CN1135623A

CN1135623A - Method for making identity card and identity card thereof

Info

Publication number: CN1135623A
Application number: CN96105510A
Authority: CN
Inventors: W·沃特
Original assignee: INTLUOK PUBLIC AG
Current assignee: INTLUOK PUBLIC AG
Priority date: 1995-02-09
Filing date: 1996-02-09
Publication date: 1996-11-13
Anticipated expiration: 2016-02-09
Also published as: DE19504194C1; DE29502080U1; EP0726541A3; EP0726541B1; CN1145559C; DE59611165D1; EP0726541A2; US5804026A

Abstract

For producing identity cards, access cards, identification cards, or the like, containing electronic and/or electric components, including such with outwardly directed contacts, it is proposed that at least one central layer of the card, containing also the electronic and/or electric components or consisting thereof, be initially retained in floating condition by adhesive quantities applied as floating mass at least on one inner face, and be then progressively compressed to a thickness that is predetermined by stops, without any application of heat, and be finally cured so that the electric and/or electronic components are supported in the finished card, embedded in the intermediate adhesive layer so formed.

Description

Make the method for ID (identity number) card and the ID (identity number) card of making according to this method

The present invention relates to a kind of method, and relate to a kind of ID (identity number) card or the ID card, especially have a kind of ID (identity number) card that contains the structure of electronic unit according to claim 1 preamble making ID (identity number) card.A kind of like this cartoon that can be used for the application scenario of any kind of often also is called as chip card.The invention still further relates to a kind of device of on this method basis, making chip card.

In this chip card, or usually in other element, contain electronics or only contain in the carrier of electronic unit, promptly, under the simplest situation, in a kind of mode of resonant circuit with a coil and/or capacitance adjustment to a characteristic frequency, this just allows to move on personal identification verification system and the similar device and look into rope control system, false proof device by this carrier element is fixed on the article, may produce considerable problem in the making.

Usually, this (chip) card or carrier element (latter also is rendered as a kind of chip card shape or a kind of flat element shape under any circumstance usually) are to adopt common known lamination to make, this technology will contain (for example) exactly and be preferably in the many layer of PVC and combine, promptly, under the compound action of heat and elevated pressures, in laminator, overlap together, this just means that different layers to card (promptly their adjacently situated surfaces) at least heats, and makes it be in bonding state (promptly fusing together) in these zones in specific inseparable mode.

Owing to heat and pressure effect make its this class laminating method that is different from other method owing to a variety of causes finds to be unsuitable for putting into sensitive electronic components, because these elements will be subjected to the effect of sizable power at least, may be impaired and even can be because lamination process and destroyed, and another aspect relates to that electronic component may show by the surface of the adjacent chip card of each layer, promptly becomes detectable possibility.Therefore, for these elements, do not wish that they touch or directly place on the adjacent layer, and this is also because element needn't have very level and smooth surface, but unsmooth or vacancy may appear, this may cause unevenness or adjacent fusion plastic material is flowed in this vacancy, also can have execution.

Satisfy quite high requirement though taked multiple means to attempt to make, especially satisfy the chip card of the requirement that avoids waste by means of laminator commonly used or laminating method, but this purpose did not also reach in recent years, because people always run into the limitation that is difficult to overcome, though even a kind of method-people that obviously will adopt laminated method by means of examining a plurality of actual parameters so that the result of its more approaching hope can not utilize known laminating method to obtain the success of one of percentage hundred.For example, in the applicant's method for making, though even carried out multiple effort for many years and when having adopted enforcement means the most complicated for laminating method, also only reached 95% action limit value.

In order only to list several in many known laminating methods, with European patent application EP 0,621,139A1, EP0,399,410A2, US Patent specification 4,999,065 or UK Patent Application GB2,276,291A is as a reference.

So, purpose of the present invention just provides a kind of manufacture method and implementation tool of carrier body, this carrier body is normally with the carrier body of the form of the card that contains electricity or electronic component, the i.e. ID (identity number) card of chip card, phonecard or other any kind especially, these are stuck in when having a kind of attractive outward appearance, can comprise the sizable electronics and/or the electricity component that have Any shape and be in any distribution, and guarantee to get rid of any damage of making this class component of method generation by this reliably.

The present invention relies on the feature in the claim 1 to reach this purpose, and provide such advantage, promptly might produce now and comprise a kind of disclosed middle layer, even has the thickness of any hope, the extremely sensitive electricity of shape and physical dimension and/or the carrier body and/or the chip card of electronic component, wherein element or chip are clamped between the overlayer that embeds in the sheet in manufacturing process, promptly do not contact basically with the adjacent layer of card or carrier body and-obviously-embedding after sheet solidifies, they can be fixed and held on this position, simultaneously such sheet has constituted one and has had predetermined thickness in the hierarchy that constitutes card or carrier body, obviously be different from the lipostrat of other layer.

By in remaining card layer, electricity and electronic component being spaced apart fully; wherein be provided with like this and can (in simple embodiment) constitute overlayer or form additional middle layer according to the specific device of the card of final acquisition; not only aspect the initial embedding of those elements and holding; and in use subsequently, all has an advantage; because mechanical stress or pressure directly do not import on electricity or the electronic component, this is because the latter has been kept safely and protected in the embedding sheet cured layer of himself.

