CN113669250A - Rubber pump testing system and method - Google Patents
Rubber pump testing system and method Download PDFInfo
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- CN113669250A CN113669250A CN202111091303.5A CN202111091303A CN113669250A CN 113669250 A CN113669250 A CN 113669250A CN 202111091303 A CN202111091303 A CN 202111091303A CN 113669250 A CN113669250 A CN 113669250A
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B51/00—Testing machines, pumps, or pumping installations
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Abstract
The invention discloses a system and a method for testing a rubber pump, wherein the system for testing the rubber pump comprises the following steps: the glue supply device is communicated with the glue inlet; the weight measuring device comprises a glue solution container and a weight obtaining device, and the glue solution container is communicated with the glue outlet; the controller is connected with the glue pump and used for setting the single glue outlet amount of the glue pump, controlling the glue pump to carry out glue outlet action and receiving the weight measurement information of the weight acquisition device. The invention effectively solves the problem that whether the precision of the glue pump meets the requirement or not can not be judged.
Description
Technical Field
The invention relates to semiconductor processing, in particular to a rubber pump testing system and a rubber pump testing method.
Background
In the semiconductor industry, photolithography processes are used in a wide variety of applications. The basic process of photolithography consists of steps of photoresist coating, exposure, development, etc. The photoresist itself can be in liquid form and can be delivered by a glue pump. However, the photoresist coating process requires a constant amount of photoresist, and thus the accuracy of the photoresist pump is particularly important.
In the prior art, no device or method for testing the glue output of the glue pump exists, so that the actual glue output of the glue pump cannot be measured, and whether the precision of the glue pump meets the requirement cannot be judged.
Disclosure of Invention
Therefore, the embodiment of the invention provides a system and a method for testing a rubber pump, which effectively solve the problem that whether the precision of the rubber pump meets the requirement cannot be judged.
In one aspect, a rubber pump testing system provided in an embodiment of the present invention includes: the glue supply device is communicated with the glue inlet; the weight measuring device comprises a glue solution container and a weight obtaining device, and the glue solution container is communicated with the glue outlet; the controller is connected with the glue pump and used for setting the single glue outlet amount of the glue pump, controlling the glue pump to carry out glue outlet action and receiving the weight measurement information of the weight acquisition device.
Compared with the prior art, the technical effect achieved after the technical scheme is adopted is as follows: the weight acquisition device is used for measuring the total weight of the glue solution container and the glue solution in the glue solution container, and the single glue output of the glue pump can be calculated after two times of continuous measurement, so that whether the glue output of the glue pump is accurate or not is judged; the glue pump acts for multiple times, so that the glue output of the glue pump for multiple times can be obtained, and the test result is more accurate; the controller can control the action of the glue pump, and the glue pump does not need to be continuously operated manually, so that the test process of the glue pump test system is more convenient.
In one embodiment of the present invention, the glue supply apparatus includes: the glue solution storage device is communicated with the glue inlet; and the pressurizing device is communicated with the glue solution storage device and is used for extruding the glue solution of the glue solution storage device.
The technical effect achieved after the technical scheme is adopted is as follows: the controller controls the pressurizing device, and the pressurizing device can realize timed and quantitative glue solution conveying, so that the labor is saved; and the pressurizing device can prevent the glue solution in the glue solution storage device from contacting with air to cause failure in the pressurizing process.
In one embodiment of the present invention, the glue supply apparatus further includes: and the glue solution buffer is communicated between the glue solution storage device and the glue inlet and is provided with at least one liquid level sensor.
The technical effect achieved after the technical scheme is adopted is as follows: the glue solution buffer is used for slowing down the flow rate of the glue solution and avoiding the damage of the glue pump due to overlarge flow rate of the glue solution; the liquid level sensor can detect the liquid level of the glue solution in the glue solution buffer, so that whether the glue solution is too little or not is judged, and gluing and emptying under the condition of too little glue solution are avoided; for example, when the liquid level is low, the liquid level sensor obtains a signal, and the controller controls the liquid pumping device to supplement the glue solution, so that the glue pump can be continuously detected, or when the liquid level is low, the glue pump testing system is controlled to be closed, and the glue solution is manually supplemented.
In one embodiment of the present invention, the glue supply apparatus further includes: and the filter is communicated between the glue solution storage device and the glue inlet.
