CN113587519A - Low-temperature storage box and refrigerator - Google Patents
Low-temperature storage box and refrigerator Download PDFInfo
- Publication number
- CN113587519A CN113587519A CN202110862566.5A CN202110862566A CN113587519A CN 113587519 A CN113587519 A CN 113587519A CN 202110862566 A CN202110862566 A CN 202110862566A CN 113587519 A CN113587519 A CN 113587519A
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- evaporator
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- heat preservation
- box
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 79
- 229910052802 copper Inorganic materials 0.000 claims abstract description 79
- 239000010949 copper Substances 0.000 claims abstract description 79
- 238000005057 refrigeration Methods 0.000 claims abstract description 54
- 239000004065 semiconductor Substances 0.000 claims abstract description 54
- 238000004321 preservation Methods 0.000 claims abstract description 46
- 238000009413 insulation Methods 0.000 claims description 9
- 238000005187 foaming Methods 0.000 claims description 3
- 239000003507 refrigerant Substances 0.000 description 12
- 238000001816 cooling Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000007710 freezing Methods 0.000 description 2
- 230000008014 freezing Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 102000004190 Enzymes Human genes 0.000 description 1
- 108090000790 Enzymes Proteins 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005842 biochemical reaction Methods 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004088 foaming agent Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 102000004169 proteins and genes Human genes 0.000 description 1
- 108090000623 proteins and genes Proteins 0.000 description 1
Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D11/00—Self-contained movable devices, e.g. domestic refrigerators
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D19/00—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D25/00—Charging, supporting, and discharging the articles to be cooled
- F25D25/005—Charging, supporting, and discharging the articles to be cooled using containers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D29/00—Arrangement or mounting of control or safety devices
- F25D29/005—Mounting of control devices
Abstract
The invention discloses a low-temperature storage box, which comprises a heat preservation box and an ultralow-temperature refrigerating system, wherein the heat preservation box and the ultralow-temperature refrigerating system are arranged in a corresponding storage compartment of a refrigerator body; a push-pull drawer is arranged at the opening of the heat preservation box; the ultralow temperature refrigerating system comprises a compressor, a condenser, an evaporator and a semiconductor refrigerating sheet; the outlet of the compressor is connected with the inlet of the condenser through a pipeline, the outlet of the condenser is connected with the inlet of the evaporator through a pipeline, and the outlet of the evaporator is connected with the inlet of the compressor through a pipeline; the cold end of the semiconductor refrigeration piece is attached to the heat preservation box, and the hot end of the semiconductor refrigeration piece is attached to the U-shaped connecting copper pipe; two ends of the U-shaped connecting copper pipe penetrate out of the heat preservation box and then are connected with an inlet of the evaporator in series. The invention also discloses a refrigerator. The combination of the evaporator, the U-shaped connecting copper pipe and the semiconductor refrigerating sheet can realize the acquisition of ultralow temperature, and meet the requirement of common users on the realization of local ultralow-temperature refrigeration in the household refrigerator.
Description
Technical Field
The invention belongs to the technical field of refrigerators, and particularly relates to a low-temperature storage box and a refrigerator.
Background
Along with science and technology gradually fuses modern life, people also propose higher requirement to domestic appliance, no longer satisfy ordinary cold-stored freezing to the refrigerator that daily use is more, for the storage time of guaranteeing to eat the material and the fresh degree of preserving, ultra-low temperature storage becomes the development trend of domestic refrigerator. The ultra-low temperature storage can greatly weaken the activity and catalytic action of enzyme, reduce the speed of biochemical reaction, and can meet the requirements of ultra-low temperature long-term storage of high-end food material fresh-keeping, protein-rich fresh-keeping and the like. Therefore, there is an increasing call for creating a separate space within a home refrigerator to achieve local ultra-low temperature refrigeration.
Based on the above problems, the application provides a low temperature storage box and refrigerator, realizes the super low temperature refrigeration in the low temperature storage box to satisfy ordinary user to realize local super low temperature refrigerated demand in the domestic refrigerator.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides a low-temperature storage box and a refrigerator.
