CN113630989A - Heating and compounding integrated device for circuit board - Google Patents
Heating and compounding integrated device for circuit board Download PDFInfo
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- CN113630989A CN113630989A CN202110973862.2A CN202110973862A CN113630989A CN 113630989 A CN113630989 A CN 113630989A CN 202110973862 A CN202110973862 A CN 202110973862A CN 113630989 A CN113630989 A CN 113630989A
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- circuit board
- top plate
- pressing cylinder
- pressing
- frame
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention relates to a circuit board heating and compounding integrated device, which relates to the technical field of circuit board processing, in the invention, when the circuit board is processed, firstly, the top plates of a plurality of circuit boards are placed in the top plate feeding assembly, then, a worker draws out the bottom plate sliding frame and places the bottom plates of the circuit boards in the bottom plate placing grooves, then the bottom plate sliding frame is returned, the top plate feeding assembly conveys the top plate of the circuit board to the circuit board pressing assembly, when the circuit board pressing component drives the circuit board top plate to move downwards, the gluing component glues the top surface of the circuit board bottom plate, then the circuit board pressing component presses the circuit board top plate on the circuit board bottom plate, the circuit board is compounded, the equipment is simple in structure and convenient to operate, does not need workers to shuttle among multiple devices, and greatly improves the processing efficiency of the circuit board.
Description
Technical Field
The invention relates to the technical field of circuit board processing, in particular to a circuit board heating and compounding integrated device.
Background
The circuit board plays an important role in the development of electronic technology, but the processing technology of the circuit board in China still cannot reach the standard of developed countries, and because electronic products develop towards miniaturization and digitalization, the multilayer circuit board is produced at the same time, but because the processing and production requirements of the multilayer circuit board are strict.
When the existing circuit board is compounded, a plurality of devices are required to perform auxiliary treatment to complete the compounding, the feeding of the board, the gluing of the board and the compounding of the board are firstly completed, the worker needs to shuttle among the devices to be busy, the processing efficiency is very low, and the labor intensity is high.
Disclosure of Invention
Technical problem to be solved
The invention aims to overcome the defects of the prior art, adapt to the practical needs and provide a circuit board heating and compounding integrated device to solve the technical problems.
Technical scheme
In order to realize the purpose of the invention, the technical scheme adopted by the invention is as follows:
a circuit board heating and compounding integrated device comprises a machine box body, wherein supporting legs are arranged at four corners of the bottom of the machine box body, a control panel is fixedly arranged above one side of the machine box body, and a top plate is arranged at the top of the machine box body; the top plate is fixedly provided with a circuit board pressing component; a gluing component is arranged below the circuit board pressing component, and two ends of the gluing component are fixedly connected with the frame body; a heater is fixedly arranged on one side in the machine frame body and is positioned above the gluing component;
a top plate feeding assembly for feeding a circuit board top plate is fixedly arranged on the outer side of one end of the frame body, which is far away from the heater; slide rails are fixedly arranged on two sides of the interior of the frame body; the two slide rails are positioned below the gluing component, and a bottom plate sliding frame is connected between the two slide rails in a sliding manner; a bottom plate placing groove convenient for placing the circuit board bottom plate is formed in the middle of the top of the bottom plate sliding frame;
the circuit board pressing component is arranged into two parts, one part is fixed above the top plate, and the other part is arranged below the top plate; a through groove is formed in one side, away from the heater, of the rack body.
Furthermore, the circuit board pressing assembly comprises a pressing cylinder, the pressing cylinder is fixedly arranged above the top plate, a push rod of the pressing cylinder penetrates through the lower part of the top plate, and a pressing cylinder is arranged outside the push rod of the pressing cylinder; the bottom of the pressing cylinder is fixedly provided with a connecting piece; the bottom of the connecting piece is fixedly provided with a top plate fixing frame;
when the pressing cylinder is in a contraction state, the top plate fixing frame is located at the highest position, and the top plate fixing frame and the through groove are located on the same horizontal line.
Furthermore, one side of the pressing cylinder is provided with teeth from top to bottom, and the teeth are meshed and connected with a driving gear arranged on one side of the pressing cylinder; the driving gear is arranged on the rotating shaft in an interference fit manner; the rotating shaft is fixedly arranged on the rear side wall of the frame body through a bearing with a seat;
the rotating shaft is also provided with a first transmission wheel in a matching way; the two first driving wheels are arranged, the other first driving wheel and the second driving wheel are coaxially arranged, and the two first driving wheels are connected in a matched mode through a first driving belt; the two second driving wheels are fixedly arranged on the intermediate shaft, and the two second driving wheels are connected through a second driving belt.
