CN113625150B - Bread board and test equipment - Google Patents
Bread board and test equipment Download PDFInfo
- Publication number
- CN113625150B CN113625150B CN202110754368.7A CN202110754368A CN113625150B CN 113625150 B CN113625150 B CN 113625150B CN 202110754368 A CN202110754368 A CN 202110754368A CN 113625150 B CN113625150 B CN 113625150B
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- Prior art keywords
- switch
- bread board
- contact
- conducting
- control
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- 238000012360 testing method Methods 0.000 title claims abstract description 52
- 235000008429 bread Nutrition 0.000 title claims abstract description 38
- 238000004891 communication Methods 0.000 claims description 17
- 239000000872 buffer Substances 0.000 claims description 15
- 238000006073 displacement reaction Methods 0.000 claims description 15
- 230000011664 signaling Effects 0.000 claims description 2
- 238000000034 method Methods 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 238000011217 control strategy Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
- G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0416—Connectors, terminals
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Structure Of Printed Boards (AREA)
- Tests Of Electronic Circuits (AREA)
Abstract
The invention discloses a bread board and test equipment, and relates to the technical field of electronics. The bread board is formed by arranging the bottom plate, the top plate and the contact array; wherein, the bottom plate is provided with a plurality of first conducting wires; the top plate is provided with a plurality of second conducting wires; the contact array is arranged between the bottom plate and the top plate, a first connecting end of each contact in the contact array is connected with the first conducting wire, a second connecting end of each contact is connected with the second conducting wire, and a third connecting end of each contact is connected with the test element. In the invention, the test elements are inserted on the contacts, and the test elements can be connected through the contacts and the conducting wires, so that extra wiring is reduced, the circuit is concise, and the adjustment of test personnel is facilitated.
Description
Technical Field
The invention relates to the technical field of electronics, in particular to a bread board and test equipment.
Background
In the early stages of the design of electronic products, it is often necessary to test the functions of the designed circuits, which is not replaced by software simulation. At present, the testing method mainly comprises the following steps: and (3) plugging components by using the bread board, connecting the components by a travelling wire after plugging the components by the method, and then executing the test. However, there are often more wires in this way, and when the circuit is in error, it is difficult to find out the problem from the out-of-order complicated external wires, and the difficulty of adjusting the wires is high. Therefore, how to test the circuit conveniently is a technical problem to be solved.
The foregoing is provided merely for the purpose of facilitating understanding of the technical solutions of the present invention and is not intended to represent an admission that the foregoing is prior art.
Disclosure of Invention
The invention mainly aims to provide a bread board and test equipment, and aims to solve the technical problems of more bread board wiring and high adjustment difficulty in the prior art.
To achieve the above object, the present invention provides a bread board, comprising:
a bottom plate provided with a plurality of first conducting wires;
a top plate provided with a plurality of second conducting wires;
the contact array is arranged between the bottom plate and the top plate, a first connecting end of each contact in the contact array is connected with the first conducting wire, a second connecting end of each contact is connected with the second conducting wire, and a third connecting end of each contact is connected with the test element.
Optionally, the plurality of first conductive lines are disposed in parallel along a first direction on the bottom board.
Optionally, the plurality of second conductive lines are disposed in parallel along the second direction on the top plate.
Optionally, the first direction and the second direction are perpendicular to each other.
Optionally, the contact includes a first switch, a second switch, and a conducting member;
the first connecting end of the conducting piece is connected with the first end of the first switch, the second connecting end of the conducting piece is connected with the first end of the second switch, the third connecting end of the conducting piece is connected with the test element, the second end of the first switch is connected with the first conducting wire, and the second end of the second switch is connected with the second conducting wire.
Optionally, the bread board further comprises a control circuit, wherein the third end of the first switch and the third end of the second switch are connected with the output end of the control circuit;
and the control circuit is used for outputting a control signal to the first switch and/or the second switch so as to control the on-off of the first switch and/or the second switch.
Optionally, the first switch is a MOS transistor electronic switch, a control end of the MOS transistor electronic switch is connected to an output end of the control circuit, a first communication end of the MOS transistor electronic switch is connected to a first conductive line on the bottom plate, and a second communication end of the MOS transistor electronic switch is connected to a second conductive line on the top plate.
