CN111854274A

CN111854274A - Refrigeration system, refrigerator and method for controlling refrigerator

Info

Publication number: CN111854274A
Application number: CN201910346305.0A
Authority: CN
Inventors: 裴玉哲; 王定远; 王大伟
Original assignee: Qingdao Haier Co Ltd; Qingdao Haier Smart Technology R&D Co Ltd
Current assignee: Qingdao Haier Co Ltd; Qingdao Haier Smart Technology R&D Co Ltd
Priority date: 2019-04-26
Filing date: 2019-04-26
Publication date: 2020-10-30

Abstract

The application discloses a refrigerating system belongs to household electrical appliances technical field. The refrigeration system includes: the primary refrigeration device comprises two or more evaporators; and a secondary refrigeration unit; wherein, the secondary refrigeration device is connected with part or all of the evaporators; an evaporator coupled to the secondary refrigeration device and configured to dissipate heat from the hot side of the secondary refrigeration device. By adopting the embodiment, the refrigeration efficiency and the energy utilization rate are improved. The application also discloses a refrigerator and a method for controlling the refrigerator.

Description

Refrigeration system, refrigerator and method for controlling refrigerator

Technical Field

The present application relates to the field of household electrical appliances, and in particular, to a refrigeration system, a refrigerator, and a method for controlling a refrigerator.

Background

At present, the refrigerating temperature of a refrigerating chamber of a common compressor refrigerator is-26 ℃ to-18 ℃, the refrigerating time is long, moisture in food expands and destroys cell membranes when being frozen, the food discolors and goes bad after being thawed, the taste and the nutritive value are reduced, the refrigerating requirements of high-end food materials such as tuna, salmon and the like cannot be met, the ultra-low temperature quick freezing at minus 50 ℃ is an effective means for solving the refrigerating quality of the food, the food can be quickly frozen by the ultra-low temperature quick freezing, the original freshness and taste of the food are reserved, the growth of product microorganisms is effectively inhibited, the quality guarantee period of the food is prolonged, more than two refrigerating devices are adopted to refrigerate to the same chamber together in the existing ultra-low temperature refrigerating technology, and the deep refrigeration.

In the process of implementing the embodiments of the present disclosure, it is found that at least the following problems exist in the related art: the ultra-low temperature is too fast in temperature dissipation, so that the refrigeration device is frequently started, the temperature change interval is large, the energy consumption is high, and the energy utilization rate is low.

Disclosure of Invention

The following presents a simplified summary in order to provide a basic understanding of some aspects of the disclosed embodiments. This summary is not an extensive overview nor is intended to identify key/critical elements or to delineate the scope of such embodiments but rather as a prelude to the more detailed description that is presented later.

The embodiment of the disclosure provides a refrigeration system.

In some embodiments, a refrigeration system comprises: the primary refrigeration device comprises two or more evaporators; and a secondary refrigeration unit; wherein, the secondary refrigeration device is connected with part or all of the evaporators; an evaporator coupled to the secondary refrigeration device and configured to dissipate heat from the hot side of the secondary refrigeration device.

By adopting the optional embodiment, the first-stage refrigerating device is utilized for refrigerating, the hot end of the second-stage refrigerating device is subjected to heat dissipation, the second refrigerating device has a good heat dissipation effect, ultra-low-temperature refrigeration can be rapidly carried out, the problem that the temperature change interval is too large due to cold loss between ultra-low-temperature refrigeration intervals is solved, the refrigerating device is more stable in operation, and the refrigerating efficiency and the energy utilization rate are improved.

The embodiment of the disclosure provides a refrigerator.

In some embodiments, a refrigerator includes: the refrigeration system of any of the embodiments described above.

The embodiment of the disclosure provides a method for controlling a refrigerator.

In some embodiments, the method comprises: and controlling the cold quantity distribution of the evaporator on the primary refrigerating device according to the cold quantity required by each compartment reaching the preset temperature.

By adopting the optional embodiment, the cold quantity can be reasonably distributed, so that each chamber can reach the preset temperature at the same time, the running time of the compressor is reduced, the energy utilization rate is further improved, and the energy consumption is reduced.

The embodiment of the disclosure provides an electronic device.

In some embodiments, the electronic device comprises:

at least one processor; and

a memory communicatively coupled to the at least one processor; wherein the content of the first and second substances,

the memory stores instructions executable by the at least one processor, the instructions, when executed by the at least one processor, cause the at least one processor to perform the above-described method for controlling a refrigerator.

The disclosed embodiments provide a computer-readable storage medium.

In some embodiments, the computer-readable storage medium stores computer-executable instructions configured to perform the method for controlling a refrigerator described above.

The disclosed embodiments provide a computer program product.

In some embodiments, the computer program product includes a computer program stored on a computer-readable storage medium, the computer program including program instructions that, when executed by a computer, cause the computer to perform the method for controlling a refrigerator described above.

Some technical solutions provided by the embodiments of the present disclosure can achieve the following technical effects:

the refrigerating device operates more stably, and the refrigerating efficiency and the energy utilization rate are improved.

The foregoing general description and the following description are exemplary and explanatory only and are not restrictive of the application.

Drawings

One or more embodiments are illustrated by way of example in the accompanying drawings, which correspond to the accompanying drawings and not in limitation thereof, in which elements having the same reference numeral designations are shown as like elements and not in limitation thereof, and wherein:

FIG. 1 is a block diagram of a refrigeration system provided by an embodiment of the present disclosure;

FIG. 2 is a schematic diagram of a refrigeration system provided by an embodiment of the present disclosure;

FIG. 3 is another schematic diagram of a refrigeration system provided by an embodiment of the present disclosure;

Fig. 4 is a block diagram of a heat dissipation structure provided in the embodiments of the present disclosure;

fig. 5 is a schematic structural diagram of a heat dissipation structure provided in an embodiment of the present disclosure;

fig. 6 is another schematic structural diagram of a heat dissipation structure provided in an embodiment of the present disclosure;

fig. 7 is a schematic structural view of a cold storage box provided in an embodiment of the present disclosure;

fig. 8 is another schematic structural diagram of a heat dissipation structure provided in an embodiment of the present disclosure;

fig. 9 is another schematic structural diagram of a heat dissipation structure provided in an embodiment of the present disclosure;

fig. 10 is a schematic structural diagram of a heat sink provided by an embodiment of the present disclosure;

FIG. 11 is a schematic structural view of an anti-frosting structure provided by an embodiment of the present disclosure;

fig. 12 is a schematic structural diagram of a refrigerator provided in an embodiment of the present disclosure;

fig. 13 is a flowchart illustrating a method for controlling a refrigerator according to an embodiment of the present disclosure; and

fig. 14 is a schematic structural diagram of an electronic device provided in an embodiment of the present disclosure.

