CN113600881A - Method for inhibiting fracture damage of ultra-precision milling surface of carbide ceramic microstructure - Google Patents
Method for inhibiting fracture damage of ultra-precision milling surface of carbide ceramic microstructure Download PDFInfo
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Abstract
The invention discloses a method for inhibiting the fracture damage of a super-precision milling surface of a carbide ceramic microstructure, which relates to the technical field of carbide processing and comprises the following steps: firstly, obtaining mechanical characteristic parameters of the carbide ceramic material; secondly, obtaining the brittle-plastic transition critical cutting depth of the carbide ceramic material; thirdly, calculating the fracture length of the carbide ceramic material; fourthly, calculating the change relation of the chip thickness along with the turning angle of the cutter according to the technological parameters of the ultra-precision milling; fifthly, judging whether the carbide ceramic material is cracked or not through the brittle-plastic transition critical cutting depth and the chip thickness, and further obtaining a cracked cutter corner at the cracked position; sixthly, solving the distance from the cracked part to the processing bottom surface of the workpiece; and seventhly, comparing the distance from the cracked part to the machined bottom surface of the workpiece with the relative size of the cracked length, and judging whether the cracked crack penetrates into the machined bottom surface of the workpiece. The invention improves the precision of processing the microstructure surface.
Description
Technical Field
The invention relates to the technical field of carbide processing, in particular to a method for inhibiting fracture damage of an ultraprecise milling surface of a carbide ceramic microstructure.
Background
Carbide hard brittle materials including silicon carbide, carbides and the like have extremely low fracture toughness, and the plastic cutting depth is usually less than 100 nanometers, so that surface chipping is extremely likely to occur in machining. At present, methods such as ion implantation surface modification, laser-assisted machining and the like are generally adopted to inhibit surface fragmentation in the processing of carbide ceramic microstructures. The ion implantation surface modification is to inject inert gas ions into the surface of the carbide material to change the structure of the crystal lattice on the surface layer of the material and realize non-crystallization, thereby increasing the cutting depth of the plastic domain of the hard and brittle material and avoiding the fragmentation and damage in the processing process. The laser-assisted cutting technology mainly takes a high-energy laser beam as a heat source, the surface temperature of a material is raised in a direct heating mode, the cutting performance of the material is changed when the surface temperature of the material is higher, a corresponding cutter is used for removing the material, and the cutting mechanism is plastic deformation instead of brittle failure.
At present, methods such as ion implantation surface modification, laser-assisted machining and the like are generally adopted to inhibit surface fragmentation in the processing of carbide ceramic microstructures. These methods can effectively inhibit surface chipping in the processing of carbide ceramic microstructures to some extent, but have problems, for example, the depth of the ion-implanted surface modification layer is usually less than a few micrometers, which is only suitable for processing microstructures with small cutting depth, and the surface modification requires expensive equipment and has extremely low efficiency, which increases the processing cost of the microstructures; in laser-assisted machining, a laser beam heats a material, the surface temperature of the material is high, cutter abrasion is aggravated, and the thermal deformation of the surface of a workpiece can cause the precision of a machined microstructure to be reduced. In addition, the carbide ceramic microstructure processed by the method has high cost and low efficiency, and the effect of inhibiting the surface fragmentation in the processing of the carbide ceramic microstructure is not obvious in a complex processing environment.
The carbide ceramics comprise materials such as silicon carbide, tungsten carbide and the like, and the microstructure surface of the materials has unique semiconductor characteristics and optical characteristics and is a core element of a key element of modern optical and optoelectronic systems. The ultra-precision milling technology can process a micro-structure with submicron-level surface precision on the surface of a workpiece by using a rotary cutter. However, since carbide ceramic materials are hard brittle hard-to-machine materials with very low fracture toughness, their brittle-to-plastic transition critical cut depth is only about 100 nm. The processing depth of the microstructure is generally several micrometers to several tens of micrometers. Therefore, when the ultra-precision milling technology is used for processing the carbide ceramic microstructure, the processing surface is easy to crack and damage, and the processing precision and the surface quality of the monocrystalline silicon microstructure component are influenced.
Disclosure of Invention
The invention aims to provide a method for inhibiting the fracture damage of the ultraprecise milling surface of a carbide ceramic microstructure, which aims to solve the problems in the prior art and improve the precision of the surface type of the machined microstructure by effectively inhibiting the fracture of the machined surface of the carbide ceramic microstructure in ultraprecise milling.
