US20200087758A1 - Method for making polycrystalline diamond compacts having curved surface - Google Patents
Method for making polycrystalline diamond compacts having curved surface Download PDFInfo
- Publication number
- US20200087758A1 US20200087758A1 US16/690,174 US201916690174A US2020087758A1 US 20200087758 A1 US20200087758 A1 US 20200087758A1 US 201916690174 A US201916690174 A US 201916690174A US 2020087758 A1 US2020087758 A1 US 2020087758A1
- Authority
- US
- United States
- Prior art keywords
- polycrystalline diamond
- diamond compact
- workblank
- etching
- laser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 135
- 239000010432 diamond Substances 0.000 title claims abstract description 135
- 238000000034 method Methods 0.000 title claims abstract description 27
- 238000005530 etching Methods 0.000 claims abstract description 32
- 239000011159 matrix material Substances 0.000 claims description 13
- 239000000758 substrate Substances 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 8
- 239000007787 solid Substances 0.000 claims description 8
- 239000000843 powder Substances 0.000 claims description 5
- 238000005245 sintering Methods 0.000 claims description 4
- 239000000835 fiber Substances 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 35
- 238000005553 drilling Methods 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 238000005755 formation reaction Methods 0.000 description 5
- 239000011435 rock Substances 0.000 description 5
- 238000012545 processing Methods 0.000 description 4
- 238000003672 processing method Methods 0.000 description 4
- 238000010276 construction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005065 mining Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000007858 starting material Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 229910052769 Ytterbium Inorganic materials 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000010329 laser etching Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- NAWDYIZEMPQZHO-UHFFFAOYSA-N ytterbium Chemical group [Yb] NAWDYIZEMPQZHO-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C26/00—Alloys containing diamond or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes
-
- E—FIXED CONSTRUCTIONS
- E21—EARTH DRILLING; MINING
- E21B—EARTH DRILLING, e.g. DEEP DRILLING; OBTAINING OIL, GAS, WATER, SOLUBLE OR MELTABLE MATERIALS OR A SLURRY OF MINERALS FROM WELLS
- E21B10/00—Drill bits
- E21B10/46—Drill bits characterised by wear resisting parts, e.g. diamond inserts
- E21B10/56—Button-type inserts
- E21B10/567—Button-type inserts with preformed cutting elements mounted on a distinct support, e.g. polycrystalline inserts
- E21B10/5676—Button-type inserts with preformed cutting elements mounted on a distinct support, e.g. polycrystalline inserts having a cutting face with different segments, e.g. mosaic-type inserts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0626—Energy control of the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0665—Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/0036—Laser treatment
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/009—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
-
- E—FIXED CONSTRUCTIONS
- E21—EARTH DRILLING; MINING
- E21B—EARTH DRILLING, e.g. DEEP DRILLING; OBTAINING OIL, GAS, WATER, SOLUBLE OR MELTABLE MATERIALS OR A SLURRY OF MINERALS FROM WELLS
- E21B10/00—Drill bits
- E21B10/46—Drill bits characterised by wear resisting parts, e.g. diamond inserts
- E21B10/56—Button-type inserts
- E21B10/567—Button-type inserts with preformed cutting elements mounted on a distinct support, e.g. polycrystalline inserts
- E21B10/5673—Button-type inserts with preformed cutting elements mounted on a distinct support, e.g. polycrystalline inserts having a non planar or non circular cutting face
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F5/00—Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product
- B22F2005/001—Cutting tools, earth boring or grinding tool other than table ware
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2999/00—Aspects linked to processes or compositions used in powder metallurgy
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23B—TURNING; BORING
- B23B2226/00—Materials of tools or workpieces not comprising a metal
- B23B2226/31—Diamond
- B23B2226/315—Diamond polycrystalline [PCD]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23B—TURNING; BORING
- B23B27/00—Tools for turning or boring machines; Tools of a similar kind in general; Accessories therefor
- B23B27/14—Cutting tools of which the bits or tips or cutting inserts are of special material
- B23B27/148—Composition of the cutting inserts
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/64—Burning or sintering processes
- C04B35/645—Pressure sintering
Definitions
- This disclosure relates to the field of super hard composite materials, and more particularly to a method for making polycrystalline diamond compacts (PDCs) having a curved surface for drill bits.
- PDCs polycrystalline diamond compacts
- PDCs polycrystalline diamond compacts
- drill bits are widely used in drill bits and other downhole tools for oil and gas drilling as well as tools for construction and mining.
- conventional drill bits use PDCs with a flat top surface, exhibit relatively low working efficiency, especially in the presence of complex geological formations such as high abrasive stratum, hard rocks, and interbedded formations, and the cutting edges of the PDCs tend to break down.