Furthermore, two ends of the intermediate shaft are arranged on the fixed seat through bearings; the fixed seat is fixedly arranged on the frame body and is positioned below the through groove;
a winding wheel is arranged in the middle of the intermediate shaft in a matching way; the winding wheel is wound with a pull rope, and one end of the pull rope is fixedly connected with the gluing component.
Furthermore, a chuck is welded on the inner wall of the upper end of the pressing cylinder, and a through hole for the push rod of the pressing cylinder to pass through is formed in the middle of the chuck; the bottom end of the pressing cylinder push rod penetrates through the connecting piece and the top plate fixing frame and is fixedly connected with the pressing plate; the laminated plate is positioned in the top plate fixing frame;
the pressing cylinder push rod is also fixedly provided with an annular disc; the diameter of the annular disc is smaller than the inner diameter of the pressing cylinder, and a rubber block is fixedly arranged below the annular disc; and a return spring is arranged between the annular disc and the chuck and is also sleeved on a push rod of the pressing air cylinder.
Furthermore, the top plate fixing frame is made of hard rubber, and two sides of the lower portion of the top plate fixing frame are inclined inwards, so that the top plate of the circuit board can be clamped conveniently.
Further, the top plate feeding assembly comprises a top plate placing table, and the top plate placing table is fixedly installed on the outer side of the frame body and is positioned below the through groove; the bottom of the top plate placing table is fixedly connected with the frame body through two triangular supports; a feeding cylinder is arranged between the two brackets; the push rod of the feeding cylinder is fixedly connected with the drive plate; the driving plate is provided with a through hole, is sleeved on the sliding rod and moves along the axial direction of the sliding rod; the two sliding rods are symmetrically arranged on two sides of the top plate placing table;
one ends of the two sliding rods, which are far away from the frame body, are connected with an end baffle together; the driving plate is also fixedly provided with a push plate; and a frame body convenient for placing the circuit board top plate is fixedly arranged above the top plate placing table.
Further, the gluing assembly comprises a carriage; two sides of the sliding frame are connected with the two guide rods in a sliding manner; two ends of the two guide rods are fixedly connected with the frame body; the upper end of the sliding frame is fixedly provided with a glue storage box, and the lower part of the sliding frame is fixedly provided with a brush; the brush is communicated with the interior of the glue storage box; the carriage is connected with the frame body on one side of the heater through an extension spring.
Further, when the extension spring is in a normal state, the sliding frame is positioned at the rightmost end of the guide rod, and the glue storage box is positioned right below the heater.
(3) Has the advantages that:
A. when the circuit board is processed, firstly, the top plates of a plurality of circuit boards are placed in the top plate feeding assembly, then the bottom plate sliding frame is drawn out by a worker and the bottom plate of the circuit board is placed in the bottom plate placing groove, then the bottom plate sliding frame is returned, the top plate of the circuit board is conveyed to the circuit board pressing assembly by the top plate feeding assembly, the top surface of the circuit board bottom plate is coated by the coating assembly while the circuit board pressing assembly drives the circuit board top plate to move downwards, and then the top plate of the circuit board is pressed on the circuit board bottom plate by the circuit board pressing assembly, so that the circuit board is compounded;
B. when the circuit board top plate is fed, the push rod of the feeding cylinder contracts and drives the drive plate to move rightwards along the sliding rod, the push plate arranged on the drive plate pushes the circuit board top plate to move rightwards and inserts the circuit board top plate into the top plate fixing frame, then the push rod of the feeding cylinder is pushed out again, and when the push plate is separated from the top plate placing table, a plurality of circuit board top plates fall on the top plate placing table again, so that the next pushing is facilitated;
C. according to the invention, when a circuit board is compounded, the pressing cylinder drives the pressing cylinder to move downwards, the teeth outside the pressing cylinder drive the driving gear to rotate while moving downwards, the first driving wheel coaxially arranged also rotates, and the winding wheel rotates and winds the pull rope under the mutual matching of the first driving wheel, the second driving wheel, the first driving wheel and the second driving wheel, so that the gluing component moves to the left side, glue is coated on the upper surface of the bottom plate of the circuit board, and the gluing of the top plate is realized;
D. according to the invention, when the pressing cylinder presses the top plate fixing frame carrying the top plate of the circuit board on the bottom plate sliding frame through the connecting piece, the push rod of the pressing cylinder continuously extends out, the rubber block positioned in the pressing cylinder is compressed, the pressing cylinder pushes the top plate of the circuit board out of the top plate fixing frame through the pressing plate, and the top plate fixing frame is made of hard rubber, so that the top plate of the circuit board can be pushed out, the damage of the top plate can be prevented, the top plate of the pushed circuit board is pressed on the floor of the circuit board, and the compounding of the circuit board is realized under the acting force of the pressing cylinder;
E. according to the invention, when the winding wheel rotates and the pull rope is wound, the sliding frame drives the glue storage box and the brush to slide leftwards along the guide rod, glue in the glue storage box flows onto the brush, and the brush can be used for smearing glue on the circuit board bottom plate, so that the structure is simple and the smearing is uniform;
F. according to the invention, when the extension spring is in a normal state, the sliding frame is positioned at the rightmost end of the guide rod, the glue storage box is positioned under the heater, and the heater can heat the glue solution in the glue storage box to prevent the glue solution from being solidified.