Reference numerals:

100. a processor; 101. a memory; 102. a communication interface; 200. a primary refrigeration unit; 201. an evaporator; 202. a compressor; 203. a condenser; 204. a refrigerant pipe; 205. a capillary tube; 206. drying the filter; 207. a one-way valve; 208. an electromagnetic valve; 209. an electronic valve; 300. a secondary refrigeration device; 301. a hot end; 302. a refrigeration chip; 303. a cold end; 304. a thermal insulation plate; 305. a heat sink; 306. a fin; 307. an air duct groove; 308. an axial flow fan; 400. a first cold source; 500. a second cold source; 600. a cold storage device; 601. a cold storage box; 602. an opening; 700. a heat pipe; 800. a heat preservation shell; 900. an air duct; 901. a vacuum insulation panel VIP; 1000. a foamed layer; 1100. a refrigerating chamber; 1200. deep freezing chamber.

Detailed Description

So that the manner in which the features and elements of the disclosed embodiments can be understood in detail, a more particular description of the disclosed embodiments, briefly summarized above, may be had by reference to the embodiments, some of which are illustrated in the appended drawings. In the following description of the technology, for purposes of explanation, numerous details are set forth in order to provide a thorough understanding of the disclosed embodiments. However, one or more embodiments may be practiced without these details. In other instances, well-known structures and devices may be shown in simplified form in order to simplify the drawing.

The disclosed embodiment provides a refrigeration system.

Fig. 1, 2 and 3 show alternative embodiments of the refrigeration system.

In some embodiments, a refrigeration system comprises: a primary refrigeration device 200, the primary refrigeration device 200 including two or more evaporators 201; and a secondary refrigeration unit 300; wherein, the secondary refrigeration device 300 is connected with part or all of the evaporator 201, and the evaporator 201 connected with the secondary refrigeration device 300 is configured to radiate heat to the hot end 301 of the secondary refrigeration device 300.

By adopting the optional embodiment, the first-stage refrigerating device 200 is utilized for refrigerating, the hot end 301 of the second-stage refrigerating device 300 is cooled, so that the second refrigerating device has a good heat dissipation effect, ultralow-temperature refrigeration can be rapidly carried out, the problem that the temperature change interval is too large due to cold loss in the ultralow-temperature refrigeration interval is solved, the refrigerating device is more stable in operation, and the refrigerating efficiency and the energy utilization rate are improved.

Optionally, the primary refrigeration unit 200 is a compressor refrigeration unit.

Alternatively, a compressor refrigeration unit, including compressor 202; a condenser 203; a refrigerant pipe 204; and an evaporator 201.

Alternatively, the inlet end of the evaporator 201 is connected to the refrigerant pipe 204 through a capillary tube 205.

Optionally, the outlet end of the condenser 203 is provided with a dry filter 206.

Optionally, the secondary refrigeration device 300 is a semiconductor refrigeration device, and includes a refrigeration chip 302; hot side 301; a cold end 303; and thermal barriers 304, with hot side 301 and cold side 303 separated by thermal barrier 304. By adopting the optional embodiment, the lower the temperature of the hot end 301 is, the lower the temperature of the cold end 303 is, and the more suitable for ultra-low temperature refrigeration is made by utilizing the characteristic that the temperature can be lowered by semiconductor refrigeration.

Optionally, the hot side 301 of the secondary refrigeration unit 300 is connected to a heat sink 305, the heat sink 305 completely encasing the one or more evaporators 201 of the primary refrigeration unit 200. By adopting the optional embodiment, the effect of conducting the cold energy generated by the primary refrigeration device 200 and the temperature of the hot end 301 of the secondary refrigeration device 300 can be increased, and the cooling effect on the hot end 301 of the secondary refrigeration device 300 can be increased.

Optionally, the method further comprises: one or more than one of the following refrigeration devices: a tertiary refrigeration device; a refrigerating device with more than three stages. By adopting the optional embodiment, multi-stage refrigerating devices can be superposed, so that deep refrigeration can be simultaneously carried out on a plurality of areas, or deep refrigeration at lower temperature can be carried out.

In some alternative embodiments, the evaporator 201 is connected in parallel to the primary refrigeration unit 200. With this alternative embodiment, the primary refrigeration unit 200 can deliver refrigeration to multiple evaporators 201 simultaneously by being arranged in parallel.

Optionally, the evaporator 201 is connected in parallel to the primary refrigeration device 200 through the electronic valve 209; the electronic valve 209 is configured to control the cooling capacity of the evaporator 201 through opening degree adjustment. With this alternative embodiment, the refrigeration capacity introduced to each parallel evaporator 201 can be controlled by the electronic valve 209, so that the refrigeration capacity of each evaporator 201 can have different temperatures.

Alternatively, the electronic valve 209 is an electronic expansion valve, is mounted on the refrigerant pipe 204 connected to the evaporator 201, and is configured to adjust the flow rate of the refrigerant passing through the evaporator 201. By adopting the optional embodiment, the flow of the refrigerant can be more finely regulated and controlled through the electronic expansion valve, and the temperature control interval is smaller.

Optionally, an electronic valve 209 is provided at the inlet end of the evaporator 201.

Optionally, the inlet end of each evaporator 201 is provided with an electronic valve 209. By adopting the optional embodiment, the refrigerant flow of each evaporator 201 can be controlled, so that the cold quantity distribution is facilitated.

Optionally, a check valve 207 is further disposed on the refrigerant pipe 204 on one side of the evaporator 201. With this alternative embodiment, the two refrigerant pipes 204 connected in parallel can be prevented from being influenced by the pressure difference.

Alternatively, the inlet ends of the parallel evaporators 201 are all connected with a solenoid valve 208. With this alternative embodiment, one or more evaporators 201 can be completely shut off using a solenoid valve, stopping the distribution of cold to the evaporators 201.

Alternatively, the solenoid valve 208 is a shunt solenoid valve.

In some alternative embodiments, one or more evaporators 201 are connected in series with the one-stage refrigeration unit 200. By adopting the optional embodiment, the use of the series structure is more stable, the cost is lower, and the control is convenient.