- Curved polycrystalline diamond compacts e.g., cutters or inserts with uniform or non-uniform diamond thickness and non-planar diamond working surface with or without carbide substrate
- Convention curved polycrystalline diamond compacts are sintered and formed in one step, and, therefore, their dimensional accuracy is difficult to control.
- PDC polycrystalline diamond compact
- a method for making a polycrystalline diamond compact (PDC) having a curved surface comprising: preparing a workblank of a polycrystalline diamond compact (PDC) having a flat or curved surface, and thermally- or cold-etching the curved surface of the workblank of a polycrystalline diamond compact (PDC) using laser.
- the etching is achieved in the presence of a laser, thermally or cold.
- thermally- or cold-etching the curved surface of the workblank of the polycrystalline diamond compact comprises: employing a laser generator to produce a laser beam, expanding the laser beam, focusing, to yield an energy concentration area in the curved surface of the workblank of the polycrystalline diamond compact, and etching the curved surface using energy concentration area.
- thermally-etching the surface of the workblank of the polycrystalline diamond compact is carried out according to the following parameters: the workblank of the polycrystalline diamond compact is clamped in a work table, and processed using the following parameters: a laser wavelength of 193-10600 nm, a laser pulse frequency of 100-1000 kHz, a pulse width of 1-100 ns, a beam expansion ratio between 1:2 and 1:50, and a focal length of a focus lens of 20-200 mm; the etching is performed layer by layer in the form of table movement or galvanometer matrix scanning, feeding along a Z axis, layer by layer, to yield a polycrystalline diamond compact (PDC) having a newly designed curved surface.
- PDC polycrystalline diamond compact
- cold-etching the surface of the workblank of the polycrystalline diamond compact is carried out according to the following parameters: the workblank of the polycrystalline diamond compact is clamped in a work table, a laser wavelength is 193-10600 nm, a laser pulse frequency is 100-1000 kHz, a pulse width is 1 fs-100 ps, a beam expansion ratio is between 1:2 and 1:50, a focal length of a focus lens is 20-200 mm; the etching is performed layer by layer in the form of table movement or galvanometer matrix scanning, feeding along a Z axis, layer by layer, to yield a polycrystalline diamond compact (PDC) having a new curved surface.
- PDC polycrystalline diamond compact
- thermally-etching the surface of the workblank of the polycrystalline diamond compact is carried out according to the following parameters: the workblank of the polycrystalline diamond compact is clamped in a work table, and processed using the following parameters: a laser wavelength of 193-2000 nm, a laser pulse frequency of 0.5-200 kHz, a pulse width of 1-100 ns, a beam expansion ratio between 1:2 and 1:50, and a focal length of a focus lens of 20-200 mm; the etching is performed layer by layer in the form of table movement or galvanometer matrix scanning, feeding along a Z axis, layer by layer, to yield a polycrystalline diamond compact (PDC) having a newly designed curved surface.
- PDC polycrystalline diamond compact
- cold-etching the surface of the workblank of the polycrystalline diamond compact is carried out according to the following parameters: the workblank of the polycrystalline diamond compact is clamped in a work table, a laser wavelength is 193-1100 nm, a laser pulse frequency is 0.5-200 kHz, a pulse width is 1 fs-1 ns, a beam expansion ratio is between 1:2 and 1:50, a focal length of a focus lens is 20-200 mm; the etching is performed layer by layer in the form of table movement or galvanometer matrix scanning, feeding along a Z axis, layer by layer, to yield a polycrystalline diamond compact (PDC) having a new curved surface.
- PDC polycrystalline diamond compact
- the heat effect of the processed region is not obvious in the cold laser etching process, and the process poses little effect on the properties of the material.
- the laser generator is a solid laser, a semiconductor laser, or a fiber laser.
- the laser generator is an ytterbium fiber laser.
- the workblank of the polycrystalline diamond compact is a planar workblank or a curved workblank; the workblank is shaped by employing diamond micro-powder and cemented carbide substrate as starting materials, and then sintering the material at a temperature of 1400-2000° C. and a pressure of 5.0-11.0 GPa.
- a chamfering precision of the polycrystalline diamond compact is 0.01-0.1 mm
- an angle precision of cutting edges of the polycrystalline diamond compact is 0.1°-0.5°
- a roughness of an upper surface of the polycrystalline diamond compact is 0.01-0.5 ⁇ m.
- the processing method of the invention is non-contact laser processing which employs the laser to focus on the surface of the workblank to form a high energy concentrated area, so as to vaporize and remove the unwanted part.