In order to achieve the purpose, the invention provides the following scheme:
the invention provides a method for inhibiting the fracture damage of an ultraprecise milling surface of a carbide ceramic microstructure, which comprises the following steps of:
firstly, obtaining mechanical characteristic parameters of the carbide ceramic material;
secondly, obtaining the brittle-plastic transition critical cutting depth of the carbide ceramic material;
thirdly, calculating the fracture length of the carbide ceramic material;
fourthly, calculating the change relation of the chip thickness along with the turning angle of the cutter according to the technological parameters of the ultra-precision milling;
fifthly, judging whether the carbide ceramic material is cracked or not through the brittle-plastic transition critical cutting depth and the chip thickness, and further obtaining a cracked cutter corner at the cracked position;
sixthly, solving the distance from the cracked part to the processing bottom surface of the workpiece;
comparing the distance from the cracked part to the processing bottom surface of the workpiece with the relative size of the cracked length, judging whether the cracked crack permeates the processing bottom surface of the workpiece, and if the cracked crack permeates the processing bottom surface of the workpiece, reselecting technological parameters of ultra-precision milling; and if the cracked cracks do not penetrate into the machined bottom surface of the workpiece, using the technological parameters of the ultra-precision milling machining in the step four.
Preferably, in the first step, indentation experiments are performed on the carbide ceramic material by using tools with different tip arc radii, so as to obtain mechanical characteristic parameters of the carbide ceramic material, and obtain a first corresponding relation between the mechanical characteristic parameters of the carbide ceramic material and the tip arc radii.
Preferably, the first corresponding relation is that the larger the radius of the arc of the tip is, the larger both the hardness of the carbide ceramic material and the elastic modulus of the carbide ceramic material are.
Preferably, in the second step, a scribing experiment is performed on the carbide ceramic material by using tools with different tool rake angles and tool nose arc radii, the size of the brittle-plastic transition critical cutting depth is observed, a prediction model of the brittle-plastic transition critical cutting depth of the carbide ceramic material is further constructed, and a second corresponding relationship between the brittle-plastic transition critical cutting depth of the carbide ceramic material and the tool nose arc radii is obtained.
Preferably, the second corresponding relation is that the larger the arc radius of the tool tip is, the larger the brittle-plastic transition critical cutting depth of the carbide ceramic material is.
Preferably, in the third step, according to the first corresponding relationship, the hardness of the carbide ceramic material under different nose arc radii is obtained, and the obtained mechanical property parameter of the carbide ceramic material is substituted into a fracture length prediction model to obtain a third corresponding relationship between the fracture length of the carbide ceramic material and the tool parameter, where the fracture length prediction model is as follows:
wherein c is the fragmentation length; mu.s0Is a geometric constant based on the radius of the circular arc of the tool nose; kc is the fracture toughness of the carbide ceramic material; h is the hardness of the carbide ceramic material; g is the shearing amount of the carbide ceramic material; e is the elastic modulus of the carbide ceramic material; a is0Is a constant; v is the poisson's ratio of the carbide ceramic material.
Preferably, in the fourth step, an ultra-precision milling plastic processing model is established according to the configuration structure of the ultra-precision milling system, and the ultra-precision milling plastic processing model is as follows:
and further obtaining a fourth corresponding relation between the technological parameters of the ultra-precision milling and the thickness of the chip, wherein the fourth corresponding relation is as follows:
in the formula, theta is a tool rotation angle; h isθThe thickness of the cutting chip when the cutter rotates at any angle; swIs the turning radius of the cutter; doIs the cutting depth; f. ofeThe tool feed speed; x is the number of1The current cutting abscissa set of the cutter in the feeding direction; z is a radical of1The current cutting ordinate set of the cutter in the feeding direction; x is the number of0Cutting a set of abscissa coordinates for the previous step of the cutter in the feeding direction; z is a radical of0Is the current cutting ordinate set of the tool in the feeding direction.
