CN113571441A - Detection device, detection system and detection method of array substrate - Google Patents
Detection device, detection system and detection method of array substrate Download PDFInfo
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- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/14—Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
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- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
- H01L22/24—Optical enhancement of defects or not directly visible states, e.g. selective electrolytic deposition, bubbles in liquids, light emission, colour change
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- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
- H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
- H01L22/32—Additional lead-in metallisation on a device or substrate, e.g. additional pads or pad portions, lines in the scribe line, sacrificed conductors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
- H01L22/34—Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line
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Abstract
The embodiment of the application relates to a detection device, a detection system and a detection method of an array substrate, wherein the detection device of the array substrate comprises: a pixel substrate; the mechanical arm is provided with a cathode lead connected with the pixel substrate to transmit a first potential to the pixel substrate, the mechanical arm is used for moving the pixel substrate so that the pixel substrate is connected with the array substrate and receives a second potential from the array substrate, and the potential difference between the first potential and the second potential is used for driving the pixel substrate to emit light; the probe is used for transmitting the second electric potential to the array substrate; and the optical detection device is arranged corresponding to the light emitting area of the pixel substrate and is used for detecting the bright-state optical performance of the pixel substrate so as to determine whether the array substrate has an abnormality.
Description
Technical Field
The embodiment of the application relates to the technical field of detection, in particular to a detection device, a detection system and a detection method for an array substrate.
Background
When manufacturing an array substrate of a display device, after each circuit structure in the array substrate is prepared, a signal waveform output by the array substrate needs to be detected to determine whether a signal line and an element in the array substrate have poor electrical properties. However, the array substrate includes a plurality of driving circuits arranged in an array, and each driving circuit includes a plurality of Thin Film Transistors (TFTs), each of which may cause a signal waveform to change, thereby causing insufficient accuracy of a detection result.
Disclosure of Invention
The embodiment of the application provides a detection device, a detection system and a detection method of an array substrate, which can optimize the contact accuracy of the array substrate.
An inspection apparatus for an array substrate, comprising:
a pixel substrate;
the mechanical arm is provided with a cathode lead connected with the pixel substrate to transmit a first potential to the pixel substrate, the mechanical arm is used for moving the pixel substrate so that the pixel substrate is connected with the array substrate and receives a second potential from the array substrate, and the potential difference between the first potential and the second potential is used for driving the pixel substrate to emit light;
the probe is used for transmitting the second electric potential to the array substrate; and
and the optical detection device is arranged corresponding to the light emitting area of the pixel substrate and is used for detecting the bright-state optical performance of the pixel substrate so as to determine whether the array substrate has an abnormality.
An array substrate detection system comprises an array substrate, a first anode and a detection device of the array substrate, wherein the array substrate comprises:
the test pad is used for connecting a probe of a detection device to receive a second potential from the probe;
an anode contact structure connected to the test pad for transmitting the second potential;
the first anode is arranged on the pixel substrate or on the surface of one side of the anode contact structure, which is used for connecting the pixel substrate, and the first anode is used for transmitting the second potential from the anode contact structure to the pixel substrate.
An array substrate detection method is applied to the array substrate detection system, and the detection method includes:
controlling the mechanical arm to move the pixel substrate so as to connect the pixel substrate on the pixel substrate with the array substrate;
transmitting a first potential to the cathode signal line;
transmitting a second potential to the probe, wherein the potential difference between the first potential and the second potential drives the pixel substrate to emit light;
and detecting the bright-state optical performance of the pixel substrate by using the optical detection equipment to determine whether the array substrate has an abnormality.