Therefore, this also makes electricity or electronic component with virtually any size to be integral with corresponding year part parts or blocking, for example comprise the antenna pattern of being made up of the superincumbent coil of a plurality of common printings, wherein these coils and peanut capacitor and other electron component combine the resonant circuit that can constitute permission employing non-contact scanning method.

So, an advantage of the present invention is exactly the cardinal rule by the laminating method of abandoning using always, can not be subjected to any stress ground and card or carrier body to make one electronics or electricity component, and its sealing can be used within it and in the use of card, the present invention simultaneously is simplified to such degree with the making of this card, promptly, to for different materials, always need careful complicated parameter in essence of regulating, its kind, thickness or other characteristic replace with a kind of " mull technique ", although this term does not limit the notional scope of the present invention.Yet, under any circumstance, no longer need to adopt heat, and applying of very important before this pressure is present in such a way by suitable adjustment and qualification, the sheet that promptly comprises electricity or electronic component has at least formed additional card layer after it solidifies, therefore obviously, owing to do not have heat and limited ground fully, the cause of very carefully exerting pressure, manufacturing process can never be introduced stress on electronics or electricity component now, makes people expect can not produce waste or the trouble that is caused by method for making in use subsequently.

Though combine like this or with laminating method, (plasticity) layer that will have one or two adhesive surface is inserted into treats that between bonding disclosed (plasticity) layer be known, but the purpose of this arrangement normally makes adjacent lamination be bonded together, what this mode obtained is bonding good more, preferred more, the pressure that needs is big more.And, can apply heat as feasible.Therefore, " bonding coat " (only being) that in laminating method commonly used, runs into as thin as a wafer, and they have played any effect of himself really, so, in the time of in manufacturing process or afterwards certain, the danger that does not exist bonding coat from layer structure, to break away from.

This situation is very different with the present invention, because at this, dose adhesive sheet or glue with the q.s that allows electricity or electronic component (if necessary even with himself flat carriers layer) " suspension ", or the bonding plastic material of semi liquid state, after this, to handle to form the lipostrat of the card of so making these bonding sheets that definitely is evenly distributed in manufacturing process on the whole card zone, wherein each layer all has almost homogeneous thickness and can be described as lamination at this point in all places.Owing to be placed in the synusia like this; element is maintained reliably by safety, and also is protected from be fabricated into use subsequently, and also protects these elements not exposed or do not contact with adjacent layer; and then under corresponding transparent condition, they can also become visible.

Another advantage of the present invention belongs to such fact, promptly, if present, as the whole center of these elements (carrier) layer, electricity of putting into or electronic component can suitably comprise some snotteres, projection, vacancy or analog, because these snotteres or projection can be balanced out and integration by the method for making that is proposed.Therefore, can say exactly also that combine with method for making according to the present invention, these electricity and/or electronic component are to be suspended in a little in the card; They are clamped between the adjacent layer loosely and can be subjected to any pressure effect, have absorbed because pressure is embedded into the sheet of element, and have been used as a conforming layer by this sheet in addition and are distributed between the adjacent skin to fill this space and to solidify subsequently; It should be noted that, in this combination, distribution will can not cause embeding layer or sheet to flow out to beyond the borderline region like this, in any case because in case can judge the sheet that contains electricity and electronic component and all will be dispersed in whole card surface equably by the quantity of corresponding semiliquid, high viscosity glue or bonding agent the time, just stop to exert pressure in fact automatically.

This initial constant exerting pressure, subsequently the mode that when reaching predetermined thickness, stops to exert pressure can by one (on) stop on the pressure plare obtains, thus, the upward pressure plate can add the bonding coat of permission (on the both sides) the corresponding to degree of thickness near the actual (real) thickness of (descending) pressure plare-wherein comprise card layer to be glued together-part card layer that both only are close to and insert between two plates.

The invention discloses the multiple novel method of preferably realizing card shape slide glass parts, because at present quite the electronic system of complexity and card type structure are made one and without any problem first, even and this type systematic is very responsive or be difficult to embed, or its planform makes that the present invention also can finish in the time of can not making by laminated technology commonly used.

After this will be described in greater detail with reference to the attached drawings preferred embodiments more of the present invention and the method according to this invention.

Fig. 1 represents to have the side view of first kind of possible hierarchy of waiting to make card of the electricity of firm one or electronic component; With

Fig. 2 represents the top view along the II-II line according to the card structure of Fig. 1; Simultaneously

The final expression of Fig. 3 is so made finishes, and solidifies the card shape laminate of compression, and wherein the latter will be made in making step subsequently, the final external dimensions of card commonly used;

Fig. 4 represents to be used for to make first possible embodiment of device of the laminated product of card under limited pressure, comprising at card structure " laminated " at least one bonding coat by solidifying to form afterwards;

Fig. 5 represents to be used to make another possible embodiment of a device of the card shape carrier body of electricity or electronic component, wherein utilizes roller bearing or cylinder to realize providing continuously laminate; And

Fig. 6 represents that has being placed on electricity on the carrier layer or electronic component and all being embedded into the top view of a possible embodiment of intermediate product of sheet sealing in all sides of embedding, wherein by taking out top layer, the bonding coat that can will add at the top comes out.Top layer comprises overlayer that (for example) is provided with for the most initial bonding process.

