CN113620546A - Treatment method of silicon wafer cleaning sewage - Google Patents
Treatment method of silicon wafer cleaning sewage Download PDFInfo
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- CN113620546A CN113620546A CN202111168743.6A CN202111168743A CN113620546A CN 113620546 A CN113620546 A CN 113620546A CN 202111168743 A CN202111168743 A CN 202111168743A CN 113620546 A CN113620546 A CN 113620546A
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- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F9/00—Multistage treatment of water, waste water or sewage
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- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F1/00—Treatment of water, waste water, or sewage
- C02F1/001—Processes for the treatment of water whereby the filtration technique is of importance
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- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F1/00—Treatment of water, waste water, or sewage
- C02F1/66—Treatment of water, waste water, or sewage by neutralisation; pH adjustment
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- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F2301/00—General aspects of water treatment
- C02F2301/08—Multistage treatments, e.g. repetition of the same process step under different conditions
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- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F3/00—Biological treatment of water, waste water, or sewage
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- Environmental & Geological Engineering (AREA)
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- Separation Using Semi-Permeable Membranes (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The application relates to a method for treating silicon wafer cleaning sewage, which comprises the following steps: adding acid liquor into the silicon wafer cleaning sewage, and adjusting the pH value of the silicon wafer cleaning sewage to 4-6; adding silicon wafer cutting sewage into the silicon wafer cleaning sewage, and adjusting the concentration of suspended matters in the silicon wafer cleaning sewage; carrying out filter pressing on the silicon wafer cleaning sewage with the adjusted pH value and suspended matter concentration, and collecting a solid phase obtained by filter pressing; adding alkali liquor into the filtrate obtained by filter pressing, and adjusting the pH value of the filtrate to 7-8; and (4) carrying out biochemical treatment on the filtrate after the pH value is adjusted. The method provided by the application not only realizes the recovery of silicon powder in the silicon wafer cleaning sewage and the silicon wafer cutting sewage safely and efficiently, but also increases the benefit; the concentration of suspended matters in the treated sewage is obviously reduced, the biochemical treatment efficiency is improved, and the generation of sludge which can cause secondary pollution to the environment is eliminated.
Description
Technical Field
The application relates to the technical field of sewage treatment, in particular to a method for treating silicon wafer cleaning sewage.
Background
In the photovoltaic industry, in the process of producing and processing silicon wafers, the cut silicon wafers are subjected to multi-stage cleaning to remove attachments such as mortar, oil stains, dust and the like attached to the surfaces of the silicon wafers so as to meet the processing technological requirements of the subsequent procedures, and therefore silicon wafer cleaning sewage is generated. At present, no good treatment method is available for silicon wafer cleaning sewage.
Disclosure of Invention
In view of the problems in the background art, the application provides a method for treating silicon wafer cleaning wastewater.
The application provides a treatment method of silicon wafer cleaning sewage, which comprises the following steps: adding acid liquor into the silicon wafer cleaning sewage, and adjusting the pH value of the silicon wafer cleaning sewage to 4-6; adding silicon wafer cutting sewage into the silicon wafer cleaning sewage, and adjusting the concentration of suspended matters in the silicon wafer cleaning sewage; carrying out filter pressing on the silicon wafer cleaning sewage with the adjusted pH value and suspended matter concentration, and collecting a solid phase obtained by filter pressing; adding alkali liquor into the filtrate obtained by filter pressing, and adjusting the pH value of the filtrate to 7-8; and (4) carrying out biochemical treatment on the filtrate after the pH value is adjusted.