According to the detection device, the detection system and the detection method of the array substrate, the pixel substrate is controlled to move through the mechanical arm, and the voltage signal is transmitted to the pixel substrate through the cathode lead arranged in the mechanical arm, so that the automatic control function can be realized. Meanwhile, the electrical characteristics of the array substrate can be characterized based on the optical characteristics of the pixel substrate. Specifically, if the pixel substrate can normally emit light in the test process, it indicates that the array substrate to be tested can accurately transmit the driving signal; if the pixel substrate can not emit light normally, it indicates that the signal line or the element in the array substrate to be tested is abnormal. Therefore, the detection device provided by the embodiment of the application can accurately and automatically test the array substrate, and the detection device with higher accuracy is realized.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments or related technologies of the present application, the drawings needed to be used in the description of the embodiments or related technologies are briefly introduced below, it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a detection apparatus of an array substrate according to an embodiment of the present application;
fig. 2 is a second schematic structural view of an exemplary detection apparatus for an array substrate;
FIG. 3 is a schematic structural diagram of a pixel substrate according to an embodiment;
FIG. 4 is a schematic structural diagram of an array substrate according to an embodiment;
FIG. 5 is a schematic structural diagram of the first alignment mark and the second alignment mark coinciding with each other in the projection direction according to an embodiment;
FIG. 6 is a schematic view of a connection of one embodiment of a connector;
fig. 7 is a schematic structural diagram of an exemplary inspection system for an array substrate;
fig. 8 is a second schematic structural view of an exemplary inspection system for an array substrate;
FIG. 9 is a diagram illustrating the detection results according to an embodiment;
FIG. 10 is a flowchart illustrating a method for inspecting an array substrate according to an embodiment;
fig. 11 is a second flowchart of the inspection method of the array substrate according to the embodiment.
Element number description:
a pixel substrate: 100, respectively; cathode: 110; light-emitting layer: 120 of a solvent; first alignment mark: 120 of a solvent; mechanical arm: 200 of a carrier; cathode lead: 210; and (3) current testing line: 220, 220; and (3) probe: 300, respectively; an optical detection device: 400, respectively; connecting piece: 500, a step of; an array substrate: 20; testing a bonding pad: 600, preparing a mixture; anode contact structure: 700 of the base material; a first anode: 810; a second anode: 820; second alignment mark: 900.
Detailed Description
To facilitate an understanding of the embodiments of the present application, the embodiments of the present application will be described more fully below with reference to the accompanying drawings. Preferred embodiments of the present application are shown in the drawings. The embodiments of the present application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the embodiments of this application belong. The terminology used herein in the description of the embodiments of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the embodiments of the present application. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
In the description of the embodiments of the present application, it is to be understood that the terms "upper", "lower", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on methods or positional relationships shown in the drawings, and are only used for convenience in describing the embodiments of the present application and simplifying the description, but do not indicate or imply that the devices or elements referred to must have specific orientations, be constructed in specific orientations, and be operated, and thus, should not be construed as limiting the embodiments of the present application.
It will be understood that, as used herein, the terms "first," "second," and the like may be used herein to describe various elements, but these elements are not limited by these terms. These terms are only used to distinguish one element from another element, and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. For example, a first anode may be referred to as a second anode, and similarly, a second anode may be referred to as a first anode, without departing from the scope of the present application. The first anode and the second anode are both anodes, but they are not the same anode.
Further, in the description of the present application, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise. In the description of the present application, "a number" means at least one, such as one, two, etc., unless specifically limited otherwise.
Fig. 1 is a schematic structural diagram of an inspection apparatus for an array substrate according to an embodiment of the present disclosure, and referring to fig. 1, in the embodiment, the inspection apparatus for an array substrate includes a pixel substrate 100, a robot arm 200, a probe 300, and an optical inspection device 400.
Here, the pixel substrate 100 refers to a substrate on which a light emitting device is formed. Specifically, the size and the position of the light emitting device correspond to the array substrate to be tested, so that the pixel substrate 100 can be accurately lighted when contacting the array substrate to be tested and receiving the driving signal. Wherein the driving signal may be a potential signal. It should be noted that each Light Emitting device in the present embodiment may be, but is not limited to, an Organic Light-Emitting diode (OLED), a Quantum Dot Light Emitting diode (QLED), a Micro Light Emitting diode (Micro LED), and the like. Each light emitting device may be an organic light emitting diode with different colors, such as a red OLED, a green OLED, a blue OLED, and the like, but the selected color needs to correspond to the array substrate to be tested.
