CN113573491B - Material replacing machine of surface mounted device and automatic material replacing method - Google Patents
Material replacing machine of surface mounted device and automatic material replacing method Download PDFInfo
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- CN113573491B CN113573491B CN202111129708.3A CN202111129708A CN113573491B CN 113573491 B CN113573491 B CN 113573491B CN 202111129708 A CN202111129708 A CN 202111129708A CN 113573491 B CN113573491 B CN 113573491B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/225—Correcting or repairing of printed circuits
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Abstract
The invention provides a material replacing machine of a patch device and an automatic material replacing method, which are used for replacing a PCB (printed circuit board) needing to be re-patch, and comprise the following steps: a bottom support; the tin absorbing device is fixed on the bottom support; the tin dispensing device is fixed on the bottom support; the control device is connected with the bottom support and used for controlling the bottom support to rotate so that the tin absorbing device can absorb tin on unqualified chip mounting points on the heated PCB, and after the tin absorbing operation, the control device controls the bottom support to be switched to the tin dispensing device and performs tin dispensing operation on the unqualified chip mounting points; the control device controls the bottom support to rotate so that the tin suction device and the tin dispensing device can automatically convert a tin suction mode and a tin dispensing mode, and therefore the material changing process is automatic. The automatic material changing device has the advantages of good automatic material changing effect, cost saving and high production efficiency.
Description
Technical Field
The invention relates to the technical field of circuit maintenance equipment, in particular to a material replacing machine of a surface mounted device and an automatic material replacing method.
Background
The SMT sheet refers to a short name of a series of process flows processed on the basis of a PCB (printed Circuit board), which is a printed Circuit board. SMT is a Surface Mounted Technology (abbreviation for Surface Mounted Technology) that is one of the most popular techniques and processes in the electronic assembly industry.
The traditional Surface Mount Technology (SMT) process comprises the steps of material preparation, tin paste filling, tin brushing, surface mounting, backflow, rear end inspection and manual maintenance. After obtaining the production order, the material staff must prepare the required SMT material according to the list, and cut the foot or pin integer according to the technological requirement, and at the same time, the tin brushing machine is loaded with tin cream, and the paster template and the steel mesh are installed and corrected. After the tin brushing machine starts to operate, brushing tin at the position shown by the template on a Printed Circuit Board (PCB). And after the tin brushing is finished, the PCB enters a high-speed chip mounter for chip mounting SMT, and after the tin brushing is finished, the PCB enters a reflow soldering machine for preheating, heat preservation, reflow soldering and cooling. And after the reflow is finished, the PCB is subjected to back end inspection, including solder joint inspection and optical detector inspection. If meet defects such as insufficient tin cream, welding short circuit and perk foot, send the PCB board of defect to artifical maintenance department and weld again, maintenance personal need heat problem PCB board again, gets rid of waste material and tin scrap, and the tin thick liquid of dotting with a glance at again places the paster device, heats through the welding bench, carries out solder joint again after the cooling and detects, waits to detect and carries out aftertreatment packing etc. on next step again after passing.
However, in the mounting process, after the problems of single-end welding of the component, component displacement and the like are detected at the rear end, the PCB with problems can only be sent to a manual maintenance place for re-welding, so that the problems of insufficient automation and labor cost in the material changing process exist, and meanwhile, if the large-range material changing is met, the manual maintenance and material changing efficiency is low, and mistakes are easy to make.
Therefore, there is a need to provide a new feeding machine for patch devices and a method for automatically feeding patch devices to solve the above-mentioned technical problems.
Disclosure of Invention
The invention aims to overcome at least one technical problem and provides a replacing machine of a chip mounting device, which can automatically convert tin absorption and tin point so as to improve the processing efficiency of a PCB (printed circuit board).
In order to achieve the above object, in a first aspect, the present invention provides a reloading machine for a chip mounter, for reloading a PCB board requiring chip mounting again, including:
a bottom support;
the tin absorbing device is fixed on the bottom support;
the tin dispensing device is fixed on the bottom support;
the control device is connected with the bottom support and used for controlling the bottom support to rotate so that the tin suction device can suck tin on unqualified chip mounting points on the heated PCB, and after the tin suction operation, the control device controls the bottom support to be switched to the tin spot welding device and carries out tin spot welding on the unqualified chip mounting points.