Preferably, in the fifth step, when the chip thickness h is smallerθReach the brittle-plastic transition critical cutting depth h of the carbide ceramic material_cWhen the ceramic carbide material is broken; establishment of h_c＝hθCalculating a value of a chip-on tool corner theta, defined as the chip-on tool corner theta at the chip_c。
Preferably, in the sixth step, the distance formula from the machined bottom surface to the machined surface of the workpiece is as follows:
in the formula, HθIs the distance from the machined bottom surface to the machined surface;
the angle theta of the cutting tool at the position to be cut_cReplacing theta, H in the above formulaθ_cSubstituting H in the above formulaθSolving the distance H from the broken part to the bottom surface of the workpieceθ_c。
Preferably, in the seventh step, the distance from the fracture to the machined bottom surface is compared with the fracture length, and if the distance from the fracture to the machined bottom surface is greater than the fracture length, a fracture crack is generated in the machining and does not penetrate into the machined bottom surface of the workpiece; if the distance from the fracture to the machined bottom surface is less than the fracture length, the fracture crack generated in the machining already penetrates into the machined bottom surface of the workpiece.
Compared with the prior art, the invention has the following technical effects:
1. the brittle-plastic conversion process of the carbide ceramic material is researched by utilizing cutters with different cutter rake angles and cutter point arc radiuses, a carbide ceramic brittle-plastic conversion critical cutting depth prediction model is constructed, and the relationship between the carbide ceramic brittle-plastic conversion critical cutting depth and the cutter parameters is established. Meanwhile, a carbide ceramic fragmentation length prediction model is established, and the corresponding relation between the carbide ceramic fragmentation length and the cutter parameters is obtained.
2. According to the geometric characteristics of the processed microstructure, including the geometric shape and the depth of the microstructure cross section, a proper cutter is selected, namely the geometric shape of the cutting edge of the cutter is required to be the same as the geometric shape of the microstructure cross section, and the cutting depth in milling is determined.
3. Establishing an ultra-precision milling plastic processing model according to the selected ultra-precision milling process parameters, establishing a corresponding relation between the process parameters and the carbide fragmentation point positions, establishing a surface quality prediction model, and predicting whether the processed surface is fragmented. If cracked, the process parameters are reconfigured to inhibit surface cracking, and if not, the process parameters can be used for machining.
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In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
FIG. 1 is a schematic diagram of ultra-precision milling;
FIG. 2 is a view of a micro-groove for ultra-precision milling under an optical microscope;
FIG. 3 is a schematic diagram of a nanoindentation experiment;
FIG. 4 is a graph showing the variation trend of the hardness of the material in different arc radiuses of the tool nose;
FIG. 5 is a graph showing the variation trend of the elastic modulus in different arc radiuses of the nose;
FIG. 6 is a schematic view of a tool scoring experiment;
in FIG. 7, the graph (a) is the graph of the brittle-plastic transition boundary of the microgrooves under an optical microscope, and the graph (b) is the graph of the brittle-plastic transition critical cutting depth;
FIG. 8 is a graph showing the relationship between the radius of the circular arc of the nose and the critical cutting depth for brittle-plastic transformation;
FIG. 9 is a schematic view of an ultra-precision milling plastic working model;
FIG. 10 is a flow chart of a method for suppressing the fracture damage of the ultra-precision milling surface of the carbide ceramic microstructure;
wherein: 1-workpiece, 2-spindle, 3-microgroove, 4-tool bit, 5-tool residual trace, 6-indenter, 7-carbide ceramic material sample, 8-chip, 9-tool, 10-cutting path.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without inventive effort based on the embodiments of the present invention, are within the scope of the present invention.
The invention aims to provide a method for inhibiting the fracture damage of the ultraprecise milling surface of a carbide ceramic microstructure, which aims to solve the problems in the prior art and improve the precision of the surface type of the machined microstructure by effectively inhibiting the fracture of the machined surface of the carbide ceramic microstructure in ultraprecise milling.
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in further detail below.