The robot arm 200 may be connected to the pixel substrate 100, and is provided with a cathode lead 210 connected to the pixel substrate 100 to transmit a first potential to the pixel substrate 100, the robot arm 200 is configured to move the pixel substrate 100 to connect the pixel substrate 100 to an array substrate and receive a second potential from the array substrate, and a potential difference between the first potential and the second potential is used to drive the pixel substrate 100 to emit light. Among them, the robot arm 200 may have multiple degrees of freedom, i.e., the robot arm 200 can support movement in up, down, left, right, front, and rear directions. Optionally, the robot arm 200 may also support rotation in at least one direction of the X-axis, the Y-axis, and the Z-axis, thereby achieving more accurate contact of the pixel substrate 100 with the array substrate to be tested.
The probe 300 is used for transmitting the second electric potential to the array substrate. The probe 300 can be understood as a contact medium for testing, and therefore, the probe 300 is a conductive element with certain elasticity. The array substrate may be provided with a test pad 600, and the test pad 600 is connected to a structure of the array substrate for transmitting the second potential signal to the pixel substrate 100 through a trace. When testing, the probe 300 may be attached to the test pad 600, so as to transmit the second potential signal to the pixel substrate 100, thereby driving the pixel substrate 100 to emit light.
The optical detection device 400 is disposed corresponding to the light emitting region of the pixel substrate 100, and is used for detecting the bright-state optical performance of the pixel substrate 100 to determine whether the array substrate has an abnormality. The optical detection device 400 may cover the entire light emitting area of the pixel substrate 100, and obtain the overall optical characteristics of the array substrate through one test, thereby improving the test efficiency. The optical detection device 400 may cover only a part of the light emitting area of the pixel substrate 100, and sequentially acquire the optical characteristics of each area of the array substrate through continuous movement and testing, thereby obtaining a more accurate test result. Further, the optical detection device 400 may be disposed on the robot arm 200, and the robot arm 200 is further configured to move the optical detection device 400 to a position corresponding to the light emitting area of the pixel substrate 100, so as to achieve the above-mentioned function of continuous movement, thereby improving flexibility of testing.
In the related art, an input test pad of a first potential, an input test pad of a second potential, an output test pad, and the like are usually required to be disposed on an array substrate, and the test pads occupy a certain space on the array substrate, so that the frame width of a display product can be increased, and the display product is not favorable for a narrow-frame product. Moreover, the test pad is usually made of a metal material, and if an excessive metal structure is disposed on a frame of the array substrate, a risk of electrostatic discharge (ESD) may be increased, and the array substrate may be worn due to the electrostatic discharge, so that reliability of the array substrate is greatly affected, and reliability of the display device is affected.
In the present embodiment, the robot arm 200 controls the movement of the pixel substrate 100, and the cathode lead 210 provided in the robot arm 200 transmits a potential signal to the pixel substrate 100, thereby implementing an automatic control function. Meanwhile, based on the optical characteristics of the pixel substrate 100, the electrical characteristics of the array substrate can be characterized. Specifically, if the pixel substrate 100 can emit light normally in the test process, it indicates that the array substrate to be tested can accurately transmit the driving signal; if the pixel substrate 100 cannot emit light normally, it indicates that there is an abnormality in the lead or the device in the array substrate to be tested. Therefore, the detection device for the array substrate can accurately and automatically test the array substrate, and the detection device for the array substrate with higher accuracy is realized.
In one embodiment, the optical detection device 400 may be a CMOS (complementary Metal Oxide semiconductor) sensor. In particular, the CMOS sensor may integrate peripheral circuits (e.g., AGC, CDS, Timing generator, or DSP, etc.) into a sensor chip, so that the cost of a peripheral chip may be saved, thereby implementing a small-sized, low-cost optical detection apparatus 400.
In one embodiment, the optical detection device 400 may be a Charge Coupled Device (CCD) sensor. Specifically, the CCD sensor has a plurality of capacitors arranged in order to sense light and directly convert an optical signal into an analog current signal, and the current signal is amplified and analog-to-digital converted to acquire, store, transmit, process, and reproduce an image, and the CCD sensor has high test resolution and precision, thereby realizing the optical detection apparatus 400 with a more accurate test result.
Further, the optical detection apparatus 400 can realize detection of light emission uniformity of the pixel substrate 100 based on the above-described CMOS sensor or CCD sensor.