Drawings
FIG. 1 is a schematic structural diagram of a circuit board heating and laminating integrated device according to the present invention;
FIG. 2 is a bottom view of the integrated circuit board heater assembly of FIG. 1;
FIG. 3 is a right side view of the circuit board heater assembly of the present invention shown in FIG. 1;
FIG. 4 is a front view of the integrated circuit board heater assembly of the present invention;
FIG. 5 is a schematic view of a circuit board pressing assembly of the integrated circuit board heating and laminating device according to the present invention;
FIG. 6 is a schematic plane view of a circuit board pressing assembly of the circuit board heating and laminating integrated device of the present invention;
FIG. 7 is a cross-sectional view A-A of FIG. 6 of the circuit board heater assembly of the present invention;
FIG. 8 is an enlarged view of the circuit board heating and laminating integrated apparatus shown in FIG. 2;
fig. 9 is an enlarged schematic view of the circuit board heating and compounding integrated device of the present invention at the position B in fig. 3.
The reference numbers are as follows:
the machine comprises a machine box body 1, a control panel 2, a machine frame body 3, a top plate 4, a circuit board pressing component 5, a pressing air cylinder 51, a pressing cylinder 52, a connecting piece 53, a top plate fixing frame 54, a rotating shaft 55, a driving gear 56, a first transmission belt 57, a second transmission wheel 58, a first transmission wheel 59, a second transmission belt 510, a fixing seat 511, an intermediate shaft 512, a winding wheel 513, a pressing plate 514, a return spring 515, an annular disc 516, a rubber block 517, a chuck 518, a heater 6, a top plate feeding component 7, a top plate placing table 71, a support 72, a feeding air cylinder 73, a driving plate 74, a sliding rod 75, an end baffle 76, a pushing plate 77, a frame body 78, a gluing component 8, a sliding frame 81, a glue storage box 82, a brush 83, a guide rod 84, a tension spring 85, a sliding frame bottom plate 9, a bottom plate placing groove 10, a sliding rail 11 and a through groove 12.
Detailed Description
The invention will be further illustrated with reference to the following figures 1 to 9 and examples:
a circuit board heating and compounding integrated device comprises a machine box body 1, wherein supporting legs are arranged at four corners of the bottom of the machine box body 1, a control panel 2 is fixedly arranged above one side of the machine box body 1, and a top plate 4 is arranged at the top of the machine box body 1; the top plate 4 is fixedly provided with a circuit board pressing component 5; a gluing component 8 is arranged below the circuit board pressing component 5, and two ends of the gluing component 8 are fixedly connected with the frame body 3; a heater 6 is fixedly arranged on one side inside the frame body 3, and the heater 6 is positioned above the gluing component 8;
a top plate feeding assembly 7 for feeding a circuit board top plate is fixedly arranged on the outer side of one end, away from the heater 6, of the frame body 3; slide rails 11 are fixedly arranged on two sides inside the frame body 3; the two slide rails 11 are positioned below the gluing component 8, and a bottom plate sliding frame 9 is connected between the two slide rails 11 in a sliding manner; a bottom plate placing groove 10 convenient for placing a circuit board bottom plate is formed in the middle of the top of the bottom plate sliding frame 9;
the circuit board pressing component 5 is arranged into two parts, one part is fixed above the top plate 4, and the other part is arranged below the top plate 4; a through groove 12 is arranged on one side of the frame body 3 far away from the heater 6.
