CN113579555A - Zinc-aluminum flux-cored brazing filler metal for copper-aluminum brazing and preparation method thereof - Google Patents
Zinc-aluminum flux-cored brazing filler metal for copper-aluminum brazing and preparation method thereof Download PDFInfo
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- 238000005219 brazing Methods 0.000 title claims abstract description 120
- 229910000611 Zinc aluminium Inorganic materials 0.000 title claims abstract description 92
- HXFVOUUOTHJFPX-UHFFFAOYSA-N alumane;zinc Chemical compound [AlH3].[Zn] HXFVOUUOTHJFPX-UHFFFAOYSA-N 0.000 title claims abstract description 92
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 44
- 239000002184 metal Substances 0.000 title claims abstract description 44
- JRBRVDCKNXZZGH-UHFFFAOYSA-N alumane;copper Chemical compound [AlH3].[Cu] JRBRVDCKNXZZGH-UHFFFAOYSA-N 0.000 title claims abstract description 40
- 239000000945 filler Substances 0.000 title claims abstract description 39
- 238000002360 preparation method Methods 0.000 title claims abstract description 28
- 229910000679 solder Inorganic materials 0.000 claims abstract description 92
- 230000004907 flux Effects 0.000 claims abstract description 47
- 239000002131 composite material Substances 0.000 claims abstract description 29
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 28
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 28
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical group [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims abstract description 27
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 27
- 239000011701 zinc Substances 0.000 claims abstract description 27
- 229910000838 Al alloy Inorganic materials 0.000 claims abstract description 11
- 238000000034 method Methods 0.000 claims abstract description 11
- 229910001297 Zn alloy Inorganic materials 0.000 claims abstract description 6
- YBMRDBCBODYGJE-UHFFFAOYSA-N germanium dioxide Chemical compound O=[Ge]=O YBMRDBCBODYGJE-UHFFFAOYSA-N 0.000 claims description 20
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 18
- 150000002484 inorganic compounds Chemical class 0.000 claims description 16
- 229910010272 inorganic material Inorganic materials 0.000 claims description 16
- 239000000843 powder Substances 0.000 claims description 15
- 238000005096 rolling process Methods 0.000 claims description 15
- 229910052681 coesite Inorganic materials 0.000 claims description 13
- 229910052906 cristobalite Inorganic materials 0.000 claims description 13
- 239000000377 silicon dioxide Substances 0.000 claims description 13
- 229910052682 stishovite Inorganic materials 0.000 claims description 13
- 229910052905 tridymite Inorganic materials 0.000 claims description 13
- 238000010438 heat treatment Methods 0.000 claims description 12
- 229910007570 Zn-Al Inorganic materials 0.000 claims description 7
- 238000002156 mixing Methods 0.000 claims description 7
- 239000007787 solid Substances 0.000 claims description 7
- 239000011812 mixed powder Substances 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 238000013329 compounding Methods 0.000 claims description 2
- 229910052761 rare earth metal Inorganic materials 0.000 claims description 2
- 229910017767 Cu—Al Inorganic materials 0.000 claims 2
- 238000005476 soldering Methods 0.000 claims 1
- 238000011065 in-situ storage Methods 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 54
- 239000010949 copper Substances 0.000 description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 14
- 229910052802 copper Inorganic materials 0.000 description 14
- 239000000203 mixture Substances 0.000 description 12
- IOLCXVTUBQKXJR-UHFFFAOYSA-M potassium bromide Inorganic materials [K+].[Br-] IOLCXVTUBQKXJR-UHFFFAOYSA-M 0.000 description 12
- KLZUFWVZNOTSEM-UHFFFAOYSA-K Aluminum fluoride Inorganic materials F[Al](F)F KLZUFWVZNOTSEM-UHFFFAOYSA-K 0.000 description 11
- 239000000463 material Substances 0.000 description 10
- 238000002844 melting Methods 0.000 description 10
- 230000008018 melting Effects 0.000 description 10
- 229910045601 alloy Inorganic materials 0.000 description 9
