CN113629026A - Multi-dimensional heat dissipation design solution device and method for industrial equipment - Google Patents
Multi-dimensional heat dissipation design solution device and method for industrial equipment Download PDFInfo
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- CN113629026A CN113629026A CN202110794594.8A CN202110794594A CN113629026A CN 113629026 A CN113629026 A CN 113629026A CN 202110794594 A CN202110794594 A CN 202110794594A CN 113629026 A CN113629026 A CN 113629026A
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 49
- 238000000034 method Methods 0.000 title claims abstract description 16
- 239000000463 material Substances 0.000 claims abstract description 18
- 239000004020 conductor Substances 0.000 claims abstract description 9
- 230000000694 effects Effects 0.000 abstract description 5
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- NMWSKOLWZZWHPL-UHFFFAOYSA-N 3-chlorobiphenyl Chemical compound ClC1=CC=CC(C=2C=CC=CC=2)=C1 NMWSKOLWZZWHPL-UHFFFAOYSA-N 0.000 description 5
- 101001082832 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) Pyruvate carboxylase 2 Proteins 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a multi-dimensional heat dissipation design solving device for industrial equipment, which relates to the field of heat dissipation treatment and comprises the following components: the PCB board is used for placing chips and integrating the chips with different functions; the chip is used for finishing operation and processing tasks; the heat conduction material is used for dissipating heat generated by the chip during working and ensuring that the temperature of the chip in normal working is reduced; the phase change radiator is used for timely transferring heat generated in the working process of the chip so as to avoid influencing the normal work of the chip; compared with the prior art, the invention has the beneficial effects that: the invention fully utilizes the physical characteristics of hot gas and the combination of heat conducting materials, brings very good temperature control effect to products, reduces the temperature by at least 8 ℃ compared with single temperature control measures, and simultaneously ensures the stability of equipment in high-speed operation and good user experience.
Description
Technical Field
The invention relates to the field of heat dissipation treatment, in particular to a multi-dimensional heat dissipation design solving device and method for industrial equipment.
Background
Industrial equipment generates heat when working, the rising of the heat can lead to the working state of the equipment, heat dissipation treatment is needed, and with the progress of the times, people pursue the performance of the industrial equipment, so that the integration level of a PCB (printed circuit board) is raised, and the difficulty of heat dissipation is raised.
Because heat dissipation treatment is a multidisciplinary comprehensive solution, the effect of the current single treatment method cannot be achieved, and the current commonly adopted solution is to conduct heat by using a physical material with high heat conductivity coefficient, such as graphene, so as to expand the heat dissipation area to dissipate heat. Some products also use aluminum heat pipes to conduct heat from heavily-emitting chips to areas with less heat to achieve heat-spreading, and these single physical solutions often fail to achieve the desired effect and need improvement.
Disclosure of Invention
The present invention is directed to a device and a method for solving the multi-dimensional heat dissipation design of industrial devices, so as to solve the problems mentioned in the background art.
In order to achieve the purpose, the invention provides the following technical scheme:
a multi-dimensional heat dissipation design solving device for industrial equipment comprises:
the PCB board is used for placing chips and integrating the chips with different functions;
the chip is used for finishing operation and processing tasks;
the heat conduction material is used for dissipating heat generated by the chip during working and ensuring that the temperature of the chip in normal working is reduced;
and the phase change radiator is used for timely transferring heat generated in the working process of the chip so as to avoid influencing the normal work of the chip.
As a still further scheme of the invention: the number of the chips is at least 3, and the chips are arranged at intervals.
As a still further scheme of the invention: the chip is arranged on the PCB, and the top of the PCB is provided with a hole.
As a still further scheme of the invention: and a phase change heat radiator is arranged on the surface of each chip.
As a still further scheme of the invention: the heat conduction material is arranged on the PCB, and the chip is arranged inside the heat conduction material.
The multi-dimensional heat dissipation design solution method for the industrial equipment is applied to the multi-dimensional heat dissipation design solution device for the industrial equipment, and comprises the following steps: step 1, placing chips integrated on a PCB in a staggered manner so as to accelerate heat dissipation; step 2, dissipating and guiding out heat generated by the chip through a heat conduction material; and 3, dissipating and guiding out the heat generated by the chip through the phase change radiator.
As a still further scheme of the invention: in the step 1, the chips on the PCB are isolated, so that the chips which are originally influenced with each other in the heat dissipation process are not influenced with each other, and meanwhile, the top of the PCB is provided with a hole, so that the heat dissipation speed is accelerated.
