CN113670343B - Temperature compensation circuit, terminal, temperature control method, temperature compensation device and storage medium - Google Patents
Temperature compensation circuit, terminal, temperature control method, temperature compensation device and storage medium Download PDFInfo
- Publication number
- CN113670343B CN113670343B CN202010408969.8A CN202010408969A CN113670343B CN 113670343 B CN113670343 B CN 113670343B CN 202010408969 A CN202010408969 A CN 202010408969A CN 113670343 B CN113670343 B CN 113670343B
- Authority
- CN
- China
- Prior art keywords
- temperature
- vibration motor
- vibration
- threshold range
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 title claims abstract description 31
- 230000004044 response Effects 0.000 claims abstract description 30
- 238000010521 absorption reaction Methods 0.000 claims abstract description 18
- 229910052751 metal Inorganic materials 0.000 claims description 68
- 239000002184 metal Substances 0.000 claims description 68
- 239000004065 semiconductor Substances 0.000 claims description 60
- 230000035807 sensation Effects 0.000 claims description 5
- 230000001052 transient effect Effects 0.000 abstract description 4
- 230000000694 effects Effects 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 12
- 238000012545 processing Methods 0.000 description 11
- 238000004891 communication Methods 0.000 description 10
- 230000001276 controlling effect Effects 0.000 description 7
- 238000013016 damping Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 230000005236 sound signal Effects 0.000 description 4
- 239000000969 carrier Substances 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 230000006870 function Effects 0.000 description 3
- 230000003993 interaction Effects 0.000 description 3
- 230000001133 acceleration Effects 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 230000014509 gene expression Effects 0.000 description 2
- 238000007726 management method Methods 0.000 description 2
- 238000005381 potential energy Methods 0.000 description 2
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000013500 data storage Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000003574 free electron Substances 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000011897 real-time detection Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
- G01D5/12—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means
- G01D5/14—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage
- G01D5/16—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying resistance
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D3/00—Indicating or recording apparatus with provision for the special purposes referred to in the subgroups
- G01D3/028—Indicating or recording apparatus with provision for the special purposes referred to in the subgroups mitigating undesired influences, e.g. temperature, pressure
- G01D3/036—Indicating or recording apparatus with provision for the special purposes referred to in the subgroups mitigating undesired influences, e.g. temperature, pressure on measuring arrangements themselves
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Control Of Electric Motors In General (AREA)
- User Interface Of Digital Computer (AREA)
Abstract
The present disclosure relates to a temperature compensation circuit, a terminal, a temperature control method, a temperature control device and a storage medium. A temperature compensation circuit for compensating the temperature of a vibration motor, which comprises a control component, a temperature sensor and an endothermic and exothermic circuit, wherein the temperature sensor is used for detecting the temperature of the vibration motor; the control component controls the heat absorption and release circuit to absorb heat or release heat based on the temperature detected by the temperature sensor so as to raise or lower the temperature of the vibration motor to keep the temperature of the vibration motor within a set temperature threshold range. According to the temperature compensation circuit, the temperature of the vibration motor is dynamically compensated, unstable performance of the vibration motor caused by the temperature is avoided, and the transient vibration response effect of the vibration motor is further improved.
Description
Technical Field
The present disclosure relates to the field of haptic sensation, and more particularly, to a temperature compensation circuit, a terminal, and a temperature control method, apparatus, and storage medium.
Background
With the continuous development of mobile devices, touch is an expression mode that a user interacts with the mobile device to obtain feedback, and the mobile terminal gives the user tactile feedback through vibration by touching the mobile device by the user.
In the related art, a haptic feedback vibration assembly (haptic) of a mobile terminal drives a vibration motor, and can simulate simple vibration or a prompt. When a large number of scenes needing touch sense occur in the user interaction process of the mobile equipment, the temperature of the vibration motor fluctuates along with the change of the terminal temperature, at the moment, the vibration motor is driven by the touch feedback vibration assembly to vibrate, delay occurs, instant starting and stopping vibration cannot be realized, and then the touch effect of a user is affected.
Disclosure of Invention
To overcome the problems in the related art, the present disclosure provides a temperature compensation circuit, a terminal, and a temperature control method, apparatus, and storage medium.
According to a first aspect of embodiments of the present disclosure, there is provided a temperature compensation circuit for compensating for a temperature of a vibration motor, comprising a control assembly, a temperature sensor, and an endothermic heat release circuit, wherein,
The temperature sensor is connected with the vibration motor and is used for detecting the temperature of the vibration motor; the control component is connected with the temperature sensor and is used for controlling the heat absorption and release circuit to absorb heat or release heat based on the temperature detected by the temperature sensor so as to raise or lower the temperature of the vibration motor to keep the temperature of the vibration motor within a set temperature threshold range.
In one embodiment, the heat absorption and release circuit comprises a metal device, a semiconductor device and a power supply circuit;
The two ends of the power supply circuit are connected with the semiconductor devices connected with the two ends of the metal device respectively; the semiconductor device and the metal device are driven by the power circuit to carry out electron movement and hole movement, and current is formed through the electron movement direction and the hole movement direction, so that the metal device absorbs heat or releases heat.
In one embodiment, the metal device is a metal sheet.