Furthermore, the tin dispensing device comprises a tin dispensing gun body, a tin dispensing gun head and a tin feeding pump, wherein one end of the tin dispensing gun body is fixed on the bottom support, a hollow tin dispensing channel is formed in the tin dispensing gun body, the tin dispensing gun head is fixedly arranged at one end, far away from the bottom support, of the tin dispensing gun body and is communicated with the hollow tin dispensing channel, and the tin feeding pump is positioned at one end, close to the bottom support, of the tin dispensing gun body and is communicated with the hollow tin dispensing channel;
and the tin feeding pump is used for providing tin materials for the tin dispensing gun head through the hollow tin absorbing channel so as to enable the tin dispensing gun head to perform tin dispensing operation.
Furthermore, the tin dotting device further comprises a flow control component arranged in the hollow tin dotting channel, the flow control component divides the hollow tin dotting channel into a discharging channel and a feeding channel, the tin dotting gun head is communicated with the discharging channel, the tin pump is communicated with the feeding channel, and the flow control component is used for controlling the connection and disconnection of the discharging channel and the feeding channel.
Furthermore, the tin dotting device also comprises a channel tube;
the flow control component is including locating in the hollow point tin passageway and with the hollow point tin passageway is separated for discharging channel and feedstock channel's butterfly-shaped channel switch, set up in controller on the butterfly-shaped channel switch, with butterfly-shaped channel switch connects and is located soft supporter in the feedstock channel with wrap up in soft supporter is internal is hourglass hopper-shaped's inner tube, the inner tube passes through the channel pipe with send the tin pump intercommunication, the controller is used for controlling opening and closing of butterfly-shaped channel switch, and then control discharging channel with feedstock channel's intercommunication and disconnection.
Furthermore, the tin absorbing device comprises a tin absorbing gun body, a tin absorbing gun head and an air suction pump, wherein one end of the tin absorbing gun body is fixed on the bottom support, the tin absorbing gun body is internally provided with a hollow tin absorbing channel, the tin absorbing gun head is fixed at one end, away from the bottom support, of the tin absorbing gun body and is communicated with the hollow tin absorbing channel, and the air suction pump is positioned at one end, close to the bottom support, of the tin absorbing gun body and is communicated with the hollow tin absorbing channel;
the air suction pump is used for sucking air in the hollow point tin channel and the tin absorption gun head which are communicated with each other, so that the tin absorption gun head can carry out tin absorption operation.
Furthermore, the tin absorption device also comprises a tin scraping part arranged on the outer wall of the tin absorption gun head.
Furthermore, the tin scraping part is a concave shovel head formed by extending and sinking the tin absorbing gun head, and the concave shovel head is connected with the tin absorbing gun head and the hollow tin absorbing channel.
Furthermore, a filter screen which divides the hollow tin absorbing channel into a tin inlet channel and a tin outlet channel is arranged in the hollow tin absorbing channel, the tin absorbing gun head is communicated with the tin inlet channel, and the air suction pump is communicated with the tin outlet channel;
the tin suction gun body is provided with an opening communicated with the tin inlet channel on the side wall between the tin suction gun head and the filter screen, and the tin suction device body comprises a shifting cover covering the opening.
Further, a groove net covering the opening is arranged in the opening.
Furthermore, a columnar pipeline with two open ends is arranged in the tin absorption gun head, the port of the tin inlet channel close to the tin absorption gun head is funnel-shaped, the opening at one end of the columnar pipeline far away from the tin inlet channel is a suction nozzle of the tin absorption gun head, and the opening at the other end of the columnar pipeline is connected with the funnel-shaped port of the tin inlet channel.
Furthermore, the tin absorbing device also comprises a sealing sleeve arranged in the tin outlet channel.
Furthermore, the bottom support comprises a fixed base in an oval structure and a soft gasket which is fixed on the outer peripheral side of the fixed base in a matched mode, and the tin sucking device and the tin dispensing device are fixed on the fixed base.