Wherein the light emission uniformity may be luminance uniformity. For example, if the routing in the partial area of the array substrate is disconnected, the routing corresponding to the disconnected position cannot transmit the second potential signal to the corresponding light emitting device in the pixel substrate 100, and accordingly, the light emitting device cannot emit light, and the optical detection device 400 can detect that the brightness at the position of the light emitting device is much smaller than the brightness at other positions, so that it can be determined that the driving circuit or the routing connected to the light emitting device that does not emit light normally is abnormal, that is, the array substrate is abnormal.
The light emission uniformity may be chromaticity uniformity. For example, if the array substrate needs to drive the pixel substrate 100 to display a white picture, but some potential signals are abnormal in the transmission process, and the corresponding pixel is displayed in yellow, the optical detection device 400 can detect that the difference between the chromaticity at the position of the light emitting device and the chromaticity at other positions is greater than the chromaticity threshold value, so that it can be determined that the driving circuit or the trace connected to the pixel is abnormal, that is, the array substrate is abnormal.
Fig. 2 is a second schematic structural diagram of an exemplary detecting device of an array substrate, and referring to fig. 2, in this embodiment, the pixel substrate 100 includes a cathode 110 and a light emitting layer 120. The cathode 110 is connected to the cathode lead 210 for receiving the first potential through the cathode lead 210. The light emitting layer 120 is stacked on the cathode 110, and the light emitting layer 120 is connected to the array substrate, receives a second potential from the array substrate, and emits light at a potential difference between the first potential and the second potential. In performing the test, the light emitting layer 120 is located at a side close to the array substrate, the cathode 110 is located at a side away from the array substrate, and the optical detection apparatus 400 is disposed close to the cathode 110. Wherein, the light emitted from the light emitting device passes through the cathode 110 and is received by the optical detection device 400.
Optionally, the cathode 110 may be a transparent conductive material to reduce the absorption of light by the cathode 110, thereby improving the detection accuracy of the optical detection apparatus 400. The transparent conductive material may be, for example, Indium Tin Oxide (ITO), silver nanowires, metal mesh, or the like.
Further, if the array substrate to be tested is an array substrate of an OLED display device, the material of the light emitting layer 120 is an organic light emitting material. It is understood that, in the display device, characteristics of devices such as thin film transistors in the array substrate may be specifically set for the type of the display device, thereby achieving better display performance. Therefore, in this embodiment, the pixel substrate 100 of the corresponding organic light emitting device is selected to be tested according to the characteristics of the array substrate to be tested, so that the preparation yield of the array substrate can be more accurately reflected, and the test accuracy is improved.
With continued reference to fig. 2, in an embodiment, the apparatus for inspecting an array substrate further includes a current testing line 220, the current testing line 220 is disposed on the robot arm 200 and connected to the cathode 110, and is configured to transmit a current signal output by the cathode 110, where the current signal is used to characterize an electrical property of the pixel substrate 100. In this embodiment, the current condition flowing through the light emitting device can be obtained through the current test line 220, so as to determine whether the array substrate outputs an accurate driving current to the light emitting device, thereby implementing the detection of the electrical performance of the pixel substrate 100.
It can be understood that, on the premise that the hardware structure of the pixel substrate 100 is normal, if the current test line 220 cannot receive the current signal, it indicates that the pixel substrate 100 does not receive the current signal, that is, the array substrate does not output the driving current to the light emitting device. For another example, if the array substrate should output the driving current with the target current value to the pixel substrate 100 to drive the pixel substrate 100 to achieve the target brightness, but the actual brightness of the pixel substrate 100 is smaller than the target brightness, and the current value of the tested current signal is smaller than the target current value, it indicates that the driving current output by the array substrate is abnormal. In this embodiment, the optical performance and the electrical performance of the pixel substrate 100 may be comprehensively tested, so as to more accurately represent whether the array substrate has an abnormality.
