CN113618508A - Outer circle grinding process of wafer cutting blade - Google Patents
Outer circle grinding process of wafer cutting blade Download PDFInfo
- Publication number
- CN113618508A CN113618508A CN202111184542.5A CN202111184542A CN113618508A CN 113618508 A CN113618508 A CN 113618508A CN 202111184542 A CN202111184542 A CN 202111184542A CN 113618508 A CN113618508 A CN 113618508A
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- CN
- China
- Prior art keywords
- grinding
- tool
- annular
- outer circle
- chassis
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B3/00—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools
- B24B3/36—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools of cutting blades
- B24B3/363—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools of cutting blades of blades mounted on a turning drum
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
- B24B41/067—Work supports, e.g. adjustable steadies radially supporting workpieces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/20—Drives or gearings; Equipment therefor relating to feed movement
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Abstract
The invention discloses an outer circle grinding process of a wafer cutting blade, which specifically comprises the following steps: a plurality of annular blades are concentrically arranged on a grinding tool, and a protection block is separated between every two adjacent annular blades; the grinding tool is rotatably installed on the machine tool, when the grinding tool is installed, the machining center line of the machine tool is overlapped with the center line of the grinding tool, the rotating grinding tool is close to the rotating grinding wheel, the rotating direction of the grinding wheel is opposite to that of the grinding tool, the grinding wheel grinds the edge of the annular blade, in the step S3, the industrial camera is adopted to find the defect of the end face of the annular blade at any time, and the feeding amount and the grinding position of the grinding wheel are controlled according to the defect of the annular blade, so that the accuracy of the grinding position of the annular blade by the grinding wheel is improved.
Description
The technical field is as follows:
the invention relates to the technical field of production of wafer cutting blades, in particular to an outer circle grinding process of a wafer cutting blade.
Background art:
wafer scribing is an indispensable process in the semiconductor chip manufacturing process, belongs to a subsequent process in the wafer manufacturing process, and the working principle of the wafer scribing is to divide a positive wafer with chips into single chips according to the size of the chips, so that a wafer cutting blade is generally adopted for cutting in the process, and the sharpness of the wafer cutting blade is particularly important.
At present, when a wafer is processed, a wafer cutting blade is mainly adopted to process and cut the wafer, the production flow of the wafer cutting blade generally needs to carry out the steps of pretreatment, composite deposition, semi-finished product detection, excircle grinding and the like, wherein, the excircle grinding is carried out aiming at the edge of an annular blade, the process is directly related to the sharpness of the final forming of the wafer cutting blade, in the grinding process, a grinding wheel is generally adopted to directly act on the edge of the annular blade to completely grind the edge of the annular blade, however, in the actual grinding process, the grinding of the grinding wheel easily causes the stress damage inside the edge of the annular blade, the edge of the annular blade becomes very fragile, the phenomenon of edge fracture often occurs in the subsequent wafer cutting process, and the grinding position of the grinding wheel on the annular blade is very important, he is directly related to the yield and sharpness of the final formed blade.
The invention content is as follows:
an object of the present invention is to provide a process for grinding an outer circumference of a wafer cutting blade, which solves one or more of the above-mentioned problems of the prior art.
In order to solve the technical problems, the innovation points of the invention are as follows: the method specifically comprises the following steps:
s1, concentrically mounting a plurality of annular blades on a grinding tool, and separating a protection block between every two adjacent annular blades;
s2, rotatably installing the polishing tool on the machine tool, wherein the machining center line of the machine tool and the center line of the polishing tool coincide;
s3, enabling the rotating grinding tool to be close to the rotating grinding wheel, wherein the rotating direction of the grinding wheel is opposite to that of the grinding tool, and the grinding wheel is used for grinding the edge of the annular blade;
in step S3, the industrial camera is used to detect the defect of the end face of the annular blade at any time, and the feeding amount and the grinding position of the grinding wheel are controlled according to the defect of the annular blade.
Further, above-mentioned frock of polishing includes two chassis and boom, and the chassis is circularly, and it is protruding that the chassis wherein one side is equipped with the terminal surface, and the other one side in chassis is equipped with fixed screw hole, and fixed screw hole and the protruding integrated into one piece of terminal surface put at the central point on chassis, and the both ends of boom all are equipped with the stiff end, and stiff end threaded connection is in the inside of fixed screw hole.
Furthermore, the center position of the end face bulge is provided with a thimble hole, and the polishing tool is clamped on a machining station of a machine tool through the thimble hole.
Further, the excircle on above-mentioned chassis is overlapped and is equipped with the excircle gear, and the bottom of lathe is equipped with the fixing base, is equipped with the triangular supports frame on the fixing base, and the top of triangular supports frame is equipped with rotatable stabilizing gear, and stabilizing gear and excircle gear engagement are connected.
Furthermore, the surface of the protective block is covered with a soft cushion.
Further, in step S3, the grinding wheel preferentially grinds the end face of the ring blade, and finally grinds the side face of the edge of the ring blade.