- 239000000956 alloy Substances 0.000 description 9
- 229910000636 Ce alloy Inorganic materials 0.000 description 6
- HIPVTVNIGFETDW-UHFFFAOYSA-N aluminum cerium Chemical compound [Al].[Ce] HIPVTVNIGFETDW-UHFFFAOYSA-N 0.000 description 6
- 238000000498 ball milling Methods 0.000 description 5
- 238000001938 differential scanning calorimetry curve Methods 0.000 description 5
- 238000009736 wetting Methods 0.000 description 5
- 229910018125 Al-Si Inorganic materials 0.000 description 4
- 229910018520 Al—Si Inorganic materials 0.000 description 4
- 229910018530 Si-Ag Inorganic materials 0.000 description 4
- 229910018594 Si-Cu Inorganic materials 0.000 description 4
- 229910008383 Si—Ag Inorganic materials 0.000 description 4
- 229910008465 Si—Cu Inorganic materials 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- AHLATJUETSFVIM-UHFFFAOYSA-M rubidium fluoride Inorganic materials [F-].[Rb+] AHLATJUETSFVIM-UHFFFAOYSA-M 0.000 description 3
- 229910052684 Cerium Inorganic materials 0.000 description 2
- WLLURKMCNUGIRG-UHFFFAOYSA-N alumane;cerium Chemical compound [AlH3].[Ce] WLLURKMCNUGIRG-UHFFFAOYSA-N 0.000 description 2
- CSDREXVUYHZDNP-UHFFFAOYSA-N alumanylidynesilicon Chemical compound [Al].[Si] CSDREXVUYHZDNP-UHFFFAOYSA-N 0.000 description 2
- -1 aluminum-silicon copper Chemical compound 0.000 description 2
- 239000010953 base metal Substances 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 230000009972 noncorrosive effect Effects 0.000 description 2
- 238000003892 spreading Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 241001391944 Commicarpus scandens Species 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- UYFXWCIZFDKSTJ-UHFFFAOYSA-J aluminum;cesium;tetrafluoride Chemical compound [F-].[F-].[F-].[F-].[Al+3].[Cs+] UYFXWCIZFDKSTJ-UHFFFAOYSA-J 0.000 description 1
- 229910052792 caesium Inorganic materials 0.000 description 1
- TVFDJXOCXUVLDH-UHFFFAOYSA-N caesium atom Chemical compound [Cs] TVFDJXOCXUVLDH-UHFFFAOYSA-N 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 229910052729 chemical element Inorganic materials 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000003670 easy-to-clean Effects 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/28—Selection of soldering or welding materials proper with the principal constituent melting at less than 950 degrees C
- B23K35/286—Al as the principal constituent
- B23K35/288—Al as the principal constituent with Sn or Zn
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Powder Metallurgy (AREA)
- Nonmetallic Welding Materials (AREA)
Abstract
The invention belongs to the field of brazing filler metal, and particularly relates to a zinc-aluminum flux-cored brazing filler metal for copper-aluminum brazing and a preparation method thereof. The zinc-aluminum flux-cored solder for copper-aluminum brazing comprises a zinc-aluminum solder sheath, wherein the zinc-aluminum solder sheath wraps a brazing flux inner core, and comprises an inner layer wrapping the brazing flux inner core and an outer layer compounded on the inner layer; the inner layer is a zinc strip or a zinc alloy strip, the outer layer is an aluminum strip or an aluminum alloy strip, the inner layer and the outer layer are rolled and compounded together, and the inner layer and the outer layer form the zinc-aluminum brazing filler metal during brazing. The zinc-aluminum flux-cored solder for copper-aluminum brazing of the invention splits the zinc-aluminum solder into an inner layer and an outer layer composite form, the inner layer and the outer layer are rolled to form a composite belt, the form has good processing performance and high yield, and the inner layer and the outer layer are synthesized into the zinc-aluminum solder in situ in the brazing process, thereby not influencing the realization of the brazing performance of the zinc-aluminum solder.
Description
Technical Field
The invention belongs to the field of brazing filler metal, and particularly relates to a zinc-aluminum flux-cored brazing filler metal for copper-aluminum brazing and a preparation method thereof.