In a second aspect, the invention also provides a method for automatically reloading a reloading machine, which comprises the following steps:
s1, conveying the PCB with unqualified paster points to a welding table through a conveying belt for heating treatment;
s2, controlling the bottom support to rotate by the control device of the refueling machine, so that the tin suction device can suck tin on the heated unqualified paster points on the PCB, and removing waste materials on the unqualified paster points;
s3, controlling the bottom support to be automatically switched to a tin dotting device by the control device of the material replacing machine to perform tin dotting operation on the unqualified paster points after the waste materials are removed;
s4, conveying the PCB to a chip mounter through a conveying belt, and re-mounting the unqualified chip mounting points through the chip mounter;
s5, conveying the PCB subjected to re-mounting to reflow soldering equipment through a conveying belt to perform solder joint solidification;
s6, carrying out solder joint or optical inspection on the PCB after the solder joint is solidified through inspection equipment;
and S7, if all the paster points are qualified, ending the process, and if unqualified paster points exist, returning to the step S1.
Compared with the prior art, the head device of the chip device reloading machine comprises the bottom support, the tin sucking device and the tin dotting device, wherein the tin sucking device and the tin dotting device are arranged on the bottom support, and the tin sucking mode and the tin dotting mode are automatically converted by the control device respectively, so that the automation in the reloading process is realized, the safety is high, the manpower is saved, and the processing efficiency is improved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without inventive efforts, wherein:
fig. 1 is a schematic structural diagram of a refueling machine of a patch device provided by the invention;
fig. 2 is a flowchart of an automatic material changing method of a material changing machine for a patch device provided by the present invention.
In the figure, 200, a material changer of a patch device, 201, a bottom support, 202, a tin dropping device, 203, a tin sucking device, 204, a tin dropping gun head, 205, a tin dropping gun body, 206, a butterfly-shaped channel switch, 207, a controller, 208, a soft support body, 209, a funnel-shaped inner pipe, 210, a channel pipe, 211, a first base, 212, a fixed base, 213, a soft gasket, 214, a concave head, 215, a tin sucking gun head, 216, a columnar pipeline, 217, a funnel-shaped pipeline, 218, a tin sucking gun body, 219, a groove net, 220, a shifting cover, 221, a filter screen, 222, a sealing sleeve, 223, a second base, 224, a ventilation pipe, 225, an opening, 226, a tin feeding pump, 227, an air suction pump, 228, a hollow tin dropping channel, 229 and a hollow tin sucking channel.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, in a first aspect, the present invention provides a material changer for a chip mounter, for changing a PCB where chip mounting is to be performed again, including: a shoe 201; the tin absorbing device 203 is fixed on the bottom support 201; the tin soldering device 202, the tin soldering device 202 is fixed on the bottom support 201; and the control device is connected with the bottom support 201 and used for controlling the bottom support 201 to rotate so that the tin suction device 203 performs tin suction operation on unqualified chip mounting points on the heated PCB, and after the tin suction operation, the control device controls the bottom support 201 to be switched to the tin dispensing device 202 to perform tin dispensing operation on the unqualified chip mounting points.
Specifically, the tin suction device 203 and the tin spot device 202 are fixed on the bottom support 201, the control device controls the tin suction device 203 and the tin spot device 202 on the bottom support 201 to realize automatic switching, so that the tin suction device 203 is controlled to perform tin suction operation on unqualified chip mounting points on the heated PCB, and after the tin suction operation, the bottom support 201 is controlled to switch to the tin spot device 202 to perform tin spot operation on the unqualified chip mounting points. And finally, the adhesive tape is transmitted to a chip mounter by using a conveyor belt to verify the chip mounting and the backflow again. Through controlling means control collet 201 rotation respectively to inhale tin device 203 and tin device 202 and carry out automatic conversion and inhale tin mode and tin mode to make the in-process of reloading automatic, the security is high, uses manpower sparingly, improves machining efficiency.