Fig. 3 is a schematic structural diagram of a pixel substrate 100 according to an embodiment, and referring to fig. 3, in an embodiment, the pixel substrate 100 is provided with a first alignment mark 120. Correspondingly, fig. 4 is a schematic structural diagram of the array substrate 20 according to an embodiment, and referring to fig. 4, the array substrate 20 is provided with a second alignment mark 900. The optical inspection apparatus 400 is further configured to acquire an alignment image of the first alignment mark 120, and control the robot arm 200 to move according to the alignment image, so that the first alignment mark 120 coincides with the second alignment mark 900 on the array substrate 20 in a projection direction, which is perpendicular to the pixel substrate 100. Specifically, fig. 5 is a schematic structural diagram of the first alignment mark 120 and the second alignment mark 900 overlapping in the projection direction according to an embodiment, referring to fig. 5, when the first alignment mark 120 and the second alignment mark 900 overlap in the projection direction, it can be considered that the pixel substrate 100 is aligned with the array substrate 20, and then the light emitting device on the pixel substrate 100 is also aligned with the driving circuit on the array substrate 20, so that the second potential output by the array substrate 20 can be ensured to be accurately applied to the corresponding light emitting device, the problem that the pixel substrate 100 does not emit light due to alignment misalignment is avoided, and the test accuracy of the array substrate 20 can be further improved.
In one embodiment, the detecting device of the array substrate further includes a connector 500. Fig. 6 is a schematic connection diagram of a connection member 500 according to an embodiment, referring to fig. 6, one end of the connection member 500 is connected to the pixel substrate 100, the other end of the connection member 500 is used for being detachably connected to the array substrate 20, and the connection member 500 is used for limiting the movement of the array substrate 20 when being connected to the array substrate 20. In the embodiment, the movement of the array substrate 20 is limited by the connecting member 500, so that the array substrate 20 and the pixel substrate 100 can be prevented from being dislocated in the testing process, and therefore, the detection result errors caused by unstable factors such as vibration in the testing process can be reduced. It should be understood that in the embodiment shown in fig. 6, the connector 500 is a snap connector 500, in other embodiments, the connector 500 may also be any connecting structure with a fixing function, such as a vacuum chuck, and the embodiment is not limited thereto.
Fig. 7 is a schematic structural diagram of an inspection system of an array substrate according to an embodiment, and referring to fig. 7, in the embodiment, the inspection system includes an array substrate 20, a first anode 810, and an inspection apparatus of the array substrate as described above. The array substrate 20 includes a test pad 600 and an anode contact structure 700. The test pad 600 is used for connecting the probe 300 of the inspection apparatus to receive a second potential from the probe 300, and the second potential is used for driving the pixel substrate 100 in the inspection apparatus to emit light together with the first potential. An anode contact structure 700 is connected to the test pad 600 for transmitting the second potential.
The first anode 810 is disposed on the pixel substrate 100, or on a surface of the anode contact structure 700 on a side connected to the pixel substrate 100, and the first anode 810 is used for transmitting the second potential from the anode contact structure 700 to the pixel substrate 100.
Specifically, in this embodiment, the pixel substrate 100 with the cathode 110+ light emitting layer 120 structure may be used to inspect the array substrate 20 after the first anode 810 is prepared, where the first anode 810 is disposed in the array substrate 20, and after the inspection is completed, the light emitting layer 120 and the cathode 110 of the light emitting device need to be prepared on the array substrate 20 to form a final display panel. It will be appreciated that the area of the anode is larger relative to the area of the anode contact structure 700, and therefore, if the array substrate 20 is inspected after the first anode 810 is fabricated, a larger alignment margin can be achieved, i.e., the alignment requirements for the pixel substrate 100 and the array substrate 20 during testing are relatively low.
In this embodiment, the array substrate 20 after the anode contact structure 700 is prepared may also be tested by using the pixel substrate 100 having the structure of the cathode 110+ the light-emitting layer 120+ the first anode 810, wherein the first anode 810 is disposed in the pixel substrate 100, and after the testing is completed, the anode, the light-emitting layer 120 and the cathode 110 of the light-emitting device need to be prepared on the array substrate 20 to form a final display panel. It can be understood that if the detection is directly performed after the anode contact structure 700 is completed, the abnormal array substrate 20 can be screened out earlier, and the repairing or rejecting operation can be performed, so that the operation of preparing the anode for the array substrate 20 with serious abnormality can be omitted, the preparation yield can be improved, and the overall preparation cost of the display panel can be reduced.
