CN113571629A - Thermoelectric module with special external lead electrifying mode - Google Patents
Thermoelectric module with special external lead electrifying mode Download PDFInfo
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- CN113571629A CN113571629A CN202110736157.0A CN202110736157A CN113571629A CN 113571629 A CN113571629 A CN 113571629A CN 202110736157 A CN202110736157 A CN 202110736157A CN 113571629 A CN113571629 A CN 113571629A
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- ceramic substrate
- thermoelectric module
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- external lead
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/81—Structural details of the junction
- H10N10/817—Structural details of the junction the junction being non-separable, e.g. being cemented, sintered or soldered
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/82—Connection of interconnections
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Abstract
The invention discloses a thermoelectric module with a special external lead electrifying mode, which comprises an upper ceramic substrate and a lower ceramic substrate, wherein the inner sides of the upper ceramic substrate and the lower ceramic substrate are respectively provided with a layer of copper particles, a layer of semiconductor particles is arranged between the two layers of copper particles, and the lower ceramic substrate is connected with a lead through a connecting part. According to the invention, long copper particles are placed on the copper particles at the welding wire end of the hot-surface ceramic substrate, the long copper particles are fixed through a tin soldering process, the conducting wire is welded on the long copper particles, the connecting part of the long copper particles and the guide is protected through the protection device, finally, the sealing glue is carried out on the periphery of the thermoelectric semiconductor module and the surface of the long copper particles, and the cold-surface ceramic substrate adopts the conventional ceramic substrate, so that the thermoelectric module is convenient to process and manufacture.
Description
Technical Field
The invention relates to the technical field of semiconductors, in particular to a thermoelectric module with a special external lead electrifying mode.
Background
The conventional thermoelectric semiconductor module is designed for a high-current product structure as follows: the height of the semiconductor particles is relatively short; the wire model needs to select larger wires, such as #20, #18 and the like; and notches are required to be formed above the cold surface ceramic substrate corresponding to the welding wire ends so as to facilitate welding wires. The structural design mainly lies in that a cold-side ceramic substrate is notched or a welding guide sheet with a specific shape is additionally arranged, and the manufacturing process of the cold-side ceramic substrate and the manufacturing process of a conventional thermoelectric semiconductor module are carried out by one more process, so that the qualification rate is reduced, the cost of the substrate is increased, and the overall cost of the product is finally influenced.
For example, chinese patent CN104681708B, published 2018, 9, 4, a thermoelectric module arranged in a non-equidistant manner, which includes an upper substrate, a lower substrate, a thermoelectric module and a flow deflector, wherein the upper substrate includes an upper module area for arranging the thermoelectric module, the lower substrate includes a lower module area for arranging the thermoelectric module and a lead-out area, and each semiconductor element in the upper module area and the lower module area is arranged in a non-equidistant manner. Because the lead-out area needs to be additionally arranged on the substrate and the flow deflector specially used for connecting the lead and in a special shape needs to be welded, the thermoelectric semiconductor module is complicated to manufacture.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: the connection structure that is used for being connected with the wire that present thermoelectric module set up on the base plate makes thermoelectric module's preparation loaded down with trivial details, leads to the technical problem that the qualification rate reduces. The thermoelectric module with the special external lead power-on mode is convenient to manufacture and capable of increasing the manufacturing yield of the module.
In order to solve the technical problems, the technical scheme adopted by the invention is as follows: the thermoelectric module comprises an upper ceramic substrate and a lower ceramic substrate, wherein the inner sides of the upper ceramic substrate and the lower ceramic substrate are both provided with a layer of copper particles, a layer of semiconductor particles is arranged between the two layers of copper particles, and the lower ceramic substrate is connected with a wire through a connecting part. A thermoelectric module with a special external lead electrifying mode is characterized in that long copper grains are placed on copper grains at a welding wire end of a hot-surface ceramic substrate and fixed through a tin soldering process, leads are welded on the long copper grains, finally, the periphery of a thermoelectric semiconductor module and the surface of the long copper grains are sealed with glue, and a cold-surface ceramic substrate is also a conventional ceramic substrate, so that the thermoelectric module is convenient to process and manufacture.
Preferably, one end of the connecting part is connected to the copper particles at the edge of the lower ceramic substrate, and the other end of the connecting part is connected to the conductive core in the lead. The wire is including leading the core and leading the outside insulating layer of core, and the one end of connecting portion is connected with the copper grain that is located ceramic substrate edge down, and the one end of connecting portion is used for being connected with the copper grain of wire near the wire in ceramic substrate edge down promptly, the other end of connecting portion with lead in the wire core connection, make connecting portion play the effect of auxiliary connection, through setting up the bridge that connecting portion are connected as copper grain and wire, needn't change ceramic substrate's shape, reduce ceramic substrate preparation process, reduce the cost.