As a still further scheme of the invention: in the step 2, heat generated in the working process of the chip is quickly discharged through the heat conducting material, so that the influence of high temperature on the working of the chip is reduced.
As a still further scheme of the invention: in the step 3, the heat dissipation of the chip is further accelerated through the phase change heat radiator, and the chip can work continuously and efficiently.
Compared with the prior art, the invention has the beneficial effects that: the invention fully utilizes the physical characteristics of hot gas and the combination of heat conducting materials, brings very good temperature control effect to products, reduces the temperature by at least 8 ℃ compared with single temperature control measures, and simultaneously ensures the stability of equipment in high-speed operation and good user experience.
Drawings
Fig. 1 is a heat dissipation diagram of staggered chip distribution and overlapped chip distribution.
Fig. 2 is a heat dissipation schematic diagram of chips with heat conduction materials added in staggered distribution.
Fig. 3 is a heat dissipation schematic diagram of a chip with heat conduction materials and a phase change heat sink distributed in a staggered manner.
In the figure: the chip comprises a 1-chip, a 2-PCB, a 3-heat conduction material, a 4-phase change heat radiator, a 11-first chip, a 12-second chip and a 13-third chip.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments, and all other embodiments obtained by a person of ordinary skill in the art without creative efforts based on the embodiments of the present invention belong to the protection scope of the present invention.
Referring to fig. 1-3, a multi-dimensional heat dissipation design solution apparatus for industrial equipment includes:
the PCB board 2 is used for placing the chips 1 and integrating the chips 1 with different functions;
the chip 1 is used for completing operation and processing tasks;
the heat conduction material 3 is used for dissipating heat generated by the chip 1 during working and ensuring that the temperature of the chip 1 which normally works is reduced;
and the phase change heat radiator 4 is used for timely transferring heat generated in the working process of the chip 1 so as to avoid influencing the normal work of the chip 1.
In this embodiment: at least 3 chips 1 are arranged at intervals among the chips 1. A plurality of chips 1 cooperate to realize complex functions.
In this embodiment: the chip 1 is arranged on the PCB 2, and the top of the PCB 2 is provided with a hole. The opening facilitates heat dissipation of the chip 1.
In this embodiment: each chip 1 surface is provided with a phase change heat sink 4. The phase change heat sink 4 accelerates heat dissipation of the chip 1.
In this embodiment: heat conduction material 3 is located on PCB board 2, and chip 1 sets up inside heat conduction material 3. The heat conducting material 3 plus the chip 1 dissipates heat.
The multi-dimensional heat dissipation design solution method for the industrial equipment is applied to the multi-dimensional heat dissipation design solution device for the industrial equipment, and comprises the following steps: step 1, placing chips 1 integrated on a PCB 2 in a staggered manner so as to accelerate heat dissipation; step 2, heat generated by the chip 1 is dissipated and led out through the heat conduction material 3; and 3, radiating and guiding out the heat generated by the chip 1 through the phase change radiator 4.
In this embodiment: referring to fig. 1, in step 1, the chips 1 on the PCB 2 are isolated, so that the chips 1 that originally affect each other during heat dissipation are not affected by each other, and a hole is formed in the top of the PCB 2 to accelerate the heat dissipation speed.
The heat dissipation speed of the staggered chip 1 is better than that of the chip 1 attached together, and during specific tests, the temperature (on the left side of fig. 1) of the staggered chip 1 is higher than that (on the right side of fig. 1) of the chip 1 attached together: the first chip 11 is lowered by 5 ℃, the second chip 12 is lowered by 3.8 ℃, and the third chip 13 is lowered by 4.2 ℃;
in this embodiment: referring to fig. 1 and 2, in step 2, heat generated during the operation of the chip 1 is rapidly dissipated through the heat conductive material 3, so as to reduce the influence of high temperature on the operation of the chip 1.
Adding heat conduction material 3 accelerates the heat dissipation speed of chip 1, during the concrete test, the staggered temperature of chip 1 (figure 2) compared with chip 1 (figure 1 left side) using heat conduction material 3: the first chip 11 is lowered by 3.5 ℃, the second chip 12 is lowered by 3.2 ℃, and the third chip 13 is lowered by 3.7 ℃;
in this embodiment: referring to fig. 2 and 3, in step 3, the phase change heat spreader 4 is used to further accelerate the heat dissipation of the chip 1, so as to ensure that the chip 1 can continuously and efficiently operate.
