CN113571335A - Intelligent high-frequency capacitor and manufacturing method thereof - Google Patents
Intelligent high-frequency capacitor and manufacturing method thereof Download PDFInfo
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- CN113571335A CN113571335A CN202110618733.1A CN202110618733A CN113571335A CN 113571335 A CN113571335 A CN 113571335A CN 202110618733 A CN202110618733 A CN 202110618733A CN 113571335 A CN113571335 A CN 113571335A
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- 239000003990 capacitor Substances 0.000 title claims abstract description 104
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- 238000003780 insertion Methods 0.000 claims abstract description 7
- 230000037431 insertion Effects 0.000 claims abstract description 7
- 238000005498 polishing Methods 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 7
- 238000005520 cutting process Methods 0.000 claims description 6
- 229920000742 Cotton Polymers 0.000 claims description 5
- 239000012528 membrane Substances 0.000 claims description 4
- 230000000149 penetrating effect Effects 0.000 claims description 4
- 238000001514 detection method Methods 0.000 claims description 3
- 238000012360 testing method Methods 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- 238000004026 adhesive bonding Methods 0.000 claims description 2
- 238000002844 melting Methods 0.000 claims description 2
- 230000008018 melting Effects 0.000 claims description 2
- 230000000694 effects Effects 0.000 description 6
- 238000004140 cleaning Methods 0.000 description 5
- 230000004888 barrier function Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 2
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000005201 scrubbing Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/08—Cooling arrangements; Heating arrangements; Ventilating arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/224—Housing; Encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E40/00—Technologies for an efficient electrical power generation, transmission or distribution
- Y02E40/30—Reactive power compensation
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Abstract
The invention discloses an intelligent high-frequency capacitor and a manufacturing method thereof, belonging to the technical field of capacitors and comprising a capacitor body, wherein two built-in pins are led out from the bottom end of the capacitor body, the intelligent high-frequency capacitor also comprises two pin sockets which are cylindrical and are both arranged at the bottom end of the capacitor body, the two built-in pins are respectively and coaxially inserted into the two pin sockets, one end of each pin socket, which is far away from the capacitor body, is provided with a second slot, and the insertion ends of the built-in pins just extend into the second slot; the pin plugs are cylindrical and provided with two pins, the pin plugs are respectively matched with the two pin sockets in an inserting mode, and eccentric through openings are formed in the pin plugs in the axial direction. The pins of the intelligent high-frequency capacitor can be replaced very conveniently and rapidly, the pins of different specifications can be replaced according to different requirements, the manufacturing method of the intelligent high-frequency capacitor adopts a multi-structure assembly type manufacturing method, the operation is simple, and the manufactured capacitor is stable in structure.
Description
Technical Field
The invention relates to the technical field of capacitors, in particular to an intelligent high-frequency capacitor and a manufacturing method thereof.
Background
The intelligent capacitor integrates advanced technologies such as modern measurement and control, power electronics, network communication, automatic control, power capacitors and the like. The backward controller technology of the traditional reactive power compensation device and the backward switching technology of a mechanical contactor or a mechatronic switch as a switched capacitor are changed, and the structural mode of large volume and heavy weight of the traditional reactive power compensation device is changed, so that the new generation of low-voltage reactive power compensation equipment has the characteristics of better compensation effect, smaller volume, lower power consumption, lower price, more cost saving, more flexibility in use, more convenience in maintenance, longer service life and higher reliability, and meets the higher requirement of the modern power grid on reactive power compensation; the capacitor will generate different losses at different frequencies of use, and thus there will be a high frequency capacitance and a low frequency capacitance. Rather than the capacitance generating a high or low frequency, a high or low frequency circuit is suitable for the capacitor. High frequency electric capacity is applicable to high frequency circuit, and intelligence high frequency electric capacity is more and more common in high frequency circuit now, and intelligence high frequency electric capacity will be a big trend of condenser manufacturing towards high-accuracy technological development.