Preferably, the connecting part is a copper particle, and the connecting part is a cuboid. Connecting portion are long copper grain, and the copper grain is changeed through soldering tin with the copper grain and is fixed, and does not influence the electric conductivity on copper grain layer, and utilizes wire and long copper grain to carry out the easy and convenient nature of welding, conveniently carries out the automation and welds.
Preferably, a protection device is arranged at the connection position of the connecting part and the lead. The protection device is arranged at the joint of the connecting part and the lead, so that the joint of the connecting part and the lead can be prevented from falling off or breaking due to collision, abrasion and the like.
Preferably, the protection device comprises a first splicing part and a second splicing part, and the first splicing part is connected with the second splicing part through a clamping structure. The protection device is more convenient to install through the splicing mode of the first splicing part and the second splicing part, and in addition, a button can be arranged to facilitate assembling or disassembling of the protection device.
Preferably, the first splicing part is provided with a connecting buckle used for being clamped with the second splicing part, and the second splicing part is provided with a clamping groove corresponding to the connecting buckle. The protective device is spliced and installed through the plurality of buckles and the clamping grooves which are arranged on the two splicing parts.
Preferably, the first splicing part and the second splicing part are both provided with a plurality of vent holes. Can take the air into the gap of two concatenation portion concatenations department through the ventilation hole, realize the ventilation cooling function, also can set up the dust screen on the ventilation hole and prevent that the dust from getting into.
Preferably, the first splicing part and the second splicing part are both provided with clamping parts, and the clamping parts are connected with the corresponding splicing parts through a plurality of springs. The clamping part is connected with the corresponding splicing part through a plurality of springs, namely, the first splicing part is connected with the clamping part on the first splicing part through a plurality of springs, the second splicing part is connected with the clamping part on the second splicing part through a plurality of springs, the connecting part is in contact with the splicing part through the clamping part at the connecting part of a wire, the clamping part can play the roles of auxiliary installation, clamping and buffering, and the clamping part can be divided into two parts which are respectively in contact with the connecting part and in contact with the wire.
Preferably, the clamping portion comprises a first clamping portion for clamping the wire and a second clamping portion for clamping the connecting portion, and one side of the first clamping portion, which is close to the wire, is arc-shaped. One side of the first clamping part close to the wire is arc-shaped, the arc-shaped wire is convenient for the core guide of the wire to contact, and the clamping part or the protection device can adopt heat-resistant insulating materials.
Preferably, the upper ceramic substrate is a cold-side ceramic substrate, and the lower ceramic substrate is a hot-side ceramic substrate. Compare in setting up connection structure on cold side ceramic substrate, this patent cold side ceramic substrate adopts conventional ceramic substrate, and the process can be reduced to the manufacture, reduces the cost, and hot side ceramic substrate bonding wire end department is that the copper grain is fixed through soldering tin with the copper grain, has increased the fastness of junction.
The substantial effects of the invention are as follows: according to the invention, long copper particles are placed on the copper particles at the welding wire end of the hot-surface ceramic substrate, the long copper particles are fixed through a tin soldering process, the conducting wire is welded on the long copper particles, the connecting part of the long copper particles and the guide is protected through the protection device, finally, the sealing glue is carried out on the periphery of the thermoelectric semiconductor module and the surface of the long copper particles, and the cold-surface ceramic substrate adopts the conventional ceramic substrate, so that the thermoelectric module is convenient to process and manufacture.
Drawings
FIG. 1 is a schematic structural diagram of the present embodiment;
fig. 2 is a schematic structural diagram of the protection device of the present embodiment.
Wherein: 1. go up ceramic substrate, 2, lower ceramic substrate, 3, semiconductor granule, 4, wire, 5, connecting portion, 6, protection device, 7, ventilation hole, 8, first concatenation portion, 9, second concatenation portion, 10, first clamping part, 11, second clamping part.
Detailed Description
The following provides a more detailed description of the present invention, with reference to the accompanying drawings.