- the processing method of the invention involves no external force, so that the equipment and the object to be processed are not subject to deformation.
- the processing method of the invention does not pose the requirement of the conductivity of the object to be processed, and has no requirement for the hardness, strength and other parameters of the object to be processed.
- the method of the invention exhibits high precision in processing a polycrystalline diamond compact (PDC) having a curved surface, can realize high precision machining on the surface of simple or complex polycrystalline diamond compacts, thus improving the efficiency of tools using polycrystalline diamond compacts as cutting elements, greatly reducing the cost of drilling, construction or mining.
- PDC polycrystalline diamond compact
- FIG. 1 is a schematic diagram of a workblank of a polycrystalline diamond compact (PDC) having a flat surface according to one embodiment of the disclosure;
- PDC polycrystalline diamond compact
- FIG. 2 is a schematic diagram of a polycrystalline diamond compact (PDC) comprising ridges according to Example 1 of the disclosure;
- FIG. 3 is a schematic diagram of a polycrystalline diamond compact (PDC) comprising four cutting edges according to Example 2 of the disclosure.
- FIG. 4 is a schematic diagram of a polycrystalline diamond compact (PDC) comprising a plurality of cutting edges according to Example 3 of the disclosure.
- PDC polycrystalline diamond compact
- 100 Polycrystalline diamond layer; 101 . Upper surface of polycrystalline diamond compact; 200 . Cemented carbide substrate; 102 . Angle of chamfer; 103 . Cutting edge.
- the present invention uses a universal tool such as microscope to test the cutting-edge angle precision and chamfering precision of the surface polycrystalline diamond compacts, and uses a portable surface roughness tester to test the roughness of the upper surface of the polycrystalline diamond compact.
- the workblank of the polycrystalline diamond compact (PDC) of the invention comprises a polycrystalline diamond layer and a cemented carbide substrate adhered to the polycrystalline diamond layer.
- the two elements are sintered under high temperature and high pressure conditions.
- the starting materials of diamond micro-powder and cemented carbide substrate are sintered at the temperature of 1500° C. and a pressure of 9.0 GPa to yield a workblank of a flat polycrystalline diamond compact (PDC).
- the workblank of the polycrystalline diamond compact (PDC) comprises a polycrystalline diamond layer 100 and a cemented carbide substrate 200 adhered to the polycrystalline diamond layer.
- the polycrystalline diamond layer comprises an upper surface 101 .
- FIGS. 2-4 shows schematic diagrams of the prepared polycrystalline diamond compacts (PDC) having a curved surface in three examples, where 102 represents an angle of chamfer, and 103 represents a cutting edge.
- the following three examples employ the workblank of the polycrystalline diamond compact in FIG. 1 for laser processing.
- the workblank of the polycrystalline diamond compact was clamped in a work table, the laser wavelength of the solid laser was controlled at 1064 nm, a laser pulse frequency was 80 kHz, a pulse width was 80 ns, a beam expansion ratio was 1:30, a focal length of a focus lens was 100 mm; the etching was performed layer by layer in the form of galvanometer matrix scanning, feeding along a Z axis, to yield a polycrystalline diamond compact (PDC) having a curved surface.
- PDC polycrystalline diamond compact
- the workblank of the polycrystalline diamond compact was clamped in a work table, the laser wavelength of the solid laser was controlled at 355 nm, a laser pulse frequency was 100 kHz, a pulse width was 100 ps, a beam expansion ratio was 1:20, a focal length of a focus lens was 120 mm; the etching was performed layer by layer in the form of galvanometer matrix scanning, feeding along a Z axis, to yield a polycrystalline diamond compact (PDC) having a curved surface.
- PDC polycrystalline diamond compact
- the high precision ridge-shaped polycrystalline diamond compact is suitable for drilling in challenging formations such as medium to hard rocks, interbedded layers with hard rocks or inclusions.
- the workblank of the polycrystalline diamond compact was clamped in a work table, the laser wavelength of the solid laser was controlled at 1064 nm, a laser pulse frequency was 85 kHz, a pulse width was 80 ns, a beam expansion ratio was 1:30, a focal length of a focus lens was 100 mm; the etching was performed layer by layer in the form of table moving, feeding along a Z axis, to yield a polycrystalline diamond compact (PDC) having a curved surface.
- PDC polycrystalline diamond compact
- the workblank of the polycrystalline diamond compact was clamped in a work table, the laser wavelength of the solid laser was controlled at 355 nm, a laser pulse frequency was 95 kHz, a pulse width was 100 ps, a beam expansion ratio was 1:20, a focal length of a focus lens was 150 mm; the etching was performed layer by layer in the form of galvanometer matrix scanning, feeding along a Z axis, to yield a polycrystalline diamond compact (PDC) having a curved surface.
