CN113621163A - Flexible packaging material and preparation method thereof - Google Patents
Flexible packaging material and preparation method thereof Download PDFInfo
- Publication number
- CN113621163A CN113621163A CN202110945121.3A CN202110945121A CN113621163A CN 113621163 A CN113621163 A CN 113621163A CN 202110945121 A CN202110945121 A CN 202110945121A CN 113621163 A CN113621163 A CN 113621163A
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- Prior art keywords
- matrix
- rubber
- oil
- ether
- benzoin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000005021 flexible packaging material Substances 0.000 title claims abstract description 23
- 238000002360 preparation method Methods 0.000 title abstract description 8
- 239000011159 matrix material Substances 0.000 claims abstract description 62
- 230000002209 hydrophobic effect Effects 0.000 claims abstract description 47
- 239000000758 substrate Substances 0.000 claims abstract description 31
- 239000003921 oil Substances 0.000 claims description 63
- 229920001971 elastomer Polymers 0.000 claims description 43
- 239000005060 rubber Substances 0.000 claims description 37
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 36
- 239000002904 solvent Substances 0.000 claims description 23
- 238000000034 method Methods 0.000 claims description 22
- 229920000468 styrene butadiene styrene block copolymer Polymers 0.000 claims description 21
- 229920005549 butyl rubber Polymers 0.000 claims description 19
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 18
- 239000003795 chemical substances by application Substances 0.000 claims description 17
- 239000000654 additive Substances 0.000 claims description 16
- 229920005557 bromobutyl Polymers 0.000 claims description 16
- DCAYPVUWAIABOU-UHFFFAOYSA-N hexadecane Chemical compound CCCCCCCCCCCCCCCC DCAYPVUWAIABOU-UHFFFAOYSA-N 0.000 claims description 16
- 230000000996 additive effect Effects 0.000 claims description 15
- 238000010438 heat treatment Methods 0.000 claims description 15
- 230000008961 swelling Effects 0.000 claims description 15
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 14
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 claims description 14
- 229920000642 polymer Polymers 0.000 claims description 14
- 239000003431 cross linking reagent Substances 0.000 claims description 13
- 150000001335 aliphatic alkanes Chemical class 0.000 claims description 12
- 239000000945 filler Substances 0.000 claims description 12
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 11
- 229920002367 Polyisobutene Polymers 0.000 claims description 11
- 239000012190 activator Substances 0.000 claims description 11
- 229920001577 copolymer Polymers 0.000 claims description 11
- 239000005662 Paraffin oil Substances 0.000 claims description 10
- -1 alicyclic hydrocarbon Chemical class 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 10
- VLKZOEOYAKHREP-UHFFFAOYSA-N methyl pentane Natural products CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 claims description 10
- 229920000181 Ethylene propylene rubber Polymers 0.000 claims description 9
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims description 9
- KUAZQDVKQLNFPE-UHFFFAOYSA-N thiram Chemical compound CN(C)C(=S)SSC(=S)N(C)C KUAZQDVKQLNFPE-UHFFFAOYSA-N 0.000 claims description 9
- LCGLNKUTAGEVQW-UHFFFAOYSA-N Dimethyl ether Chemical compound COC LCGLNKUTAGEVQW-UHFFFAOYSA-N 0.000 claims description 8
- 239000005062 Polybutadiene Substances 0.000 claims description 8
- 238000001035 drying Methods 0.000 claims description 8
- 229920001519 homopolymer Polymers 0.000 claims description 8
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 claims description 8
- 239000003960 organic solvent Substances 0.000 claims description 8
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 7
- 244000028419 Styrax benzoin Species 0.000 claims description 7
- 235000000126 Styrax benzoin Nutrition 0.000 claims description 7
- 235000008411 Sumatra benzointree Nutrition 0.000 claims description 7
- 230000003712 anti-aging effect Effects 0.000 claims description 7
- 229960002130 benzoin Drugs 0.000 claims description 7
- 235000019382 gum benzoic Nutrition 0.000 claims description 7
- 229910052717 sulfur Inorganic materials 0.000 claims description 7
- 239000011593 sulfur Substances 0.000 claims description 7
- 229960002447 thiram Drugs 0.000 claims description 7
- FXVNBZGTAWLLNE-UHFFFAOYSA-N 1,3-thiazole;zinc Chemical compound [Zn].C1=CSC=N1 FXVNBZGTAWLLNE-UHFFFAOYSA-N 0.000 claims description 6
- IPJGAEWUPXWFPL-UHFFFAOYSA-N 1-[3-(2,5-dioxopyrrol-1-yl)phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC(N2C(C=CC2=O)=O)=C1 IPJGAEWUPXWFPL-UHFFFAOYSA-N 0.000 claims description 6
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 claims description 6
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 claims description 6
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 claims description 6
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 claims description 6
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 6
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 claims description 6
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 claims description 6
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- 238000003490 calendering Methods 0.000 claims description 6
- CBFCDTFDPHXCNY-UHFFFAOYSA-N icosane Chemical compound CCCCCCCCCCCCCCCCCCCC CBFCDTFDPHXCNY-UHFFFAOYSA-N 0.000 claims description 6
- 150000002576 ketones Chemical class 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 6
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- 229920002857 polybutadiene Polymers 0.000 claims description 6
- 229920003048 styrene butadiene rubber Polymers 0.000 claims description 6
- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 claims description 5
- 235000021355 Stearic acid Nutrition 0.000 claims description 5
- 229910052799 carbon Inorganic materials 0.000 claims description 5
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- SNRUBQQJIBEYMU-UHFFFAOYSA-N dodecane Chemical compound CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 claims description 5
- 229930195733 hydrocarbon Natural products 0.000 claims description 5
- 238000000465 moulding Methods 0.000 claims description 5
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 claims description 5
- 239000005011 phenolic resin Substances 0.000 claims description 5
- 239000008117 stearic acid Substances 0.000 claims description 5
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 claims description 4
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 claims description 4
- ZXDDPOHVAMWLBH-UHFFFAOYSA-N 2,4-Dihydroxybenzophenone Chemical compound OC1=CC(O)=CC=C1C(=O)C1=CC=CC=C1 ZXDDPOHVAMWLBH-UHFFFAOYSA-N 0.000 claims description 4
- DZZAHLOABNWIFA-UHFFFAOYSA-N 2-butoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCCCC)C(=O)C1=CC=CC=C1 DZZAHLOABNWIFA-UHFFFAOYSA-N 0.000 claims description 4
- 239000004215 Carbon black (E152) Substances 0.000 claims description 4
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 claims description 4
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 4
- 229910021578 Iron(III) chloride Inorganic materials 0.000 claims description 4
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 4
- OFBQJSOFQDEBGM-UHFFFAOYSA-N Pentane Chemical compound CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 claims description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 4
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 claims description 4
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 claims description 4
- 150000001412 amines Chemical class 0.000 claims description 4
- 150000004945 aromatic hydrocarbons Chemical class 0.000 claims description 4
- 125000004429 atom Chemical group 0.000 claims description 4
- FACXGONDLDSNOE-UHFFFAOYSA-N buta-1,3-diene;styrene Chemical class C=CC=C.C=CC1=CC=CC=C1.C=CC1=CC=CC=C1 FACXGONDLDSNOE-UHFFFAOYSA-N 0.000 claims description 4
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 claims description 4