The technical effect achieved after the technical scheme is adopted is as follows: the filter is used for filtering the glue solution led out by the glue solution storage device, and the influence of impurities in the pipeline on the accuracy of the glue pump test is avoided.
In one embodiment of the present invention, the glue pump testing system further comprises: and the liquid pumping device faces the glue solution container and can pump the glue solution in the glue solution container.
The technical effect achieved after the technical scheme is adopted is as follows: after the glue pump introduces the glue solution into the glue solution container for many times, the glue solution in the glue solution container can reach the maximum capacity, the liquid pumping device pumps the glue solution in the glue solution container, the glue solution can be prevented from overflowing out of the glue solution container, and the recycling of the glue solution can be ensured.
In one embodiment of the present invention, the glue pump testing system further comprises: a liquid extraction bracket; and the sliding assembly is arranged on the liquid pumping support and used for controlling the liquid pumping device to stretch into the glue solution container or to be far away from the glue solution container.
The technical effect achieved after the technical scheme is adopted is as follows: in the process of measuring the weight of the glue solution by the weight measuring device, the liquid pumping device is positioned outside the glue solution container, so that the liquid pumping device cannot be in contact with the glue solution and cannot influence the measurement result of the weight measuring device; and when the glue solution in the glue solution container reaches the maximum capacity, the liquid pumping device extends into the glue solution container again to realize the extraction and the cyclic utilization of the glue solution.
In one embodiment of the invention, one end of the liquid pumping device, which is far away from the glue solution container, is communicated with the glue supply device.
The technical effect achieved after the technical scheme is adopted is as follows: the liquid pumping device pumps the glue solution to the glue supply device, so that the glue solution is recycled.
On the other hand, the embodiment of the invention also provides a rubber pump testing method, which is characterized by further comprising the following steps: the controller is used for setting a preset glue outlet quantity A of the glue pump; the weight obtaining device obtains the weight m of the glue solution container before glue feeding0(ii) a The glue pump acts, and the glue is pumped out to the glue solution container; the weight obtaining device obtains the weight m of the glue solution container after glue feeding1(ii) a The controller calculates the actual glue output quantity delta m as m1-m0。
The technical effect achieved after the technical scheme is adopted is as follows: according to the weight change of the glue solution container before and after glue feeding, the actual glue output of the glue pump can be accurately obtained; correspondingly, the glue solution container feeds glue for multiple times, so that multiple actual glue output amounts can be obtained, and the accuracy is improved; the controller controls and calculates, uses manpower sparingly, improves detection efficiency.
In an embodiment of the present invention, after the controller calculates the actual glue amount Δ m, the glue pump testing method further includes: judgment mnWhether the glue solution recycling condition m is metn≥mmax(ii) a If so, controlling a liquid pumping device to pump the glue liquid in the glue liquid container; if not, the glue pump action is repeated, glue is discharged to the glue solution container, and the subsequent steps are sequentially carried out; wherein m ismaxThe maximum volume of the glue solution container.
The technical effect achieved after the technical scheme is adopted is as follows: the controller controls the liquid pumping device to recover the glue solution, so that the excessive glue solution in the glue solution container is avoided, the glue solution is recycled, and the glue pump testing method is continuously performed.
In one embodiment of the present invention, the actuating the glue pump to pump glue out of the glue container includes: the glue supply device conveys glue liquid to a glue inlet of the glue pump, and the glue pump acts to convey the glue liquid to the glue liquid container from a glue outlet of the glue pump.
The technical effect achieved after the technical scheme is adopted is as follows: the glue supply device automatically conveys glue liquid, saves labor, avoids too much or too little glue liquid conveying, and avoids the glue liquid from losing efficacy due to air entering in the conveying process.
In one embodiment of the invention, the glue supply device is provided with a glue solution buffer; the glue pump testing method further comprises the following steps: and judging whether the liquid level of the glue solution buffer reaches the designated liquid level, and if so, controlling the liquid pumping device to act or stopping the glue pump test system.
The technical effect achieved after the technical scheme is adopted is as follows: when the liquid level in the glue solution buffer is too low, the liquid pumping device is controlled to act to supplement the glue solution, so that the glue solution can be prevented from being emptied.