The invention has the beneficial effects that:
1. the invention provides an excircle grinding process of a wafer cutting blade, which is characterized in that the center lines of a plurality of annular blades are coincided with the processing center line of a machine tool through a grinding tool, so that grinding of a grinding wheel on all the annular blades on the grinding tool is kept consistent, and then the rotating direction of the grinding wheel is opposite to that of the grinding tool, so that the friction force of a contact surface between the grinding wheel and the annular blades is increased, the grinding effect of the grinding wheel on the annular blades is further improved, in the grinding process of the grinding wheel on the annular blades, the defects on the end surfaces of the annular blades are monitored at any time through an industrial camera, and the accuracy of the grinding position of the grinding wheel on the annular blades is improved.
2. The invention provides an outer circle grinding process of a wafer cutting blade, wherein in the rotating process of a grinding tool, a chassis rotates to enable an outer circle gear and a stabilizing gear to rotate mutually, the rotating stability of the chassis is improved through the supporting effect of a triangular supporting frame on the stabilizing gear, the rotating stability of the grinding tool is further improved, the stability improves the accuracy of the industrial camera for capturing the defect position of an annular blade, and the grinding accuracy of the annular blade is further improved.
3. The invention provides an outer circle grinding process of a wafer cutting blade, which improves the grinding sharpness of the upper end part of an annular blade by reasonably arranging the grinding positions on the annular blade in the grinding process of the annular blade.
Description of the drawings:
fig. 1 is a side view of the grinding wheel of the present invention grinding on a ring blade.
FIG. 2 is a side view of the stabilizing gear and cylindrical gear connection of the present invention.
The specific implementation mode is as follows:
for the purpose of enhancing the understanding of the present invention, the present invention will be further described in detail with reference to the following examples and the accompanying drawings, which are only used for explaining the present invention and are not to be construed as limiting the scope of the present invention.
Fig. 1 to fig. 2 show an embodiment of the present invention, which specifically includes the following steps:
s1, concentrically installing a plurality of annular blades 1 on a polishing tool 2, and separating a protection block 3 between every two adjacent annular blades 1;
s2, rotatably installing the grinding tool 2 on the machine tool 101, wherein during installation, the machining center line of the machine tool 101 is superposed with the center line of the grinding tool 2;
s3, enabling the rotating grinding tool 2 to be close to the rotating grinding wheel 6, enabling the rotating direction of the grinding wheel 6 to be opposite to that of the grinding tool 2, and grinding the edge of the annular blade 1 by the grinding wheel 6;
in step S3, the industrial camera is used to detect the defect of the end face of the ring blade 1 at any time, and the feeding amount and the grinding position of the grinding wheel 6 are controlled according to the defect of the ring blade 1.
According to the invention, the center lines of the plurality of annular blades 1 are coincided with the machining center line of the machine tool 101 through the grinding tool 2, so that grinding of the grinding wheel 6 on all the annular blades 1 on the grinding tool 2 is kept consistent, and then, the rotating direction of the grinding wheel 6 is opposite to that of the grinding tool 2, so that the friction force of the contact surface between the grinding wheel 6 and the annular blades 1 is increased, further, the grinding effect of the grinding wheel 6 on the annular blades 1 is improved, in the grinding process of the grinding wheel 6 on the annular blades 1, the defects on the end surfaces of the annular blades 1 are monitored at any time through an industrial camera, and the accuracy of the grinding position of the grinding wheel 6 on the annular blades 1 is improved.
In the present invention, as a preferred scheme, the polishing tool 2 includes two chassis 21 and a string rod 22, the chassis 21 is circular, one surface of the chassis 21 is provided with an end surface protrusion 211, the other surface of the chassis 21 is provided with a fixing threaded hole 212, the fixing threaded hole 212 and the end surface protrusion 211 are integrally formed at a central position of the chassis 21, both ends of the string rod 22 are provided with fixing ends 221, and the fixing ends 221 are in threaded connection with the inside of the fixing threaded hole 212.
In the present invention, preferably, the center of the end surface protrusion 211 is provided with an ejector pin hole 102, and the grinding tool 2 is clamped to a processing station of the machine tool 101 through the ejector pin hole 102.
In the invention, the use principle of the grinding tool 2 is as follows: the center position of the annular blade 1 and the center position of the protection block 3 are sleeved on the string rod 22 at intervals, finally, the annular blade 1 and the protection block 3 are clamped and fixed on the string rod 22 by utilizing the two base plates 21, at the moment, the center line of the annular blade 1 and the center line of the grinding tool 2 coincide with each other, and finally, the thimble hole 102 is clamped on a machining station of the machine tool 101, so that the thimble hole 102 coincides with the machining center line of the machine tool 101 and the thimble hole 102, and further the center line of the annular blade 1 coincides with the machining center line of the machine tool 101.
In the present invention, as a preferable scheme, an outer circular gear 4 is sleeved on an outer circle of the chassis 21, a fixed seat 5 is arranged at the bottom of the machine tool 101, a triangular support frame 51 is arranged on the fixed seat 5, a rotatable stabilizing gear 52 is arranged at the top of the triangular support frame 51, and the stabilizing gear 52 is meshed with the outer circular gear 4.