- 239000010779 crude oil Substances 0.000 claims description 4
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 claims description 4
- 150000002148 esters Chemical class 0.000 claims description 4
- 239000011737 fluorine Substances 0.000 claims description 4
- 229910052731 fluorine Inorganic materials 0.000 claims description 4
- 238000005194 fractionation Methods 0.000 claims description 4
- 150000002334 glycols Chemical class 0.000 claims description 4
- 150000008282 halocarbons Chemical class 0.000 claims description 4
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 claims description 4
- 239000003350 kerosene Substances 0.000 claims description 4
- 239000000395 magnesium oxide Substances 0.000 claims description 4
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 4
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims description 4
- ODUCDPQEXGNKDN-UHFFFAOYSA-N nitroxyl Chemical compound O=N ODUCDPQEXGNKDN-UHFFFAOYSA-N 0.000 claims description 4
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- 244000043261 Hevea brasiliensis Species 0.000 claims description 3
- RAWPGIYPSZIIIU-UHFFFAOYSA-N [benzoyl(phenyl)phosphoryl]-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)P(=O)(C=1C=CC=CC=1)C(=O)C1=CC=CC=C1 RAWPGIYPSZIIIU-UHFFFAOYSA-N 0.000 claims description 3
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- VAMFXQBUQXONLZ-UHFFFAOYSA-N n-alpha-eicosene Natural products CCCCCCCCCCCCCCCCCCC=C VAMFXQBUQXONLZ-UHFFFAOYSA-N 0.000 claims description 3
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- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 claims description 3
- OCJBOOLMMGQPQU-UHFFFAOYSA-N 1,4-dichlorobenzene Chemical compound ClC1=CC=C(Cl)C=C1 OCJBOOLMMGQPQU-UHFFFAOYSA-N 0.000 claims description 2
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 claims description 2
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- 239000010409 thin film Substances 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/06—Coating with compositions not containing macromolecular substances
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/048—Forming gas barrier coatings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2323/00—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers
- C08J2323/02—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers not modified by chemical after treatment
- C08J2323/18—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms
- C08J2323/20—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms having four to nine carbon atoms
- C08J2323/22—Copolymers of isobutene; butyl rubber
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2323/00—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers
- C08J2323/26—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers modified by chemical after-treatment
- C08J2323/28—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers modified by chemical after-treatment by reaction with halogens or halogen-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2353/00—Characterised by the use of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Derivatives of such polymers
- C08J2353/02—Characterised by the use of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Derivatives of such polymers of vinyl aromatic monomers and conjugated dienes
Abstract
A flexible packaging material and a preparation method thereof are provided, the flexible packaging material comprises a substrate and hydrophobic oil compounded to at least part of the surface of the substrate. The invention combines the hydrophobic oil and the matrix, effectively prevents the erosion of water and oxygen substances in the external environment to the device, improves the environmental adaptability of the device and prolongs the service life of the device.
Description
Technical Field
The invention relates to the field of packaging materials, in particular to a flexible packaging material and a preparation method thereof.
Background
With the increasing maturity of new technologies such as electronic skins, implantable electronic devices, organic photovoltaics, flexible solar cells, soft robots and the like, the service stability of flexible devices gradually draws attention of people, and particularly, the failure of flexible semiconductors caused by water molecules in the air seriously affects the long-life work of flexible functional materials such as conductive polymers, two-dimensional materials, halogen perovskites and the like, and restricts the realization of commercial application of the materials.
Encapsulation is the primary means of protecting semiconductors from water molecules and plays an irreplaceable role in the electronics industry. In the traditional hard substrate semiconductor device, the traditional packaging materials such as epoxy resin plastic and the like have high mechanical strength and excellent water vapor barrier property, and provide strong support and protection for silicon electronics such as chips and the like. However, the conventional package has a large modulus, is difficult to deform greatly, and cannot be applied to the package of flexible electronics.
At present, flexible electronic packaging materials are mainly classified into three major categories, namely inorganic substances, plastics and high-molecular elastomers, including oxygen/nitride films with micro/nano-scale thickness, hydrophobic plastic films, high-density high-molecular elastomers and the like. However, defects and surface polarity result in a large intrinsic Water Vapor Transmission Rate (WVTR) of the solid flexible encapsulant. The defects are difficult to avoid in the preparation process of the solid material, the concentration increases exponentially along with the increase of the film thickness, and a low-energy barrier diffusion channel of water molecules is formed after stacking and communication, so that the water vapor transmittance is not reduced along with the increase of the film thickness, and the low water permeability of the material cannot be effectively converted into the low water vapor transmittance. In addition, the flexible packaging material has limited rearrangement capability of original molecules, and is difficult to maintain stable waterproof effect in complex actual working environments such as high temperature and high humidity, physical impact, chemical substance erosion and the like, and the expected service life cannot be reached.
Disclosure of Invention
According to a first aspect, in an embodiment, there is provided a flexible encapsulant comprising a matrix and a hydrophobic oil compounded to at least a portion of a surface of the matrix.
According to a second aspect, in an embodiment, there is provided a method for preparing the flexible packaging material of the first aspect, including: and immersing at least part of the substrate into hydrophobic oil to obtain the packaging material.
According to a third aspect, there is provided an electronic device comprising the flexible encapsulant of the first aspect.
According to the flexible packaging material and the preparation method thereof, hydrophobic oil is compounded with the matrix, so that the corrosion of water and oxygen substances in the external environment to the device is effectively prevented, the environmental adaptability of the device is improved, and the service life of the device is prolonged.
Drawings
FIG. 1 is a schematic view of a liquid-solid composite package according to an embodiment;
FIG. 2 is a flow chart of the process for preparing and packaging the liquid-solid composite polymer film according to an embodiment;
FIG. 3 is a graph showing the mass swelling ratio of a liquid-solid composite polymer film and device packaging test according to an embodiment;
FIG. 4 is a schematic diagram of an electronic device package structure according to an embodiment;
fig. 5 is a schematic view of an electronic device package structure according to an embodiment.
Description of reference numerals: 1. packaging the film; 2. a substrate; 3. an electronic device.
