CN113651611A - Ceramic gas sensor porous structure sensitive slurry and preparation method of ceramic gas sensor - Google Patents
Ceramic gas sensor porous structure sensitive slurry and preparation method of ceramic gas sensor Download PDFInfo
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- 239000000919 ceramic Substances 0.000 title claims abstract description 137
- 239000002002 slurry Substances 0.000 title claims abstract description 61
- 238000002360 preparation method Methods 0.000 title claims abstract description 10
- 238000007613 slurry method Methods 0.000 title description 2
- 238000001354 calcination Methods 0.000 claims abstract description 70
- 238000007639 printing Methods 0.000 claims abstract description 32
- 239000000843 powder Substances 0.000 claims abstract description 28
- 239000002245 particle Substances 0.000 claims abstract description 22
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 21
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims abstract description 19
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 15
- 239000001856 Ethyl cellulose Substances 0.000 claims abstract description 12
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 claims abstract description 12
- PRXRUNOAOLTIEF-ADSICKODSA-N Sorbitan trioleate Chemical compound CCCCCCCC\C=C/CCCCCCCC(=O)OC[C@@H](OC(=O)CCCCCCC\C=C/CCCCCCCC)[C@H]1OC[C@H](O)[C@H]1OC(=O)CCCCCCC\C=C/CCCCCCCC PRXRUNOAOLTIEF-ADSICKODSA-N 0.000 claims abstract description 12
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 claims abstract description 12
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 claims abstract description 12
- 229920001249 ethyl cellulose Polymers 0.000 claims abstract description 12
- 235000019325 ethyl cellulose Nutrition 0.000 claims abstract description 12
- 229940116411 terpineol Drugs 0.000 claims abstract description 12
- 239000004793 Polystyrene Substances 0.000 claims abstract description 5
- 229920002223 polystyrene Polymers 0.000 claims abstract description 5
- 238000010438 heat treatment Methods 0.000 claims description 26
- 238000004140 cleaning Methods 0.000 claims description 18
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims description 12
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 12
- 229910052707 ruthenium Inorganic materials 0.000 claims description 12
- 238000010304 firing Methods 0.000 claims description 10
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical group O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 7
- 238000004026 adhesive bonding Methods 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims description 6
- 238000001816 cooling Methods 0.000 claims description 6
- 238000005520 cutting process Methods 0.000 claims description 6
- 238000004806 packaging method and process Methods 0.000 claims description 6
- 229910052697 platinum Inorganic materials 0.000 claims description 6
- 238000003466 welding Methods 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 239000000463 material Substances 0.000 abstract description 23
- 230000000694 effects Effects 0.000 abstract description 5
- 239000000428 dust Substances 0.000 abstract description 2
- 239000000758 substrate Substances 0.000 description 9
- 238000003837 high-temperature calcination Methods 0.000 description 7
- 239000000377 silicon dioxide Substances 0.000 description 6
- 235000012239 silicon dioxide Nutrition 0.000 description 6
- 230000004044 response Effects 0.000 description 5
- 238000002156 mixing Methods 0.000 description 4
- 238000003756 stirring Methods 0.000 description 4
- 239000007787 solid Substances 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 238000004513 sizing Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 229910002091 carbon monoxide Inorganic materials 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000003995 emulsifying agent Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
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Abstract
The invention relates to the technical field of preparation of new materials for gas sensors, in particular to sensitive slurry for a porous structure of a ceramic gas sensor and a preparation method of the ceramic gas sensor. Comprises tin powder, pore-forming powder, alumina particles, silica particles, terpineol, span 85 and ethyl cellulose. According to the sensitive slurry of the ceramic gas sensor, the pore-forming powder mainly comprising saw dust or polystyrene balls is added, and after calcination, the pore-forming powder is completely removed, so that the pore-forming effect is achieved, the specific surface area of the gas-sensitive material is increased, gas flow is facilitated, and the gas-sensitive performance of the gas-sensitive material can be effectively improved. The ceramic chip before printing the sensitive slurry is not completely sintered, the semi-sintered ceramic chip is adopted, and after printing the sensitive slurry, the sensitive slurry and the ceramic chip are sintered together, so that the direct bonding force of the sensitive slurry and the ceramic chip is effectively improved, and the structure is more stable and reliable.