The most basic idea of the present invention is to make a kind of ID card, access card, chip card of being used as Or the carrier body of the shape that preferably has card commonly used of similar card, in each case required With desirable electricity and, or electronic component is suspended in a little in the card structure, that is, real Kept loosely within it at the very start on the border, by applying a company that is properly adjusted Continuous pressure, finally the effect by stop stops making the laminated product of card with it, At last the suspension lamella that contains electricity or electronic component is cured processing, so that at card structure Discontinuity layer of interior formation, wherein this card structure is definitely to be bonded together securely, because of Again adhesive layer during for suspension sheet interlayer.

Fig. 1 has represented first possible embodiment of the present invention, and this embodiment relates to by each card layer or lamination and makes the electronics that has one and or the method for the finished product card of electricity component.

Be provided with for this reason below one or first part card layer 11, be preferably the form of PVC layer, and also preferably have than the bigger size of card, on this size that exceeds, apply a kind of bonding agent or the adhesive glue of scheduled volume with the plastic substance formula.If bonding agent only when a corresponding time period finishes, occurs, then this bonding agent or glue can also comprise a kind of semi liquid state, the plastic material of corresponding thickness, and can have any desirable characteristic, and then obtain a solid bed, wherein in certain limit, keep elasticity and its good adhesion characteristic can produce this moment and the closely bonding of adjacent (part) card layer certainly.

Represent bonding agent-in further specifying after this, will mainly adopt this term with reference number 12, for example in the top view of Fig. 2, bonding agent can comprise that two strings are intersected with each other and be applied to bonding agent on the bottom card (PVC) according to a kind of suitable mode, the simplest situation is to adopt a kind of suitable hand-held dissemination apparatus, but preferably adopt full-automatic method certainly, can adjust the amount of coating so more accurately.

For understanding the required and/or desirable characteristic of bonding agent better, also will describe below, therefore, following explanation will at first relate to further step, and with reference to shown in Figure 1 these steps be described.Described device is continued by 13 tops, middle level, it can by the flat carriers or carrier layer 13, the integrated circuit component 15 that are bearing in, are contained in or be fixed on electronics on this layer or electricity component with certain alternate manner (as laminated technology commonly used and play a kind of printed coil winding 14 of antenna effect), adopt usually known SMD technology be fixed on carrier layer 13 ' on other electricity or electronic component 16, or analog is formed.SMD is that the abbreviation of " surperficial stationary installation " and the meaning are a kind ofly to be fixed on the carrier surface by adhesive glue but also to be electrically connected the small-sized electricity component of (only mode is to adopt immersed solder) with it.

Find out obviously that from shown in Figure 1 middle level 13 obviously also can comprise alloy, jut, passage or analog, this just means the specific (special) requirements that electricity/electronic structure can have any desirable shape and can be adapted to every kind of situation.

On this middle layer or middle level 13, apply a certain amount of bonding agent 12 again, for example also with the form of string intersected with each other, will of course be appreciated that can also be on last application of adhesive on the bottom surface of (PVC) overlayer 17, yes then applies bonding agent at it on laminated.

Should also be understood that in this connection, can be by a kind of mode definitely arbitrarily mode of a central point or two central points (promptly with) application of adhesive 12, and they are distributed on the whole respective surfaces to be symmetrical arranged easily; Under any circumstance, the amount of putting into the bonding agent between layer and the layer like this must be by suitable investigation, detect or calculate and determine, when dispense adhesive is with the flat overlayer of formation on adjacently situated surfaces equably with box lunch, so the bonding coat that constitutes will have given thickness, that is, this thickness can be scheduled to and easy predetermined fixed and under any circumstance must allow the middle level 13 of charged or electronic component to place in the space between two

overlayers

11 and 17 and being held in place loosely in any case in the phase one with having a few suspension.In this connected, term " in the phase one " meaned such fact, promptly kept central core 13 or had only this " loose " location of electricity or electronic component to solidify up to the bonding agent of putting into this layer or element under other embodiment situation.

Further method for making comprises the layer structure 10 that constituted adhesive spots that having of finished product card apply or string is afterwards therebetween put into as shown in Figure 4 the sort of suitable but clear and definite improved press 20 then.Because the bonding agent bundle is still (at least in the example shown) with string or other form concentration of local, the stratiform card thickness of structure that therefore comprises

layer

11,13 and 17 also is not defined; Adopt laminator 20 shown in Figure 4 that stratiform card structure is depressed into a specific thickness then.In this connection, should note following points.Laminator 20 shown in Figure 4 comprises a lower supporting plate 21, the resilient supporting unit 23 going up stacked pressuring plate 22 and be used for lower supporting plate 21, this device has guaranteed that the pressure that acts on the card structure 10 that is present in the laminator will be no more than corresponding predetermined and prevalue when producing the pressure of any kind of by certain effect or other effect by last stacked pressuring plate 22.This is to be guaranteed by the spring 23 that supports described lower supporting plate 21, in the process that stacked pressuring plate 21 moves downward-pressure that can any hope moves, but must be distributed on the predetermined amount of time-this has just guaranteed spring 23 making property elastic responses so that (as being easy to find out) in fact the pressure between two