A thermoelectric module with a special external lead electrifying mode is shown in figure 1 and comprises an upper ceramic substrate 1 and a lower ceramic substrate 2, wherein the inner sides of the upper ceramic substrate 1 and the lower ceramic substrate 2 are respectively provided with a layer of copper particles, a layer of semiconductor particles 3 is arranged between the two layers of copper particles, the 3 layers of semiconductor particles can adopt P/N type semiconductor particles 3, and the lower ceramic substrate 2 is connected with a lead 4 through a connecting part 5. The upper ceramic substrate 1 is a cold-side ceramic substrate, and the lower ceramic substrate 2 is a hot-side ceramic substrate. Compare in setting up connection structure on cold side ceramic substrate, this patent cold side ceramic substrate adopts conventional ceramic substrate, and the process can be reduced to the manufacture, reduces the cost, and hot side ceramic substrate bonding wire end department is that the copper grain is fixed through soldering tin with the copper grain, has increased the fastness of junction.
The connecting part 5 is a copper particle, and the connecting part 5 is a cuboid. Connecting portion 5 is long copper grain, and copper grain are changeed and are fixed through soldering tin, and do not influence the electric conductivity on copper grain layer, and utilize wire 4 and long copper grain to carry out the welded just easy nature, conveniently carry out the automation and weld. One end of the connecting part 5 is connected with the copper particles positioned at the edge of the lower ceramic substrate 2, and the other end of the connecting part 5 is connected with the guide core in the lead 4. Wire 4 is including leading the core and leading the outside insulating layer of core, the one end of connecting portion 5 is connected with the copper grain that is located 2 edges of ceramic substrate down, the one end of connecting portion 5 is close to wire 4 in 2 edges of ceramic substrate down and is used for being connected with the copper grain of wire 4, the other end of connecting portion 5 is connected with the interior core of leading of wire 4, make connecting portion 5 play auxiliary connection's effect, through setting up connecting portion 5 as the bridge that copper grain and wire 4 are connected, needn't change ceramic substrate's shape, reduce ceramic substrate preparation process, reduce the cost.
The connection part 5 is provided with a protection device 6 at the connection part with the lead 4, as shown in fig. 2. The protection device 6 is arranged at the joint of the connecting part 5 and the lead 4, so that the joint of the connecting part 5 and the lead 4 can be prevented from falling off or breaking due to collision, abrasion and the like. The protection device 6 comprises a first splicing part 8 and a second splicing part 9, and the first splicing part 8 is connected with the second splicing part 9 through a clamping structure. The protection device 6 is more convenient to install through the splicing mode of the first splicing part 8 and the second splicing part 9, and in addition, a button can be arranged to facilitate assembling or disassembling of the protection device 6. The first splicing part 8 is provided with a connecting buckle used for being connected with the second splicing part 9 in a clamping mode, and the second splicing part 9 is provided with a clamping groove corresponding to the connecting buckle. The protective device 6 is spliced and installed through the plurality of buckles and the clamping grooves which are arranged on the two splicing parts. The first splicing part 8 and the second splicing part 9 are both provided with a plurality of vent holes 7. Can take the air into the gap of two concatenation portion concatenations department through ventilation hole 7, realize the ventilation cooling function, also can set up the dust screen on ventilation hole 7 and prevent that the dust from getting into.
The first splicing part 8 and the second splicing part 9 are both provided with clamping parts, and the clamping parts are connected with the corresponding splicing parts through a plurality of springs. The joint of the connecting part 5 and the wire 4 is contacted with the splicing part through the clamping part, the clamping part can play roles of auxiliary installation, clamping and buffering, and the clamping part can also be divided into two parts which are respectively contacted with the connecting part 5 and the wire 4. The clamping parts comprise a first clamping part 10 used for clamping the wire 4 and a second clamping part 11 used for clamping the connecting part 5, and one side of the first clamping part 10 close to the wire 4 is arc-shaped. The first clamping portion 10 is curved on the side near the conductor 4, the arc is convenient for the conductor 4 to contact with the core, and the clamping portion or the protection device 6 can be made of heat-resistant insulating material.
The long copper particles are placed on the copper particles at the welding wire end of the hot-surface ceramic substrate, the hot-surface ceramic substrate is fixed through a tin soldering process, the wire 4 is welded on the long copper particles, the periphery of the thermoelectric semiconductor module and the surface of the long copper particles are sealed, and the cold-surface ceramic substrate is also a conventional ceramic substrate, so that the thermoelectric module can be conveniently processed and manufactured.
The above examples only show some embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention.
Claims (10)
1. The thermoelectric module with the special external lead electrifying mode is characterized by comprising an upper ceramic substrate (1) and a lower ceramic substrate (2), wherein a layer of copper particles is arranged on the inner sides of the upper ceramic substrate (1) and the lower ceramic substrate (2), a layer of semiconductor particles (3) is arranged between the two layers of copper particles, and the lower ceramic substrate (2) is connected with a lead (4) through a connecting part (5).