Optionally, the control circuit includes a microcontroller and a plurality of displacement buffers, the microcontroller is connected with each displacement buffer, and the displacement buffer is connected with the first switch and/or the second switch;
and the displacement buffer is used for converting the control signal sent by the microcontroller into a driving signal and controlling the on-off of the first switch and/or the second switch according to the driving signal.
Optionally, the control circuit further comprises a communication circuit, and the communication circuit is connected with the microcontroller;
and the microcontroller is used for generating a control signal according to the control information sent by the communication circuit.
In order to achieve the above object, the present invention also provides a testing device, which comprises a bread board as described above.
The bread board is formed by arranging the bottom plate, the top plate and the contact array; wherein, the bottom plate is provided with a plurality of first conducting wires; the top plate is provided with a plurality of second conducting wires; the contact array is arranged between the bottom plate and the top plate, a first connecting end of each contact in the contact array is connected with the first conducting wire, a second connecting end of each contact is connected with the second conducting wire, and a third connecting end of each contact is connected with the test element. In the invention, the test elements are inserted on the contacts, and the test elements can be connected through the contacts and the conducting wires, so that extra wiring is reduced, the circuit is concise, and the adjustment of test personnel is facilitated.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to the structures shown in these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a front view of a first embodiment of a bread board according to the present invention;
FIG. 2 is a bottom view of a first embodiment of a breadboard according to the present invention;
FIG. 3 is a top view of a first embodiment of a bread board according to the present invention;
FIG. 4 is a front view of a second embodiment of a bread board according to the present invention;
fig. 5 is a functional schematic diagram of an embodiment of a bread board control circuit according to the present invention.
Reference numerals illustrate:
reference numerals | Name of the name | Reference numerals | Name of the name |
10 | Bottom plate | 70 | Second switch |
20 | Top plate | 80 | Conduction piece |
30 | Contact array | 90 | Micro controller |
40 | First conductive line | 100 | Displacement buffer |
50 | Second conductive line | 110 | Communication circuit |
60 | First switch |
The achievement of the objects, functional features and advantages of the present invention will be further described with reference to the accompanying drawings, in conjunction with the embodiments.
Detailed Description
It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
It should be noted that all directional indicators (such as up, down, left, right, front, and rear … …) in the embodiments of the present invention are merely used to explain the relative positional relationship, movement, etc. between the components in a particular posture (as shown in the drawings), and if the particular posture is changed, the directional indicator is changed accordingly.
Furthermore, the description of "first," "second," etc. in this disclosure is for descriptive purposes only and is not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the technical solutions should be considered that the combination does not exist and is not within the scope of protection claimed by the present invention.
Referring to fig. 1, 2 and 3, fig. 1 is a front view of a first embodiment of a bread board according to the present invention;
fig. 2 is a bottom view of the first embodiment of the bread board according to the present invention, and fig. 3 is a top view of the first embodiment of the bread board according to the present invention. The present invention proposes a first embodiment of a bread board.
In the first embodiment, the bread board includes a bottom plate 10 provided with a plurality of first conductive lines 40; a top plate 20 provided with a plurality of second conductive lines 50; the contact array 30 is disposed between the bottom plate 10 and the top plate 20, a first connection end of each contact in the contact array 30 is connected to the first conductive line 40, a second connection end of each contact is connected to the second conductive line 50, and a third connection end of each contact is connected to the test element.
The first conductive line 40 and the second conductive line 50 are made of conductive material, so that the connection points formed by the contact points on the conductive lines are communicated with each other. The number of the conducting lines on the bottom plate 10 and the top plate 20 may be set as required, for example, four or five conducting lines, which is not limited in this embodiment.
Each contact in the contact array 30 is also made of a conductive material, and each contact is provided with a portion, such as a jack or the like, for connecting to a pin of a test element; the test element comprises components such as a resistor, a capacitor and the like.
After the test element is connected to the contact, the test element may be connected to the first conductive line 40 and the second conductive line 50 corresponding to the contact through the contact, so as to be connected to the test element connected to the other contact on the first conductive line 40 or the second conductive line 50. According to different arrangement relations of pins of the test elements on each conducting wire, the two test elements can form a parallel connection or series connection relation, so that wiring among the test elements can be reduced, and a test circuit is simplified.