plates

21,22 will be limited by the buffer brake that applies by spring 23.For example be appreciated that, can also adopt the initial stacked pressuring plate 22 of pressurized air, in this case,, then can especially easily guarantee flatness on all parts of last stacked pressuring plate because pressurized air works equably.Because be applied to the cause of the limited pressure on the card structure 10, this structure will be compressed in a predetermined amount of time, this depends on the decline rate of stacked pressuring plate 22.Compression with limited pressure has effect like this, promptly, adhesive line 12,12 ', more generally say so and place the adhesive sheet of interlayer, flattened gradually, and subsequently with its viscosity and the whole possible surface of the as one man flat cloth of moving phase on, be understood that, compression speed must be adjusted to the flowing velocity of bonding agent, its quantity must be adjusted to the desired thickness of the adhesive phase of generation like this, and for the flow velocity of pressure and the restriction of required time of exerting pressure-equally also must adjust to bonding agent and viscosity-must be able to guarantee to give bonding agent to be evenly distributed on whole lip-deep chance.For example, if apply two row's adhesive spots in mode at a distance from each other, then also can produce the distribution of the uniform adhesive phase of a kind of absolute perfection, because at the beginning, these points just move towards each other when exerting pressure gradually, and work as these points and contact with each other then, they will be attempted to the side effusion and utilize all possible space so that finally obtain a kind of Ideal Match to allow to put into susceptibility electricity or electronic component between making layer product and required degree of freedom with suspending.

Certainly be appreciated that pressure does not apply continuously, because can cause a kind of formation of the pressure that increases continuously like this, this is because the elasticity of stratiform card structure will be subjected to the restriction of its limited thickness certainly; On the contrary, relatively moving between the

stacked pressuring plate

21 and 22 that produces owing to the pressure effect just stops when the stratified pieces structural thickness reaches a predetermined general thickness, and then adjust and finally reach a predetermined general thickness and just stop, and then adjust and finally reach a predetermined card thickness-this thickness and can determine according to following manner.For determining final thickness, local thickness's (because the cause of physical factor, these thickness are constant) phase adduction of different layers is determined bed thickness X ₁And X ₂, wherein the adhesive sheet of hypothesis dispersion is in any side in middle level 13 in laminates.And then obtain a total laminates thickness:

D _G＝d ₁₁＋d ₁₃＋d ₁₇＋X ₁＋X ₂

In case reached this overall laminates thickness (this thickness will appear in the thickness of finished product card) in pressing process, then the relative motion of pressing process and/or two stacked

pressuring plates

21 and 22 promptly stops in some way, interrupts or prevention, and bonding coat is solidified.13 both sides needn't be greater than about 0.1mm in the middle level for the thickness of these layers, but can cover according to waiting of will being supported loosely at the beginning in process, electronics to be suspended and the requirement of electricity component choose at random.This can realize by the final definite measured in the space that will reach and amount of binder to be applied are suitably adjusted.

Expression embodiment illustrated in fig. 4 a kind of specific implementations of the present invention, wherein retainer 24 or stop mark with a kind of suitable mode be provided with box lunch reached card layer product final required predetermined thickness stop pressing operation, stop is done 24 and is arranged between two stacked

pressuring plates

21 and 22 so that limit an accurate predetermined thickness and limit final interval thus.Be understandable that can also provide different retainers 24 with this simple and practical device with advantage, each retainer comprises a 24a of bar portion and the 24b of microcephaly portion; The effect of bar portion is in the receiver hole 25 that is inserted into loosely in the back up pad 21 simultaneously, the work of the head 24b that can make by different process for machining (grinding) has to such an extent that preset different thickness so that by maintain the different separator 24 of right quantity on back up pad, can be the predetermined different thickness of various chips card.

In a word, the manufacturing process of this card is such, last stacked pressuring plate 22 is in a kind of suitable mode and mechanically drop to lower supporting plate 21 in finite time, and need not to consider that (at least in this embodiment) is applied to the effective pressure on the upper plate 22, because the effect by its spring support 23, lower supporting plate 21 are in and a kind ofly can flexibly produce and and then absorb or consume the position of any excessive pressure.The compression to stratiform card structure will can not be effective in process for moving down at stacked pressuring plate 22 for these.In case it is thick to reach predetermined final card, retainer 24 becomes effectively with the further relative motion downwards that limits stacked pressuring plate 22-or in other words: the thickness that is reached keeps constant.

The possibility that stacked pressuring plate 22 is descended so also is provided, has for example adopted even manual rib linkage makes it move on to the head center position at its end of travel in placely can be removed in the process that next time moves upward at plate up to the card laminate so that be fixed in.As previously mentioned, the resilient supporting unit by lower plate makes the excessive amount of motion that goes up stacked pressuring plate 22 be balanced.