Optionally, a fan is arranged on one side of the partial evaporator 201, and the speed of the fan can be adjusted. By adopting the optional embodiment, the dissipation of the cold quantity on the evaporators 201 is regulated and controlled by regulating the rotating speed of the fan, so that the distribution of the cold quantity of each evaporator 201 is controlled.

The embodiment of the disclosure provides a heat dissipation structure.

Fig. 4 and 5 show an alternative embodiment of the heat dissipation structure.

In some embodiments, the heat dissipation structure includes: heat sink 305 connected to hot side 301; a first cool source 400 connected to the heat sink 305; and a second cool source 500 connected to the heat sink 305.

By adopting the optional embodiment, the first cold source 400 and the second cold source 500 are both connected to the heat sink 305, and when one of the cold sources stops supplying cold, the heat sink 305 can still use the cold energy of the other cold source to dissipate heat, so that the hot end 301 can dissipate heat stably, thereby reducing the frequency of supplying the first cold source 400 and reducing the energy consumption.

Optionally, the first cool source 400 is connected to the second cool source 500.

Optionally, the second cool source 500 is cooled by the first cool source 400. With this alternative embodiment, the second cold source 500 accumulates the cold energy of the first cold source 400, and after the first cold source 400 stops supplying cold, the second cold source 500 can continue to radiate the heat sink 305.

Alternatively, the first cool source 400 and the second cool source 500 are cooled by the same cooling device. By adopting the optional embodiment, the same refrigerating device is used for supplying cold to the first cold source 400 and the second cold source 500, so that the number of the refrigerating devices is reduced, more energy is saved, and the cost is reduced.

Optionally, a cooling medium coil is embedded in the radiator 305, and the cooling medium coil is communicated with the first cooling source 400. The refrigerant coil pipe is directly embedded into the radiator 305 for integral manufacture, so that the heat exchange effect between the radiator 305 and the first cold source 400 is enhanced, and the production is more convenient.

Optionally, the method further comprises: the primary refrigeration device 200, the radiator 305 is connected with the evaporator 201 of the primary refrigeration device 200; and a secondary refrigeration unit 300, with a heat sink 305 connected to a warm end 301 of secondary refrigeration unit 300. With this alternative embodiment, the evaporator 201 of the primary refrigeration device 200 provides cooling energy to dissipate heat from the heat sink 305, and the heat sink 305 dissipates heat from the hot end 301 of the secondary refrigeration device 300, so that the secondary refrigeration device 300 can operate more stably, and the secondary refrigeration device 300 can perform ultra-low temperature refrigeration conveniently.

Alternatively, the heat sink 305 and the evaporator 201 are in direct contact for heat exchange. With the alternative embodiment, the heat sink 305 is in direct contact with the evaporator 201, so that heat can be exchanged between the heat sink 305 and the evaporator 201 more efficiently, and the heat dissipation efficiency of the heat sink 305 is improved.

Optionally, the heat sink 305 entirely or partially encases the evaporator 201. With this alternative embodiment, the cold energy of the evaporator 201 can be completely absorbed by the heat sink 305, and the heat dissipation effect is better.

Optionally, the evaporator 201 wraps the heat sink 305 in whole or in part. With this alternative embodiment, the heat emitted from the heat sink 305 is completely absorbed by the evaporator 201, thereby improving the heat dissipation effect.

Optionally, the primary refrigeration device 200 is one or more of the following: a compressor refrigeration device; an electrochemical cooling device; an electromagnetic refrigeration device; and a semiconductor refrigeration device. With this alternative embodiment, the primary refrigeration device 200 may be any conventional refrigeration device having a temperature-lowering capability.

Alternatively, the primary refrigeration device 200 is a compressor refrigeration device and the secondary refrigeration device 300 is a semiconductor refrigeration device. By adopting the optional embodiment and the compressor refrigerating device, the cost is lower and the work is more stable.

Optionally, the primary refrigeration unit 200 includes two or more evaporators 201. With the optional embodiment, part of the evaporator 201 can serve as the first cold source 400 to dissipate heat from the heat sink 305, and part of the evaporator 201 can serve as the second cold source 500 to assist in dissipating heat from the heat sink 305, and meanwhile, other parts of the refrigerator can be refrigerated.

Alternatively, part of the evaporator 201 of the primary refrigeration device 200 is the first cold source 400, and part of the evaporator is the second cold source 500. With this alternative embodiment, the first cool source 400 and the second cool source 500 are directly cooled by the heat sink 305 of the same refrigeration device, and a single refrigeration device is used, thereby reducing the cost.

Fig. 6 and 7 show another alternative implementation of the heat dissipation structure.

In some embodiments, the heat dissipation structure includes: heat sink 305 connected to hot side 301; a cold storage device 600 connected to the heat sink 305 and configured to store cold energy and dissipate the heat from the heat sink 305; and a first cool source 400 connected to the heat sink 305.

With this alternative embodiment, a part of cold energy is accumulated by the cold accumulation device 600, and when the first cold source 400 stops supplying cold to the heat sink 305, the cold accumulation device 600 dissipates heat to the heat sink 305, so that the cold supply frequency of the first cold source 400 is reduced, and the energy consumption is reduced.

Alternatively, the cold thermal storage device 600 includes: a cold storage box 601; and a cold storage material stored in the cold storage case 601. With this alternative embodiment, the cold storage box 601 is used to store cold storage material, which facilitates the installation of the heat sink 305 in the cold storage device 600, and better dissipates heat from the heat sink 305.

Alternatively, cold thermal storage device 600 is an integral solid heat sink material.

Alternatively, the radiator 305 is integrally sealed within the cool storage box 601. By adopting the optional embodiment, the whole radiator 305 is sealed in the cold storage box 601, so that the hot end 301 connected with the radiator 305 is also partially arranged in the cold storage box 601, and the hot end 301 can exchange heat with the cold storage material in the cold storage box 601, thereby improving the heat dissipation efficiency.

Alternatively, heat sink 305 is connected to hot side 301 at one end and is embedded and sealed within cold thermal storage device 600 at the other end. With this alternative embodiment, heat sink 305 has one end connected to cold storage device 600 and the other end connected to hot end 301, i.e. hot end 301 exchanges heat with cold storage device 600 through heat sink 305, preventing cold storage material from damaging hot end 301.

Optionally, the heat sink 305 is connected to the first cool source 400 through the cooling medium pipe 204. With this alternative embodiment, the cooling capacity of the first cooling source 400 is input to the radiator 305 through the cooling medium pipe 204, so as to dissipate the heat of the radiator 305.