When the capacitor is installed, the capacitor body needs to be welded in a circuit by means of the positive pin and the negative pin, when the working condition changes and the capacitor with other specifications needs to be replaced, the pins often need to be directly cut off, a new capacitor is welded at the position again, the replaced capacitor often cannot be normally used due to the fact that the pins are cut off, the pins are quite troublesome to replace for one capacitor, in order to save labor and time cost, people often discard the capacitor with the intact capacitor body but only with the pins cut off, waste is caused, the intelligent high-frequency capacitor is expensive compared with the non-intelligent low-frequency capacitor, and therefore waste is more serious.
Disclosure of Invention
The invention aims to provide an intelligent high-frequency capacitor and a manufacturing method thereof, aiming at solving the problems in the prior art, the intelligent high-frequency capacitor can replace pins conveniently and quickly, and the pins with different specifications can be replaced according to different requirements.
The technical purpose of the invention is realized by the following technical scheme: an intelligent high-frequency capacitor comprises a capacitor body, two built-in pins and two pin sockets, wherein the two built-in pins are led out from the bottom end of the capacitor body, the two pin sockets are cylindrical and arranged at the bottom end of the capacitor body, the two built-in pins are respectively and coaxially inserted into the two pin sockets, one ends, far away from the capacitor body, of the pin sockets are provided with second slots, and the insertion ends of the built-in pins just extend into the second slots; the pin plugs are also cylindrical and provided with two pins which are respectively matched with the two pin sockets in an inserting way, the pin plug is provided with an eccentric through hole along the axial direction, one side of the through hole far away from the axis of the pin plug is provided with a first notch, a third notch is formed in one side, away from the through hole, of the outer side wall of the pin plug, a threaded hole is formed in the third notch in a penetrating manner towards the axis direction of the pin plug, the threaded hole is internally provided with a bolt in a matching way, the through hole is internally and rotatably provided with a rotating wheel matched with the through hole in shape and size, a plurality of pin mounting grooves with different specifications are arranged on the side wall of the rotating wheel around the axis of the rotating wheel, each pin mounting groove is arranged along the axial direction of the rotating wheel in a run-through manner, and each pin mounting groove can move to a position coaxial with the pin plug along with the rotation of the rotating wheel; and the two external pins are respectively arranged on the two pin plugs, are specifically arranged in the pin mounting grooves corresponding to the specifications of the two pin plugs, and are electrically contacted with the built-in pins after the pin plugs are inserted into the pin sockets.
Furthermore, the built-in pin extends to a first slot is formed in the end portion of the second slot, two toughness clamping pieces are symmetrically arranged on the inner wall of the first slot, the middle portions of the toughness clamping pieces are protruded to form an arc-shaped structure, the protruded portions of the toughness clamping pieces and the arc-shaped structure are close to each other, one end of each toughness clamping piece is fixedly connected with the inner wall of the first slot, and the other end of each toughness clamping piece is not in contact with the inner wall of the first slot.
Furthermore, the inner wall of the second slot and the outer wall of the pin plug are respectively provided with threads which are matched with each other.
Furthermore, both ends of the inner wall of the through opening are provided with limiting edges protruding along the axis direction of the through opening, and the limiting edges positioned at both ends of the inner wall of the through opening are also positioned at both ends of the rotating wheel and are also tightly attached to both end faces of the rotating wheel.
Furthermore, a second notch is formed in one side, away from the first notch, of the through hole, a tough isolating membrane is arranged between the through hole and the second notch, and the tough isolating membrane and the second notch jointly form a through channel.
Furthermore, the outer side wall of the rotating wheel is provided with anti-skid lines.
Further, the bottom of electric capacity body still is equipped with preliminary treatment portion, it has seted up hole of polishing and clean hole to link up respectively in the preliminary treatment portion, wherein the inner wall in hole of polishing is equipped with the dull polish layer, the inner wall in clean hole is equipped with flexible cotton, just the hole of polishing is rectangular form, and the width of its one end is greater than the width of the other end, and both ends are passed through the inclined plane and are connected.