In order to make the circuit layout of the test circuit more flexible, the directions of the conducting lines on the bottom board 10 and the top board 20 may be different, for example, the bottom board 10 may be provided with a conducting line parallel to one side, a conducting line perpendicular to the side, and a conducting line intersecting the side.
Of course, to make the circuit simpler, the directions of the conducting lines on the bottom plate 10 and the top plate 20 may be the same; that is, the first conductive lines 40 are disposed in parallel on the bottom board 10 along the first direction; the second conductive lines 50 are disposed in parallel in the second direction on the top plate 20. The first direction and the second direction can be set according to the user requirement.
In addition, in order to facilitate the arrangement of the contact array, the contacts are uniformly distributed, the operation is convenient, and the first direction and the second direction are mutually perpendicular. In a specific implementation, for each conductive line to facilitate printing, each first conductive line 40 on the bottom plate 10 is distributed in a longitudinal direction as shown in fig. 2, and each second conductive line 50 on the top plate 20 is distributed in a transverse direction as shown in fig. 3.
The first embodiment constitutes a bread board by providing a bottom plate 10, a top plate 20, and a contact array 30; wherein, the bottom plate 10 is provided with a plurality of first conducting wires 40; a top plate 20 provided with a plurality of second conductive lines 50; the contact array 30 is disposed between the bottom plate 10 and the top plate 20, a first connection end of each contact in the contact array 30 is connected to the first conductive line 40, a second connection end of each contact is connected to the second conductive line 50, and a third connection end of each contact is connected to the test element. In the embodiment, the test elements are inserted into the contacts, and the test elements can be connected through the contacts and the conducting wires, so that extra wiring is reduced, the circuit is concise, and the adjustment of test personnel is facilitated.
Referring again to fig. 2, 3 and 4, fig. 4 is a front view of a second embodiment of the bread board according to the present invention. Based on the first embodiment described above, the present invention proposes a second embodiment of a bread board.
In the second embodiment, the contacts include a first switch 60, a second switch 70, and a conductive member 80. The first connection end of the conducting member 80 is connected to the first end of the first switch 60, the second connection end of the conducting member 80 is connected to the first end of the second switch 70, the third connection end of the conducting member 80 is connected to the test element, the second end of the first switch 60 is connected to the first conducting wire 40, and the second end of the second switch 70 is connected to the second conducting wire 50.
In order to improve the convenience of the bread board in adjusting the circuit, in this embodiment, the contacts include the first switch 60, the second switch 70, and the conductive member 80. The conductive member 80 is made of conductive material, and the conductive member 80 is provided with a jack for connecting pins of the test element.
The test element is connected by inserting pins into receptacles in the pass-through 80, the test element being in communication with the first pass-through line 40 when the first switch 60 is closed; when the second switch 70 is closed, the test element communicates with the second conductive line 50. When a tester modulates the circuit route, the connection relation between the test elements can be adjusted by controlling the closing states of the first switch 60 and the second switch 70, so that the adjustment of the test elements is reduced.
In a specific implementation, the first switch 60 or the second switch 70 may be an electrically controlled switch or a manually controlled switch, and after the test element is plugged into each conducting member 80, the test personnel controls the first switch 60 or the second switch 70 to be turned on or off, so as to adjust the circuit line to a required line, and the specific configuration of the first switch 60 or the second switch 70 may be set according to the requirement, which is not limited in this embodiment.
In order to clearly describe the control of the first switch 60 or the second switch 70, the present embodiment will be described taking the first switch 60 or the second switch 70 as an electrically controlled switch as an example.
In this embodiment, the bread board further includes a control circuit, and the third terminal of the first switch 60 and the third terminal of the second switch 70 are both connected to the output terminal of the control circuit. And the control circuit is used for outputting a control signal to the first switch 60 and/or the second switch 70 so as to control the on-off of the first switch 60 and/or the second switch 70.
In a specific implementation, a processor may be disposed in the control circuit, and the processor outputs control information to the first switch 60 or the second switch 70 through a preset control program, where the control signal may be a low level signal or a high level signal. The first switch 60 or the second switch 70 may be closed when a low level signal is received, or may be closed when a high level signal is received.
For control, the first switch 60 is a MOS transistor electronic switch, a control end of the MOS transistor electronic switch is connected to an output end of the control circuit, a first connection end of the MOS transistor electronic switch is connected to a first conductive line on the bottom plate, and a second connection end of the MOS transistor electronic switch is connected to a second conductive line on the top plate.
