CN113657066A - SMT (surface mount technology) mounting data rapid conversion method and system - Google Patents
SMT (surface mount technology) mounting data rapid conversion method and system Download PDFInfo
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- 238000004806 packaging method and process Methods 0.000 claims abstract description 42
- 238000013461 design Methods 0.000 claims abstract description 35
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- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/39—Circuit design at the physical level
- G06F30/392—Floor-planning or layout, e.g. partitioning or placement
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/39—Circuit design at the physical level
- G06F30/398—Design verification or optimisation, e.g. using design rule check [DRC], layout versus schematics [LVS] or finite element methods [FEM]
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- G—PHYSICS
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- G06F2115/00—Details relating to the type of the circuit
- G06F2115/12—Printed circuit boards [PCB] or multi-chip modules [MCM]
Abstract
The invention discloses a method and a system for quickly converting SMT (surface mount technology) mounting data, wherein the method comprises the following steps: the method comprises the steps of reading a PCB design file, obtaining attribute information of all components and attribute information of all bonding pads, judging the packaging forms of the components, automatically correcting the angles of the components for the components identified as surface mount packaging forms, automatically calculating the center coordinates of the components, and outputting the result as a chip mounter assembly list, so that the technical problems that the angle information contained in a surface mount data file exported by PCB design software cannot be directly used and needs to be manually corrected one by one due to the fact that the 0-degree state and the positive direction of a component packaging library used by PCB design software and a chip mounter in the related technology are inconsistent are solved. The invention extracts the attribute information from the PCB design file, automatically corrects the angle of the component and automatically calculates the center coordinate, replaces the manual checking and modifying method with low efficiency and insufficient precision, and improves the accuracy and the working efficiency of the surface mounting data.
Description
Technical Field
The invention relates to the technical field of surface mounting, in particular to a SMT (surface mount technology) mounting data rapid conversion method and system.
Background
Since the Surface Mount Technology (SMT) was used in consumer electronics in the early 70 s of the 20 th century, although it is as short as 30 years, it has become the most important and even the only electronic manufacturing technology, and the placement machine is the main equipment for completing the placement operation in the SMT production line and is the bottleneck for improving the efficiency of the production line. In a production mode of various and small-batch aerospace electronic products, frequent programming of the mounting program is inevitable, so that the key for improving the production efficiency of the mounting machine is to improve the programming efficiency and quality of the mounting program.
The information of a mounting data file is matched with the information of a component library of a chip mounter to establish an incidence relation when a mounting program is compiled, the file is generated by PCB design software and contains information of the position number, the central coordinate, the rotation angle and the like of a component, the quality of the file directly influences the compiling efficiency and the program quality, and the file mainly has the following influence factors:
the 0-degree state and the positive direction of the PCB design software and a component packaging library used by the chip mounter are inconsistent, so that angle information contained in a mounting data file exported by the PCB design software cannot be directly used and needs to be manually corrected one by one; the problem that the central coordinates of components contained in the mounting data file are inaccurate, manual modification is needed, and the precision is insufficient; the mounting data file comprises information of all components, and the mounting program only needs to surface mount the information of the components and needs to manually check the packaging form of the real object and delete other components.
Disclosure of Invention
Aiming at the defects in the prior art, the technical problems to be solved by the invention are as follows: in a production mode of various and small-batch aerospace electronic products, frequent programming of the surface mounting program is inevitable, and how to improve the programming efficiency and quality of the surface mounting program is the key for improving the production efficiency of the surface mounting machine.
In order to solve the above problems, the present invention is realized by the following technical solutions:
in one aspect of the present invention, there is provided an SMT (Surface Mount Technology) mounting data fast converting method, including the steps of:
s1, reading a PCB (Printed Circuit Board) design file, calling a component interface to traverse a component, acquiring attribute information of the component, calling a component pad interface to traverse a component pad, and acquiring attribute information of the pad;
s2, judging the type of the pad according to the attribute information of the pad;
s3, judging the packaging form of the component according to the pad types of all the pads of the component;
s4, carrying out data processing of center coordinate calculation and component angle correction on the components identified as surface mount package forms;
and S5, outputting an assembly list suitable for the chip mounter mounting program, wherein the assembly list comprises the processed position numbers of all components, the angles of the components and the central coordinate data of the components.
