CN113639853A - Fault detection device and fault detection circuit of stamping die - Google Patents
Fault detection device and fault detection circuit of stamping die Download PDFInfo
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- CN113639853A CN113639853A CN202111007498.0A CN202111007498A CN113639853A CN 113639853 A CN113639853 A CN 113639853A CN 202111007498 A CN202111007498 A CN 202111007498A CN 113639853 A CN113639853 A CN 113639853A
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- 238000001514 detection method Methods 0.000 title claims abstract description 34
- 239000000919 ceramic Substances 0.000 claims description 12
- 238000013016 damping Methods 0.000 claims description 11
- 238000001914 filtration Methods 0.000 claims description 6
- 238000004080 punching Methods 0.000 claims description 5
- 230000001934 delay Effects 0.000 claims description 3
- 238000003860 storage Methods 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 238000005299 abrasion Methods 0.000 abstract description 5
- 238000005336 cracking Methods 0.000 abstract description 4
- 239000003292 glue Substances 0.000 description 4
- 230000009191 jumping Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 230000000644 propagated effect Effects 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 230000005236 sound signal Effects 0.000 description 3
- 230000002159 abnormal effect Effects 0.000 description 2
- 230000003139 buffering effect Effects 0.000 description 2
- 230000010355 oscillation Effects 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
- G01H11/00—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties
- G01H11/06—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means
- G01H11/08—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means using piezoelectric devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
- B21C51/00—Measuring, gauging, indicating, counting, or marking devices specially adapted for use in the production or manipulation of material in accordance with subclasses B21B - B21F
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D55/00—Safety devices protecting the machine or the operator, specially adapted for apparatus or machines dealt with in this subclass
Abstract
The invention relates to a fault detection device of a stamping die and a fault detection circuit thereof, which comprise a first piezoelectric sound pickup for detecting the vibration condition of an upper die and a second piezoelectric sound pickup for detecting the vibration condition of a lower die, wherein the first piezoelectric sound pickup is arranged on the upper die, and the second piezoelectric sound pickup is arranged on the lower die. The fault detection device can timely respond to the fault phenomena of spring breakage, punch abrasion, movable assembly clamping stagnation, movable assembly cracking, mistaken feeding and the like of the stamping die, so that the economic loss is reduced.
Description
Technical Field
The invention relates to the technical field of stamping dies, in particular to a fault detection device of a stamping die.
Background
At present, fault phenomena such as mistaken feeding, scrap jumping, damage of a mold insert, breakage of a spring and the like can occur in the stamping production process of a high-speed continuous stamping mold, and various fault detectors are required to detect the fault phenomena, and then the stamping mold is closed in time, so that the stamping mold is protected.
At present, the general detection scheme of the stamping die is as follows: and installing a bottom dead center detection device to monitor the operation of the stamping die. The bottom dead center detection device consists of a bottom dead center sensor and a controller, wherein the sensor consists of a coil, is arranged on the lower template and forms an LC oscillator with a related circuit of the controller to form a magnetic field with fixed oscillation frequency. When the upper die assembly of the stamping die descends to the bottom dead center, the iron core is equivalently added into the coil, so that the oscillation frequency and the intensity of the electronic circuit are changed. The controller is equivalent to the detection of the position degree change of an upper die assembly of the stamping die at the bottom dead center through detecting and comparing the frequency and the intensity change of the bottom dead center of each working stroke of the stamping die, when the stamping die generates scrap jumping and stacking, the fluctuation value of the frequency of the bottom dead center of the die exceeds a set value, and the controller outputs a signal to close the stamping die, so that the stamping die is protected.