A manufacturing method of an intelligent high-frequency capacitor comprises the following steps:
a. selecting an intelligent high-frequency capacitor body, and cutting a built-in pin led out from the bottom end of the capacitor body;
b. a through hole matched with the shape and the size of the built-in pin is formed in the pin socket along the axis of the pin socket in a penetrating way;
c. inserting the built-in pin into the through hole, and fixedly connecting the pin socket with the capacitor body;
d. selecting the external pin, and mounting the selected external pin on the pin plug;
e. inserting the pin plug into the second slot on the pin socket and ensuring that the external pin is electrically contacted with the built-in pin;
f. and (4) installing the capacitor assembled in the steps in a test circuit for functional detection, and finishing the manufacture of the intelligent high-frequency capacitor after the capacitor is qualified.
Further, when the built-in pins are cut in the step a, the cutting standard is that the insertion ends of the built-in pins can just extend into the second slot.
Further, in the step c, the pin socket and the capacitor body are fixedly connected by welding, hot melting or gluing.
In conclusion, the invention has the following beneficial effects:
(1) the intelligent high-frequency capacitor is characterized in that a rotatable and adjustable rotating wheel is arranged on a pin plug, a plurality of pin mounting grooves with different specifications are formed in the rotating wheel, an operator can select a corresponding pin mounting groove according to the specification of an external pin to place and install the pin, after the external pin is placed in the pin mounting groove, the external pin is moved to the axis of the pin plug by rotating the rotating wheel, then a bolt is screwed into a threaded hole until the bolt firmly abuts against the external pin, so that the external pin is stably installed on the pin plug, then the pin plug is in plug fit with a pin socket, the external pin is electrically contacted with a built-in pin, if the intelligent high-frequency capacitor needs to be detached from a circuit, the external pin is directly cut off, and when the capacitor body needs to be recycled, the external pin needs to be replaced again according to the steps, to sum up, this kind of intelligence high frequency capacitor can change the pin very convenient and fast ground, and can change the pin of different specifications according to the demand of difference.
(2) This kind of intelligence high frequency capacitor, the tip at built-in pin is equipped with first slot, be equipped with the toughness clamping piece in the inside of first slot, and be equipped with the screw thread of mutually supporting on the inner wall of second slot and the outer wall of pin plug respectively, when pegging graft the cooperation with pin socket and pin plug, can twist the pin plug, make pin socket and pin plug screw-thread fit, thereby the fastness of connecting between the two has been promoted, and when external pin and built-in pin electric contact, external pin will insert to first slot in, and clip the clamping piece by the toughness, external pin and built-in pin electric contact's steadiness has also been promoted from this.
(3) This kind of intelligence high frequency capacitor, one side of keeping away from first breach at the through hole has seted up the second breach, separate between through hole and the second breach and have toughness barrier film, toughness barrier film has constituted a through channel with the second breach jointly, should link up the one side that the channel is located external pin, and its inside air that can circulate has played the radiating effect fine to external pin to toughness barrier film keeps apart the bolt with external pin, has played the effect of protecting external pin.
(4) This kind of intelligence high frequency capacitor is equipped with preliminary treatment portion, can polish the rust cleaning and clean scrubbing to external pin with the help of preliminary treatment portion to the realization is treated the preliminary treatment of installing external pin, and then promotes the quality of whole condenser.
(5) The manufacturing method of the intelligent high-frequency capacitor takes the capacitor body as a base body, built-in pins on the capacitor body are cut in advance, pin sockets are installed on the capacitor body, required external pins are selected to be installed on the pin plugs, and finally the pin plugs and the pin sockets are in plug-in fit, so that the whole capacitor is assembled.
Drawings
FIG. 1 is a front view of an intelligent high frequency capacitor of the present invention;
FIG. 2 is an enlarged cross-sectional view of FIG. 1A;
FIG. 3 is an enlarged view of FIG. 1B;
FIG. 4 is a bottom view of an intelligent high-frequency capacitor of the present invention;
FIG. 5 is an enlarged schematic view of FIG. 4C;
fig. 6 is a first isometric view of a pin plug of a smart high-frequency capacitor of the invention;
FIG. 7 is a second isometric view of a pin plug of an intelligent high frequency capacitor of the present invention;
fig. 8 is an exploded view of a pin plug of an intelligent high-frequency capacitor according to the present invention.
In the figure: 1. a capacitor body; 101. a pin is arranged inside; 102. a first slot; 103. a ductile clamping piece; 2. a pin socket; 201. a second slot; 3. a pin plug; 301. a through opening; 302. a limiting edge; 303. a first notch; 304. a second notch; 305. a tough barrier film; 306. a third notch; 307. a threaded hole; 308. A bolt; 309. a rotating wheel; 310. a pin mounting groove; 4. connecting a pin externally; 5. a pretreatment section; 501. grinding the hole; 502. sanding layer; 503. cleaning the hole; 504. flexible cotton.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-8, an intelligent high-frequency capacitor includes a capacitor body 1, two built-in pins 101 led out from the bottom end of the capacitor body 1, and two pin sockets 2, which are cylindrical and installed at the bottom end of the capacitor body 1, wherein the two built-in pins 101 are respectively and coaxially inserted into the two pin sockets 2, a second slot 201 is formed at one end of the pin socket 2 away from the capacitor body 1, and the insertion ends of the built-in pins 101 just extend into the second slot 201; the pin plug 3 is also cylindrical and provided with two pin plugs, the pin plug 3 is respectively matched with the two pin sockets 2 in an inserting way, the pin plug 3 is provided with an eccentric through hole 301 along the axial direction, one side of the through hole 301 far away from the axis of the pin plug 3 is provided with a first notch 303, one side of the outer side wall of the pin plug 3 far away from the through hole 301 is provided with a third notch 306, the third notch 306 is internally provided with a threaded hole 307 through towards the axis direction of the pin plug 3, the threaded hole 307 is internally provided with a bolt 308 in a matching way, the through hole 301 is internally provided with a rotating wheel 309 in a rotating way, the side wall of the rotating wheel 309 is provided with a plurality of pin mounting grooves 310 with different specifications around the axis thereof, and each pin mounting groove 310 is arranged through along the axial direction of the rotating wheel 309, and each pin mounting groove 310 can move to a position coaxial with the pin plug 3 with the rotation of the runner 309; the two external pins 4 are respectively installed on the two pin plugs 3, and are specifically installed in the pin installation grooves 310 corresponding to the specifications of the pin plugs, and after the pin plugs 3 are inserted into the pin sockets 2, the external pins 4 are electrically contacted with the built-in pins 101.
Through the technical scheme, this kind of intelligence high frequency capacitor is by electric capacity body 1, built-in pin 101, external pin 4 and be used for pin socket 2 and pin plug 3 that built-in pin 101 and external pin 4 electric connection get up, external pin 4 can freely be dismantled and assembled and change, please refer to fig. 6-8, be equipped with rotatable regulation's runner 309 on pin plug 3, the pin mounting groove 310 of a plurality of different specifications has been seted up on runner 309, operating personnel can remove to select corresponding pin mounting groove 310 to place the installation according to external pin 4's specification, concrete operation is: rotating the rotating wheel 309 to locate the selected pin mounting groove 310 at the first notch 303, then pressing the external pin 4 into the selected pin mounting groove 310 from the first notch 303, after the external pin 4 is placed in the pin mounting groove 310, moving the external pin 4 to the axis of the pin plug 3 by rotating the rotating wheel 309, at this time, the external pin 4 is close to the threaded hole 307, at this time, screwing the bolt 308 into the threaded hole 307 until the bolt 308 firmly abuts against the external pin 4, thereby realizing the stable mounting of the external pin 4 on the pin plug 3 (as shown in fig. 7), then inserting and matching the pin plug 3 and the pin socket 2 to make the external pin 4 and the built-in pin 101 electrically contact (as shown in fig. 1 and fig. 2), thereby realizing the mounting of the external pin 4, when the external pin 4 needs to be dismounted, firstly connecting the pin plug 3 and the pin socket 2, the bolt 308 is screwed out from the threaded hole 307, and the external pin 4 is directly pulled out from the pin mounting groove 310. This kind of intelligence high frequency capacitor if need follow when the circuit is pulled down, directly cut off its external pin 4 can, when needing reuse electric capacity body 1, only need again according to above-mentioned step change external pin 4 again can. To sum up, this kind of intelligence high frequency capacitor can change the pin very convenient and fast ground, and can change the pin of different specifications according to the demand of difference.
Further, as shown in fig. 2, the end portion of the built-in pin 101 extending into the second slot 201 is provided with a first slot 102, two flexible clips 103 are symmetrically arranged on the inner wall of the first slot 102, the middle portions of the two flexible clips 103 are both raised to form an arc-shaped structure, the raised portions of the two flexible clips are close to each other, when the external pin 4 is in electrical contact with the built-in pin 101, the external pin 4 is inserted into the first slot 102 and is squeezed between the two flexible clips 103, at this time, the two flexible clips 103 generate elastic deformation and firmly clamp the external pin 4, so that the stability of the electrical contact between the external pin 4 and the built-in pin 101 is improved, one end of each flexible clip 103 is fixedly connected with the inner wall of the first slot 102, and the other end of each flexible clip 103 is not in contact with the inner wall of the first slot 102, and such a structure can improve the deformation smoothness of the flexible clips 103.
Furthermore, the inner wall of the second slot 201 and the outer wall of the pin plug 3 are respectively provided with mutually matched threads (not shown in the figure), and when the pin socket 2 is in splicing fit with the pin plug 3, the pin plug 3 can be screwed, so that the pin socket 2 is in threaded fit with the pin plug 3, and the firmness of connection between the pin socket 2 and the pin plug 3 is improved.
Further, as shown in fig. 6 to 8, both ends of the inner wall of the through hole 301 are provided with limiting ribs 302 protruding along the axial direction of the through hole 301, the limiting ribs 302 at both ends of the inner wall of the through hole 301 are also located at both ends of the runner 309 and are also tightly attached to both end surfaces of the runner 309, and these limiting ribs 302 play a role in limiting the runner 309 so as to prevent the runner 309 from falling out of the through hole 301.
Further, as shown in fig. 6 to 8, a second notch 304 is formed in a side of the through hole 301 away from the first notch 303, a tough separation film 305 is arranged between the through hole 301 and the second notch 304, the tough separation film 305 and the second notch 304 jointly form a through channel, the through channel is located on one side of the external pin 4, air can flow through the through channel, a good heat dissipation effect on the external pin 4 is achieved, the tough separation film 305 separates the bolt 308 from the external pin 4, and the bolt 308 is prevented from directly contacting the external pin 4, so that the external pin 4 is protected.
Further, the outer side wall of the runner 309 is provided with anti-slip threads (not shown in the figure), so that it is more convenient to rotate the adjusting runner 309, and the runner is not easy to slip in the rotation adjusting process.
Further, as shown in fig. 1 and 3, the bottom end of the capacitor body 1 is further provided with a pretreatment portion 5, the pretreatment portion 5 is respectively provided with a polishing hole 501 and a cleaning hole 503 in a through manner, wherein the inner wall of the polishing hole 501 is provided with a frosting layer 502, the external pin 4 can be extended into the polishing hole 501, the external pin 4 is polished by the frosting layer 502, the effects of removing rust and corrosion are achieved, the inner wall of the cleaning hole 503 is provided with flexible cotton 504, the external pin 4 can be extended into the cleaning hole 503, the external pin 4 is wiped by the flexible cotton 504, the effects of removing dust and dirt are achieved, the polishing hole 501 is in a long strip shape, the width of one end of the polishing hole is larger than that of the other end, the two ends of the polishing hole are connected through an inclined plane, and the polishing hole 501 with the structure can be adapted to the external pin 4 with various specifications.
A manufacturing method of an intelligent high-frequency capacitor comprises the following steps:
a. selecting an intelligent high-frequency capacitor body 1, and cutting a built-in pin 101 led out from the bottom end of the capacitor body 1;
b. a through hole which is matched with the built-in pin 101 in shape and size is penetratingly arranged on the pin socket 2 along the axis;
c. inserting the built-in pin 101 into the through hole, and fixedly connecting the pin socket 2 with the capacitor body 1;
d. selecting an external pin 4, and installing the selected external pin 4 on the pin plug 3;
e. inserting the pin plug 3 into the second slot 201 on the pin socket 2, and ensuring the electrical contact between the external pin 4 and the built-in pin 101;
f. and (4) installing the capacitor assembled in the steps in a test circuit for functional detection, and finishing the manufacture of the intelligent high-frequency capacitor after the capacitor is qualified.
The manufacturing method of the intelligent high-frequency capacitor takes the capacitor body 1 as a substrate, the built-in pins 101 on the capacitor body 1 are cut in advance, the pin socket 2 is installed on the capacitor body 1, the required external pins 4 are selected to be installed on the pin plug 3, and finally the pin plug 3 is in plug-in fit with the pin socket 2, so that the whole capacitor is assembled.
Further, when the built-in pin 101 is cut in the step a, the cutting standard is that the insertion end of the built-in pin 101 can just extend into the second slot 201, as shown in fig. 2, so that the pin plug 3 can be inserted into the deepest portion of the second slot 201, and the mounting firmness of the pin plug 3 and the pin socket 2 is optimal.
Furthermore, pin socket 2 and capacitor body 1 can adopt welding or hot melt or sticky mode to carry out fixed connection in step c, and operating personnel can select the connected mode by oneself according to the demand.
The present embodiment is only for explaining the present invention, and it is not limited to the present invention, and those skilled in the art can make modifications of the present embodiment without inventive contribution as needed after reading the present specification, but all of them are protected by patent law within the scope of the claims of the present invention.
Claims (10)
1. The utility model provides an intelligence high frequency capacitor, includes the electric capacity body, two built-in pins have been drawn forth to the bottom of electric capacity body, its characterized in that still includes:
the pin sockets are cylindrical and are provided with two pins, the two pins are mounted at the bottom end of the capacitor body, the two built-in pins are respectively and coaxially inserted into the two pin sockets, a second slot is formed in one end, away from the capacitor body, of each pin socket, and the insertion ends of the built-in pins just extend into the second slot;
the pin plugs are also cylindrical and provided with two pins which are respectively matched with the two pin sockets in an inserting way, the pin plug is provided with an eccentric through hole along the axial direction, one side of the through hole far away from the axis of the pin plug is provided with a first notch, a third notch is formed in one side, away from the through hole, of the outer side wall of the pin plug, a threaded hole is formed in the third notch in a penetrating manner towards the axis direction of the pin plug, the threaded hole is internally provided with a bolt in a matching way, the through hole is internally and rotatably provided with a rotating wheel matched with the through hole in shape and size, a plurality of pin mounting grooves with different specifications are arranged on the side wall of the rotating wheel around the axis of the rotating wheel, each pin mounting groove is arranged along the axial direction of the rotating wheel in a run-through manner, and each pin mounting groove can move to a position coaxial with the pin plug along with the rotation of the rotating wheel;
and the two external pins are respectively arranged on the two pin plugs, are specifically arranged in the pin mounting grooves corresponding to the specifications of the two pin plugs, and are electrically contacted with the built-in pins after the pin plugs are inserted into the pin sockets.
2. The intelligent high-frequency capacitor as claimed in claim 1, wherein: built-in pin extends to first slot has been seted up to the tip in the second slot, the symmetry is provided with two toughness clamping pieces on the inner wall of first slot, two equal middle part uplift of toughness clamping piece is the arc structure, and the position of the two uplift is close to each other, just the one end of toughness clamping piece with the inner wall fixed connection of first slot, the other end then not with the inner wall contact of first slot.
3. The intelligent high-frequency capacitor as claimed in claim 1, wherein: and the inner wall of the second slot and the outer wall of the pin plug are respectively provided with threads which are matched with each other.
4. The intelligent high-frequency capacitor as claimed in claim 1, wherein: and the two ends of the inner wall of the through hole are respectively provided with a limiting edge protruding along the axis direction of the through hole, and the limiting edges at the two ends of the inner wall of the through hole are also positioned at the two ends of the rotating wheel and are also tightly attached to the two end surfaces of the rotating wheel.
5. The intelligent high-frequency capacitor as claimed in claim 1, wherein: a second notch is formed in one side, away from the first notch, of the through hole, a tough isolating membrane is arranged between the through hole and the second notch, and the tough isolating membrane and the second notch jointly form a through channel.
6. The intelligent high-frequency capacitor as claimed in claim 1, wherein: and the outer side wall of the rotating wheel is provided with anti-skid lines.
7. The intelligent high-frequency capacitor as claimed in claim 1, wherein: the bottom of electric capacity body still is equipped with preliminary treatment portion, it has seted up hole of polishing and clean hole to link up respectively in the preliminary treatment portion, wherein the inner wall in hole of polishing is equipped with the dull polish layer, the inner wall in clean hole is equipped with flexible cotton, just the hole of polishing is rectangular form, and the width of its one end is greater than the width of the other end, and both ends are passed through the inclined plane and are connected.
8. A method for manufacturing an intelligent high-frequency capacitor to which the intelligent high-frequency capacitor of any one of claims 1 to 7 is applied, characterized in that:
the method comprises the following steps:
a. selecting an intelligent high-frequency capacitor body, and cutting a built-in pin led out from the bottom end of the capacitor body;
b. a through hole matched with the shape and the size of the built-in pin is formed in the pin socket along the axis of the pin socket in a penetrating way;
c. inserting the built-in pin into the through hole, and fixedly connecting the pin socket with the capacitor body;
d. selecting the external pin, and mounting the selected external pin on the pin plug;
e. inserting the pin plug into the second slot on the pin socket and ensuring that the external pin is electrically contacted with the built-in pin;
f. and (4) installing the capacitor assembled in the steps in a test circuit for functional detection, and finishing the manufacture of the intelligent high-frequency capacitor after the capacitor is qualified.
9. The method for manufacturing an intelligent high-frequency capacitor according to claim 8, wherein the method comprises the following steps: and b, when the built-in pins are cut in the step a, the cutting standard is that the insertion ends of the built-in pins can just extend into the second slot.
10. The method for manufacturing an intelligent high-frequency capacitor according to claim 8, wherein the method comprises the following steps: and in the step c, the pin socket and the capacitor body are fixedly connected in a welding or hot melting or gluing mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110618733.1A CN113571335B (en) | 2021-06-03 | 2021-06-03 | Intelligent high-frequency capacitor and manufacturing method thereof |
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| US6249422B1 (en) * | 2000-02-01 | 2001-06-19 | Real Power Cap Company | Capacitor module for car audio system |
| CN102598171A (en) * | 2010-09-29 | 2012-07-18 | 欧姆龙株式会社 | Electrolytic Capacitor Socket |
| CN203150398U (en) * | 2013-04-12 | 2013-08-21 | 深圳市瑞康电子有限公司 | Electrolytic capacitor suitable for modular design |
| CN108806982A (en) * | 2018-06-08 | 2018-11-13 | 铜陵泽辉电子有限责任公司 | A kind of fast-connecting type capacitor cover plate |
| CN212322836U (en) * | 2020-07-07 | 2021-01-08 | 江苏瑞友康电子科技有限公司 | Capacitor with waterproof protection |
| CN212750625U (en) * | 2020-08-25 | 2021-03-19 | 达州市金联富电子科技有限公司 | Lead structure for electrolytic capacitor |
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2021
- 2021-06-03 CN CN202110618733.1A patent/CN113571335B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6249422B1 (en) * | 2000-02-01 | 2001-06-19 | Real Power Cap Company | Capacitor module for car audio system |
| CN102598171A (en) * | 2010-09-29 | 2012-07-18 | 欧姆龙株式会社 | Electrolytic Capacitor Socket |
| CN203150398U (en) * | 2013-04-12 | 2013-08-21 | 深圳市瑞康电子有限公司 | Electrolytic capacitor suitable for modular design |
| CN108806982A (en) * | 2018-06-08 | 2018-11-13 | 铜陵泽辉电子有限责任公司 | A kind of fast-connecting type capacitor cover plate |
| CN212322836U (en) * | 2020-07-07 | 2021-01-08 | 江苏瑞友康电子科技有限公司 | Capacitor with waterproof protection |
| CN212750625U (en) * | 2020-08-25 | 2021-03-19 | 达州市金联富电子科技有限公司 | Lead structure for electrolytic capacitor |
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