Further, the PCB design file includes at least: PCB Layout file.
Further, the attribute information of the components includes any one or a combination of more than one of the following: position number, front and back sides, encapsulation, number of pads, angle, center coordinate.
Further, the property information of the pad includes any one or a combination of: identification, shape, pad size, via size, surface mount properties, center coordinates.
Further, the determining the type of the pad according to the attribute information of the pad includes: and judging the type of the bonding pad according to the size of the bonding pad, the size of the through hole and the surface-mounted attribute.
Further, the determining the type of the pad according to the attribute information of the pad includes: judging whether the size of the bonding pad is larger than that of the through hole or not, and if so, identifying the bonding pad as a metalized bonding pad;
and judging whether the metalized pad with the pad surface-mounted attribute is a surface-mounted pad or not, and judging whether the metalized pad with the pad surface-mounted attribute is a through hole pad or not.
Further, the determining the packaging form of the component according to the pad types of all the pads of the component includes: the components with the number of the surface-mounted pads larger than that of the through-hole pads are identified as the components in the surface-mounted packaging mode.
Further, the step of calculating the center coordinates of the component identified as the surface mount package form includes:
for the components with the total number of the metalized pads not being 3, automatically calculating the mean value of the extreme values of the coordinates of the centers of all the pads as the central coordinates of the components;
and for the components with the total number of the metallized bonding pads of 3, automatically calculating the center coordinates of circumscribed circles of the centers of the 3 bonding pads as the center coordinates of the components.
Further, the data processing for correcting the angle of the component by identifying the component in the form of surface mount package includes:
automatically identifying a first bonding pad of a component, and acquiring coordinates of the first bonding pad;
and automatically calculating the difference value between the 0-degree state of the component in the PCB design coordinate system and the 0-degree state of the component in the chip mounter coordinate system according to the front and back surface attributes of the component, the first pad coordinate, the central coordinate of the component and the angle of the component before correction, and compensating and correcting the component angle in the PCB design coordinate system into the component angle in the chip mounter coordinate system according to the difference value.
In another aspect of the present invention, there is provided an SMT pick and place data rapid conversion system, including:
the data acquisition unit is used for acquiring a PCB design file and calling a component interface to traverse the component; acquiring attribute information of the component, and calling a component pad interface to traverse a component pad; acquiring attribute information of a bonding pad;
the first judging unit is used for judging the type of the bonding pad according to the attribute information of the bonding pad;
the second judging unit is used for judging the packaging form of the component according to the pad types of all the pads of the component;
the execution unit is used for carrying out data processing of center coordinate calculation and component angle correction on the components identified as surface mount packaging forms;
and the output unit is used for outputting an assembly list applicable to the surface mounting program of the surface mounting machine, and the assembly list comprises all the processed component position numbers, component angles and component center coordinate data.
The invention has the technical effects that:
the SMT mounting data rapid conversion method adopted by the invention obtains the attribute information of all components and the attribute information of all bonding pads by reading the PCB design file, judges the packaging form of the components, automatically corrects the component angle and automatically calculates the central coordinate of the component for the components identified as the surface mounting packaging form, and outputs the result as the mounting list of the chip mounter, thereby solving the problem that the 0-degree state and the positive direction of the PCB design software and the component packaging library used by the chip mounter in the related technology are inconsistent, which causes that the angle information contained in the mounting data file derived by the PCB design software can not be directly used and needs to be manually corrected one by one; the problem that the central coordinates of the components contained in the mounting data file are inaccurate, manual modification is needed, and the precision is insufficient; and the mounting data file comprises information of all components, and the mounting program only needs to surface mount the information of the components in the packaging form and needs to manually check the packaging form of the real object and delete other components. The SMT mounting data rapid conversion method extracts the attribute information from the PCB design file, automatically corrects the angle of the component and automatically calculates the center coordinate, replaces the manual checking and modifying method with low efficiency and insufficient precision, and improves the accuracy and the working efficiency of the mounting data.