The fault classification of the high-speed continuous stamping die comprises scrap jumping, material stacking, spring breaking, punch abrasion, movable assembly clamping stagnation, movable assembly cracking, mistaken material conveying and the like. The bottom dead center detection device can only react to the condition that scrap jumping, material stacking and the like can cause the change of the closing height of the upper die stripper plate, but the bottom dead center detection device can not timely react to the internal fault phenomena of the die, such as spring breakage, punch abrasion, movable assembly clamping stagnation, material mis-feeding and the like, the fault phenomena can cause severe vibration of the upper die and the lower die, the die failure is possibly aggravated, and the economic loss is increased.
Disclosure of Invention
The first object of the present invention is to provide a fault detection device for a press die, which can timely respond to various fault phenomena in the press die, reduce loss, and avoid aggravation of failure.
The first invention of the present invention is realized by:
the utility model provides a stamping die's fault detection device, stamping die includes mould, bed die and central controller, mould fault detection device is including the first piezoelectricity sound pick-up that is used for detecting the vibrations condition of mould and the second piezoelectricity sound pick-up that is used for detecting the vibrations condition of bed die, first piezoelectricity sound pick-up is located on the mould, second piezoelectricity sound pick-up is located on the bed die, first piezoelectricity sound pick-up and second piezoelectricity sound pick-up respectively with central controller electric connection, central controller is fed back to the vibrations condition of mould with first piezoelectricity sound pick-up, central controller is fed back to the vibrations condition of bed die with the second piezoelectricity sound pick-up.
The fault detection device can timely respond to the fault phenomena of spring breakage, punch abrasion, movable assembly clamping stagnation, movable assembly cracking, mis-feeding and the like of the stamping die, and the stamping die can be stopped in time, so that the economic loss is reduced and the internal failure aggravation of the stamping die can be prevented. The detection principle of the invention is that when the upper and lower dies are in normal operation, the vibration frequency and the vibration intensity generated in each working period are the same, the first piezoelectric sound pick-up head and the second piezoelectric sound pick-up head respectively convert the vibration mechanical energy of the upper and lower dies into electric signals and then transmit the electric signals to the central controller, the fault detection device judges that the vibration frequency and the vibration intensity do not exceed the numerical values set in the central controller, and the central controller controls the whole stamping die to continue to work. When the upper die or the lower die abnormally operates, the upper die or the lower die can abnormally vibrate, and if the vibration frequency and the vibration strength of the upper die or the lower die exceed the values set inside the central controller, the central controller can control the whole stamping die to stop.
The present invention may be further improved as follows.
The first piezoelectric sound pick-up is arranged on an upper die base of the upper die, and the second piezoelectric sound pick-up is arranged on a lower die base of the lower die.
First piezoelectricity sound pick-up and second piezoelectricity sound pick-up all include that shell, pickup contact, elastic damping body, supporting piece, equalizer blade, piezoceramics piece and buffering glue, the inner, elastic damping body, supporting piece, equalizer blade, piezoceramics piece and the buffering of pickup contact are glued and are located in the shell in proper order to offset in proper order, the shell is stretched out to the outer end of pickup contact. The structure of the piezoelectric sound pick-up can enable the piezoelectric ceramic piece to pick up audio signals propagated through the solid. The audio signal (vibration signal) of the upper die or the lower die is transmitted to the piezoelectric ceramic sheet sequentially through the pickup contact, the elastic damping body and the pressure equalizing sheet, corresponding micro-current is generated on the piezoelectric ceramic sheet, the micro-current is processed into an electric signal through the amplifier at the later stage, and then the electric signal is transmitted to the next stage for processing.
The upper die base and the lower die base are respectively provided with a first mounting hole and a second mounting hole, and the pickup contact of the first piezoelectric sound pickup and the pickup contact of the second piezoelectric sound pickup are respectively arranged in the first mounting hole and the second mounting hole.
The elastic damping body is a spring.
The shell is including support and the enclosing cover that is connected, the outer end of pickup contact is from stretching out on the support, the cushion gum supports and leans on the enclosing cover, piezoceramics piece's signal line stretches out the enclosing cover.
