CN212440474U

CN212440474U - Exhaust device for reflow soldering of PCB (printed circuit board)

Info

Publication number: CN212440474U
Application number: CN202020870544.4U
Authority: CN
Inventors: 王浩; 樊志江
Original assignee: Dalian Gulong Electronic Co ltd
Current assignee: Dalian Gulong Electronic Co ltd
Priority date: 2020-05-22
Filing date: 2020-05-22
Publication date: 2021-02-02
Anticipated expiration: 2030-05-22

Abstract

The utility model discloses an exhaust device for PCB reflow soldering, which belongs to the technical field of printed circuit boards, and comprises an air pump, wherein an air inlet pipe orifice and an air outlet pipe orifice of the air pump are both connected with an air guide pipe, the air guide pipe connected with the air inlet pipe orifice of the air pump is respectively connected with a plurality of exhaust collecting boxes, one end of the air guide pipe is connected with an exhaust collecting box, one end of the collecting box is provided with an air inlet groove, and one end of the inside of the collecting box, which is close to the air inlet groove, is provided with a dust screen; the utility model discloses an in the guide duct sent gas into the box, in gaseous bulb entering box through giving vent to anger, the absorption liquid carried out toxic gas's absorption in the box, and the gas is discharged from the gas vent after adsorbing, avoids environmental pollution.

Description

Exhaust device for reflow soldering of PCB (printed circuit board)

Technical Field

The utility model belongs to the technical field of printed circuit board, concretely relates to PCB board is exhaust device for reflow soldering.

Background

Printed circuit boards, also known as printed circuit boards, are providers of electrical connections for electronic components.

The printed circuit board is generally denoted as "PCB" and cannot be called "PCB board".

Its development has been over 100 years old; the design of the method is mainly layout design; the circuit board has the main advantages of greatly reducing errors of wiring and assembly, and improving the automation level and the production labor rate.

The circuit board can be divided into a single-sided board, a double-sided board, a four-layer board, a six-layer board and other multi-layer circuit boards according to the number of the layers of the circuit board.

The prior art has the following problems: the existing exhaust device for PCB reflow soldering has the problem of inconvenient exhaust when in use, can not filter impurities in gas, can not remove harmful substances in the gas, and is easy to cause environmental pollution.

SUMMERY OF THE UTILITY MODEL

To solve the problems set forth in the background art described above. The utility model provides an exhaust device for PCB board reflow soldering has simple structure, and it is convenient to air exhaust, filters handy characteristics.

In order to achieve the above object, the utility model provides a following technical scheme: the air exhaust device for PCB reflow soldering comprises an air pump, wherein air inlet pipes and air outlet pipes of the air pump are connected with air guide pipes, the air guide pipes connected with the air inlet pipes of the air pump are connected with a plurality of air exhaust collecting boxes respectively, each air exhaust collecting box comprises a collecting box body, an air inlet groove and a dust screen, one end of each air guide pipe is connected with the air exhaust collecting box, the air inlet grooves are formed in one ends of the collecting boxes, and the dust screens are arranged at the ends, close to the air inlet grooves, inside the collecting boxes.

Preferably, the joints of the two ends of the air guide pipe are provided with sealing rings, and the air guide pipe is of a steel whip hose structure.

Preferably, the opening of the air inlet groove is of an inclined downward structure, and the dust screen is adhered to the inner wall glue of the collecting box.

Preferably, the air guide pipe connected with the air outlet pipe orifice of the air pump is connected with an adsorption box, the adsorption box comprises an air inlet, an air outlet ball head, a box body and an air outlet, wherein the air inlet is arranged on one side of the upper end of the box body, the air outlet is arranged on the other side of the upper end of the box body, and the lower end of the air inlet is connected with the air outlet ball head.

Preferably, the liquid in the box body is kept more than half of the box body, and the maximum amount of the liquid in the box body is positioned at the lower end of the exhaust port.

Preferably, the air outlet ball head is always positioned at the lower end of the liquid level, and air holes are uniformly formed in the surface of the air outlet ball head.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the utility model is provided with an exhaust collecting box, a dust screen is arranged in the collecting box, air is pumped into the collecting box from the air inlet groove by utilizing the suction of an air pump, and the dust screen filters the air and filters fine impurities generated by welding;

2. the utility model discloses an in the guide duct sent gas into the box, in gaseous bulb entering box through giving vent to anger, the absorption liquid carried out toxic gas's absorption in the box, and the gas is discharged from the gas vent after adsorbing, avoids environmental pollution.