Drawings
Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:
FIG. 1 is a system flow diagram of a SMT fast conversion method according to one embodiment of the invention;
fig. 2 is a schematic block diagram of an SMT mounted data fast conversion system in an embodiment of the present invention.
Wherein, the corresponding relationship between the reference numbers and the names of the components in fig. 2 is:
the system comprises a 200 SMT mounting data rapid conversion system, a 210 data acquisition unit, a 220 first judgment unit, a 230 second judgment unit, a 240 execution unit and a 250 output unit.
Detailed Description
The present invention will be described in detail with reference to specific examples. The following examples will assist those skilled in the art in further understanding the invention, but are not intended to limit the invention in any way. It should be noted that variations and modifications can be made by persons skilled in the art without departing from the spirit of the invention. All falling within the scope of the present invention.
Fig. 1 is a flowchart of an SMT mounting data fast conversion method provided by the present invention, and the SMT mounting data fast conversion method provided by the present invention includes the following steps:
s1, reading the PCB design file, calling a component interface to traverse the component, acquiring the attribute information of the component, calling a component pad interface to traverse a component pad, and acquiring the attribute information of the pad;
s2, judging the pad type according to the attribute information of the pad;
s3, judging the packaging form of the component according to the pad types of all the pads of the component;
s4, carrying out data processing of center coordinate calculation and component angle correction on the components identified as surface mount package forms;
and S5, outputting an assembly list suitable for the chip mounter mounting program, wherein the assembly list comprises the processed position numbers of all components, the angles of the components and the central coordinate data of the components.
FIG. 1 is a flow chart of the SMT pasting data rapid conversion method provided by the invention, the SMT pasting data rapid conversion method adopted by the invention obtains attribute information of all components and pads by reading PCB design files, judges component packaging forms, automatically corrects component angles and automatically calculates component center coordinates for components identified as surface pasting packaging forms, and outputs results as a pasting machine assembly list, thereby solving the problem that the 0-degree state and the positive direction of a component packaging library used by PCB design software and a pasting machine in the related technology are inconsistent, so that the angle information contained in a pasting data file derived by the PCB design software cannot be directly used and needs to be manually corrected one by one; the problem that the central coordinates of the components contained in the mounting data file are inaccurate, manual modification is needed, and the precision is insufficient; and the mounting data file comprises information of all components, and the mounting program only needs to surface mount the information of the components in the packaging form and needs to manually check the packaging form of the real object and delete other components. The SMT mounting data rapid conversion method extracts the attribute information from the PCB design file, automatically corrects the angle of the component and automatically calculates the center coordinate, replaces the manual checking and modifying method with low efficiency and insufficient precision, and improves the accuracy and the working efficiency of the mounting data.
In one embodiment of the present invention, further, the PCB design file includes at least: PCB Layout file.
Further, the attribute information of the components includes any one or a combination of more than one of the following: position number, front and back sides, encapsulation, number of pads, angle, center coordinate.
Further, the property information of the pad includes any one or a combination of: identification, shape, pad size, via size, surface mount properties, center coordinates.
In this embodiment, specifically, when step S1 is executed, the PCB design file is read by a design software API (Application Programming Interface), the component Interface is called to traverse the component, so as to obtain the attribute information of the component, and the component pad Interface is called to traverse the component pad, so as to obtain the attribute information of the pad. For example, the PCB design file includes a PCB Layout file; the component attribute information includes: position number, front and back sides, encapsulation, number of pads, angle and central coordinate; the pad attribute information includes: identification, shape, size, through hole size, surface-mounted attribute and center coordinate. Then, step S2 is executed.
In an embodiment of the present invention, further, the determining the type of the pad according to the attribute information of the pad includes: and judging the type of the bonding pad according to the size of the bonding pad, the size of the through hole and the surface-mounted attribute.
Further, the determining the type of the pad according to the attribute information of the pad includes: judging whether the size of the bonding pad is larger than that of the through hole or not, and if so, identifying the bonding pad as a metalized bonding pad;
and judging whether the metalized pad with the pad surface-mounted attribute is a surface-mounted pad or not, and judging whether the metalized pad with the pad surface-mounted attribute is a through hole pad or not.