In summary, the above embodiments of the present application may have one or more of the following advantages or benefits: i) the glue pump testing system obtains the total weight of the glue solution container and the glue solution therein for multiple times through the weight obtaining device, and can obtain the difference value of every two adjacent weights, namely the single actual glue output of the glue pump, so as to judge whether the actual glue output meets the preset glue output of the glue pump, and realize the detection of the glue pump, thereby being more rapid and accurate; ii) the detection process is controlled by the controller without manual operation or monitoring, thereby saving manpower; iii) the glue pump test system realizes glue solution recycling through the liquid pumping device, and realizes long-time continuous test; iv) the glue solution buffer can prevent the glue solution from emptying when the glue solution is too low through the monitoring of the liquid level sensor, so that the detection error of the glue pump test system is reduced.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a rubber pump testing system according to a first embodiment of the present invention.
Fig. 2 is a schematic structural diagram of a rubber pump testing system according to an embodiment of the present invention.
Fig. 3 is a schematic structural view of the glue supply device in fig. 1.
Fig. 4 is a schematic structural diagram of the glue pump in fig. 1.
Fig. 5 is a schematic structural view of the weight measuring device and the liquid pumping device in fig. 1.
Fig. 6 is a schematic structural diagram of the controller in fig. 1.
Fig. 7 is a flowchart of a method for testing a rubber pump according to a second embodiment of the present invention.
Fig. 8 is a schematic flow chart of a method for testing the glue pump in fig. 7.
Fig. 9 is a flowchart of step S7.
Description of the main element symbols:
100 is a rubber pump test system; 110 is a glue pump; 111 is a glue inlet; 112 is a glue outlet; 120 is a glue supply device; 121 is a glue solution storage device; 123 is a glue solution buffer; 1231 is a first level sensor; 1232 is a second level sensor; 1233 is a manual valve; 124 is a filter; 130 is a weight measuring device; 131 is a glue solution container; 132 is a weight acquisition device; 133 is a dropper; 134 is a dropper bracket; 140 is a controller; 141 electrical control components; 142 is a display; 143 is a solenoid valve set; 144 is a control button; 150 is a liquid pumping device; 151 is an extraction bracket; 152 is a slide assembly.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
[ first embodiment ] A method for manufacturing a semiconductor device
Referring to fig. 1-2, an embodiment of the present invention provides a glue pump testing system 100 for testing the glue output of a glue pump 110. The glue pump 110 is provided with a glue inlet 111 and a glue outlet 112. The glue pump testing system 100 includes, for example: the glue supply device 120, the weight measuring device 130 and the controller 140, wherein the glue supply device 120 is communicated with the glue inlet 111 and used for conveying glue solution to the glue pump 110; the weight measuring device 130 comprises a glue solution container 131 and a weight obtaining device 132, the glue solution container 131 is communicated with the glue outlet 112, and weight measuring information is obtained through the weight obtaining device 132 after the glue pump 110 conveys glue solution to the glue solution container 131; the controller 140 is connected to the glue pump 110, and the controller 140 is configured to set a single glue discharging amount of the glue pump 110, control the glue pump 110 to perform a glue discharging operation, and receive the weight measurement information of the weight obtaining device 132.
In this embodiment, the actual glue output of the glue pump 110 can be calculated through the weight measurement information, so as to accurately determine whether the precision of the glue pump 110 meets the requirement; and the weight measurement information is measured for many times, so that a plurality of groups of actual glue output amounts can be obtained, the test accuracy of the glue pump test system 100 is improved, the labor is saved, and the test efficiency is improved.
In a specific embodiment, with reference to fig. 2 and 3, the glue supply device 120 includes, for example: a glue solution storage device 121 and a pressurizing device. Wherein, the glue solution storage device 121 is communicated with the glue inlet 111; the pressurizing device is communicated with the glue solution storage device 121 and is used for extruding the glue solution of the glue solution storage device 121.
Preferably, the pressurizing device is, for example, a nitrogen pressurizing method, and the glue solution storage device 121 is, for example, a glue bottle. The pressurizing device extrudes the glue solution in the glue solution storage device 121 through nitrogen, so that the failure caused by the contact of the glue solution and air can be avoided; meanwhile, the controller 140 controls the on/off of the pressurizing device, so that the glue discharging amount of the glue solution storage device 121 can be accurately controlled, and the manual control is more convenient and accurate.