As shown in fig. 1-10: the embodiment provides a method for inhibiting the fracture damage of the ultra-precision milling surface of a carbide ceramic microstructure, wherein in the drawing, X is a feeding direction, Y is a stepping direction, and Z is a cutting depth direction, and the embodiment takes the ultra-precision milling for processing a micro-groove 3 (shown in fig. 2) with a circular arc-shaped cross section on silicon carbide as an example, and comprises the following steps:
firstly, obtaining mechanical characteristic parameters of the carbide ceramic material;
specifically, in the first step of this embodiment, as shown in fig. 3, a tool 9 with different tip arc radii is used to perform an indentation experiment on the carbide ceramic material, and the indentation experiment obtains mechanical characteristic parameters of the carbide ceramic material through load-displacement data when the indenter 6 is pressed into the material, where the mechanical characteristic parameters of the carbide ceramic material include hardness, elastic modulus, yield stress, fracture toughness, shear volume, and poisson's ratio, and due to a size effect, the micro-hardness of the material under micro-nano deformation is different under the action of the tip arc radii with different sizes. And obtaining a first corresponding relation between the mechanical characteristic parameters of the carbide ceramic material and the circular arc radius of the tool nose through an indentation experiment.
In the present embodiment, as shown in fig. 4 to 5, the first correlation is that the larger the radius of the circular arc of the tip, the larger both the hardness of the carbide ceramic material and the elastic modulus of the carbide ceramic material.
Secondly, obtaining the brittle-plastic transition critical cutting depth of the carbide ceramic material;
specifically, in the second step of the present embodiment, as shown in fig. 6, a scribing experiment is performed on the carbide ceramic material by using tools 9 with different tool rake angles and tool nose arc radii, wherein the inclination angle of the scribing groove is 0.1 degree, so that the cutting depth d of the scribing is achieved0And (3) observing the size of the brittle-plastic transition critical cutting depth by adopting a white light interferometer along with the increase of the scribing distance, and further constructing a prediction model of the brittle-plastic transition critical cutting depth of the carbide ceramic material, as shown in FIG. 7, and obtaining a second corresponding relation between the brittle-plastic transition critical cutting depth of the carbide ceramic material and the arc radius of the tool nose.
In fig. 7, the graph (a) is a diagram of the brittle-plastic transition boundary of the micro-groove under an optical microscope, and the critical cutting depth of the brittle-plastic transition under the current cutting condition can be detected by observing the smoothness degree of the cross-sectional morphology of the micro-groove. The abscissa of the graph (b) is the length of the scribe and the ordinate is the cutting depth of the scribe. FIG. b illustrates the depth of cut d when scribing0Beyond 148 nm, the appearance of contour chipping is clearly visible in the cross section. That is, the critical depth of cut for plastic and brittle transition in the present case is 148 nanometers. Through the processing experiment of the microgrooves 3, the brittle-plastic transition critical cutting depth under the current cutting condition can be obtained. The prediction model of the brittle-plastic transition critical cutting depth of the carbide ceramic material is a cutting depth prediction model when the carbide ceramic material is subjected to plastic deformation and a brittle fracture critical point.
In this embodiment, as shown in fig. 8, the second corresponding relationship is that the larger the radius of the circular arc of the tool tip, the larger the brittle-plastic transition critical cutting depth of the carbide ceramic material.
Thirdly, calculating the fracture length of the carbide ceramic material;
specifically, in the third step, according to the first corresponding relationship, the hardness of the carbide ceramic material under different nose arc radii is obtained, the obtained mechanical characteristic parameters of the carbide ceramic material are substituted into the fracture length prediction model, and a third corresponding relationship between the fracture length of the carbide ceramic material and the parameters of the tool 9 is obtained, where the fracture length prediction model is as follows:
wherein c is the fragmentation length; mu.s0Is a geometric constant based on the radius of the circular arc of the tool nose; kc is the fracture toughness (fracture resistance) of the carbide ceramic material; h is the hardness of the carbide ceramic material; g is the shearing amount of the carbide ceramic material; e is the elastic modulus of the carbide ceramic material; a is0Is a constant; v is the poisson's ratio of the carbide ceramic material.
In this embodiment, the parameters of the tool 9 include the radius of the cutting edge, the radius of the arc of the nose, and the rake angle of the tool.
In this embodiment, the third correspondence is a fragmentation length prediction model.
The brittle-plastic transition critical cut depth and chip length of the carbide ceramic material are related to the rake angle and nose arc radius of the tool 9.