Optionally, the heat sink 305 is an evaporator 201 of the primary refrigeration unit 200. By adopting the optional embodiment, the evaporator 201 is directly used as the radiator 305 of the hot end 301, so that the hot end 301 can directly exchange heat with the cold energy in the evaporator 201, and the heat exchange efficiency is improved.

Optionally, the heat sink 305 is provided with fins 306 on one side. With this alternative embodiment, the heat dissipation area is increased by the fins 306, and the heat dissipation effect of the heat sink 305 is improved.

Alternatively, the side of the heat sink 305 on which the fins 306 are provided is sealed in the cool storage box 601. With this alternative embodiment, the contact area between the radiator 305 and the cool storage material in the cool storage box 601 can be increased, and the heat dissipation efficiency can be improved.

Alternatively, an opening 602 is provided at one side of the cool storage box 601, the size of the opening 602 is the same as that of the heat sink 305, one side of the heat sink 305 is inserted into the cool storage box 601 through the opening 602, and the heat sink 305 is hermetically connected to the periphery of the opening 602 of the cool storage box 601.

Optionally, the sealing connection is an adhesive connection or a weld using a sealant. By adopting the alternative embodiment, the sealing effect can be improved, and the stability of sealing can be kept.

Alternatively, the sealing connection is performed by providing a gasket in a gap between the opening 602 of the cold storage box 601 and the heat sink 305, and fixing the heat sink 305 and the cold storage box 601 by a detachable connection method such as a screw or a clip. By adopting the optional embodiment, the radiator 305 and the cold storage box 601 can be detached, so that the radiator 305 and the cold storage box 601 can be maintained and replaced conveniently in the later period.

For example, the primary refrigeration unit 200 is provided with two evaporators 201; one evaporator 201 is a first cold source 400, the evaporator 201 is wrapped in a radiator 305, the radiator 305 is hermetically installed in the cold accumulation device 600, and the cold accumulation device 600 accumulates cold energy emitted from the evaporator 201 through heat conduction of the radiator 305; the other evaporator 201 supplies cooling to other portions. After the primary refrigeration device 200 stops operating, the cold energy accumulated in the cold accumulation device 600 continues to cool the heat sink 305, so that the heat sink 305 can still maintain heat dissipation after the primary refrigeration device 200 stops operating.

Fig. 8 shows another alternative embodiment of the heat dissipation structure.

In some embodiments, the heat dissipation structure includes: heat sink 305 connected to hot side 301; a first cool source 400 connected to the heat sink 305; a second cool source 500; a heat pipe 700; wherein, the second cool source 500 is connected to the heat sink 305 through the heat pipe 700.

With this alternative embodiment, when the first cold source 400 stops supplying cold to the heat sink 305, the second cold source 500 transfers cold to the heat sink 305 through the heat pipe 700, so as to cool the heat sink 305, thereby reducing the frequency of cold supply of the first cold source 400 and reducing energy consumption.

Optionally, the heat sink 305 is connected to the second cool source 500 through a plurality of heat pipes 700. With this alternative embodiment, the heat exchange between the heat sink 305 and the second cool source 500 is performed by the plurality of heat pipes 700, so as to improve the heat exchange efficiency and the heat dissipation efficiency of the heat sink 305. The heat sink 305 and the second cool source 500 may be connected by three heat pipes 700, for example.

Alternatively, the second cool source 500 is a part of the evaporator 201 of the primary refrigeration device 200, and the heat sink 305 is connected to the part of the evaporator 201 through the heat pipe 700.

Optionally, heat pipe 700 is a low temperature heat pipe.

Alternatively, the radiator 305 is a plate heat exchanger and the evaporator 201 is embedded directly in the radiator 305. By adopting the optional embodiment, the heat dissipation between the evaporator 201 and the radiator 305 is more sufficient, and the heat dissipation efficiency of the evaporator 201 is improved.

Optionally, a cold storage device 600 is further included, and the cold storage device 600 is the second cold source 500. With this alternative embodiment, the heat sink 305 dissipates heat quickly by accumulating cold from the cold storage device 600 and transferring the cold to the heat sink 305 through the heat pipe 700.

For example, the primary refrigeration unit 200 is provided with two evaporators 201; one evaporator 201 is a first cold source 400, and the evaporator 201 is wrapped in a heat sink 305; the other evaporator 201 is a second cool source 500, and the heat sink 305 is connected to the evaporator 201 through a heat pipe 700. After the primary refrigeration device 200 stops working, the cold energy of the evaporator 201 connected to the heat sink 305 is dissipated too fast, and the heat sink 305 can continue to exchange heat with another evaporator 201 through the heat pipe 700, so that the heat sink 305 can continuously dissipate heat.

Fig. 9 and 10 show another alternative embodiment of the heat dissipation structure.

In some embodiments, the heat dissipation structure includes: heat sink 305 connected to hot side 301; a first cool source 400 connected to the heat sink 305; a second cool source 500; and an air duct 900; wherein, the heat sink 305 and the second cool source 500 are both disposed in the air duct 900.

By adopting the optional embodiment, the radiator 305 and the second cold source 500 are both arranged in the air duct 900, and under the condition that the first cold source 400 does not supply cold, the cold energy of the second cold source 500 can cool the radiator 305, so that the cold supply frequency of the first cold source 400 is reduced, and the radiator 305 and the second cold source 500 can perform defrosting operation in the air duct 900 together, so that the defrosting of the radiator 305 is more convenient, the heat dissipation efficiency is improved, and the energy consumption is reduced.

Optionally, a defrosting device is provided in the air duct 900, and is configured to defrost one or more of the following: a heat sink 305; a second cool source 500. By adopting the optional embodiment, after the frosting phenomenon occurs in one or more of the radiator 305 and the second cold source 500, the defrosting can be performed by the same defrosting device, and the defrosting device does not need to be separately installed at the radiator 305, so that the energy is saved.

Optionally, the defrosting device is an electric heating defrosting device, and defrosting is performed by generating high temperature through electric heating.

Optionally, an air duct groove 307 is provided on the heat sink 305, and an axial fan 308 is provided in the air duct groove 307. With this alternative embodiment, the air duct groove 307 increases the contact area between the heat sink 305 and the airflow, and the axial fan 308 increases the speed of the airflow, so that the heat sink 305 can contact more airflow per unit time, thereby improving the heat dissipation efficiency of the heat sink 305.