In a specific embodiment, the glue supply device 120 further includes, for example: and the glue solution buffer 123 is communicated between the glue solution storage device 121 and the glue inlet 111 and is used for slowing down the flow rate of the glue solution.
Preferably, the glue solution buffer 123 is provided with at least one liquid level sensor for detecting a low liquid level condition of the glue solution buffer 123, so as to avoid emptying the glue solution caused by too little glue solution in the glue solution buffer 123. For example, the liquid level sensor includes a first liquid level sensor 1231 and a second liquid level sensor 1232, wherein the first liquid level sensor 1231 is disposed in the middle of the inner cavity of the glue buffer 123, and the second liquid level sensor 1232 is disposed at the bottom of the glue buffer 123.
When the liquid level of the glue solution is located at the position of the first liquid level sensor 1231, the glue solution is less, and the glue solution can be added into the glue solution buffer 123 to avoid emptying the glue solution; when the liquid level of the glue solution is at the second liquid level sensor 1232, the glue solution is added to the glue solution buffer 123, which cannot be replenished for a short time, and the glue pump test system 100 can be turned off at this time.
Further, the glue buffer 123 is provided with a manual valve 1233, for example, so as to manually control the conduction of the glue buffer 123.
In a specific embodiment, the glue supply device 120 further includes, for example: and the filter 124 is communicated between the glue solution storage device 121 and the glue inlet 111. The filter 124 is used for filtering the glue solution, so as to prevent impurities in the glue solution from affecting the precision of the glue pump testing system 100 and prevent the glue pump 110 from operating abnormally.
On the basis of the glue solution buffer 123, the filter 124 may be disposed before the glue solution buffer 123, or disposed after the glue solution buffer 123.
In a specific embodiment, referring to fig. 2 and 4, the glue pump 110 is provided with a cylinder, and the glue inlet 111 and the glue outlet 112 of the glue pump 110 are provided with one-way valves (not shown). When the air cylinder sucks air, the glue pump 110 can control the glue solution to enter from the glue inlet 111, and the glue solution at the glue outlet 112 cannot enter from the glue outlet 112; when the air cylinder exhausts, the glue pump 110 can control the glue solution to be discharged from the glue outlet 112, and the glue solution in the glue inlet 111 cannot be discharged from the glue inlet 111.
In a specific embodiment, referring to fig. 2 and 5, the glue container 131 is a beaker, for example, and the weight obtaining device 132 is a platform scale, for example, without limitation. The glue solution container 131 is arranged on the weight obtaining device 132, so that the weight obtaining device 132 can obtain the mass of the glue solution container 131, or the total mass of the glue solution container 131 and the glue solution therein, and the actual glue output amount of the glue pump 110 can be obtained according to two continuous measurement values.
Certainly, scales may also be set on the glue solution container 131 to obtain the variation of the glue solution in the glue solution container 131, which is not described herein again.
In a specific embodiment, the weighing device 130 further includes, for example, a dropper 133, a dropper bracket 134 is disposed on either side of the glue container 131, and the dropper 133 is fixed to the dropper bracket 134 and located above the glue container 131. The glue outlet 112 is communicated with a dropper 133, and the glue solution is slowly added into the glue solution container 131 through the dropper 133, so that the error between the glue outlet amount of the glue outlet 112 and the actual glue outlet amount measured by the weight obtaining device 132 is reduced, and the precision of the weight measuring device 130 is improved.
Preferably, the glue solution container 131 has a maximum capacity, and when the glue solution in the glue solution container 131 reaches the maximum capacity, the glue solution in the glue solution container 131 is pumped out, so that the glue pump test system 100 can continue to perform the test. The maximum volume may be an actual maximum volume of the glue solution container 131, or may be any preset value, which is not limited herein.
In a particular embodiment, the glue pump testing system 100, for example, further comprises: and a liquid extraction device 150, wherein the liquid extraction device 150 faces the glue solution container 131 and can extract the glue solution in the glue solution container 131. For example, the pumping device 150 is, but not limited to, an air cylinder or a hydraulic cylinder.
Preferably, the glue pump testing system 100 further comprises, for example: a liquid pumping bracket 151 and a sliding assembly 152, wherein the liquid pumping bracket 151 is arranged at one side of the glue solution container 131 and is used for fixing the liquid pumping device 150; the sliding assembly 152 is disposed on the pumping support 151, for example, between the pumping support 151 and the pumping device 150, such that the pumping support 151 is slidably connected to the pumping device 150.