- PDC polycrystalline diamond compact
- the high precision polycrystalline diamond compact having four cutting edges is suitable for drilling in complex strata such as hard rock, interbedded formations, with high work efficiency, thus greatly reducing the cost for drilling.
- the workblank of the polycrystalline diamond compact was clamped in a work table, the laser wavelength of the solid laser was controlled at 1070 nm, a laser pulse frequency was 20 kHz, a pulse width was 90 ns, a beam expansion ratio was 1:30, a focal length of a focus lens was 150 mm; the etching was performed layer by layer in the form of galvanometer matrix scanning, feeding along a Z axis, to yield a polycrystalline diamond compact (PDC) having a curved surface.
- PDC polycrystalline diamond compact
- the workblank of the polycrystalline diamond compact having a surface was clamped in a work table, the laser wavelength of the solid laser was controlled at 532 nm, a laser pulse frequency was 50 kHz, a pulse width was 80 ps, a beam expansion ratio was 1:20, a focal length of a focus lens was 120 mm; the etching was performed layer by layer in the form of galvanometer matrix scanning, feeding along a Z axis, to yield a polycrystalline diamond compact (PDC) having a curved surface.
- PDC polycrystalline diamond compact
- the high precision ridge-shaped polycrystalline diamond compact is suitable for drilling in complex strata such as hard rock, interbedded formations, especially in tough interlayer and deep complex strata.
Abstract
Description
- This application is a continuation-in-part of U.S. application Ser. No. 15/851,692 filed Dec. 21, 2017, which is a continuation-in-part of International Patent Application No. PCT/CN2017/105472 with an international filing date of Oct. 10, 2017, designating the United States and further claims foreign priority benefits to Chinese Patent Application No. 201710308958.0 filed May 4, 2017. The contents of all of the aforementioned applications, including any intervening amendments thereto, are incorporated herein by reference. Inquiries from the public to applicants or assignees concerning this document or the related applications should be directed to: Matthias Scholl P.C., Attn.: Dr. Matthias Scholl Esq., 245 First Street, 18th Floor, Cambridge, Mass. 02142.
- This disclosure relates to the field of super hard composite materials, and more particularly to a method for making polycrystalline diamond compacts (PDCs) having a curved surface for drill bits.
- Currently, polycrystalline diamond compacts (PDCs) are widely used in drill bits and other downhole tools for oil and gas drilling as well as tools for construction and mining. However, conventional drill bits use PDCs with a flat top surface, exhibit relatively low working efficiency, especially in the presence of complex geological formations such as high abrasive stratum, hard rocks, and interbedded formations, and the cutting edges of the PDCs tend to break down.
- Curved polycrystalline diamond compacts (e.g., cutters or inserts with uniform or non-uniform diamond thickness and non-planar diamond working surface with or without carbide substrate) can partially solve these problems. However, conventional curved polycrystalline diamond compacts are sintered and formed in one step, and, therefore, their dimensional accuracy is difficult to control. In addition, it is difficulty and inefficient to make curved PDC having complex new geometries with good geometry control and residual management.
- In view of the above-described problems, it is an objective of the invention to a method for making a polycrystalline diamond compact (PDC) having a curved surface. The method greatly improves the processing efficiency of the curved polycrystalline diamond compacts, accurately controls the geometries of the curved polycrystalline diamond compacts, and overcomes the rough operation surface facing the conventional curved polycrystalline diamond compacts.
- To achieve the above objective, according to one embodiment of the invention, there is provided a method for making a polycrystalline diamond compact (PDC) having a curved surface, the method comprising: preparing a workblank of a polycrystalline diamond compact (PDC) having a flat or curved surface, and thermally- or cold-etching the curved surface of the workblank of a polycrystalline diamond compact (PDC) using laser.
- In a class of this embodiment, the etching is achieved in the presence of a laser, thermally or cold.
- In a class of this embodiment, thermally- or cold-etching the curved surface of the workblank of the polycrystalline diamond compact (PDC) comprises: employing a laser generator to produce a laser beam, expanding the laser beam, focusing, to yield an energy concentration area in the curved surface of the workblank of the polycrystalline diamond compact, and etching the curved surface using energy concentration area.
- In a class of this embodiment, thermally-etching the surface of the workblank of the polycrystalline diamond compact is carried out according to the following parameters: the workblank of the polycrystalline diamond compact is clamped in a work table, and processed using the following parameters: a laser wavelength of 193-10600 nm, a laser pulse frequency of 100-1000 kHz, a pulse width of 1-100 ns, a beam expansion ratio between 1:2 and 1:50, and a focal length of a focus lens of 20-200 mm; the etching is performed layer by layer in the form of table movement or galvanometer matrix scanning, feeding along a Z axis, layer by layer, to yield a polycrystalline diamond compact (PDC) having a newly designed curved surface.