Compared with the prior art, the silicon wafer cleaning sewage treatment system has the advantages that a series of treatment steps including pH value adjustment, suspended matter concentration adjustment and filter pressing are added before the silicon wafer cleaning sewage is discharged into the environment-friendly sewage treatment system for biochemical treatment. In the embodiment of the application, the pH value (about 9-12) of the silicon wafer cleaning wastewater is adjusted to 4-6 by using the acid solution. On one hand, the sodium silicate water glass contained in the silicon wafer cleaning sewage has high viscosity, and is easy to block filter cloth in the filter pressing process; on the other hand, the dispersibility of suspended matters in the silicon wafer cleaning sewage is larger, so that a filter cake layer is difficult to form, and the difficulty of filter pressing is increased; in addition, in the filter pressing process, when the pH value of the sewage is more than 6, the silicon powder contained in the sewage has larger specific surface area and is easy to react with OH-A violent exothermic chemical reaction occurs, which may cause spontaneous combustion and cause potential safety hazards. The pH value environment after adjustment can reduce the viscosity of sodium silicate water glass in the sewage and prevent the sodium silicate water glass from blocking filter cloth in the filter pressing process; meanwhile, the dispersibility of suspended matters in the sewage is reduced, and the filter pressing efficiency is improved; and potential safety hazards can be avoided. In addition, in the embodiment of this application, still add silicon chip cutting sewage to silicon chip washing sewage to the suspended solid concentration in the sewage has been increased, makes the suspended solid form the filter cake more easily at the filter-pressing in-process, improves filter-pressing efficiency, has also realized simultaneously to the economic material in the silicon chip cutting sewageAnd (5) recovering the silicon powder.
Therefore, in the embodiment of the application, the economic substance silicon powder in the silicon wafer cleaning sewage and the silicon wafer cutting sewage is safely and efficiently recovered, and the benefit is increased; the concentration of suspended matters in the treated sewage is obviously reduced, the subsequent biochemical treatment efficiency is improved, and the generation of sludge which can generate secondary pollution to the environment is basically eliminated.
Detailed Description
Embodiments of the present invention will be described in detail below. The following embodiments are merely used to more clearly illustrate the technical solutions of the present application, and therefore, the following embodiments are only used as examples, and the scope of the present application is not limited thereby. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.
In some embodiments of the present application, a method for treating silicon wafer cleaning wastewater is provided, which comprises the following steps: adding acid liquor into the silicon wafer cleaning sewage, and adjusting the pH value of the silicon wafer cleaning sewage to 4-6; adding silicon wafer cutting sewage into the silicon wafer cleaning sewage, and adjusting the concentration of suspended matters in the silicon wafer cleaning sewage; carrying out filter pressing on the silicon wafer cleaning sewage with the adjusted pH value and suspended matter concentration, and collecting a solid phase obtained by filter pressing; adding alkali liquor into the filtrate obtained by filter pressing, and adjusting the pH value of the filtrate to 7-8; and (4) carrying out biochemical treatment on the filtrate after the pH value is adjusted.
In the above embodiment, the pH of the silicon wafer cleaning wastewater (about 9 to 12) is adjusted to 4 to 6 by using an acid solution. On the one hand, silicon wafer cleaning wastewater containsThe sodium silicate water glass has high viscosity and is easy to block the filter cloth in the filter pressing process; on the other hand, the dispersibility of suspended matters in the silicon wafer cleaning sewage is larger, and the difficulty of filter pressing is also increased; in addition, in the filter pressing process, when the pH value of the sewage is more than 6, the silicon powder contained in the sewage has larger specific surface area and is easy to react with OH-A violent exothermic chemical reaction occurs, which may cause spontaneous combustion and cause potential safety hazards. The pH value environment after adjustment can reduce the viscosity of sodium silicate water glass in the sewage and prevent the sodium silicate water glass from blocking filter cloth in the filter pressing process; meanwhile, the filter pressing device is also beneficial to reducing the dispersibility of suspended matters in sewage, improving the filter pressing efficiency and avoiding potential safety hazards.
In addition, in the embodiment, the silicon wafer cutting sewage is added into the silicon wafer cleaning sewage before filter pressing, so that the concentration of suspended matters in the sewage is increased, a filter cake is easier to form in the filter pressing process, the filter pressing efficiency is improved, and the recovery of economic silicon powder in the silicon wafer cutting sewage is realized.