In one embodiment, the array substrate 20 may include a plurality of test pads 600, and each test pad 600 is used to connect to a corresponding color of driving circuit, so as to control the driving circuits of different colors, so that the pixel substrate 100 can display different color pictures. For example, the array substrate 20 may include three test pads 600, the three test pads 600 corresponding to red, green, and blue colors, respectively. When the probe 300 transmits the second potential to the test pad 600 connected to the driving circuit corresponding to the red light emitting device, the pixel substrate 100 displays a red screen. When the probe 300 transmits the second potential to the test pad 600 connected to the driving circuit corresponding to the green light emitting device, the pixel substrate 100 displays a green screen. When the probe 300 transmits the second potential to the test pad 600 to which the driving circuit corresponding to the blue light emitting device is connected, the pixel substrate 100 displays a blue picture. When the probe 300 simultaneously transmits the second potential to the test pad 600 to which the driving circuits corresponding to the light emitting devices of the three colors are connected, the pixel substrate 100 displays a white screen.
Fig. 8 is a second schematic structural diagram of a detection system of an array substrate according to an embodiment, referring to fig. 8, in this embodiment, in an embodiment, the second anode 820 is disposed on a surface of the anode contact structure 700 for connecting to a side of the pixel substrate 100, the pixel substrate 100 includes a cathode 110 and a light-emitting layer 120 that are stacked, the detection apparatus further includes a first anode 810, the first anode 810 is disposed on a surface of the light-emitting layer 120 away from the cathode 110, and the second anode 820 is configured to connect to the first anode 810 and transmit the second potential to the light-emitting layer 120. In this embodiment, the first anode 810 and the second anode 820 are matched to realize better transmission performance for the second potential, so as to improve the accuracy of the test. Meanwhile, the first anode 810 on the pixel substrate 100 can protect the light emitting layer 120 to prevent the light emitting layer 120 from being exposed to the air, so that the stability of the light emitting layer 120 is improved, and the stability of the pixel substrate 100 is further improved.
Fig. 9 is a schematic diagram of a detection result according to an embodiment, and referring to fig. 9, in the embodiment, the detection result may include a received optical signal and a current signal. Taking the detection result as an optical signal as an example, as described above, the optical signal can be obtained by collecting the bright-state optical performance of the pixel substrate by the optical detection device. The mechanical arm can control the optical detection equipment to move in a preset direction, so that different areas of the pixel substrate are subjected to scanning test, and corresponding optical signals are detected at different scanning positions. Optionally, the preset direction may be parallel to an extending direction of the scan line of the array substrate, or may be parallel to an extending direction of the data line of the array substrate, which is not limited in this embodiment. When there is no abnormality in the array substrate, the pixel substrate can normally emit light in a bright state, that is, an optical signal having a large intensity can be detected (as shown in a portion outside the dashed line frame in fig. 9). When the array substrate is abnormal, the pixel substrate cannot normally emit light in a bright state, that is, only an optical signal with small or zero intensity (as shown in the portion of the dashed line frame in fig. 9) can be detected. Therefore, whether the array substrate is abnormal or not can be determined more accurately by detecting the optical signal of the pixel substrate. In addition, if the current signal of the pixel substrate is synchronously detected, the current signal can be used together with the optical signal to determine whether the array substrate has an abnormality, so that the detection accuracy is further improved.
Fig. 10 is a flowchart of an embodiment of a method for inspecting an array substrate, in which the method for inspecting an array substrate is applied to the above-mentioned inspection system for an array substrate, and referring to fig. 7 and 10 in combination, in the embodiment, the method for inspecting an array substrate includes steps 1002 to 1008.