A second object of the present invention is to provide a fault detection circuit for a press die, which can timely respond to various fault phenomena in the press die, reduce loss, and avoid aggravation of failure.
The second object of the present invention is achieved by:
a fault detection circuit of a stamping die comprises a first piezoelectric sound pickup, a first filter, a first signal amplifier, a first signal delay memory, a first signal frequency divider, a first signal comparator, a second piezoelectric sound pickup, a second filter, a second signal amplifier, a second signal delay memory, a second signal frequency divider, a second signal comparator and a central controller, wherein the first piezoelectric sound pickup converts vibration mechanical energy of an upper die of the stamping die into a first pulse signal and then transmits the first pulse signal to the first filter for filtering, the first signal amplifier amplifies the filtered first pulse signal, the first signal frequency divider transmits the first pulse signal to the first signal comparator and the first signal delay memory respectively, the first signal delay memory delays and stores the first pulse signal, the first signal delay memory transmits the first pulse signal of an upper period to the first signal comparator, the first signal comparator compares a first signal of the current period with a first pulse signal of the previous period, and if the value difference between the first pulse signal of the current period and the first pulse signal of the previous period is smaller than the value set in the comparator, the first signal comparator outputs a normal signal to the central controller, and the central controller controls the stamping die to continue working; on the contrary, if the value difference between the first pulse signal of the current period and the first pulse signal of the previous period is larger than the value set in the first signal comparator, the first signal comparator outputs a fault signal to the central controller, and the central controller controls the punching die to stop.
The second piezoelectric sound pick-up converts the vibration mechanical energy of the lower die of the stamping die into a second pulse signal, then the second pulse signal is transmitted to a second filter for filtering, then the second signal amplifier amplifies the filtered second pulse signal, then the second signal frequency divider transmits the second pulse signal to a second signal comparator and a second signal delay memory respectively, the second signal delay memory carries out delay storage on the second pulse signal, the second signal delay memory transmits the second pulse signal of the previous period to a second signal comparator, the second signal comparator compares the second pulse signal of the current period with the second pulse signal of the previous period, and if the value difference between the second pulse signal of the current period and the second pulse signal of the previous period is smaller than the value set in the second signal comparator, the comparator outputs a normal signal to the central controller, the central controller controls the stamping die to continue working; on the contrary, if the value difference between the second pulse signal of the current period and the second pulse signal of the previous period is larger than the value set in the second signal comparator, the second signal comparator outputs a fault signal to the central controller, and the central controller controls the punching die to stop.
The value of the first pulse signal and the value of the second pulse signal refer to the frequency or the intensity of the pulse signals.
The first signal delay memory and the second signal delay memory delay and store the pulse signal of the previous period so that the next period is sent to the comparator for comparison.
The invention has the following beneficial effects:
the fault detection device comprises a central controller, a central sound processor, a central controller and a stamping die, wherein the central sound processor is used for acquiring vibration conditions of an upper die and a lower die respectively through two piezoelectric sound pick-up devices, converting the vibration conditions into electric signals and sending the electric signals to the central controller, the central controller analyzes and judges whether the upper die and the lower die are in abnormal vibration, if the upper die and the lower die are in abnormal vibration, the central controller controls the stamping die to be stopped in time, and otherwise, the stamping die continues to operate. The fault detection device can timely respond to the fault phenomena of spring breakage, punch abrasion, movable assembly clamping stagnation, movable assembly cracking, mis-feeding and the like of the stamping die, and the stamping die can be stopped in time, so that the economic loss is reduced and the internal failure aggravation of the stamping die can be prevented.
In addition, the piezoelectric ceramic plate of the conventional piezoelectric sound pickup can only pick up airborne sound, but cannot pick up vibration propagated through a solid, and the piezoelectric sound pickup of the present invention has a structure that enables the piezoelectric ceramic plate to pick up vibration signals propagated through the solid.