In this embodiment, the tin dispensing device 202 includes a tin dispensing gun body 205 having one end fixed on the bottom bracket 201 and a hollow tin dispensing channel 228 inside, a tin dispensing gun head 204 fixedly disposed at one end of the tin dispensing gun body 205 away from the bottom bracket 201 and communicated with the hollow tin dispensing channel 228, and a tin feeding pump 226 disposed at one end of the tin dispensing gun body 205 close to the bottom bracket 201 and communicated with the hollow tin dispensing channel 228; the tin feeding pump 226 is used for supplying tin material to the tin dispensing gun head 204 through the hollow tin dispensing channel 228, so that the tin dispensing gun head 204 performs tin dispensing operation. By aligning the tin dispensing gun head 204 with the position of the PCB subjected to tin scraping, tin slurry is conveyed to the tin dispensing gun head 204 through the hollow tin dispensing channel 228 of the tin dispensing gun body 205 by the tin conveying pump 226, and tin dispensing operation is performed on the PCB by the tin dispensing gun head 204. Automatic tin dispensing is convenient, cost is saved, and tin dispensing efficiency is improved.
The tin dispensing gun head 204 is arranged in a conical structure, so that tin dispensing is performed uniformly.
In this embodiment, the tin dotting device 202 further includes a flow control member disposed in the hollow tin dotting channel 228, the flow control member divides the hollow tin dotting channel 228 into a discharging channel and a feeding channel, the tin dotting gun head 204 is communicated with the discharging channel, the tin pump 226 is communicated with the feeding channel, and the flow control member is used for controlling the communication and disconnection of the discharging channel and the feeding channel. The tin pump 226 is conveyed to the flow control component through the feeding channel, and the feeding channel and the discharging channel are controlled to be communicated and disconnected through the flow control component, so that the flow control effect is good, and the cost is saved.
In this embodiment, the wicking device 202 further includes a channel tube 210; the flow control member comprises a butterfly-shaped channel switch 206 arranged in the hollow point tin channel 228 and used for dividing the hollow point tin channel 228 into a discharging channel and a feeding channel, a controller 207 arranged on the butterfly-shaped channel switch 206, a soft support body 208 connected with the butterfly-shaped channel switch 206 and positioned in the feeding channel, and a funnel-shaped inner tube 209 wrapped in the soft support body 208, wherein the inner tube 209 is communicated with the tin feeding pump 226 through the channel tube 210, and the controller 207 is used for controlling the butterfly-shaped channel switch 206 to be opened and closed so as to control the connection and disconnection of the discharging channel and the feeding channel.
Specifically, when the tin is started, the tin pump 226 sends the tin slurry to the channel pipe 210 and then to the funnel-shaped inner pipe 209, the controller 207 opens the disc-shaped channel switch 206, and the tin slurry can normally flow into the tin dotting gun head 204 to complete tin dotting; when the tin point is stopped, the controller 207 closes the disc-shaped channel, and the tin slurry stops flowing into the tin point gun head 204. The control effect is good, and the cost is saved.
Further, the butterfly-shaped channel switch 206 is a baffle plate with a butterfly-shaped structure, and the tin-dotting channel is opened and closed through rotation, so that the use is convenient.
In this embodiment, the tin suction device 203 includes a tin suction gun body 218 having one end fixed on the bottom bracket 201 and a hollow tin suction channel 229 inside, a tin suction gun head 215 fixed on one end of the tin suction gun body 218 away from the bottom bracket 201 and communicating with the hollow tin suction channel 229, and an air suction pump 227 located at one end of the tin suction gun body 218 close to the bottom bracket 201 and communicating with the hollow tin suction channel 229; the air pump 227 is used for pumping air in the hollow tin-absorbing channel 229 and the tin-absorbing gun head 215 which are communicated with each other, so that the tin-absorbing gun head 215 performs tin-absorbing operation. The tin absorption gun head 215 is aligned to a position needing tin removal through the control device, and air in the hollow point tin channel 228 and the tin absorption gun head 215 which are communicated with each other is sucked through the air suction pump 227, so that the tin absorption gun head 215 can carry out tin absorption operation quickly, and the tin absorption effect is good and the use is convenient.