Description
Technical Field
The invention relates to the technical field of preparation of new materials for gas sensors, in particular to sensitive slurry for a porous structure of a ceramic gas sensor and a preparation method of the ceramic gas sensor.
Background
The gas sensor has a plurality of application fields, such as fire alarm, gas detection, methane and carbon monoxide detection in mines and the like. In these applications, the problems of long-term operation, the bonding force between the sensitive material and the ceramic substrate, and the problem that the sensitive material will not fall off in a high-humidity environment and high-frequency vibration for a long time are considered, and particularly, a high anti-vibration effect is required in the field of vehicle sensors.
The ceramic-based gas sensor is manufactured by printing a fork tooth electrode and a heating electrode on a sintered ceramic chip, calcining at high temperature to solidify the electrode, then printing a sensitive material on the fork tooth electrode, and drying and solidifying the sensitive material to remove an organic solvent in the sensitive material by high-temperature calcination. The traditional ceramic gas sensor is characterized in that sensitive materials are coated on sintered ceramics, so that even a bonding agent added with the ceramics at the later stage is difficult to integrate the sensitive materials with the ceramics, the bonding force is slightly poor, most of porous structures of the gas sensitive materials are made of the materials, pores given from the outside are few, and the performance is general.
Disclosure of Invention
The invention aims to provide sensitive slurry of a porous structure of a ceramic gas sensor, the ceramic gas sensor with good bonding force and excellent performance prepared from the sensitive slurry and a preparation method thereof.
The technical scheme adopted by the invention for solving the technical problems is as follows:
a ceramic gas sensor porous structure sensitive slurry comprises tin powder, pore-forming powder, alumina particles, silica particles, terpineol, span 85 and ethyl cellulose.
Further, the mass ratio of the tin powder, the pore-forming powder, the alumina particles, the silica particles, the terpineol, the span 85 and the ethyl cellulose is (10-15): (0.5-1.5): (0.5-1.5): (0.5-1.5): (10-30): (0.01-0.5): (0.01-0.2).
Further, the tin powder is tin dioxide, and the particle size is 0.05-1 μm.
Further, the pore-forming powder is sawdust or polystyrene balls.
Furthermore, the particle size of the pore-forming powder is 0.05-2 μm.
Further, the alumina particles and the silica particles have a particle size of 0.05 to 1.5 μm.
The preparation method of the ceramic gas sensor comprises the following steps:
step 1: placing the formed ceramic wafer blank into a ceramic firing kiln, adjusting the temperature of the ceramic firing kiln to be 300-500 ℃ for calcining to obtain a semi-fired ceramic wafer, and cleaning the semi-fired ceramic wafer;
step 2: printing a heating electrode taking a platinum electrode as a conductive material on one surface of the semi-sintered ceramic plate, and calcining the heating electrode, wherein the calcining temperature is 300-500 ℃;
and step 3: cleaning the ceramic wafer calcined with the heating electrode, printing a layer of resistance ruthenium slurry on the fixed position of the heating electrode, and calcining the resistance ruthenium slurry at the calcining temperature of 300-500 ℃;
and 4, step 4: cleaning the ceramic wafer calcined in the step 3, printing a prong electrode on the other surface of the semi-calcined ceramic wafer, and calcining the semi-calcined ceramic wafer at the calcining temperature of 300-500 ℃;
and 5: printing sensitive slurry of a porous structure of the ceramic gas sensor on the fork tooth electrode, and calcining, insulating and cooling the sensitive slurry at the calcining temperature of 900-;
step 6: and 5, cutting, sticking wires, spot welding, gluing and packaging the ceramic wafer cooled in the step 5 to obtain the ceramic gas sensor.
