CN113667306A - Light diffusion type organic silicon composite material and preparation method thereof - Google Patents
Light diffusion type organic silicon composite material and preparation method thereof Download PDFInfo
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- CN113667306A CN113667306A CN202010412035.1A CN202010412035A CN113667306A CN 113667306 A CN113667306 A CN 113667306A CN 202010412035 A CN202010412035 A CN 202010412035A CN 113667306 A CN113667306 A CN 113667306A
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- 239000002131 composite material Substances 0.000 title claims abstract description 38
- 238000009792 diffusion process Methods 0.000 title claims abstract description 30
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 27
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 27
- 239000010703 silicon Substances 0.000 title claims abstract description 27
- 238000002360 preparation method Methods 0.000 title abstract description 11
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 22
- -1 polydimethylsiloxane Polymers 0.000 claims abstract description 12
- 239000012763 reinforcing filler Substances 0.000 claims abstract description 12
- 239000004205 dimethyl polysiloxane Substances 0.000 claims abstract description 11
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims abstract description 11
- 239000003054 catalyst Substances 0.000 claims abstract description 10
- 239000003431 cross linking reagent Substances 0.000 claims abstract description 10
- 239000007788 liquid Substances 0.000 claims abstract description 8
- 239000002994 raw material Substances 0.000 claims abstract description 6
- 229920001971 elastomer Polymers 0.000 claims abstract description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 16
- 239000006229 carbon black Substances 0.000 claims description 12
- 238000006243 chemical reaction Methods 0.000 claims description 8
- 150000001875 compounds Chemical class 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 8
- 238000003756 stirring Methods 0.000 claims description 8
- 239000000853 adhesive Substances 0.000 claims description 6
- 230000001070 adhesive effect Effects 0.000 claims description 6
- 150000001335 aliphatic alkanes Chemical class 0.000 claims description 6
- 239000004014 plasticizer Substances 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 5
- 239000000049 pigment Substances 0.000 claims description 5
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 claims description 4
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 claims description 4
- 239000012975 dibutyltin dilaurate Substances 0.000 claims description 4
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 claims description 3
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 claims description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 2
- NBJODVYWAQLZOC-UHFFFAOYSA-L [dibutyl(octanoyloxy)stannyl] octanoate Chemical compound CCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCC NBJODVYWAQLZOC-UHFFFAOYSA-L 0.000 claims description 2
- XQBCVRSTVUHIGH-UHFFFAOYSA-L [dodecanoyloxy(dioctyl)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCCCCCC)(CCCCCCCC)OC(=O)CCCCCCCCCCC XQBCVRSTVUHIGH-UHFFFAOYSA-L 0.000 claims description 2
- 125000003342 alkenyl group Chemical group 0.000 claims description 2
- 125000002947 alkylene group Chemical group 0.000 claims description 2
- 239000013522 chelant Substances 0.000 claims description 2
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 claims description 2
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 claims description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 2
- 238000001556 precipitation Methods 0.000 claims description 2
- 229910000077 silane Inorganic materials 0.000 claims description 2
- ZQZCOBSUOFHDEE-UHFFFAOYSA-N tetrapropyl silicate Chemical compound CCCO[Si](OCCC)(OCCC)OCCC ZQZCOBSUOFHDEE-UHFFFAOYSA-N 0.000 claims description 2
- VXUYXOFXAQZZMF-UHFFFAOYSA-N titanium(IV) isopropoxide Chemical compound CC(C)O[Ti](OC(C)C)(OC(C)C)OC(C)C VXUYXOFXAQZZMF-UHFFFAOYSA-N 0.000 claims description 2
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 claims description 2
- HQYALQRYBUJWDH-UHFFFAOYSA-N trimethoxy(propyl)silane Chemical compound CCC[Si](OC)(OC)OC HQYALQRYBUJWDH-UHFFFAOYSA-N 0.000 claims description 2
- 229920001296 polysiloxane Polymers 0.000 claims 1
- 238000002834 transmittance Methods 0.000 abstract description 14
- 239000003292 glue Substances 0.000 abstract description 9
- 239000002210 silicon-based material Substances 0.000 abstract description 9
- 238000004382 potting Methods 0.000 abstract description 6
- 125000003545 alkoxy group Chemical group 0.000 abstract description 2
- 125000003118 aryl group Chemical group 0.000 abstract description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 abstract description 2
- 239000000463 material Substances 0.000 description 11
- 230000000052 comparative effect Effects 0.000 description 9
- 239000000843 powder Substances 0.000 description 8
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 description 7