Drawings
Fig. 1 is a schematic structural view of a failure detection device of a press die according to the present invention.
Fig. 2 is a half sectional view of the first piezoelectric pickup of the present invention.
Fig. 3 is a circuit diagram of a failure detection circuit of the press die of the present invention.
Fig. 4 is an enlarged view at a in fig. 1.
Detailed Description
The invention is further described with reference to the following figures and examples.
In a first embodiment, as shown in fig. 1 to 4, a fault detection apparatus for a stamping die includes an upper die 91, a lower die 92 and a central controller 8, the fault detection apparatus for a stamping die includes a first piezoelectric sound pickup 1 for detecting a vibration condition of the upper die 91 and a second piezoelectric sound pickup 11 for detecting a vibration condition of the lower die 92, the first piezoelectric sound pickup 1 is disposed on the upper die 91, the second piezoelectric sound pickup 11 is disposed on the lower die 92, the first piezoelectric sound pickup 1 and the second piezoelectric sound pickup 11 are respectively electrically connected to the central controller 8, the first piezoelectric sound pickup 1 feeds back the vibration condition of the upper die 91 to the central controller 8, and the second piezoelectric sound pickup 11 feeds back the vibration condition of the lower die 92 to the central controller 8.
The present invention is a more specific embodiment.
The first piezoelectric sound pickup 1 is disposed on an upper die seat 93 of the upper die 91, and the second piezoelectric sound pickup 11 is disposed on a lower die seat 94 of the lower die 92.
First piezoelectricity sound pick-up 1 and second piezoelectricity sound pick-up 11 all include shell 111, pick-up contact 10, elastic damping body 15, supporting piece 16, equalizer plate 17, piezoceramics piece 18 and cushion and glue 19, the inner, elastic damping body 15, supporting piece 16, equalizer plate 17, piezoceramics piece 18 and the cushion of pick-up contact 10 glue 19 and locate in shell 111 in proper order to offset in proper order, shell 111 is stretched out to the outer end of pick-up contact 10.
The upper die holder 93 and the lower die holder 94 are respectively provided with a first mounting hole 95 and a second mounting hole 96, and the pickup contact 10 of the first piezoelectric sound pickup 1 and the pickup contact 10 of the second piezoelectric sound pickup 11 are respectively arranged in the first mounting hole 95 and the second mounting hole 96.
The piezoelectric sound pickup of the present invention has a structure that enables the piezoelectric ceramic plate 18 to pick up an audio signal (vibration signal) propagated through a solid. The vibration of the upper die holder 93 and the lower die holder 94 is transmitted to the piezoelectric ceramic piece 18 through the pickup contact 10, the elastic damping body 15 and the pressure equalizing piece 17 in sequence, corresponding micro-current is generated on the piezoelectric ceramic piece 18, the micro-current is processed into an electric signal through an amplifier at the later stage, and then the electric signal is transmitted to the next stage for processing.
The elastic damping body 15 is a spring. The spring has both ends abutting against the pickup contact 10 and the supporting piece 16, respectively.
The shell 111 comprises a support 12 and an outer cover 13 which are connected, the outer end of the pickup contact 10 extends out of the support 12, the buffer glue 19 abuts against the outer cover 13, and the signal line of the piezoelectric ceramic piece 18 extends out of the outer cover 13.
A connecting hole 121 is formed in the support 12 of the first piezoelectric sound pickup 1, a bolt 97 penetrates through the connecting hole 121, and the bolt 97 is in threaded connection with the upper die base 93. The second piezoelectric pickup is mounted in a manner similar to that of the first piezoelectric pickup 1, and will not be described in detail.