In this embodiment, the tin absorbing device 203 further includes a tin scraping portion disposed on an outer wall of the tin absorbing gun head 215. The tin scraping part is convenient for scraping waste tin on the PCB, so that the scraping waste tin is collected through the suction pump 227, and the treatment is convenient.
In this embodiment, the tin scraping portion is a concave shovel head 214 formed by extending and recessing the tin-absorbing gun head 215, and the concave shovel head 214 is connected with the tin-absorbing gun head 215 and the hollow tin-absorbing channel 229. The concave shovel head 214 is connected with the tin absorption gun head 215 and the hollow tin absorption channel 229. The concave shovel head 214 has good effect of shoveling waste tin and is convenient to use.
In this embodiment, a filter screen 221 for dividing the hollow tin absorption channel 229 into a tin inlet channel and a tin outlet channel is disposed in the hollow tin absorption channel 229, the tin absorption gun head 215 is communicated with the tin inlet channel, and the air suction pump 227 is communicated with the tin outlet channel; an opening 225 communicated with the tin inlet channel is arranged on the side wall of the tin suction gun body 218 between the tin suction gun head 215 and the filter screen 221, and the tin suction device 203 body comprises a shifting cover 220 covering the opening 225.
In this embodiment, a groove net 219 is disposed in the opening 225 to cover the opening 225.
In this embodiment, a cylindrical pipeline 216 with two open ends is arranged in the tin-absorbing gun head 215, a port of the tin-feeding channel, which is close to the tin-absorbing gun head 215, is funnel-shaped, an opening at one end of the cylindrical pipeline 216, which is far away from the tin-feeding channel, is a suction nozzle of the tin-absorbing gun head 215, and an opening at the other end of the cylindrical pipeline 216 is connected with the funnel-shaped port of the tin-feeding channel. The waste tin removed by the tin scraping part is quickly transmitted to the funnel-shaped pipeline 217 through the columnar pipeline 216 under the action of the air suction pump 227, and the waste tin is uniformly dispersed in the tin suction gun body 218 through the funnel-shaped pipeline 217, so that the waste tin is conveniently collected and processed by the groove net 219.
In this embodiment, the tin suction device further includes a sealing sleeve disposed in the tin outlet channel. The gland 222 is connected to the vent tube 224. The interior of the tin suction gun body 218 is connected with a sealing sleeve 222, the sealing sleeve 222 is connected with a ventilation pipe 224, and the sealing sleeve 222 is high in safety in order to prevent the situation that the suction force is insufficient due to air leakage.
In this embodiment, the tin spraying gun body 205 and the tin spraying gun head 204 are fixedly connected through a screw thread, and the tin absorbing gun body 218 and the tin absorbing gun head 215 are fixedly connected through a screw thread. The point tin gun head 204 and the tin absorption gun head 215 are convenient to disassemble and clean, and meanwhile, the assembling is convenient.
In this embodiment, the tin dispensing device 202 further includes a first base 211 fixed to the tin dispensing gun body 205 and disposed away from the tin dispensing gun head 204, the tin suction device 203 further includes a second base 223 fixed to the tin suction gun body 218 and disposed away from the tin suction gun head 215, the first base 211 and the second base 223 are both disposed in the bottom base 201, and the sealing sleeve 222 is disposed in the second base 223.
In this embodiment, the base 201 includes a fixing base 212 having an oval structure and a soft gasket 213 fixed to an outer peripheral side of the fixing base 212 in a fitting manner, and the tin suction device 203 and the tin dispensing device 202 are fixed to the fixing base 213. Specifically, the solder dispensing gun body 205 is connected to a first base 211, the first base 211 is connected to an elliptical head device base for fixing, a fixing base 212 of an elliptical structure is connected to a soft gasket 213, and the soft gasket 213 is connected to a stocker as a stocker head device, and is made of a soft material so as to be resistant to abrasion. The exterior of the solder gun body 218 is connected with a second base 223, and the second base 223 is connected with the oval structure fixing base 212 for fixing.