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 description 7
- 238000002156 mixing Methods 0.000 description 5
- 238000011056 performance test Methods 0.000 description 5
- 239000011324 bead Substances 0.000 description 4
- 238000010276 construction Methods 0.000 description 4
- 230000007547 defect Effects 0.000 description 4
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- XCJYREBRNVKWGJ-UHFFFAOYSA-N copper(II) phthalocyanine Chemical compound [Cu+2].C12=CC=CC=C2C(N=C2[N-]C(C3=CC=CC=C32)=N2)=NC1=NC([C]1C=CC=CC1=1)=NC=1N=C1[C]3C=CC=CC3=C2[N-]1 XCJYREBRNVKWGJ-UHFFFAOYSA-N 0.000 description 3
- 239000004005 microsphere Substances 0.000 description 3
- 235000012431 wafers Nutrition 0.000 description 3
- KCXZNSGUUQJJTR-UHFFFAOYSA-N Di-n-hexyl phthalate Chemical compound CCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCC KCXZNSGUUQJJTR-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000003153 chemical reaction reagent Substances 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 229910021485 fumed silica Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000003094 microcapsule Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 239000012812 sealant material Substances 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- 241000251468 Actinopterygii Species 0.000 description 1
- 208000020564 Eye injury Diseases 0.000 description 1
- 241000598860 Garcinia hanburyi Species 0.000 description 1
- 235000000177 Indigofera tinctoria Nutrition 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- NRCMAYZCPIVABH-UHFFFAOYSA-N Quinacridone Chemical compound N1C2=CC=CC=C2C(=O)C2=C1C=C1C(=O)C3=CC=CC=C3NC1=C2 NRCMAYZCPIVABH-UHFFFAOYSA-N 0.000 description 1
- RGCKGOZRHPZPFP-UHFFFAOYSA-N alizarin Chemical compound C1=CC=C2C(=O)C3=C(O)C(O)=CC=C3C(=O)C2=C1 RGCKGOZRHPZPFP-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 230000003796 beauty Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000002775 capsule Substances 0.000 description 1
- 239000004106 carminic acid Substances 0.000 description 1
- 235000012730 carminic acid Nutrition 0.000 description 1
- 229910052956 cinnabar Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229940080423 cochineal Drugs 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 208000002173 dizziness Diseases 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229940117709 gamboge Drugs 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 229940097275 indigo Drugs 0.000 description 1
- COHYTHOBJLSHDF-UHFFFAOYSA-N indigo powder Natural products N1C2=CC=CC=C2C(=O)C1=C1C(=O)C2=CC=CC=C2N1 COHYTHOBJLSHDF-UHFFFAOYSA-N 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- MOUPNEIJQCETIW-UHFFFAOYSA-N lead chromate Chemical compound [Pb+2].[O-][Cr]([O-])(=O)=O MOUPNEIJQCETIW-UHFFFAOYSA-N 0.000 description 1
- 229940107698 malachite green Drugs 0.000 description 1
- FDZZZRQASAIRJF-UHFFFAOYSA-M malachite green Chemical compound [Cl-].C1=CC(N(C)C)=CC=C1C(C=1C=CC=CC=1)=C1C=CC(=[N+](C)C)C=C1 FDZZZRQASAIRJF-UHFFFAOYSA-M 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229910052957 realgar Inorganic materials 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 239000004526 silane-modified polyether Substances 0.000 description 1
- ABTOQLMXBSRXSM-UHFFFAOYSA-N silicon tetrafluoride Chemical compound F[Si](F)(F)F ABTOQLMXBSRXSM-UHFFFAOYSA-N 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 229920002725 thermoplastic elastomer Polymers 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- 239000004636 vulcanized rubber Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 239000010456 wollastonite Substances 0.000 description 1
- 229910052882 wollastonite Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/006—Additives being defined by their surface area
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inorganic Chemistry (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
A light diffusion type organic silicon composite material and a preparation method thereof, the composite material comprises a component A and a component B, and the component A, B comprises the following raw materials: the component A comprises base rubber and reinforcing filler; the component B comprises a cross-linking agent, a catalyst and a light diffusion agent, wherein the light diffusion agent is liquid and contains groups with high molar refractivity, such as ether bonds, aromatic rings and alkoxy groups which can be hydrolyzed to generate ester bonds with high molar refractivity. According to the invention, the liquid light diffusant is added into the organic silicon material, and the liquid light diffusant can not shield light, so that the loss of transmitted light is reduced, and the organic silicon material can keep higher transmittance; meanwhile, because the refractive index of the light diffusants is larger than 1.45, and the refractive index of the used base glue is generally 1.39-1.40, after the potting glue is cured, the light diffusants and the polydimethylsiloxane are separated in a microscopic phase, so that the potting glue is endowed with higher haze.