In one embodiment, the semiconductor device includes a P-type semiconductor and an N-type semiconductor.
In one embodiment, the power circuit includes a DC power converter or a low dropout linear regulator.
In one embodiment, the control assembly is electrically connected to the power circuit, which provides a voltage to the control assembly.
According to a second aspect of embodiments of the present disclosure, there is provided a terminal comprising a haptic feedback assembly comprising a vibration motor and a temperature compensation circuit as described in any one of the embodiments of the first aspect and the first aspect.
According to a third aspect of the embodiments of the present disclosure, there is provided a temperature control method, which is applied to the temperature compensation circuit in any one of the first aspect and the implementation manner of the first aspect, the temperature control method includes:
acquiring the temperature of the vibration motor detected by the temperature sensor in real time;
In response to detecting that the temperature of the vibration motor is not within the set temperature threshold range, controlling the heat absorption and release circuit to absorb heat to reduce the temperature of the vibration motor or release heat to raise the temperature of the vibration motor, so that the temperature of the vibration motor is maintained within the set temperature threshold range.
In one embodiment, in response to detecting that the temperature of the vibration motor is not within the set temperature threshold range, controlling the heat absorption and release circuit to absorb heat to reduce the temperature of the vibration motor, maintaining the temperature of the vibration motor within the set temperature threshold range includes:
In response to detecting that the temperature of the vibration motor is higher than the highest temperature in the temperature threshold range, electrons and holes in the metal device are controlled to move to the semiconductor device to form current, and the metal device absorbs heat to reduce the temperature of the vibration motor until the temperature of the vibration motor is reduced to be in the temperature threshold range.
In one embodiment, in response to detecting that the temperature of the vibration motor is not within the set temperature threshold range, controlling the heat absorption and release circuit to release heat to raise the temperature of the vibration motor, maintaining the temperature of the vibration motor within the set temperature threshold range, includes:
in response to detecting that the temperature of the vibration motor is below a lowest temperature within the temperature threshold range, electrons and holes in the semiconductor device are controlled to move to a metal device to form a current, and the metal device is caused to emit heat to raise the temperature of the vibration motor until the temperature of the vibration motor is raised to be within the temperature threshold range.
According to a fourth aspect of embodiments of the present disclosure, there is provided a temperature control device applied to the temperature compensation circuit in any one of the embodiments of the first aspect and the first aspect, the temperature control device including:
the acquisition module is used for acquiring the temperature of the vibration motor detected by the temperature sensor in real time;
And the response module is used for controlling the heat absorption and release circuit to absorb heat to reduce the temperature of the vibration motor or release heat to increase the temperature of the vibration motor in response to detecting that the temperature of the vibration motor is not in the set temperature threshold range, so that the temperature of the vibration motor is kept in the set temperature threshold range.
In one embodiment, the response module reduces the temperature of the motor by:
In response to detecting that the temperature of the vibration motor is higher than the highest temperature in the temperature threshold range, electrons and holes in the metal device are controlled to move to the semiconductor device to form current, and the metal device absorbs heat to reduce the temperature of the vibration motor until the temperature of the vibration motor is reduced to be in the temperature threshold range.
In one embodiment, the response module increases the temperature of the motor by:
in response to detecting that the temperature of the vibration motor is below a lowest temperature within the temperature threshold range, electrons and holes in the semiconductor device are controlled to move to a metal device to form a current, and the metal device is caused to emit heat to raise the temperature of the vibration motor until the temperature of the vibration motor is raised to be within the temperature threshold range.
According to a fifth aspect of the embodiments of the present disclosure, there is provided a temperature control apparatus, comprising:
A processor; a memory for storing processor-executable instructions; wherein the processor is configured to: the temperature control method described in any one of the embodiments of the third aspect and the third aspect is performed.
According to a sixth aspect of embodiments of the present disclosure, there is provided a non-transitory computer readable storage medium, which when executed by a processor of a network device, enables an electronic device to perform the temperature control method described in any one of the embodiments of the third aspect and the third aspect.
The technical scheme provided by the embodiment of the disclosure can comprise the following beneficial effects: through designing temperature compensating circuit, further carry out reasonable control through temperature compensating circuit to the temperature of motor, make the temperature of motor keep in preset temperature range, realized the damping uniformity of motor, further because vibration motor damping uniformity shortens vibration motor's response time, realized the motor play shake in the twinkling of an eye and with the uniformity of customized transient play shake effect.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the disclosure and together with the description, serve to explain the principles of the disclosure.
Fig. 1 is a block diagram illustrating a temperature compensation circuit according to an exemplary embodiment.
Fig. 2 is a block diagram illustrating yet another temperature compensation circuit according to an exemplary embodiment.
Fig. 3 is a circuit diagram illustrating a temperature compensation circuit according to an exemplary embodiment.
Fig. 4 is a flow chart illustrating a temperature control method according to an exemplary embodiment.
Fig. 5 is a schematic diagram illustrating a temperature control method temperature compensation circuit endothermic process according to an exemplary embodiment.
FIG. 6 is a schematic diagram illustrating a temperature control method temperature compensation circuit exothermal process according to an exemplary embodiment.