In this embodiment, the soldering tin gun body 205 is detachably fixed on the base, and the solder sucking gun body 218 is detachably fixed on the base, so that the soldering tin gun body 205 and the solder sucking gun body 218 can be conveniently detached and replaced, and maintenance is facilitated.
Referring to fig. 2, in a second aspect, the present invention further provides a method for automatically reloading a reloading machine, including the following steps:
s1, conveying the PCB with unqualified paster points to a welding table through a conveying belt for heating treatment;
s2, controlling the bottom support to rotate by the control device of the refueling machine, so that the tin suction device can suck tin on the heated unqualified paster points on the PCB, and removing waste materials on the unqualified paster points;
s3, controlling the bottom support to be automatically switched to a tin dotting device by the control device of the material replacing machine to perform tin dotting operation on the unqualified paster points after the waste materials are removed;
s4, conveying the PCB to a chip mounter through a conveying belt, and re-mounting the unqualified chip mounting points through the chip mounter;
s5, conveying the PCB subjected to re-mounting to reflow soldering equipment through a conveying belt to perform solder joint solidification;
s6, carrying out solder joint or optical inspection on the PCB after the solder joint is solidified through inspection equipment;
and S7, if all the paster points are qualified, ending the process, and if unqualified paster points exist, returning to the step S1.
Specifically, above-mentioned unqualified paster can be inspected and the position is confirmed through the solder joint inspection, adjusts tin absorption rifle head alignment of inhaling the tin device through controlling means and inhales the tin work of giving up, and effectual tin processing of giving up carries out convenient to use.
Specifically, above-mentioned unqualified paster can also be shot in real time through the camera to on picture through signal transmission to controlling means that will shoot, inhale tin device and some tin device through controlling means control and carry out tin absorption and some tin operation.
Specifically, the unqualified patches can also be manually input with position data, the position data is sent to the control device, and the tin suction device and the tin dispensing device are controlled by the control device to perform tin suction and tin dispensing operations.
Specifically, the PCB with unqualified surface mount points is conveyed to a welding table through a conveying belt for heating treatment; the control device of the refueling machine 200 controls the tin suction device 203 on the bottom support 201 to perform tin suction operation on the unqualified chip mounting points on the heated PCB so as to remove waste materials on the unqualified chip mounting points; the control device of the refueling machine 200 controls the collet 201 to be automatically switched to the tin dotting device 202 to perform tin dotting operation on the unqualified paster points after the waste materials are removed; conveying the PCB to a chip mounter through a conveying belt, and re-mounting the unqualified chip mounting points through the chip mounter; conveying the PCB subjected to re-mounting to reflow soldering equipment through a conveying belt to perform welding spot solidification; carrying out solder joint or optical inspection on the PCB after the solder joint is solidified through inspection equipment; if all the patch points are qualified, the process is ended, and if the unqualified patch points are detected, the process returns to the step S1. The method realizes the automatic material changing process, has high safety, saves manpower and improves the processing efficiency.
While the foregoing is directed to embodiments of the present invention, it will be understood by those skilled in the art that various changes may be made without departing from the spirit and scope of the invention.