- In a class of this embodiment, cold-etching the surface of the workblank of the polycrystalline diamond compact is carried out according to the following parameters: the workblank of the polycrystalline diamond compact is clamped in a work table, a laser wavelength is 193-10600 nm, a laser pulse frequency is 100-1000 kHz, a pulse width is 1 fs-100 ps, a beam expansion ratio is between 1:2 and 1:50, a focal length of a focus lens is 20-200 mm; the etching is performed layer by layer in the form of table movement or galvanometer matrix scanning, feeding along a Z axis, layer by layer, to yield a polycrystalline diamond compact (PDC) having a new curved surface.
- In a class of this embodiment, thermally-etching the surface of the workblank of the polycrystalline diamond compact is carried out according to the following parameters: the workblank of the polycrystalline diamond compact is clamped in a work table, and processed using the following parameters: a laser wavelength of 193-2000 nm, a laser pulse frequency of 0.5-200 kHz, a pulse width of 1-100 ns, a beam expansion ratio between 1:2 and 1:50, and a focal length of a focus lens of 20-200 mm; the etching is performed layer by layer in the form of table movement or galvanometer matrix scanning, feeding along a Z axis, layer by layer, to yield a polycrystalline diamond compact (PDC) having a newly designed curved surface.
- In a class of this embodiment, cold-etching the surface of the workblank of the polycrystalline diamond compact is carried out according to the following parameters: the workblank of the polycrystalline diamond compact is clamped in a work table, a laser wavelength is 193-1100 nm, a laser pulse frequency is 0.5-200 kHz, a pulse width is 1 fs-1 ns, a beam expansion ratio is between 1:2 and 1:50, a focal length of a focus lens is 20-200 mm; the etching is performed layer by layer in the form of table movement or galvanometer matrix scanning, feeding along a Z axis, layer by layer, to yield a polycrystalline diamond compact (PDC) having a new curved surface.
- The heat effect of the processed region is not obvious in the cold laser etching process, and the process poses little effect on the properties of the material.
- In a class of this embodiment, the laser generator is a solid laser, a semiconductor laser, or a fiber laser.
- In a class of this embodiment, the laser generator is an ytterbium fiber laser.
- In a class of this embodiment, the workblank of the polycrystalline diamond compact (PDC) is a planar workblank or a curved workblank; the workblank is shaped by employing diamond micro-powder and cemented carbide substrate as starting materials, and then sintering the material at a temperature of 1400-2000° C. and a pressure of 5.0-11.0 GPa.
- In a class of this embodiment, a chamfering precision of the polycrystalline diamond compact is 0.01-0.1 mm, an angle precision of cutting edges of the polycrystalline diamond compact is 0.1°-0.5°, and a roughness of an upper surface of the polycrystalline diamond compact is 0.01-0.5 μm.
- Advantages of the method for making a polycrystalline diamond compact (PDC) having a curved surface are summarized as follows:
- 1. The processing method of the invention is non-contact laser processing which employs the laser to focus on the surface of the workblank to form a high energy concentrated area, so as to vaporize and remove the unwanted part. Compared with the traditional processing methods, the processing method of the invention involves no external force, so that the equipment and the object to be processed are not subject to deformation. Compared with electromachining, the processing method of the invention does not pose the requirement of the conductivity of the object to be processed, and has no requirement for the hardness, strength and other parameters of the object to be processed.
- 2. The method of the invention exhibits high precision in processing a polycrystalline diamond compact (PDC) having a curved surface, can realize high precision machining on the surface of simple or complex polycrystalline diamond compacts, thus improving the efficiency of tools using polycrystalline diamond compacts as cutting elements, greatly reducing the cost of drilling, construction or mining.
-
FIG. 1 is a schematic diagram of a workblank of a polycrystalline diamond compact (PDC) having a flat surface according to one embodiment of the disclosure; -
FIG. 2 is a schematic diagram of a polycrystalline diamond compact (PDC) comprising ridges according to Example 1 of the disclosure; -
FIG. 3 is a schematic diagram of a polycrystalline diamond compact (PDC) comprising four cutting edges according to Example 2 of the disclosure; and -
FIG. 4 is a schematic diagram of a polycrystalline diamond compact (PDC) comprising a plurality of cutting edges according to Example 3 of the disclosure. - In the drawings, the following reference numbers are used: 100. Polycrystalline diamond layer; 101. Upper surface of polycrystalline diamond compact; 200. Cemented carbide substrate; 102. Angle of chamfer; 103. Cutting edge.