Fig. 7 is a block diagram illustrating a temperature control apparatus according to an exemplary embodiment.
Fig. 8 is a block diagram of an apparatus according to an example embodiment.
Detailed Description
Reference will now be made in detail to exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numbers in different drawings refer to the same or similar elements, unless otherwise indicated. The implementations described in the following exemplary examples are not representative of all implementations consistent with the present disclosure. Rather, they are merely examples of apparatus and methods consistent with some aspects of the present disclosure as detailed in the accompanying claims.
The temperature compensation circuit and the temperature control method provided by the embodiment of the disclosure are applied to the terminal provided with the tactile vibration feedback component. When a user uses a terminal provided with a tactile vibration feedback component, the temperature of the terminal rises due to the operation of the terminal application, so that the temperature of the vibration motor is affected, the damping of the vibration motor cannot be kept consistent, and the tactile feedback vibration component cannot respond to vibration feedback instantaneously.
The temperature compensation circuit is designed, the temperature of the vibration motor is reasonably controlled through the temperature compensation circuit, the temperature of the motor is kept within a preset temperature range, the damping consistency of the motor is realized, and further, the instantaneous vibration starting of the motor and the consistency of the transient effect of the terminal are realized.
The temperature compensation circuit according to the present disclosure will be described first with reference to practical applications.
Fig. 1 is a block diagram of a temperature compensation circuit for compensating for the temperature of a vibration motor, including a control assembly 104, a temperature sensor 102, and an endothermic and exothermic circuit 103, as shown in fig. 1, according to an exemplary embodiment.
The temperature sensor 102 is used to detect the temperature of the vibration motor.
The control unit 104 controls the heat absorption and release circuit 103 to absorb heat or release heat based on the temperature detected by the temperature sensor 102 to raise or lower the temperature of the vibration motor so that the temperature of the vibration motor is maintained within a set temperature threshold range.
The temperature sensor 102 may be provided inside the vibration motor or outside the vibration motor, and the placement position of the temperature sensor may be selected according to the structure of the space. The control component 104 may be a CPU (central processing unit).
The control component 104 receives the temperature of the vibration motor sent by the temperature sensor 102 in real time, and if the temperature of the vibration motor is higher or lower than a preset temperature threshold range, the heat absorption and release circuit 103 is controlled to absorb heat or release heat according to the preset temperature threshold and the temperature of the vibration motor, and the vibration motor is further cooled or heated, so that the vibration motor reaches the preset temperature threshold range.
The temperature compensation circuit can further control the temperature of the vibration motor through real-time detection of the temperature of the vibration motor and the heat absorption and release circuit 103, so that the damping consistency of the vibration motor is ensured.
Fig. 2 is a block diagram of a temperature compensation circuit according to an exemplary embodiment, and as shown in fig. 2, the endothermic/exothermic circuit 103 includes a metal device 1033, a semiconductor device 1031, and a power supply circuit 1032.
The power supply circuit 1032 is connected to the semiconductor device 1031, and the semiconductor device 1031 is connected in parallel to the metal device 1033.
The semiconductor device 1031 and the metal device 1033 are driven by the power supply circuit 1032 to perform electron movement and hole movement, and current is formed by controlling the electron movement direction and the hole movement direction so that the metal device 1033 absorbs heat or emits heat. When electrons and holes are controlled to move from the metal device 1033 toward the semiconductor device 1031, the metal device 1033 absorbs heat. When electrons and holes are controlled to move from the semiconductor device 1031 toward the mounted metal device 1033, the metal device 1033 emits heat.
The semiconductor device 1031 obtains free electrons and corresponding holes by obtaining energy at normal temperature. The present disclosure uses the characteristics of the semiconductor device 1031 described above to connect the metal device 1033 and the power supply circuit 1032, so that electrons and holes in the semiconductor device 1031 are moved in a specified direction by the energy supplied from the power supply circuit, forming a current including an electron current and a hole current. During movement of electrons and holes, if electrons and holes move to the semiconductor device 1031 through the metal device 1033, the metal device 1033 absorbs heat during movement of electrons and holes to the semiconductor device 1031, and if electrons and holes move to the metal device 1033 based on the semiconductor device 1031, the metal device 1033 releases heat during movement of electrons and holes to the metal device 1033.
Fig. 3 is a circuit diagram of a temperature compensation circuit according to an exemplary embodiment, as shown in fig. 3, in an exemplary embodiment of the present disclosure, the metal device 1033 is a metal sheet.
In an exemplary embodiment of the present disclosure, the semiconductor device 1031 includes a P-type semiconductor and an N-type semiconductor.
In an exemplary embodiment of the present disclosure, power circuit 1032 is a direct current power converter (DC) or a low dropout linear regulator (low dropout regulator, LDO).
In an exemplary embodiment of the present disclosure, the control component 104 is electrically connected to the power circuit 1032 to provide a voltage to the power circuit 1032.
The control component 104 provides a voltage to the power circuit 1032 via a power source, such as a lithium battery, and the power circuit 1032 converts according to the voltage provided by the control component 104 to provide a current to the heat absorption and release circuit 103.