Detailed Description
The present invention will be described in further detail with reference to the following detailed description and accompanying drawings. Wherein like elements in different embodiments are numbered with like associated elements. In the following description, numerous details are set forth in order to provide a better understanding of the present application. However, those skilled in the art will readily recognize that some of the features may be omitted or replaced with other elements, materials, methods in different instances. In some instances, certain operations related to the present application have not been shown or described in detail in order to avoid obscuring the core of the present application from excessive description, and it is not necessary for those skilled in the art to describe these operations in detail, so that they may be fully understood from the description in the specification and the general knowledge in the art.
Furthermore, the features, operations, or characteristics described in the specification may be combined in any suitable manner to form various embodiments. Also, the various steps or actions in the method descriptions may be transposed or transposed in order, as will be apparent to one of ordinary skill in the art. Thus, the various sequences in the specification and drawings are for the purpose of describing certain embodiments only and are not intended to imply a required sequence unless otherwise indicated where such sequence must be followed.
The numbering of the components as such, e.g., "first", "second", etc., is used herein only to distinguish the objects as described, and does not have any sequential or technical meaning. The terms "connected" and "coupled" when used herein, unless otherwise indicated, include both direct and indirect connections (couplings).
In view of the defects in the prior art, the flexible packaging material with high water vapor barrier property and self-adaptive environment is developed, the damage and corrosion of water, oxygen and corrosive substances in the external environment to the device are prevented, and the flexible packaging material has very important practical significance for realizing the commercial application of flexible electronic, photoelectric and energy devices.
In this context, the abbreviations are explained as follows:
TABLE 1
English abbreviation | English full scale | Common name of Chinese |
WVTR | water vapor transmission rate | Water vapor transmission rate |
IIR | Butyl Rubber | Butyl rubber |
BIIR | Bromobutyl rubber | Brominated butyl rubber |
PIB | Polyisobutylene | Polyisobutylene rubber |
SBR | Styrene Butadiene Rubber | Styrene butadiene rubber |
BR | cis-polybutadiene | Cis-polybutadiene rubber |
EPR | Ethylene propylene rubber | Ethylene propylene rubber |
SBS | Styrenic Block Copolymers | Styrene-butadiene-styrene block copolymers |
SEBS | Styrene Ethylene Butylene Styrene | Hydrogenated styrene-butadiene-styrene block copolymers |
EVA | Ethylene-Vinyl Acetate Copolymer | Ethylene-vinyl acetate copolymer |
PS | Polystyrene | Polystyrene |
According to a first aspect, in an embodiment, there is provided a flexible encapsulant comprising a matrix and a hydrophobic oil compounded to at least a portion of a surface of the matrix. The matrix is usually solid, the hydrophobic oil is liquid, and the hydrophobic oil is compounded to the matrix to form the liquid-solid composite flexible material.
The "liquid seal" concept benefits from the liquid defect-free nature of the liquid relative to traditional sealing techniques and has been used in laboratories to preserve viable chemicals such as alkali metal in hydrophobic oils such as kerosene. At the same time, the long-range mobility of the liquid molecules makes it possible to carry out a structural reformation rapidly under load.
Based on the above research backgrounds and ideas, the invention provides a liquid-solid composite packaging concept, and in one embodiment, as shown in fig. 1, the invention provides a novel flexible packaging material based on injecting a hydrophobic liquid into a high molecular elastomer. In the macromolecule elastomer, the hydrophobic liquid is driven by chemical potential to spontaneously flow to an intrinsic defect region and a defect region generated by load, the diffusion free energy barrier of water molecules in the region is improved, and the permeation resistance of the water molecules is improved thermodynamically. On the surface of the polymer elastomer, a layer of thin oil film exists due to separation pressure, oil molecules move and rearrange continuously at room temperature, and exchange positions with adjacent oil molecules frequently, so that a time window for effective interaction between the oil molecules and water molecules is shortened, and the adsorption rate of the water molecules is reduced in dynamics.
The liquid-solid composite flexible packaging material provides an effective solution for the problem of failure of the flexible device caused by erosion of water, oxygen and ions.
In one embodiment, the matrix comprises a polymer.
In one embodiment, the matrix comprises at least one of a homopolymer, a copolymer.
In one embodiment, the matrix comprises at least one of a homopolymer mainly composed of long straight carbon chains and a copolymer mainly composed of long straight carbon chains, and in the repeating units of the homopolymer and/or the copolymer, the number of atoms in the main chain is more than or equal to 2.
In one embodiment, the number of atoms in the main chain of the repeating units of the homopolymer and/or the copolymer can be 2-10.
In one embodiment, the copolymer includes, but is not limited to, at least one of styrene-butadiene-styrene block copolymer (SBS), hydrogenated styrene-butadiene-styrene block copolymer (SEBS).
In one embodiment, the matrix includes, but is not limited to, rubber.
In an embodiment, the rubber includes, but is not limited to, at least one of natural rubber, butyl rubber (IIR), bromobutyl rubber (BII R), polyisobutylene rubber (PIB), Styrene Butadiene Rubber (SBR), cis-Butadiene Rubber (BR), Ethylene Propylene Rubber (EPR).
In a preferred embodiment, the matrix may be at least one of a non-polar long carbon chain rubber having a low intrinsic water vapor transmission rate and a weakly polar long carbon chain rubber.
In a preferred embodiment, the matrix may be at least one of butyl rubber, brominated butyl rubber, and polyisobutylene rubber.
In one embodiment, the hydrophobic oil includes but is not limited to at least one of fluorine-containing silicone oil and long linear chain alkane oil with the carbon number being more than or equal to 6.
In one embodiment, the hydrophobic oil may be a long straight chain paraffin oil having 6 or more carbon atoms obtained by crude oil fractionation and/or dearomatization, or a mixture thereof.
In one embodiment, the hydrophobic oil includes, but is not limited to, kerosene (CAS registry number: 8008-20-6), mineral oil (CA S registry number: 8012-95-1), light paraffin oil, heavy paraffin oil, n-dodecane, n-hexadecane, n-eicosane, and long straight chain paraffin oil obtained by crude oil fractionation and/or dearomatization, or a mixture thereof (carbon number ≧ 6).
In a preferred embodiment, the hydrophobic oil may be at least one of n-dodecane and n-hexadecane, which have a wide application range.
In one embodiment, the substrate is in the form of a film.
In one embodiment, the substrate has a thickness of about 50 μm to about 1mm, including but not limited to 50 μm, 100 μm, 200 μm, 300 μm, 400 μm, 500 μm, 600 μm, 700 μm, 800 μm, 900 μm, 1mm, and the like.
In one embodiment, the thickness of the substrate is about 200 μm.
In one embodiment, the hydrophobic oil is complexed to at least a portion of the surface of the matrix in a swelling manner.