Therefore, in the embodiment, the recovery of the economic substance silicon powder in the silicon wafer cleaning sewage and the silicon wafer cutting sewage is safely and efficiently realized, and the benefit is increased; the concentration of suspended matters in the treated sewage is obviously reduced, the subsequent biochemical treatment efficiency is improved, and the generation of sludge which can cause secondary pollution to the environment is basically eliminated.
In some embodiments of the present application, in the step of adding an acid solution to the silicon wafer cleaning wastewater, the acid solution is selected from hydrochloric acid or sulfuric acid. The pH value of the silicon wafer cleaning sewage is adjusted by using hydrochloric acid or sulfuric acid, so that impurity ions which can influence biochemical treatment subsequently are prevented from being introduced into the sewage.
In some embodiments of the application, in the step of adding silicon wafer cutting sewage in the silicon wafer cleaning sewage, the suspended matter concentration of the silicon wafer cleaning sewage is adjusted to 1000-3000 mg/L. Generally speaking, the original suspended matter concentration of the silicon wafer cleaning sewage is about 700mg/L, and in the actual industrial process, the suspended matter concentration of the silicon wafer cleaning sewage can be reduced to 300-400 mg/L due to the mixing of clean water in the pipeline. According to the method, the silicon wafer cutting sewage is added, so that the concentration of suspended matters in the silicon wafer cleaning sewage is increased to 1000-3000 mg/L, a filter cake is easier to form in the filter pressing process, the filter pressing efficiency is obviously improved, and the efficient recovery of economic silicon powder in the silicon wafer cutting sewage is realized.
In some embodiments of the present application, the silicon wafer cleaning wastewater comprises silicon powder, impurities and water; the impurities comprise at least one of silicon dioxide, sodium silicate colloid, plastic residue, epoxy resin and polymer formed by amine curing agent.
In some embodiments of the present application, the silicon wafer cutting wastewater added to the silicon wafer cleaning wastewater contains silicon powder, a surfactant and water; the pH value of the silicon wafer cutting sewage is 4-7, the silicon wafer cutting sewage is used for increasing suspended matters in the silicon wafer cleaning sewage, and the influence on the pH value of the silicon wafer cleaning sewage is avoided.
In some embodiments of the present application, a cellulose filter aid is added to the silicon wafer cleaning wastewater after the pH and the suspended matter concentration are adjusted before the pressure filtration step. The cellulose filter aid is added into the sewage before filter pressing, so that the formation of a filter cake in the filter pressing process is facilitated, the rigidity of the filter cake is improved, the filter pressing efficiency is improved, and the turbidity of the filtrate is further reduced.
In some embodiments of the present application, a cellulose filter aid is added to the silicon wafer cleaning wastewater after the pH and suspended matter concentration are adjusted when the turbidity of the filtrate is higher than 100NTU or when the filter pressing efficiency of a single filter press is lower than 12 cubic meters per hour. Wherein NTU is turbidity unit, and suspended matter concentration in sewage is represented by turbidity. The filter pressing efficiency is as follows: and when the filter press performs filter pressing on the silicon wafer cleaning sewage with the pH value and the suspension concentration adjusted, the volume of the sewage subjected to filter pressing is completed by a single filter press every hour. In an embodiment of the present application, the filter press has a filter press area of 150 square meters.
In some embodiments of the present application, the filter cloth used in the filter pressing step is a high-strength polyester material. In some embodiments of the present application, the filter cloth used in the filter pressing step has an air permeability of 4 to 6 (L/m)2S), wherein,the air permeability means: the volume of air passing through a square meter area of fabric per second can be measured using conventional air permeability measuring instruments.
In some embodiments of the present application, in the step of adding a lye to the filtrate obtained by pressure filtration, the lye is selected from the group consisting of sodium hydroxide or potassium hydroxide. The pH value of the filtrate is adjusted by using sodium hydroxide or potassium hydroxide, so that ions which can influence the biochemical treatment subsequently are prevented from being introduced into the filtrate.