The fault detection circuit of the fault detection device comprises a first piezoelectric sound pickup 1, a first filter 2, a first signal amplifier 3, a first signal delay memory 5, a first signal frequency divider 6, a first signal comparator 7, a second piezoelectric sound pickup 11, a second filter 21, a second signal amplifier 31, a second signal delay memory 51, a second signal frequency divider 61, a second signal comparator 71 and a central controller 8, wherein the first piezoelectric sound pickup 1 converts vibration mechanical energy of an upper die 91 of a stamping die into a first pulse signal and then transmits the first pulse signal to the first filter 2 for filtering, then the first signal amplifier 3 amplifies the filtered first pulse signal, the first signal frequency divider 6 transmits the first pulse signal to the first signal comparator 7 and the first signal delay memory 5 respectively, the first signal delay memory 5 delays and stores the first pulse signal, the first signal delay memory 5 transmits the first pulse signal of the previous period to the first signal comparator 7, the first signal comparator 7 compares the first signal of the current period with the first pulse signal of the previous period, if the difference between the value of the first pulse signal of the current period and the value of the first pulse signal of the previous period is smaller than the value set in the first signal comparator 7, the comparator outputs a normal signal to the central controller 8, and the central controller 8 controls the stamping die to continue working; on the contrary, if the difference between the value of the first pulse signal in the current period and the value of the first pulse signal in the previous period is larger than the value set inside the first signal comparator 7, the first signal comparator 7 outputs a fault signal to the central controller 8, and the central controller 8 controls the punching die to stop.
The second piezoelectric sound pickup 11 converts the vibration mechanical energy of the lower die 92 of the press die into a second pulse signal, and then transmits the second pulse signal to the second filter 21 for filtering, then the second signal amplifier 31 amplifies the filtered second pulse signal, and then the second signal frequency divider 61 transmits the second pulse signal to the second signal comparator 71 and the second signal delay memory 51, respectively, the second signal delay memory 51 stores the second pulse signal in a delay manner, the second signal delay memory 51 transmits the second pulse signal of the previous period to the second signal comparator 71, the second signal comparator 71 compares the second pulse signal of the current period with the second pulse signal of the previous period, if the difference between the value of the second pulse signal of the current period and the value of the second pulse signal of the previous period is smaller than the value set inside the second signal comparator 71, the second signal comparator 71 outputs a normal signal to the central controller 8, the central controller 8 controls the stamping die to continue working; on the contrary, if the difference between the second pulse signal of the current period and the second pulse signal of the previous period is greater than the value set inside the second signal comparator 71, the second signal comparator outputs a fault signal to the central controller 8, and the central controller 8 controls the press mold to stop.
The value of the first pulse signal and the value of the second pulse signal refer to the frequency or the intensity of the pulse signals.
The first signal delay memory and the second signal delay memory delay and store the pulse signal of the previous period so that the next period is sent to the comparator for comparison.
Claims (9)
1. The utility model provides a stamping die's fault detection device, stamping die includes mould, bed die and central controller, mould fault detection device is including the first piezoelectricity sound pick-up that is used for detecting the vibrations condition of mould and the second piezoelectricity sound pick-up that is used for detecting the vibrations condition of bed die, first piezoelectricity sound pick-up is located on the mould, second piezoelectricity sound pick-up is located on the bed die, first piezoelectricity sound pick-up and second piezoelectricity sound pick-up respectively with central controller electric connection, central controller is fed back to the vibrations condition of mould with first piezoelectricity sound pick-up, central controller is fed back to the vibrations condition of bed die with the second piezoelectricity sound pick-up.
2. The apparatus of claim 1, wherein the first piezoelectric pickup is disposed on an upper die base of the upper die, and the second piezoelectric pickup is disposed on a lower die base of the lower die.
3. The apparatus according to claim 2, wherein each of the first and second piezoelectric sound pick-up devices comprises a housing, a sound pick-up contact, an elastic damping body, a support piece, a pressure-equalizing piece, a piezoelectric ceramic piece, and a cushion rubber, the inner end of the sound pick-up contact, the elastic damping body, the support piece, the pressure-equalizing piece, the piezoelectric ceramic piece, and the cushion rubber are sequentially disposed in the housing and sequentially abut against each other, and the outer end of the sound pick-up contact extends out of the housing.