In this embodiment, the circuit board pressing assembly 5 includes a pressing cylinder 51, the pressing cylinder 51 is fixedly mounted above the top plate 4, a push rod thereof penetrates below the top plate 4, and a pressing cylinder 52 is arranged outside the push rod of the pressing cylinder 51; the bottom of the pressing cylinder 52 is fixedly provided with a connecting piece 53; a top plate fixing frame 54 is fixedly arranged at the bottom of the connecting piece 53;
when the pressing cylinder 51 is in a contracted state, the top plate fixing frame 54 is located at the highest position, and the top plate fixing frame 54 and the through groove 12 are located on the same horizontal line.
Through adopting the above technical scheme, when processing the circuit board, at first place the roof of a plurality of circuit boards in roof material loading subassembly 7, the staff takes bottom plate balladeur train 9 out afterwards, and place the bottom plate of circuit board in bottom plate standing groove 10, then with bottom plate balladeur train 9 return, roof material loading subassembly 7 carries the roof of circuit board to circuit board pressing components 5 in, when circuit board pressing components 5 drive the circuit board roof and move down, rubber coating subassembly 8 carries out the rubber coating to the top surface of circuit board bottom plate, circuit board pressing components 5 carries the roof pressfitting of circuit board on circuit board bottom plate afterwards, the complex of circuit board has been realized, this equipment structure is simple, high durability and convenient operation, need not the staff and shuttle between many equipment, very big improvement the machining efficiency of circuit board.
In this embodiment, one side of the pressing cylinder 52 is provided with teeth from top to bottom, and the teeth are engaged with the driving gear 56 arranged on one side of the pressing cylinder 52; the driving gear 56 is arranged on the rotating shaft 55 in an interference fit manner; the rotating shaft 55 is fixedly arranged on the rear side wall of the frame body 3 through a bearing with a seat;
a first driving wheel 59 is also arranged on the rotating shaft 55 in a matching way; the number of the first driving wheels 59 is two, the other first driving wheel 59 and the second driving wheel 58 are coaxially arranged, and the two first driving wheels 59 are connected in a matching way through a first driving belt 57; two second transmission wheels 58 are adopted, the other second transmission wheel 58 is fixedly arranged on the intermediate shaft 512, and the two second transmission wheels 58 are connected through a second transmission belt 510.
In this embodiment, two ends of the intermediate shaft 512 are mounted on the fixing seat 511 through bearings; the fixed seat 511 is fixedly installed on the frame body 3 and is positioned below the through groove 12;
a winding wheel 513 is arranged in the middle of the intermediate shaft 512 in a matching manner; and a pull rope is wound on the winding wheel 513, and one end of the pull rope is fixedly connected with the gluing component 8.
By adopting the technical scheme, when the circuit board is compounded, the pressing cylinder 51 drives the pressing cylinder 52 to move downwards, when the circuit board moves downwards, the teeth outside the pressing cylinder 52 drive the driving gear 56 to rotate, the coaxially arranged first driving wheel 59 also rotates, the first driving wheel 57, the second driving wheel 58, the first driving wheel 59 and the second driving wheel 510 are matched with each other, the winding wheel 513 rotates, the pull rope is wound, the gluing component 8 moves towards the left side, glue is coated on the upper surface of the circuit board bottom plate, and gluing of the top plate is realized.
In this embodiment, a chuck 518 is welded on the inner wall of the upper end of the pressing cylinder 52, and a through hole for the push rod of the pressing cylinder 51 to pass through is formed in the middle of the chuck 518; the bottom end of the push rod of the pressing air cylinder 51 penetrates through the connecting piece 53 and the top plate fixing frame 54 and is fixedly connected with a pressing plate 514; the pressing plate 514 is positioned in the top plate fixing frame 54;
the push rod of the pressing cylinder 51 is also fixedly provided with an annular disc 516; the diameter of the annular disc 516 is smaller than the inner diameter of the pressing cylinder 52, and a rubber block 517 is fixedly arranged below the annular disc 516; a return spring 515 is arranged between the annular disc 516 and the chuck 518, and the return spring 515 is further sleeved on the push rod of the pressing air cylinder 51.
In this embodiment, the top plate fixing frame 54 is made of hard rubber, and two sides of the lower portion of the top plate fixing frame 54 are both inclined inward, so that the top plate of the circuit board can be clamped conveniently.