Fourthly, calculating the change relation of the chip thickness along with the turning angle of the cutter 9 according to the technological parameters of the ultra-precision milling; technological parameters of the ultra-precision milling comprise the feeding speed of the cutter 9, the rotating speed of a main shaft, the cutting depth and the turning radius of the cutter 9;
specifically, in the present embodiment, in the fourth step, as shown in fig. 9, an ultra-precision milling plastic working model is established according to the configuration structure of the ultra-precision milling system, where the ultra-precision milling plastic working model is as follows:
and further obtaining a fourth corresponding relation between the technological parameters of the ultra-precision milling and the thickness of the chip, wherein the fourth corresponding relation is as follows:
in the formula, theta is the turning angle of the cutter 9; h isθThe thickness of the chips when the tool 9 rotates at any angle; swThe radius of gyration of the cutter 9; doIs the cutting depth; f. ofeThe feed speed of the tool 9; x is the number of1The set of the abscissa for the current cutting of the tool 9 in the feed direction (i.e. the set of the abscissas between the curves ab in the ultra-precision milling plastic working model); z is a radical of1A current cutting ordinate set (namely an ordinate set between curves ab in the ultra-precision milling plastic processing model) of the cutter 9 in the feeding direction; x is the number of0Cutting an abscissa set (namely an abscissa set of a curve ac in the ultra-precision milling plastic processing model) for the previous step of the cutter 9 in the feeding direction; z is a radical of0The current cutting ordinate set (i.e. the set of the ac ordinate of the curve in the ultra-precision milling plastic working model) of the tool 9 in the feeding direction.
The fourth correspondence is to solve the chip thickness at different tool 9 rotation angles, or the mapping between the chip thickness and the tool 9 rotation angle at the given process parameters.
Fifthly, converting the critical cutting depth h through brittle-plastic_cAnd chip thickness hθJudging whether the carbide ceramic material is cracked or not, and further obtaining a corner of the cracking cutter 9 at the cracked position;
specifically, in the present embodiment, in the fifth step, when the chip thickness h is setθReach the brittle-plastic transition critical cutting depth h of the carbide ceramic material_cWhen the ceramic carbide material is broken; establishment of h_c＝hθIs calculated by the equationThe angle theta of the tool 9 at the fracture is defined as the angle theta of the fracture tool 9 at the fracture_c。
Sixthly, solving the distance from the cracked part to the processing bottom surface of the workpiece 1;
specifically, in the present embodiment, in the sixth step, the distance formula from the machined bottom surface to the machined surface of the workpiece 1 is as follows:
in the formula, HθIs the distance from the machined bottom surface to the machined surface;
the angle theta of the crushing cutter 9 at the crushed part_cReplacing theta, H in the above formulaθ_cSubstituting H in the above formulaθSolving the distance H from the fracture part to the bottom surface of the workpiece 1θ_c。
Seventhly, establishing a surface quality prediction model, namely comparing the distance H of the machined bottom surfaceθ_cRelative size to the fragmentation length c.
Judging whether a cracked crack caused by brittle fracture of the carbide ceramic material after machining permeates to the machined bottom surface of the workpiece 1 or not through a surface quality prediction model, and reselecting technological parameters of ultra-precision milling machining if the cracked crack permeates to the machined bottom surface of the workpiece 1; and if the crack cracks do not penetrate into the machined bottom surface of the workpiece 1, using the technological parameters of the ultra-precision milling machining in the step four.
Specifically, in the present embodiment, in the seventh step, the distance from the fracture point to the machined bottom surface is compared with the fracture length, and if the distance from the fracture point to the machined bottom surface is greater than the fracture length, a fracture crack is generated in the machining and does not penetrate into the machined bottom surface of the workpiece 1; if the distance from the chipping to the machined bottom surface is smaller than the chipping length, the chipping crack generated in the machining has penetrated to the machined bottom surface of the workpiece 1.
The embodiment provides a method for inhibiting the fracture damage of the ultraprecise milling surface of a carbide ceramic microstructure, which effectively inhibits the fracture of the processing surface of the carbide ceramic microstructure in ultraprecise milling and improves the surface form precision of the processing microstructure.
In this embodiment, the tool 9 with different tool rake angles and tool nose arc radii is used to study the brittle-plastic transition process of the carbide ceramic material, construct a prediction model of the brittle-plastic transition critical cutting depth of the carbide ceramic, and establish the relationship between the brittle-plastic transition critical cutting depth of the carbide ceramic and the parameters of the tool 9. Meanwhile, a carbide ceramic fragmentation length prediction model is established, and the corresponding relation between the carbide ceramic fragmentation length and the parameters of the cutter 9 is obtained.