Similarly, the second switch 70 may be a MOS transistor electronic switch. The MOS transistor electronic switch is an integrated device, and may implement physical connection between the conducting element 80 and each conducting line, where the logic control level of the closing and conducting is related to its specific model, which is not limited in this embodiment.
Referring to fig. 5, fig. 5 is a functional schematic diagram of an embodiment of a bread board control circuit according to the present invention.
As shown in fig. 5, the control circuit includes a microcontroller 90 and a plurality of displacement buffers 100, the microcontroller 90 is respectively connected to each of the displacement buffers 100, and the displacement buffers 100 are connected to the first switch 60 and/or the second switch 70. The displacement buffer 100 is configured to convert the control signal sent by the microcontroller 90 into a driving signal, and control the on/off of the first switch 60 and/or the second switch 70 according to the driving signal.
It should be noted that, the control signal and the driving signal may be current signals, and the output current of the microcontroller 90 is low, so that the control current of the first switch 60 or the second switch 70 is difficult to reach, and therefore, the displacement buffer 100 is provided to amplify the control current, so as to obtain the driving current meeting the requirement.
In addition, when the number of the first switches 60 and the second switches 70 is large, the number of control pins of the single microcontroller 90 is insufficient, and the control pins need to be extended by the displacement buffer 100, so that all the first switches 60 and the second switches 70 are controlled. The microcontroller 90 inputs the bit data to be input to the data input of the shift register 100; the shift register 100 strings in data; and then parallel output data, namely data merging, is realized according to the control sequence.
To facilitate adjustment of the control program, the control circuit further includes a communication circuit 110, the communication circuit 110 being coupled to the microcontroller 90; the microcontroller 90 is configured to generate a control signal according to the control information sent by the communication circuit 110.
It should be noted that the communication circuit 110 may employ a conventional communication interface, such as SCI (Serial Communication Interface ), SPI (Serial Peripheral Interface, serial peripheral interface), or others. The communication circuit 110 may receive the control information from the external device and forward the control information to the microcontroller 90, and the microcontroller 90 generates corresponding control information by compiling the control information.
In specific implementations, the first switch 60 or the second switch 70 may be numbered in advance, such as 01, 02, 03, or the like; and simultaneously, the control state is coded, for example, the closing state is 00, and the opening state is 01. The external device generates information of the protection switch number and the state number according to the need, and transmits the generated signals to the microcontroller 90, so that the microcontroller 90 determines the control strategy for each switch.
In the second embodiment, the contacts include the first switch 60, the second switch 70 and the conducting member 80, each of which is driven by the control circuit, and the tester can modify by changing the state of the switch when adjusting the circuit, so that the adjustment of the test element is reduced, and the test is more convenient.
In order to achieve the above object, the present invention also provides a testing device, which comprises a bread board as described above. The bread board adopts all the technical schemes of all the embodiments, so that the bread board has at least all the beneficial effects brought by the technical schemes of the embodiments, and the description is omitted herein.
From the above description of the embodiments, it will be clear to those skilled in the art that the above-described embodiment method may be implemented by means of software plus a necessary general hardware platform, but of course may also be implemented by means of hardware, but in many cases the former is a preferred embodiment. Based on such understanding, the technical solution of the present invention may be embodied essentially or in a part contributing to the prior art in the form of a software product stored in a storage medium (e.g. read only memory mirror (Read Only Memory image, ROM)/random access memory (Random Access Memory, RAM), magnetic disk, optical disk), comprising instructions for causing a terminal device (which may be a mobile phone, a computer, a server, an air conditioner, or a network device, etc.) to perform the method according to the embodiments of the present invention.
The foregoing description is only of the preferred embodiments of the present invention, and is not intended to limit the scope of the invention, but rather is intended to cover any equivalents of the structures or equivalent processes disclosed herein or in the alternative, which may be employed directly or indirectly in other related arts.