By adopting the technical scheme, when the pressing cylinder 52 presses the top plate fixing frame 54 carrying the top plate of the circuit board on the bottom plate sliding frame 9 through the connecting piece 53, the push rod of the pressing cylinder 51 continuously extends out, the rubber block 517 positioned in the pressing cylinder 52 is compressed, the pressing cylinder 51 pushes the top plate of the circuit board out of the top plate fixing frame 54 through the pressing plate 514, the top plate fixing frame 54 is made of hard rubber, so that the top plate of the circuit board can be pushed out, the damage of the top plate can be prevented, the top plate of the pushed-out circuit board is pressed on the floor of the circuit board, and the compounding of the circuit board is realized under the acting force of the pressing cylinder 51.
In this embodiment, the top plate feeding assembly 7 includes a top plate placing table 71, and the top plate placing table 71 is fixedly installed on the outer side of the frame body 3 and located below the through groove 12; the bottom of the top plate placing table 71 is fixedly connected with the frame body 3 through two triangular supports 72; a feeding cylinder 73 is arranged between the two brackets 72; the push rod of the feeding cylinder 73 is fixedly connected with the driving plate 74; the driving plate 74 is provided with a through hole, is sleeved on the sliding rod 75 and moves along the axial direction of the sliding rod 75; two slide bars 75 are symmetrically arranged on two sides of the top plate placing table 71;
Through adopting above-mentioned technical scheme, when carrying out the material loading to the circuit board roof, the push rod shrink of material loading cylinder 73 to drive plate 74 and move along slide bar 75 rightwards, push pedal 77 installed on drive plate 74 promotes the circuit board roof and moves rightwards, and peg graft the circuit board roof in roof mount 54, the push rod of material loading cylinder 73 is released once more afterwards, when push pedal 77 breaks away from the roof and places platform 71, a great deal of circuit board roof falls once more on the roof places platform 71, the propelling movement of next time of being convenient for.
In this embodiment, the gluing assembly 8 comprises a carriage 81; two sides of the sliding frame 81 are connected with two guide rods 84 in a sliding way; two ends of the two guide rods 84 are fixedly connected with the frame body 3; the upper end of the sliding frame 81 is fixedly provided with a glue storage box 82, and the lower part of the sliding frame 81 is fixedly provided with a brush 83; the brush 83 is communicated with the interior of the glue storage box 82; the carriage 81 is connected to the housing body 3 on the side where the heater 6 is provided, by an extension spring 85.
Through adopting above-mentioned technical scheme, take place to rotate when rolling wheel 513 to when rolling the stay cord, balladeur train 81 drives and stores up gluey box 82 and brush 83 and slides to the left side along guide bar 84, stores up the glue solution in gluey box 82 and flows to brush 83 on, can realize the daub to the circuit board bottom plate through brush 83, simple structure scribbles evenly.
In this embodiment, when the extension spring 85 is in a normal state, the carriage 81 is located at the rightmost end of the guide rod 84, and the glue storage box 82 is located right below the heater 6.
By adopting the technical scheme, the heater 6 can heat the glue solution in the glue storage box 82, so that the glue solution is prevented from being solidified.
By adopting the technical scheme, the invention has the advantages that the working principle comprises the following processes:
when a circuit board is compounded, the pressing cylinder 51 drives the pressing cylinder 52 to move downwards, the teeth outside the pressing cylinder 52 drive the driving gear 56 to rotate while moving downwards, the first driving wheel 59 arranged coaxially also rotates, the first driving wheel 57, the second driving wheel 58, the first driving wheel 59 and the second driving wheel 510 are matched with each other, the winding wheel 513 rotates and winds the pull rope, the sliding frame 81 drives the glue storage box 82 and the brush 83 to slide to the left side along the guide rod 84, glue in the glue storage box 82 flows onto the brush 83, and the bottom plate of the circuit board can be wiped by the brush 83;
subsequently, the gluing component 8 is positioned at the leftmost side inside the frame body 3, when the pressing cylinder 52 presses the top plate fixing frame 54 carrying the top plate of the circuit board on the bottom plate carriage 9 through the connecting piece 53, the push rod of the pressing cylinder 51 continues to extend, the rubber block 517 positioned inside the pressing cylinder 52 is compressed, the pressing cylinder 51 pushes the top plate of the circuit board out of the top plate fixing frame 54 through the pressing plate 514, the top plate fixing frame 54 is made of hard rubber, so that the top plate of the circuit board can be pushed out, the damage of the top plate can be prevented, the top plate of the pushed out circuit board is pressed on the floor of the circuit board, and the compounding of the circuit board is realized under the acting force of the pressing cylinder 51;
after the pressing, the pressing cylinder 51 drives the pressing cylinder 52 to move upwards, while moving upwards, the teeth outside the pressing cylinder 52 drive the driving gear 56 to rotate, the first driving wheel 59 coaxially arranged also rotates, the first driving belt 57, the second driving wheel 58, the first driving wheel 59 and the second driving belt 510 are mutually matched, the winding wheel 513 rotates and unwinds the pulling rope, the carriage 81 returns under the pulling of the tension spring 85, when the tension spring 85 is in a normal state, the carriage 81 is positioned at the rightmost end of the guide rod 84, the glue storage box 82 is positioned under the heater 6, and the heater 6 can heat the glue solution in the glue storage box 82 to prevent the glue solution from being solidified.