Based on the temperature compensation circuit provided in the above embodiments, the present disclosure provides a terminal including a haptic feedback vibration assembly including a temperature compensation circuit, and the configuration of the temperature compensation circuit may be referred to the description of the above related embodiments, which will not be described in detail herein.
Based on the same inventive concept, the present disclosure also provides a temperature control method.
Fig. 4 is a flowchart illustrating a temperature control method according to an exemplary embodiment, and the temperature control method is used in a terminal as shown in fig. 4, and includes the following steps.
In step S41, the temperature of the vibration motor detected in real time by the temperature sensor is acquired.
In step S42, in response to detecting that the temperature of the vibration motor is not within the set temperature threshold range, the heat absorbing and releasing circuit is controlled to absorb or release heat to raise or lower the temperature of the vibration motor so that the temperature of the vibration motor is maintained within the set temperature threshold range.
When a user runs an application on the terminal, a control component of the terminal, such as a CPU, controls a temperature sensor of a temperature compensation circuit in the haptic feedback vibration component to detect the temperature of a vibration motor of the terminal in real time. And confirms whether the temperature of the vibration motor detected in real time is within a preset temperature threshold range. If the detected temperature of the vibration motor is higher than or lower than a preset temperature threshold range, the terminal control component controls the temperature compensation circuit to absorb heat or release heat, and controls the temperature of the vibration motor of the terminal to be kept within the preset threshold range.
In an exemplary embodiment of the present disclosure, the terminal detects that the temperature of the vibration motor is higher than the highest temperature within the temperature threshold range, as shown in fig. 5, the terminal control assembly controls the movement of electrons and holes of the semiconductor device in the temperature compensation circuit, wherein the holes move to one side of the semiconductor device through the metal device of the temperature compensation circuit, the electrons move to the other side of the semiconductor device through the metal device of the temperature compensation circuit, forming a current, and the metal device absorbs heat contrary to the current provided by the power supply circuit in the temperature compensation circuit, thereby decreasing the temperature of the vibration motor until the temperature of the vibration motor is decreased within the temperature threshold range. The control component of the terminal controls the temperature compensation circuit to stop absorbing heat.
In an exemplary embodiment of the present disclosure, when the terminal detects that the temperature of the vibration motor is lower than the lowest temperature within the temperature threshold range, as shown in fig. 6, the terminal control assembly controls the movement of electrons and holes of the semiconductor device in the temperature compensation circuit, at this time, the current provided by the power supply circuit in the temperature compensation circuit flows through the metal device on the side where the holes of the semiconductor device are located, the holes are moved by the metal device on the side of the semiconductor device, and heat is released from the metal device during the movement of the holes to the metal device. Meanwhile, electrons move from the other side of the semiconductor device to the metal device, and after the electrons move to the metal device, heat is released. Until the temperature of the vibration motor rises to within the temperature threshold range. The terminal control component controls the temperature compensation circuit to stop releasing heat.
The semiconductor device is formed by connecting an N-type semiconductor device and a P-type semiconductor device, and is connected with a power circuit. When current passes through, heat transfer is generated between the two ends, and the heat is transferred from one end to the other end, so that a temperature difference is generated to form a cold end and a hot end. Because the number of carriers in the semiconductor increases with increasing temperature, the number of carriers at the hot side of the semiconductor device is greater than the number of carriers at the cold side. For N-type semiconductor devices, some electrons move to the cold side, making the hot side more positive ions, the hot side potential higher than the cold side. For P-type semiconductor devices, holes move to the cold side and the hot side potential is lower than the cold side.
Electrons enter the P-type semiconductor device through the metal device and are combined with holes to release heat, cold ends absorb heat to generate electron-hole pairs, electrons enter the metal device, and holes are transmitted in the P-type semiconductor device; electrons enter the N-type semiconductor device through the metal, the electron energy level in the metal is lower than the conduction band electron energy level in the N-type semiconductor device, absorb heat, release heat at the hot end and enter the metal again, and finally return to the positive electrode of the power supply.
Electrons move to the metal device through the N-type semiconductor device, and at the moment, the potential energy of the N-type semiconductor device is higher than that of the metal device, so that the electrons release heat after moving to the metal device. Holes move to the metal device through the P-type semiconductor device, and the potential energy of the holes of the P-type semiconductor device is higher than that of the metal device, so that the holes emit heat in the process of moving from the P-type semiconductor device to the metal device.
In the temperature control method, the temperature of the vibration motor is controlled and regulated, so that the consistency of the temperature of the vibration motor is kept, the damping consistency of the vibration motor is ensured, the tactile feedback of the terminal is further more accurate, and the transient vibration and vibration stopping are realized.
The vibration motor referred to in the embodiments of the present disclosure may be a linear vibration motor.
Based on the same conception, the embodiment of the disclosure also provides a temperature control device.
It will be appreciated that, in order to achieve the above-mentioned functions, the temperature control apparatus provided in the embodiments of the present disclosure includes corresponding hardware structures and/or software modules that perform the respective functions. The disclosed embodiments may be implemented in hardware or a combination of hardware and computer software, in combination with the various example elements and algorithm steps disclosed in the embodiments of the disclosure. Whether a function is implemented as hardware or computer software driven hardware depends upon the particular application and design constraints imposed on the solution. Those skilled in the art may implement the described functionality using different approaches for each particular application, but such implementation is not to be considered as beyond the scope of the embodiments of the present disclosure.