Claims (8)
1. A breadboard, characterized in that the breadboard comprises:
a bottom plate provided with a plurality of first conducting wires;
a top plate provided with a plurality of second conducting wires;
the contact array is arranged between the bottom plate and the top plate, a first connecting end of each contact in the contact array is connected with the first conducting wire, a second connecting end of each contact is connected with the second conducting wire, and a third connecting end of each contact is connected with the test element;
wherein the contact comprises a first switch, a second switch and a conducting piece;
the first connecting end of the conducting piece is connected with the first end of the first switch, the second connecting end of the conducting piece is connected with the first end of the second switch, the third connecting end of the conducting piece is connected with the test element, the second end of the first switch is connected with the first conducting wire, the second end of the second switch is connected with the second conducting wire, and when the first switch is closed, the test element is communicated with the first conducting wire; when the second switch is closed, the test element is communicated with the second conducting wire;
the bread board further comprises a control circuit, wherein the third end of the first switch and the third end of the second switch are connected with the output end of the control circuit;
the control circuit is used for outputting control signals to the first switch and/or the second switch so as to control the on-off of the first switch and/or the second switch.
2. The bread board of claim 1, wherein said plurality of first conductive lines are disposed in parallel along a first direction on said bottom plate.
3. The bread board of claim 2, wherein said plurality of second conductive lines are disposed in parallel along a second direction on said top plate.
4. A bread board as claimed in claim 3, wherein said first direction and said second direction are mutually perpendicular.
5. The bread board of claim 4, wherein said first switch is a MOS transistor electronic switch, a control end of said MOS transistor electronic switch is connected to an output end of said control circuit, a first connection end of said MOS transistor electronic switch is connected to a first conductive line on said bottom plate, and a second connection end of said MOS transistor electronic switch is connected to a second conductive line on said top plate.
6. The bread board of claim 5, wherein said control circuit includes a microcontroller and a plurality of displacement buffers, said microcontroller being respectively connected to each displacement buffer, said displacement buffers being connected to said first switch and/or said second switch;
the displacement buffer is used for converting the control signal sent by the microcontroller into a driving signal and controlling the on-off of the first switch and/or the second switch according to the driving signal.
7. The bread board of claim 6, wherein said control circuit further comprises a communication circuit, said communication circuit being connected to said microcontroller;
and the microcontroller is used for generating a control signal according to the control information sent by the communication circuit.
8. A testing device, characterized in that it comprises a bread board according to any one of claims 1-7.
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CN202110754368.7A CN113625150B (en) | 2021-07-02 | 2021-07-02 | Bread board and test equipment |
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CN202110754368.7A CN113625150B (en) | 2021-07-02 | 2021-07-02 | Bread board and test equipment |
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CN113625150B true CN113625150B (en) | 2024-03-19 |
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Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2105050A (en) * | 1978-08-25 | 1983-03-16 | Racal Automation Ltd | Improvements in and relating to circuit testing apparatus |
KR20000027807A (en) * | 1998-10-29 | 2000-05-15 | 박용진 | Apparatus for testing electric/electronic logic using breadboard |
CN1304121A (en) * | 1999-12-02 | 2001-07-18 | 王祖斌 | Multifunction circuit board |
CN108107342A (en) * | 2017-11-07 | 2018-06-01 | 广州兴森快捷电路科技有限公司 | Test module wiring method and test module |
CN208540244U (en) * | 2018-06-28 | 2019-02-22 | 合肥恩光电子科技有限公司 | A kind of circuit board being conveniently replaceable element |
WO2019175969A1 (en) * | 2018-03-13 | 2019-09-19 | 株式会社 東芝 | Breadboard |
-
2021
- 2021-07-02 CN CN202110754368.7A patent/CN113625150B/en active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2105050A (en) * | 1978-08-25 | 1983-03-16 | Racal Automation Ltd | Improvements in and relating to circuit testing apparatus |
KR20000027807A (en) * | 1998-10-29 | 2000-05-15 | 박용진 | Apparatus for testing electric/electronic logic using breadboard |
CN1304121A (en) * | 1999-12-02 | 2001-07-18 | 王祖斌 | Multifunction circuit board |
CN108107342A (en) * | 2017-11-07 | 2018-06-01 | 广州兴森快捷电路科技有限公司 | Test module wiring method and test module |
WO2019175969A1 (en) * | 2018-03-13 | 2019-09-19 | 株式会社 東芝 | Breadboard |
CN208540244U (en) * | 2018-06-28 | 2019-02-22 | 合肥恩光电子科技有限公司 | A kind of circuit board being conveniently replaceable element |
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