CN113561097A - 780nm distributed feedback Bragg semiconductor laser cavity surface coating clamp - Google Patents

780nm distributed feedback Bragg semiconductor laser cavity surface coating clamp Download PDF

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Publication number
CN113561097A
CN113561097A CN202110964337.4A CN202110964337A CN113561097A CN 113561097 A CN113561097 A CN 113561097A CN 202110964337 A CN202110964337 A CN 202110964337A CN 113561097 A CN113561097 A CN 113561097A
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CN
China
Prior art keywords
hole
distributed feedback
semiconductor laser
plate
feedback bragg
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202110964337.4A
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Chinese (zh)
Inventor
李再金
丁可可
韦龙
马宇航
曾丽娜
李林
赵志斌
陈浩
乔忠良
曲轶
刘国军
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Hainan Normal University
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Hainan Normal University
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Publication date
Application filed by Hainan Normal University filed Critical Hainan Normal University
Priority to CN202110964337.4A priority Critical patent/CN113561097A/en
Publication of CN113561097A publication Critical patent/CN113561097A/en
Pending legal-status Critical Current

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B25HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25BTOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
    • B25B11/00Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C26/00Coating not provided for in groups C23C2/00 - C23C24/00

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Semiconductor Lasers (AREA)

Abstract

The invention discloses a 780nm distributed feedback Bragg semiconductor laser cavity surface coating clamp which comprises a supporting plate 1, a spring plate 4 and a fixing plate 6. The supporting plate 1 comprises a first through hole 2 and a second through hole 3; the lower end of the spring plate 4 is provided with a spring leaf 5; the fixing plate 6 includes: a third through hole 7, a fourth through hole 8, a first internally threaded hole 9 and a second internally threaded hole 10. Firstly, fixing a fixing plate 6 and a supporting plate 1 together by screws and nuts through matching of a first through hole and a third through hole, and matching of a second through hole and a 4 th through hole in pairs; stacking chips bar which are separated by 780nm distributed feedback Bragg semiconductor lasers on the supporting plate 1; after chip bar strips dissociated by the 780nm distributed feedback Bragg semiconductor laser are stacked, the spring plate 4 is inserted into a slideway between the fixing plate 6 and the supporting plate 1; and finally fixing 780nm distributed feedback Bragg semiconductor laser chip bar bars through the first internal thread hole 9 and the second internal thread hole 10, and preparing film coating after clamping.