Further, the calcination time in the step 1 is 1-4 h.
Further, the calcination time in the step 2, the step 3 and the step 4 is 0.5-2 h.
Further, the calcination time in the step 5 is 1-5 h.
The invention has the beneficial effects that:
1. the method has the advantages that the saw dust or polystyrene ball-based pore-forming powder is added into the sensitive slurry of the ceramic gas sensor, and after the sensitive slurry is calcined, the pore-forming powder is completely removed, so that the pore-forming effect is achieved, the surface area of the gas-sensitive material is increased, the gas flow is facilitated, and the gas-sensitive performance of the gas-sensitive material can be effectively improved.
2. The ceramic chip before printing the sensitive slurry is not completely sintered, the semi-sintered ceramic chip is adopted, and after printing the sensitive slurry, the sensitive slurry and the ceramic chip are sintered together, so that the direct bonding force of the sensitive slurry and the ceramic chip is effectively improved, and the structure is more stable and reliable.
3. Because the sensitive slurry is added with alumina and the ceramic plate also contains alumina, the bonding force between the sensitive slurry and the ceramic plate can be further increased when the sensitive slurry and the ceramic plate are calcined together at high temperature.
Drawings
FIG. 1 is a graph of the response of the gas sensor of the present invention.
1. Conventional gas sensor, 2, examples 1, 3, examples 2, 4, example 3.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
A ceramic gas sensor porous structure sensitive slurry comprises tin powder, pore-forming powder, alumina particles, silica particles, terpineol, span 85 and ethyl cellulose.
The mass ratio of tin powder, pore-forming powder, alumina particles, silica particles, terpineol, span 85 and ethyl cellulose is (10-15): (0.5-1.5): (0.5-1.5): (0.5-1.5): (10-15): (0.01-0.1): (0.01-0.1). The tin powder is tin dioxide, the particle size is 0.05-1 mu m, the pore-forming powder is saw powder or polystyrene spheres, the particle size of the pore-forming powder is 0.05-2 mu m, and the particle sizes of the aluminum oxide particles and the silicon dioxide particles are 0.05-1.5 mu m. And fully mixing and uniformly stirring the raw materials to obtain the porous structure sensitive slurry of the ceramic gas sensor. Wherein, the terpineol is used as a solvent of the sensitive sizing agent to fully and uniformly fuse tin powder, pore-forming powder, alumina particles and silicon dioxide particles, span 85 is used as an emulsifier, and ethyl cellulose is used as an organic carrier of the sensitive sizing agent.
The sensitive slurry forms a porous gas-sensitive material after high-temperature calcination in the later period, wherein the pore-forming powder, terpineol, span 85 and ethyl cellulose are completely burnt out in the high-temperature calcination process in the later period, so that a porous structure is formed on the gas-sensitive material, and the specific surface area of the gas-sensitive material is increased. The tin powder forms tin dioxide after high-temperature calcination, is the main gas-sensitive part of the gas-sensitive material and is used for adsorbing gas to be tested. Because the ceramic chip substrate also contains alumina, the alumina in the sensitive slurry can be burnt together with the alumina in the ceramic chip substrate when high-temperature calcination is carried out at the later stage, so that the binding force between the alumina and the ceramic chip substrate is increased, the structure of the ceramic chip substrate is more stable and reliable, and the falling of sensitive materials during high-frequency vibration is reduced.