After this, the characteristic according to the corresponding material behavior that is adopted and bonding agent, viscose glue or elastic adhesive material is solidified equally distributed bonding agent or adhesive-layer; Normal curing can be spent the time of several hrs; Have the bonding agent that certain makes the property that its ultraviolet (UV) solidifies yet can also adopt, comprise in the bonding agent in other words and guarantee the photosensitive composition that in a shorter time, solidifies.

This can realize by the filling material (so-called pipeline group system) that preferred this UV solidifies adhesion substance or substitutes the unexpected curing under the UV irradiation accordingly, the curing of these materials or filling material is started by initial UV irradiation, after this will be little by little, but in the short period section, for example (cationic system) is cured a few minutes.Before each (lighttight) overlayer being placed on the adhesive sheet that applies in advance, can allow adhesive sheet stand the UV irradiation in short time in this case, finish and suppress this stratiform card structure then and after this it is stayed in the press up to its full solidification, although this back step not necessarily, because initial laminate step after and after the supposition adhesive phase is the shape of one deck, they will no longer change its size and extension.This situation, for example, can be by the suspension sheet being selected accordingly or being adjusted and realize.

Another aspect is also very important in this connects; The front was mentioned, the outer dimension that forms stratiform card structure strengthens, even because measure the words of the bonding agent that is applied exactly, can't guarantee that also the bonding agent that scatters will reach and covers outmost edge equably, shown in Fig. 2 top view, if the layer of the original laminate that adopt to strengthen is made stratiform card structure 10, can guarantee all that under any circumstance coated bonding agent is dispersed in and is filled in equably by at least on the possible surface of the different layers within the limit of the final size of the card of as shown in Figure 2 reference word word 11 ' expression.In order to allow with covering the required finite quantity of increasing layer with this fully or being lower than this bonding agent of limiting the quantity of is to work, also require the original part layer that strengthens is selected, " each of laminate layer " of final size with finished product card is even can cause a kind of situation that not accuracy is wherein arranged when applying the bonding agent of scheduled volume a little, bonding agent is overflowed between the edge, and this is a kind of undesirable situation and even can causes device interrupt.Because the size of the part layer that is adopted strengthens, coated amount of binder be not very strict and as need even can manually measure must be covered by a uniform adhesive phase with predetermined thickness in the electronic component both sides because added bonding amount only need guarantee actual inside caliper cun 11.

After the adhesive phase of being represented by X1 and X2 solidifies, then only need the finished product card structure is cut into the practical dimensions of this card, for example by punching press in the sectional view of Fig. 3.If do not require this punching operation, consider selected certain material, can carry out punching operation in such a way, promptly reserve a bigger surplus, after this by surface working process-by the final card format of the edge grinding that on suitable robot apparatus, carries out or similar processing-make.

Can also make semi-manufacture by means of method of the present invention, for example in initial product, be used as the sort of middle layer in middle layer 13 according to Fig. 1.As shown in Figure 6, in this case, can be provided with a following carrier layer 11a, comprise (for example) a kind of suitable transparent plastic material and also have the size of corresponding increasing that these materials can be placed in carrier layer 11a by (for example) and have, are inserted in the corresponding slotted recess 26 (being used for forming antenna) of establishing within it or by assembling power backup and/or electronic component with certain alternate manner with modes such as carrier layer 11a temporarily are connected.In front among the embodiment with reference to Fig. 1 and the description of accompanying drawing subsequently, carrier layer is then as lower floor, and also may (for example) with little droplet, point or similar type be positioned at or establish thereon carrier layer and/or electronics and electricity component on apply the bonding agent of aequum, and place (for example) one single tissue layers at last thereon, when no longer needing, this layer paper can be removed.Subsequently, if hand over total to place laminator 20, as shown in Figure 4, bonding agent will be forced in institute's opening, open space, gap or the similar structures, but also move on carrier board, forming one deck, thereby here electronics or electricity component are put into loosely or are suspended in wherein up to reaching final thickness, at this moment once more along outside direction, in this case, an application of adhesive and the adhesive phase made has reached desirable predetermined thickness.According to the front in conjunction with described method shown in Figure 1; someone successfully installs element and be sealed on the carrier board 11a in a kind of mode shielded and that do not disperse in this way; and they are fixed on this plate simultaneously; so that can with initiation layer that element is housed on it as the further processing that combines with other card layer-also be adopt normal, i.e. Chang Yong laminated step-intermediate product or middle layer 13.If carry out like this, then bonding coat itself forms the middle level.

Another kind by the corresponding card structure of bonding making may be shown in Fig. 5 and comprise a kind of more continuous running program, wherein can also take can be by the upper and lower overlayer 11b of the form of the strip of foil of pulling out on the suitable donor rollers, 17b delivers in a pair of

press roller

27,28 with mutual neat setting, is formed with the roll gap that (adjustable) has preset width therebetween.