Claims (10)
1. The utility model provides a reloading machine of paster device for refuel to the PCB board that needs carry out the paster again, its characterized in that includes:
a bottom support;
the tin absorbing device is fixed on the bottom support;
the tin dispensing device is fixed on the bottom support;
the control device is connected with the bottom support and used for controlling the bottom support to rotate so that the tin absorbing device can absorb tin on unqualified chip mounting points on the heated PCB, and after the tin absorbing operation, the control device controls the bottom support to be switched to the tin dispensing device and performs tin dispensing operation on the unqualified chip mounting points;
the tin dispensing device comprises a tin dispensing gun body, a tin dispensing gun head and a tin feeding pump, wherein one end of the tin dispensing gun body is fixed on the bottom support, a hollow tin dispensing channel is formed in the tin dispensing gun body, the tin dispensing gun head is fixedly arranged at one end, far away from the bottom support, of the tin dispensing gun body and is communicated with the hollow tin dispensing channel, and the tin feeding pump is positioned at one end, close to the bottom support, of the tin dispensing gun body and is communicated with the hollow tin dispensing channel;
the tin feeding pump is used for providing tin materials for the tin dispensing gun head through the hollow tin dispensing channel so as to enable the tin dispensing gun head to perform tin dispensing operation;
the tin dotting device also comprises a flow control component arranged in the hollow tin dotting channel, the flow control component divides the hollow tin dotting channel into a discharging channel and a feeding channel, the tin dotting gun head is communicated with the discharging channel, the tin pump is communicated with the feeding channel, and the flow control component is used for controlling the connection and disconnection of the discharging channel and the feeding channel;
the tin dispensing device also comprises a channel tube;
the flow control component is including locating in the hollow point tin passageway and with the hollow point tin passageway is separated for discharging channel and feedstock channel's butterfly-shaped channel switch, set up in controller on the butterfly-shaped channel switch, with butterfly-shaped channel switch connects and is located soft supporter in the feedstock channel with wrap up in soft supporter is internal is hourglass hopper-shaped's inner tube, the inner tube passes through the channel pipe with send the tin pump intercommunication, the controller is used for controlling opening and closing of butterfly-shaped channel switch, and then control discharging channel with feedstock channel's intercommunication and disconnection.
2. The refueling machine as recited in claim 1, wherein the tin suction device comprises a tin suction gun body, one end of the tin suction gun body is fixed on the bottom support, the tin suction gun body is internally provided with a hollow tin suction channel, a tin suction gun head is fixed at one end of the tin suction gun body, the end of the tin suction gun body is far away from the bottom support and is communicated with the hollow tin suction channel, and an air suction pump is positioned at one end of the tin suction gun body, the end of the tin suction gun body is close to the bottom support and is communicated with the hollow tin suction channel;
the air suction pump is used for sucking air in the hollow tin suction channel and the tin suction gun head which are communicated with each other, so that the tin suction gun head can perform tin suction operation.
3. The refueling machine as recited in claim 2, wherein the tin suction device further comprises a tin scraping part arranged on the outer wall of the tin suction gun head.
4. The refueling machine as claimed in claim 3, wherein the tin scraping part is a concave shovel head formed by extending and sinking the tin suction gun head, and the concave shovel head is connected with the tin suction gun head and the hollow tin suction channel.
5. The refueling machine as claimed in claim 2, wherein a filter screen is arranged in the hollow tin absorbing channel to divide the hollow tin absorbing channel into a tin inlet channel and a tin outlet channel, the tin absorbing gun head is communicated with the tin inlet channel, and the air suction pump is communicated with the tin outlet channel;
and an opening communicated with the tin inlet channel is formed in the side wall of the tin suction gun body between the tin suction gun head and the filter screen, and the tin suction gun body comprises a shifting cover covering the opening.
6. The reclaimer device according to claim 5, wherein a groove network is provided in said opening covering said opening.
7. The refueling machine as claimed in claim 5, wherein a cylindrical pipeline with two open ends is arranged in the tin suction gun head, the end of the tin feeding channel close to the tin suction gun head is funnel-shaped, the opening of one end of the cylindrical pipeline far away from the tin feeding channel is a suction nozzle of the tin suction gun head, and the opening of the other end of the cylindrical pipeline is connected with the funnel-shaped end of the tin feeding channel.
8. The refueling machine as recited in claim 5, wherein the tin suction device further comprises a sealing sleeve disposed in the tin outlet passage.
9. The reclaimer according to claim 1, wherein said collet comprises a fixed base having an oval structure and a soft gasket fixed on the outer periphery of said fixed base, said tin absorbing device and said tin dispensing device are fixed on said fixed base.