A preparation method of a ceramic gas sensor comprises the following steps:
step 1: placing the formed ceramic wafer blank into a ceramic firing kiln, adjusting the temperature of the ceramic firing kiln to be 300-500 ℃ for calcining to obtain a semi-fired ceramic wafer, and cleaning the semi-fired ceramic wafer;
step 2: printing a heating electrode taking a platinum electrode as a conductive material on one surface of the semi-sintered ceramic plate, and calcining the heating electrode at the calcining temperature of 300-500 ℃;
and step 3: cleaning the ceramic wafer with the calcined heating electrode, printing a layer of resistance ruthenium slurry on the fixed position of the heating electrode, and calcining the resistance ruthenium slurry at the calcining temperature of 300-500 ℃;
and 4, step 4: cleaning the ceramic wafer calcined in the step 3, printing a prong electrode on the other surface of the semi-calcined ceramic wafer, and calcining the ceramic wafer at the calcining temperature of 300-500 ℃;
and 5: printing the ceramic gas sensor porous structure sensitive slurry on a fork tooth electrode, and calcining, insulating and cooling the slurry at the calcining temperature of 900-;
step 6: and 5, cutting, wire sticking, spot welding, gluing and packaging the ceramic wafer cooled in the step 5 to obtain the ceramic gas sensor.
Wherein the calcination time in the step 1 is 1-4h, the calcination time in the steps 2, 3 and 4 is 0.5-2h, and the calcination time in the step 5 is 1-5 h.
And (2) obtaining a semi-sintered ceramic wafer through the primary calcination at the temperature of 300-plus-500 ℃, printing and calcining the heating electrode and the prong electrode on two surfaces of the semi-sintered ceramic wafer in sequence, then printing the prepared sensitive slurry with the porous structure on the prong electrode as a gas sensitive material, and carrying out high-temperature calcination molding on the printed sensitive slurry and the semi-sintered ceramic wafer at the temperature of 900-plus-1300 ℃. The solvent and the pore-forming powder of the sensitive slurry can be removed during high-temperature calcination, the pore-forming powder can achieve the pore-forming effect on the gas-sensitive material after being completely burnt out, and the gas-sensitive material and the ceramic wafer substrate achieve an integrated structure due to the effects of the aluminum oxide and the silicon dioxide, so that the binding force is better.
Example 1
Taking 10g of tin powder, 0.5g of pore-forming powder, 0.5g of alumina and 0.5g of silicon dioxide, adding 10g of terpineol, 0.01g of span 85 and 0.01g of ethyl cellulose into the solid, and fully stirring and uniformly mixing to prepare the sensitive slurry.
The method for preparing the ceramic gas sensor of example 1 includes the following steps:
step 1: placing the formed ceramic wafer blank into a ceramic firing kiln, adjusting the temperature of the ceramic wafer blank to be 300-500 ℃ for calcining for 1-4h, determining the calcining time according to the thickness of a specific ceramic substrate to obtain a semi-fired ceramic wafer, and cleaning the semi-fired ceramic wafer;
step 2: printing a heating electrode taking a platinum electrode as a conductive material on one surface of the semi-sintered ceramic sheet, and calcining the heating electrode at the calcining temperature of 300-500 ℃ for 0.5-2 h;
and step 3: cleaning the ceramic wafer with the calcined heating electrode, printing a layer of resistance ruthenium slurry on the fixed position of the heating electrode, and calcining the resistance ruthenium slurry at the calcining temperature of 300-500 ℃ for 0.5-2 h;
and 4, step 4: cleaning the ceramic wafer calcined in the step 3, printing a prong electrode on the other surface of the semi-calcined ceramic wafer, and calcining the ceramic wafer at the calcining temperature of 300-500 ℃ for 0.5-2 h;
and 5: printing the sensitive slurry of the porous structure of the ceramic gas sensor on the prong electrode, calcining, preserving heat and cooling the sensitive slurry, wherein the calcining temperature is 900-;
step 6: and 5, cutting, wire sticking, spot welding, gluing and packaging the ceramic wafer cooled in the step 5 to obtain the ceramic gas sensor.