In order to achieve the purpose, the invention adopts the following technical scheme:
a low-temperature storage box comprises a heat preservation box and an ultralow-temperature refrigerating system which are arranged in a corresponding storage room of a refrigerator body, wherein the open end of the heat preservation box is arranged outwards;
a push-pull drawer is arranged at the opening of the heat preservation box, and two sides of the push-pull drawer are in sliding fit with the corresponding inner end surface of the box body along the direction vertical to the depth of the box body;
the ultra-low temperature refrigerating system comprises a compressor, a condenser, an evaporator and a semiconductor refrigerating sheet, wherein the evaporator is positioned in an air duct of a corresponding storage compartment of the box body;
the outlet of the compressor is in pipeline connection with the inlet of the condenser, the outlet of the condenser is in pipeline connection with the inlet of the evaporator, and the outlet of the evaporator is in pipeline connection with the inlet of the compressor;
the cold end of the semiconductor refrigeration piece is attached to the heat preservation box, and the hot end of the semiconductor refrigeration piece is attached to the U-shaped connecting copper pipe;
and two ends of the U-shaped connecting copper pipe penetrate out of the heat preservation box and are connected with an inlet of the evaporator in series.
Preferably, the heat preservation box comprises a shell with a U-shaped structure, and a U-shaped inner cavity is arranged in the shell; the two parallel side walls of the shell are distributed along the up-down direction; the U-shaped opening of the shell is arranged outwards;
an enclosing assembly is arranged in the U-shaped inner cavity, and a foaming heat-insulating layer is filled in the U-shaped inner cavity outside the enclosing assembly;
the semiconductor refrigeration piece is fixedly arranged on the inner side of the enclosure assembly, and the cold end of the semiconductor refrigeration piece is attached to the bottom end face of the U-shaped inner cavity in the enclosure assembly; and two ends of the U-shaped connecting copper pipe sequentially penetrate through the enclosure assembly and the shell and then are connected with an inlet of the evaporator in series.
Preferably, the hot end of the semiconductor refrigeration piece is attached to a heat exchange copper block located in the enclosure assembly, and the bent end of the U-shaped connecting copper pipe is embedded into the heat exchange copper block.
Preferably, the heat exchange copper block comprises an upper heat exchange copper block and a lower heat exchange copper block which are opposite up and down; u-shaped clamping grooves are formed in the opposite end faces of the upper heat exchange copper block and the lower heat exchange copper block;
two U-shaped clamping grooves on the upper heat exchange copper block and the lower heat exchange copper block are matched to form a clamping groove embedded into the bent end of the U-shaped connecting copper pipe.
Preferably, the shell comprises a heat-preservation inner cover and a heat-preservation outer cover which can enclose a U-shaped inner cavity;
the enclosure assembly comprises an enclosure side wall fixedly arranged on the outer end face of the heat-preservation inner cover;
the position department that corresponds on the heat preservation enclosing cover and encloses the lateral wall open end sets up and encloses the fender opening, it can be with enclosing the end cover that keeps off the shutoff of lateral wall open end to assemble on the heat preservation enclosing cover that encloses the fender opening part.
Preferably, the semiconductor refrigeration piece is connected with the heat-preservation inner cover in the enclosure assembly through screws.
Preferably, the end cover is connected with the heat-preservation outer cover at the opening of the enclosure through screws.
Preferably, the outlet of the condenser is connected with the inlet of the dry filter through a pipeline, and the outlet of the dry filter is connected with the inlet of the evaporator.
Preferably, the outlet of the dry filter is connected to the inlet of the evaporator through a capillary tube.
The invention also provides a refrigerator.
A refrigerator includes a low temperature storage box.
The invention has the beneficial effects that:
the combination of the evaporator, the U-shaped connecting copper pipe and the semiconductor refrigerating sheet can realize the acquisition of ultralow temperature, and meet the requirements of common users on realizing local ultralow-temperature refrigeration in the household refrigerator: the evaporator is a storage box for primary refrigeration and temperature reduction, and a U-shaped connecting copper pipe connected with an inlet of the evaporator in series is equivalent to a small evaporator for secondary conduction and temperature reduction of a storage chamber; when the semiconductor refrigeration piece is not electrified, the semiconductor refrigeration piece plays a role in conduction, the cold quantity of the refrigerant in the U-shaped connecting copper pipe is transferred to the storage box, and when the semiconductor refrigeration piece is electrified, the semiconductor refrigeration piece plays a role in three-stage refrigeration on the basis of combined refrigeration of the evaporator and the U-shaped connecting copper pipe, so that the temperature of the storage box is further reduced, and the ultra-low temperature is obtained.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this application, illustrate embodiments of the application and, together with the description, serve to explain the application and are not intended to limit the application.