Further, the sliding assembly 152 is vertically arranged, so as to control the liquid pumping device 150 to extend into the glue solution container 131 or to be far away from the glue solution container 131. When the dropper 133 is in the liquid adding process, the sliding assembly 152 controls the liquid pumping device 150 to be positioned above the glue solution container 131 and higher than the maximum capacity position of the glue solution container 131, so that the liquid pumping device 150 is prevented from influencing the display number of the weight obtaining device 132; when the glue solution in the glue solution container 131 reaches the maximum volume, the sliding assembly 152 controls the liquid pumping device 150 to contact with the glue solution, so as to pump the glue solution, and the glue solution container 131 can continuously add the liquid to measure the glue discharging amount.
The sliding assembly 152 is, for example, a sliding cylinder, but may also be a screw rod, which is not limited herein.
Preferably, one end of the liquid pumping device 150, which is far away from the glue solution container 131, is communicated with the glue supply device 120. For example, the fluid extraction device 150 is in communication with the filter 124. When the glue solution in the glue solution container 131 reaches the maximum capacity, the liquid pumping device 150 pumps the glue solution to the filter 124, and the glue solution enters the glue inlet 111 of the glue pump 110 again after being filtered, so that the recycling of the glue solution is realized.
Of course, the liquid pumping device 150 can also be connected to the glue solution buffer 123 or the glue solution storage device 121, and will not be described herein.
Preferably, on the basis of the first liquid level sensor 1231 and the second liquid level sensor 1232, when the glue solution in the glue solution buffer 123 triggers the first liquid level sensor 1231, the liquid pumping device 150 pumps the glue solution in the glue solution container 131 to the filter 124; when the glue solution in the glue solution buffer 123 triggers the second liquid level sensor 1232, the glue pump testing system 100 is stopped.
In one particular embodiment, in conjunction with fig. 2 and 6, controller 140 includes, for example, an electrical control assembly 141, a display 142, and a solenoid valve block 143. The electrical control assembly 141 is configured to receive a signal of the liquid level sensor, control the pressurizing device, the glue pump 110, the liquid pumping device 150, or the electromagnetic valve group 143 to operate, obtain the weight measurement information detected by the weight obtaining device 132, and calculate an actual glue output of the glue pump 110; the display 142 is used for displaying or setting a preset glue discharging amount of the glue pump 110, and displaying the weight measuring information of the weight obtaining device 132 and an actual glue discharging amount of the glue pump 110; the electromagnetic valve set 143 can be disposed at the glue outlet 112, the glue inlet 111, or the liquid pumping device 150, which is not limited herein, and the electrical control assembly 141 controls on/off of the electromagnetic valve set 143.
Further, the controller 140 includes, for example: a control button 144 for manually controlling the opening or closing of the adhesive pump testing system 100.
[ second embodiment ]
Referring to fig. 7-8, a second embodiment of the present invention provides a glue pump testing method, for example, comprising:
s1: the controller 140 sets a preset glue discharging amount a of the glue pump 110;
s2: the weight obtaining device 132 obtains the weight m of the glue solution container 131 before glue feeding0
S3: the glue pump 110 is operated, and the glue pump 110 discharges glue to the glue solution container 131;
s4: the weight obtaining device 132 obtains the weight m of the glue solution container 131 after glue feeding1；
S5: the controller 140 calculates the actual glue output Δ m ═ m1-m0。
In a specific embodiment, it should be noted that, when the glue pump test method is performed multiple times, the weight difference obtained by the weight obtaining device 132 before and after the glue discharging operation is used as the actual glue discharging amount. For example, the first actual glue output Δ m1＝m1-m0(ii) a The second actual glue yield Delta m1＝m2-m1(ii) a Wherein m is2After the glue solution container 131 is filled with glue for the second time, the weight obtaining device 132 obtains a numerical value, which is not described herein again.
In another specific embodiment, the actual glue output can also be measured according to the volume of glue in the glue container 131. For example, a scale or a liquid level sensor may be disposed on the glue container 131. Correspondingly, step S2 may also be to obtain the liquid level of the glue solution container 131 before glue feeding; step S4 may also be to obtain the liquid level of the glue solution container 131 after glue feeding; in step S5, the controller 140 may also obtain the liquid level difference between the liquid level before and after the glue is fed into the glue container 131, and calculate the glue yield.