The invention has the beneficial effects that:
when a circuit board is processed, firstly, top plates of a plurality of circuit boards are placed in a top plate feeding assembly 7, then a worker draws out a bottom plate sliding frame 9 and places a bottom plate of the circuit board in a bottom plate placing groove 10, then the bottom plate sliding frame 9 returns, the top plate of the circuit board is conveyed to a circuit board pressing assembly 5 by the top plate feeding assembly 7, the top surface of the circuit board bottom plate is coated with glue by a glue coating assembly 8 when the circuit board pressing assembly 5 drives the circuit board top plate to move downwards, and then the circuit board pressing assembly 5 presses the top plate of the circuit board on the circuit board bottom plate, so that the circuit board is compounded;
in the invention, when the circuit board top plate is fed, the push rod of the feeding cylinder 73 is contracted and drives the drive plate 74 to move rightwards along the slide rod 75, the push plate 77 arranged on the drive plate 74 pushes the circuit board top plate to move rightwards and inserts the circuit board top plate into the top plate fixing frame 54, then the push rod of the feeding cylinder 73 is pushed out again, and when the push plate 77 is separated from the top plate placing table 71, a plurality of circuit board top plates fall on the top plate placing table 71 again, so that the next pushing is facilitated;
in the invention, when a circuit board is compounded, the pressing cylinder 51 drives the pressing cylinder 52 to move downwards, while moving downwards, teeth outside the pressing cylinder 52 drive the driving gear 56 to rotate, the first driving wheel 59 coaxially arranged also rotates, and under the mutual matching of the first driving belt 57, the second driving wheel 58, the first driving wheel 59 and the second driving wheel 510, the winding wheel 513 rotates and winds the pull rope, so that the gluing component 8 moves towards the left side, glue is coated on the upper surface of the bottom plate of the circuit board, and the gluing of the top plate is realized;
in the invention, when the pressing cylinder 52 presses the top plate fixing frame 54 carrying the top plate of the circuit board on the bottom plate carriage 9 through the connecting piece 53, the push rod of the pressing cylinder 51 continuously extends out, the rubber block 517 positioned in the pressing cylinder 52 is compressed, the pressing cylinder 51 pushes the top plate of the circuit board out of the top plate fixing frame 54 through the pressing plate 514, and the top plate fixing frame 54 is made of hard rubber, so that the top plate of the circuit board can be pushed out, the damage of the top plate can be prevented, the top plate of the pushed circuit board is pressed on the floor of the circuit board, and the compounding of the circuit board is realized under the acting force of the pressing cylinder 51;
in the invention, when the winding wheel 513 rotates and winds the pull rope, the sliding frame 81 drives the glue storage box 82 and the brush 83 to slide to the left side along the guide rod 84, glue in the glue storage box 82 flows onto the brush 83, and the brush 83 can be used for smearing glue on the bottom plate of the circuit board, so that the structure is simple and the smearing is uniform;
in the invention, when the extension spring 85 is in a normal state, the carriage 81 is positioned at the rightmost end of the guide rod 84, the glue storage box 82 is positioned right below the heater 6, and the heater 6 can heat the glue solution in the glue storage box 82 to prevent the glue solution from being solidified.