Description
Technical Field
The invention belongs to the technical field of organic silicon materials, and particularly relates to a light diffusion type organic silicon composite material and a preparation method thereof.
Background
The LED lamp is widely loved by people due to the advantages of green, environment-friendly, high-efficiency, energy-saving and the like, is mainly applied to the fields of screen display systems, indicator lamps, mobile phones and the like, and is also actively developed in the field of power illumination in recent years. However, the LED lamp has a limited area for illuminating a point light source, has strong light intensity, contains a large amount of blue light components, and is vulnerable to eye injury, and people often use a packaging material with light diffusion performance to solve the problems of soft light and high brightness from the point light source to the area light source. Lens materials are most widely used for LED lamps, including polycarbonate, polymethyl methacrylate, glass and the like, and the lens materials can obtain the advantages of higher transparency, light intensity suitable for human eyes and the like by mixing some light diffusers, but with technological progress, the strength, linear expansion coefficient and the like of the materials are more and more unsatisfied, and particularly for long, thin, soft and wide LED lamps, the bending performance, the shrinkage performance or the expansion performance of the materials are far from the standard, so another soft and elastic encapsulating material-encapsulating material is favored by the market for the long, thin, soft and wide LED lamps.
The encapsulating material mainly comprises epoxy resin and an organic silicon material, the epoxy resin can change color and cannot bear a high-temperature welding process, and the application of the encapsulating material has certain limitation, so that the organic silicon material has the development prospect at present, the organic silicon material can absorb heat and prevent color change, particularly has higher refractive index per se, and the defect in the beauty is that the haze of the organic silicon material is generally lower, for example, patent CN201410568860.5 discloses preparation of two-component condensation type LED organic silicon encapsulating glue, patent CN201310346458.8 discloses two-component organic silicon encapsulating glue, and patent CN201410685155.3 discloses single-component dealcoholization type room temperature vulcanized organic silicon encapsulating glue and a preparation method thereof. The organic silicon pouring sealant prepared by the patents has the characteristics of good light transmittance, high refractive index, good thermal stability, small stress cracking and the like, and has the defect that although the light transmittance is high, the haze and the diffusion are small and cannot meet the actual requirement. Generally, in order to seek higher light transmittance in the preparation process, the haze of the obtained potting adhesive is correspondingly reduced, and a light diffuser is generally directly added, so that the haze is improved, but the light transmittance is lost, and although a patent which is beneficial to improving the haze by the light diffuser, such as patent CN201710545923.9, discloses an LED surface light source, wherein the potting adhesive is silica gel, and the light diffuser is organic silicon with the particle size of 2-4 μm. CN201610219317.3 discloses a polyester resin-based light diffusion composite material, which is prepared by mixing polycarbonate, polyester terephthalate, a light diffuser, an antioxidant and a mold release agent, wherein the light diffuser is selected from one or more of organic silicon resin microspheres, silica gel microspheres and crosslinked PMMA microspheres; CN201711188327.6 discloses a light diffuser for LED, a preparation method thereof and a light diffuser material containing the light diffuser, the light diffuser is an organic silicon microcapsule, a capsule material is composed of methyltrimethoxysilane and phenyltrimethoxysilane, the particle size of the microcapsule is 1-5 μm, although the light diffuser in the patent can make the base material obtain higher haze and avoid dizziness, the light diffuser has the common defects: the solid light diffusant with high cost is used, has a certain shielding effect on light, and can certainly cause the reduction of light transmittance and diffusion angle, so that the LED lamp beads are obviously visible to naked eyes, and therefore, the development of the pouring sealant material with low light transmittance loss or even no light transmittance loss under the condition of improving the haze is urgently needed.