Background
Copper and its alloy have excellent conductivity, thermal conductivity, corrosion resistance and higher intensity, widely used in refrigeration, electric power, electron, aerospace and other fields. However, in recent years, copper resources are increasingly in short supply, and the price of copper is high, which seriously hinders the application of copper in these fields. The storage amount of aluminum in the earth crust is very rich, the price of the aluminum is only about 30% of that of copper, and meanwhile, the aluminum has the advantages of good electric conductivity, heat conductivity, light weight and the like, and the aluminum is considered to be a more ideal copper substitute material. In actual production, copper and aluminum are often used together in order to fully utilize the performance advantages of copper and aluminum and to achieve the best technical economy. The copper-aluminum dissimilar metal connection has very important significance for saving rare copper resources and light weight design of parts.
Copper and aluminum are far apart in a chemical element periodic table, the physical and chemical properties of the copper and aluminum are greatly different, the difference of the physical and chemical properties inevitably has important influence on the solderability of copper-aluminum dissimilar metals, and the selection of a proper brazing material is very important for realizing the reliable connection between the copper and aluminum dissimilar metals.
The eutectic point temperature of the zinc-aluminum brazing filler metal is 382 ℃, the melting temperature of the brazing filler metal can be controlled to be 380-500 ℃ according to the difference of aluminum content, the melting temperature of the brazing filler metal is obviously lower than that of an aluminum alloy base metal, and the problems of overburning and softening of the aluminum alloy base metal caused by overhigh melting temperature of the aluminum-silicon brazing filler metal are solved well. However, the zinc-aluminum solder has poor processability due to less metal crystal structure slippage system and poor plasticity, particularly has easy edge cracking and low yield in rolling, and particularly has low yield when being matched with a noncorrosive brazing flux-cored cesium fluoroaluminate to form the zinc-aluminum solder (the strap-shaped zinc-aluminum solder wraps brazing flux powder), the strap-shaped zinc-aluminum solder has low yield, is easy to break and generates waste products when being rolled and drawn to produce the flux-cored solder, the actual yield is even less than 50%, and the yield is lower for the flux-cored solder containing copper, silicon and other elements in the zinc-aluminum solder.
Disclosure of Invention
The invention aims to provide a zinc-aluminum flux-cored solder for copper-aluminum brazing, which solves the problem of poor processability of the conventional zinc-aluminum flux-cored solder.
The second purpose of the invention is to provide a preparation method of the zinc-aluminum flux-cored solder for copper-aluminum brazing.
In order to realize the purpose, the technical scheme of the zinc-aluminum flux-cored solder for copper-aluminum brazing is as follows:
a zinc-aluminum flux-cored brazing filler metal for copper-aluminum brazing comprises a zinc-aluminum brazing filler metal sheath, wherein the zinc-aluminum brazing filler metal sheath wraps a brazing flux inner core, and comprises an inner layer wrapping the brazing flux inner core and an outer layer compounded on the inner layer;
the inner layer is a zinc strip or a zinc alloy strip, the outer layer is an aluminum strip or an aluminum alloy strip, the inner layer and the outer layer are rolled and compounded together, and the inner layer and the outer layer form the zinc-aluminum brazing filler metal during brazing.
The zinc-aluminum flux-cored brazing filler metal for copper-aluminum brazing is split into an inner layer and an outer layer in a composite form, the inner layer and the outer layer are rolled to form a composite strip, the form has good processability and high yield, and the inner layer and the outer layer are synthesized into the zinc-aluminum (series) brazing filler metal in situ in the brazing process, so that the realization of the brazing performance of the zinc-aluminum brazing filler metal is not influenced.
On the premise that the zinc-aluminum brazing filler metal meeting the requirements is formed by combining the outer layer and the inner layer, the alloy elements are respectively distributed to the inner layer and the outer layer. Preferably, the outer layer consists of the following components in percentage by mass: 81-100% of Al, 0-12% of Si, 0-3% of Cu, 0-3% of Ag and 0-1% of rare earth elements. The zinc-aluminum brazing filler metal with various components can be prepared by adopting the method, so that the active temperature range of the inorganic compound is adapted, and the use temperature range of the zinc-aluminum flux-cored brazing filler metal is expanded.