Fig. 7 is a block diagram of a temperature control device according to an exemplary embodiment. Referring to fig. 7, a temperature control apparatus 700 for controlling a temperature compensation circuit to control a temperature of a vibration motor includes an acquisition module 701 and a response module 702.
The acquisition module 701 is configured to acquire the temperature of the vibration motor detected in real time by the temperature sensor. And a response module 702, configured to control the heat absorption and release circuit to absorb heat to reduce the temperature of the vibration motor or release heat to raise the temperature of the vibration motor in response to detecting that the temperature of the vibration motor is not within the set temperature threshold range, so as to maintain the temperature of the vibration motor within the set temperature threshold range.
In an embodiment of the present disclosure, the response module 702 reduces the temperature of the vibration motor in the following manner:
In response to detecting that the temperature of the vibration motor is higher than the highest temperature in the temperature threshold range, electrons and holes in the metal device are controlled to move to the semiconductor device to form current, so that the metal device absorbs heat to reduce the temperature of the vibration motor until the temperature of the vibration motor is reduced to be in the temperature threshold range.
In an embodiment of the present disclosure, the response module 702 increases the temperature of the vibration motor in the following manner:
In response to detecting that the temperature of the vibration motor is below a minimum temperature within a temperature threshold range, electrons and holes in the semiconductor device are controlled to move to the metal device to form a current, and the metal device is caused to emit heat to raise the temperature of the vibration motor until the temperature of the vibration motor is raised to be within the temperature threshold range.
The specific manner in which the various modules perform the operations in the apparatus of the above embodiments have been described in detail in connection with the embodiments of the method, and will not be described in detail herein.
Fig. 8 is a block diagram illustrating a temperature control device 800 according to an exemplary embodiment. For example, apparatus 800 may be a mobile phone, computer, digital broadcast terminal, messaging device, game console, tablet device, medical device, exercise device, personal digital assistant, or the like.
Referring to fig. 8, apparatus 800 may include one or more of the following components: a processing component 802, a memory 804, a power component 806, a multimedia component 808, an audio component 810, an input/output (I/O) interface 812, a sensor component 814, and a communication component 816.
The processing component 802 generally controls overall operation of the apparatus 800, such as operations associated with display, telephone calls, data communications, camera operations, and recording operations. The processing component 802 may include one or more processors 820 to execute instructions to perform all or part of the steps of the methods described above. Further, the processing component 802 can include one or more modules that facilitate interactions between the processing component 802 and other components. For example, the processing component 802 can include a multimedia module to facilitate interaction between the multimedia component 808 and the processing component 802.
The memory 804 is configured to store various types of data to support operations at the device 800. Examples of such data include instructions for any application or method operating on the device 800, contact data, phonebook data, messages, pictures, videos, and the like. The memory 804 may be implemented by any type or combination of volatile or nonvolatile memory devices such as Static Random Access Memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic memory, flash memory, magnetic or optical disk.
The power component 806 provides power to the various components of the device 800. The power components 806 may include a power management system, one or more power sources, and other components associated with generating, managing, and distributing power for the device 800.
The multimedia component 808 includes a screen between the device 800 and the user that provides an output interface. In some embodiments, the screen may include a Liquid Crystal Display (LCD) and a Touch Panel (TP). If the screen includes a touch panel, the screen may be implemented as a touch screen to receive input signals from a user. The touch panel includes one or more touch sensors to sense touches, swipes, and gestures on the touch panel. The touch sensor may sense not only the boundary of a touch or slide action, but also the duration and pressure associated with the touch or slide operation. In some embodiments, the multimedia component 808 includes a front camera and/or a rear camera. The front camera and/or the rear camera may receive external multimedia data when the device 800 is in an operational mode, such as a shooting mode or a video mode. Each front camera and rear camera may be a fixed optical lens system or have focal length and optical zoom capabilities.
The audio component 810 is configured to output and/or input audio signals. For example, the audio component 810 includes a Microphone (MIC) configured to receive external audio signals when the device 800 is in an operational mode, such as a call mode, a recording mode, and a voice recognition mode. The received audio signals may be further stored in the memory 804 or transmitted via the communication component 816. In some embodiments, audio component 810 further includes a speaker for outputting audio signals.
The I/O interface 812 provides an interface between the processing component 802 and peripheral interface modules, which may be a keyboard, click wheel, buttons, etc. These buttons may include, but are not limited to: homepage button, volume button, start button, and lock button.
The sensor assembly 814 includes one or more sensors for providing status assessment of various aspects of the apparatus 800. For example, the sensor assembly 814 may detect an on/off state of the device 800, a relative positioning of the components, such as a display and keypad of the apparatus 800, the sensor assembly 814 may also detect a change in position of the apparatus 800 or one component of the apparatus 800, the presence or absence of user contact with the apparatus 800, an orientation or acceleration/deceleration of the apparatus 800, and a change in temperature of the apparatus 800. The sensor assembly 814 may include a proximity sensor configured to detect the presence of nearby objects without any physical contact. The sensor assembly 814 may also include a light sensor, such as a CMOS or CCD image sensor, for use in imaging applications. In some embodiments, the sensor assembly 814 may also include an acceleration sensor, a gyroscopic sensor, a magnetic sensor, a pressure sensor, or a temperature sensor.