FIG. 1 is a schematic diagram of the cryogenic storage tank of the present invention;
FIG. 2 is a schematic structural diagram of a sliding rail in a refrigerator body according to the present invention;
FIG. 3 is a schematic view of the construction of the thermal insulation case of the present invention;
FIG. 4 is an exploded view of the thermal container of the present invention;
FIG. 5 is a schematic diagram of the semiconductor refrigeration piece, the heat exchange copper block and the U-shaped connecting copper pipe;
FIG. 6 is a schematic view of the push-pull drawer of the present invention;
FIG. 7 is a schematic flow diagram of the ultra-low temperature refrigeration system of the present invention;
wherein:
01-box body, 02-slide rail;
1-an insulation box, 101-an insulation inner cover, 102-an insulation outer cover, 103-an enclosure side wall, 104-an enclosure opening, 105-an end cover, 2-a push-pull drawer, 3-a compressor, 4-a condenser, 5-an evaporator, 6-a semiconductor refrigeration sheet, 7-U-shaped connecting copper pipes, 8-a lower heat exchange copper block, 9-an upper heat exchange copper block, 10-a U-shaped clamping groove, 11-a dry filter and 12-a capillary tube.
Detailed Description
It should be noted that the following detailed description is exemplary and is intended to provide further explanation of the disclosure. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs.
It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof, unless the context clearly indicates otherwise.
In the present invention, terms such as "upper", "lower", "bottom", "top", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only terms of relationships determined for convenience in describing structural relationships of the components or elements of the present invention, and do not particularly indicate any components or elements of the present invention, and are not to be construed as limiting the present invention.
In the present invention, terms such as "connected" and "connecting" should be interpreted broadly, and mean either a fixed connection or an integral connection or a detachable connection; may be directly connected or indirectly connected through an intermediate. The specific meanings of the above terms in the present invention can be determined according to specific situations by persons skilled in the relevant scientific or technical field, and are not to be construed as limiting the present invention.
The invention is further illustrated with reference to the following figures and examples.
Example 1:
as shown in fig. 1, the low-temperature storage box comprises a heat preservation box 1 and an ultra-low temperature refrigerating system, wherein the heat preservation box 1 is arranged in a corresponding storage room of a refrigerator body 01, and an open end of the heat preservation box 1 is arranged outwards;
a push-pull drawer 2 is arranged at an opening of the heat preservation box 1, and two sides of the push-pull drawer 2 are in sliding fit with corresponding inner end surfaces of the box body 01 along the direction vertical to the depth of the box body; specifically, as shown in fig. 2, the inner end surfaces of two sides of the box 01 are provided with slide rails 02, and two sides of the push-pull drawer 2 are provided with slide blocks matched with the corresponding slide rails 02, wherein the structure of the push-pull drawer 2 is as shown in fig. 6, and since the push-pull drawer 2 can be realized by adopting the prior art, detailed description thereof is omitted herein;
as shown in fig. 7, the ultra-low temperature refrigeration system comprises a compressor 3, a condenser 4, an evaporator 5 located in an air duct of a corresponding storage compartment of the box body 01, and a semiconductor refrigeration sheet 6 located inside a shell of the heat preservation box 1;
the outlet of the compressor 3 is connected with the inlet of a condenser 4 through a pipeline, the outlet of the condenser 4 is connected with the inlet of an evaporator 5 through a pipeline, and the outlet of the evaporator 5 is connected with the inlet of the compressor 3 through a pipeline;
the cold end of the semiconductor refrigeration piece 6 is attached to the heat preservation box 1, and the hot end of the semiconductor refrigeration piece 6 is attached to the U-shaped connecting copper pipe 7;
and two ends of the U-shaped connecting copper pipe 7 penetrate out of the heat preservation box 1 and then are connected with an inlet of the evaporator 5 in series.