As shown in fig. 1, the output voltage of the conventional gas sensor 1 without the pore-forming powder added thereto was about 0.555v, the output voltage of the porous structure gas sensor prepared in example 1 was about 0.6781, and the higher the output voltage, the higher the response value thereof, and the more excellent the performance.
Example 2
Taking 12g of tin powder, 1g of pore-forming powder, 1g of alumina and 1g of silicon dioxide, adding 12g of terpineol, 0.05g of span 85 and 0.05g of ethyl cellulose into the solid, and fully stirring and uniformly mixing to prepare the sensitive slurry.
The method for preparing the ceramic gas sensor of example 2 includes the following steps:
step 1: placing the formed ceramic wafer blank into a ceramic firing kiln, adjusting the temperature of the ceramic wafer blank to be 300-500 ℃ for calcining for 1-4h, determining the calcining time according to the thickness of a specific ceramic substrate to obtain a semi-fired ceramic wafer, and cleaning the semi-fired ceramic wafer;
step 2: printing a heating electrode taking a platinum electrode as a conductive material on one surface of the semi-sintered ceramic sheet, and calcining the heating electrode at the calcining temperature of 300-500 ℃ for 0.5-2 h;
and step 3: cleaning the ceramic wafer with the calcined heating electrode, printing a layer of resistance ruthenium slurry on the fixed position of the heating electrode, and calcining the resistance ruthenium slurry at the calcining temperature of 300-500 ℃ for 0.5-2 h;
and 4, step 4: cleaning the ceramic wafer calcined in the step 3, printing a prong electrode on the other surface of the semi-calcined ceramic wafer, and calcining the ceramic wafer at the calcining temperature of 300-500 ℃ for 0.5-2 h;
and 5: printing the sensitive slurry of the porous structure of the ceramic gas sensor on the prong electrode, calcining, preserving heat and cooling the sensitive slurry, wherein the calcining temperature is 900-;
step 6: and 5, cutting, wire sticking, spot welding, gluing and packaging the ceramic wafer cooled in the step 5 to obtain the ceramic gas sensor.
As shown in fig. 1, the output voltage of the conventional gas sensor 1 without the pore-forming powder added thereto was about 0.555v, the output voltage of the porous structure gas sensor prepared in example 2 was about 0.7710, the output voltage was much higher than that of the conventional gas sensor 1, and the response value was the highest.
Example 3
15g of tin powder, 1.5g of pore-forming powder, 1.5g of alumina and 1.5g of silicon dioxide are taken, 15g of terpineol, 0.1g of span 85 and 0.1g of ethyl cellulose are added into the solid, and the sensitive slurry is prepared by fully stirring and uniformly mixing.
The method of making the ceramic gas sensor of example 3, comprising the steps of:
step 1: placing the formed ceramic wafer blank into a ceramic firing kiln, adjusting the temperature of the ceramic wafer blank to be 300-500 ℃ for calcining for 1-4h, determining the calcining time according to the thickness of a specific ceramic substrate to obtain a semi-fired ceramic wafer, and cleaning the semi-fired ceramic wafer;
step 2: printing a heating electrode taking a platinum electrode as a conductive material on one surface of the semi-sintered ceramic sheet, and calcining the heating electrode at the calcining temperature of 300-500 ℃ for 0.5-2 h;
and step 3: cleaning the ceramic wafer with the calcined heating electrode, printing a layer of resistance ruthenium slurry on the fixed position of the heating electrode, and calcining the resistance ruthenium slurry at the calcining temperature of 300-500 ℃ for 0.5-2 h;
and 4, step 4: cleaning the ceramic wafer calcined in the step 3, printing a prong electrode on the other surface of the semi-calcined ceramic wafer, and calcining the ceramic wafer at the calcining temperature of 300-500 ℃ for 0.5-2 h;
and 5: printing the sensitive slurry of the porous structure of the ceramic gas sensor on the prong electrode, calcining, preserving heat and cooling the sensitive slurry, wherein the calcining temperature is 900-;
step 6: and 5, cutting, wire sticking, spot welding, gluing and packaging the ceramic wafer cooled in the step 5 to obtain the ceramic gas sensor.