The communication component 816 is configured to facilitate communication between the apparatus 800 and other devices, either in a wired or wireless manner. The device 800 may access a wireless network based on a communication standard, such as WiFi,2G or 3G, or a combination thereof. In one exemplary embodiment, the communication component 816 receives broadcast signals or broadcast related information from an external broadcast management system via a broadcast channel. In one exemplary embodiment, the communication component 816 further includes a Near Field Communication (NFC) module to facilitate short range communications. For example, the NFC module may be implemented based on Radio Frequency Identification (RFID) technology, infrared data association (IrDA) technology, ultra Wideband (UWB) technology, bluetooth (BT) technology, and other technologies.
In an exemplary embodiment, the apparatus 800 may be implemented by one or more Application Specific Integrated Circuits (ASICs), digital Signal Processors (DSPs), digital Signal Processing Devices (DSPDs), programmable Logic Devices (PLDs), field Programmable Gate Arrays (FPGAs), controllers, microcontrollers, microprocessors, or other electronic elements for executing the methods described above.
In an exemplary embodiment, a non-transitory computer readable storage medium is also provided, such as memory 804 including instructions executable by processor 820 of apparatus 800 to perform the above-described method. For example, the non-transitory computer readable storage medium may be ROM, random Access Memory (RAM), CD-ROM, magnetic tape, floppy disk, optical data storage device, etc.
It is further understood that the term "plurality" in this disclosure means two or more, and other adjectives are similar thereto. "and/or", describes an association relationship of an association object, and indicates that there may be three relationships, for example, a and/or B, and may indicate: a exists alone, A and B exist together, and B exists alone. The character "/" generally indicates that the context-dependent object is an "or" relationship. The singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
It is further understood that the terms "first," "second," and the like are used to describe various information, but such information should not be limited to these terms. These terms are only used to distinguish one type of information from another and do not denote a particular order or importance. Indeed, the expressions "first", "second", etc. may be used entirely interchangeably. For example, first information may also be referred to as second information, and similarly, second information may also be referred to as first information, without departing from the scope of the present disclosure.
It will be further understood that although operations are depicted in the drawings in a particular order, this should not be understood as requiring that such operations be performed in the particular order shown or in sequential order, or that all illustrated operations be performed, to achieve desirable results. In certain circumstances, multitasking and parallel processing may be advantageous.
Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This application is intended to cover any adaptations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.
It is to be understood that the present disclosure is not limited to the precise arrangements and instrumentalities shown in the drawings, and that various modifications and changes may be effected without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.
Claims (10)
1. A temperature compensation circuit is characterized by comprising a control component, a temperature sensor and an endothermic and exothermic circuit, wherein the vibration motor is driven by a tactile feedback vibration component in a terminal, the vibration motor is used for simulating vibration or prompting, the tactile feedback vibration component is used for driving the vibration motor in a scene requiring tactile sensation,
The temperature sensor is connected with the vibration motor and is used for detecting the temperature of the vibration motor;
The control component is connected with the temperature sensor and is used for controlling the heat absorption and release circuit to absorb heat or release heat based on the temperature detected by the temperature sensor so as to raise or lower the temperature of the vibration motor to keep the temperature of the vibration motor in a set temperature threshold range;
the heat absorption and release circuit comprises a metal device, a semiconductor device and a power supply circuit;
The two ends of the power supply circuit are connected with the semiconductor devices connected with the two ends of the metal device respectively;
the semiconductor device and the metal device are driven by the power circuit to carry out electron movement and hole movement, and current is formed through the electron movement direction and the hole movement direction, so that the metal device absorbs heat or releases heat.
2. The temperature compensation circuit of claim 1 wherein said metal device is a metal sheet.
3. The temperature compensation circuit of claim 1 wherein said semiconductor device comprises a P-type semiconductor and an N-type semiconductor.
4. The temperature compensation circuit of claim 1 wherein the power supply circuit comprises a dc power converter or a low dropout linear regulator.
5. The temperature compensation circuit of claim 1 wherein said control assembly is electrically connected to said power circuit, said power circuit providing a voltage to said control assembly.
6. A terminal comprising a haptic feedback vibration assembly comprising a vibration motor for simulating vibration or cues and a temperature compensation circuit according to any one of claims 1 to 5, the vibration motor being a motor driven by the haptic feedback vibration assembly in the terminal, the haptic feedback vibration assembly being for driving the vibration motor in a scene where haptic sensations are required.