In the application, the evaporator 5 performs refrigeration and cooling on the storage chamber where the heat preservation box 1 is located, and the U-shaped connecting copper pipe 7 connected with the inlet of the evaporator 5 in series is equivalent to a small evaporator and performs secondary conduction and cooling on the storage chamber, so that the temperature of the storage chamber can be further reduced, and the temperature of the storage chamber where the heat preservation box is located can reach a low-temperature effect of-60 ℃; in the application, when the semiconductor refrigerating sheet 6 is not electrified, the semiconductor refrigerating sheet plays a role in conduction and transmits the cold energy of the refrigerant in the U-shaped connecting copper pipe 7 to the storage compartment where the heat preservation box is located; when the semiconductor refrigerating sheet 6 is electrified, the semiconductor refrigerating sheet plays a role in three-stage refrigeration on the basis of combined refrigeration of the evaporator 5 and the U-shaped connecting copper pipe 7, so that the temperature of the storage compartment is further reduced, and ultra-low temperature acquisition is realized.
Preferably, as shown in fig. 3-4, the heat preservation box 1 includes a housing having a U-shaped structure, and a U-shaped inner cavity is disposed inside the housing; the two parallel side walls of the shell are distributed along the up-down direction; the U-shaped opening of the shell is arranged outwards;
an enclosing assembly is arranged in the U-shaped inner cavity, and a foaming heat-insulating layer is filled in the U-shaped inner cavity outside the enclosing assembly;
the semiconductor refrigeration piece 6 is fixedly arranged on the inner side of the enclosure assembly, and the cold end of the semiconductor refrigeration piece 6 is attached to the bottom end face of the U-shaped inner cavity in the enclosure assembly; and two ends of the U-shaped connecting copper pipe 7 sequentially penetrate through the enclosure assembly and the shell and then are connected with the inlet of the evaporator 5 in series.
Preferably, the hot end of the semiconductor refrigeration piece 6 is attached to a heat exchange copper block located in the enclosure assembly, and the bent end of the U-shaped connecting copper pipe 7 is embedded into the heat exchange copper block.
The heat transfer copper block realizes the heat conduction between the hot end of the semiconductor refrigeration sheet 6 and the refrigerant in the U-shaped connecting copper pipe 7.
Preferably, as shown in fig. 5, the heat exchange copper block comprises an upper heat exchange copper block 9 and a lower heat exchange copper block 8 which are opposite up and down; u-shaped clamping grooves 10 are formed in the opposite end faces of the upper heat exchange copper block 9 and the lower heat exchange copper block 8;
two U-shaped clamping grooves 10 on the upper heat exchange copper block 9 and the lower heat exchange copper block 8 are matched to form clamping grooves embedded into bent ends of the U-shaped connecting copper pipes 7.
Preferably, as shown in fig. 4, the housing includes an insulating inner cover 101 and an insulating outer cover 102 capable of enclosing a U-shaped inner cavity; specifically, the cold end of the semiconductor refrigeration sheet 6 is attached to the outer end face of the heat-preservation inner cover 101;
the enclosure assembly comprises an enclosure side wall 103 fixedly arranged on the outer end face of the heat-insulation inner cover 101;
an enclosing opening 104 is arranged at the position, corresponding to the opening end of the enclosing side wall 103, on the heat-insulating outer cover 102, and an end cover 105 capable of plugging the opening end of the enclosing side wall 103 is assembled on the heat-insulating outer cover 102 at the position of the enclosing opening 104.
Preferably, the semiconductor refrigeration piece 6 is connected with the heat preservation inner cover 101 in the enclosure assembly through screws.
Preferably, the end cap 105 is connected with the insulating outer cover 102 at the enclosure opening 104 through screws.
The specific assembling process of the heat preservation box 1 in the application is as follows:
mounting the semiconductor refrigeration piece 6 on the outer end face of the heat-insulation inner cover 101 in the side wall 103 of the enclosure by using screws, so that the cold end of the semiconductor refrigeration piece 6 is attached to the outer end face of the heat-insulation inner cover 101; then, a lower heat exchange copper block 8 is placed in the side wall 103 of the enclosure, so that the lower heat exchange copper block 8 is attached to the hot end of the semiconductor refrigeration sheet 6; then, a U-shaped connecting copper pipe 7 is clamped in the U-shaped clamping groove of the lower heat exchange copper block 8, wherein two ends of the U-shaped connecting copper pipe 7 penetrate through the side wall 103 of the enclosure; then, continuously placing the upper heat exchange copper block 9 in the side wall 103 of the enclosure, so that the U-shaped clamping groove 10 of the upper heat exchange copper block 9 is also clamped on the U-shaped connecting copper pipe 7;
then assembling the heat-insulating inner cover 101 and the heat-insulating outer cover 102 into a shell with a U-shaped structure, wherein two ends of the U-shaped connecting copper pipe 7 penetrate out of the heat-insulating outer cover 102;
then, an end cover 105 is arranged at the position of the enclosure opening 104, so that the end cover 105 seals the opening end of the enclosure side wall 103 and compresses the upper heat exchange copper block 9;
then foaming agent is injected into the U-shaped inner cavity and then the U-shaped inner cavity is foamed to form the heat insulation layer.