Specifically, in the detection process of step 1008, if the pixel substrate 100 can emit light normally, it indicates that the array substrate 20 to be tested can accurately transmit the driving signal; if the pixel substrate 100 fails to emit light normally, it indicates that there is an abnormality in the lead or the device in the array substrate 20 to be tested. For example, if the pixel array is controlled to display a white screen, but the brightness of some pixels is detected to be dark or not bright, it can be detected that the array substrate 20 has an abnormality. Therefore, the robot arm 200 controls the pixel substrate 100 to move, and the cathode lead 210 disposed in the robot arm 200 transmits the potential signal to the pixel substrate 100, so that the detection method of the embodiment can accurately and automatically test the array substrate 20, thereby implementing a high-accuracy detection method.
Fig. 11 is a second flowchart of an inspection method of an array substrate according to an embodiment, and referring to fig. 7 and fig. 11 in combination, in the embodiment, the inspection method includes steps 1102 to 1112.
At step 1104, a first potential is transmitted to the cathode lead 210.
in step 1108, when the brightness of the light emitting devices greater than the threshold number is greater than the threshold brightness, it is determined that the array substrate 20 is abnormal.
Here, the dark optical performance refers to the optical performance of the pixel substrate 100 when it does not emit light, and the bright optical performance refers to the optical performance of the pixel substrate 100 when it emits light. In the present embodiment, if a part of the light emitting devices emits light before the second potential is applied in step 1110, it is illustrated that a short circuit phenomenon exists in the array substrate 20, and a potential is erroneously applied to the light emitting devices in the pixel substrate 100, thereby causing the light emitting devices to emit light. The number of the threshold values may be 5, 10, and the like, and may be specifically determined according to the quality requirement of the display panel. In addition, in the embodiment, the dark state optical performance is detected first, and the array substrates 20 with the dark state optical performance which does not meet the requirements can be removed, so that the number of the array substrates 20 which need to be subjected to the bright state optical performance detection is reduced, and the test efficiency is improved.
In one embodiment, the method further comprises the following steps: receiving the current signal output by the cathode 110, and obtaining the electrical performance of the pixel substrate 100 according to the current signal, so as to determine whether the array substrate 100 has an abnormality together with the bright-state optical performance. In this embodiment, the array substrate 20 can be detected by combining the electrical performance and the optical performance, so as to improve the accuracy of the detection result.
It should be understood that, although the steps in the flowcharts of fig. 10 and 11 are shown in order as indicated by the arrows, the steps are not necessarily performed in order as indicated by the arrows. The steps are not performed in the exact order shown and described, and may be performed in other orders, unless explicitly stated otherwise. Moreover, at least some of the steps in fig. 10 and 11 may include multiple sub-steps or multiple stages that are not necessarily performed at the same time, but may be performed at different times, and the order of performing the sub-steps or stages is not necessarily sequential, but may be performed alternately or alternately with other steps or at least some of the sub-steps or stages of other steps.
The embodiment of the application also provides a computer readable storage medium. One or more non-transitory computer-readable storage media containing computer-executable instructions that, when executed by one or more processors, cause the processors to perform the steps of the method of inspecting an array substrate.
A computer program product containing instructions which, when run on a computer, cause the computer to perform a method of inspecting an array substrate.
Any reference to memory, storage, database, or other medium used herein may include non-volatile and/or volatile memory. Non-volatile memory can include read-only memory (ROM), Programmable ROM (PROM), Electrically Programmable ROM (EPROM), Electrically Erasable Programmable ROM (EEPROM), or flash memory. Volatile memory can include Random Access Memory (RAM), which acts as external cache memory. By way of illustration and not limitation, RAM is available in a variety of forms, such as Static RAM (SRAM), Dynamic RAM (DRAM), Synchronous DRAM (SDRAM), double data rate SDRAM (DDR SDRAM), Enhanced SDRAM (ESDRAM), synchronous Link (Synchlink) DRAM (SLDRAM), Rambus Direct RAM (RDRAM), direct bus dynamic RAM (DRDRAM), and bus dynamic RAM (RDRAM).
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express a few embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for those skilled in the art, variations and modifications can be made without departing from the concept of the embodiments of the present application, and these embodiments are within the scope of the present application. Therefore, the protection scope of the embodiments of the present application shall be subject to the appended claims.