In this embodiment, specifically, when step S2 is executed, the pad type is determined according to the pad size, the via size, and the surface-mount attribute, where a pad with a pad size larger than the via size is identified as a metalized pad, a metalized pad with a pad surface-mount attribute of yes is a surface-mount pad, and a metalized pad with a pad surface-mount attribute of no is a via pad. Step S3 is then performed.
In an embodiment of the present invention, further, the determining the packaging form of the component according to the pad types of all the pads of the component includes: the components with the number of the surface-mounted pads larger than that of the through-hole pads are identified as the components in the surface-mounted packaging mode.
In this embodiment, it is specifically explained that, when step S3 is executed, the package form of the component is determined according to the pad types of all the pads of the component, and the component having the number of surface-mounted pads greater than the number of through-hole pads is identified as a surface-mounted package form component. Step S4 is then performed.
In an embodiment of the present invention, further, the calculating the center coordinates of the component identified as the surface mount package includes:
for the components with the total number of the metalized pads not being 3, automatically calculating the mean value of the extreme values of the coordinates of the centers of all the pads as the central coordinates of the components;
and for the components with the total number of the metallized bonding pads of 3, automatically calculating the center coordinates of circumscribed circles of the centers of the 3 bonding pads as the center coordinates of the components.
Further, the data processing for correcting the angle of the component by identifying the component in the form of surface mount package includes:
automatically identifying a first bonding pad of a component, and acquiring coordinates of the first bonding pad;
and automatically calculating the difference value between the 0-degree state of the component in the PCB design coordinate system and the 0-degree state of the component in the chip mounter coordinate system according to the front and back surface attributes of the component, the first pad coordinate, the central coordinate of the component and the angle of the component before correction, and compensating and correcting the component angle in the PCB design coordinate system into the component angle in the chip mounter coordinate system according to the difference value.
In this embodiment, specifically, when step S4 is executed, the component identified as the surface mount package type performs data processing of component center coordinate calculation and component angle correction. When the central coordinates of the components are calculated, for the components with the total number of the metalized pads not being 3, automatically calculating the coordinate extreme value mean value of all the pad centers as the central coordinates of the components, and for the components with the total number of the metalized pads being 3, automatically calculating the coordinates of the centers of circumscribed circles of the 3 pad centers as the central coordinates of the components; when the component angle is corrected, a first pad of the component is automatically identified, a first pad coordinate is obtained, then the difference value between the 0-degree state of the component in the PCB design coordinate system and the 0-degree state of the component in the chip mounter coordinate system is automatically calculated according to the front and back surface attributes of the component, the first pad coordinate, the central coordinate of the component and the component angle before correction, and the component angle in the PCB design coordinate system is compensated and corrected into the component angle in the chip mounter coordinate system according to the difference value. Step S5 is then performed.
In an embodiment of the present invention, the first pad coordinates are not used for the mounting program, but the correctness of the first pad coordinates affects the component angle correction calculation. When a component is packaged, most of the pads of the component are identified by "1", "2", "3" … or "a", "B" and "C" …, so the first pad is identified by "1", "2", "3" … or "a", "B" and "C" …. However, in a component having a large number of pads, such as an array device like BGA or CCGA, the pads are designated by a combination of "a", "B", "C" … and "1", "2" or "3" …, and therefore, the first pads are identified in the order of priority as "a 1", "B1", "C1", "a 2", "B2" or "C2" …. Thus, the first pad of the component can be identified by the pad identification.
Further, the component angle of the PCB design software is positive when the component is rotated counterclockwise based on the initial state of the component in the package library, and the component angle of the chip mounter is positive when the component is rotated clockwise based on the initial state of the component in the package library of the chip mounter. In addition, during component packaging, the placement states of the components are not unified for convenience of drawing, so that the initial packaging state of the same component is inconsistent with the initial packaging state of the chip mounter, and the angle is difficult to correct through simple positive-negative conversion. The 0-degree states of components in a packaging library of a known chip mounter are unified: the component is vertically or horizontally arranged, and the arrangement position of the first bonding pad on the second quadrant or the positive Y axis is in a 0-degree state. And automatically calculating the difference value between the 0-degree state of the component in the PCB design coordinate system and the 0-degree state of the component in the chip mounter coordinate system according to the front and back surface attributes of the component, the first pad coordinate, the central coordinate of the component and the angle of the component before correction, and compensating and correcting the component angle in the PCB design coordinate system into the component angle in the chip mounter coordinate system according to the difference value.