Preferably, the thickness of the inner layer is 0.13 to 10 times the thickness of the outer layer. More preferably, the thickness ratio of the inner layer to the outer layer is (0.05-0.1): (0.15 to 0.20); more preferably (0.07 to 0.09): (0.16-0.19).
Preferably, the brazing flux inner core consists of the following components in percentage by mass: CsAlF4 88％～100％，KBr 0％～5％，RbF 0％～5％，GeO2 0％～1％，SiO20 to 1 percent. The main component of the brazing flux inner core is CsAlF4(CsF-AlF3Cesium fluoroaluminate), KBr, RbF, GeO2、SiO2And the like, improve the activity of inorganic compounds, and can be used for brazing aluminum alloy and copper with low magnesium content. Meanwhile, the copper-aluminum brazing filler metal is provided with the non-corrosive brazing flux, the brazing flux is automatically, accurately and quantitatively added in the brazing process, and a brazed joint of a welded workpiece is free of corrosion and easy to clean.
Preferably, the diameter of the brazing flux inner core is 0.01-20 mm. Can be 0.1-10 mm, 1-5 mm, etc. The weight of the brazing flux inner core accounts for 4-20% of the total weight of the zinc-aluminum flux-cored brazing filler metal. May be 5% to 10%, 7% to 10%, etc.
Preferably, the cross section of the zinc-aluminum flux-cored solder is circular or polygonal.
Preferably, the zinc-aluminum flux-cored solder is a seamed flux-cored solder. For example, the braze alloy sheath may be formed from a strip of braze alloy rolled to have overlapping seams.
The preparation method of the zinc-aluminum flux-cored solder for copper-aluminum brazing comprises the following steps:
1) rolling and compounding the zinc strip or the zinc alloy strip serving as the inner layer and the aluminum strip or the aluminum alloy strip serving as the outer layer to form a zinc-aluminum composite strip;
mixing inorganic compound powder used as a brazing flux inner core uniformly, heating at 100-200 ℃, and crushing the formed solid to prepare mixed powder;
2) and (3) coating the mixed powder with a zinc-aluminum composite belt, closing the opening and drawing.
Compared with the traditional zinc-aluminum flux-cored solder, the preparation method of the zinc-aluminum flux-cored solder for copper-aluminum brazing has the advantages of greatly improving the production efficiency, saving energy and protecting environment.
In the step 2), the flux-cored solder can be formed by referring to the prior art, as an exemplary form, a zinc-aluminum composite strip can be rolled to form a U-shaped strip with an opening at one end, the mixed powder is fed into the U-shaped strip, and the copper-aluminum brazing material is formed through the processes of closing, drawing, straightening and the like.
Preferably, in the step 1), the heating time is 0.5h to 1.0 h. The brazing flux powder can be mixed more uniformly through the processes of heating and crushing.
Preferably, in the step 1), the particle size of the mixed powder is 200-300 meshes.
Drawings
FIG. 1 is a schematic structural diagram of a zinc-aluminum flux-cored solder for copper-aluminum brazing according to the present invention;
wherein, 1-brazing flux inner core, 2-outer layer, and 3-inner layer.
Detailed Description
The following further describes embodiments of the present invention with reference to the drawings.
Specific embodiment of the zinc-aluminum flux-cored solder for copper-aluminum brazing
Example 1
The zinc-aluminum flux-cored solder for copper-aluminum brazing in the embodiment has a structural schematic diagram shown in fig. 1, and comprises a solder alloy sheath and a flux core 1 wrapped by the solder alloy sheath, wherein the solder alloy sheath comprises an outer layer 2 and an inner layer 3 which are sequentially arranged from outside to inside, and the outer layer 2 and the inner layer 3 are compounded into a whole. The zinc-aluminum flux-cored solder is a seamed flux-cored solder, the cross section of the zinc-aluminum flux-cored solder is circular, and the alloy sheath of the zinc-aluminum flux-cored solder is provided with a lap joint seam formed in the forming process.
The outer layer 2 is an aluminum-cerium alloy strip (containing 0.05% of Ce and the balance of Al) with the thickness of 0.16mm, the inner layer 3 is a pure zinc strip with the thickness of 0.09mm, and the aluminum-cerium alloy strip (containing 0.05% of Ce) and the pure zinc strip are rolled and compounded to form the Zn-Al-Ce composite strip.