In this embodiment, an appropriate tool 9 is selected according to the geometric features of the microstructure to be machined, including the cross-sectional geometry and depth of the microstructure, that is, the cutting edge geometry of the tool 9 is required to be the same as the cross-sectional geometry of the microstructure, and the cutting depth during milling is determined.
In this embodiment, an ultra-precision milling plastic processing model is established according to the selected process parameters of ultra-precision milling, a corresponding relationship between the process parameters and the carbide fracture point positions is established, and a surface quality prediction model is established to predict whether the processed surface is fractured. If cracked, the process parameters are reconfigured to inhibit surface cracking, and if not, the process parameters can be used for machining.
The principle and the implementation mode of the present invention are explained by applying specific examples in the present specification, and the above descriptions of the examples are only used to help understanding the method and the core idea of the present invention; meanwhile, for a person skilled in the art, according to the idea of the present invention, the specific embodiments and the application range may be changed. In view of the above, the present disclosure should not be construed as limiting the invention.
Claims (10)
1. A method for inhibiting the fracture damage of the ultra-precision milling surface of a carbide ceramic microstructure is characterized by comprising the following steps: the method comprises the following steps:
firstly, obtaining mechanical characteristic parameters of the carbide ceramic material;
secondly, obtaining the brittle-plastic transition critical cutting depth of the carbide ceramic material;
thirdly, calculating the fracture length of the carbide ceramic material;
fourthly, calculating the change relation of the chip thickness along with the turning angle of the cutter according to the technological parameters of the ultra-precision milling;
fifthly, judging whether the carbide ceramic material is cracked or not through the brittle-plastic transition critical cutting depth and the chip thickness, and further obtaining a cracked cutter corner at the cracked position;
sixthly, solving the distance from the cracked part to the processing bottom surface of the workpiece;
comparing the distance from the cracked part to the processing bottom surface of the workpiece with the relative size of the cracked length, judging whether the cracked crack permeates the processing bottom surface of the workpiece, and if the cracked crack permeates the processing bottom surface of the workpiece, reselecting technological parameters of ultra-precision milling; and if the cracked cracks do not penetrate into the machined bottom surface of the workpiece, using the technological parameters of the ultra-precision milling machining in the step four.
2. The method for suppressing chipping damage of the ultra-precision milling surface with the carbide ceramic microstructure according to claim 1, wherein: in the first step, indentation experiments are carried out on the carbide ceramic material by using cutters with different tool tip arc radiuses, so that mechanical characteristic parameters of the carbide ceramic material are obtained, and a first corresponding relation between the mechanical characteristic parameters of the carbide ceramic material and the tool tip arc radiuses is obtained.
3. The method for suppressing chipping damage of the ultra-precision milling surface with the carbide ceramic microstructure according to claim 2, wherein: the first corresponding relation is that the larger the arc radius of the tool nose is, the larger the hardness of the carbide ceramic material and the elastic modulus of the carbide ceramic material are.
4. The method for suppressing chipping damage of the ultra-precision milling surface with the carbide ceramic microstructure according to claim 1, wherein: in the second step, a scribing experiment is carried out on the carbide ceramic material by using cutters with different cutter rake angles and cutter point arc radiuses, the size of the brittle-plastic transition critical cutting depth is observed, a prediction model of the brittle-plastic transition critical cutting depth of the carbide ceramic material is further constructed, and a second corresponding relation between the brittle-plastic transition critical cutting depth of the carbide ceramic material and the cutter point arc radiuses is obtained.
5. The method for suppressing chipping damage of the ultra-precision milling surface with the carbide ceramic microstructure as claimed in claim 4, wherein: the second corresponding relation is that the larger the arc radius of the tool nose is, the larger the brittle-plastic transition critical cutting depth of the carbide ceramic material is.