Further, in step S5, an assembly list applicable to the placement program of the placement machine is output, which includes the processed data of the position numbers of all the components, the angles of the components, the central coordinates of the components, and the like.
Fig. 2 is a schematic block diagram of an SMT mounted data fast conversion system 200 provided by the present invention, where the SMT mounted data fast conversion system 200 provided by the present invention includes:
the data acquisition unit 210 is configured to acquire a PCB design file and call a component interface to traverse a component; acquiring attribute information of the component, and calling a component pad interface to traverse a component pad; acquiring attribute information of a bonding pad;
a first determining unit 220, configured to determine the pad type according to the attribute information of the pad;
a second determining unit 230, configured to determine a package form of the component according to pad types of all pads of the component;
an execution unit 240, configured to perform data processing of center coordinate calculation and component angle correction on the component identified as the surface mount package form;
and the output unit 250 is configured to output an assembly list applicable to the mounting program of the chip mounter, where the assembly list includes the processed position numbers of all the components, the angles of the components, and the coordinate data of the centers of the components.
As shown in fig. 2, the SMT mounted data fast conversion system 200 provided by the present invention includes: the system comprises a data acquisition unit 210, a first judgment unit 220, a second judgment unit 230, an execution unit 240 and an output unit 250, wherein a PCB design file is read through the data acquisition unit 210, attribute information of all components and pads is acquired, the packaging forms of the components are judged, the angles of the components identified as surface mount packaging forms are automatically corrected, the central coordinates of the components are automatically calculated, and the results are output as a mounting list of a chip mounter, so that the problem that the angle information contained in a mounting data file derived by PCB design software cannot be directly used and needs to be manually corrected one by one due to the fact that the 0-degree state and the positive direction of the PCB design software and a component packaging library used by the chip mounter are inconsistent in the related technology is solved; the problem that the central coordinates of the components contained in the mounting data file are inaccurate, manual modification is needed, and the precision is insufficient; and the mounting data file comprises information of all components, and the mounting program only needs to surface mount the information of the components in the packaging form and needs to manually check the packaging form of the real object and delete other components. The SMT mounting data rapid conversion method extracts the attribute information from the PCB design file, automatically corrects the angle of the component and automatically calculates the center coordinate, replaces the manual checking and modifying method with low efficiency and insufficient precision, and improves the accuracy and the working efficiency of the mounting data.
In an embodiment of the present invention, further, the first determining unit 220 includes:
the first judging subunit judges whether the size of the bonding pad is larger than that of the through hole or not, and if so, the bonding pad is identified as a metalized bonding pad;
and the second judging subunit judges that the metalized pad with the pad surface-mounted attribute of yes is the surface-mounted pad, and judges that the metalized pad with the pad surface-mounted attribute of no is the through hole pad.
In this embodiment, it is specifically stated that the first determining unit 220 includes a first determining subunit and a second determining subunit, and specifically determines the type of the pad according to the pad size, the via size, and the surface mount attribute, where the first determining subunit is configured to determine whether the pad size is larger than the via size, and identify the pad with the pad size larger than the via size as a metalized pad, and the second determining subunit is configured to determine that the metalized pad with the pad surface mount attribute being yes is a surface mount pad, and determine that the metalized pad with the pad surface mount attribute being no is a via pad.
In an embodiment of the present invention, further, the components having the number of surface mount pads larger than the number of through hole pads are identified as components in a surface mount package form.
In this embodiment, it is specifically explained that the packaging form of the component is determined according to the pad types of all the pads of the component, and the component whose number of surface-mounted pads is greater than that of through-hole pads is identified as a surface-mounted component.
In an embodiment of the present invention, further, the execution unit 240 includes:
the first calculation unit is used for automatically calculating the mean value of the extreme coordinates of all the centers of the bonding pads as the central coordinates of the components for the components with the total number of the metallized bonding pads not being 3;
and the second calculating unit is used for automatically calculating the center coordinates of circumscribed circles of the centers of the 3 bonding pads as the center coordinates of the components for the components with the total number of the metallized bonding pads being 3.