The brazing flux inner core is prepared from the following inorganic compound powder in percentage by mass: CsF-AlF3 90％、KBr 4.5％、RbF4.5％、GeO20.5％、SiO20.5％。
The diameter of the zinc-aluminum flux-cored solder is 2.0 mm. The diameter of the brazing flux inner core is 1.5mm, and the weight of the brazing flux inner core accounts for 9.4% of the total weight of the zinc-aluminum flux-cored brazing filler metal.
Example 2
The zinc-aluminum flux-cored solder for copper-aluminum brazing in the embodiment has the same structure as the zinc-aluminum flux-cored solder in the embodiment 1, and the difference is only that:
the brazing flux inner core is prepared from the following inorganic compound powder in percentage by mass: CsF-AlF3 95％、KBr 2.0％、RbF 2.0％、GeO2 0.5％、SiO2 0.5％。
The diameter of the zinc-aluminum flux-cored solder is 2.0 mm. The diameter of the brazing flux inner core is 1.5mm, and the weight of the brazing flux inner core accounts for 9.4% of the total weight of the zinc-aluminum flux-cored brazing filler metal.
Example 3
The zinc-aluminum flux-cored solder for copper-aluminum brazing in the embodiment has the same structure as the zinc-aluminum flux-cored solder in the embodiment 1, and the difference is only that:
the outer layer is an Al88Si12 aluminum strip with the thickness of 0.18mm, the inner layer is a pure zinc strip with the thickness of 0.08mm, and the Al88Si12 aluminum strip and the pure zinc strip are rolled and compounded to form the Zn-Al-Si composite strip.
The brazing flux inner core is prepared from the following inorganic compound powder in percentage by mass: CsF-AlF3 97％、KBr 1.0％、RbF1.0％、GeO2 0.5％、SiO2 0.5％。
The diameter of the zinc-aluminum flux-cored solder is 2.0 mm. The diameter of the brazing flux inner core is 1.48mm, and the weight of the brazing flux inner core accounts for 8.9 percent of the total weight of the zinc-aluminum flux-cored brazing filler metal.
Example 4
The zinc-aluminum flux-cored solder for copper-aluminum brazing in the embodiment has the same structure as the zinc-aluminum flux-cored solder in the embodiment 1, and the difference is only that:
the outer layer is an Al88Si11Cu1 aluminum strip with the thickness of 0.19mm, the inner layer is a pure zinc strip with the thickness of 0.07mm, and the Al88Si11Cu1 aluminum strip and the pure zinc strip are rolled and compounded to form the Zn-Al-Si-Cu composite strip.
The brazing flux inner core is prepared from the following inorganic compound powder in percentage by mass: CsF-AlF3 96％、KBr 2.0％、RbF1.0％、GeO2 0.5％、SiO2 0.5％。
The diameter of the zinc-aluminum flux-cored solder is 2.0 mm. The diameter of the brazing flux inner core is 1.48mm, and the weight of the brazing flux inner core accounts for 8.2% of the total weight of the zinc-aluminum flux-cored brazing filler metal.
Example 5
The zinc-aluminum flux-cored solder for copper-aluminum brazing in the embodiment has the same structure as the zinc-aluminum flux-cored solder in the embodiment 1, and the difference is only that:
the outer layer is an Al88Si11Ag1 aluminum strip with the thickness of 0.18mm, the inner layer is a pure zinc strip with the thickness of 0.08mm, and the Al88Si11Ag1 aluminum strip and the pure zinc strip are rolled and compounded to form the Zn-Al-Si-Ag composite strip.
The brazing flux inner core is prepared from the following inorganic compound powder in percentage by mass: CsF-AlF3 96％、KBr 1.0％、RbF2.0％、GeO2 0.5％、SiO2 0.5％。
The diameter of the zinc-aluminum flux-cored solder is 2.0 mm. The diameter of the brazing flux inner core is 1.48mm, and the weight of the brazing flux inner core accounts for 8.3 percent of the total weight of the zinc-aluminum flux-cored brazing filler metal.