Adding phase change heat sink 4 accelerates the heat dissipation rate of chip 1, during the concrete test, the temperature that chip 1 that has used thermally conductive material 3 and phase change heat sink 4 staggers (fig. 3) and compare with chip 1 that has used thermally conductive material 3 staggers (fig. 2): the first chip 11 is lowered by 2.1 ℃, the second chip 12 is lowered by 2.3 ℃, and the third chip 13 is lowered by 2.5 ℃;
the temperature of the entire surface of the chip 1 is respectively decreased after the multiple measures: the temperature of the first chip 11 is reduced by 10.6 ℃, the temperature of the second chip 12 is reduced by 9.3 ℃, and the temperature of the third chip 13 is reduced by 10.4 ℃; the heat dissipation effect is very good.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (9)
1. The utility model provides an industry class equipment multidimension degree heat dissipation design solution device which characterized in that:
this industry class equipment multidimension degree heat dissipation design solution device includes:
the PCB board is used for placing chips and integrating the chips with different functions;
the chip is used for finishing operation and processing tasks;
the heat conduction material is used for dissipating heat generated by the chip during working and ensuring that the temperature of the chip in normal working is reduced;
and the phase change radiator is used for timely transferring heat generated in the working process of the chip so as to avoid influencing the normal work of the chip.
2. The multi-dimensional heat dissipation design solving device for industrial equipment according to claim 1, wherein at least 3 chips are arranged, and a plurality of chips are arranged at intervals.
3. The multi-dimensional heat dissipation design solving device for industrial equipment according to claim 1, wherein the chip is disposed on a PCB, and the top of the PCB is provided with an opening.
4. The multi-dimensional heat dissipation design solution of industrial equipment according to claim 1, wherein each chip surface is provided with a phase change heat sink.
5. The multi-dimensional heat dissipation design solving device for industrial equipment according to claim 1, wherein the heat conducting material is disposed on the PCB, and the chip is disposed inside the heat conducting material.
6. A multi-dimensional heat dissipation design solution method for industrial equipment is applied to the multi-dimensional heat dissipation design solution device for industrial equipment according to any one of claims 1 to 5, and the method comprises the following steps: step 1, placing chips integrated on a PCB in a staggered manner so as to accelerate heat dissipation; step 2, dissipating and guiding out heat generated by the chip through a heat conduction material; and 3, dissipating and guiding out the heat generated by the chip through the phase change radiator.
7. The multi-dimensional heat dissipation design solution of industrial equipment according to claim 6, wherein in step 1, the chips on the PCB are isolated, so that the chips that originally affect each other during heat dissipation do not affect each other, and a hole is formed in the top of the PCB to accelerate the heat dissipation speed.
8. The multi-dimensional heat dissipation design solution for industrial equipment according to claim 6, wherein in step 2, heat generated in the working process of the chip is rapidly exhausted through a heat conduction material, so that the influence of high temperature on the working of the chip is reduced.
9. The multi-dimensional heat dissipation design solution for industrial equipment according to claim 6, wherein in step 3, the heat dissipation of the chip is further accelerated by the phase change heat sink, so as to ensure that the chip can continuously and efficiently operate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110794594.8A CN113629026A (en) | 2021-07-14 | 2021-07-14 | Multi-dimensional heat dissipation design solution device and method for industrial equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110794594.8A CN113629026A (en) | 2021-07-14 | 2021-07-14 | Multi-dimensional heat dissipation design solution device and method for industrial equipment |
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| CN113629026A true CN113629026A (en) | 2021-11-09 |
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| CN202110794594.8A Pending CN113629026A (en) | 2021-07-14 | 2021-07-14 | Multi-dimensional heat dissipation design solution device and method for industrial equipment |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN207149550U (en) * | 2017-09-25 | 2018-03-27 | 四川卫士通信息安全平台技术有限公司 | Radiator based on chip difference variation |
| CN112882983A (en) * | 2021-04-21 | 2021-06-01 | 北京百度网讯科技有限公司 | Heat dissipation device and server with same |
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2021
- 2021-07-14 CN CN202110794594.8A patent/CN113629026A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN207149550U (en) * | 2017-09-25 | 2018-03-27 | 四川卫士通信息安全平台技术有限公司 | Radiator based on chip difference variation |
| CN112882983A (en) * | 2021-04-21 | 2021-06-01 | 北京百度网讯科技有限公司 | Heat dissipation device and server with same |
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