As shown in fig. 1, the output voltage of the conventional gas sensor 1 to which the pore-forming powder was not added was about 0.555v, and the output voltage of the porous structure gas sensor prepared by example 3 was about 0.7347.
In summary, the response value of the conventional gas sensor 1 is the lowest, and it can be seen that the response value of the gas sensitive device prepared by the integrated firing method of the present invention is generally better than the gas sensitive performance of the normally prepared method.
The above-mentioned embodiments are intended to illustrate the objects, technical solutions and advantages of the present invention in further detail, and it should be understood that the above-mentioned embodiments are only exemplary embodiments of the present invention, and are not intended to limit the present invention, and any modifications, equivalents, improvements and the like made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. The porous structure sensitive slurry for the ceramic gas sensor is characterized in that: comprises tin powder, pore-forming powder, alumina particles, silica particles, terpineol, span 85 and ethyl cellulose.
2. The ceramic gas sensor porous structure sensitive slurry of claim 1, wherein: the mass ratio of the tin powder, the pore-forming powder, the alumina particles, the silica particles, the terpineol, the span 85 and the ethyl cellulose is (10-15): (0.5-1.5): (0.5-1.5): (0.5-1.5): (10-15): (0.01-0.1): (0.01-0.1).
3. The ceramic gas sensor porous structure sensitive slurry of claim 1, wherein: the tin powder is tin dioxide, and the particle size is 0.05-1 mu m.
4. The ceramic gas sensor porous structure sensitive slurry of claim 1, wherein: the pore-forming powder is sawdust or polystyrene balls.
5. The ceramic gas sensor porous structure sensitive slurry of claim 1, wherein: the particle size of the pore-forming powder is 0.05-2 μm.
6. The ceramic gas sensor porous structure sensitive slurry of claim 1, wherein: the particle diameters of the alumina particles and the silica particles are 0.05-1.5 μm.
7. The preparation method of the ceramic gas sensor is characterized by comprising the following steps: the method comprises the following steps:
step 1: placing the formed ceramic wafer blank into a ceramic firing kiln, adjusting the temperature of the ceramic firing kiln to be 300-500 ℃ for calcining to obtain a semi-fired ceramic wafer, and cleaning the semi-fired ceramic wafer;
step 2: printing a heating electrode taking a platinum electrode as a conductive material on one surface of the semi-sintered ceramic plate, and calcining the heating electrode, wherein the calcining temperature is 300-500 ℃;
and step 3: cleaning the ceramic wafer calcined with the heating electrode, printing a layer of resistance ruthenium slurry on the fixed position of the heating electrode, and calcining the resistance ruthenium slurry at the calcining temperature of 300-500 ℃;
and 4, step 4: cleaning the ceramic wafer calcined in the step 3, printing a prong electrode on the other surface of the semi-calcined ceramic wafer, and calcining the semi-calcined ceramic wafer at the calcining temperature of 300-500 ℃;
and 5: printing sensitive slurry of a porous structure of the ceramic gas sensor on the fork tooth electrode, and calcining, insulating and cooling the sensitive slurry at the calcining temperature of 900-;
step 6: and 5, cutting, sticking wires, spot welding, gluing and packaging the ceramic wafer cooled in the step 5 to obtain the ceramic gas sensor.
8. The method of manufacturing a ceramic gas sensor according to claim 7, wherein: the calcination time in the step 1 is 1-4 h.
9. The method of manufacturing a ceramic gas sensor according to claim 7, wherein: the calcination time in the step 2, the step 3 and the step 4 is 0.5-2 h.
10. The method of manufacturing a ceramic gas sensor according to claim 7, wherein: the calcination time in the step 5 is 1-5 h.
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