In other embodiments of the zinc-aluminum flux-cored solder for copper-aluminum brazing of the invention, the outer layer can be in other forms, such as a pure aluminum tape, an Al84Si10Cu3Ag3 aluminum alloy tape, an Al81Si12Cu3Ag3Ce1 aluminum alloy tape; or an outer layer aluminum alloy belt (or a pure aluminum belt) and an inner layer zinc alloy belt are adopted.
Secondly, the specific embodiment of the preparation method of the zinc-aluminum flux-cored solder for copper-aluminum brazing
Example 6
The preparation method of the zinc-aluminum flux-cored solder for copper-aluminum brazing in this embodiment describes in detail the preparation process of the zinc-aluminum flux-cored solder in embodiment 1, and specifically includes the following steps:
1) selecting an aluminum-cerium alloy strip (containing 0.05 percent of Ce) with the thickness of 0.2mm, wherein the thickness of a pure zinc strip is 0.1mm, rolling the aluminium-cerium alloy strip by a precision rolling mill for multiple times to form a Zn-Al-Ce composite strip with the thickness of a zinc layer of 0.09mm and the thickness of an aluminum-cerium layer of 0.16mm, measuring a DSC curve of the Zn-Al composite strip by adopting a model STA449F3 comprehensive thermal analyzer produced by Germany NETZSCH company, and measuring the melting temperature of the Zn-Al composite strip to be 426.7-540.6 ℃; the inorganic compound component is CsF-AlF3 90％、KBr 4.5％、RbF4.5％、GeO20.5％、SiO20.5 percent, uniformly mixing the materials by using a V-shaped mixer, putting the mixture into an oven, heating the mixture for 0.5 hour at the temperature of 150 ℃, and performing ball milling on the formed solid to obtain 250-mesh powder;
2) the zinc layer is upward, the composite strip is rolled for a plurality of times to form a U-shaped strip, the inorganic compound is continuously sent into the U-shaped strip, and the copper-aluminum brazing material with the diameter of 2.0mm is formed through the working procedures of closing, drawing, straightening and the like.
Example 7
The preparation method of the zinc-aluminum flux-cored solder for copper-aluminum brazing in this embodiment describes in detail the preparation process of the zinc-aluminum flux-cored solder in embodiment 2, and the preparation process is basically the same as that in embodiment 6, except that:
selecting an aluminum-cerium alloy strip (containing 0.05 percent of Ce) with the thickness of 0.2mm, wherein the thickness of a pure zinc strip is 0.1mm, rolling the aluminium-cerium alloy strip by a precision rolling mill for multiple times to form a Zn-Al-Ce composite strip with the thickness of a zinc layer of 0.09mm and the thickness of an aluminum-cerium layer of 0.16mm, measuring a DSC curve of the Zn-Al composite strip by adopting a model STA449F3 comprehensive thermal analyzer produced by Germany NETZSCH company, and measuring the melting temperature of the Zn-Al composite strip to be 426.7-540.6 ℃; the inorganic compound component is CsF-AlF3 95％、KBr 2.0％、RbF2.0％、GeO20.5％、SiO20.5 percent, uniformly mixing the materials by using a V-shaped mixer, putting the mixture into an oven, heating the mixture for 0.5 hour at the temperature of 150 ℃, and ball-milling and crushing the formed solid to form 250-mesh powder.
Example 8
The preparation method of the zinc-aluminum flux-cored solder for copper-aluminum brazing in this embodiment describes in detail the preparation process of the zinc-aluminum flux-cored solder in embodiment 3, and the preparation process is basically the same as that in embodiment 6, except that:
selecting an Al88Si12 aluminum strip with the thickness of 0.2mm, wherein the thickness of the pure zinc strip is 0.1mm, rolling the pure zinc strip by a precision rolling mill for multiple times to form a Zn-Al-Si composite strip with the thickness of a zinc layer of 0.08mm and the thickness of an aluminum silicon layer of 0.18mm, measuring a DSC curve of the Zn-Al-Si composite strip by adopting a model STA449F3 comprehensive thermal analyzer produced by Germany NETZSCH company, and measuring the melting temperature of the Zn-Al-Si composite strip to be 447.9-527.2 ℃; the inorganic compound component is CsF-AlF3 97％、KBr 1.0％、RbF1.0％、GeO20.5％、SiO20.5 percent, uniformly mixing the materials by using a V-shaped mixer, putting the mixture into an oven, heating the mixture for 0.5 hour at the temperature of 150 ℃, and ball-milling and crushing the formed solid to form 250-mesh powder.