7. A temperature control method applied to the temperature compensation circuit according to any one of claims 1 to 5, the temperature control method comprising:
acquiring the temperature of a vibration motor detected in real time by a temperature sensor, wherein the vibration motor is a motor driven by a tactile feedback vibration component in a terminal, the vibration motor is used for simulating vibration or prompting, and the tactile feedback vibration component is used for driving the vibration motor in a scene requiring tactile sensation;
Controlling the heat absorption and release circuit to absorb heat to reduce the temperature of the vibration motor or release heat to raise the temperature of the vibration motor in response to detecting that the temperature of the vibration motor is not within a set temperature threshold range, so that the temperature of the vibration motor is kept within the set temperature threshold range;
wherein controlling the heat absorption and release circuit to absorb heat to reduce the temperature of the vibration motor in response to detecting that the temperature of the vibration motor is not within a set temperature threshold range, the vibration motor being kept at the set temperature threshold range for vibration, comprises:
Controlling electrons and holes in a metal device to move to a semiconductor device to form a current in response to detecting that the temperature of the vibration motor is higher than the highest temperature in the temperature threshold range, and enabling the metal device to absorb heat to reduce the temperature of the vibration motor until the temperature of the vibration motor is reduced to be in the temperature threshold range;
Wherein controlling the heat absorption and release circuit to release heat to raise the temperature of the vibration motor in response to detecting that the temperature of the vibration motor is not within a set temperature threshold range, the maintaining the temperature of the vibration motor within the set temperature threshold range comprises:
in response to detecting that the temperature of the vibration motor is below a lowest temperature within the temperature threshold range, electrons and holes in the semiconductor device are controlled to move to a metal device to form a current, and the metal device is caused to emit heat to raise the temperature of the vibration motor until the temperature of the vibration motor is raised to be within the temperature threshold range.
8. A temperature control device, characterized in that it is applied to the temperature compensation circuit according to any one of claims 1 to 5, comprising:
The acquisition module is used for acquiring the temperature of the vibration motor detected in real time by the temperature sensor, wherein the vibration motor is a motor driven by a tactile feedback vibration component in the terminal, the vibration motor is used for simulating vibration or prompting, and the tactile feedback vibration component is used for driving the vibration motor in a scene requiring tactile sensation;
a response module for controlling the heat absorption and release circuit to absorb heat to reduce the temperature of the vibration motor or release heat to raise the temperature of the vibration motor in response to detecting that the temperature of the vibration motor is not within a set temperature threshold range, so that the temperature of the vibration motor is maintained within the set temperature threshold range;
Wherein, in response to detecting that the temperature of the vibration motor is higher than the highest temperature in the temperature threshold range, electrons and holes in the metal device are controlled to move to the semiconductor device to form current, so that the metal device absorbs heat to reduce the temperature of the vibration motor until the temperature of the vibration motor is reduced to be in the temperature threshold range;
Wherein, in response to detecting that the temperature of the vibration motor is lower than the lowest temperature in the temperature threshold range, electrons and holes in the semiconductor device are controlled to move to the metal device to form a current, and the metal device is made to emit heat to raise the temperature of the vibration motor until the temperature of the vibration motor is raised to be in the temperature threshold range.
9. A temperature control apparatus, comprising:
a processor;
A memory for storing processor-executable instructions;
Wherein the processor is configured to: a temperature control method according to any one of claim 7.
10. A non-transitory computer readable storage medium, which when executed by a processor of a network device, causes an electronic device to perform the temperature control method of any of claims 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010408969.8A CN113670343B (en) | 2020-05-14 | 2020-05-14 | Temperature compensation circuit, terminal, temperature control method, temperature compensation device and storage medium |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010408969.8A CN113670343B (en) | 2020-05-14 | 2020-05-14 | Temperature compensation circuit, terminal, temperature control method, temperature compensation device and storage medium |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113670343A CN113670343A (en) | 2021-11-19 |
| CN113670343B true CN113670343B (en) | 2024-06-04 |
Family
ID=78537363
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010408969.8A Active CN113670343B (en) | 2020-05-14 | 2020-05-14 | Temperature compensation circuit, terminal, temperature control method, temperature compensation device and storage medium |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113670343B (en) |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001103771A (en) * | 1999-09-29 | 2001-04-13 | Canon Inc | Vibration motor temperature controlling device |