Claims (9)
1. A circuit board heating and compounding integrated device comprises a machine box body (1) and is characterized in that supporting legs are arranged at four corners of the bottom of the machine box body (1), a control panel (2) is fixedly installed above one side of the machine box body (1), and a top plate (4) is arranged at the top of the machine box body (1); a circuit board pressing component (5) is fixedly arranged on the top plate (4); a gluing component (8) is arranged below the circuit board pressing component (5), and two ends of the gluing component (8) are fixedly connected with the frame body (3); a heater (6) is fixedly arranged on one side inside the machine frame body (3), and the heater (6) is positioned above the gluing component (8);
a top plate feeding assembly (7) for feeding a circuit board top plate is fixedly mounted on the outer side of one end, away from the heater (6), of the frame body (3); two sides of the inside of the frame body (3) are fixedly provided with slide rails (11); the two slide rails (11) are positioned below the gluing component (8), and a bottom plate sliding frame (9) is connected between the two slide rails (11) in a sliding manner; a bottom plate placing groove (10) convenient for placing the circuit board bottom plate is formed in the middle of the top of the bottom plate sliding frame (9);
the circuit board pressing component (5) is arranged into two parts, one part is fixed above the top plate (4), and the other part is arranged below the top plate (4); a through groove (12) is formed in one side, away from the heater (6), of the frame body (3).
2. The circuit board heating composite integrated device according to claim 1, wherein: the circuit board pressing component (5) comprises a pressing cylinder (51), the pressing cylinder (51) is fixedly arranged above the top plate (4), a push rod of the pressing cylinder penetrates through the lower part of the top plate (4), and a pressing cylinder (52) is arranged outside the push rod of the pressing cylinder (51); the bottom of the pressing cylinder (52) is fixedly provided with a connecting piece (53); a top plate fixing frame (54) is fixedly arranged at the bottom of the connecting piece (53);
when the pressing cylinder (51) is in a contraction state, the top plate fixing frame (54) is located at the highest position, and the top plate fixing frame (54) and the through groove (12) are located on the same horizontal line.
3. The circuit board heating composite integrated device according to claim 2, wherein: one side of the pressing cylinder (52) is provided with teeth from top to bottom, and the teeth are meshed and connected with a driving gear (56) arranged on one side of the pressing cylinder (52); the driving gear (56) is arranged on the rotating shaft (55) in an interference fit manner; the rotating shaft (55) is fixedly arranged on the rear side wall of the frame body (3) through a bearing with a seat;
a first driving wheel (59) is also arranged on the rotating shaft (55) in a matching way; the number of the first driving wheels (59) is two, the other first driving wheel (59) and the second driving wheel (58) are coaxially arranged, and the two first driving wheels (59) are connected in a matched mode through a first driving belt (57); two second transmission wheels (58) are adopted, the other second transmission wheel (58) is fixedly arranged on the intermediate shaft (512), and the two second transmission wheels (58) are connected through a second transmission belt (510).
4. The circuit board heating composite integrated device according to claim 3, wherein: two ends of the intermediate shaft (512) are arranged on the fixed seat (511) through bearings; the fixed seat (511) is fixedly arranged on the frame body (3) and is positioned below the through groove (12);
a winding wheel (513) is arranged in the middle of the intermediate shaft (512) in a matching way; and a pull rope is wound on the winding wheel (513), and one end of the pull rope is fixedly connected with the gluing component (8).
5. The circuit board heating composite integrated device according to claim 3, wherein: a chuck (518) is welded on the inner wall of the upper end of the pressing cylinder (52), and a through hole for a push rod of the pressing cylinder (51) to pass through is formed in the middle of the chuck (518); the bottom end of the push rod of the pressing cylinder (51) penetrates through the connecting piece (53) and the top plate fixing frame (54) and is fixedly connected with a pressing plate (514); the pressing plate (514) is positioned in the top plate fixing frame (54);
the push rod of the pressing cylinder (51) is also fixedly provided with an annular disc (516); the diameter of the annular disc (516) is smaller than the inner diameter of the pressing cylinder (52), and a rubber block (517) is fixedly arranged below the annular disc (516); a return spring (515) is arranged between the annular disc (516) and the chuck (518), and the return spring (515) is further sleeved on a push rod of the pressing air cylinder (51).
6. The circuit board heating composite integrated device according to claim 5, wherein: the top plate fixing frame (54) is made of hard rubber, and two sides of the lower portion of the top plate fixing frame (54) are inclined inwards, so that the top plate of the circuit board can be clamped conveniently.