In this case, if want to make and the consistent chip card of stratiform card structure shown in Figure 1, then can be at coiled material 11b, the 17b inboard applies corresponding rope form adhesive line 12a continuously, for example form outer field those adhesive line, and for example adopt automatic feed system in the mode of the service tank that in position is provided with opening 30 and pump 29, simultaneously between two strip of foil, carrier body 30 that separates or the carrier body that corresponding electronics or electricity component are housed on it are introduced with suitable conveying device, the continuous carrier that perhaps will be rendered as the thin slice bar shaped and each element is housed is incorporated into overlayer 11b, between the 17b, can also need not at last that any carrier ground carries out and electronics or electricity component are introduced directly into out at last lower caldding layer 11b, in the gap between the 17b.Here, in the bonding agent that adheres to the strip of foil inboard, can also obtain fully loose and putting into of suspending, wherein work as strip of foil and enter into a pair of pressure roller 27, in the time of in the gap between 28, it moves closer to each other up to them and arrives the roll-gap region that narrows down, consider time dependent factor, functional condition is with identical according to the described press of Fig. 4, because the cause of that increase but limited pressure, the bonding agent that is applied to both sides because of-but sweep away also only in a side in some feelings, especially when sending into electronics and electricity component in the press separately-fully be distributed in component ambient and strip of foil 11b, on the adjacent inside surface of 17b up at pressure roller 27, form invalid adhesive phase in the narrowest gap between 28, wherein this layer forms middle level 13 with electricity or electronic component subsequently, remove the clear and definite disclosed carrier layer of negator tool a dance squad, shown in 30 and 31.

The speed that continuous stratiform card structure is sent into by two

pressure rollers

27,28 also is applicable to the component of adhesion substance, its flow or viscosity guaranteeing at least being full of needed adhesive phase in the close clearance between two pressure rollers have the perfect card structure of announcing layer so that utilize subsequently cutting operation to make.Preferably by locating a bit that in the roller downstream stratiform card structure is taken out realization, that is, in such a way: roller itself is with motionless, because might cause relativity shift like this in such conveying.

For by service tank, the control of the amount of binder that provides by pump or opening 30 best by means of 32 expressions among Fig. 5 suitable control circuit and instruct according to continued operation by means of the microprocessor that has corresponding memory storage with different adjusting of storage and steering order and to carry out.

As for shown in Figure 1, should further notice, as be readily appreciated that, under the situation of thicker cementing line in 13 both sides, middle level or point-or, usually under the situation of all insertion electronics or electricity component-have a kind of danger, that is, last but not least because the possible slip or the slip characteristic of bonding agent, in the starting stage, might make its skew or be extruded, or change its position.Like this, can be for this reason for middle level 13 auxiliary little maintenance pin 13a be set on all sides of carrier or

overlay

11,17 above and/or under locational outside the card structure easily, wherein make to place elastic threads 12 by light pressure, thus 12 ' on central plate 13 be caught to catch and be secured in place to make in the incipient stage and keep pin to become effectively.In the last production run of card, then carry out punching press and cutting process in such a way, that is, as previously mentioned, along the line 11 of card structure ' the remove borderline region that these keep pin and exceed.

There are a plurality of purposes relevant of the present invention that especially should mention in this and the brass tacks of advantage.Should be appreciated that, the present invention is not only applicable to comprise than the preceding described chip card that any internal electronics that contacts is not arranged with the external world, but also can have special advantage aspect the general contact-type card being used to make, so-called contact-type card is exactly the chip card that can contact with external device (ED) (for example phonecard).Under the situation of this contact-type electronic cards, provide one to be located at the electronic module that is provided with in such a way in the card laminate, promptly, a lip-deep outside at card can freely contact, so that (for example) is when inserting a phonecard, these contacts will be set up the contact of a kind of physics in corresponding device thereof, as long as and then allow chip and/or module be arranged in card can to set up a kind of telecommunication annexation.

According to a kind of method that preferably is used to make this contact-type chip card, can on a kind of like this laminate skin of card or film, be provided with-preferably perforation-opening to be to hold electronic module exactly, perhaps its external contact at least.Constitute afterwards on the side of the outside of blocking, preferably by a kind of suitable adhesive tape sealing, for example the trade mark that can buy is called the adhesive tape of Scotehtape or Tesafilm to this opening; When chip module suitably was contained in the opening, then parts surface constituted an external card lamella-under the situation of the 2nd embodiment, and wherein parts are that form (for example descending offset plate) with strip of foil to be bonded together provides.

Specifically, fully might be in the mode of suitable line or point in carrying or comprise on the inside surface of module and apply the bonding agent/plasticity group or group of suspension with outwards outstanding contact; Therefore, be convenient to only adopt a secondary cover layer, according to first embodiment, this layer be by means of spacer be crushed on top in case make with closely around this layer and have the water suspension sheet of the such module of mud of point image to constitute the 3rd inside and the middle level in this scope; Perhaps, also provide the cover sheet bar, and two strip of foil are passed a pair of pressure roller according to second embodiment.In this case, the clearance of predetermined width that has between two pressure rollers after regulating has then caused forming the 3rd middle level by that sheet that applies for the suspension sheet of electronic module at the beginning.