In one embodiment, the hydrophobic oil is compounded to all surfaces of the substrate in a swelling manner. When the substrate is immersed in the hydrophobic oil for swelling treatment, the hydrophobic oil is firstly compounded to the surface of the substrate, and along with the increase of the swelling time, a large amount of the hydrophobic oil is also immersed into the substrate until the equilibrium point is reached. That is, as the degree of swelling increases, the hydrophobic oil is largely impregnated into the matrix until saturated.
In one embodiment, the matrix further comprises an additive.
In one embodiment, the additive includes, but is not limited to, at least one of a filler, a crosslinking agent, an anti-aging agent, an activator, a promoter, and a photoinitiator.
In one embodiment, the filler includes, but is not limited to, magnesium oxide, carbon black (alias carbon black, CAS registry number: 1333-86-4), calcium carbonate (CaCO)3) Silicon dioxide (SiO)2) At least one of (1).
In one embodiment, the crosslinking agent includes, but is not limited to, 5-dimethyl-2, 5-di-tert-butylperoxyhexane (CAS number 78-63-7, formula C)16H34O4Molecular weight of 290.44), triallyl isocyanurate (CAS number 213-834-7, molecular formula C12H15N3O3Molecular weight 249.27), sulfur (CAS accession number: 7704-34-9), dicumyl peroxide (CAS accession No.: 80-43-3), phenol resin (CAS accession No.: 9003-35-4), N' -m-phenylene bismaleimide (CAS number 3006-93-7, molecular formula C14H8N2O4Molecular weight of 268.2). Sulfur, peroxidePeroxides such as diisopropylbenzene and phenol resins can function as a vulcanizing agent, and can be crosslinked by using various crosslinking agents. The N, N' -m-phenylene bismaleimide can play a role of a vulcanization assistant, promote crosslinking and improve the rubber performance.
Under certain conditions, the substances capable of vulcanizing rubber are collectively called as vulcanizing agents, and the vulcanization is that the linear molecular structure of the rubber is changed into a three-dimensional net-shaped mechanism through the bridging of the vulcanizing agents, so that the mechanical and physical properties of the rubber are improved. Vulcanizing agents may include, but are not limited to, sulfur, metal oxides, resinous vulcanizing agents, tetramethylthiuram disulfide, and the like.
In one embodiment, the antioxidant includes, but is not limited to, at least one of amine, ketoamine, and p-phenylenediamine.
In one embodiment, the activator includes, but is not limited to, ferric chloride (FeCl)3) Zinc oxide (ZnO), stearic acid (CAS accession No.: 57-11-4).
In one embodiment, the accelerator includes, but is not limited to, at least one of zinc thiazole (also known as zinc thiazole salt, CAS registry number: 155-04-4), tetramethylthiuram disulfide (also known as tetramethylthiuram disulfide, CAS registry number: 137-26-8).
In one embodiment, the photoinitiator includes, but is not limited to, benzoin ethyl ether (CAS number 574-09-4, formula C)16H16O2Molecular weight 240.297), benzoin dimethyl ether, benzoin isopropyl ether, benzoin butyl ether, bisbenzoylphenylphosphine oxide, 2,4,6- (trimethylbenzoyl) diphenylphosphine oxide, alpha-dimethoxy-alpha-phenylacetophenone, alpha-diethoxyacetophenone, 2, 4-dihydroxybenzophenone, thiopropoxy thioxanthone.
In one embodiment, the additive is added in an amount of 0 to 100 mass% (inclusive) of the mass of the polymer in the matrix. The additive can be added without or in an unlimited amount, and the mass of the additive added in the additive accounts for the mass of the polymer, and can include, but is not limited to, 0, 1%, 5%, 10%, 20%, 30%, 40%, 50%, 60%, 70%, 80%, 90%, 100%, etc.
According to a second aspect, in an embodiment, there is provided a method for preparing the flexible packaging material of the first aspect, including: and (3) immersing at least part of the substrate in hydrophobic oil to obtain the flexible packaging material.
In one embodiment, the matrix is prepared by at least one of a solvent molding method and a calendaring method.
In one embodiment, the solution forming process comprises: dissolving a matrix material in a solvent to obtain a solution, and removing the solvent from the solution to obtain the matrix.
In one embodiment, the solvent comprises an organic solvent.
In one embodiment, the organic solvent includes, but is not limited to, at least one of aromatic hydrocarbons, aliphatic hydrocarbons, alicyclic hydrocarbons, halogenated hydrocarbons, alcohols, ethers, esters, ketones, glycol derivatives, acetonitrile, pyridine, and phenol.
In one embodiment, the aromatic hydrocarbon includes, but is not limited to, at least one of benzene, toluene, xylene; the aliphatic hydrocarbon includes but is not limited to at least one of pentane, hexane and octane; the alicyclic hydrocarbon includes but is not limited to at least one of cyclohexane, cyclohexanone and toluene cyclohexanone; the halogenated hydrocarbon includes but is not limited to at least one of chlorobenzene, dichlorobenzene and dichloromethane; the alcohols include but are not limited to at least one of methanol, ethanol, isopropanol; the ethers include but are not limited to at least one of ethyl ether and propylene oxide; the esters include but are not limited to at least one of methyl acetate, ethyl acetate and propyl acetate; the ketones include but are not limited to at least one of ketone, methyl butanone, methyl isobutyl ketone; the glycol derivative includes but is not limited to at least one of ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, and ethylene glycol monobutyl ether.
In one embodiment, the organic solvent includes, but is not limited to, at least one of toluene, cyclohexane, and the like.
In one embodiment, the dissolving is performed at 25-80 ℃. Specifically, the solution can reach the target temperature by heating, so that all components are fully dissolved and uniformly dispersed.
In one embodiment, the dissolution to the base material is a homogeneous viscous fluid.
In one embodiment, additives may also be added to the solution during dissolution.
In one embodiment, the additive includes, but is not limited to, at least one of a filler, a crosslinking agent, an anti-aging agent, an activator, a promoter, and a photoinitiator.
In one embodiment, the filler includes, but is not limited to, magnesium oxide, carbon black (alias carbon black, CAS registry number: 1333-86-4), calcium carbonate (CaCO)3) Silicon dioxide (SiO)2) At least one of (1).
In one embodiment, the crosslinking agent includes, but is not limited to, 5-dimethyl-2, 5-di-tert-butylperoxyhexane (CAS number 78-63-7, formula C)16H34O4Molecular weight of 290.44), triallyl isocyanurate (CAS number 213-834-7, molecular formula C12H15N3O3Molecular weight 249.27), sulfur (CAS accession number: 7704-34-9), dicumyl peroxide (CAS accession No.: 80-43-3), phenol resin (CAS accession No.: 9003-35-4), N' -m-phenylene bismaleimide (CAS number 3006-93-7, molecular formula C14H8N2O4Molecular weight of 268.2).
