CN113579442B

CN113579442B - Double-interface module electrical connection material and preparation method and application thereof

Info

Publication number: CN113579442B
Application number: CN202111132220.6A
Authority: CN
Inventors: 朱林; 陈长军; 季元鸿; 蔡雄辉
Original assignee: New Henghui Electronics Co ltd
Current assignee: New Henghui Electronics Co ltd
Priority date: 2021-09-27
Filing date: 2021-09-27
Publication date: 2022-02-08
Anticipated expiration: 2041-09-27
Also published as: CN113579442A

Abstract

The invention relates to a double-interface module electrical connection material, a preparation method and application thereof, belonging to the technical field of communication electricity. The double-interface module electrical connection material is a mixture of alloy soldering paste and polymer microspheres which can expand in volume after being heated; the mixing mass ratio of the alloy soldering paste to the polymer microspheres which can expand in volume after being heated is 20 (0.1-20). The application of the double-interface module electrical connection material is that the volatile solvent in the double-interface module electrical connection material is removed, then the double-interface module electrical connection material is applied to the via hole for filling, the salient point is formed outside the via hole, and the butt-welding conduction between the antenna and the module is realized. The double-interface module electrical connecting material realizes butt-welding conduction of the antenna and the module and improves the yield; the invention also provides a simple and easy preparation method and application.

Description

Double-interface module electrical connection material and preparation method and application thereof

Technical Field

The invention relates to a double-interface module electrical connection material, a preparation method and application thereof, belonging to the technical field of communication electricity.

Background

The dual-interface module can simultaneously realize communication in a contact mode and a non-contact mode, wherein the non-contact mode is mainly realized by utilizing a radio frequency function, so that the dual-interface module needs to be electrically interconnected with a radio frequency antenna to transmit data when non-contact communication is realized.

The traditional connection between the dual-interface module and the antenna generally adopts conductive rubber or solder paste, solder sheets and the like, but the methods have defects such as low yield, poor reliability, low production efficiency and the like. As shown in fig. 1, the non-bonding pads on the chip are connected to C4, C8 through Au wires, and C4, C8 are connected to via holes L1, L2 through contact surfaces, respectively. The card is electrically interconnected with the antenna through the L2 and the L1 by adopting the method.

The finished product yield of the traditional conductive rubber is low, and the problem of open circuit is easily caused due to the fact that the volume of soldering paste shrinks in the reflow process by adopting the common solder, so that the antenna cannot be normally butt-welded.

Disclosure of Invention

The technical problem to be solved by the invention is to overcome the defects in the prior art and provide a double-interface module electrical connecting material, which realizes butt-welding conduction between an antenna and a module and improves the yield; the invention also provides a simple and easy preparation method and application.

The double-interface module electrical connection material is a mixture of alloy soldering paste and polymer microspheres capable of expanding in volume after being heated.

The mixing proportion of the polymer microspheres capable of expanding in volume after being heated and the alloy soldering paste can be determined according to the volume required to expand. The volume to be expanded is large, so that the number of expandable polymer microspheres is large, specifically, the volume can be quantitatively measured through the thermal expansion coefficient or the volume expansion rate, and the mixing mass ratio of the alloy solder paste and the polymer microspheres capable of expanding in volume after heating is preferably 20 (0.1-20).

The polymer microsphere capable of expanding in volume after heating can be selected according to the melting point of the alloy soldering paste, the highest temperature of the process, the aperture to be filled and the heat resistance, such as EXpancel DU, F-190D and the like, and has different particle sizes, heating volume expansion starting points and heat resistance.

The alloy solder paste can be a common solder paste on the market, such as tin-lead, tin-silver-copper, tin-bismuth, etc., or other single metal solder paste, such as tin paste, etc., and is further preferably 980DU 120. These general purpose solder pastes consist of alloy solder powder, flux, solvent, etc. The aperture of the hole to be filled determines the particle size of the solder powder of the alloy solder paste, and generally the maximum particle size of the solder powder should be less than one tenth of the filling aperture.

The preparation method of the double-interface module electrical connection material comprises the following steps:

and adding the polymer microspheres which can expand in volume after being heated into the alloy soldering paste, and dispersing at a high speed to obtain the double-interface module electrical connection material.

The stirring speed in the high-speed dispersion is 100-20000r/min, preferably 2000-6000 r/min.

In order to uniformly disperse the polymer microspheres, a volatile solvent can be added into the alloy solder paste to reduce the viscosity, and then the polymer microspheres are dispersed, and the volatile solvent is removed before use.

And applying the double-interface module electrical connection material to the via hole for filling, forming salient points outside the via hole, and realizing butt welding conduction between the antenna and the module.