After the heat preservation box 1 is assembled, the heat preservation box 1 is assembled into the refrigerator body 01, and particularly, the heat preservation box 1 can be assembled into a freezing chamber in the refrigerator body 01; the push-pull drawer 2 is then engaged with the slide rail 102 of the refrigerator body 01, thereby completing the assembly of the low temperature storage box.
Preferably, the outlet of the condenser 4 is connected with the inlet of the dry filter 11 through a pipeline, and the outlet of the dry filter 11 is connected with the inlet of the evaporator 5.
Preferably, the outlet of the dry filter 11 is connected to the inlet of the evaporator 5 via a capillary tube 12.
A low-temperature storage box comprises the following specific embodiments:
(1) when the semiconductor refrigerating sheet 6 is not electrified in the application
When the semiconductor refrigerating sheet 6 is not electrified, the function of conduction is achieved.
At the moment, the compressor 3, the condenser 4, the dry filter 11, the capillary tube 12, the U-shaped connecting copper tube 7 and the evaporator 5 form a refrigerating system of the low-temperature storage box; the refrigerant enters the compressor 3, the compressor 3 improves the gas pressure of the refrigerant to cause liquefaction conditions, the refrigerant is condensed and liquefied to release heat when passing through the condenser 4, and then sequentially passes through the drying filter 11, the capillary tube 12, the U-shaped connecting copper tube 7 and the evaporator 5, the pressure and the temperature of the refrigerant are reduced when passing through the capillary tube 12, the refrigerant is boiled and vaporized when passing through the evaporator 5, the heat of the air in the air channel of the storage chamber where the heat preservation box 1 is located is absorbed, and the primary refrigeration of the low-temperature storage box is realized; meanwhile, when the refrigerant passes through the U-shaped connecting copper pipe 7, the cold energy of the refrigerant is transferred into the low-temperature storage box through the heat exchange copper block and the semiconductor refrigerating sheet 6, so that secondary conduction cooling is realized; and the refrigerant after absorbing heat is returned to the compressor 3.
(2) When the semiconductor refrigerating sheet 6 is electrified in the application
When the semiconductor refrigerating sheet 6 is electrified, the three-stage refrigeration effect is achieved.
On the basis of the heat absorption and primary refrigeration of the evaporator 5, when the semiconductor refrigeration piece 6 is electrified, the hot end of the semiconductor refrigeration piece 6 is attached to the U-shaped connecting copper pipe 7 through the heat exchange copper block, so that the cold quantity of the refrigerant in the U-shaped connecting copper pipe 7 is transferred to the hot end of the semiconductor refrigeration piece 6, the temperature of the hot end of the semiconductor refrigeration piece 6 is consistent with the outer wall of the U-shaped connecting copper pipe 7, namely the U-shaped connecting copper pipe 7 cools the hot end of the semiconductor refrigeration piece 6, and secondary conduction refrigeration is realized; and the cold junction of semiconductor refrigeration piece 6 pastes with heat preservation box 1 mutually to transmit the cold volume of cold junction for heat preservation box 1, and then realize tertiary refrigeration, further realize acquireing of ultra-low temperature.
Under normal conditions, the temperature in the storage box can reach about-20 ℃ by the single evaporator 5, and can reach about-60 ℃ after the conduction cooling of the U-shaped connecting copper pipe 7; and when the semiconductor refrigerating sheet 6 is powered on, the temperature in the storage box can be lower. Therefore, the combination of the evaporator, the U-shaped connecting copper pipe 7 and the semiconductor refrigerating sheet 6 in the storage box can achieve ultralow temperature acquisition, and the requirement of common users for achieving local ultralow temperature refrigeration in the household refrigerator is met.
Example 2:
a refrigerator comprising the low temperature storage tank of embodiment 1.
Although the embodiments of the present invention have been described with reference to the accompanying drawings, it is not intended to limit the present invention, and it should be understood by those skilled in the art that various modifications and changes may be made without inventive efforts based on the technical solutions of the present invention.