Disclosure of Invention
The invention aims to overcome the defect that the haze and the light transmittance of an organic silicon encapsulating material of an LED lamp in the prior art cannot meet the requirements at the same time, and provides a light diffusion type organic silicon composite material.
In order to achieve the purpose, the invention provides the following technical scheme:
a light diffusion type organic silicon composite material comprises a component A and a component B, and is characterized in that the component A, B comprises the following raw materials: the component A comprises base rubber and reinforcing filler; the component B comprises a crosslinking agent, a catalyst and a light diffusion agent, wherein the light diffusion agent is a compound of a formula (I) and/or a formula (II):
wherein R is1Is composed of
R11Is C2-C16 alkane;
R2is composed of
R21Is C2-C16 alkane;
R3is phenyl, -H or C2-C16 alkane;
wherein R is4is-H, an alkoxysilane containing an imido group (-CONH-), an alkoxysilane containing an alkylene group- (CH)2)x-alkoxy silane, alkenyl; m in the formula (II) is an integer between 0 and 12, preferably an integer between 0 and 6; n in the formula (II) is an integer of 20-400, preferably an integer of 50-200.
Specifically, the compound of the formula (I) is selected from at least one of dioctyl phthalate, dibutyl phthalate and dihexyl phthalate.
The inventor unexpectedly finds that the compound of the formula (I) can be used as a light diffuser of an organosilicon pouring sealant material, can not only improve the haze, but also can not cause too much reduction of light transmittance.
The light diffusant is liquid at room temperature, and when the light diffusant is a compound shown as a formula (I), the kinematic viscosity v is less than 150mPa & s; when the light diffuser is a compound of formula (II), the kinematic viscosity v is < 10000 mPas.
The refractive index of the light diffusant is larger than 1.45.
The A, B component comprises the following raw materials in parts by weight: the component A comprises 100 parts of base rubber and 1-30 parts of reinforcing filler; the component B comprises 10-20 parts of cross-linking agent, 0.2-5 parts of catalyst and 20-50 parts of light diffusant.
In order to make the light diffusion type organic silicon composite material cheaper to use, the light diffusing agent in the component B in the scheme can be separated and marked as the component C, namely, the light diffusion type organic silicon composite material further comprises the component A, the component B and the component C, and the A, B, C component comprises the following raw materials in parts by weight: wherein the component A comprises 100 parts of base adhesive, 0-50 parts of plasticizer, 1-30 parts of reinforcing filler and 0-1 part of pigment, the component B comprises 2-20 parts of cross-linking agent and 0.1-10 parts of catalyst, and the component C comprises 20-50 parts of light diffusant.
The base adhesive is alpha, omega-dihydroxy polydimethylsiloxane, and the viscosity range of the alpha, omega-dihydroxy polydimethylsiloxane is 400-80000 mPas, preferably 400-10000 mPas.
The viscosity of the alpha, omega-dihydroxy polydimethylsiloxane determines the construction performance and the mechanical performance of the composite material to a great extent, and the lower the viscosity value is, the better the construction performance of the composite material is, but the lower the elongation at break is; the higher the viscosity value, the poorer the workability of the composite material, but the higher the elongation at break.
The plasticizer is polydimethylsiloxane, and the viscosity range is 50-500 mPas, preferably 100-350 mPas.
The reinforcing filler is white carbon black or methyl MQ resin, and the specific surface area of the white carbon black is 100-300m2The white carbon black comprises gas-phase white carbon black or precipitation white carbon black.
The pigment is selected from at least one of cinnabar, realgar, malachite green, wollastonite, mica powder, titanium dioxide, cochineal red, natural fish scale powder, gamboge, alizarin red, indigo, lithopone, lead chrome yellow, iron blue, scarlet powder, bipale yellow, phthalocyanine blue and quinacridone.