7. The circuit board heating composite integrated device according to claim 1, wherein: the top plate feeding assembly (7) comprises a top plate placing table (71), and the top plate placing table (71) is fixedly installed on the outer side of the rack body (3) and is positioned below the through groove (12); the bottom of the top plate placing table (71) is fixedly connected with the frame body (3) through two triangular supports (72); a feeding cylinder (73) is arranged between the two brackets (72); a push rod of the feeding cylinder (73) is fixedly connected with the driving plate (74); the driving plate (74) is provided with a through hole, is sleeved on the sliding rod (75) and moves along the axial direction of the sliding rod (75); the two sliding rods (75) are symmetrically arranged on two sides of the top plate placing table (71);
one ends of the two sliding rods (75) far away from the rack body (3) are connected with an end baffle (76) together; the drive plate (74) is also fixedly provided with a push plate (77); and a frame body (78) convenient for placing the circuit board top plate is fixedly arranged above the top plate placing table (71).
8. The circuit board heating composite integrated device according to claim 1, wherein: the gluing assembly (8) comprises a carriage (81); two sides of the sliding frame (81) are connected with two guide rods (84) in a sliding way; two ends of the two guide rods (84) are fixedly connected with the frame body (3); the upper end of the sliding frame (81) is fixedly provided with a glue storage box (82), and the lower part of the sliding frame (81) is fixedly provided with a brush (83); the brush (83) is communicated with the interior of the glue storage box (82); the sliding frame (81) is connected with the frame body (3) at one side provided with the heater (6) through an extension spring (85).
9. The circuit board heater assembly as defined in claim 7, wherein: when the extension spring (85) is in a normal state, the carriage (81) is positioned at the rightmost end of the guide rod (84), and the glue storage box (82) is positioned right below the heater (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202110973862.2A CN113630989B (en) | 2021-08-24 | 2021-08-24 | Heating and compounding integrated device for circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110973862.2A CN113630989B (en) | 2021-08-24 | 2021-08-24 | Heating and compounding integrated device for circuit board |
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| CN113630989A true CN113630989A (en) | 2021-11-09 |
| CN113630989B CN113630989B (en) | 2022-08-26 |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107809857A (en) * | 2017-11-22 | 2018-03-16 | 苏州市亿利华电子有限公司 | A kind of multi-layer PCB board gluing press fit device |
| CN208063561U (en) * | 2017-12-28 | 2018-11-06 | 岳阳市华立丰电子科技有限公司 | A kind of circuit board composite plate heating pressing integrated device |
| US20190247050A1 (en) * | 2006-11-21 | 2019-08-15 | David S. Goldsmith | Integrated system for the infixion and retrieval of implants |
| CN209914204U (en) * | 2018-11-28 | 2020-01-07 | 广州铭豪自动化设备有限公司 | Quick pressfitting machine of flexible line way board |
| CN112389011A (en) * | 2020-07-14 | 2021-02-23 | 江阴科利达电子有限公司 | LCP processing is with high temperature lamination equipment |
| CN212911987U (en) * | 2020-08-20 | 2021-04-09 | 江西服装学院 | Shoemaking compression fittings |
| CN113017198A (en) * | 2021-02-26 | 2021-06-25 | 界首市旭升塑胶制品有限公司 | Bottom texture pressing device of PVC rain shoes and pressing method thereof |
-
2021
- 2021-08-24 CN CN202110973862.2A patent/CN113630989B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20190247050A1 (en) * | 2006-11-21 | 2019-08-15 | David S. Goldsmith | Integrated system for the infixion and retrieval of implants |
| CN107809857A (en) * | 2017-11-22 | 2018-03-16 | 苏州市亿利华电子有限公司 | A kind of multi-layer PCB board gluing press fit device |
| CN208063561U (en) * | 2017-12-28 | 2018-11-06 | 岳阳市华立丰电子科技有限公司 | A kind of circuit board composite plate heating pressing integrated device |
| CN209914204U (en) * | 2018-11-28 | 2020-01-07 | 广州铭豪自动化设备有限公司 | Quick pressfitting machine of flexible line way board |
| CN112389011A (en) * | 2020-07-14 | 2021-02-23 | 江阴科利达电子有限公司 | LCP processing is with high temperature lamination equipment |
| CN212911987U (en) * | 2020-08-20 | 2021-04-09 | 江西服装学院 | Shoemaking compression fittings |
| CN113017198A (en) * | 2021-02-26 | 2021-06-25 | 界首市旭升塑胶制品有限公司 | Bottom texture pressing device of PVC rain shoes and pressing method thereof |
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| CN113630989B (en) | 2022-08-26 |
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