The mechanism that obtains thus comprises, being fixed with the chip layer of chip or the inside of chip film on it is surrounded by elasticity suspension sheet, outside simultaneously Tesafilm layer has guaranteed plane contact fully, and guaranteed fully in all sides in addition, around the similar conversion between the suspension sheet of module and this chip.When the incomplete adaptation module of the original perforation of module, especially be suitable for this method, suspension material enter into that institute has living space and the gap so that also module is fixed on the card opening by the side.Take off adhesive tape then, so can from external freedom touch the contact of module the card.This method can also automatically be carried out according to second embodiment, outer tape-bottom of embodiment from Fig. 2 of covering the punched card opening-and can remove wherein can be provided in addition, and be wound into a slice before each card is perforated.This method for making is specially adapted to include the module that structure or hook are hung in insertion, in this case, the molding technique that no longer needs the front for this reason to adopt, this technology are very complicated on the part degree, and have increased the cost of this making to a large extent.

Particularly under the situation of second embodiment, the strip of foil that wherein preferred employing can detect from corresponding feed rolls is also guided by a pair of pressure roller, also might adopt suitable adhesive is obtained in first embodiment provides horizontal maintenance pin for it required chip temporary fixed, utilize above-mentioned suitable bonding agent that each electronics or electricity component (being chip or module) are fixed on the corresponding adjacent card face, or temporarily be fixed on the sheet metal 31 of continuous carrier up to putting into electronic installation, and therefore make it in place by applying the group of suspension, originally the form with a kind of bonding agent applies the group of suspension, and it is solidified to form the 3rd a card layer.

Another interesting aspect once also should be discussed:

If the suspension group (adhesive material) that is adopted has more more low viscosity characteristics, may have the advantage that a kind of restraining barrier that suspends is provided, wherein in first embodiment, this suspension stops and comprises an outer closed frame of extending of little area at card, and in place so that avoid in the pressing operation process relatively the adhesive flow of water-based on the outer rim of blocking at least one card inner surface film.As a kind of conversion, then this small frame can be limited for the thickness in the 3rd or the middle layer that remain to be formed by bonding agent simultaneously by its thickness, and wherein the middle layer also comprises electronic component.In some pressing operation, do like this and also need not the outside retainer that in press, provides extra.Yet, also wish this incomplete structure is fallen, maybe can make its form that finally in each card film, is a kind of integrally formed volume circle, and then will produce the round outshot with the form of enclosed construction.In the end grind in (punching press) operating process then these parts are removed.

This method of same employing in second embodiment, wherein, in the mode (parts can be fixed) of discharging parts respectively or the continuous strip of foil of form outside finished product card profile laterally projecting part to be set with integrally formed outstanding circle portion in card membrane material itself for example by bonding.

At last, it should be noted that claims and especially main claim are attempted the present invention is converted into literal and be need not the comprehensive knowledge of prior art, and therefore, do not embrace limited prejudice.Therefore, with regard to instructions, all features described in claims and the accompanying drawing; no matter be independently or any combination to each other; the most basic for the present invention right is protected, and they are write in claims, and reduces the characteristic number in the main claim.

Claims

1. be used to make ID (identity number) card, access card, the ID card, especially comprise and also can be used as intermediate product, especially with card, chip card, the electronics of phonecard or similar card and/or the carrier body of electricity component, wherein a plurality of card layers stack each other and are bonded in together by exerting pressure, it is characterized in that: at least one comprise electronics and/or electricity component card (in) layer remain on suspended state by the amount of binder that is applied at least one inside surface at the beginning, and be increasingly compressed to then by the retainer preset thickness and needn't heat, and make its curing at last so that support electricity and/or electronic component, and they are embedded in the intermediary adhesive layer that so forms by the finished product card.

2. method according to claim 1, it is characterized in that the middle layer area is formed by a middle layer supporting electricity and/or electronic component, at two bonding agent that is provided with scheduled volume of this layer, and form at least on the gabarit of card the intermediary adhesive layer of uniformly extension so that under finished product card state by pressing operation, by being located at the curing elastic layer on the both sides in the finished product card structure, the middle layer is remained between at least one secondary cover layer (11,17) on each side.

3. method according to claim 1 is characterized in that: manually or automatically, or adopt a kind of continuation method to apply to have through regulating in the bonding agent of the scheduled volume of the predetermined amount of flow of pressing speed.

4. as method as described in the claim 2, it is characterized in that elasticity with scheduled volume, can flow bonding agent or adhesive glue is applied to going up more at least of first (descending) the card layer, after this, after this layer is in place, on a middle layer (electronic shell) that is loaded with electricity or electronic component, apply the flowed bonding agent of another kind of at least scheduled volume, and after this, on the middle layer, place at least one upper caldding layer, and this card structure is compressed to by exerting pressure in one section finite time and reaches predetermined thickness, wherein solidify this thickness of back and constituted the final thickness of finished product card and this thickness summation, add the thickness (X of at least one the additional intermediary adhesive layer that obtains by the bonding agent curing that is applied by the each several part layer when the middle layer ₁, X ₂) decide.