Description

780nm distributed feedback Bragg semiconductor laser cavity surface coating clamp
Technical Field
The invention relates to the technical field of semiconductor laser, in particular to a 780nm distributed feedback Bragg semiconductor laser cavity surface coating clamp.
Background
The distributed feedback semiconductor laser has wide application in the fields of optical communication systems, laser radars, sensing and the like. The 780nm tunable distributed feedback semiconductor laser is mainly used as a light source for pumping Rb D2 energy level transition and is widely used for Rb atomic clocks, magnetometers, precision gyroscopes, gas sensing and local area network communication. Research and application of local area network communication is now a growing market, and thus there is an increasing demand for 780nm distributed feedback bragg semiconductor lasers. However, key factors for restricting 780nm distributed feedback Bragg semiconductor laser include the clamping problem of a laser cavity surface coating clamp. The method has the advantages of convenient and rapid clamping, no cavity surface contact pollution and double-sided coating, and is the most key point for realizing high power and high efficiency of the 780nm distributed feedback Bragg semiconductor laser. The invention provides a convenient and rapid coating clamp for a cavity surface of a 780nm distributed feedback Bragg semiconductor laser, which has no contact pollution on the cavity surface.
Disclosure of Invention
The invention aims to provide a 780nm distributed feedback Bragg semiconductor laser cavity surface coating clamp.
A780 nm distributed feedback Bragg semiconductor laser cavity surface coating clamp comprises a supporting plate 1, a spring plate 4 and a fixing plate 6. The supporting plate 1 comprises a first through hole 2 and a second through hole 3; the lower end of the spring plate 4 is provided with a spring leaf 5; the fixing plate 6 includes: a third through hole 7, a fourth through hole 8, a first internally threaded hole 9 and a second internally threaded hole 10.
The method is characterized in that:
firstly, fixing a fixing plate 6 and a supporting plate 1 together by screws and nuts through matching of a first through hole and a third through hole, and matching of a second through hole and a 4 th through hole in pairs; stacking chips bar which are separated by 780nm distributed feedback Bragg semiconductor lasers on the supporting plate 1; after chips bar strips dissociated by the 780nm distributed feedback Bragg semiconductor laser are stacked, the spring plate 4 is inserted into a slideway between the fixed plate 6 and the supporting plate 1, a little elastic force is ensured when the spring piece 5 is clamped, no gap between the bar strips is ensured, and the bar strips are prevented from falling off when the film is coated in a turnover mode; and finally fixing bar bars of the 780nm distributed feedback Bragg semiconductor laser chip through the first internal thread hole 9 and the second internal thread hole 10. The non-shielding area in the middle of the clamp is a bar cavity surface coating area of a 780nm distributed feedback Bragg semiconductor laser chip, only two ends of a cavity surface of the bar of the 780nm distributed feedback Bragg semiconductor laser chip are in contact with each other in the clamping process, other parts do not contact with any object, cavity surface pollution cannot be caused, the clamp is convenient and quick to clamp, the bar cavity surface coating of the 780nm distributed feedback Bragg semiconductor laser chip can be realized simultaneously, secondary clamping is not needed, and time and labor are saved.
Drawings
FIG. 1 is a diagram of a fixture according to an embodiment of the present invention.
Detailed Description
The present invention will be described in further detail below with reference to fig. 1 for a 780nm distributed feedback bragg semiconductor laser chip bar with a cavity length of 1mm, a bar length of 16mm and a bar thickness of 130um, but the use of the clamp is not limited to this embodiment: the supporting plate 1, the spring plate 4 and the fixing plate 6. The supporting plate 1 comprises a first through hole 2 and a second through hole 3; the lower end of the spring plate 4 is provided with a spring leaf 5; the fixing plate 6 includes: a third through hole 7, a fourth through hole 8, a first internally threaded hole 9 and a second internally threaded hole 10.
To 780nm distribution feedback Bragg semiconductor laser chip bar that the chamber length is 1mm, bar length is 16mm and bar thickness is 130um, require that the thickness of spring plate 4 is 1mm, the width of spring plate 4 is 16mm, after the length of spring plate 4 can guarantee to have installed and clamped chip bar, first internal thread hole 9 and second internal thread hole 10 can be fixed well the bar can. The dimensions of the carrier plate 1 and the fixing plate 6 may be determined according to the dimensions of the spring plate 4. The clamp can clamp cavity surface coating on 780nm distribution feedback Bragg semiconductor laser chip bars with different cavity lengths and different bar lengths by changing the thickness of the spring plate 4 and the width of the spring plate 4. The number of bar bars for clamping 780nm distributed feedback Bragg semiconductor laser chips is determined by changing the length of the spring plate 4.
Firstly, fixing a fixing plate 6 and a supporting plate 1 together by screws and nuts through matching of a first through hole and a third through hole, and matching of a second through hole and a 4 th through hole in pairs; stacking 780nm distributed feedback Bragg semiconductor laser chip bars with the cavity length of 1mm, the bar length of 16mm and the bar thickness of 130um on the supporting plate 1, wherein the stacking number is 10; after chips bar strips which are dissociated by the 780nm distributed feedback Bragg semiconductor laser are stacked, the spring plate 4 is inserted into a slideway between the fixed plate 6 and the supporting plate 1, little elasticity is ensured when the spring plate 5 is clamped, and no gap is ensured between the bar strips; and finally fixing 780nm distributed feedback Bragg semiconductor laser chip bar bars through the first internal thread hole 9 and the second internal thread hole 10, and waiting for coating after clamping is finished.

Claims (1)

1. A780 nm distributed feedback Bragg semiconductor laser cavity surface coating clamp is characterized by comprising: the supporting plate 1, the spring plate 4 and the fixing plate 6; the supporting plate 1 comprises a first through hole 2 and a second through hole 3; the lower end of the spring plate 4 is provided with a spring leaf 5; the fixing plate 6 includes: a third through hole 7, a fourth through hole 8, a first internally threaded hole 9 and a second internally threaded hole 10.
CN202110964337.4A 2021-08-22 2021-08-22 780nm distributed feedback Bragg semiconductor laser cavity surface coating clamp Pending CN113561097A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110964337.4A CN113561097A (en) 2021-08-22 2021-08-22 780nm distributed feedback Bragg semiconductor laser cavity surface coating clamp

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202110964337.4A CN113561097A (en) 2021-08-22 2021-08-22 780nm distributed feedback Bragg semiconductor laser cavity surface coating clamp

Publications (1)

Publication Number Publication Date
CN113561097A true CN113561097A (en) 2021-10-29

Family

ID=78172402

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202110964337.4A Pending CN113561097A (en) 2021-08-22 2021-08-22 780nm distributed feedback Bragg semiconductor laser cavity surface coating clamp

Country Status (1)

Country Link
CN (1) CN113561097A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111501042A (en) * 2020-06-02 2020-08-07 海南师范大学 Edge-emitting semiconductor laser chip cavity surface coating clamp

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111501042A (en) * 2020-06-02 2020-08-07 海南师范大学 Edge-emitting semiconductor laser chip cavity surface coating clamp
CN111501042B (en) * 2020-06-02 2023-09-01 海南师范大学 Edge-emitting semiconductor laser chip cavity surface coating clamp

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