In one embodiment, the antioxidant includes, but is not limited to, at least one of amine, ketoamine, and p-phenylenediamine.
In one embodiment, the activator includes, but is not limited to, ferric chloride (FeCl)3) Zinc oxide (ZnO), stearic acid (CAS accession No.: 57-11-4).
In one embodiment, the accelerator includes, but is not limited to, at least one of zinc thiazole (also known as zinc thiazole salt, CAS registry number: 155-04-4), tetramethylthiuram disulfide (also known as tetramethylthiuram disulfide, CAS registry number: 137-26-8).
In one embodiment, the photoinitiator includes, but is not limited to, at least one of benzoin, benzoin ethyl ether, benzoin dimethyl ether, benzoin isopropyl ether, benzoin butyl ether, bis-benzoylphenylphosphine oxide, 2,4,6- (trimethylbenzoyl) diphenylphosphine oxide, α -dimethoxy- α -phenylacetophenone, α -diethoxyacetophenone, 2, 4-dihydroxybenzophenone, thiopropoxythioxanone.
In one embodiment, the additive is added in an amount of 0-100% by mass based on the mass of the polymer in the matrix.
In one embodiment, the solution is poured into a container to form a liquid with a low liquid level, and the solvent in the solution is removed to obtain a film-shaped substrate.
In one embodiment, the solvent is removed from the solution by drying.
In one embodiment, the drying temperature is 40-60 ℃.
In one embodiment, the drying time is 12-24 hours.
In one embodiment, the matrix after the solvent is removed is separated from the container, then the separated matrix is heated and/or radiated to enable molecules in the matrix to be crosslinked, and then the crosslinked matrix is at least partially immersed in hydrophobic oil, so that the matrix compounded with the hydrophobic oil, namely the flexible packaging material, is obtained.
In one embodiment, the solvent-removed matrix is removed from the container and heated by heating the matrix to a first temperature for a first time, then to a second temperature for a second time to obtain a crosslinked matrix.
In one embodiment, the first temperature is 80-100 ℃ and the first time is 2-6 hours.
In one embodiment, the second temperature is 160-180 ℃, and the second time is 10min-1 h.
In one embodiment, the substrate after removal of the solvent is removed from the container and heated by placing the substrate on a heating table. The method of heating the base after the separation is not limited to the heating by the heating table, and the base may be crosslinked by a flat plate heat pressing method.
In one embodiment, the radiation includes, but is not limited to, ultraviolet radiation, which can also cause cross-linking of molecules within the matrix.
In one embodiment, the dissected substrate is irradiated and then heated to crosslink the molecules within the substrate.
In one embodiment, when at least part of the substrate is immersed in the hydrophobic oil, the temperature of the hydrophobic oil is 20-100 ℃.
In one embodiment, the time for immersing at least part of the substrate in the hydrophobic oil is 10min to 24 h.
In one embodiment, the calendering generally includes the steps of plastication, kneading, calendering, extrusion, molding, vulcanization, and the like in this order.
According to a third aspect, there is provided an electronic device comprising the flexible encapsulant of the first aspect.
In an embodiment, the electronic device includes, but is not limited to, at least one of a solar cell, an electronic skin, a wearable or implantable electronic device, a soft body robot, and the like.
In an embodiment, the solar cell includes, but is not limited to, a perovskite solar cell.
In one embodiment, the hydrophobic alkane oil is compounded with the commercial long straight carbon chain rubber to prepare the high-molecular film with high water vapor barrier property and environmental adaptability, and the high-molecular film is applied to packaging of flexible electronic, photoelectric and energy devices to realize long-life operation of the devices. The alkane oil/carbon chain rubber composite film can be obtained by the following method: toluene or other benign organic solvents are used for fully dissolving the carbon chain rubber to homogeneous viscous fluid, the temperature is about 25-80 ℃, and the magnetic stirring time is about 12 hours. Based on 100 parts by mass of the total amount of the rubber, 0.1 to 5 parts by mass of a vulcanizing agent and an auxiliary vulcanizing agent are added, and various fillers, an anti-aging agent, an activating agent, an accelerating agent and the like can also be added in a proper amount, wherein the added substances are fully and uniformly dispersed by an ultrasonic crusher, the power is 200 to 300W, and the time is 5 to 20 min. Pouring the dispersed rubber solution into a horizontal glass culture dish, drying in an oven at the temperature of 40-60 ℃ for 12-24 h, putting into a vacuum oven at the temperature of 40 ℃ to completely volatilize a solvent (such as toluene or other benign organic solvents), cleaning the glass culture dish by deionized water, ethanol and acetone, and spraying a fluorine release agent to facilitate film separation. And (3) heating the stripped rubber film for about 2-6 hours under a 80 ℃ heating table, slowly heating to 160-180 ℃, and keeping for 10min-1 hour to crosslink rubber molecules and improve the mechanical property of the material. And (3) immersing the crosslinked polymer rubber film into alkane oil at the temperature range of 20-100 ℃, keeping for 10 min-24 h, and finishing the compounding of the hydrophobic oil and the polymer in a swelling mode to finally obtain the liquid-solid composite flexible electronic packaging film with high water vapor barrier property and environmental adaptability.
In one embodiment, the commercial elastomers selected include, but are not limited to, natural rubber, butyl rubber (IIR), brominated butyl rubber (BIIR), polyisobutylene rubber (PIB), styrene-butadiene rubber (SBR), cis-Butadiene Rubber (BR), ethylene-propylene rubber (EPR), styrene-butadiene-styrene block copolymer (SBS), hydrogenated styrene-butadiene-styrene block copolymer (SEBS), and long carbon chain type rubbers/copolymers such as, but not limited to, nonpolar/weakly polar long carbon chain butyl rubber, brominated butyl rubber, and polyisobutylene rubber, which have low intrinsic moisture permeability.
In one embodiment, the selected hydrophobic oil includes, but is not limited to, kerosene, white oil, mineral oil, light paraffin oil, heavy paraffin oil, n-dodecane, n-hexadecane, n-eicosane, and long linear alkane oils obtained by crude oil fractionation and/or dearomatization, and mixtures thereof (with carbon number of 6 or more), wherein n-dodecane and n-hexadecane with a wide application range are preferred.
In one embodiment, the solvent is selected depending on the solubility of the solvent in the corresponding polymer rubber, and a colorless transparent solution is best, for example, toluene is better for the solubility of both blocks of styrene-butadiene-styrene block copolymer (SBS), but cyclohexane solvent has poor solubility for PS block, and a heterogeneous white emulsion is formed, which is not good for the preparation of transparent film.
In one embodiment, the solvent is volatilized at a suitable temperature. Too high drying temperature can lead to too fast volatilization speed of the organic solvent, and the film has bubble, wrinkle, crack and other defect positions, thereby reducing the water vapor barrier property of the film. And the solvent volatilization speed is too slow, which can cause the insoluble filler substance to be settled and influence the mechanical property of the material.