5. as method as described in the claim 2, it is characterized in that: be to form the card structure, adopt the each several part layer of amplifying, and have only after middle adhesive phase curing and just card is cut into last specification (by punching press, edge grinding).

6. as method as described in the claim 2, it is characterized in that:, on adjacent upper and lower card layer, be provided with and (be pressed into) retainer that is positioned at final card gabarit outside for the middle layer of electronics or electricity component fixedly is housed.

7. method according to claim 1, it is characterized in that: after finishing stratiform card structure by the middle layer that adds bonding agent, the process of exerting pressure on this structure is finished by means of spring assembly, this spring assembly allows a kind of sequence of motion gradually in the compression process of stratiform card structure, and spring assembly also has the fixing retainer of the final height that determines card after compression process.

8. method according to claim 1, it is characterized in that: the stratiform that is made of the skin on both sides at least and an inner shell that also can be only be made of electronic component and the bonding agent that applies is in addition ended chip architecture and is long strip of foil form, they can be directed into and move closer to each other so that be introduced in a pair of pressure roller (27 that is provided with a preset distance to each other, 28) in the gap, so that stratiform card structure is pressed into its final size, scatter bonding agent equably to form an extra play, and limit and be scheduled to the final thickness of this layer by keeping roll gap this moment, and stratiform card structure is pulled out so that it is carried by pressure roller from this gap.

9. as method as described in the claim 2, it is characterized in that: at first by a kind of bonding agent (acryloid cement) of card on the inside surface with electronic component or chip fix in position, then the bonding agent by having applied the group's effect that suspends with they around or be embedded on the card inside surface, and then prepare for the 3rd layer for formation.

10. method according to claim 1, it is characterized in that: the card that contains the module that has the contact for punching press, (penetrating) one is set in card film or the card layer outside one desires to hold the opening of the contact region at least of electronic module, then after load module, with an adhesive tape opening is covered, after this, on another inside surface, apply a bonding agent to form one the 3rd layer, play the effect that embeds or pour into electronic module during this interlayer, on this layer, scatter bonding agent according to its flow characteristics, additional another card layer at least also is depressed into final card thickness with it, and at last the outer adhesive film is taken out so that module contact can be touched by the opening in the card layer from module contact.

11., it is characterized in that: the electronic module of contact-carrying is incorporated between two card layer strip of foil that enter into nip according to the continuous process of claim 8 at least, makes its contact outwards outstanding as method as described in the claim 10.

12. be used to make ID (identity number) card, access card, the ID card, especially comprise also can be used as intermediate product especially with card, chip card, the device of the electronics of the form of phonecard or similar card and/or the carrier body of electricity component, wherein a plurality of card layers are stacked each other and they are bonded together by exerting pressure, so that the method in carry out claim 1 to 11 is characterized in that: the spacer (24) that utilizes the final card thickness of the stratiform card structure 10 determine to place device, upper and lower pressing plate (21,22) is remained on its final position each other at a certain distance.

13. as method as described in the claim 12, it is characterized in that: lower supporting plate (21) is supported on the resilient supporting unit (support spring 23) of the constant back-pressure of generation of himself, so that top board continuously near motion process in, when keeping being applied to the structural constant pressure of stratiform card, lower supporting plate (21) pressurized works up to the retainer that determines the final interval between two pressing plates (24).

14. be used to make ID (identity number) card, access card, the ID card, especially comprise and also can be used as intermediate product, especially with the device of the carrier body of the electronics of the form of card, chip card, phonecard or similar card and/or electricity component, wherein a plurality of card layers are stacked each other and they are bonded together by exerting pressure, so that the method in carry out claim 1 to 11, it is characterized in that: be provided with two pressure rollers (27,28), be used for keeping both predetermined spaces to each other, stratiform card structure therefrom imports with a kind of form of rectangular thin slice.

15. as method as described in the claim 14, it is characterized in that: thin slice bar shaped stratiform card structure a bit is drawn out at place in the downstream of non-driving pressure roller (27,28).

16. as device as described in claim 14 or 15, it is characterized in that: for the binder mass that constitutes the 3rd layer or middle layer (comprising electronic component) is provided with a suspension restraining barrier, wherein comprise a closed frame, this structure is greater than the card sizes on the inside surface face that is positioned at film or card at least, perhaps under the situation of thin slice shape initial film material, comprise the outstanding circle that is located at both sides, the framework wherein or the circle of projection also can be included in outstanding coiled portion integrally formed in the membraneous material.

17. as method as described in the claim 16, it is characterized in that: the height of the circle of this framework or projection is relevant with the quantity of bonding agent, and has constituted the pressure retainer that is used for pressing operation.

18. the ID (identity number) card of utilizing the one or more methods in the claim 1 to 17 to make; access card; the ID card; especially comprise and also can be used as intermediate product; particularly with card; chip card; phonecard; or the carrier body of the electronics of the form of similar card and/or electricity component; it is characterized in that: will be arranged at solid state between the prefabricated part card layer at the adhesive phase that extends on the whole card face with predetermined finished product thickness; wherein be embedded with and be supported with and maintain electronics and/or electricity component, this moment is because its adhesion characteristic middle layer is used for protecting the stacked characteristic of card.