In a specific embodiment, after the controller 140 calculates the actual glue amount Δ m, the glue pump testing method further includes:
step S6: judgment mnWhether the glue solution recycling condition m is metn≥mmaxIf yes, controlling the liquid pumping device 150 to pump the glue solution in the glue solution container 131; if not, the action of the glue pump 110 is repeated, glue is discharged to the glue solution container 131, and the subsequent steps are sequentially carried out.
Wherein m ismaxThe maximum volume of the glue solution container 131; n is the number of times of glue feeding of the glue solution container 131; m isnWhen the glue solution is fed into the glue solution container 131 for the nth time, the weight obtaining device 132 obtains the total weight of the glue solution container 131 and the glue solution.
It should be noted that the controller 140 controls the liquid pumping device 150 to pump the glue solution in the glue solution container 131 to the glue supply device 120, for example, to pump the glue solution to the glue solution storage device 121, the glue solution buffer 123 or the filter 124, so as to realize recycling of the glue solution, which is not limited herein.
In a specific embodiment, the discharging of the glue from the glue pump 110 to the glue container 131 includes: the glue supply device 120 delivers the glue solution to the glue inlet 111 of the glue pump 110, and the glue pump 110 operates to deliver the glue solution from the glue outlet 112 of the glue pump 110 to the glue solution container 131. For example, the controller 140 controls the pressurizing device to operate, the pressurizing device extrudes the glue solution in the glue solution storage device 121 to the glue solution buffer 123, the glue solution enters the filter 124 after being buffered, and then is introduced into the glue inlet 111; the controller 140 controls the glue pump 110 to operate at a preset glue discharge amount a, so as to lead out the glue solution from the glue outlet 112, gradually add the glue solution into the glue solution container 131 through the dropper 133, and stop the glue pump 110 after the preset glue discharge amount a is completed.
In a specific embodiment, referring to fig. 9, on the basis that the glue supplying device 120 is provided with the glue buffer 123, the glue pump testing method further includes, for example:
step S7: judging whether the liquid level of the glue solution buffer 123 reaches a specified liquid level, and if so, controlling the liquid pumping device 150 to act or stopping the glue pump testing system 100; if not, the glue pump test system 100 proceeds normally.
It should be noted that, when the liquid level of the glue solution in the glue solution buffer 123 is lowered to the position of the first liquid level sensor 1231, the controller 140 obtains the first signal, and controls the liquid pumping device 150 to operate, so as to pump the glue solution in the glue solution container 131 to the filter 124; when the level of the glue solution in the glue solution buffer 123 decreases to the position of the second liquid level sensor 1232, the controller 140 obtains a second signal, and at this time, the glue pump testing system 100 is turned off. Wherein, the liquid level corresponding to the first liquid level sensor 1231 is higher than the liquid level corresponding to the second liquid level sensor 1232.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (11)
1. The utility model provides a glue pump test system, it is equipped with into gluey mouth and goes out gluey mouth to glue the pump, its characterized in that, it includes to glue pump test system:
the glue supply device is communicated with the glue inlet;
the weight measuring device comprises a glue solution container and a weight obtaining device, and the glue solution container is communicated with the glue outlet;
the controller is connected with the glue pump and used for setting the single glue outlet amount of the glue pump, controlling the glue pump to carry out glue outlet action and receiving the weight measurement information of the weight acquisition device.
2. The glue pump testing system of claim 1, wherein the glue supply includes:
the glue solution storage device is communicated with the glue inlet;
and the pressurizing device is communicated with the glue solution storage device and is used for extruding the glue solution of the glue solution storage device.
3. The glue pump testing system of claim 2, wherein the glue supply further comprises:
and the glue solution buffer is communicated between the glue solution storage device and the glue inlet and is provided with at least one liquid level sensor.
4. The glue pump testing system of claim 2, wherein the glue supply further comprises:
and the filter is communicated between the glue solution storage device and the glue inlet.
5. The glue pump testing system of any one of claims 1-4 further comprising:
and the liquid pumping device faces the glue solution container and can pump the glue solution in the glue solution container.