In the invention, in the rotating process of the grinding tool 2, the outer circle gear 4 and the stabilizing gear 52 rotate mutually due to the rotation of the chassis 21, the rotating stability of the chassis 21 is improved through the supporting effect of the triangular support frame on the stabilizing gear 52, and further the rotating stability of the grinding tool 2 is improved, and the stability improves the accuracy of the industrial camera in capturing the defect position of the annular blade 1, so that the grinding accuracy of the annular blade 1 is further improved.
In the present invention, preferably, the surface of the protection block 3 is covered with a soft pad, and the soft pad plays a role of protecting the annular blade 1.
In the present invention, it is preferable that the grinding wheel 6 grind the end face of the ring blade 1 preferentially and finally grind the side face of the edge of the ring blade 1 in step S3.
In the invention, in the grinding process of the annular blade 1, the grinding sequence of the grinding positions on the annular blade 1 is reasonably arranged, so that the grinding sharpness of the upper end part of the annular blade 1 is improved.
It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (6)
1. The outer circle grinding process of the wafer cutting blade is characterized by comprising the following steps of: the method specifically comprises the following steps:
s1, concentrically installing a plurality of annular blades (1) on a grinding tool (2), and separating a protection block (3) between every two adjacent annular blades (1);
s2, rotatably installing the grinding tool (2) on a machine tool (101), wherein the machining center line of the machine tool (101) is superposed with the center line of the grinding tool (2) during installation;
s3, enabling the rotating grinding tool (2) to be close to the rotating grinding wheel (6), wherein the rotating direction of the grinding wheel (6) is opposite to that of the grinding tool (2), and the grinding wheel (6) grinds the edge of the annular blade (1);
in the step S3, an industrial camera is used to find the defect of the end face of the annular blade (1) at any time, and the feeding amount and the grinding position of the grinding wheel (6) are controlled according to the defect of the annular blade (1).
2. The outer circle grinding process for a wafer cutting blade according to claim 1, wherein: frock of polishing (2) includes two chassis (21) and boom (22), chassis (21) are circularly, chassis (21) wherein one side is equipped with terminal surface arch (211), chassis (21) simultaneously is equipped with fixing thread hole (212) in addition, fixing thread hole (212) terminal surface arch (211) integrated into one piece is in the central point of chassis (21) puts, the both ends of boom (22) all are equipped with stiff end (221), stiff end (221) threaded connection is in the inside of fixing thread hole (212).
3. The outer circle grinding process for a wafer cutting blade according to claim 2, wherein: the center position of the end face bulge (211) is provided with a thimble hole (102), and the grinding tool (2) is clamped on a machining station of the machine tool (101) through the thimble hole (102).
4. The outer circle grinding process for a wafer cutting blade according to claim 3, wherein: the cover is equipped with excircle gear (4) on the excircle of chassis (21), the bottom of lathe (101) is equipped with fixing base (5), be equipped with triangular supports frame (51) on fixing base (5), the top of triangular supports frame (51) is equipped with rotatable stabilizing gear (52), stabilizing gear (52) with excircle gear (4) meshing is connected.
5. The outer circle grinding process for a wafer cutting blade according to claim 1, wherein: the surface of the protection block (3) is covered with a soft cushion.
6. The outer circle grinding process for a wafer cutting blade according to claim 1, wherein: in the step S3, the grinding wheel (6) preferentially grinds the end face of the ring blade (1), and finally grinds the side face of the edge of the ring blade (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111184542.5A CN113618508B (en) | 2021-10-12 | 2021-10-12 | Outer circle grinding process of wafer cutting blade |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111184542.5A CN113618508B (en) | 2021-10-12 | 2021-10-12 | Outer circle grinding process of wafer cutting blade |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113618508A true CN113618508A (en) | 2021-11-09 |
| CN113618508B CN113618508B (en) | 2021-12-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111184542.5A Active CN113618508B (en) | 2021-10-12 | 2021-10-12 | Outer circle grinding process of wafer cutting blade |
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| Country | Link |
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| CN (1) | CN113618508B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104684685A (en) * | 2012-10-17 | 2015-06-03 | 三菱重工业株式会社 | Dressing device and gear grinding device |
| CN105479277A (en) * | 2015-11-25 | 2016-04-13 | 安徽楚江科技新材料股份有限公司 | Grinding method for circle cutter |
| CN113070745A (en) * | 2021-03-31 | 2021-07-06 | 成都工具研究所有限公司 | Numerical control machining machine tool for side edge of blade and machining process of numerical control machine tool |
-
2021
- 2021-10-12 CN CN202111184542.5A patent/CN113618508B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104684685A (en) * | 2012-10-17 | 2015-06-03 | 三菱重工业株式会社 | Dressing device and gear grinding device |
| CN105479277A (en) * | 2015-11-25 | 2016-04-13 | 安徽楚江科技新材料股份有限公司 | Grinding method for circle cutter |
| CN113070745A (en) * | 2021-03-31 | 2021-07-06 | 成都工具研究所有限公司 | Numerical control machining machine tool for side edge of blade and machining process of numerical control machine tool |
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| Publication number | Publication date |
|---|---|
| CN113618508B (en) | 2021-12-28 |
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