The catalyst is at least one of dibutyltin dilaurate, dioctyltin dilaurate, dibutyltin dioctoate, n-butyl titanate, isopropyl titanate and titanate chelate.
The cross-linking agent includes but is not limited to at least one of methyltrimethoxysilane, vinyltrimethoxysilane, phenyltrimethoxysilane, propyltrimethoxysilane, methyltriethoxysilane, tetraethoxysilane, propyl orthosilicate, polymethyltriethoxysilane, and polyethyl orthosilicate.
The component A of the composite material also can comprise 5-50 parts of plasticizer and 0.01-1 part of pigment.
The invention also provides a preparation method of the double-component light diffusion type organic silicon composite material, which comprises the following steps:
1) adding the base adhesive, the plasticizer, the reinforcing filler and the pigment into a reaction container, and uniformly stirring under negative pressure to obtain a component A;
2) adding a cross-linking agent, a catalyst and a light diffusant into a reaction vessel, and uniformly stirring under negative pressure to obtain a component B;
3) before use, uniformly mixing the component A obtained in the step 1) and the component B obtained in the step 2) to obtain the light diffusion type organic silicon composite material which can be directly encapsulated for use;
step 1), the negative pressure is-0.05- (-0.10) MPa, and the stirring time is 15-60 min;
the negative pressure in the step 2) is-0.05- (-0.10) MPa, and the stirring time is 15-60 min.
If the light diffusion type organic silicon composite material comprises A, B, C components, no light diffusion agent is added in the step 2), A, B, C components are mixed before the light diffusion type organic silicon composite material is used in the step 3), and the light diffusion type organic silicon composite material is obtained and can be directly encapsulated.
Compared with the prior art, the invention has the beneficial effects that:
1. according to the invention, the liquid light diffusant is added into the organic silicon material, and the liquid light diffusant can not shield light, so that the loss of transmitted light is reduced, and the prepared organic silicon material can keep higher transmittance; meanwhile, because the molecules of the light diffusant contain groups with high molar refraction degree, such as ether bonds, aromatic rings and alkoxy groups which can be hydrolyzed to generate ester bonds with high molar refraction degree, the refractive index of the used base glue is 1.39-1.40, after the potting glue is cured, the light diffusant and the polydimethylsiloxane are separated at microscopic phase, and the potting glue is endowed with high haze.
2. The invention has the advantages of low price of each component, low production cost, simple and environment-friendly preparation process, flexible and various product forms, double-component or three-component type and convenient construction.
Detailed Description
The present invention will be further described with reference to the following examples, but the present invention is not limited to the descriptions in the following. Unless otherwise specified, the parts of the reagents are parts by weight. All reagents used are commercially available in the art.
Example 1
1) 100 parts of alpha, omega-dihydroxy polydimethylsiloxane having a viscosity of 1500mPa · s, 10 parts of polydimethylsiloxane having a viscosity of 350mPa · s, 10 parts of fumed silica (trade name: wake V-15) and 0.03 part of phthalocyanine blue are added into a reaction vessel and stirred for 30min under the negative pressure of-0.085 MPa; obtaining a component A;
2) adding 8 parts of ethyl orthosilicate, 30 parts of dioctyl phthalate (a light diffusant with a structure of a formula I) and 1 part of dibutyltin dilaurate into a reaction vessel, and stirring for 15min under the negative pressure of-0.085 MPa to obtain a component B;
3) mixing the component A obtained in the step 1) and the component B obtained in the step 2) to obtain the light diffusion type organic silicon composite material.
Example 2
The procedure of example 1 was repeated, except that 20 parts of dioctyl phthalate as a light diffusing agent was used.
Example 3
The procedure of example 1 was repeated, except that 50 parts of dioctyl phthalate as a light diffusing agent was used.
Example 4
The procedure of example 1 was repeated, except that the amount of dioctyl phthalate as the light diffusing agent was 10 parts.
Example 5
The procedure of example 1 was repeated, except that the amount of dioctyl phthalate as the light diffusing agent was 80 parts.