Drawings

Fig. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic view of the structure of the air exhaust collection box of the present invention;

FIG. 3 is a schematic view of the adsorption box of the present invention;

in the figure: 1. an exhaust collection box; 11. a collection box; 12. an air inlet groove; 13. a dust screen; 2. an air guide pipe; 3. an air pump; 4. an adsorption tank; 41. an air inlet; 42. an air outlet ball head; 43. a box body; 44. and (7) an exhaust port.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-3, the present invention provides the following technical solutions: the utility model provides a PCB board is exhaust device for reflow soldering, including air pump 3, the mouth of pipe that admits air of air pump 3 and the mouth of pipe that gives vent to anger all are connected with guide duct 2, guide duct 2 that the mouth of pipe that admits air of air pump 3 is connected with a plurality of collecting box 1 of airing exhaust respectively, collecting box 1 of airing exhaust includes collecting box 11, air inlet duct 12 and dust screen 13, wherein, the one end of guide duct 2 is connected with collecting box 1 of airing exhaust, the one end of collecting box 11 is provided with air inlet duct 12, the inside one end that is close to air inlet duct 12.

Specifically, the joints of the two ends of the air guide pipe 2 are both provided with sealing rings, the air guide pipe 2 is of a steel whip hose structure,

through adopting above-mentioned technical scheme, improve the leakproofness, adopt steel whip hose construction, plasticity is high, conveniently carries out fixed mounting.

Specifically, the opening of the air inlet groove 12 is designed to be inclined downward, the dust screen 13 is adhered to the inner wall glue of the collecting box 11,

through adopting above-mentioned technical scheme, convenient dustproof, and ensure that dust screen 13 is fixed firm.

Specifically, the air guide pipe 2 connected with the outlet pipe orifice of the air pump 3 is connected with an adsorption tank 4, the adsorption tank 4 comprises an air inlet 41, an air outlet ball 42, a tank body 43 and an air outlet 44, wherein one side of the upper end of the tank body 43 is provided with the air inlet 41, the other side of the upper end of the tank body 43 is provided with the air outlet 44, the lower end of the air inlet 41 is connected with the air outlet ball 42,

through adopting above-mentioned technical scheme, conveniently carry out the absorption of noxious material in the gas.

Specifically, the liquid in the box body 43 is kept more than half of the box body, and the maximum amount of the liquid in the box body 43 is positioned at the lower end of the exhaust port 44,

by adopting the technical scheme, the phenomenon that the overflow is caused by too much adsorbing liquid amount and the incomplete adsorption is easily caused by too little amount is avoided.

Specifically, the air outlet ball head 42 is always positioned at the lower end of the liquid level, air holes are uniformly arranged on the surface of the air outlet ball head 42,

through adopting above-mentioned technical scheme, make gas pass through adsorption liquid all the time and adsorb.

The utility model discloses a theory of operation and use flow: the utility model discloses during the use, will air exhaust collecting box 1 and install in reflow soldering machine's inside, utilize the suction of air pump 3, gaseous collecting box 11 of intaking from air inlet duct 12 suction, dust screen 13 filters gas, the tiny impurity that filter weld produced, gaseous through leading to pipe 2 carry into box 43, gaseous through giving vent to anger bulb 42 get into box 43 in, absorption liquid carries out the absorption of toxic gas in the box 43, adsorb the back gas and discharge from gas vent 44, avoid environmental pollution, it is portable to use.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a PCB board is exhaust device for reflow soldering, includes air pump (3), its characterized in that: the air exhaust device is characterized in that an air inlet pipe opening and an air outlet pipe opening of the air pump (3) are connected with air guide pipes (2), the air guide pipes (2) connected with the air inlet pipe opening of the air pump (3) are connected with a plurality of air exhaust collecting boxes (1) respectively, each air exhaust collecting box (1) comprises a collecting box (11), an air inlet groove (12) and a dust screen (13), wherein one end of each air guide pipe (2) is connected with the air exhaust collecting box (1), the air inlet groove (12) is formed in one end of each collecting box (11), and the dust screen (13) is arranged at one end, close to the air inlet groove (12).

2. The exhaust device for reflow soldering of PCB board of claim 1, wherein: sealing rings are arranged at the joints of the two ends of the air guide pipe (2), and the air guide pipe (2) is of a steel whip hose structure.

3. The exhaust device for reflow soldering of PCB board of claim 1, wherein: the opening of the air inlet groove (12) is of an inclined downward structure, and the dust screen (13) is adhered to the inner wall glue of the collecting box (11).

4. The exhaust device for reflow soldering of PCB board of claim 1, wherein: the air pump is characterized in that an air guide pipe (2) connected with an air outlet pipe opening of the air pump (3) is connected with an adsorption box (4), the adsorption box (4) comprises an air inlet (41), an air outlet ball head (42), a box body (43) and an air outlet (44), wherein the air inlet (41) is arranged on one side of the upper end of the box body (43), the air outlet (44) is arranged on the other side of the upper end of the box body (43), and the lower end of the air inlet (41) is connected with the air outlet ball head (42.

5. The exhaust device for reflow soldering of PCB board of claim 4, wherein: the liquid in the box body (43) is kept more than half of the box body, and the maximum amount of the liquid in the box body (43) is positioned at the lower end of the exhaust port (44).

6. The exhaust device for reflow soldering of PCB board of claim 4, wherein: the air outlet ball head (42) is always positioned at the lower end of the liquid level, and air holes are uniformly formed in the surface of the air outlet ball head (42).