Alternatively, the heat sink 305 is provided with fins 306 on one side, and the air duct groove 307 is provided on the fins 306. With this alternative embodiment, fins 306 are brought into faster heat exchange with the air flow, increasing the heat dissipation efficiency of heat sink 305.

Optionally, a foaming layer 1000 is further included, and the air duct 900 is disposed on the foaming layer 1000. With this alternative embodiment, the air channel 900 is disposed within the foam layer 1000 to prevent the cold within the air channel 900 from escaping too quickly.

Optionally, one side of the air duct 900 is provided with a vacuum insulation panel VIP901(vacuum insulation panel). By adopting the optional embodiment, the temperature in the air duct 900 is lower, and the cold loss is reduced by utilizing the high heat insulation performance of the VIP 901.

For example, the primary refrigeration unit 200 is provided with two evaporators 201; one evaporator 201 is a first cold source 400, and the evaporator 201 is wrapped in a heat sink 305; the other evaporator 201 is a second cool source 500; both evaporators 201 are disposed within the air duct 900. After the first-stage refrigeration device 200 stops working, the cold energy of the evaporator 201 connected to the heat sink 305 is dissipated too fast, and the other evaporator 201 can supply cold to the heat sink 305 through the air duct 900, so that the heat sink 305 can continue to dissipate heat.

The disclosed embodiment provides a frosting prevention structure.

FIG. 11 illustrates an alternative implementation of an anti-frosting structure.

In some embodiments, the anti-frosting structure comprises: heat sink 305 connected to hot side 301; and a first cool source 400 connected to the heat sink 305; wherein, the heat sink 305 is hermetically installed in the thermal insulation case 800.

With this alternative embodiment, because the temperature of the heat sink 305 is below zero, the contact with air can condense water vapor on the surface of the heat sink 305, and the heat sink 305 is hermetically mounted to isolate the heat sink 305 from air, thereby avoiding the problem of frosting on the surface of the heat sink 305, improving heat exchange efficiency, eliminating the need for additional defrosting, and reducing energy consumption.

Optionally, the insulating shell 800 is a foamed layer 1000. By adopting the optional embodiment, the heat radiator 305 is sealed by the foaming layer 1000 of the refrigerator, so that the installation is convenient, no additional part is needed, the heat preservation effect of the foaming layer 1000 is better, the dissipation of cold energy can be reduced, and the frosting on the surface of the heat preservation shell 800 is prevented.

Alternatively, the thermal insulation shell 800 is a shell made of thermal insulation material, and the heat sink 305 may be completely wrapped in the thermal insulation shell 800. With this alternative embodiment, the heat sink 305 is partially sealed from water vapor by the insulating shell 800, preventing the heat sink 305 from frosting.

Optionally, a foaming layer 1000 is further included, and the thermal insulation shell 800 is embedded in the foaming layer 1000. With this alternative embodiment, the heat sink 305 is sealed together with the foam layer 1000 and the thermal insulation shell 800 to prevent the dissipation of cold within the heat sink 305.

Optionally, a vacuum insulation panel VIP901(vacuum insulation panel) is disposed between the foam layer 1000 and the heat sink 305. With this alternative embodiment, the cold energy of the heat sink 305 is prevented from escaping by the high thermal insulation of the VIP 901.

Optionally, a VIP901 is disposed between the heat sink 305 and the foam layer 1000 at an end of the heat sink 305 near the outer side of the foam layer 1000. By adopting the optional embodiment, the thinner end of the radiator 305 close to the outer side of the foaming layer 1000 can reduce the heat insulation performance of the foaming layer 1000, the added VIP901 can effectively isolate the temperature, improve the heat insulation performance and prevent the cold energy of the radiator 305 from dissipating.

Optionally, the heat sink 305 is completely embedded and sealed within the thermal shell 800. By adopting the optional embodiment, the heat sink 305 and the heat-insulating shell 800 are not in clearance due to embedded sealing, so that the phenomenon that the heat sink 305 frosts to a certain extent due to the fact that water vapor is carried in the air remained in the heat-insulating shell 800 is avoided.

Optionally, the heat sink 305 is vacuum sealed within the insulated housing 800. With this alternative embodiment, the thermal insulation performance of the thermal insulation case 800 can be increased, and the thermal insulation case 800 does not contain water vapor, thereby preventing frost from forming on the surface of the heat sink 305.

Optionally, the cooling medium device further comprises a cooling medium pipe 204; the radiator 305 is connected to the first cold source 400 through the refrigerant pipe 204; the refrigerant pipe 204 is partially or completely embedded and sealed in the heat preservation shell 800. With this alternative embodiment, the refrigerant pipe 204 connected to the heat sink 305 is also sealed inside the thermal insulation shell 800, ensuring that there is no portion of the heat sink 305 exposed outside the thermal insulation shell 800, and also preventing frost from forming on the refrigerant pipe 204.

Optionally, a cold storage device 600 is further included, and a heat sink 305 is connected to the cold storage device 600. With this alternative embodiment, the heat sink 305 can be cooled permanently by accumulating part of the cold energy in the cold accumulation device 600.

Alternatively, the cold storage device 600 is hermetically mounted to the thermal insulation case 800 together with the heat sink 305. With this alternative embodiment, water vapor in the air is blocked, and frost formation on the surfaces of the cold storage device 600 and the heat sink 305 can be prevented.

Optionally, a second cool source 500 is further included, and the heat sink 305 is connected to the second cool source 500. With this alternative embodiment, the second cold source 500 provides the cold energy for dissipating heat to the heat sink 305, so that the heat sink 305 can normally maintain heat dissipation under the condition that the first cold source 400 does not provide cold.

Optionally, a heat pipe 700 is also included; the heat sink 305 is connected to the second cool source 500 through the heat pipe 700; the heat pipe 700 is partially or entirely embedded and sealed in the thermal insulation case 800. With this alternative embodiment, it is ensured that the heat sink 305 does not have a portion exposed to the outside of the thermal insulating case 800, and also frost is prevented from forming on the heat pipe 700 connected to the heat sink 305.

For example, the first cool source 400 is the evaporator 201 of the primary refrigeration device 200; wherein the evaporator 201 is wrapped in the heat sink 305; the heat spreader 305 is entirely embedded and sealed within the foam layer 1000. By sealing the heat sink 305 within the foam layer 1000, the heat sink 305 is protected from air, thereby preventing frost formation on the heat sink 305 and preventing dissipation of low temperature at the heat sink 305.

The embodiment of the disclosure provides a refrigerator.