Example 6
The procedure was repeated as in example 1 except that the light diffusing agent was dibutyl phthalate (light diffusing agent having a structure represented by formula I).
Example 7
The rest is the same as the example 1, except that the light diffusing agent is silane modified polyether (the trade name is the Brillouin S203H, the light diffusing agent belongs to the structure of the formula II, and the kinematic viscosity is 6000-8000 mPa.s).
Example 8
The rest is the same as the example 1, except that the light diffusing agent is polyether (trade name: Lanxingdong large DL-4000D, belonging to the light diffusing agent with the structure of the formula II, and the kinematic viscosity is 800-1000 mPa.s).
Example 9
1) 100 parts of alpha, omega-dihydroxy polydimethylsiloxane having a viscosity of 1500mPa · s, 10 parts of polydimethylsiloxane having a viscosity of 350mPa · s, 10 parts of fumed silica (trade name: wake V-15) and 0.03 part of phthalocyanine blue are added into a reaction vessel and stirred for 30min under the negative pressure of-0.085 MPa; obtaining a component A;
2) adding 8 parts of ethyl orthosilicate and 1 part of dibutyltin dilaurate into a reaction vessel, and stirring for 15min under the negative pressure of-0.085 MPa to obtain a component B;
3) and (2) adding 30 parts of component C (dioctyl phthalate) (light diffusant with the structure of the formula I) into the component A obtained in the step 1) and the component B obtained in the step 2), and uniformly mixing to obtain the light diffusion type organic silicon composite material.
Example 10
The process is the same as example 1 except that the reinforcing filler is a methyl MQ resin (Shenzhen Jipeng silicon fluoride materials Co., Ltd.) with the designation of 5201P.
Comparative example 1
The rest is the same as the embodiment 1, except that the light diffusing agent used is Shenzhen Haiyang powder HY-690, the average grain diameter is 2 μm, and the dosage is 2 parts (2 parts is the recommended dosage by the manufacturer).
Comparative example 2
The rest is the same as the embodiment 1, except that the light diffusing agent used is Shenzhen Haiyang powder HY-690, the average grain diameter is 2 μm, and the dosage is 10 parts (2 parts is the recommended dosage by the manufacturer).
Comparative example 3
The rest is the same as the embodiment 10, except that the light diffusing agent used is Shenzhen Haiyang powder HY-690, the average grain diameter is 2 μm, and the dosage is 2 parts (2 parts is the recommended dosage by the manufacturer).
The cured light-diffusing organic silicon composite material prepared in the above examples and comparative examples was subjected to optical performance test and mechanical performance test by preparing sample pieces according to the following steps and specifications, and the results are shown in table 1 below.
1. The composite materials of the examples and the comparative examples are respectively prepared into flat and uniform sample wafers with the thickness of 0.3mm, and optical performance tests are carried out.
2. The composite materials of the examples and the comparative examples are respectively prepared into flat and uniform sample wafers with the thickness of 0.5mm, and optical performance tests are carried out.
3. Preparing a plurality of wedge-shaped grooves with the same size, fixing an LED lamp bar with the model of 2835-120P-12V, the lumen of 24-26LM/PCS and the power of 10W/M at the bottom of the wedge-shaped grooves, then respectively coating (encapsulating) the composite materials of the embodiment and the comparative example in the wedge-shaped grooves, flattening the upper surface, and curing for 7d at room temperature; then, the LED lamp strip is lightened, the lightened lamp beads are observed through the wedge-shaped groove, marks are made at the positions where the lamp beads can not be seen completely on each sample respectively, and the thickness of the positions of the marks is measured. This thickness is referred to as the critical thickness A. Then, sample wafers with critical thickness A of each sample are respectively prepared, and optical performance test is carried out.
4. And (3) performing mechanical property test according to a standard GB/T528-2009 (determination of tensile stress strain performance of vulcanized rubber or thermoplastic rubber).
TABLE 1
As can be seen from the above table, in the embodiment, the light-diffusing type organic silicon composite material prepared by using the liquid low-molecular light-diffusing agent can obtain higher haze with lower thickness, has higher transmittance without great loss of transmitted light, and has a composite material coverage thickness of less than 7.5mm, and the LED lamp beads are completely invisible to naked eyes. Whereas comparative examples 1 and 2 show a greater loss of light transmission under the same conditions.