The device comprises an acquisition unit, a detection unit and a control unit, wherein the acquisition unit is used for automatically identifying a first bonding pad of a component and acquiring a first bonding pad coordinate;
and the correcting unit is used for automatically calculating the difference value between the 0-degree state of the component in the PCB design coordinate system and the 0-degree state of the component in the chip mounter coordinate system according to the front and back surface attributes of the component, the first pad coordinate, the central coordinate of the component and the angle of the component before correction, and compensating and correcting the component angle in the PCB design coordinate system into the component angle in the chip mounter coordinate system according to the difference value.
In this embodiment, specifically, the execution unit 240 includes: the device comprises a first calculating unit, a second calculating unit, an acquiring unit and a correcting unit. When the central coordinates of the components are calculated, the first calculating unit is used for automatically calculating the mean value of the extreme coordinates of all the centers of the pads as the central coordinates of the components for the components with the total number of the metallized pads not being 3; the second calculating unit is used for automatically calculating the center coordinates of circumscribed circles of the centers of the 3 bonding pads as the center coordinates of the components for the components with the total number of the metallized bonding pads being 3; when the component angle is corrected, firstly, a first pad of the component is automatically identified through the obtaining unit, a first pad coordinate is obtained, then the correcting unit automatically calculates the difference value between the 0-degree state of the component under the PCB design coordinate system and the 0-degree state of the component under the chip mounter coordinate system according to the front and back surface attributes of the component, the first pad coordinate, the central coordinate of the component and the component angle before correction, and compensates and corrects the component angle under the PCB design coordinate system into the component angle under the chip mounter coordinate system according to the difference value.
In an embodiment of the present invention, the first pad coordinates are not used for the mounting program, but the correctness of the first pad coordinates affects the component angle correction calculation. When a component is packaged, most of the pads of the component are identified by "1", "2", "3" … or "a", "B" and "C" …, so the first pad is identified by "1", "2", "3" … or "a", "B" and "C" …. However, in a component having a large number of pads, such as an array device like BGA or CCGA, the pads are designated by a combination of "a", "B", "C" … and "1", "2" or "3" …, and therefore, the first pads are identified in the order of priority as "a 1", "B1", "C1", "a 2", "B2" or "C2" …. Thus, the first pad of the component can be identified by the pad identification.
Further, the component angle of the PCB design software is positive when the component is rotated counterclockwise based on the initial state of the component in the package library, and the component angle of the chip mounter is positive when the component is rotated clockwise based on the initial state of the component in the package library of the chip mounter. In addition, during component packaging, the placement states of the components are not unified for convenience of drawing, so that the initial packaging state of the same component is inconsistent with the initial packaging state of the chip mounter, and the angle is difficult to correct through simple positive-negative conversion. The 0-degree states of components in a packaging library of a known chip mounter are unified: the component is vertically or horizontally arranged, and the arrangement position of the first bonding pad on the second quadrant or the positive Y axis is in a 0-degree state. And automatically calculating the difference value between the 0-degree state of the component in the PCB design coordinate system and the 0-degree state of the component in the chip mounter coordinate system according to the front and back surface attributes of the component, the first pad coordinate, the central coordinate of the component and the angle of the component before correction, and compensating and correcting the component angle in the PCB design coordinate system into the component angle in the chip mounter coordinate system according to the difference value.
And further, outputting an assembly list suitable for the chip mounter mounting program, wherein the assembly list comprises processed data of all component position numbers, component angles, component center coordinates and the like.
The above-mentioned embodiments are only specific embodiments of the present invention, not intended to limit the present invention, but to describe the objects, technical solutions and advantages of the present invention in further detail,
it is intended to cover any variations, equivalents, improvements, etc. within the spirit and scope of the invention as defined by the appended claims.
The foregoing description of specific embodiments of the present invention has been presented. It is to be understood that the present invention is not limited to the specific embodiments described above, and that various changes and modifications may be made by one skilled in the art within the scope of the appended claims without departing from the spirit of the invention.