Claims (12)
1. An array substrate detection device, comprising:
a pixel substrate;
the mechanical arm is provided with a cathode lead connected with the pixel substrate to transmit a first potential to the pixel substrate, the mechanical arm is used for moving the pixel substrate so that the pixel substrate is connected with the array substrate and receives a second potential from the array substrate, and the potential difference between the first potential and the second potential is used for driving the pixel substrate to emit light;
the probe is used for transmitting the second electric potential to the array substrate; and
and the optical detection device is arranged corresponding to the light emitting area of the pixel substrate and is used for detecting the bright-state optical performance of the pixel substrate so as to determine whether the array substrate has an abnormality.
2. The apparatus of claim 1, wherein the pixel substrate comprises:
a cathode connected to the cathode lead for receiving the first potential through the cathode lead;
and a light emitting layer laminated on the cathode, the light emitting layer being connected to the array substrate, receiving the second potential from the array substrate, and emitting light at a potential difference between the first potential and the second potential.
3. The detecting device for detecting the array substrate as claimed in claim 2, wherein the material of the light emitting layer is an organic light emitting material.
4. The apparatus for inspecting an array substrate of claim 2, further comprising:
and the current test line is arranged on the mechanical arm, is connected with the cathode and is used for transmitting a current signal output by the cathode, and the current signal is used for representing the electrical property of the pixel substrate.
5. The device for inspecting the array substrate of claim 1, wherein the pixel substrate is provided with a first alignment mark, and the optical inspection apparatus is further configured to obtain an alignment image of the first alignment mark, and control the robot arm to move according to the alignment image, so that the first alignment mark and a second alignment mark on the array substrate coincide in a projection direction, and the projection direction is perpendicular to the pixel substrate.
6. The apparatus for inspecting an array substrate of claim 1, further comprising:
the one end of connecting piece with the pixel substrate is connected, the other end of connecting piece be used for with array substrate can dismantle the connection, the connecting piece connect in during the array substrate, be used for the restriction array substrate's removal.
7. The array substrate detecting apparatus of claim 1, wherein the optical detecting device is disposed on the robot arm, and the robot arm is further configured to move the optical detecting device to a position corresponding to the light emitting area of the pixel substrate.
8. An inspection system for an array substrate, comprising an array substrate, a first anode, and an inspection apparatus for an array substrate according to any one of claims 1 to 7, the array substrate comprising:
the test pad is used for connecting a probe of a detection device to receive a second potential from the probe;
an anode contact structure connected to the test pad for transmitting the second potential;
the first anode is arranged on the pixel substrate or on the surface of one side of the anode contact structure, which is used for connecting the pixel substrate, and the first anode is used for transmitting the second potential from the anode contact structure to the pixel substrate.
9. The array substrate detecting system of claim 8, wherein the first anode is disposed on a surface of the light emitting layer on a side away from the cathode, the pixel substrate includes a cathode and a light emitting layer stacked on each other, and the array substrate further includes:
and the second anode is arranged on the surface of one side of the anode contact structure, which is used for being connected with the pixel substrate, and is used for being connected with the first anode and transmitting the second potential to the light-emitting layer.
10. An inspection method of an array substrate, applied to the inspection system of the array substrate according to claim 8 or 9, the inspection method comprising:
controlling the mechanical arm to move the pixel substrate so as to connect the pixel substrate on the pixel substrate with the array substrate;
transmitting a first potential to the cathode signal line;
transmitting a second potential to the probe, wherein the potential difference between the first potential and the second potential drives the pixel substrate to emit light;
and detecting the bright-state optical performance of the pixel substrate by using the optical detection equipment to determine whether the array substrate has an abnormality.
11. The method for inspecting an array substrate of claim 10, wherein the pixel substrate is provided with a plurality of light emitting devices, and before transmitting the second potential to the probes, the method further comprises:
detecting the dark state optical performance of the pixel substrate;
and when the brightness of the light-emitting devices larger than the threshold number is larger than the threshold brightness, judging that the array substrate has abnormity.
12. The method for inspecting the array substrate of claim 10, further comprising:
and receiving a current signal output by the cathode, and acquiring the electrical performance of the pixel substrate according to the current signal so as to determine whether the array substrate is abnormal or not together with the bright-state optical performance.
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