From the above table, it can be found that the reinforcing filler white carbon black can also provide a certain haze, but has a certain influence on the light transmittance, so that in example 10, after the white carbon black is replaced by the methyl MQ resin, compared with examples 1 to 9, the light transmittance is greatly improved, and the haze is slightly reduced.
Comparative example 3 was replaced with methyl MQ resin, but the haze was not as good as in example 10 due to insufficient light diffusion, the critical thickness was high, and the mechanical properties of the powder light diffusion powder were greatly affected.
The invention has the advantages of low price of each component, low production cost, simple and environment-friendly preparation process, flexible and various product forms, double-component or three-component type and convenient construction.
The above detailed description is specific to one possible embodiment of the present invention, and the embodiment is not intended to limit the scope of the present invention, and all equivalent implementations or modifications without departing from the scope of the present invention should be included in the technical scope of the present invention.
Claims (10)
1. A light diffusion type organic silicon composite material comprises a component A and a component B, and is characterized in that the component A, B comprises the following raw materials: the component A comprises base rubber and reinforcing filler; the component B comprises a cross-linking agent, a catalyst and a light diffusion agent, wherein the light diffusion agent is a compound of a formula (I) and/or a formula (II):
wherein R is1Is composed of
R11Is C2-C16 alkane;
R2is composed of
R21Is C2-C16 alkane;
R3is phenyl, -H or C2-C16 alkane;
wherein R is4is-H, an alkoxysilane containing an imido group (-CONH-), an alkoxysilane containing an alkylene group- (CH)2)x-alkoxy silane, alkenyl; m in the formula (II) is an integer between 0 and 12, preferably an integer between 0 and 6; n is an integer of 20 to 400, preferably 50 to 200.
2. The composite material of claim 1, wherein the A, B component comprises the following raw materials in parts by weight: the component A comprises 100 parts of base rubber and 1-30 parts of reinforcing filler; the component B comprises 10-20 parts of cross-linking agent, 0.2-5 parts of catalyst and 20-50 parts of light diffusant.
3. The composite material of claim 1, wherein the light diffuser is liquid at room temperature and has a kinematic viscosity v < 150 mPa-s when the light diffuser is a compound of formula (I); when the light diffuser is a compound of formula (II), the kinematic viscosity v is < 10000 mPas.
4. The composite of claim 1, wherein the light diffuser has a refractive index of > 1.45.
5. The composite material of claim 1, wherein the base gum is α, ω -dihydroxypolydimethylsiloxane having a viscosity in the range of 400-.
6. Composite material according to claim 1, wherein the plasticizer is polydimethylsiloxane and has a viscosity in the range of 50 to 500 mPa-s, preferably 100-350 mPa-s.
7. The composite material as claimed in claim 1, wherein the reinforcing filler is white carbon black or methyl MQ resin, and the specific surface area of the white carbon black is 100-300m2The white carbon black comprises gas-phase white carbon black or precipitation white carbon black.
8. The composite material of claim 1, wherein the catalyst comprises at least one of dibutyltin dilaurate, dioctyltin dilaurate, dibutyltin dioctoate, n-butyl titanate, isopropyl titanate, titanate chelate.
9. The composite material of claim 1, wherein the cross-linking agent comprises at least one of methyltrimethoxysilane, vinyltrimethoxysilane, phenyltrimethoxysilane, propyltrimethoxysilane, methyltriethoxysilane, tetraethoxysilane, propylorthosilicate, polymethyltriethoxysilane, and polyethylorthosilicate.
10. A method for preparing the light-diffusing silicone composite material according to any one of claims 1 to 9, comprising the steps of:
1) adding the base adhesive, the plasticizer, the reinforcing filler and the pigment into a reaction container, and uniformly stirring under negative pressure to obtain a component A;
2) adding a cross-linking agent, a catalyst and a light diffusant into a reaction vessel, and uniformly stirring under negative pressure to obtain a component B;
3) before use, the component A obtained in the step 1) and the component B obtained in the step 2) are mixed to obtain the light diffusion type organic silicon composite material which can be directly encapsulated for use.
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