Claims (8)
1. A SMT mounting data rapid conversion method is characterized by comprising the following steps:
s1, reading the PCB design file, calling a component interface to traverse the component, acquiring the attribute information of the component, calling a component pad interface to traverse a component pad, and acquiring the attribute information of the pad;
s2, judging the type of the pad according to the attribute information of the pad;
s3, judging the packaging form of the component according to the pad types of all the pads of the component;
s4, carrying out data processing of center coordinate calculation and component angle correction on the components identified as surface mount package forms;
and S5, outputting an assembly list suitable for the chip mounter mounting program, wherein the assembly list comprises the processed position numbers of all components, the angles of the components and the central coordinate data of the components.
2. An SMT mounting data fast conversion method according to claim 1,
the PCB design file at least comprises: PCB Layout files; and/or
The attribute information of the components comprises any one or more of the following combinations: position number, front and back sides, encapsulation, number of pads, angle and central coordinate; and/or
The property information of the bonding pad comprises any one or more of the following combinations: identification, shape, pad size, via size, surface mount properties, center coordinates.
3. An SMT data fast conversion method according to claim 1, wherein the determining a pad type based on the pad attribute information comprises:
and judging the type of the bonding pad according to the size of the bonding pad, the size of the through hole and the surface-mounted attribute.
4. An SMT data fast conversion method according to claim 2, wherein said determining a pad type based on the pad attribute information comprises:
judging whether the size of the bonding pad is larger than that of the through hole or not, and if so, identifying the bonding pad as a metalized bonding pad;
and the metalized pad with the pad surface-mounted attribute of yes is a surface-mounted pad, and the metalized pad with the pad surface-mounted attribute of no is a through hole pad.
5. An SMT data fast conversion method according to claim 4, wherein the determining of the packaging type of the component based on the pad types of all the pads of the component comprises:
the components with the number of the surface-mounted pads larger than that of the through-hole pads are identified as the components in the surface-mounted packaging mode.
6. An SMT data fast conversion method according to claim 4, wherein the calculating of center coordinates of components identified as surface mount package format includes:
automatically calculating the mean value of the extreme coordinates of the centers of all the bonding pads as the central coordinates of the components for the components with the total number of the metallized bonding pads not being 3;
and automatically calculating the center coordinates of circumscribed circles of the centers of the 3 bonding pads as the center coordinates of the components for the components with the total number of the metallized bonding pads being 3.
7. An SMT data fast conversion method according to claim 6, wherein the data processing for component angle correction of components identified as surface mount package format comprises:
automatically identifying a first bonding pad of the component, and acquiring a first bonding pad coordinate;
and automatically calculating the difference value between the 0-degree state of the component in the PCB design coordinate system and the 0-degree state of the component in the chip mounter coordinate system according to the front and back surface attributes of the component, the first pad coordinate, the central coordinate of the component and the angle of the component before correction, and compensating and correcting the component angle in the PCB design coordinate system into the component angle in the chip mounter coordinate system according to the difference value.
8. An SMT mounting data rapid conversion system (200), the SMT mounting data rapid conversion system (200) comprising:
the data acquisition unit (210) is used for acquiring a PCB design file and calling a component interface to traverse the component; acquiring attribute information of the component, and calling a component pad interface to traverse a component pad; acquiring attribute information of a bonding pad;
a first judging unit (220) for judging the type of the pad according to the attribute information of the pad;
a second judging unit (230) for judging the packaging form of the component according to the pad types of all the pads of the component;
the execution unit (240) is used for carrying out data processing of center coordinate calculation and component angle correction on the components identified as surface mount packaging forms;
and the output unit (250) is used for outputting an assembly list applicable to the chip mounter mounting program, and the assembly list comprises all the processed component position numbers, component angles and component center coordinate data.