2. The thermoelectric module with special external lead wire energizing manner according to claim 1, wherein one end of the connecting portion (5) is connected with the copper particles at the edge of the lower ceramic substrate (2), and the other end of the connecting portion (5) is connected with the conductive core in the lead wire (4).
3. The thermoelectric module with the special external lead energizing manner according to claim 1, wherein the connecting portion (5) is a copper particle, and the connecting portion (5) is a rectangular parallelepiped.
4. The thermoelectric module with special external lead-through mode according to claim 1, 2 or 3, characterized in that a protection device (6) is arranged at the connection position of the connecting part (5) and the lead (4).
5. The thermoelectric module with the special external lead-through mode according to claim 4, wherein the protection device (6) comprises a first splicing part (8) and a second splicing part (9), and the first splicing part (8) is connected with the second splicing part (9) through a clamping structure.
6. The thermoelectric module with the special external lead energizing manner according to claim 5, wherein the first splicing part (8) is provided with a connecting buckle for being clamped with the second splicing part (9), and the second splicing part (9) is provided with a clamping groove corresponding to the connecting buckle.
7. The thermoelectric module with special external lead-through mode according to claim 5 or 6, characterized in that the first splicing part (8) and the second splicing part (9) are provided with a plurality of vent holes (7).
8. The thermoelectric module with the special external lead-through mode according to claim 5 or 6, wherein the first splicing part (8) and the second splicing part (9) are provided with clamping parts, and the clamping parts are connected with the corresponding splicing parts through a plurality of springs.
9. The thermoelectric module with special external lead energizing mode according to claim 8, wherein the clamping portion comprises a first clamping portion (10) for clamping the lead (4) and a second clamping portion (11) for clamping the connecting portion (5), and one side of the first clamping portion (10) close to the lead (4) is arc-shaped.
10. The thermoelectric module with special external lead energizing pattern according to claim 1, 3 or 9, characterized in that the upper ceramic substrate (1) is a cold-side ceramic substrate and the lower ceramic substrate (2) is a hot-side ceramic substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110736157.0A CN113571629A (en) | 2021-06-30 | 2021-06-30 | Thermoelectric module with special external lead electrifying mode |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110736157.0A CN113571629A (en) | 2021-06-30 | 2021-06-30 | Thermoelectric module with special external lead electrifying mode |
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| Publication Number | Publication Date |
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| CN113571629A true CN113571629A (en) | 2021-10-29 |
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| CN202110736157.0A Pending CN113571629A (en) | 2021-06-30 | 2021-06-30 | Thermoelectric module with special external lead electrifying mode |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005282106A (en) * | 2004-03-29 | 2005-10-13 | Kyocera Corp | Dimming glass window system |
| KR20160024199A (en) * | 2014-08-25 | 2016-03-04 | 삼성전기주식회사 | Thermoelectric module and method of manufacturing the same |
| JP2018093152A (en) * | 2016-12-02 | 2018-06-14 | 株式会社イムコ | Thermoelectric power generation device |
| CN112614930A (en) * | 2020-11-18 | 2021-04-06 | 浙江先导热电科技股份有限公司 | Sensor thermoelectric module in special position |
| CN112787288A (en) * | 2020-12-29 | 2021-05-11 | 山东华宇工学院 | Electrical engineering cable protection device |
| CN215644553U (en) * | 2021-06-30 | 2022-01-25 | 浙江先导热电科技股份有限公司 | Thermoelectric module with special external lead electrifying mode |
-
2021
- 2021-06-30 CN CN202110736157.0A patent/CN113571629A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005282106A (en) * | 2004-03-29 | 2005-10-13 | Kyocera Corp | Dimming glass window system |
| KR20160024199A (en) * | 2014-08-25 | 2016-03-04 | 삼성전기주식회사 | Thermoelectric module and method of manufacturing the same |
| JP2018093152A (en) * | 2016-12-02 | 2018-06-14 | 株式会社イムコ | Thermoelectric power generation device |
| CN112614930A (en) * | 2020-11-18 | 2021-04-06 | 浙江先导热电科技股份有限公司 | Sensor thermoelectric module in special position |
| CN112787288A (en) * | 2020-12-29 | 2021-05-11 | 山东华宇工学院 | Electrical engineering cable protection device |
| CN215644553U (en) * | 2021-06-30 | 2022-01-25 | 浙江先导热电科技股份有限公司 | Thermoelectric module with special external lead electrifying mode |
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