electronic device of claim 1, further comprising a processor for receiving a sensing data provided by the fingerprint recognition module to recognize a fingerprint.

21. The electronic device of claim 20, wherein the processor further detects a change in blood flow in the human microvasculature based on the sensed data.

22. A fingerprint identification module for being disposed in an electronic device, the electronic device comprising: the display device comprises a display panel and a back plate, wherein the back plate and the display panel are arranged oppositely, the back plate is provided with a fingerprint contact area, the fingerprint contact area is used for sensing fingerprints and can be penetrated by light rays, the fingerprint identification module is arranged between the display panel and the back plate and comprises an optical fingerprint sensing wafer, and the optical fingerprint sensing wafer is provided with a sensing surface which is used for being arranged to face the fingerprint contact area of the back plate so as to sense the light rays from the fingerprint contact area.

23. The module of claim 22, further comprising at least one light source for providing the light.

24. The module of claim 23, wherein the at least one light source comprises a plurality of light sources, and the plurality of light sources are symmetrically disposed with respect to a center point of the optical fingerprint sensing chip.

25. The module of claim 23, further comprising a light shielding structure disposed between the at least one light source and the optical fingerprint sensor chip.

26. The module of claim 25, wherein the light shield structure has an opening between the sensing surface and the fingerprint contact area, the opening allowing light from the fingerprint contact area to enter the sensing surface.

27. The module of claim 23, further comprising a light guide structure for guiding the light from the at least one light source to the fingerprint contact area and/or guiding the light from the fingerprint contact area to the sensing surface.

28. The module of claim 27, wherein the light guide structure comprises at least one of a light collimating element, a lens, a micro-lens array and a filter disposed between the fingerprint contact area and the sensing surface of the optical fingerprint sensing chip.

29. The fingerprint recognition module of claim 22, wherein the fingerprint recognition module is configured to provide the sensed data to a processor for the processor to recognize a fingerprint.

30. The module of claim 29, wherein the processor further detects a change in blood flow in the human microvasculature based on the sensed data.