Example 9
The preparation method of the zinc-aluminum flux-cored solder for copper-aluminum brazing in this embodiment describes in detail the preparation process of the zinc-aluminum flux-cored solder in embodiment 4, which is basically the same as that in embodiment 6, except that:
selecting an Al88Si11Cu1 aluminum strip with the thickness of 0.2mm, wherein the thickness of a pure zinc strip is 0.1mm, rolling the pure zinc strip by a precision rolling mill for multiple times to form a Zn-Al-Si-Cu composite strip with the thickness of a zinc layer of 0.07mm and the thickness of an aluminum-silicon copper layer of 0.19mm, measuring a DSC curve of the Zn-Al-Si-Cu composite strip by adopting a model STA449F3 comprehensive thermal analyzer produced by Germany NETZSCH company, and measuring the melting temperature of the Zn-Al-Si-Cu composite strip to be 453.4-519.7 ℃; the inorganic compound component is CsF-AlF3 96％、KBr 2.0％、RbF1.0％、GeO20.5％、SiO20.5 percent, uniformly mixing the materials by using a V-shaped mixer, putting the mixture into an oven, heating the mixture for 0.5 hour at the temperature of 150 ℃, and ball-milling and crushing the formed solid to form 250-mesh powder.
Example 10
The preparation method of the zinc-aluminum flux-cored solder for copper-aluminum brazing in this embodiment describes in detail the preparation process of the zinc-aluminum flux-cored solder in example 5, and the preparation process is basically the same as that in example 6, except that:
selecting an Al88Si11Ag1 aluminum strip with the thickness of 0.2mm, wherein the thickness of a pure zinc strip is 0.1mm, rolling the pure zinc strip by a precision rolling mill for multiple times to form a Zn-Al-Si-Ag composite strip with the thickness of a zinc layer of 0.08mm and the thickness of an aluminum-silicon-silver layer of 0.18mm, measuring a DSC curve of the Zn-Al-Si-Ag composite strip by adopting a model STA449F3 comprehensive thermal analyzer produced by Germany NETZSCH company, and measuring the melting temperature of the Zn-Al-Si-Ag composite strip to be 449.2-524.6 ℃; the inorganic compound component is CsF-AlF3 96％、KBr 1.0％、RbF2.0％、GeO20.5％、SiO20.5 percent, uniformly mixing the materials by using a V-shaped mixer, putting the mixture into an oven, heating the mixture for 0.5 hour at the temperature of 150 ℃, and ball-milling and crushing the formed solid to form 250-mesh powder.
In other embodiments, the heating condition can be adjusted to 100 ℃ for 1.0h, or 200 ℃ for 0.5h, and the effect is comparable.
Third, Experimental example
Experimental example 1 experiment of production efficiency and yield
Taking the flux cored solder of example 1 as an example, the conventional process of the flux cored solder (the outer skin is a single layer solder alloy) having the same overall composition as that of example 1 includes the steps of melting, extruding, rolling, powder coating, and the like. The preparation efficiency is the weight of the finished product per unit time; the yield is the weight of the finished flux-cored solder produced by the metal belt per unit weight.
The comparison was carried out with the same overall composition, and the results were:
the preparation efficiency of the flux-cored solder in the embodiment 1 is improved by 126%, and the yield is improved by 63%.
The preparation efficiency of the flux-cored solder in the embodiment 2 is improved by 126%, and the yield is improved by 63%.
The preparation efficiency of the flux-cored solder in the embodiment 3 is improved by 175%, and the yield is improved by 79%.
The preparation efficiency of the flux-cored solder in the embodiment 4 is improved by 183%, and the yield is improved by 74%.
The preparation efficiency of the flux-cored solder in the embodiment 5 is improved by 149%, and the yield is improved by 78%.