In one embodiment, the crosslinking temperature and time directly affect the degree of crosslinking of the film, and the volume swell ratio and mass swell ratio of the film vary from one film to another. At the same time, the choice of the crosslinking system is also crucial for the mechanical and swelling properties of the film. The liquid-solid composite proportion can be effectively regulated and controlled by controlling the crosslinking degree and the crosslinking mode of the polymer film.
In one embodiment, the different hydrophobic alkane oils have different injectability and water vapor barrier capabilities. Under the same immersion time and temperature, the theoretical water vapor barrier property of the heavy alkane oil is higher and the swelling rate of the film per unit volume is lower than that of the light alkane oil. Therefore, for the easily swellable rubber film, a heavy long straight chain paraffin oil having a large number of carbon atoms is selected, and for the hardly swellable rubber film, a light paraffin oil having a small number of carbon atoms is selected.
In one embodiment, the material provided by the invention can also be used for packaging rigid electronic devices, such as a packaging adhesive of perovskite solar cells, can also effectively isolate water and oxygen in the air, and has obvious performance and price advantages compared with the traditional ultraviolet curing glue, ethylene-vinyl acetate copolymer (EVA) and Surlyn resin (Surlyn).
In one embodiment, the flexible high polymer film with high water vapor barrier property is prepared and successfully applied to the field of packaging of organic flexible electronic, photoelectric and energy devices sensitive to water, oxygen and corrosive ions, and the service life of the devices is effectively prolonged.
In one embodiment, a novel simple preparation method of a liquid-solid composite flexible film with high water vapor barrier property is provided, and a series of hydrophobic polymer flexible films with different liquid-solid composite ratios are obtained by performing in-situ swelling and compounding on a rubber film with high intrinsic water vapor permeability and hydrophobic alkane oil and assisting in regulating and controlling factors such as the mode and degree of crosslinking and swelling of the film.
In one embodiment, a new approach for solving the problem of water-oxygen sensitivity of the organic flexible electronic device is provided, and the liquid-solid composite hydrophobic film is used for packaging the flexible device, so that the corrosion of water-oxygen substances in the external environment to the device is effectively prevented, the environmental adaptability of the device is improved, and the service life of the device is prolonged.
In one embodiment, the polymer film can be compounded with other types of hydrophobic oils, including but not limited to naphthenic oils, aromatic oils, fluorine-containing silicone oils, various mixed oils, and the like, to achieve the same or similar water vapor barrier properties.
In one embodiment, there are also alternatives for preparing the liquid-solid composite polymer film, for example, the rubber matrix is plasticized, kneaded, calendered, extruded, molded, vulcanized to form a film, and then compounded by in-situ swelling.
In an embodiment, as shown in fig. 4, a schematic view of an electronic device package structure is shown, which includes a substrate 2 and an electronic device 3 disposed on an upper surface of the substrate 2, where the electronic device 3 is generally a flexible electronic device, and the packaging film 1 is the flexible packaging material according to the first aspect of the present invention. The outer edges of the substrate 2 and the electronic device 3 are almost completely consistent, the integral structure formed by the substrate 2 and the electronic device 3 is a component to be packaged, and the packaging film 1 is packaged to the outer surface of the component to be packaged, so that the substrate 2 and the electronic device 3 are both packaged in the packaging film 1.
In another embodiment, as shown in fig. 5, another electronic device packaging structure is schematically illustrated, a substrate 2 and an electronic device 3 disposed on an upper surface of the substrate 2, where the electronic device 3 is generally a flexible electronic device, a packaging film 1 is the flexible packaging material according to the first aspect of the present invention, the upper surface of the substrate 2 is larger than a lower surface of the electronic device 3, and the packaging film 1 covers the upper surface and the sidewalls of the electronic device 3 and extends outward to a portion of the upper surface of the substrate 2, so that the electronic device 3 is completely covered.
The invention is further illustrated by the following non-limiting specific examples.
In the following examples, room temperature means 23. + -. 2 ℃ unless otherwise specified.
The following embodiments all employ the package structure shown in fig. 4.
Example 1
Anhydrous toluene is used as a solvent, butyl Rubber (purchased from German Langsheng company, product number: LANXESS 301, full name in English, Isobutylene Isoprene Rubber, IIR for short) is used as a polymer matrix, and the product is magnetically stirred for 12 hours at room temperature to prepare a homogeneous transparent solution of 100 mg/mL. Based on 100 parts by mass of the butyl rubber, 5 parts of zinc oxide (activator), 1.5 parts of stearic acid (activator) and 1.5 parts of sulfur (cross-linking agent) are sequentially added into the transparent solution, and the components are fully dissolved and dispersed for 10min by a 200W ultrasonic crusher. The pipette gun transferred 10mL of the mixed solution into a flat-bottomed glass culture dish having a diameter of 60mm, and then placed in a forced air drying oven at 50 ℃ to volatilize the toluene solvent for 12 hours, thereby obtaining a butyl rubber film having a thickness of about 200. mu.m. And (3) placing the prepared film under a 80 ℃ hot stage for preliminary crosslinking for 4h, completely volatilizing the residual toluene solution, gradually and slowly heating to 170 ℃ and keeping for 30min to complete crosslinking, wherein the prepared crosslinked butyl rubber film is light yellow and transparent. The components in the additive can play a variety of roles, for example, zinc oxide is used as an activator, and when the amount of zinc oxide added is large, the zinc oxide can play a role in filler reinforcement, and the zinc oxide in the embodiment can play a role in filler reinforcement.
The polymer film is cut into 2cm x 2cm in size, completely immersed in a beaker containing n-hexadecane oil (purchased from Aladdin, Inc., anhydrous grade, purity is more than or equal to 99%) for 6h, taken out and wiped to dry the surface oil film by using filter paper, as shown in figure 3(a), the ordinate is mass swelling ratio (%), and the abscissa is time (h), so that the polymer film with the liquid-solid composite ratio of about 1.2:1 is obtained, and the polymer film is proved to have better flexibility, transparency, self-healing and water vapor barrier effect. The liquid refers to hexadecane oil, and the solid refers to a cross-linked butyl rubber film.
The flexible perovskite solar cell is packaged by a film hot-pressing mode, specifically, the flexible perovskite solar cell is packaged by a space-electron RADIANT solar component laminating machine by adopting the polymer film prepared by the embodiment, the laminating pressure is 500mbar, the temperature is 120 ℃, and the vacuum degree is lower than 100kPa, so that the flexible perovskite solar cell is prepared. The packaging method of the flexible perovskite solar cell of the subsequent embodiment is the same as that of the embodiment.