- To further illustrate the invention, experiments detailing a method for making a polycrystalline diamond compact (PDC) having a curved surface are described below.
- The present invention uses a universal tool such as microscope to test the cutting-edge angle precision and chamfering precision of the surface polycrystalline diamond compacts, and uses a portable surface roughness tester to test the roughness of the upper surface of the polycrystalline diamond compact.
- The workblank of the polycrystalline diamond compact (PDC) of the invention comprises a polycrystalline diamond layer and a cemented carbide substrate adhered to the polycrystalline diamond layer. The two elements are sintered under high temperature and high pressure conditions.
- The starting materials of diamond micro-powder and cemented carbide substrate are sintered at the temperature of 1500° C. and a pressure of 9.0 GPa to yield a workblank of a flat polycrystalline diamond compact (PDC). As shown in
FIG. 1 , the workblank of the polycrystalline diamond compact (PDC) comprises apolycrystalline diamond layer 100 and a cementedcarbide substrate 200 adhered to the polycrystalline diamond layer. The polycrystalline diamond layer comprises anupper surface 101.FIGS. 2-4 shows schematic diagrams of the prepared polycrystalline diamond compacts (PDC) having a curved surface in three examples, where 102 represents an angle of chamfer, and 103 represents a cutting edge. - The following three examples employ the workblank of the polycrystalline diamond compact in
FIG. 1 for laser processing. - The workblank of the polycrystalline diamond compact was clamped in a work table, the laser wavelength of the solid laser was controlled at 1064 nm, a laser pulse frequency was 80 kHz, a pulse width was 80 ns, a beam expansion ratio was 1:30, a focal length of a focus lens was 100 mm; the etching was performed layer by layer in the form of galvanometer matrix scanning, feeding along a Z axis, to yield a polycrystalline diamond compact (PDC) having a curved surface.
- The prepared polycrystalline diamond compact under the wavelength comprised ridges, the angle precision of cutting edges of the polycrystalline diamond compact was 0.4°, the chamfering precision of the polycrystalline diamond compact was 0.025 mm, and the roughness of the upper surface of the polycrystalline diamond compact was 0.12 μm.
- The workblank of the polycrystalline diamond compact was clamped in a work table, the laser wavelength of the solid laser was controlled at 355 nm, a laser pulse frequency was 100 kHz, a pulse width was 100 ps, a beam expansion ratio was 1:20, a focal length of a focus lens was 120 mm; the etching was performed layer by layer in the form of galvanometer matrix scanning, feeding along a Z axis, to yield a polycrystalline diamond compact (PDC) having a curved surface.
- The prepared curved polycrystalline diamond compact under the wavelength comprised ridges, the angle precision of cutting edges of the polycrystalline diamond compact was 0.3°, the chamfering precision of the polycrystalline diamond compact was 0.015 mm, and the roughness of the upper surface of the polycrystalline diamond compact was 0.16 μm.
- The high precision ridge-shaped polycrystalline diamond compact is suitable for drilling in challenging formations such as medium to hard rocks, interbedded layers with hard rocks or inclusions.
- The workblank of the polycrystalline diamond compact was clamped in a work table, the laser wavelength of the solid laser was controlled at 1064 nm, a laser pulse frequency was 85 kHz, a pulse width was 80 ns, a beam expansion ratio was 1:30, a focal length of a focus lens was 100 mm; the etching was performed layer by layer in the form of table moving, feeding along a Z axis, to yield a polycrystalline diamond compact (PDC) having a curved surface.
- The prepared curved polycrystalline diamond compact under the wavelength comprised four cutting edges, the angle precision of cutting edges of the polycrystalline diamond compact was 0.3°, the chamfering precision of the polycrystalline diamond compact was 0.03 mm, and the roughness of the upper surface of the polycrystalline diamond compact was 0.22 μm.
- The workblank of the polycrystalline diamond compact was clamped in a work table, the laser wavelength of the solid laser was controlled at 355 nm, a laser pulse frequency was 95 kHz, a pulse width was 100 ps, a beam expansion ratio was 1:20, a focal length of a focus lens was 150 mm; the etching was performed layer by layer in the form of galvanometer matrix scanning, feeding along a Z axis, to yield a polycrystalline diamond compact (PDC) having a curved surface.
- The prepared curved polycrystalline diamond compact under the wavelength comprised four cutting edges, the angle precision of cutting edges of the polycrystalline diamond compact was 0.2°, the chamfering precision of the polycrystalline diamond compact was 0.028 mm, and the roughness of the upper surface of the polycrystalline diamond compact was 0.21 μm.