Fig. 12 shows an alternative embodiment of the refrigerator.

In some embodiments, a refrigerator includes: any one or more of the refrigeration system, heat dissipation structure, and anti-frost structure of any of the above embodiments.

Optionally, the method further comprises: two or more compartments; part of the compartments are cooled by the evaporator 201 of the primary cooling device 200, and part of the compartments are cooled by the secondary cooling device 300.

By adopting the optional embodiment, compartments with different temperatures are arranged in the refrigerator, so that different storage requirements are met. For example, including a refrigerator compartment 1100 and a deep freezer compartment 1200, the primary refrigerator 200 provides cold to the refrigerator compartment 1100 and the secondary refrigerator 300 provides cold to the deep freezer compartment 1200.

Optionally, a fan is disposed on one side of the evaporator 201, and the cooling energy on the evaporator 201 is blown into the compartment by the fan. By adopting the optional embodiment, the cold air around the evaporator 201 is driven by the fan to convey the cold energy into the compartments, and the amount of the cold energy conveyed to each compartment can be controlled by adjusting the rotating speed of the fan.

Optionally, evaporator 201 of primary refrigeration unit 200 dissipates heat from warm end 301 of secondary refrigeration unit 300. The refrigerating capacity of the secondary refrigerating device is improved.

The disclosed embodiment provides a method for controlling a refrigerator.

Fig. 13 illustrates a flowchart of a method for controlling a refrigerator.

In some embodiments, a method for controlling a refrigerator includes:

and controlling the cold quantity distribution of the evaporator on the primary refrigerating device according to the cold quantity required by each compartment reaching the preset temperature.

By adopting the optional embodiment, the cold quantity can be reasonably distributed, so that each chamber can reach the preset temperature at the same time, the running time of the compressor 202 is reduced, the energy utilization rate is further improved, and the energy consumption is reduced.

Optionally, controlling the refrigeration capacity distribution of the evaporator on the primary refrigeration unit comprises: and controlling the cold quantity distribution of the evaporators by controlling the rotating speed of the fan corresponding to each evaporator. By adopting the optional embodiment, the cold quantity on the evaporator 201 is transmitted to each compartment at different speeds by adjusting the rotating speed of the fan, and the method is more suitable for the distribution of the cold quantity when the evaporators 201 are connected in series.

Optionally, controlling the refrigeration capacity distribution of the evaporator on the primary refrigeration unit comprises: the cold quantity distribution of the evaporators is controlled by controlling the opening size of the air channels leading to the chambers of each evaporator. With this alternative embodiment, the amount of cooling capacity supplied to the compartment by the evaporator 201 is controlled by the opening size of the air duct 900, so as to realize the distribution of cooling capacity.

Optionally, the method further comprises: and (4) preferentially distributing cold to an evaporator connected with the secondary refrigeration device on the primary refrigeration device according to the temperature of the hot end of the secondary refrigeration device. By adopting the optional embodiment, the hot end 301 of the second-stage refrigeration device 300 is preferentially cooled, and the second-stage refrigeration device 300 is started to refrigerate after the second-stage refrigeration device 300 reaches a lower temperature, because the second-stage refrigeration device 300 generally adopts a semiconductor refrigeration device, the energy efficiency ratio of the semiconductor refrigeration device is lower than that of a compressor refrigeration device commonly used by the first-stage refrigeration device 200, the more the refrigeration capacity input by the compressor refrigeration device is, the less the refrigeration capacity required to be input by the semiconductor refrigeration device is, and the overall energy consumption can be reduced.

Optionally, the method further comprises: and when the temperature of the hot end of the secondary refrigerating device is higher than a first preset value, preferentially distributing cold to an evaporator connected with the secondary refrigerating device on the primary refrigerating device. By adopting the optional embodiment, whether the refrigeration capacity is preferentially distributed to the evaporator 201 connected with the secondary refrigeration device 300 on the primary refrigeration device 200 or not is more accurately controlled, and the control is more stable and more energy-saving. For example, if the first preset temperature value is minus 20 degrees, the primary refrigeration device 200 preferentially distributes cooling energy to the evaporator 201 connected to the secondary refrigeration device 300 when the temperature of the hot end 301 of the secondary refrigeration device 300 is higher than minus 20 degrees, so as to rapidly decrease the temperature of the hot end 301 of the secondary refrigeration device 300.

Optionally, the method further comprises: and controlling and starting the secondary refrigeration device according to the temperature of the hot end of the secondary refrigeration device. With the optional embodiment, when the temperature of the hot end 301 of the secondary refrigeration device 300 is lower than or equal to the first preset value, the secondary refrigeration device 300 is started again, and the energy consumption of the total refrigeration can be reduced by utilizing the characteristic of higher energy efficiency of the primary refrigeration device 200. For example, the first preset temperature value is-20 ℃, when the indoor temperature of the secondary refrigeration device 300 needs to be cooled due to the rise of the temperature, it is determined whether the temperature of the hot end 301 of the secondary refrigeration device is lower than or equal to-20 ℃, when the temperature of the hot end 301 of the secondary refrigeration device 300 is lower than or equal to-20 ℃, the secondary refrigeration device 300 is started, when the temperature of the hot end 301 of the secondary refrigeration device 300 is higher than-20 ℃, the hot end 301 of the secondary refrigeration device 300 is cooled by the primary refrigeration device 200, and when the temperature of the hot end 301 of the secondary refrigeration device 300 reaches-20 ℃, the secondary refrigeration device 300 is started.

Optionally, controlling the refrigeration capacity distribution of the evaporator on the primary refrigeration unit comprises: and controlling the amount of cold energy distributed to the secondary refrigerating device according to the change of the input voltage of the secondary refrigerating device. With this alternative embodiment, the input voltage to the secondary refrigeration device 300 is different, the refrigeration capacity of the secondary refrigeration device 300 is different, and the cooling capacity required at the hot side 301 is also different, i.e., the cooling capacity allocated to the secondary refrigeration device 300 is different. For example, when the voltage input to the secondary refrigeration device 300 is reduced, the amount of cooling in the secondary refrigeration device 300 is reduced, and the amount of cooling absorbed by the hot side 301 is also reduced, so that the amount of cooling lost by the evaporator 201 that supplies cooling to the hot side 301 is also reduced.