In some embodiments of the present application, the biochemical treatment of the filtrate comprises at least one of the following treatment steps: hydrolysis acidification and anaerobic treatment: decomposing the macromolecular organic matters in the filtrate into micromolecular organic matters; aerobic treatment: aerobic microorganisms (including facultative microorganisms) are used for aerobic respiration in an aerobic environment, and micromolecular organic matters in the filtrate are decomposed into inorganic matters; and (3) precipitation treatment: in a radial flow pool, removing suspended matters in the filtrate by using physical precipitation; air floatation treatment: utilizing small bubbles or micro-bubbles generated by an air floatation machine to enable impurities in the filtrate to float out of the water surface, and removing suspended matters and jelly in the filtrate; aeration treatment: and in the aeration biological filter, carrying out aeration treatment on the filtrate to remove one or more of suspended matters, COD (chemical oxygen demand), BOD (biochemical oxygen demand), nitrogen, phosphorus and AOX (absorbable organic halide) in the filtrate.
The advantages of the present application are further illustrated by the following specific examples. It should be understood that these examples are for illustrative purposes only and are not intended to limit the scope of the present application.
Examples 1 to 13
(1) Adding acid liquor into the silicon wafer cleaning sewage, and adjusting the pH value of the silicon wafer cleaning sewage;
(2) adding silicon wafer cutting sewage into the silicon wafer cleaning sewage, and adjusting the concentration of suspended matters in the silicon wafer cleaning sewage;
(3) carrying out filter pressing on the silicon wafer cleaning sewage with the adjusted pH value and suspended matter concentration, and collecting a solid phase obtained by filter pressing;
(4) adding alkali liquor into the filtrate obtained by filter pressing, and adjusting the pH value of the filtrate;
(5) and (4) carrying out biochemical treatment on the filtrate after the pH value is adjusted.
Comparative example 1 differs from example 3 only in that: comparative example 1 neither acid solution nor silicon wafer cutting wastewater was added to the silicon wafer cleaning wastewater before filter pressing. The remaining procedure was the same as in example 3.
Comparative example 2 differs from example 3 only in that: comparative example 2 no acid solution was added to the silicon wafer cleaning wastewater before filter pressing. The remaining procedure was the same as in example 3.
Comparative example 3 differs from example 3 only in that: comparative example 3 silicon wafer cutting wastewater was not added to the silicon wafer cleaning wastewater before filter pressing. The remaining procedure was the same as in example 3.
The following filter pressing effect tests were performed on examples 1 to 13 and comparative examples 1 to 3.
And (3) detecting the turbidity of the filtrate:
the turbidity of the filtrate is detected by a spectrophotometer of a conventional instrument used in the field experiment, and the detection method is a spectrophotometry method used in the field in a conventional way: polymerizing hexamethylenetetramine and hydrazine sulfate to form water-insoluble macromolecular salt suspension which is used as a turbidity standard solution and is compared with the turbidity of a water sample to be detected to obtain the turbidity of the water sample to be detected.
And (3) detecting the filter pressing efficiency:
the filter pressing efficiency is as follows: and when the filter press with the filter press area of 150 square meters is used for carrying out filter pressing on the silicon wafer cleaning sewage with the pH value and the suspension concentration adjusted, the volume of the sewage for filter pressing is finished by a single filter press per hour.
The relevant process parameters and the filter pressing effect detection data of the examples 1 to 13 and the comparative examples 1 to 3 are shown in the table 1.
TABLE 1
As can be seen from the effect detection data of each example and comparative example in table 1, compared with comparative examples 1 to 3, examples 1 to 13 not only adjust the pH of the silicon wafer cleaning wastewater to 4 to 6 with an acid solution before the filter pressing step, but also add the silicon wafer cutting wastewater into the silicon wafer cleaning wastewater, and perform the filter pressing step after adjusting the pH and the suspended matter concentration of the silicon wafer cleaning wastewater, thereby significantly improving the filter pressing efficiency, reducing the turbidity of the filtrate, and simultaneously achieving the recovery of silicon powder in the silicon wafer cleaning wastewater and the silicon wafer cutting wastewater.