- The high precision polycrystalline diamond compact having four cutting edges is suitable for drilling in complex strata such as hard rock, interbedded formations, with high work efficiency, thus greatly reducing the cost for drilling.
- The workblank of the polycrystalline diamond compact was clamped in a work table, the laser wavelength of the solid laser was controlled at 1070 nm, a laser pulse frequency was 20 kHz, a pulse width was 90 ns, a beam expansion ratio was 1:30, a focal length of a focus lens was 150 mm; the etching was performed layer by layer in the form of galvanometer matrix scanning, feeding along a Z axis, to yield a polycrystalline diamond compact (PDC) having a curved surface.
- The prepared curved polycrystalline diamond compact under the wavelength comprised a plurality of cutting edges, the angle precision of cutting edges of the polycrystalline diamond compact was 0.4°, the chamfering precision of the polycrystalline diamond compact was 0.045 mm, and the roughness of the upper surface of the polycrystalline diamond compact was 0.15 μm.
- The workblank of the polycrystalline diamond compact having a surface was clamped in a work table, the laser wavelength of the solid laser was controlled at 532 nm, a laser pulse frequency was 50 kHz, a pulse width was 80 ps, a beam expansion ratio was 1:20, a focal length of a focus lens was 120 mm; the etching was performed layer by layer in the form of galvanometer matrix scanning, feeding along a Z axis, to yield a polycrystalline diamond compact (PDC) having a curved surface.
- The prepared curved polycrystalline diamond compact under the wavelength comprised a plurality of cutting edges, the angle precision of cutting edges of the polycrystalline diamond compact was 0.4°, the chamfering precision of the polycrystalline diamond compact was 0.042 mm, and the roughness of the upper surface of the polycrystalline diamond compact was 0.18 μm.
- The high precision ridge-shaped polycrystalline diamond compact is suitable for drilling in complex strata such as hard rock, interbedded formations, especially in tough interlayer and deep complex strata.
- Unless otherwise indicated, the numerical ranges involved in the invention include the end values. While particular embodiments of the invention have been shown and described, it will be obvious to those skilled in the art that changes and modifications may be made without departing from the invention in its broader aspects, and therefore, the aim in the appended claims is to cover all such changes and modifications as fall within the true spirit and scope of the invention.
Claims (14)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US16/690,174 US20200087758A1 (en) | 2017-05-04 | 2019-11-21 | Method for making polycrystalline diamond compacts having curved surface |
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710308958.0A CN106984906B (en) | 2017-05-04 | 2017-05-04 | The laser processing of oil bit curved surface composite polycrystal-diamond |
CN201710308958.0 | 2017-05-04 | ||
PCT/CN2017/105472 WO2018201672A1 (en) | 2017-05-04 | 2017-10-10 | Laser processing method for curved polycrystalline diamond composite compact for use in oil drill bit |
US15/851,692 US20180318962A1 (en) | 2017-05-04 | 2017-12-21 | Method for processing polycrystalline diamond compact having curved surface |
US16/690,174 US20200087758A1 (en) | 2017-05-04 | 2019-11-21 | Method for making polycrystalline diamond compacts having curved surface |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US15/851,692 Continuation-In-Part US20180318962A1 (en) | 2017-05-04 | 2017-12-21 | Method for processing polycrystalline diamond compact having curved surface |
Publications (1)
Publication Number | Publication Date |
---|---|
US20200087758A1 true US20200087758A1 (en) | 2020-03-19 |
Family
ID=69773801
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US16/690,174 Abandoned US20200087758A1 (en) | 2017-05-04 | 2019-11-21 | Method for making polycrystalline diamond compacts having curved surface |
Country Status (1)
Country | Link |
---|---|
US (1) | US20200087758A1 (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11365589B2 (en) * | 2019-07-03 | 2022-06-21 | Cnpc Usa Corporation | Cutting element with non-planar cutting edges |
US11598153B2 (en) * | 2018-09-10 | 2023-03-07 | National Oilwell Varco, L.P. | Drill bit cutter elements and drill bits including same |
USD982046S1 (en) * | 2020-10-16 | 2023-03-28 | Sf Diamond Co., Ltd. | Drill bit |
USD982631S1 (en) * | 2020-10-16 | 2023-04-04 | Sf Diamond Co., Ltd. | Drill bit |