The commodity information of the space-electricity solar component laminating machine is as follows: brand name: yufeng RADIANT; the model is as follows: YD S0405 (custom temperature 300 ℃); the manufacturer: qinhuang island space automation equipment ltd.
The fluorescence spectrum test is performed on the flexible perovskite solar cell obtained by encapsulation, the test result is shown in fig. 3(b), the ordinate is normalized energy conversion efficiency (normalized PCE), the abscissa is time (h), and the normalized energy conversion efficiency of the polymer thin film prepared in the embodiment after long-life operation for 500h can reach more than 0.9 (i.e., 90%), so that a possibility is provided for commercial application.
The performance index was measured as follows:
1) mass swelling ratio measuring method
Weigh 2 x 2cm size rubber film and record W1(ii) a The rubber film after being soaked in the hydrophobic alkane oil for 6 hours is weighed again and recorded as W2。
2) Method for measuring normalized energy conversion efficiency of electronic device
Detecting the device efficiency by adopting a HORIBA FluoroMax + fluorescence spectrometer, wherein the measured initial energy conversion efficiency of the encapsulated electronic device is eta1The energy conversion efficiency of the device after long-time operation is eta2。
The normalized energy conversion efficiency is mainly used for representing the performance reduction degree of the device after long-time work, and the closer the energy conversion efficiency of the device after long-time work is to the initial value, the better the packaging effect is.
The closer the normalized energy conversion efficiency is to 1, the less the device performance degradation, the more excellent the performance.
The measurement and calculation methods of the mass swelling ratio and the normalized energy conversion efficiency in the following examples 2 and 3 were the same as those in this example.
Example 2
Anhydrous toluene was used as a solvent, and BROMOBUTYL rubber (brominated isobutylene-isoprene rubber, BIIR for short, available from Lanceae, Germany under the product designation: Lanxess Bromobutyl 2030) was used as a polymer matrix, and the mixture was magnetically stirred at room temperature for 12 hours to prepare a homogeneous transparent solution of 100 mg/mL. Based on 100 parts by mass of the brominated butyl rubber, 2 parts of magnesium oxide (filler), 2 parts of 2, 5-dimethyl-2, 5-di-tert-butylperoxyhexane (cross-linking agent) and 0.3 part of N, N' -m-phenylene bismaleimide (cross-linking agent, also called vulcanization aid) are sequentially added into a transparent solution, and all the components are fully dissolved and dispersed for 10min by a 200W ultrasonic crusher. The pipette gun transferred 10mL of the mixed solution into a flat-bottomed glass petri dish having a diameter of 60mm, and then placed in a forced air drying oven at 40 ℃ to volatilize the toluene solvent for 12 hours, thereby obtaining a brominated butyl rubber film having a thickness of about 200. mu.m. And (3) placing the prepared film under a 80 ℃ hot stage for primary crosslinking for 4h, completely volatilizing the residual toluene solution, slowly heating to 170 ℃ and keeping for 30min to complete crosslinking, wherein the prepared crosslinked brominated butyl rubber film is light yellow and transparent.
Cutting the polymer film into 2cm × 2cm, completely soaking in a beaker containing n-hexadecane oil for 6h, taking out, and wiping off the surface oil film with filter paper, as shown in FIG. 3(a), to obtain a polymer film with a liquid-solid composite ratio of about 1: 1.
The flexible perovskite solar cell is packaged by adopting a film hot-pressing mode, and a test result is shown in fig. 3(b), so that the normalized energy conversion efficiency of the high polymer film prepared by the embodiment after the high polymer film works for 500 hours in a long service life can reach more than 90%, and the possibility is provided for commercial application.
Example 3
Anhydrous toluene is used as a solvent, styrene-butadiene-styrene block copolymer (SBS, sold by Keteng of America, the trade name is D1155 JOP) is used as a polymer matrix, and the mixture is magnetically stirred for 12 hours at room temperature to prepare 150mg/mL homogeneous transparent solution. And adding 2 parts of benzoin ethyl ether (photoinitiator) and 2 parts of triallyl isocyanurate (crosslinking agent) into the transparent solution in sequence according to 100 parts of the mass of the high-molecular matrix, and fully dissolving and dispersing all the components for 10min by a 200W ultrasonic crusher. The pipette gun transfers 10mL of the mixed solution to a flat-bottomed glass culture dish with a diameter of 60mm, and the flat-bottomed glass culture dish is placed in a forced air drying oven at 50 ℃ to volatilize the toluene solvent for 12 hours, so that a polymer matrix film with the thickness of about 200 mu m is obtained. And (3) placing the prepared film under 254nm ultraviolet light for irradiating for 5min for primary crosslinking, then deeply curing for 4h at a hot stage of 80 ℃, slowly heating to 160 ℃, and keeping for 1h to complete crosslinking, wherein the prepared crosslinked SBS film is light yellow and transparent.
Cutting the polymer film into 2cm x 2cm size, completely soaking in a beaker containing n-dodecane hydrocarbon oil (anhydrous grade, purity greater than or equal to 99%) for 6h, taking out, and wiping off the surface oil film with filter paper, as shown in FIG. 3(a), to obtain the polymer film with liquid-solid composite ratio of 1: 1.
The flexible perovskite solar cell is packaged by adopting a film hot-pressing mode, and a test result is shown in fig. 3(b), so that the normalized energy conversion efficiency of the high polymer film prepared by the embodiment after the high polymer film works for 500 hours in a long service life can reach more than 90%.
The present invention has been described in terms of specific examples, which are provided to aid understanding of the invention and are not intended to be limiting. For a person skilled in the art to which the invention pertains, several simple deductions, modifications or substitutions may be made according to the idea of the invention.
Claims (10)
1. The flexible packaging material is characterized by comprising a matrix and hydrophobic oil compounded to at least partial surface of the matrix.
2. The flexible packaging material of claim 1, wherein the matrix comprises at least one of a homopolymer, a copolymer;
and/or the matrix comprises at least one of a homopolymer taking a long straight carbon chain as a main body and a copolymer taking the long straight carbon chain as a main body, wherein in a repeating unit of the homopolymer and/or the copolymer, the number of atoms on a main chain is more than or equal to 2;
and/or in the repeating units of the homopolymer and/or the copolymer, the number of atoms on the main chain is 2-10;
and/or, the copolymer comprises at least one of styrene-butadiene-styrene block copolymer (SBS), hydrogenated styrene-butadiene-styrene block copolymer (SEBS);
and/or, the matrix comprises a rubber;
and/or the rubber comprises rubber mainly comprising long straight carbon chains;
and/or the rubber comprises at least one of natural rubber, butyl rubber (IIR), brominated butyl rubber (BIIR), polyisobutylene rubber (PIB), Styrene Butadiene Rubber (SBR), Butadiene Rubber (BR) and Ethylene Propylene Rubber (EPR);
and/or the hydrophobic oil comprises at least one of fluorine-containing silicone oil and long straight chain alkane oil with the carbon number more than or equal to 6;
and/or the hydrophobic oil is long straight chain alkane oil with the carbon atom number more than or equal to 6 or a mixture thereof obtained by crude oil fractionation and/or dearomatization;
and/or the hydrophobic oil comprises at least one of kerosene, mineral oil, light paraffin oil, heavy paraffin oil, n-dodecane, n-hexadecane and n-eicosane.