4. The apparatus of claim 3, wherein the upper die base and the lower die base are respectively provided with a first mounting hole and a second mounting hole, and the sound pickup contact of the first piezoelectric sound pickup and the sound pickup contact of the second piezoelectric sound pickup are respectively provided in the first mounting hole and the second mounting hole.
5. The apparatus for detecting a failure in a press die as claimed in claim 3, wherein the elastic damping body is a spring.
6. The apparatus as claimed in claim 1, wherein the housing includes a support and an outer cover connected to each other, the outer end of the pickup contact extends outward from the support, the buffer adhesive abuts against the outer cover, and the signal line of the piezoelectric ceramic plate extends out of the outer cover.
7. The apparatus for detecting a failure in a press mold as claimed in claim 6, wherein a buffer piece is provided between an inner end of the pickup contact and the holder.
8. A fault detection circuit of a stamping die comprises a first piezoelectric sound pickup, a first filter, a first signal amplifier, a first signal delay memory, a first signal frequency divider, a first signal comparator, a second piezoelectric sound pickup, a second filter, a second signal amplifier, a second signal delay memory, a second signal frequency divider, a second signal comparator and a central controller, wherein the first piezoelectric sound pickup converts vibration mechanical energy of an upper die into a first pulse signal and then transmits the first pulse signal to the first filter for filtering, the first signal amplifier amplifies the filtered first pulse signal, the first signal frequency divider transmits the first pulse signal to the first signal comparator and the first signal delay memory respectively, the first signal delay memory delays and stores the first pulse signal, the first signal delay memory transmits the first pulse signal of an upper period to the first signal comparator, the first signal comparator compares a first signal of the current period with a first pulse signal of the previous period, if the value difference between the first pulse signal of the current period and the first pulse signal of the previous period is smaller than the value set in the first signal comparator, the comparator outputs a normal signal to the central controller, and the central controller controls the stamping die to continue working; on the contrary, if the value difference between the first pulse signal of the current period and the first pulse signal of the previous period is larger than the value set in the first signal comparator, the first signal comparator outputs a fault signal to the central controller, and the central controller controls the punching die to stop;
the second piezoelectric pickup converts the vibration mechanical energy of the upper die into a second pulse signal, and then transmits the second pulse signal to a second filter for filtering, then a second signal amplifier amplifies the filtered second pulse signal, then the second signal frequency divider respectively transmits the second pulse signal to a second signal comparator and a second signal delay memory, the second signal delay memory carries out delay storage on the second pulse signal, the second signal delay memory transmits the second pulse signal of the previous period to the second signal comparator, the second signal comparator compares the second pulse signal of the current period with the second pulse signal of the previous period, if the value difference between the second pulse signal of the current period and the second pulse signal of the previous period is smaller than the value set in the comparator, the second signal comparator outputs a normal signal to a central controller, and the central controller controls the stamping die to continue working; on the contrary, if the value difference between the second pulse signal of the current period and the second pulse signal of the previous period is larger than the value set in the second signal comparator, the second signal comparator outputs a fault signal to the central controller, and the central controller controls the punching die to stop.
9. The press die fault detection circuit according to claim 8, wherein the value of the first pulse signal and the value of the second pulse signal are frequency or intensity of the pulse signal.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111007498.0A CN113639853A (en) | 2021-08-30 | 2021-08-30 | Fault detection device and fault detection circuit of stamping die |
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| CN202111007498.0A CN113639853A (en) | 2021-08-30 | 2021-08-30 | Fault detection device and fault detection circuit of stamping die |
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| 刘海利;黄丹;: "基于PVDF压电薄膜的冲压模具凸模监测方法", 机电产品开发与创新, no. 04, pages 131 - 133 * |
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