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Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102682166A (en) * | 2012-05-09 | 2012-09-19 | 上海望友信息科技有限公司 | SMT (Surface Mounted Technology) equipment rapid processing system and method |
| CN102929633A (en) * | 2012-11-06 | 2013-02-13 | 上海望友信息科技有限公司 | Program converting method and system used for surface mounting technology (SMT) processing |
| CN104200024A (en) * | 2014-09-01 | 2014-12-10 | 山东超越数控电子有限公司 | Server PCB packaging coordinate setting method |
| WO2017113839A1 (en) * | 2015-12-31 | 2017-07-06 | 广州兴森快捷电路科技有限公司 | Device position indication system and device position indication method |
| CN107133724A (en) * | 2017-04-18 | 2017-09-05 | 冀月斌 | A kind of chip mounter imports bearing calibration and the system of creation data |
| CN107357259A (en) * | 2017-06-06 | 2017-11-17 | 西安微电子技术研究所 | A kind of chip mounter off-line programing information processing method |
| CN108256170A (en) * | 2017-12-26 | 2018-07-06 | 深圳市万相源科技有限公司 | It is a kind of that the modeling optimization method and system for inserting technique are pasted based on pcb board |
| CN109413986A (en) * | 2018-11-15 | 2019-03-01 | 联想(北京)有限公司 | A kind of patch device control method and device, storage medium |
| CN110222381A (en) * | 2019-05-21 | 2019-09-10 | 上海望友信息科技有限公司 | Document generating method, system, medium and terminal are guided in dynamic installation for PCB assembly |
| CN111369505A (en) * | 2020-02-26 | 2020-07-03 | 广东省电信规划设计院有限公司 | Position correction method and device for surface mount device |
| CN111951696A (en) * | 2020-07-30 | 2020-11-17 | 深圳市艾比森光电股份有限公司 | Correction method and related device for LED display screen |
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102682166A (en) * | 2012-05-09 | 2012-09-19 | 上海望友信息科技有限公司 | SMT (Surface Mounted Technology) equipment rapid processing system and method |
| CN102929633A (en) * | 2012-11-06 | 2013-02-13 | 上海望友信息科技有限公司 | Program converting method and system used for surface mounting technology (SMT) processing |
| CN104200024A (en) * | 2014-09-01 | 2014-12-10 | 山东超越数控电子有限公司 | Server PCB packaging coordinate setting method |
| WO2017113839A1 (en) * | 2015-12-31 | 2017-07-06 | 广州兴森快捷电路科技有限公司 | Device position indication system and device position indication method |
| CN107133724A (en) * | 2017-04-18 | 2017-09-05 | 冀月斌 | A kind of chip mounter imports bearing calibration and the system of creation data |
| CN107357259A (en) * | 2017-06-06 | 2017-11-17 | 西安微电子技术研究所 | A kind of chip mounter off-line programing information processing method |
| CN108256170A (en) * | 2017-12-26 | 2018-07-06 | 深圳市万相源科技有限公司 | It is a kind of that the modeling optimization method and system for inserting technique are pasted based on pcb board |
| CN109413986A (en) * | 2018-11-15 | 2019-03-01 | 联想(北京)有限公司 | A kind of patch device control method and device, storage medium |
| CN110222381A (en) * | 2019-05-21 | 2019-09-10 | 上海望友信息科技有限公司 | Document generating method, system, medium and terminal are guided in dynamic installation for PCB assembly |
| CN111369505A (en) * | 2020-02-26 | 2020-07-03 | 广东省电信规划设计院有限公司 | Position correction method and device for surface mount device |
| CN111951696A (en) * | 2020-07-30 | 2020-11-17 | 深圳市艾比森光电股份有限公司 | Correction method and related device for LED display screen |
Non-Patent Citations (4)
| Title |
|---|
| 刘斌峰 等: "SMT产前数据快速准备软件设计与开发", 《微计算机信息》, vol. 25, no. 21, pages 207 - 209 * |
| 尚亚光 等: "转塔式贴装头吸嘴三维位姿误差分析与标定", 《上海交通大学学报》, vol. 50, no. 09, pages 1376 - 1383 * |
| 彭传谦;: "影响PCB文件转换质量的因素分析", 《舰船电子工程》, vol. 33, no. 10, pages 131 - 133 * |
| 汤小双 等: "多品种、小批量电子产品SMT生产过程中阶梯质量环应用", 《电子元器件与信息技术》, no. 03, pages 30 - 35 * |
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