3. A flexible packaging material as defined in claim 1, wherein said base is in the form of a film;
and/or the thickness of the substrate is 50 mu m-1 mm;
and/or the hydrophobic oil is compounded to at least part of the surface of the matrix in a swelling manner;
and/or, the matrix further comprises an additive;
and/or the additive comprises at least one of a filler, a crosslinking agent, an anti-aging agent, an activator, a promoter and a photoinitiator;
and/or, the filler comprises magnesium oxide, carbon black, calcium carbonate (CaCO)3) Silicon dioxide (SiO)2) At least one of;
and/or the cross-linking agent comprises at least one of 5-dimethyl-2, 5-di-tert-butylperoxy hexane, triallyl isocyanurate, sulfur, dicumyl peroxide, phenolic resin and N, N' -m-phenylene bismaleimide;
and/or the anti-aging agent comprises at least one of amine, ketoamine and p-phenylenediamine;
and/or, the activator comprises ferric chloride (FeCl)3) At least one of zinc oxide (ZnO) and stearic acid;
and/or the accelerator comprises at least one of zinc thiazole and tetramethylthiuram disulfide;
and/or the photoinitiator comprises at least one of benzoin, benzoin ethyl ether, benzoin dimethyl ether, benzoin isopropyl ether, benzoin butyl ether, bis-benzoylphenyl phosphine oxide, 2,4,6- (trimethylbenzoyl) diphenyl phosphine oxide, alpha-dimethoxy-alpha-phenyl acetophenone, alpha-diethoxy acetophenone, 2, 4-dihydroxy benzophenone, thiopropoxy thioxanthone;
and/or the addition mass of the additive is 0-100% of the mass of the polymer in the matrix.
4. A method for preparing a flexible packaging material as claimed in any one of claims 1 to 3, comprising: and (3) immersing at least part of the substrate in hydrophobic oil to obtain the flexible packaging material.
5. The method according to claim 4, wherein the matrix is produced by at least one of a solution molding method and a calender molding method.
6. The method of claim 5, wherein the solution forming process comprises: dissolving a matrix material in a solvent to obtain a solution, and removing the solvent from the solution to obtain the matrix.
7. The method of claim 6, wherein the solvent comprises an organic solvent;
the organic solvent comprises at least one of aromatic hydrocarbon, aliphatic hydrocarbon, alicyclic hydrocarbon, halogenated hydrocarbon, alcohol, ether, ester, ketone, glycol derivative, acetonitrile, pyridine and phenol;
and/or the aromatic hydrocarbon comprises at least one of benzene, toluene and xylene; the aliphatic hydrocarbon comprises at least one of pentane, hexane and octane; the alicyclic hydrocarbon comprises at least one of cyclohexane, cyclohexanone and toluene cyclohexanone; the halogenated hydrocarbon comprises at least one of chlorobenzene, dichlorobenzene and dichloromethane; the alcohol comprises at least one of methanol, ethanol and isopropanol; the ethers comprise at least one of diethyl ether and propylene oxide; the esters comprise at least one of methyl acetate, ethyl acetate and propyl acetate; the ketone comprises at least one of ketone, methyl butanone and methyl isobutyl ketone; the glycol derivative comprises at least one of ethylene glycol monomethyl ether, ethylene glycol monoethyl ether and ethylene glycol monobutyl ether;
and/or the dissolving is carried out at 25-80 ℃;
and/or, dissolving until the matrix material is a homogeneous viscous fluid;
and/or, when dissolving, also include adding additive to solution;
and/or the additive comprises at least one of a filler, a crosslinking agent, an anti-aging agent, an activator, a promoter and a photoinitiator;
and/or the cross-linking agent comprises at least one of 5-dimethyl-2, 5-di-tert-butylperoxy hexane, triallyl isocyanurate, sulfur, dicumyl peroxide, phenolic resin and N, N' -m-phenylene bismaleimide;
and/or the anti-aging agent comprises at least one of amine, ketoamine and p-phenylenediamine;
and/or the activator comprises ferric chloride (FeCl)3) Zinc oxide (ZnO), stearic acid (CAS accession No.: 57-11-4);
and/or the accelerator comprises at least one of zinc thiazole and tetramethylthiuram disulfide;
and/or the photoinitiator comprises at least one of benzoin, benzoin ethyl ether, benzoin dimethyl ether, benzoin isopropyl ether, benzoin butyl ether, bis-benzoylphenyl phosphine oxide, 2,4,6- (trimethylbenzoyl) diphenyl phosphine oxide, alpha-dimethoxy-alpha-phenyl acetophenone, alpha-diethoxy acetophenone, 2, 4-dihydroxy benzophenone, thiopropoxy thioxanthone;
and/or the addition mass of the additive is 0-100% of the mass of the polymer in the matrix;
and/or, removing the solvent in the solution by drying;
and/or the drying temperature is 40-60 ℃;
and/or the drying time is 12-24 h;
and/or, the matrix with the solvent removed is separated from the container, then the separated matrix is heated and/or radiated to enable molecules in the matrix to be crosslinked, and then the crosslinked matrix is at least partially immersed in hydrophobic oil to obtain the matrix compounded with the hydrophobic oil, namely the flexible packaging material;
and/or, separating the matrix from the container after the solvent is removed, heating the matrix to a first temperature for a first time, then heating to a second temperature for a second time to obtain a crosslinked matrix;
and/or the first temperature is 80-100 ℃, and the first time is 2-6 h;
and/or the second temperature is 160-180 ℃, and the second time is 10min-1 h;
and/or, the radiation comprises ultraviolet radiation;
and/or, radiating the dissected matrix, and then heating to crosslink molecules in the matrix;
and/or, when at least part of the matrix is immersed in hydrophobic oil, the temperature of the hydrophobic oil is 20-100 ℃;
and/or the time for immersing at least part of the matrix into the hydrophobic oil is 10 min-24 h.
8. The method of claim 5, wherein the calendering process comprises in order the steps of plasticating, compounding, calendering, extruding, molding, and vulcanizing.
9. An electronic device, characterized in that it comprises a flexible encapsulating material according to any of claims 1 to 3.
10. The electronic device of claim 9, wherein the electronic device comprises at least one of a solar cell, an electronic skin, a wearable or implantable electronic device, a soft body robot;
the solar cell comprises a perovskite solar cell.
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