Claims (10)
1. A low-temperature storage box is characterized by comprising a heat preservation box and an ultralow-temperature refrigerating system, wherein the heat preservation box and the ultralow-temperature refrigerating system are arranged in a corresponding storage room of a refrigerator body;
a push-pull drawer is arranged at the opening of the heat preservation box, and two sides of the push-pull drawer are in sliding fit with the corresponding inner end surface of the box body along the direction vertical to the depth of the box body;
the ultra-low temperature refrigerating system comprises a compressor, a condenser, an evaporator and a semiconductor refrigerating sheet, wherein the evaporator is positioned in an air duct of a corresponding storage compartment of the box body;
the outlet of the compressor is in pipeline connection with the inlet of the condenser, the outlet of the condenser is in pipeline connection with the inlet of the evaporator, and the outlet of the evaporator is in pipeline connection with the inlet of the compressor;
the cold end of the semiconductor refrigeration piece is attached to the heat preservation box, and the hot end of the semiconductor refrigeration piece is attached to the U-shaped connecting copper pipe;
and two ends of the U-shaped connecting copper pipe penetrate out of the heat preservation box and are connected with an inlet of the evaporator in series.
2. The cryogenic storage tank of claim 1 wherein the thermal insulation box comprises a housing having a U-shaped configuration, the housing having a U-shaped interior; the two parallel side walls of the shell are distributed along the up-down direction; the U-shaped opening of the shell is arranged outwards;
an enclosing assembly is arranged in the U-shaped inner cavity, and a foaming heat-insulating layer is filled in the U-shaped inner cavity outside the enclosing assembly;
the semiconductor refrigeration piece is fixedly arranged on the inner side of the enclosure assembly, and the cold end of the semiconductor refrigeration piece is attached to the bottom end face of the U-shaped inner cavity in the enclosure assembly; and two ends of the U-shaped connecting copper pipe sequentially penetrate through the enclosure assembly and the shell and then are connected with an inlet of the evaporator in series.
3. The cryogenic storage tank of claim 2 wherein the hot end of the semiconductor chilling plate is attached to a heat exchange copper block located within the enclosure assembly and the bent end of the U-shaped connecting copper tube is embedded within the heat exchange copper block.
4. The cryogenic storage tank of claim 3 wherein the heat exchange copper blocks comprise upper and lower opposing heat exchange copper blocks; u-shaped clamping grooves are formed in the opposite end faces of the upper heat exchange copper block and the lower heat exchange copper block;
two U-shaped clamping grooves on the upper heat exchange copper block and the lower heat exchange copper block are matched to form a clamping groove embedded into the bent end of the U-shaped connecting copper pipe.
5. A cryogenic storage tank according to claim 2 wherein the housing comprises an insulated inner cover, an insulated outer cover capable of enclosing a U-shaped cavity;
the enclosure assembly comprises an enclosure side wall fixedly arranged on the outer end face of the heat-preservation inner cover;
the position department that corresponds on the heat preservation enclosing cover and encloses the lateral wall open end sets up and encloses the fender opening, it can be with enclosing the end cover that keeps off the shutoff of lateral wall open end to assemble on the heat preservation enclosing cover that encloses the fender opening part.
6. The cryogenic storage tank of claim 5 wherein the semiconductor chilling plates are attached to an insulated inner cover within the enclosure assembly by screws.
7. The cryogenic storage tank of claim 5 wherein the end cap is attached to the insulating cover at the enclosure opening by screws.
8. The cryogenic storage tank of claim 1 wherein the outlet of the condenser is connected to the inlet of a dry filter by a line and the outlet of the dry filter is connected to the inlet of the evaporator.
9. The cryogenic storage tank of claim 8 wherein the outlet of the dry filter is connected to the inlet of the evaporator by a capillary tube.
10. A refrigerator comprising the low temperature storage box according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110862566.5A CN113587519A (en) | 2021-07-29 | 2021-07-29 | Low-temperature storage box and refrigerator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110862566.5A CN113587519A (en) | 2021-07-29 | 2021-07-29 | Low-temperature storage box and refrigerator |
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| Publication Number | Publication Date |
|---|---|
| CN113587519A true CN113587519A (en) | 2021-11-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110862566.5A Pending CN113587519A (en) | 2021-07-29 | 2021-07-29 | Low-temperature storage box and refrigerator |
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