Optionally, the method further comprises: and determining the cold quantity (Q) required by each compartment to reach the preset temperature according to the temperature difference (delta T) between the real-time temperature and the preset temperature of each compartment and the volume (V) of each compartment. By adopting the optional embodiment, the volume (V) of the general chambers is fixed and unchanged, and the preset temperature can not be changed in a short time, so that the cold quantity (Q) required by the reaching of the preset temperature of each chamber can be determined only by detecting the real-time temperature of each chamber in real time, and the determination process is simple and accurate. Wherein Q ═ Δ T × V.

Optionally, controlling the refrigeration capacity distribution of the evaporator on the primary refrigeration unit comprises: the ratio of the cold quantity distributed to each evaporator is controlled according to the fact that the ratio of the cold quantity required by each chamber is equal to that of the cold quantity distributed to each evaporator. With this alternative embodiment, it is possible to control the distribution of a suitable proportion of the cold to each evaporator 201, so that the cold required by each compartment can be met simultaneously. I.e. the compartments reach the preset temperature simultaneously. For example, a first compartment and a second compartment are provided, the first evaporator providing cooling to the first compartment and the second evaporator providing cooling to the second compartment; when the ratio of the cold quantity required by the first chamber to the cold quantity required by the second chamber is 1 to 2, the ratio of the cold quantity distributed to the first evaporator to the cold quantity distributed to the second evaporator is also 1 to 2.

Optionally, the method further comprises: and when the temperature in the room for cooling by the secondary refrigerating device is higher than a second preset value and the temperature of the hot end of the secondary refrigerating device is higher than a first preset value, starting the primary refrigerating device and the secondary refrigerating device. By adopting the optional embodiment, the compartment to be cooled by the secondary refrigeration device 300 needs to be cooled, and when the hot end 301 of the secondary refrigeration device 300 is higher in temperature, the primary refrigeration device 200 and the secondary refrigeration device 300 are started, the primary refrigeration device 200 dissipates heat of the hot end 301 of the secondary refrigeration device 300, and the secondary refrigeration device 300 cools the compartment under the auxiliary heat dissipation of the primary refrigeration device 200. For example, the first preset value is minus 20 degrees, and the second preset value is minus 50 degrees; when the indoor temperature of the secondary refrigeration device 300 for cooling is higher than minus 50 ℃, and the hot end 301 of the secondary refrigeration device 300 is higher than minus 20 ℃, the primary refrigeration device 200 and the secondary refrigeration device 300 are started.

Optionally, the method further comprises: when the temperature in the room for cooling by the secondary refrigerating device is higher than the second preset value, the temperature in the room for cooling by the primary refrigerating device is lower than or equal to the three preset values, and the temperature at the hot end of the secondary refrigerating device is lower than or equal to the first preset value, only the secondary refrigerating device is started. By adopting the optional embodiment, when only the cold-supplied compartment of the secondary refrigeration device 300 needs to be refrigerated and the hot end 301 of the secondary refrigeration device 300 is at a lower temperature, only the secondary refrigeration device 300 is started to refrigerate, which is suitable for the condition that the cold storage device 600 is additionally arranged on the hot end 301 of the secondary refrigeration device 300 or the hot end 301 of the secondary refrigeration device 300 is connected with other evaporators 201 of the primary refrigeration device 200. For example, the first preset value is minus 20 degrees, the second preset value is minus 50 degrees, and the third preset value is minus 10 degrees; when the indoor temperature of the secondary refrigeration device 300 for cooling is higher than minus 50 ℃, the indoor temperature of the primary refrigeration device 200 for cooling is lower than or equal to minus 10 ℃, and the hot end 301 of the secondary refrigeration device 300 is lower than or equal to minus 20 ℃, only the secondary refrigeration device 300 is started.

Optionally, the method further comprises: when the indoor temperature of the primary refrigerating device for cooling is higher than a third preset value, the indoor temperature of the secondary refrigerating device for cooling is lower than or equal to a second preset value, and only the primary refrigerating device is started. With this alternative embodiment, only the first-stage cooling device 200 is started to cool when the compartment to be cooled by the first-stage cooling device 200 needs to cool. For example, the second preset value is minus 50 degrees, and the third preset value is minus 10 degrees; when the indoor temperature of the first-stage refrigeration device 200 for cooling is higher than minus 10 degrees and the indoor temperature of the second-stage refrigeration device 300 for cooling is lower than or equal to minus 50 degrees, only the first-stage refrigeration device 200 is started.

Optionally, the method further comprises: when the first-stage refrigerating device is independently started, whether the cold quantity is distributed to the radiator for supplying cold to the hot end of the second-stage refrigerating device or not is judged according to the temperature of the hot end of the second-stage refrigerating device. By adopting the optional embodiment, whether the cold needs to be supplied to the hot end 301 of the secondary refrigeration device 300 is judged, and when the cold does not need to be supplied, the cold is not distributed to the radiator 305 for supplying the cold to the hot end 301 of the secondary refrigeration device 300, so that the cold loss is reduced, and the energy consumption is reduced. For example, when the primary refrigeration unit 200 is activated alone; when the temperature of the hot end 301 of the secondary refrigeration device 300 is higher than 20 ℃ below zero, cold energy is distributed to the radiator 305 for supplying cold to the hot end 301 of the secondary refrigeration device 300; when the temperature at the hot side 301 of the secondary refrigeration unit 300 is less than or equal to-20 degrees, then no refrigeration is distributed to the heat sink 305 that is supplying refrigeration to the hot side 301 of the secondary refrigeration unit 300.

The disclosed embodiments provide a computer-readable storage medium storing computer-executable instructions configured to perform the above-described method for controlling a refrigerator.

The disclosed embodiments provide a computer program product comprising a computer program stored on a computer-readable storage medium, the computer program comprising program instructions that, when executed by a computer, cause the computer to perform the above-described method for controlling a refrigerator.

The computer-readable storage medium described above may be a transitory computer-readable storage medium or a non-transitory computer-readable storage medium.

An embodiment of the present disclosure provides an electronic device, a structure of which is shown in fig. 14, the electronic device including:

at least one processor (processor)100, one processor 100 being exemplified in fig. 14; and a memory (memory)101, and may further include a Communication Interface (Communication Interface)102 and a bus 103. The processor 100, the communication interface 102, and the memory 101 may communicate with each other via a bus 103. The communication interface 102 may be used for information transfer. The processor 100 may call logic instructions in the memory 101 to perform the method for controlling the refrigerator of the above-described embodiment.

In addition, the logic instructions in the memory 101 may be implemented in the form of software functional units and stored in a computer readable storage medium when the logic instructions are sold or used as independent products.