6. The glue pump testing system of claim 5, further comprising:
a liquid extraction bracket;
and the sliding assembly is arranged on the liquid pumping support and used for controlling the liquid pumping device to stretch into the glue solution container or to be far away from the glue solution container.
7. The glue pump testing system of claim 5, wherein an end of the liquid extraction device, which is away from the glue solution container, is in communication with the glue supply device.
8. A method for testing a rubber pump is characterized by comprising the following steps:
the controller is used for setting a preset glue outlet quantity A of the glue pump;
weight gainThe taking device obtains the weight m of the glue solution container before glue feeding0；
The glue pump acts, and the glue is pumped out to the glue solution container;
the weight obtaining device obtains the weight m of the glue solution container after glue feeding1；
The controller calculates the actual glue output quantity delta m as m1-m0。
9. The method for testing a glue pump according to claim 8, wherein after the controller calculates the actual glue amount Δ m, the method further comprises: judgment mnWhether the glue solution recycling condition m is metn≥mmax；
If so, controlling a liquid pumping device to pump the glue liquid in the glue liquid container;
if not, the glue pump action is repeated, glue is discharged to the glue solution container, and the subsequent steps are sequentially carried out;
wherein m ismaxThe maximum volume of the glue solution container.
10. The method for testing a glue pump according to claim 8, wherein the glue pump is activated to pump glue out of the glue container, and the method comprises:
the glue supply device conveys glue liquid to a glue inlet of the glue pump, and the glue pump acts to convey the glue liquid to the glue liquid container from a glue outlet of the glue pump.
11. The method for testing a glue pump according to claim 10, wherein the glue supply device is provided with a glue buffer;
the glue pump testing method further comprises the following steps:
and judging whether the liquid level of the glue solution buffer reaches the designated liquid level, and if so, controlling the liquid pumping device to act or stopping the glue pump test system.
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN205288803U (en) * | 2016-01-08 | 2016-06-08 | 长安马自达汽车有限公司 | Sealed scrap rubber recycle device of gluing |
| CN206882053U (en) * | 2017-06-15 | 2018-01-16 | 大连天马可溶制品有限公司 | Glue reclaims automaton |
| CN109701812A (en) * | 2018-12-27 | 2019-05-03 | 北海绩迅电子科技有限公司 | A kind of dispenser and the adhesive dispensing method applied to print cartridge |
| CN210805700U (en) * | 2019-12-24 | 2020-06-19 | 中芯长电半导体（江阴）有限公司 | Automatic glue filling device and semiconductor packaging equipment |
| CN211726379U (en) * | 2019-12-25 | 2020-10-23 | 江苏宇驰包装股份有限公司 | Circulated formula glue sprayer for packaging bag production line |
| CN212681539U (en) * | 2020-06-12 | 2021-03-12 | 青岛德林科姆电子科技有限公司 | Glue amount automatic adjustment gluing robot |
| CN212931602U (en) * | 2020-08-15 | 2021-04-09 | 苏州润邦半导体材料科技有限公司 | Optical collagen material extracting and weighing device |
-
2021
- 2021-09-17 CN CN202111091303.5A patent/CN113669250B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN205288803U (en) * | 2016-01-08 | 2016-06-08 | 长安马自达汽车有限公司 | Sealed scrap rubber recycle device of gluing |
| CN206882053U (en) * | 2017-06-15 | 2018-01-16 | 大连天马可溶制品有限公司 | Glue reclaims automaton |
| CN109701812A (en) * | 2018-12-27 | 2019-05-03 | 北海绩迅电子科技有限公司 | A kind of dispenser and the adhesive dispensing method applied to print cartridge |
| CN210805700U (en) * | 2019-12-24 | 2020-06-19 | 中芯长电半导体（江阴）有限公司 | Automatic glue filling device and semiconductor packaging equipment |
| CN211726379U (en) * | 2019-12-25 | 2020-10-23 | 江苏宇驰包装股份有限公司 | Circulated formula glue sprayer for packaging bag production line |
| CN212681539U (en) * | 2020-06-12 | 2021-03-12 | 青岛德林科姆电子科技有限公司 | Glue amount automatic adjustment gluing robot |
| CN212931602U (en) * | 2020-08-15 | 2021-04-09 | 苏州润邦半导体材料科技有限公司 | Optical collagen material extracting and weighing device |
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| CN113669250B (en) | 2023-07-07 |
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