Comparative example 1 before filter pressing, neither acid solution nor silicon wafer cutting wastewater was added to the silicon wafer cleaning wastewater to adjust the pH value, nor the silicon wafer cutting wastewater was added to adjust the concentration of suspended matters, and sodium silicate water glass in the silicon wafer cleaning wastewater had a large viscosity, which easily caused clogging of filter cloth in the filter pressing process; the dispersibility of suspended matters in the silicon wafer cleaning sewage is large, a filter cake is not easy to form, potential safety hazards exist, and the filter pressing step cannot be implemented. Comparative example 2 although the silicon wafer cutting wastewater was added to the silicon wafer cleaning wastewater before the filter pressing, the concentration of suspended matter in the silicon wafer cleaning wastewater was increased, but the pH of the silicon wafer cleaning wastewater was not adjusted, so comparative example 2 still did not solve the problems of the filter cloth blockage during the filter pressing process and the high dispersibility of suspended matter in the silicon wafer cleaning wastewater due to the high viscosity of sodium silicate water glass, the filter pressing efficiency was extremely low, part of the wastewater directly passed through the filter cloth, and the turbidity of the filtrate was very high. Comparative example 3 although the pH of the silicon wafer cleaning wastewater was adjusted by using the acid solution, the silicon wafer cutting wastewater was not added to the silicon wafer cleaning wastewater before the filter pressing, the concentration of suspended matter in the silicon wafer cleaning wastewater was low, a filter cake was not easily formed during the filter pressing, and the problem of extremely low filter pressing efficiency still existed in comparative example 3.
Therefore, compared with a comparative example, the embodiment of the application can obtain remarkable beneficial effects, realizes the recovery of economic substance silicon powder in the silicon wafer cleaning sewage and the silicon wafer cutting sewage by high-efficiency filter pressing operation, and increases benefits; the concentration of suspended matters in the treated sewage is obviously reduced, and the subsequent biochemical treatment efficiency is improved.
In addition, the embodiment 1 to the embodiment 5 also show the influence of the adjustment range of the concentration of suspended matters in the silicon wafer cleaning sewage on the turbidity of the filtrate and the filter pressing efficiency in the step of adding the silicon wafer cutting sewage into the silicon wafer cleaning sewage. Through the addition of silicon wafer cutting sewage, the suspended matter concentration of silicon wafer cleaning sewage is adjusted to 1000-3000 mg/L, so that a filter cake is easier to form in the filter pressing process, and the filter pressing efficiency is improved.
Examples 3 and 6 show the effect of using cellulose filter aids on the filter pressing effect. The cellulose filter aid is added into the sewage before filter pressing, so that the formation of a filter cake in the filter pressing process is facilitated, the rigidity of the filter cake is improved, the filter pressing efficiency is improved, and the turbidity of the filtrate is further reduced.
Examples 7 to 10 show the influence of the air permeability of the filter cloth used in the filter pressing step on the filter pressing effect. When the air permeability of the filter cloth used in the filter pressing step is 4-6 (L/m)2S), the permeability of the filter cloth is more suitable, the filtrate has lower turbidity and the filter pressing efficiency is also higher.
Examples 11 to 13 show examples in which sulfuric acid is used instead of hydrochloric acid to adjust the pH of silicon wafer cleaning wastewater or potassium hydroxide is used instead of sodium hydroxide to adjust the pH of filtrate, and these examples can also achieve recovery of silicon powder in silicon wafer cleaning wastewater and silicon wafer cutting wastewater with high filter-pressing efficiency, and simultaneously significantly reduce the concentration of suspended matters in the treated wastewater, which is beneficial to subsequent biochemical treatment.