| KR100590693B1 (en) * | 2004-12-24 | 2006-06-19 | 주식회사 팬택 | Mobile communication terminal for controling heat generating by using thermoelectric semicondutor module and method therefor |
| CN201453855U (en) * | 2009-04-24 | 2010-05-12 | 贾会云 | Temperature-adjustable tourmaline health care device |
| CN204330698U (en) * | 2014-12-24 | 2015-05-13 | 江苏汉邦科技有限公司 | A kind of thermostat being applied to supercritical fluid chromatography system |
| CN204576313U (en) * | 2015-03-24 | 2015-08-19 | 安徽四创电子股份有限公司 | The permanent low temperature automatic control device of a kind of electronic equipment |
| CN105167504A (en) * | 2015-10-24 | 2015-12-23 | 苏州创必成电子科技有限公司 | Wireless charging heating and refrigerating controlled ultrasonic cup capable of achieving quick dissolving |
| CN105242715A (en) * | 2015-10-29 | 2016-01-13 | 上海斐讯数据通信技术有限公司 | Temperature control apparatus and device |
| CN105606236A (en) * | 2016-03-18 | 2016-05-25 | 西安交通大学 | Passive wireless temperature measurement sensor, and temperature measurement method thereof |
| CN106054075A (en) * | 2016-06-27 | 2016-10-26 | 联想(北京)有限公司 | Method for determining vibration motor driving parameter and electronic device |
| CN106356915A (en) * | 2016-08-30 | 2017-01-25 | 宇龙计算机通信科技(深圳)有限公司 | Temperature control device, temperature compensation method, temperature compensation device and terminal |
| CN110545340A (en) * | 2019-08-02 | 2019-12-06 | 维沃移动通信有限公司 | Vibration device of terminal equipment, control method and computer readable storage medium |
-
2020
- 2020-05-14 CN CN202010408969.8A patent/CN113670343B/en active Active
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001103771A (en) * | 1999-09-29 | 2001-04-13 | Canon Inc | Vibration motor temperature controlling device |
| KR100590693B1 (en) * | 2004-12-24 | 2006-06-19 | 주식회사 팬택 | Mobile communication terminal for controling heat generating by using thermoelectric semicondutor module and method therefor |
| CN201453855U (en) * | 2009-04-24 | 2010-05-12 | 贾会云 | Temperature-adjustable tourmaline health care device |
| CN204330698U (en) * | 2014-12-24 | 2015-05-13 | 江苏汉邦科技有限公司 | A kind of thermostat being applied to supercritical fluid chromatography system |
| CN204576313U (en) * | 2015-03-24 | 2015-08-19 | 安徽四创电子股份有限公司 | The permanent low temperature automatic control device of a kind of electronic equipment |
| CN105167504A (en) * | 2015-10-24 | 2015-12-23 | 苏州创必成电子科技有限公司 | Wireless charging heating and refrigerating controlled ultrasonic cup capable of achieving quick dissolving |
| CN105242715A (en) * | 2015-10-29 | 2016-01-13 | 上海斐讯数据通信技术有限公司 | Temperature control apparatus and device |
| CN105606236A (en) * | 2016-03-18 | 2016-05-25 | 西安交通大学 | Passive wireless temperature measurement sensor, and temperature measurement method thereof |
| CN106054075A (en) * | 2016-06-27 | 2016-10-26 | 联想(北京)有限公司 | Method for determining vibration motor driving parameter and electronic device |
| CN106356915A (en) * | 2016-08-30 | 2017-01-25 | 宇龙计算机通信科技(深圳)有限公司 | Temperature control device, temperature compensation method, temperature compensation device and terminal |
| CN110545340A (en) * | 2019-08-02 | 2019-12-06 | 维沃移动通信有限公司 | Vibration device of terminal equipment, control method and computer readable storage medium |
Non-Patent Citations (4)
| Title |
|---|
| DESIGN AND IMPLEMENTATION OF PERFORMANCE MONITORING OF DC MOTOR BASED ON MICROCONTROLLER AND TEMPERATURE CONTROL OF HEAT SINK;SS Ramprasad;International J. of Engg. Research & Indu;20111130;全文 * |
| 半导体激光器温度控制电路设计;霍佳皓;李洪祚;;现代电子技术;20131015(20);全文 * |
| 基于MC9S12C32的振动样品磁强计温度控制单元的设计;赵希;孙建中;朱澄;;科技资讯;20090503(13);全文 * |
| 硅微机械陀螺仪测控电路的温度补偿;曹慧亮;李宏生;王寿荣;杨波;黄丽斌;;光学精密工程;20131215(12);全文 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN113670343A (en) | 2021-11-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110796988B (en) | Backlight adjusting method and device | |
| EP3813223B1 (en) | Charging control method, device and storage medium | |
| CN113224822B (en) | Charging control method, device and storage medium | |
| CN107331910B (en) | Charging method and device | |
| CN113055966B (en) | Frequency band switching method, frequency band switching device and storage medium | |
| CN106325454B (en) | Power supply control device and method and electronic equipment | |
| CN106209471A (en) | Fault feedback method and device | |
| CN109862169B (en) | Electronic equipment control method, device and storage medium | |
| CN107734613B (en) | Power management method and device | |
| CN108874450B (en) | Method and device for waking up voice assistant | |
| CN106228933B (en) | Backlight circuit for lamp, method for implementing backlight and electronic equipment | |
| CN113670343B (en) | Temperature compensation circuit, terminal, temperature control method, temperature compensation device and storage medium | |
| CN104112460B (en) | Method and device for playing audio data | |
| CN107733021B (en) | Control method and device of electronic equipment | |
| CN107885464B (en) | Data storage method, device and computer readable storage medium | |
| CN111211380A (en) | Electronic equipment, and control method and device of heat conduction path | |
| CN113922457B (en) | Charging method, charging device, electronic equipment and storage medium | |
| CN106375744B (en) | Information projecting method and device | |
| CN113365188B (en) | Speaker control method, speaker control device, and storage medium | |
| CN108539823B (en) | Charging method and device | |
| CN116365623A (en) | Charging control method, device and medium | |
| CN116054294A (en) | Charging method, device, terminal and storage medium | |
| CN114336895B (en) | Charging method, charging device, terminal equipment and storage medium | |
| CN114006429B (en) | Charging method, charging device, terminal equipment and computer readable storage medium | |
| US12046926B2 (en) | Wireless charging transmitter, wireless charging control method, apparatus and system |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |