CN113594716A

CN113594716A - LCP plate-based millimeter wave antenna structure and terminal equipment

Info

Publication number: CN113594716A
Application number: CN202110805455.0A
Authority: CN
Inventors: 阿米爾·馬吉扎德
Original assignee: Shenzhen Sunway Communication Co Ltd
Current assignee: Shenzhen Sunway Communication Co Ltd
Priority date: 2021-07-16
Filing date: 2021-07-16
Publication date: 2021-11-02

Abstract

The invention discloses a millimeter wave antenna structure and terminal equipment based on LCP plates, which comprise a circuit board, the LCP plates and an antenna layer which are sequentially stacked, wherein the antenna layer comprises an antenna radiator; the LCP board is kept away from be equipped with the fluting on the side on antenna layer, the fluting with antenna radiation body one-to-one. The invention can reduce the process complexity and cost and improve the antenna performance.

Description

LCP plate-based millimeter wave antenna structure and terminal equipment

Technical Field

The invention relates to the technical field of wireless communication, in particular to a millimeter wave antenna structure based on LCP (liquid Crystal display) plates and terminal equipment.

Background

For millimeter wave antennas, the antenna has to be integrated into an RFIC (radio frequency integrated circuit), a so-called antenna package (AiP). Currently, there is no standard method of doing this in an optimal way, depending on several factors such as antenna design, antenna feed, accuracy, performance and material tolerances.

In most cases, the millimeter wave antenna array design is multi-layered, and one current approach to implementing the antenna is to use a conventional high frequency PCB and perform a stacked design. However, this method is costly and complicated. Therefore, there is a need for other methods to implement millimeter wave antennas.

Disclosure of Invention

The technical problem to be solved by the invention is as follows: a millimeter wave antenna structure and a terminal device based on LCP plate are provided, which can reduce the process complexity and cost and improve the antenna performance.

In order to solve the technical problems, the invention adopts the technical scheme that: a millimeter wave antenna structure based on LCP plates comprises a circuit board, the LCP plates and an antenna layer which are sequentially stacked, wherein the antenna layer comprises an antenna radiator; the LCP board is kept away from be equipped with the fluting on the side on antenna layer, the fluting with antenna radiation body one-to-one.

The invention also provides a terminal device, which comprises the LCP plate-based millimeter wave antenna structure.

The invention has the beneficial effects that: the LCP plate is used as the substrate, the antenna layer and the circuit board are integrated together, compared with the traditional integration mode of a PCB, the cost and the process complexity can be reduced, and the LCP plate has the characteristic of low loss, so that the LCP plate is suitable for a millimeter wave antenna; by providing slots in the LCP sheet, i.e., adding air cavities between the antenna and the excitation surface, the transmission losses in the gap can be reduced since the transmission losses in air are lower than for LCP material, thereby improving antenna performance. Compared with the traditional PCB, the PCB has better design adaptability, greatly reduces the process complexity and cost, and can improve the antenna performance.

Drawings

Fig. 1 is an exploded schematic view of a millimeter wave antenna structure based on LCP plates according to a first embodiment of the present invention;

fig. 2 is a schematic size diagram of an LCP plate and an antenna layer according to a first embodiment of the present invention;

FIG. 3 is a schematic structural diagram of an LCP plate according to a first embodiment of the present invention;

fig. 4 is an exploded view of a millimeter wave antenna structure according to another embodiment of the present invention.

Description of reference numerals:

1. a circuit board; 2. LCP plate; 3. an antenna layer; 4. an adhesive layer;

11. opening a hole;

21. grooving; 22. a boss portion;

31. an antenna radiator.

Detailed Description

In order to explain technical contents, objects and effects of the present invention in detail, the following detailed description is given with reference to the accompanying drawings in conjunction with the embodiments.

Referring to fig. 1, a millimeter wave antenna structure based on LCP plates includes a circuit board, an LCP plate, and an antenna layer stacked in sequence, where the antenna layer includes an antenna radiator; the LCP board is kept away from be equipped with the fluting on the side on antenna layer, the fluting with antenna radiation body one-to-one.

From the above description, the beneficial effects of the present invention are: the process complexity and cost can be reduced and the antenna performance can be improved.

Further, the antenna layer is formed on the LCP plate by a laser direct structuring technique.

As can be seen from the above description, the LDS trace on the LCP board can well replace the conventional PCB trace.

Further, the antenna layer is an FPC antenna.

As can be seen from the above description, the antenna layer as a separate component can improve the flexibility of antenna process selection, thereby well adapting to the technical and commercial requirements of the customers.

Further, an adhesive layer is included, and the LCP plate is disposed on the circuit board through the adhesive layer.

Further, the LCP plate is snap-fit or rivet-fit connected to the circuit board.

As can be seen from the above description, the adhesive layer fixing or mechanical fixing mode can be adopted alone, and the antenna can be fixed on the circuit board uplink by adopting two fixing modes at the same time, so that the connection reliability can be ensured.

Further, the LCP board is close to be equipped with the bellying of at least one on the side of circuit board, be equipped with on the circuit board with the bellying one-to-one of at least one and the trompil of looks adaptation.

Further, the at least one raised portion is provided at an edge of the one side of the LCP plate.

As can be seen from the above description, connection stability can be ensured.

Example one

Referring to fig. 1-4, a first embodiment of the present invention is: a millimeter wave antenna structure based on LCP plate can be applied to 5G millimeter wave terminal equipment. Wherein LCP is industrial liquid crystal polymer.

As shown in fig. 1, includes a circuit board 1, an LCP board 2, and an antenna layer, which includes an antenna radiator 31, stacked in this order. The plurality of antenna radiators 31 may be distributed in an array. In this embodiment, as shown in fig. 2, the LCP plate 2 has a length and a width of 32mm and a thickness of 1 mm; the number of the antenna radiators 31 is 16, and the antenna radiators are distributed in a 4 × 4 array; each antenna radiator 31 is square in shape and has a side length of 4 mm.

As shown in fig. 3, a side of the LCP plate 2 away from the antenna layer is provided with a slot 21, and the slot 21 corresponds to the antenna radiator one to one.

In this embodiment, the antenna layer is formed on the LCP plate 2 by a Laser Direct Structuring (LDS) technique. In other embodiments, as shown in fig. 4, the antenna layer 3 is an FPC antenna. Namely, replacing the traditional PCB board with LCP board, then forming antenna wiring on the LCP board through LDS technology, or setting FPC antenna on the LCP board. Because LCP material has low-loss characteristic, so it is fit for the millimeter wave frequency to the LDS on the LCP board is walked and to replace traditional PCB to walk well.

Wherein, if the FPC antenna is used, the antenna is a single part, the assembly process is prolonged due to the addition of parts, but the mode is very flexible due to the various antenna process choices, and can meet the technical and commercial requirements of customers.

In this embodiment, the LCP plate may be obtained by injection moulding, the slots in the LCP plate corresponding to the air cavities being produced by not moulding the LCP material in the injection moulding process in correspondence with the position of the antenna radiator. Since the transmission loss in air is lower compared to LCP material, by providing slots in the LCP sheet, which is equivalent to adding air cavities between the antenna and the excitation surface (i.e. the side of the circuit board close to the LCP sheet), the transmission loss in the gap can be reduced, thereby improving antenna performance.

Further, as shown in fig. 1, the LCP board 2 is disposed on the circuit board 1 through the adhesive layer 4. Meanwhile, the LCP plate 2 is connected with the circuit board 1 in a buckling or riveting manner; specifically, LCP board 2 is close to be equipped with at least one bellying 22 on the side of circuit board 1, be equipped with on the circuit board 1 with at least one bellying 22 one-to-one and the trompil 11 of looks adaptation. As shown in fig. 3, in the present embodiment, the number of the protrusions 22 is 4, and the protrusions are respectively disposed on the four edges of the LCP plate 2. Preferably, the boss 22 may be a guide pin.

That is, in this embodiment, the antenna is fixed to an RFIC (radio frequency integrated circuit) board by using a tape and mechanical fixing method, so that connection reliability can be ensured. Of course, in other embodiments, only one of the ways to connect the LCP board and the circuit board may be used.

In addition, in this embodiment, the antenna is fed through a dedicated slot integrated on the RFIC board, which means that no electrical connection is required and the antenna traces with the LCP substrate will be stacked onto the RFIC board.

Compared with the traditional PCB, the PCB has better design adaptability, and simultaneously, the process complexity and the cost are greatly reduced.

In summary, according to the millimeter wave antenna structure and the terminal device based on the LCP board provided by the present invention, the LCP board is used as the substrate, and the antenna layer and the circuit board are integrated together, so that compared with the conventional integration method of the PCB, the cost and the process complexity can be reduced, and the LCP board has the characteristic of low loss, so that it is suitable for the millimeter wave antenna; by providing slots in the LCP sheet, i.e., adding air cavities between the antenna and the excitation surface, the transmission losses in the gap can be reduced since the transmission losses in air are lower than for LCP material, thereby improving antenna performance. Compared with the traditional PCB, the PCB has better design adaptability, greatly reduces the process complexity and cost, and can improve the antenna performance.

The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all equivalent changes made by using the contents of the present specification and the drawings, or applied directly or indirectly to the related technical fields, are included in the scope of the present invention.

Claims

1. A millimeter wave antenna structure based on LCP plate is characterized by comprising a circuit board, an LCP plate and an antenna layer which are sequentially stacked, wherein the antenna layer comprises an antenna radiator; the LCP board is kept away from be equipped with the fluting on the side on antenna layer, the fluting with antenna radiation body one-to-one.

2. The LCP plate-based millimeter wave antenna structure of claim 1, wherein the antenna layer is formed on the LCP plate by a laser direct structuring technique.

3. The LCP board-based millimeter wave antenna structure of claim 1, wherein the antenna layer is an FPC antenna.

4. The LCP board-based millimeter wave antenna structure of claim 1, further comprising an adhesive layer through which the LCP board is disposed on the circuit board.

5. The LCP board-based millimeter wave antenna structure of claim 1 or 4, wherein the LCP board is snap-fit or rivet-fit connected to the circuit board.

6. The LCP board-based millimeter wave antenna structure of claim 5, wherein at least one protrusion is disposed on a side of the LCP board close to the circuit board, and the circuit board is provided with an opening corresponding to the at least one protrusion in a one-to-one and matching manner.

7. The LCP plate-based millimeter wave antenna structure of claim 6, wherein the at least one protrusion is provided at an edge of the one side of the LCP plate.

8. A terminal device comprising an LCP board-based millimeter wave antenna structure according to any one of claims 1 to 7.