Variations and modifications to the above-described embodiments may occur to those skilled in the art based upon the disclosure and teachings of the above specification. Therefore, the present application is not limited to the specific embodiments disclosed and described above, and some modifications and variations of the present application should fall within the scope of the claims of the present application. In addition, although specific terms are used herein, they are used in a descriptive sense only and not for purposes of limitation.
Claims (10)
1. A method for treating silicon wafer cleaning sewage is characterized by comprising the following steps:
adding acid liquor into the silicon wafer cleaning sewage, and adjusting the pH value of the silicon wafer cleaning sewage to 4-6;
adding silicon wafer cutting sewage into the silicon wafer cleaning sewage, and adjusting the concentration of suspended matters in the silicon wafer cleaning sewage;
carrying out filter pressing on the silicon wafer cleaning sewage with the adjusted pH value and suspended matter concentration, and collecting a solid phase obtained by filter pressing;
adding alkali liquor into the filtrate obtained by filter pressing, and adjusting the pH value of the filtrate to 7-8;
and (4) carrying out biochemical treatment on the filtrate after the pH value is adjusted.
2. The method for treating silicon wafer cleaning wastewater according to claim 1, wherein in the step of adding an acid solution to the silicon wafer cleaning wastewater, the acid solution is selected from hydrochloric acid or sulfuric acid.
3. The method for treating silicon wafer cleaning wastewater according to claim 1, wherein in the step of adding silicon wafer cutting wastewater to the silicon wafer cleaning wastewater, the concentration of suspended matter in the silicon wafer cleaning wastewater is adjusted to 1000 to 3000 mg/L.
4. The method for treating silicon wafer cleaning wastewater according to claim 1,
the silicon wafer cleaning wastewater comprises silicon powder, impurities and water; the impurities comprise at least one of silicon dioxide, sodium silicate colloid, plastic residue, epoxy resin and polymer formed by amine curing agent;
the silicon wafer cutting sewage added into the silicon wafer cleaning sewage comprises silicon powder, a surfactant and water; the pH value of the silicon wafer cutting sewage is 4-7.
5. The method for treating silicon wafer cleaning wastewater according to claim 1, wherein a cellulose filter aid is added to the silicon wafer cleaning wastewater after the pH and the suspended matter concentration have been adjusted, before the pressure filtration step.
6. The method for treating silicon wafer cleaning wastewater according to claim 5, wherein a cellulose filter aid is added to the silicon wafer cleaning wastewater after the pH value and the suspended matter concentration are adjusted when the turbidity of the filtrate is higher than 100NTU or the filter pressing efficiency of a single filter press is lower than 12 cubic meters per hour.
7. The method for treating silicon wafer cleaning wastewater according to claim 1, wherein the filter cloth used in the pressure filtration step is a high-strength polyester material.
8. The method for treating silicon wafer cleaning wastewater according to claim 1, wherein the air permeability of the filter cloth used in the filter pressing step is 4 to 6L/m2·s。
9. The method for treating silicon wafer cleaning wastewater according to claim 1, wherein in the step of adding an alkali solution to the filtrate obtained by the pressure filtration, the alkali solution is selected from sodium hydroxide or potassium hydroxide.
10. The method for treating silicon wafer cleaning wastewater according to any one of claims 1 to 9, wherein the biochemical treatment comprises at least one of the following steps:
hydrolysis acidification and anaerobic treatment: decomposing the macromolecular organic matters in the filtrate into micromolecular organic matters;
aerobic treatment: decomposing the micromolecular organic matters in the filtrate into inorganic matters by using aerobic microorganisms;
and (3) precipitation treatment: removing suspended matters in the filtrate by using physical precipitation;
air floatation treatment: floating impurities in the filtrate out of the water surface by using an air floatation machine, and removing suspended matters and jelly in the filtrate;
aeration treatment: and carrying out aeration treatment on the filtrate to remove at least one of suspended matters, chemical oxygen demand, biochemical oxygen demand, nitrogen, phosphorus and absorbable organic halide in the filtrate.
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