The memory 101, which is a computer-readable storage medium, may be used for storing software programs, computer-executable programs, such as program instructions/modules corresponding to the methods in the embodiments of the present disclosure. The processor 100 executes functional applications and data processing by executing software programs, instructions and modules stored in the memory 101, that is, implements the method for controlling the refrigerator in the above-described method embodiment.

The memory 101 may include a storage program area and a storage data area, wherein the storage program area may store an operating system, an application program required for at least one function; the storage data area may store data created according to the use of the terminal device, and the like. In addition, the memory 101 may include a high-speed random access memory, and may also include a nonvolatile memory.

The technical solution of the embodiments of the present disclosure may be embodied in the form of a software product, where the computer software product is stored in a storage medium and includes one or more instructions to enable a computer device (which may be a personal computer, a server, or a network device) to execute all or part of the steps of the method of the embodiments of the present disclosure. And the aforementioned storage medium may be a non-transitory storage medium comprising: a U-disk, a removable hard disk, a Read-Only Memory (ROM), a Random Access Memory (RAM), a magnetic disk or an optical disk, and other various media capable of storing program codes, and may also be a transient storage medium.

The above description and drawings sufficiently illustrate embodiments of the disclosure to enable those skilled in the art to practice them. Other embodiments may incorporate structural, logical, electrical, process, and other changes. The examples merely typify possible variations. Individual components and functions are optional unless explicitly required, and the sequence of operations may vary. Portions and features of some embodiments may be included in or substituted for those of others. The scope of the disclosed embodiments includes the full ambit of the claims, as well as all available equivalents of the claims. As used in this application, although the terms "first," "second," etc. may be used in this application to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, a first element could be termed a second element, and, similarly, a second element could be termed a first element, unless the meaning of the description changes, so long as all occurrences of the "first element" are renamed consistently and all occurrences of the "second element" are renamed consistently. The first and second elements are both elements, but may not be the same element. Furthermore, the words used in the specification are words of description only and are not intended to limit the claims. As used in the description of the embodiments and the claims, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. Similarly, the term "and/or" as used in this application is meant to encompass any and all possible combinations of one or more of the associated listed. Furthermore, the terms "comprises" and/or "comprising," when used in this application, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method or apparatus that comprises the element. In this document, each embodiment may be described with emphasis on differences from other embodiments, and the same and similar parts between the respective embodiments may be referred to each other. For methods, products, etc. of the embodiment disclosures, reference may be made to the description of the method section for relevance if it corresponds to the method section of the embodiment disclosure.

Those of skill in the art would appreciate that the various illustrative elements and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware or combinations of computer software and electronic hardware. Whether such functionality is implemented as hardware or software may depend upon the particular application and design constraints imposed on the solution. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the disclosed embodiments. It can be clearly understood by the skilled person that, for convenience and brevity of description, the specific working processes of the system, the apparatus and the unit described above may refer to the corresponding processes in the foregoing method embodiments, and are not described herein again.

In the embodiments disclosed herein, the disclosed methods, products (including but not limited to devices, apparatuses, etc.) may be implemented in other ways. For example, the above-described apparatus embodiments are merely illustrative, and for example, the division of the units may be merely a logical division, and in actual implementation, there may be another division, for example, multiple units or components may be combined or integrated into another system, or some features may be omitted, or not executed. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection through some interfaces, devices or units, and may be in an electrical, mechanical or other form. The units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units can be selected according to actual needs to implement the present embodiment. In addition, functional units in the embodiments of the present disclosure may be integrated into one processing unit, or each unit may exist alone physically, or two or more units are integrated into one unit.

The flowchart and block diagrams in the figures illustrate the architecture, functionality, and operation of possible implementations of systems, methods and computer program products according to embodiments of the present disclosure. In this regard, each block in the flowchart or block diagrams may represent a module, segment, or portion of code, which comprises one or more executable instructions for implementing the specified logical function(s). In some alternative implementations, the functions noted in the block may occur out of the order noted in the figures. For example, two blocks shown in succession may, in fact, be executed substantially concurrently, or the blocks may sometimes be executed in the reverse order, depending upon the functionality involved. In the description corresponding to the flowcharts and block diagrams in the figures, operations or steps corresponding to different blocks may also occur in different orders than disclosed in the description, and sometimes there is no specific order between the different operations or steps. For example, two sequential operations or steps may in fact be executed substantially concurrently, or they may sometimes be executed in the reverse order, depending upon the functionality involved. Each block of the block diagrams and/or flowchart illustrations, and combinations of blocks in the block diagrams and/or flowchart illustrations, can be implemented by special purpose hardware-based systems that perform the specified functions or acts, or combinations of special purpose hardware and computer instructions.

Claims

1. A refrigeration system, comprising:

a primary refrigeration device comprising two or more evaporators; and

a secondary refrigeration device;

wherein the secondary refrigeration device is connected with part or all of the evaporator; the evaporator connected to the secondary refrigeration device is configured to dissipate heat from the hot side of the secondary refrigeration device.

2. The refrigeration system of claim 1 further comprising one or more of the following refrigeration devices:

a tertiary refrigeration device;

a refrigerating device with more than three stages.

3. The refrigeration system according to claim 1 or 2, wherein said evaporator is connected in parallel to said primary refrigeration unit.

4. The refrigeration system as set forth in claim 3 wherein said evaporator is connected in parallel to said primary refrigeration unit by an electronic valve;

wherein the electronic valve is configured to control the cooling capacity of the evaporator through opening degree adjustment.

5. A refrigerator characterized by comprising a refrigeration system as claimed in any one of claims 1 to 4.

6. The refrigerator of claim 5, further comprising:

two or more compartments;

Wherein part of the compartments are cooled by the evaporator of the primary refrigeration device, and part of the compartments are cooled by the secondary refrigeration device.

7. A method for controlling a refrigerator, comprising:

8. The method of claim 7, further comprising:

and preferentially distributing cold to the evaporator connected with the secondary refrigeration device according to the temperature of the hot end of the secondary refrigeration device.

9. The method of claim 7, further comprising:

and determining the cold quantity required by each compartment to reach the preset temperature according to the temperature difference between the real-time temperature of each compartment and the preset temperature and the volume of each compartment.

10. The method as claimed in any one of claims 7 to 9, wherein said controlling the refrigeration distribution of the evaporator on the primary refrigeration unit comprises:

and controlling the ratio of the cold quantity distributed to each evaporator according to the ratio of the cold quantity required by each compartment.