10. A method for automatic reloading with a reloading machine according to any of the claims from 1 to 9, characterized in that it comprises the following steps:
s1, conveying the PCB with unqualified paster points to a welding table through a conveying belt for heating treatment;
s2, controlling the bottom support to rotate by the control device of the refueling machine, so that the tin suction device can suck tin on the heated unqualified paster points on the PCB, and removing waste materials on the unqualified paster points;
s3, controlling the bottom support to be automatically switched to a tin dotting device by the control device of the material replacing machine to perform tin dotting operation on the unqualified paster points after the waste materials are removed;
s4, conveying the PCB to a chip mounter through a conveying belt, and re-mounting the unqualified chip mounting points through the chip mounter;
s5, conveying the PCB subjected to re-mounting to reflow soldering equipment through a conveying belt to perform solder joint solidification;
s6, carrying out solder joint inspection on the PCB after the solder joint is solidified through inspection equipment;
and S7, if all the paster points are qualified, ending the process, and if unqualified paster points exist, returning to the step S1.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111129708.3A CN113573491B (en) | 2021-09-26 | 2021-09-26 | Material replacing machine of surface mounted device and automatic material replacing method |
| PCT/CN2022/108106 WO2023045540A1 (en) | 2021-09-26 | 2022-07-27 | Material replacement machine for mounted device, and method for automated material replacement |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111129708.3A CN113573491B (en) | 2021-09-26 | 2021-09-26 | Material replacing machine of surface mounted device and automatic material replacing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113573491A CN113573491A (en) | 2021-10-29 |
| CN113573491B true CN113573491B (en) | 2021-12-14 |
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| CN202111129708.3A Active CN113573491B (en) | 2021-09-26 | 2021-09-26 | Material replacing machine of surface mounted device and automatic material replacing method |
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| CN (1) | CN113573491B (en) |
| WO (1) | WO2023045540A1 (en) |
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| CN113573491B (en) * | 2021-09-26 | 2021-12-14 | 深圳飞骧科技股份有限公司 | Material replacing machine of surface mounted device and automatic material replacing method |
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| CN112643164A (en) * | 2020-12-24 | 2021-04-13 | 安徽干城电子科技有限公司 | Circuit board precision component welding equipment |
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| TW387203B (en) * | 1995-06-06 | 2000-04-11 | Lsi Logic Corp | Polymorphic rectilinear thieving pad |
| CN2376675Y (en) * | 1999-04-30 | 2000-05-03 | 电子工业部第四十四研究所 | Multi-function assembling/disassembling device for integrated circuit |
| US6216938B1 (en) * | 1999-09-30 | 2001-04-17 | International Business Machines Corporation | Machine and process for reworking circuit boards |
| CN101837496A (en) * | 2010-04-23 | 2010-09-22 | 张大理 | Automatic tin supplying electric iron |
| CN203817580U (en) * | 2014-05-24 | 2014-09-10 | 史爱波 | Solder sucker |
| CN204053188U (en) * | 2014-09-16 | 2014-12-31 | 南京铁道职业技术学院 | A kind of bitubular solder sucker |
| CN206237691U (en) * | 2016-11-17 | 2017-06-09 | 深圳铭达康科技有限公司 | Bga chip maintenance unit |
| CN206481499U (en) * | 2016-12-30 | 2017-09-08 | 深圳铭达康科技有限公司 | Surface mount elements more exchange device |
| CN109940237B (en) * | 2017-12-20 | 2022-06-17 | 宁波舜宇光电信息有限公司 | Automatic tin suction device, automatic tin suction device and method |
| CN208680716U (en) * | 2018-08-29 | 2019-04-02 | 西安中科麦特电子技术设备有限公司 | A kind of novel sealing-off device for repairing |
| CN210381515U (en) * | 2019-09-09 | 2020-04-21 | 昆山汇仁氏电子有限公司 | A hot air solder leveling device for PCB |
| CN110856362B (en) * | 2019-11-18 | 2020-12-15 | 上海交通大学 | Automatic replacing method and system for flexible smart phone mainboard chip |
| CN113573491B (en) * | 2021-09-26 | 2021-12-14 | 深圳飞骧科技股份有限公司 | Material replacing machine of surface mounted device and automatic material replacing method |
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| CN112643164A (en) * | 2020-12-24 | 2021-04-13 | 安徽干城电子科技有限公司 | Circuit board precision component welding equipment |
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| CN113573491A (en) | 2021-10-29 |
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