USD982632S1 (en) * | 2020-10-16 | 2023-04-04 | Sf Diamond Co., Ltd. | Drill bit |
USD989826S1 (en) * | 2020-10-16 | 2023-06-20 | Sf Diamond Co., Ltd. | Drill bit |
USD989827S1 (en) * | 2020-10-16 | 2023-06-20 | Sf Diamond Co., Ltd. | Drill bit |
-
2019
- 2019-11-21 US US16/690,174 patent/US20200087758A1/en not_active Abandoned
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11598153B2 (en) * | 2018-09-10 | 2023-03-07 | National Oilwell Varco, L.P. | Drill bit cutter elements and drill bits including same |
US11365589B2 (en) * | 2019-07-03 | 2022-06-21 | Cnpc Usa Corporation | Cutting element with non-planar cutting edges |
USD982046S1 (en) * | 2020-10-16 | 2023-03-28 | Sf Diamond Co., Ltd. | Drill bit |
USD982631S1 (en) * | 2020-10-16 | 2023-04-04 | Sf Diamond Co., Ltd. | Drill bit |
USD982632S1 (en) * | 2020-10-16 | 2023-04-04 | Sf Diamond Co., Ltd. | Drill bit |
USD989826S1 (en) * | 2020-10-16 | 2023-06-20 | Sf Diamond Co., Ltd. | Drill bit |
USD989827S1 (en) * | 2020-10-16 | 2023-06-20 | Sf Diamond Co., Ltd. | Drill bit |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US20200087758A1 (en) | Method for making polycrystalline diamond compacts having curved surface | |
US20180318962A1 (en) | Method for processing polycrystalline diamond compact having curved surface | |
CN106984906B (en) | The laser processing of oil bit curved surface composite polycrystal-diamond | |
US10946500B2 (en) | Methods for laser cutting a polycrystalline diamond structure | |
JP5878086B2 (en) | Cutting tool manufacturing method | |
Wu et al. | Precision grinding of a microstructured surface on hard and brittle materials by a microstructured coarse-grained diamond grinding wheel | |
Gu et al. | Role of cobalt of polycrystalline diamond compact (PDC) in drilling process | |
Pu et al. | Study on the three-dimensional topography of the machined surface in laser-assisted machining of Si3N4 ceramics under different material removal modes | |
Hazzan et al. | Laser processing of hard and ultra-hard materials for micro-machining and surface engineering applications | |
Pacella et al. | Surface engineering of ultra-hard polycrystalline structures using a nanosecond Yb fibre laser: Effect of process parameters on microstructure, hardness and surface finish | |
Paul et al. | Environmentally conscious machining and grinding with cryogenic cooling | |
CN108513549A (en) | Cutting element and its manufacturing method | |
CN104174884A (en) | Edge tool | |
WO2022095804A1 (en) | Ultrasonic laser mechanical composite processing method, ultrasonic vibration fixture, machine tool, and laser | |
Zhang et al. | Turning of microgrooves both with and without aid of ultrasonic elliptical vibration | |
CN110315216A (en) | The method of laser processing workpiece and its application in cutter manufacture | |
SUGANUMA et al. | 0520 Enhancing Cutting Performance of Diamond Coating Tool by Edge Sharpening with Short Pulse Laser | |
Grigor’ev et al. | Technological aspects of the electrical-discharge machining of small-diameter holes in a high-density ceramic. Part 1 | |
Melaibari et al. | Two-dimensional contour cutting of polycrystalline cubic boron nitride using a novel laser/water jet hybrid process | |
Wu | The mechanism governing cutting of hard materials with hybrid Laser/Waterjet system through controlled fracture | |
Dvornikov et al. | Main development trends and some technical decisions on mining tools equipped with super-hard composite materials inserts | |
Hung et al. | Micromachining of advanced materials | |
Ju et al. | Simulation and Experimental Study on Rock Disintegration Characteristics of Special-shaped PDC Cutters | |
Lv et al. | Effects of high frequency vibration on the surface quality in rotary ultrasonic machining of glass BK7 | |
Singh et al. | CHEMICAL-ASSISTED MIXED ABRASIVE SLURRY INFLUENCE ON MACHINING PHYSIOGNOMIES OF POLYCARBONATE BULLET PROOF GLASS AND ACRYLIC HEAT-RESISTANT GLASS IN ULTRASONIC MACHINING |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: SF DIAMOND CO., LTD., CHINA Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:ZHAO, DONGPENG;LI, HONGLI;MA, SHANSHAN;AND OTHERS;REEL/FRAME:051082/0843 Effective date: 20191114 |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: DOCKETED NEW CASE - READY FOR EXAMINATION |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: NON FINAL ACTION MAILED |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: RESPONSE TO NON-FINAL OFFICE ACTION ENTERED AND FORWARDED TO EXAMINER |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: FINAL REJECTION MAILED |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |