CN113563691A

CN113563691A - Copper-clad plate base material

Info

Publication number: CN113563691A
Application number: CN202110969289.8A
Authority: CN
Inventors: 冯若峰
Original assignee: Individual
Current assignee: Individual
Priority date: 2021-08-23
Filing date: 2021-08-23
Publication date: 2021-10-29

Abstract

The invention relates to a copper-clad plate base material, which comprises 60-80 wt% of phenolic resin, 9-15 wt% of epoxy resin, 8-10 wt% of solvent and 10-20 wt% of flame retardant, wherein the flame retardant comprises diphenyl cresylphosphate, chlorinated paraffin and epoxidized soybean oil, the percentage content of each component of the flame retardant is 30-85 wt%, the percentage content of chlorinated paraffin is 0-60 wt% and the percentage content of epoxidized soybean oil is 0-10 wt%, and a new flame retardant is added into the copper-clad plate base material, so that the overall performance of a copper-clad plate product is improved, the electrical performance, the welding resistance and the heat resistance are obviously improved, the defects of a batch pattern plate are improved, the edge cutting of the product is smooth, and the punching effect is good.

Description

Copper-clad plate base material

Technical Field

The invention relates to a testing device, in particular to a copper-clad plate base material.

Background

The copper-clad plate product is directly used as a substrate material in the manufacturing process of the printed circuit board, the printed circuit board is widely applied to the industries such as computers, communication, consumer motors, industry/medical treatment, military, semiconductors, automobiles and the like, and almost all electronic information products are involved; among them, computer, communication and consumer electronics are three major application fields, occupying about 70% of the production value of the PCB industry.

In the whole PCB industry chain, the cost of the CCL accounts for more than 30% of the PCB industry, the application field of the paper-based CCL and the glass fiber-based CCL is continuously expanded in recent years, the production capacity is rapidly improved, the cost of the PCB industry is reduced, and the continuously improved environmental protection requirement is met, and the paper-based CCL and the glass fiber-based CCL and the PCB have the following variation trends:

1. the development of the PCB technology puts higher requirements on the CCL, and under the condition, the paper base, the glass fiber base and the composite base copper clad laminate are required to be improved and developed mainly in the aspects of electrical characteristics, high heat resistance, processability of products, low material cost and the like;

2. the EU ROHS/REACH instruction is implemented, a PCB uses a lead-free welding method, the welding temperature is improved by 30-40 degrees in the PCB welding process, and the CCL has higher required heat resistance;

3. the high density of the PCB and the new functionalization and intellectualization of the PCB bring about the development of light, thin and small products, such as heat dissipation, precise layout, packaging design and the like, and also provide more severe requirements for the innovation of the upstream CCL industry;

4. the PCB has the same harsh requirements on the CCL (the thickness of the copper clad laminate substrate is reduced from 3.2mm to 0.2mm, and the thickness of the copper foil is reduced from 70um to 18um) due to the contradiction between the CAF resistance requirement of the PCB and the development of the CCL towards lightness and thinness.

With the increase of the demand of the high heat-resistant CCL CAF-resistant products, the key of production is to maintain continuous production and stable quality. There are some problems with the plates produced in the existing workshops:

1. the gelling time is long, the curing time is slow, and the drying speed is influenced;

2. prepregs are not suitable for storage, and the gummed paper aging phenomenon occurs when the storage period at normal temperature exceeds 24 hours, so that the sheet materials are subjected to batch pattern production due to continuous production;

3. the finished product is easy to be deformed and warped by heat in the downstream PCB processing procedure, so that the automatic production efficiency is influenced;

4. when the PCB is punched, due to the fact that the flexibility of the material is not enough, the appearance of board cracking, powder falling, copper sheet bulging and the like are prone to occurring in punching;

5. the downstream PCB becomes less resistant to CAF during soldering or etching.

Disclosure of Invention

In view of the above-mentioned shortcomings of the prior art, it is an object of the present invention to provide an apparatus that solves one or more problems of the prior art.

In order to achieve the purpose, the technical scheme of the invention is as follows:

the copper-clad plate base material comprises, by weight, 60% -80% of phenolic resin, 9% -15% of epoxy resin, 8% -10% of solvent and 5% -15% of a flame retardant, wherein the flame retardant comprises 30% -85% of diphenyl cresyl phosphate, chlorinated paraffin and epoxidized soybean oil, and the flame retardant comprises, by weight, 0% -60% of chlorinated paraffin and 0% -10% of epoxidized soybean oil.

As a further improvement of the above technical solution:

aluminum hydroxide powder can be added, and the weight percentage content of the aluminum hydroxide powder is 0-1%.

Water-soluble nitrogenous resin can be added, and the weight percentage content of the water-soluble nitrogenous resin is 0-1%.

The flame retardant can be added into a melamine solution, and the melamine solution is 0-5% by weight.

The flame retardant is prepared by mixing and stirring the components, and the temperature during mixing and stirring is 10-50 ℃.

Compared with the prior art, the invention has the following beneficial technical effects:

the base material of the copper-clad plate is added with the flame retardant, so that the curing of the epoxy resin can be promoted, and the cured copper-clad plate has high crosslinking density, high welding resistance, high moisture absorption resistance and high chemical resistance, and finally the appearance pattern caused by poor curing of the copper-clad plate can be improved, and the inherent performance quality of the plate can be improved. The produced finished product can effectively improve the flatness stability in the downstream customer PCB manufacturing process, keeps the flexibility of the product suitable for punching processing and manufacturing, and reduces the problems of powder falling, board cracking and the like. (ii) a

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the following detailed description of the proposed apparatus is provided in connection with the embodiments. The advantages and features of the present invention will become more apparent from the following description. It will be understood and appreciated by those skilled in the art that changes in form and detail may be made without departing from the spirit and scope of the invention, the invention also includes the full intended scope of the appended claims.

Example one

The copper-clad plate base material of the embodiment has the following formula:

name of raw materials	Original formulation (+ TCPP)	Alternative flame retardant 1(590A)	Substitute fire retardant 2(590C)
				055	60	-	-
590A	-	60	-
				590C	-	-	60
SH	185	185	185
				ES-1	506	506	506
016	130	130	130
				Aluminum hydroxide	7.5	7.5	7.5
028	85.5	85.5	85.5

Preparing glue solution in a laboratory by using the formula, respectively testing the gelling time to be within a qualified range, and then manually gluing and drying, wherein the tested gelling time and the weight of the dried gummed paper are respectively as follows:

	TCPP	alternative flame retardant 1(590A)	Substitute fire retardant 2(590C)
				Gel time/s	153	155	157
Weight of glue per gram	268.0	273.5	259.0

SH and ES-1 are two different phenolic resins, 016 is epoxy resin, 028 is a glue-making solvent, and a brand-new 590A flame retardant and a brand-new 590C flame retardant are adopted to replace the traditional TCPP flame retardant;

590A flame retardant comprises the following components in percentage by weight: 65% of diphenyl cresyl phosphate, 28% of chlorinated paraffin, 5% of epoxidized soybean oil and 2% of melamine solution;

590C flame retardant comprises the following components in percentage by weight: 65% of toluene diphenyl phosphate, 30% of chlorinated paraffin and 5% of epoxidized soybean oil;

after the plate is pressed, various basic performances of the plate are tested, and the obtained related performance evaluation data are as follows:

from the above table, the following conclusions can be drawn:

1) from the welding resistance data, the welding resistance value of the copper-clad plate obtained by using 590A and 590C flame retardants to replace TCPP is higher than that of the formula of the TCPP flame retardant. 590A and 590C are relatively close, averaging 25.4s and 24s respectively. The same principle of peel resistance is applied, but the requirements can be met by using 590A and 590C flame retardants. The bending strength of the three components is close;

2) the electrical properties of the three are close to each other and all can meet the requirements. Water absorption comparison: 590A <590C < TCPP <2.0, it can be seen that the addition of the new flame retardant can improve water absorption to some extent;

3) in the flame retardant aspect, the primary flame retardant data and the secondary flame retardant data all reach the UL94 standard, but the secondary flame retardant data have 2 samples exceeding the index, and the deviation possibly exists in the test process, so that further experiments can be carried out for verification.

Example two

name of raw materials	Original formulation (+ TPP)	Alternative flame retardant 1(590A)	Substitute fire retardant 2(590C)
				SH	308.5	308.5	308.5
ES-1	308.5	308.5	308.5
				JP-050	140.6	-	-
590A	-	140.6	-
				590C	-	-	140.6
015	81.2	81.2	81.2
				076	10	10	10
W100	65	65	65
				028	86.2	86.2	86.2

	TPP	substitute flame retardant 1	Substitute fire retardant 2
				Gel time/s	197	187	192
Weight of glue per gram	281.2	279.6	271.2

Wherein SH and ES-1 are two different phenolic resins, 015 and 076 are epoxy resins, W100 is water-soluble nitrogen-containing resin, and 028 is a glue-making solvent.

from the above table, the following conclusions can be drawn:

1) the welding resistance values of the three are close, the average values are respectively 33s,34.8s and 35.8s, and the substitute flame retardant is slightly higher to a certain extent. And (5) stripping resistance. Both alternative flame retardants are superior to TPP, and TPP is less than standard. The bending strength of the three components is close.

2) The electrical properties of the three are close to each other and all can meet the requirements. In the aspect of water absorption: 590A <590C < TPP <2.0, it can be seen that the addition of new flame retardants can improve water absorption to some extent;

3) in the aspect of flame retardance, TPP and 590C flame retardants are used and exceed the standard sample, while 590A flame retardants meet the standard sample, and further experiments can verify the flame retardance.

Then the copper-clad plate is tested as follows, and the test data is as follows

The overall performance of the product is improved, and the electrical performance and the heat resistance are obviously improved.

The copper-clad plate produced by using the new sizing material formula can improve the defect of the pattern plates in batches, the defect of the pattern plates is reduced to 0.2% from the original 0.7%, the copper-clad plate can be continuously produced in batches in a workshop, the production cost is greatly reduced, the edge cutting of the product is smooth, the punching effect is good, and the problems that the traditional edge starting is easy to crack and burr and the powder falling occurs in punching are solved.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims

1. A copper-clad plate base material is characterized in that: the flame retardant comprises, by weight, 60-80% of phenolic resin, 9-15% of epoxy resin, 8-10% of solvent and 10-20% of flame retardant, wherein the flame retardant comprises 30-85% of diphenyl cresyl phosphate, 0-60% of chlorinated paraffin and 0-10% of epoxidized soybean oil.

2. The copper-clad plate base material of claim 1, wherein: aluminum hydroxide powder can be added, and the weight percentage content of the aluminum hydroxide powder is 0-1%.

3. The copper-clad plate base material of claim 1, wherein: water-soluble nitrogenous resin can be added, and the weight percentage content of the water-soluble nitrogenous resin is 0-1%.

4. The copper-clad plate base material of claim 1, wherein: the flame retardant can be added into a melamine solution, and the melamine solution is 0-5% by weight.

5. The copper-clad plate base material of claim 1, wherein: the flame retardant is prepared by mixing and stirring the components, and the temperature during mixing and stirring is 10-50 ℃.