Experimental example 2 wettability experiment
Taking the flux-cored solder in example 1 as an example for explanation, the solder material in example 1 and the solder with the same components prepared by traditional melting, extrusion and rolling are subjected to a wettability comparison test according to the national standard GB/T11364-2008 solder wettability test method.
200mg of the prepared brazing filler metal is placed in the center of a pure aluminum plate with the thickness of 2mm and the thickness of 40mm multiplied by 40 mm; for comparison, a matrix solder was covered with an inorganic compound flux of the same mass as the solder prepared, the flux plus matrix solder (sheet) weight was 200mg, placed in the center of a pure aluminum plate of 40mm x 40mm and 2mm thickness. The brazing filler metal is respectively placed into an RSL-5 wetting furnace for heating, the temperature is kept for 40-50 s after the brazing filler metal is melted, the brazing filler metal is cleaned after being naturally cooled at room temperature, the wetting area of the brazing filler metal prepared by the calculation method is almost the same, and the result shows that the brazing filler metal prepared by the embodiment 1 of the invention has the same wetting spreading performance as the brazing filler metal prepared by the traditional method.
The wettability effect of the flux-cored solder of the embodiment 2-4 is tested by adopting the experimental method, and the actual wetting area is calculated to be almost the same as that of the traditional solder, so that the novel flux-cored solder does not influence the realization of wetting and spreading performance.
Claims (10)
1. The zinc-aluminum flux-cored brazing filler metal for copper-aluminum brazing is characterized by comprising a zinc-aluminum brazing filler metal sheath, wherein the zinc-aluminum brazing filler metal sheath wraps a brazing flux inner core, and comprises an inner layer wrapping the brazing flux inner core and an outer layer compounded on the inner layer;
the inner layer is a zinc strip or a zinc alloy strip, the outer layer is an aluminum strip or an aluminum alloy strip, the inner layer and the outer layer are rolled and compounded together, and the inner layer and the outer layer form the zinc-aluminum brazing filler metal during brazing.
2. The zinc-aluminum flux-cored solder for copper-aluminum brazing as claimed in claim 1, wherein the outer layer consists of the following components in percentage by mass: 81-100% of Al, 0-12% of Si, 0-3% of Cu, 0-3% of Ag and 0-1% of rare earth elements.
3. The zinc-aluminum flux cored solder for copper-aluminum brazing as claimed in claim 1 or 2, wherein the thickness of the inner layer is 0.13 to 10 times as thick as the outer layer.
4. The zinc-aluminum flux-cored solder for copper-aluminum brazing as claimed in claim 1, wherein the flux core consists of the following components in percentage by mass: CsAlF4 88％～100％，KBr 0％～5％，RbF 0％～5％，GeO2 0％～1％，SiO2 0％～1％。
5. The Zn-Al flux-cored solder for Cu-Al soldering as claimed in claim 1, wherein the diameter of the flux core is 0.01 to 20 mm.
6. The Zn-Al flux-cored solder for Cu-Al brazing as claimed in claim 1, 4 or 5, wherein the weight of the flux core is 4-20% of the total weight of the Zn-Al flux-cored solder.
7. The zinc-aluminum flux cored solder for copper-aluminum brazing as claimed in claim 1, 2, 4 or 5, wherein the cross section of the zinc-aluminum flux cored solder is circular or polygonal.
8. The zinc-aluminum flux cored solder for copper-aluminum brazing as claimed in claim 1, 2, 4 or 5, wherein the zinc-aluminum flux cored solder is a seamed flux cored solder.
9. A preparation method of the zinc-aluminum flux-cored solder for copper-aluminum brazing as claimed in any one of claims 1 to 8, characterized by comprising the following steps:
1) rolling and compounding the zinc strip or the zinc alloy strip serving as the inner layer and the aluminum strip or the aluminum alloy strip serving as the outer layer to form a zinc-aluminum composite strip;
mixing inorganic compound powder used as a brazing flux inner core uniformly, heating at 100-200 ℃, and crushing the formed solid to prepare mixed powder;
2) and (3) coating the mixed powder with a zinc-aluminum composite belt, closing the opening and drawing.
10. The method for preparing the zinc-aluminum flux cored solder for copper-aluminum brazing as claimed in claim 9, wherein in the step 1), the heating time is 0.5h to 1.0 h.
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