Compared with the prior art, the invention has the following beneficial effects:

(1) the invention adopts a novel connecting material, namely a butt-welding material, to fill the via hole, when the card is manufactured and hot pressed, the material can expand by the heated material, and a salient point is formed outside the via hole, so that the antenna and the module are smoothly butt-welded and communicated;

(2) according to the invention, the expansion coefficient of the material can be adjusted, and the heated material can expand by 110-150 μm, so that the problem that the traditional soldering paste cannot be subjected to butt welding after being heated and sunken is solved, the risk of card making and circuit breaking is reduced, and the yield is improved;

(3) the preparation method of the connecting material is simple and easy to implement, and is beneficial to industrial application;

(4) the connecting material of the invention is applied without equipment transformation, thus reducing the cost investment.

Drawings

FIG. 1 is a schematic view of a substrate structure for connecting material applications;

FIG. 2 is a schematic view showing the application of a conventional connecting material;

FIG. 3 is a schematic view of the application of the jointing material according to the present invention;

wherein a is a traditional connecting material; b is the connecting material of the invention.

Detailed Description

The present invention will be further described with reference to comparative examples and examples.

All the starting materials used in the examples are commercially available, except where otherwise indicated.

Example 1

A double-interface module electrical connection material is a mixture of alloy soldering paste and polymer microspheres capable of expanding in volume after being heated, wherein the alloy soldering paste is tin-lead paste, the polymer microspheres are EXpancel DU (produced by Novon Japan), and the mixing mass ratio of the alloy soldering paste to the polymer microspheres is 20: 0.1.

adding toluene serving as a volatile solvent into the alloy soldering paste to reduce the viscosity of the soldering paste, adding polymer microspheres capable of expanding in volume after being heated, and dispersing at a high speed at a stirring speed of 3500r/min to obtain the double-interface module electrical connection material.

And removing the volatile solvent in the connecting material, silk-screening the connecting material on a module with a through hole L2 and a through hole L1 with the aperture of 2 mm and the hole depth of 90 microns, and reflowing at 200 ℃ until the thickness of the solder is 110 microns.

Example 2

A double-interface module electrical connection material is a mixture of alloy soldering paste and polymer microspheres capable of expanding in volume after being heated, wherein the alloy soldering paste is tin-silver-copper soldering paste, the polymer microspheres are F-190D (produced by Japan Songban), and the mixing mass ratio of the alloy soldering paste to the polymer microspheres is 20: 1.

adding volatile solvent alcohol into the alloy soldering paste to reduce the viscosity of the soldering paste, then adding the polymer microspheres which can expand in volume after being heated, and dispersing at high speed at the stirring speed of 2000r/min to obtain the double-interface module electrical connection material.

And removing the volatile solvent in the connecting material, silk-screening the connecting material on a module with a via hole L2 and a via hole L1 with the aperture of 2.5 mm and the hole depth of 130 microns, and reflowing at 200 ℃ to change the thickness of the solder into 150 microns.

Example 3

A double-interface module electrical connection material is a mixture of alloy soldering paste and polymer microspheres capable of expanding in volume after being heated, wherein the alloy soldering paste is tin-lead paste, the polymer microspheres are EXpancel DU (produced by Novon Japan), and the mixing mass ratio of the alloy soldering paste to the polymer microspheres is 1: 1.

and adding the polymer microspheres which can expand in volume after being heated into the alloy soldering paste, and dispersing at a high speed at a stirring speed of 6000r/min to obtain the double-interface module electrical connection material.

The connection material was screen printed on a die having a via hole L2 and L1 with a hole diameter of 3 mm and a hole depth of 150 μm, and after reflowing at 200 c, the solder thickness became 170 μm.

Claims

1. A dual interface modular electrical connection material, comprising: the material is a mixture of alloy soldering paste and polymer microspheres which can expand in volume after being heated; the mixing mass ratio of the alloy soldering paste to the polymer microspheres which can expand in volume after being heated is 20 (0.1-20);

the polymer microsphere which can expand in volume after being heated is EXpancel DU or F-190D;

2. The dual interface modular electrical connection material of claim 1, wherein: the alloy soldering paste is tin-lead soldering paste or tin-silver-copper soldering paste.

3. A method for preparing the electrical connection material of the dual interface module as claimed in claim 1 or 2, wherein: the method comprises the following steps:

4. The method of making a dual interface modular electrical connection material of claim 3, wherein: the stirring speed is 100-.

5. The method of making a dual interface modular electrical connection material of claim 4, wherein: the stirring speed in the high-speed dispersion is 2000-6000 r/min.