6. The method for suppressing chipping damage of the ultra-precision milling surface with the carbide ceramic microstructure according to claim 3, wherein: in the third step, according to the first corresponding relation, the hardness of the carbide ceramic material under different tool nose arc radiuses is obtained, the mechanical characteristic parameters of the obtained carbide ceramic material are substituted into a fragmentation length prediction model, and a third corresponding relation between the fragmentation length of the carbide ceramic material and the tool parameters is obtained, wherein the fragmentation length prediction model is as follows:
wherein c is the fragmentation length; mu.s0Is a geometric constant based on the radius of the circular arc of the tool nose; kc is the fracture toughness of the carbide ceramic material; h is the hardness of the carbide ceramic material; g is the shearing amount of the carbide ceramic material; e is the elastic modulus of the carbide ceramic material; a is0Is a constant; v is the poisson's ratio of the carbide ceramic material.
7. The method for suppressing chipping damage of the ultra-precision milling surface with the carbide ceramic microstructure according to claim 1, wherein: in the fourth step, an ultra-precise milling plastic processing model is established according to the configuration structure of the ultra-precise milling system, wherein the ultra-precise milling plastic processing model is as follows:
and further obtaining a fourth corresponding relation between the technological parameters of the ultra-precision milling and the thickness of the chip, wherein the fourth corresponding relation is as follows:
in the formula, theta is a tool rotation angle; h isθThe thickness of the cutting chip when the cutter rotates at any angle; swIs the turning radius of the cutter; doIs the cutting depth; f. ofeThe tool feed speed; x is the number of1The current cutting abscissa set of the cutter in the feeding direction; z is a radical of1The current cutting ordinate set of the cutter in the feeding direction; x is the number of0Cutting a set of abscissa coordinates for the previous step of the cutter in the feeding direction; z is a radical of0Is the current cutting ordinate set of the tool in the feeding direction.
8. The method for suppressing chipping damage of the ultra-precision milling surface with the carbide ceramic microstructure according to claim 1, wherein: in the fifth step, when the chip thickness h is smallerθReach the brittle-plastic transition critical cutting depth h of the carbide ceramic material_cWhen the ceramic carbide material is broken; establishment of h_c＝hθCalculating a value of a chip-on tool corner theta, defined as the chip-on tool corner theta at the chip_c。
9. The method for suppressing chipping damage of the ultra-precision milling surface with the carbide ceramic microstructure according to claim 8, wherein: in the sixth step, a distance formula from the machined bottom surface to the machined surface of the workpiece is as follows:
in the formula, HθIs the distance from the machined bottom surface to the machined surface;
the angle theta of the cutting tool at the position to be cut_cReplacing theta, H in the above formulaθ_cSubstituting H in the above formulaθSolving the distance H from the broken part to the bottom surface of the workpieceθ_c。
10. The method for suppressing chipping damage of the ultra-precision milling surface with the carbide ceramic microstructure according to claim 9, wherein: comparing the distance from the fracture part to the processing bottom surface with the fracture length, wherein if the distance from the fracture part to the processing bottom surface is greater than the fracture length, the fracture crack generated in the processing does not penetrate into the processing bottom surface of the workpiece; if the distance from the fracture to the machined bottom surface is less than the fracture length, the fracture crack generated in the machining already penetrates into the machined bottom surface of the workpiece.
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| CN108256244A (en) * | 2018-01-23 | 2018-07-06 | 武汉理工大学 | A kind of coated cutting tool Steady-State Thermal Field Forecasting Methodology for considering wear of the tool flank |
| CN111002104A (en) * | 2019-12-16 | 2020-04-14 | 哈尔滨理工大学 | Method for detecting and calculating frictional wear boundary of rear cutter face of cutter tooth of high-feed milling cutter |
| CN112296363A (en) * | 2020-07-03 | 2021-02-02 | 广东工业大学 | Ultra-precise single-point diamond turning precision control method and system |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106425125A (en) * | 2016-09-30 | 2017-02-22 | 广东工业大学 | Ceramic drilling method of composite nanosecond-picosecond-femtosecond laser technology |
| CN108256244A (en) * | 2018-01-23 | 2018-07-06 | 武汉理工大学 | A kind of coated cutting tool Steady-State Thermal Field Forecasting Methodology for considering wear of the tool flank |
| CN111002104A (en) * | 2019-12-16 | 2020-04-14 | 哈尔滨理工大学 | Method for detecting and calculating frictional wear boundary of rear cutter face of cutter tooth of high-feed milling cutter |
| CN112296363A (en) * | 2020-07-03 | 2021-02-02 | 广东工业大学 | Ultra-precise single-point diamond turning precision control method and system |
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